CN101527236A - Stamping fuse structure and manufacturing method thereof - Google Patents
Stamping fuse structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN101527236A CN101527236A CN200810081648A CN200810081648A CN101527236A CN 101527236 A CN101527236 A CN 101527236A CN 200810081648 A CN200810081648 A CN 200810081648A CN 200810081648 A CN200810081648 A CN 200810081648A CN 101527236 A CN101527236 A CN 101527236A
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- Prior art keywords
- fuse
- metal
- stamping
- layer
- fuse circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000011241 protective layer Substances 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- 239000011135 tin Substances 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims description 23
- 230000004888 barrier function Effects 0.000 claims description 14
- 150000002118 epoxides Chemical class 0.000 claims description 8
- 238000001459 lithography Methods 0.000 claims description 8
- 238000009740 moulding (composite fabrication) Methods 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000008187 granular material Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 230000008034 disappearance Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention relates to a stamping fuse structure and a manufacturing method thereof. The interior of a fuse is provided with a fuse line, the exterior of the fuse is covered with a protective layer and an insulating layer, and two ends of the insulating layer are provided with naked metal as electrode pins. The manufacturing method comprises the following steps: firstly, manufacturing the fuse line and electrodes on a first metal layer conductor substrate mainly using copper; secondly, adhering second metal layers consisting of silver, nickel, tin and the like and alloy thereof to the electrodes and the fuse line of the first metal layer; thirdly, manufacturing insulating layers with insulating and heat insulation effects at upside and underside of the middle fuse line of the metal substrate; and finally, cutting granules to obtain a finished product, wherein the insulating layers are made of high molecular materials such as silicon, epoxy and the like. Therefore, the method can carry out one-stop operation and quick production, and can effectively manufacture the stamping fuse with small volume, good function, convenience and practicability.
Description
Technical field
The present invention relates to the innovation on fuse structure and the manufacture method thereof, refer to especially a kind of structure simplify volume again little, make to produce easily, cost is lower, usable range is wider stamping fuse structure and manufacture method thereof.
Background technology
Popularizing of electric power system to the human lives offers convenience, but, make Electrical Safety especially come into one's own because the improper fire incident that causes of electricity consumption keeps pouring in.Wherein, fuse is being played the part of very important role in the electric disaster of prevention, and its main function is exactly that the electric current that can prevent excess flows through electronic circuit.The most important characteristic of general insurance silk is its ampacity; the setting of all kinds of fuse maximum carrying capacities is the statistical values that draw through a series of test; use with reference to selecting for circuit designer; when the electric current that exceeds the quata flows through fuse; to make its generation high temperature and cause fusing; avoid coming to harm with protective circuit, also can reach the practical purpose that the prevention electric wire cocks off and avoids fire to take place simultaneously.
Existing common fuse structure, mostly be to make with the glass tube encapsulation, the both sides of its pipe are provided with metal-back, inside at two metal-backs is provided with metal wire, not only the big manufacturing of the combined volume of structure comparatively bothers, and use also very inconveniently, must on circuit board, weld and establish the fuse holder confession it folds up.Remove this, excessive bulk also forms occupy-place simultaneously easily, and fit on artificial plug-in unit all, has been difficult to meet scientific and technologically circuit board day in epoch more simplify the actual demand of dwindling.
Therefore, how above-mentioned disappearance is forgone, and provide a kind of structure to simplify volume is little, manufacturing is produced easily, cost is lower, usable range is wider stamping fuse structure and manufacture method thereof, be the technology emphasis place that institute of the present invention desire solves.
Summary of the invention
At the deficiencies in the prior art, the objective of the invention is to: a kind of stamping fuse structure and manufacture method thereof are provided, can one-stop operation produce fast, and effective dose produces out that volume is little, better function, convenient and practical stamping fuse.
For achieving the above object, the technical solution used in the present invention comprises:
A kind of stamping fuse structure is characterized in that, comprising:
One fuse circuit, its stage casing have a narrow fusing portion of contracting, and both sides are the pin of evagination;
One protective layer is back shape and coats the appearance that is located at the fuse circuit, and;
One insulating barrier, it is granular to be piece, coats to be located on its stage casing of fuse circuit that has protective layer.
