CN101524875B - Process for multi-wire cutting of bismuth telluride by cutting machine - Google Patents

Process for multi-wire cutting of bismuth telluride by cutting machine Download PDF

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Publication number
CN101524875B
CN101524875B CN2008100501724A CN200810050172A CN101524875B CN 101524875 B CN101524875 B CN 101524875B CN 2008100501724 A CN2008100501724 A CN 2008100501724A CN 200810050172 A CN200810050172 A CN 200810050172A CN 101524875 B CN101524875 B CN 101524875B
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CN
China
Prior art keywords
cutting
bismuth telluride
die clamper
die
cutting machine
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Expired - Fee Related
Application number
CN2008100501724A
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Chinese (zh)
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CN101524875A (en
Inventor
陈建民
陈燕青
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Henan Hongchang Electronics Co Ltd
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Henan Hongchang Electronics Co Ltd
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Priority to CN2008100501724A priority Critical patent/CN101524875B/en
Publication of CN101524875A publication Critical patent/CN101524875A/en
Application granted granted Critical
Publication of CN101524875B publication Critical patent/CN101524875B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The present invention relates to a process for multi-wire cutting of bismuth telluride by a cutting machine, and belongs to a process for cutting N and P wafers and couples of semiconductor refrigerators made from the bismuth telluride. The technical proposal is realized by the following method: (1) taking carborundum steel wires as cutting wires of the cutting machine; (2) manufacturing a die clamper, wherein the upper surface of a die clamp is provided with 3 to 7 rows and 3 to 8 ranks of grooves for storing the bismuth telluride, while clamping grooves for fixedly clamping the die clamper vertically and horizontally are arranged under the die clamper; (3) placing the bismuth telluride in a groove of the die clamper, and performing primary cutting; and (4) after the primary cutting, rotating the die clamper 90 DEG for secondary cutting. By adopting the technical proposal, the process has the advantages of improving the working efficiency, reducing the labor intensity, and having high processing quality and low cost; and processed devices have the advantages of high reliability, good consistency, energy conservation, consumption reduction and the like.

Description

The technology of multi-wire cutting of bismuth telluride by cutting machine
Technical field
The present invention relates to the technology of multi-wire cutting of bismuth telluride by cutting machine, belong to the cutting technique of making N, P wafer and galvanic couple in the semiconductor cooler with bismuth telluride.
Background technology
At present, in the process of cutting bismuth telluride, the method of being taked is: with the inside diameter slicer cutting bismuth telluride that a diamond blade is installed, so just exist inefficient shortcoming, in addition also because diamond blade is very not sharp, in the process of cutting, cause the excesssive gap of bismuth telluride, when secondary cut, need filling medium, caused so again that quality instability, efficient are low, the defective of complex process; Existing multi-thread cutting technique is used for other field, sees in bismuth telluride cutting field.
Summary of the invention
The object of the present invention is to provide the technology of a kind of efficient height, steady quality, the simple multi-wire cutting of bismuth telluride by cutting machine of technology.
Technical scheme of the present invention realizes with the following method:
(1), with the line of cut of carborundum steel wire as cutting machine;
(2), make die clamper: have capable, the horizontal 3-8 row of vertical row 3-7 above the die clamper groove of placing bismuth telluride is installed, have the draw-in groove of fixing in length and breadth engaging die clamper below the die clamper;
(3), bismuth telluride is positioned in the groove of die clamper, once cut then;
(4), for the first time after cutting finishes, secondary cut is carried out in the cutting of die clamper half-twist.
Other technologies are existing cutting machine cutting bismuth telluride technology, and institute's difference is above improvement.
The present invention is owing to taked above technical scheme, make such technology have increasing work efficiency, reduce labour intensity, crudy height, advantage that cost is low, plurality of advantages such as the device reliability height of being processed, high conformity, energy savings, reduction consumption.
The specific embodiment
Below in conjunction with the present invention is further illustrated.
With the line of cut of carborundum steel wire as cutting machine; Make that such line of cut is sharper, power used during cutting is littler, does not need filled media between the gap of bismuth telluride, has to have omitted operation, advantage that disability rate is low; Make die clamper: have capable, the horizontal 3-8 row of vertical row 3-7 above the die clamper groove of placing bismuth telluride is installed, so once can install and fix the lamination post of a plurality of bismuth telluride crystal columns or bismuth telluride, because cutting machine has many undercuts secant and can cut simultaneously; The draw-in groove that has multi-purpose card matched moulds anchor clamps below the die clamper, being convenient to the die clamper vertical and horizontal like this can both fix; Bismuth telluride slabbing or strip after once cutting is finished, half-twist cut and to carry out secondary cut into strips or little bulk.Improved operating efficiency, facts have proved that the working ability of a multi-line cutting machine is equivalent to the working ability of more than 10 numerical control machine cutting; In addition, bismuth telluride is positioned in the die cavity with groove, is equivalent to the bismuth telluride crudy that is fixed up is further improved, realized quick, simple and direct, purpose efficiently.

Claims (1)

1. the technology of multi-wire cutting of bismuth telluride by cutting machine is characterized in that:
(1), with the line of cut of carborundum steel wire as cutting machine;
(2), make die clamper: have capable, the horizontal 3-8 row of vertical row 3-7 above the die clamper groove of placing bismuth telluride is installed, have the draw-in groove of fixing in length and breadth engaging die clamper below the die clamper;
(3), bismuth telluride is positioned in the groove of die clamper, once cut then;
(4), for the first time after cutting finishes, secondary cut is carried out in the cutting of die clamper half-twist.
CN2008100501724A 2008-06-27 2008-06-27 Process for multi-wire cutting of bismuth telluride by cutting machine Expired - Fee Related CN101524875B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008100501724A CN101524875B (en) 2008-06-27 2008-06-27 Process for multi-wire cutting of bismuth telluride by cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008100501724A CN101524875B (en) 2008-06-27 2008-06-27 Process for multi-wire cutting of bismuth telluride by cutting machine

Publications (2)

Publication Number Publication Date
CN101524875A CN101524875A (en) 2009-09-09
CN101524875B true CN101524875B (en) 2011-09-14

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Application Number Title Priority Date Filing Date
CN2008100501724A Expired - Fee Related CN101524875B (en) 2008-06-27 2008-06-27 Process for multi-wire cutting of bismuth telluride by cutting machine

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CN (1) CN101524875B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102941628B (en) * 2012-07-31 2014-12-24 南通皋鑫电子股份有限公司 Diode silicon stack cutting process and special tool thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1208174C (en) * 2003-08-29 2005-06-29 袁建中 Orientation method used in cutting crystal
CN101168270A (en) * 2006-10-25 2008-04-30 硅电子股份公司 Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1208174C (en) * 2003-08-29 2005-06-29 袁建中 Orientation method used in cutting crystal
CN101168270A (en) * 2006-10-25 2008-04-30 硅电子股份公司 Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2006-102917A 2006.04.20
JP特开平11-99465A 1999.04.13
JP特开平8-281642A 1996.10.29

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Granted publication date: 20110914

Termination date: 20120627