CN101525116B - Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof - Google Patents
Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof Download PDFInfo
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- CN101525116B CN101525116B CN200810207329XA CN200810207329A CN101525116B CN 101525116 B CN101525116 B CN 101525116B CN 200810207329X A CN200810207329X A CN 200810207329XA CN 200810207329 A CN200810207329 A CN 200810207329A CN 101525116 B CN101525116 B CN 101525116B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
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- 239000000853 adhesive Substances 0.000 claims abstract description 8
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Abstract
The invention relates to a structure of the vertical three-dimensional combined packaging of a micro electric mechanical system and a manufacture method thereof and is characterized by providing a novel structure of the triaxial accelerometer combined packaging and a manufacture method thereof, wherein the structure of the module combined packaging is formed by combining brackets, located by laser calibration and a triple prism and fixed by ultraviolet light cured adhesive and realizes the mutual electrical connection by lead bonding. The whole technical process is compatible with the traditional IC packaging technology and is simple. The structure provides another select for the three-dimensional acceleration measurement while reducing the cost of the packaging and simplifying the technology.
Description
Technical field
The present invention relates to structure of a kind of MEMS three-dimensional perpendicular assembled package and preparation method thereof; The present invention is the structure and the preparation method of a kind of MEMS that adopts the holder combination mode to realize (MEMS) device three-dimensional vertical cartel encapsulation or rather, belongs to MEMS device encapsulation field.
Background technology
MEMS (microelectromechanical system) is meant and adopts Micrometer-Nanometer Processing Technology to make, integrates the system of microsensor, micro parts, miniature actuator, signal processing, control circuit etc.The MEMS device all has very wide application prospect in a lot of fields.Various delivery vehicles and flight system need monitor the track of attitude, the operation of flight and vibrational state etc. in flight course.Wherein, it is essential the acceleration of each latitude being measured and controlled.At present, not long for the history of the research of incorporate 3-axis acceleration sensor, be main mainly with piezoelectric type, condenser type, manufacture and design all more complicated, technical and immature.The design and the manufacturing of low dimension acceleration are all relatively easy, through the joint efforts of academia and industrial circle, hang down the research of dimension acceleration and use comparative maturity, and domestic research to acceleration transducer mainly concentrates on the individual axis acceleration.Low dimension acceleration transducer is carried out the three-dimensional perpendicular assembled package, can make the sensing system of the acceleration that is used to measure three latitudes.
It is through compound mode that low dimension acceleration transducer is carried out the three-dimensional perpendicular assembled package, will hang down dimension acceleration chip and place on orthogonal the acceleration on the different low dimension acceleration analysis different latitude.Its key has two aspects: the making of frame for movement and the completion of electrical interconnection.The making of frame for movement mainly contains the requirement of two aspects: requirement of strength and angle requirement.Because acceleration is to be used for flight, vibrations, even the violent environment of cold and hot variation, so frame for movement needs the higher intensity and the ability of cold-resistant thermal shock.Have only single-axis acceleration sensors is placed on orthogonal, could accomplish the measurement of the acceleration of three latitudes, frame for movement is the sensor chip supporter just, therefore needs frame for movement itself to have higher perpendicularity.Sensing system generally comprises sensitive chip and modulation-demodulation circuit, and the frame for movement that assembles need be carried out electrical interconnection (comprising the electrical interconnection of single chip and substrate and the electrical interconnection between chip and the chip).
The overall construction design of MEMS (MEMS) device three-dimensional vertical cartel encapsulation must guarantee that three axial strictnesses are vertical, and this will relate to the interconnection material and the interconnection mode of chip and substrate, and the reliability of interconnection.Whole system to volume and the conditional situation of quality under, with considering to adopt the light material and the compound mode of compactness comparatively as far as possible.Simultaneously, because the measurement of perpendicularity may be carried out with assembling simultaneously, the operating time does not allow oversize, must guarantee that therefore assembling process will have ease for operation.Adopt more compound mode that fluting compound mode and holder combination mode are arranged at present.Traditional compound mode of slotting is higher to the requirement on machining accuracy of groove, though the fluting compound mode is more convenient when assembling in advance, when assembling, monitors difficulty relatively, and assembly precision is poor, and yield rate and reliability are low; Comparatively speaking, the holder combination mode realizes being easier to relatively, and assembly precision and reliability are high.