For achieving the above object, the technical solution used in the present invention also comprises:
A kind of stamping fuse manufacture method is characterized in that, comprising:
Default the first metal layer, the metal of described the first metal layer is an electric conducting material, 95%～99% weight of described electric conducting material is copper metal or aluminum metal;
Form circuit, on a metal substrate, adopt processing procedures such as yellow light lithography, punching press, laser processing, make the fuse circuit and the electrode of several arrays;
Form anchor point, adopt modes such as yellow light lithography, processing procedure punch die, laser processing to make preparation punch line and registration holes;
Adhere to second metal level, at electrode place and fuse circuit place, adopt modes such as physics or chemical metallic atom deposition, adhere to the second metal level fuse circuit, the material of described metal is a kind of in silver, nickel, tin and the alloy thereof;
Outer insulating layer coating, in the mode of plastics formings such as ejection formation or pressing mold, the upper and lower both sides of fuse circuit make insulating barrier in the middle of metal substrate, and described insulating barrier has the insulation effect of heat insulation, its material is siliceous macromolecular material or epoxides macromolecular material, and;
Single moulding adopts gradation modes such as punch die or laser cutting to form single fuse, and the demand of must looking different is and two end electrodes is rolled over pin.
Compared with prior art, the beneficial effect that has of outstanding behaviours the present invention is as follows:
Existing disappearance:
1. the big manufacturing of the combined volume of structure comparatively bothers.
2. must weld on the circuit board and establish fuse holder and fold up comparatively inconvenience in the use for it.
3. excessive bulk simultaneously also forms occupy-place easily, and fit on artificial plug-in unit all, has been difficult to meet scientific and technologically circuit board day in epoch more simplify the actual demand of dwindling.
Advantage of the present invention:
1. structure is simplified little, the better function of volume, and usable range is wider.
2. can the one-stop operation manufacturing produce easily, cost is lower.
3. the little easy planning configuration of volume, but automatic insertion also applications in can meet and scientific and technologically circuit board day in epoch more simplify the actual demand of dwindling.
Description of drawings
Fig. 1 is stamping fuse of the present invention and cut-away view thereof;
Fig. 2 is the flow chart of stamping fuse first manufacture method of the present invention;
Fig. 3 is the plane graph of the first metal layer conductor substrate of the present invention;
Fig. 4 is the schematic diagram that the present invention forms circuit;
Fig. 5 is the schematic diagram that the present invention forms anchor point;
Fig. 6 is the schematic diagram that the present invention forms profile groove;
Fig. 7 is the schematic diagram that the present invention adheres to second metal level;
Fig. 8 is the schematic diagram of the outer insulating layer coating of the present invention;
Fig. 9 is that pin of the present invention is set as horizontal schematic diagram;
Figure 10 is the schematic diagram that pin of the present invention is set as rank folding shape;
Figure 11 is the flow chart of stamping fuse second manufacture method of the present invention;
Figure 12 is the schematic diagram that the present invention makes explosion-proof layer;
Figure 13 is that the present invention has explosion-proof layer stamping fuse and cut-away view thereof.
Description of reference numerals: 1-stamping fuse; The 10-metal substrate; 11-fuse circuit; 12-fusing portion; The 13-pin; The 14-punch line; The 15-registration holes; The 16-profile groove; The 2-protective layer; The 3-insulating barrier; The 4-explosion-proof layer.
Embodiment
Your juror is convenient to understand other features of the present invention and advantage in order to make, and the effect of being reached can more manifest, and with conjunction with figs. of the present invention, is described in detail as follows now:
As Fig. 1～shown in Figure 4, a kind of stamping fuse 1 of the present invention, its structure mainly comprises:
One fuse circuit 11, its stage casing have a narrow fusing portion 12 of contracting, and both sides are the electrode pin 13 of evagination;
One protective layer 2 is back shape and coats the appearance that is located at fuse circuit 11, and;
One insulating barrier 3, it is granular to be piece, coats to be located on the stage casing of the fuse circuit 11 that has protective layer 2;
Wherein said fuse circuit 11 is that the electric conducting material based on copper (95～99% weight is the copper metal) is constituted; And described protective layer 2 is to be made of a kind of institute in silver, nickel, tin etc. and the alloy thereof; Described insulating barrier 3 is that macromolecular materials such as siliceous Silicon, epoxides epoxy constitute.