Summary of the invention
For reducing packaging cost, simplify technology simultaneously, the present invention provides structure of a kind of MEMS three-dimensional perpendicular assembled package and preparation method thereof, selects for the measurement of three-dimensional acceleration provides another kind of simultaneously.The present invention proposes a kind of holder combination structure; This structure is made right angle rack with method and ultraviolet light polymerization that laser calibration adds the prism assist location; Use the mode of lead-in wire bonding to realize electrical interconnection, the collection chip encapsulates and assembles and one, has avoided the difficulty of 3-axis acceleration design and making; Reduced packaging cost, for the measurement of three-dimensional acceleration provides another kind of approach.
The technical scheme that the present invention taked is: at first make and be used to constitute support and it supports the substrate of interconnection effect to chip; Pasting chip on substrate if necessary, also need mount the mirror surface that is used for optical correction then, and realizes the electrical connection of chip to substrate through the lead-in wire bonding; It is vertical with the plane that the module of the acceleration that is used to measure the Z direction belongs to that the method for using laser calibration to add the prism assist location subsequently will be used for the plane at module place of acceleration of measured X-Y direction; Contact-making surface two modules is fixed with ultraviolet cured adhesive; The bonding that goes between is at last realized the electrical interconnection between two modules, and adopts and plant the autumn mode, so that three-dimensional perpendicular assembled package structure and extraneous interconnection.
Concrete preparation method is:
A. pasting chip on substrate if necessary, also need mount the mirror surface that is used for optical correction
(a) at first on substrate with sticker dress MEMS acceleration sensor chip and solidify (condition of cure: 150C, 120s).If chip surface is not used in the minute surface of reflection, when perhaps not reaching minute surface and require, can mount the auxiliary mirror face at the redundant place of substrate surface (substrate surface of no wiring, pad and device) as the chip surface of reflecting surface;
B. the method for using laser calibration to add the prism assist location positions
(a) horizontal module and vertical module are loaded into respectively on horizontal adjusting bracket and the vertical adjusting bracket;
(b) regulate horizontal adjusting bracket, make horizontal module vertical with the collimator light path;
(c), make vertical module and collimator light path parallel with 45 ° of prism assist location;
(d) regulate adjusting bracket, the bottom surface of vertical module is contacted with the end face of horizontal module.
C. ultraviolet cured adhesive is fixed
(a) at the vertical contact-making surface coating ultraviolet light curing glue of module and horizontal module;
(b) exposure is solidified.
D. the completion of intermodule interconnection
(a) to vertical module and the horizontal module bonding that goes between, realize the interconnection of chip to substrate and two intermodules;
(b) add the metal cap protection.
(c) plant the autumn in the bottom surface of horizontal module, reflux then.
Architectural feature by the MEMS three-dimensional perpendicular assembled package of said method made is:
(1) structure of whole MEMS three-dimensional perpendicular assembled package comprises 20 * a 14 * 2.6mm
3Be used to test the horizontal module and 16 * 14 * 2.6mm of X-Y directional acceleration
3Be used to test the vertical module of Z directional acceleration;
(2) chip to the power condition of the bonding of substrate surface is: first bonding point: 307w, second bonding point: 278w;
(3) formed the pad array of n * m at the back side of horizontal module.Pad array supports to determine it is to adopt circumferential distribution according to interconnection exit subnumber with to the structure of whole three-dimensional perpendicular assembled package, still adopts the face array distribution;
(4) vertically the bottom surface of module contacts with the upper surface of horizontal module, and the electrical interconnection between horizontal module and the vertical module realizes through near the pad the contact-making surface that is distributed in two modules;
(5) vertically module is connected (high temperature of anti-125C) with horizontal module by ultraviolet cured adhesive, 5 minutes time for exposure;
(6) soldered ball material is Pb/Sn, and the backflow peak temperature is 215C.
(7) vertically angle between module and the horizontal module and phase quadrature 10 ' in.
N and m during said structure is described are the positive integer more than or equal to 2, and wherein n and m represent the line number and the columns of pad array.
Actual effect of the present invention is to be combined into 3-axis acceleration sensor with single-axis acceleration sensors; The collection chip encapsulates and is assembled into one; The difficulty of having avoided the 3-axis acceleration design and having made has reduced packaging cost, for the measurement of three-dimensional acceleration provides another kind of approach.Whole technical process and traditional IC packaging technology are compatible, and technology is simple.
Description of drawings
Fig. 1 is the vertical view that mounts behind the acceleration transducer bare chip.
Fig. 2 is the back view of horizontal module.
Fig. 3 is the front elevation that mounts the vertical module behind the acceleration transducer bare chip.
Fig. 4 is the sketch map of horizontal module collimation.
Fig. 5 is the sketch map of vertical module collimation.
Fig. 6 is the side view after horizontal module makes up with vertical module carrier.
Fig. 7 is the combination module chart behind the lead-in wire bonding.
Fig. 8 is the combination module chart that adds after metal cap is protected.
Fig. 9 is the combination module chart of planting after the autumn backflow forms salient point.
The specific embodiment
For advantage of the present invention and good effect are found full expression, substantive distinguishing features of the present invention and obvious improvement are described further below in conjunction with accompanying drawing and embodiment.
In Fig. 1, on substrate 101, mount MEMS acceleration transducer 103, for carrying out the transmission of the signal of telecommunication, the MEMS device has 6 metal pads 102 and three pads 104 that are used for vertical module by signal transmission on substrate 101.
In Fig. 2, on the back side 201 of substrate, n * m pad 202 arranged.(n and m are variable, the number of ports that the apparent acceleration chip is external and deciding, and it is many to connect the signal that if desired, and then n * m is big, vice versa)
In Fig. 3, on substrate 301, mount MEMS sensor 303, for carrying out the transmission of the signal of telecommunication, the MEMS device has 6 metal pads 302 and three to be used for the pad 304 that signal distributes again on substrate 301.
In Fig. 4, the light beam that light source sends reflexes to spectroscope through MEMS device 103, reflexes to eyepiece again, overlaps with cross-graduation plate in the eyepiece.
In Fig. 5, the light beam that light source sends reflects back into eyepiece through 45 ° of prisms, MEMS device 303 and spectroscope, overlaps with cross-graduation plate in the eyepiece.
In Fig. 6, move to vertical module 301 with horizontal module 101 and contact gluing, curing.
In Fig. 7, be bonded to the pad on MEMS device 103 and 303 lead-in wire on substrate pads 102 and 302, simultaneously, in order to be transferred to the next stage circuit to the signal on the vertical MEMS device 303, with pad 304 and pad 104 bonding that goes between.
In Fig. 8, with metal cap with two MEMS chips 103 and 303 and lead-in wire add metal cap 801,802 and protect, the lead-in wire of protecting between 104 and 304 with metal cap 803 simultaneously.Three metal caps solidify at 100 ℃/30min with black glue.
In Fig. 9, coating scaling flux on 202 pads is planted the autumn backflow then and is formed salient point 901.
Claims (10)
1. the preparation method of the structure of MEMS three-dimensional perpendicular assembled package is characterized in that at first making and is used to constitute support and chip is worked the substrate that supports the interconnection effect; Pasting chip on substrate then; And realizing the electrical connection of chip to substrate through the lead-in wire bonding, it is vertical with the plane that the module of the acceleration that is used to measure the Z direction belongs to that the method for using laser calibration to add the prism assist location subsequently will be used for the plane at module place of acceleration of measured X-Y direction; Contact-making surface two modules is fixed with ultraviolet cured adhesive; The bonding that goes between is at last realized the electrical interconnection between two modules, adopts at last and plants the ball mode, so that three-dimensional perpendicular assembled package structure and extraneous interconnection.
2. press the preparation method of the structure of the described MEMS three-dimensional perpendicular of claim 1 assembled package, it is characterized in that concrete processing step is:
A. pasting chip on substrate
At first on substrate, also solidify with sticker dress MEMS acceleration sensor chip;
B. the method for using laser calibration to add the prism assist location positions
(a) horizontal module and vertical module are loaded into respectively on horizontal adjusting bracket and the vertical adjusting bracket;
(b) regulate horizontal adjusting bracket, make horizontal module vertical with the collimator light path;
(c), make vertical module and collimator light path parallel with 45 ° of prism assist location;
(d) regulate vertical adjusting bracket, the bottom surface of vertical module is contacted with the end face of horizontal module;
C. ultraviolet cured adhesive is fixed
(a) at the vertical contact-making surface coating ultraviolet light curing glue of module and horizontal module;
(b) exposure is solidified;
D. the completion of intermodule interconnection
(a) to vertical module and the horizontal module bonding that goes between, realize the interconnection of chip to substrate and two intermodules;
(b) add the metal cap protection;
(c) plant ball in the bottom surface of horizontal module, reflux then.
3. by the preparation method of the structure of claim 1 or 2 described MEMS three-dimensional perpendicular assembled package, mount the mirror surface of optical standard when it is characterized in that on substrate pasting chip at the redundant place of substrate surface: described redundant place is meant the substrate surface of no wiring, pad and device.
4. by the preparation method of the structure of the described MEMS three-dimensional perpendicular of claim 2 assembled package, it is characterized in that temperature that steps A is solidified is that 150 ℃, time are 120 seconds.
5. press the preparation method of the structure of the described MEMS three-dimensional perpendicular of claim 2 assembled package, it is characterized in that the high temperature that the ultraviolet cured adhesive of in step C, selecting for use is anti-125 ℃, and the time for exposure is 5min.