So, make stamping fuse 1 its structure of composition simplify volume little, make produce easily, cost is lower, usable range more extensively and again can be manufactured fast in one-stop operation.
Please join Fig. 2～shown in Figure 10, be the concrete manufacture method of first kind of stamping fuse of the present invention 1, it mainly comprises:
Default the first metal layer, the metal of described the first metal layer be copper, aluminium etc. wherein a kind of be the electric conducting material of main (95～99% weight is copper metal or aluminum metal); (as Fig. 3)
Form circuit, on a metal substrate 10, adopt processing procedures such as yellow light lithography, punching press, laser processing, make the fuse circuit 11 and the electrode pin 13 (as Fig. 4) of several arrays;
Form anchor point, adopt modes such as yellow light lithography, processing procedure punch die, laser processing to make preparation punch line 14 and registration holes 15 (as Fig. 5);
Adhere to second metal level, at electrode pin 13 and fuse circuit 11 places, adopt modes such as physics or chemical metallic atom deposition, adhere to protective layer 2, described metal is metallic conductor or metal alloy compositions (as Fig. 7) such as silver, nickel, tin;
Outer insulating layer coating, mode with plastics formings such as ejection formation or pressing molds, fuse circuit 11 upper and lower both sides make insulating barrier 3 in the middle of metal substrate 10, described insulating barrier 3 has the insulation effect of heat insulation, its material is macromolecular materials (as Fig. 8) such as siliceous Silicon, epoxides epoxy, and;
Single moulding; adopt gradation modes such as punch die or laser cutting to form single stamping fuse 1; and the demand of must looking is different and two end electrodes pin 13 is rolled over pin, is wraparound shape (as Fig. 1), horizontal (as Fig. 9) or rank folding shape (as Figure 10) and pin 13 can be established ... wait various difformities.
So, use this method for making and promptly can one-stop operation produce fast, and effective dose produces out that volume is little, better function, convenient practical stamping fuse.
Please join Fig. 2, shown in Figure 6, in the above-mentioned processing procedure, when also can and form the anchor point processing procedure or afterwards at described formation circuit, add the processing procedure that forms profile groove for one again, it is in modes such as yellow light lithography, processing procedure punch die, laser processings, adds horizontal profile groove 16 between upper and lower and each line-spacing of the fuse circuit 11 of several arrays and electrode pin 13.So, can make its manufactured goods between insulating barrier and pin, have class's drop.
In addition; please join Figure 11～shown in Figure 13; be second kind of manufacture method of the present invention; it is after preceding method for making is adhered to the second metal level processing procedure; add one again and make explosion-proof layer; it makes explosion-proof layers 4 in the mode of plastics formings such as ejaculation or press mold in the fuse circuit 11 upper and lower both sides of adhering to protective layer 2, and its material is for being macromolecular materials such as siliceous Silicon, epoxides epoxy.Utilize described explosion-proof layer 4 to make the stamping fuse of making 1 can have insulation, heat insulation, explosion-proof and subtract the arc effect.
More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within protection scope of the present invention.
Claims (6)
1. a stamping fuse structure is characterized in that, comprising:
One fuse circuit, its stage casing have a narrow fusing portion of contracting, and both sides are the pin of evagination;
One protective layer is back shape and coats the appearance that is located at the fuse circuit, and;
One insulating barrier, it is granular to be piece, coats to be located on its stage casing of fuse circuit that has protective layer.
2. stamping fuse structure according to claim 1 is characterized in that: described fuse circuit is constituted with electric conducting material, and 95%～99% weight of described electric conducting material is the copper metal; Described protective layer is to be made of a kind of institute in silver, nickel, tin and the alloy thereof; Described insulating barrier is that siliceous macromolecular material or epoxides macromolecular material constitute.
3. stamping fuse structure according to claim 2; it is characterized in that: the stage casing protective layer that described insulating barrier coats is upper and lower can respectively set up an explosion-proof layer, and described explosion-proof layer is made of siliceous macromolecular material or epoxides macromolecular material.