6. by the preparation method of the described micro electromechanical system chip size airtight packaging vertical interconnecting structure of claim 2, it is characterized in that in step D, planting the soldered ball that ball uses and weld as Pb/Sn, the formation salient point refluxes.
7. press the preparation method of the structure of the described MEMS three-dimensional perpendicular of claim 6 assembled package, the backflow peak temperature that it is characterized in that said formation salient point is 215 ℃.
8. by the structure of the MEMS three-dimensional perpendicular assembled package of any claim made among the claim 1-6, it is characterized in that:
(1) structure of described MEMS three-dimensional perpendicular assembled package adopts the holder combination mode, comprises a horizontal module and a vertical module that is used to test the Z directional acceleration that is used to test the X-Y directional acceleration;
(2) formed the pad array of n * m at the back side of horizontal module, pad array supports according to interconnection exit subnumber with to the structure of whole three-dimensional perpendicular assembled package and determines to adopt circumferential distribution or the face of employing array distribution; Described n and m are the positive integer more than or equal to 2, and wherein, n and m represent the line number and the columns of pad array;
(3) vertically module bottom surface contacts with horizontal module upper surface, and the electrical interconnection between horizontal module and the vertical module is to realize through near the pad the contact-making surface that is distributed in two modules;
(4) vertically module is connected by ultraviolet cured adhesive with horizontal module;
(5) vertically the angle between module and the horizontal module and 90 ° of errors 10 ' in.
9. press the structure of the described MEMS three-dimensional perpendicular of claim 8 assembled package; It is characterized in that the chip that mounts the MEMS acceleration transducer on horizontal module and the vertical module and go between protecting with metal cap, the lead-in wire between near the signal of vertical module and horizontal module distributes is again also protected with metal cap.
10. by the structure of the described MEMS three-dimensional perpendicular of claim 9 assembled package, it is characterized in that described metal cap is that solidification temperature is 100 ℃ with black glue, the time is 30min.
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| CN200810207329XA CN101525116B (en) | 2008-12-19 | 2008-12-19 | Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof |
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| CN200810207329XA CN101525116B (en) | 2008-12-19 | 2008-12-19 | Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof |
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| CN102241388B (en) * | 2011-05-18 | 2015-02-18 | 中国科学院上海微系统与信息技术研究所 | MEMS (micro electro mechanical system) wafer-level three-dimensional mixing integration packaging structure and method |
| CN103184862B (en) * | 2011-12-30 | 2017-12-19 | 国家纳米技术与工程研究院 | A kind of measuring part of three-dimensional MEMS accelerometer for oil well logging and preparation method thereof |
| CN103107109B (en) * | 2012-12-12 | 2016-06-29 | 贵州振华风光半导体有限公司 | The integrated approach of three-dimensionally integrated power thin film hydrid integrated circuit |
| CN104034918A (en) * | 2013-03-06 | 2014-09-10 | 原相科技股份有限公司 | Multi-axis acceleration sensing device and related making method |
| CN105716606B (en) * | 2016-04-05 | 2018-07-10 | 中国电子科技集团公司第四十三研究所 | 3 axis MEMS Inertial Sensor System grade encapsulation unit structure |
| CN105800544B (en) * | 2016-05-16 | 2017-04-12 | 安徽北方芯动联科微系统技术有限公司 | Multi-axis MEMS sensor module and vertical assembling method thereof |
| CN107404604B (en) * | 2017-01-16 | 2019-01-18 | 南昌欧菲光电技术有限公司 | Assemble method and camera mould group |
| CN109411453B (en) * | 2018-09-17 | 2022-03-15 | 珠海欧比特电子有限公司 | Vertical interconnection method for three-dimensional packaging |
| CN109707372A (en) * | 2019-01-29 | 2019-05-03 | 杭州祥龙钻探设备科技股份有限公司 | A kind of perforation of boring machine orientation survey device based on six axis MEMS sensors |
| CN110690128B (en) * | 2019-08-27 | 2021-11-02 | 华东光电集成器件研究所 | Bonding interconnection method between three-dimensional facets of chip |
| CN113204028A (en) * | 2021-05-07 | 2021-08-03 | 哈尔滨工业大学 | Near-field thermal radiation experimental device and leveling method thereof |
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Address after: 200050 Changning Road, Shanghai, No. 865, No. Patentee after: Shanghai new Micro Technology Group Co., Ltd. Address before: 200050 Changning Road, Shanghai, No. 865, No. Patentee before: Shanghai new Microelectronics Co., Ltd. |
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