4. a stamping fuse manufacture method is characterized in that, comprising:
Default the first metal layer, the metal of described the first metal layer is an electric conducting material, 95%～99% weight of described electric conducting material is copper metal or aluminum metal;
Form circuit, on a metal substrate, adopt processing procedures such as yellow light lithography, punching press, laser processing, make the fuse circuit and the electrode of several arrays;
Form anchor point, adopt modes such as yellow light lithography, processing procedure punch die, laser processing to make preparation punch line and registration holes;
Adhere to second metal level, at electrode place and fuse circuit place, adopt modes such as physics or chemical metallic atom deposition, adhere to the second metal level fuse circuit, the material of described metal is a kind of in silver, nickel, tin and the alloy thereof;
Outer insulating layer coating, in the mode of plastics formings such as ejection formation or pressing mold, the upper and lower both sides of fuse circuit make insulating barrier in the middle of metal substrate, and described insulating barrier has the insulation effect of heat insulation, its material is siliceous macromolecular material or epoxides macromolecular material, and;
Single moulding adopts gradation modes such as punch die or laser cutting to form single fuse, and the demand of must looking different is and two end electrodes is rolled over pin.
5. stamping fuse manufacture method according to claim 4, it is characterized in that: at described formation circuit and when forming the anchor point processing procedure or afterwards, can add the processing procedure that forms profile groove for one, it is in modes such as yellow light lithography, processing procedure punch die, laser processings, adds horizontal profile groove between upper and lower and each line-spacing of the fuse circuit of several arrays and electrode.
6. stamping fuse manufacture method according to claim 4; it is characterized in that: after making the second metal level processing procedure; can add one and make explosion-proof layer; it is in the mode of plastics formings such as ejaculation or press mold; make explosion-proof layer in the upper and lower both sides of the fuse circuit that adheres to protective layer; described explosion-proof layer have insulation, heat insulation, explosion-proof, subtract the arc effect, its material is siliceous macromolecular material or epoxides macromolecular material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100816480A CN101527236B (en) | 2008-03-03 | 2008-03-03 | Stamping fuse structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100816480A CN101527236B (en) | 2008-03-03 | 2008-03-03 | Stamping fuse structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101527236A true CN101527236A (en) | 2009-09-09 |
| CN101527236B CN101527236B (en) | 2011-07-27 |
Family
ID=41095047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100816480A Expired - Fee Related CN101527236B (en) | 2008-03-03 | 2008-03-03 | Stamping fuse structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101527236B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794691A (en) * | 2010-03-18 | 2010-08-04 | 南京萨特科技发展有限公司 | Plug-in type silky fuse and method for manufacturing same |
| CN105374483A (en) * | 2014-08-19 | 2016-03-02 | 可穆特克浪涌 | Fuse-integrated resistor assembly |
| CN106384699A (en) * | 2016-11-24 | 2017-02-08 | 深圳路科技有限公司 | Method for manufacturing fuses by using LDS technology |
| CN115985721A (en) * | 2023-03-14 | 2023-04-18 | 东莞市富瑞电子科技有限公司 | Fuse processing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
| JP4112417B2 (en) * | 2003-04-14 | 2008-07-02 | 釜屋電機株式会社 | Chip fuse and manufacturing method thereof |
| CN1700383A (en) * | 2004-05-18 | 2005-11-23 | 大毅科技股份有限公司 | Thin-film fuse and method for manufacturing same |
-
2008
- 2008-03-03 CN CN2008100816480A patent/CN101527236B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794691A (en) * | 2010-03-18 | 2010-08-04 | 南京萨特科技发展有限公司 | Plug-in type silky fuse and method for manufacturing same |
| CN105374483A (en) * | 2014-08-19 | 2016-03-02 | 可穆特克浪涌 | Fuse-integrated resistor assembly |
| CN105374483B (en) * | 2014-08-19 | 2018-05-15 | 可穆特克浪涌 | The resistor component of integrated fuse |
| CN106384699A (en) * | 2016-11-24 | 2017-02-08 | 深圳路科技有限公司 | Method for manufacturing fuses by using LDS technology |
| CN106384699B (en) * | 2016-11-24 | 2019-01-15 | 电安科技（嘉兴）有限公司 | A kind of insurance wire production method using LDS technology |
| CN115985721A (en) * | 2023-03-14 | 2023-04-18 | 东莞市富瑞电子科技有限公司 | Fuse processing method |
| CN115985721B (en) * | 2023-03-14 | 2023-10-27 | 东莞市富瑞电子科技有限公司 | Fuse processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101527236B (en) | 2011-07-27 |
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Granted publication date: 20110727 |
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