CN101520613B - Device and method for calibrating mark position - Google Patents
Device and method for calibrating mark position Download PDFInfo
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- CN101520613B CN101520613B CN2009100479528A CN200910047952A CN101520613B CN 101520613 B CN101520613 B CN 101520613B CN 2009100479528 A CN2009100479528 A CN 2009100479528A CN 200910047952 A CN200910047952 A CN 200910047952A CN 101520613 B CN101520613 B CN 101520613B
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Abstract
The invention provides a device and a method for calibrating a mark position, which are used for acquiring a rotation amount of a mark relative to a reference grating. The device for calibrating the mark position comprises a first acquisition unit and an image processing unit. The first acquisition unit is used for acquiring and outputting static image data of the mark. The image processing unit is coupled to the first acquisition unit, and comprises a storage unit and a calculating unit. The storage unit is used for receiving the static image data and converting the static image data of the mark into digital signals. The calculating unit is coupled to the storage unit, and receives the digital signals to carry out calculation so as to acquire the rotation amount. The device and the methodfor calibrating the mark position can reduce the deviation caused by the rotation of the actual mark and a silicon chip, improve measurement precision, simultaneously save the steps of measuring the rotation of the silicon chip and then aligning or correcting, improve production efficiency, and increase the yield of products.
Description
Technical field
The present invention relates to the lithography alignment technology, and particularly relevant for a kind of device and method of calibrating mark position.
Background technology
Lithographic equipment is mainly used in the manufacturing of integrated circuit (IC) or other microdevices.In manufacture process, complete chip need just can complete through photolithographic exposure repeatedly usually.In these exposure process, the alignment precision between silicon chip and the silicon chip platform is a key factor that influences lithographic accuracy.Usually, in litho machine, use silicon chip alignment system to determine the position relation of silicon chip and silicon chip platform.
In the litho machine of higher-end, the general grating alignment that adopts is measured, promptly in alignment procedures, mobile silicon chip platform scanning alignment mark (grating to be measured, be positioned on the silicon chip), the diffraction light of reflection projects to reference on the grating (fixing with the exposure lens location), when the picture that obtains of sampling diffraction light overlaps with the reference grating by the alignment system imaging, be positioned at the light intensity maximum that detects with reference to the photodetector behind the grating, the silicon chip platform position in this moment is an aligned position.
Owing in litho machine, fix, and can be by surveying the calibration method calibration with reference to the rotation of grating with reference to grating.Therefore, meetings such as the position of silicon chip platform scanning alignment mark (hereinafter to be referred as mark), rotation, pattern influence it and project to reference to the picture on the grating, thereby the light intensity with reference to grating is passed through in influence, and then finally influence aligned position.Under the intact situation of mark pattern, the different rotary of same position can make alignment system obtain different aligned positions.
Figure 1 shows that mark and with reference to do not have between the grating rotation synoptic diagram.As shown in Figure 1, mark 1 and when not rotating between the grating 2, the two overlaps fully, is aligned position in this case.
Because silicon chip may exist rotation, skew when being written into the silicon chip platform, under this rotation condition of unknown, if measure the aligned position that silicon chip mark obtains by silicon chip alignment system, this position may not be a physical location.
Figure 2 shows that mark and the synoptic diagram that rotates with reference to existence between the grating.As shown in Figure 2, mark 1 and with reference to there being a certain amount of rotation between the grating 2, in this case, when detecting the light intensity maximal value, overlapping the position is that aligned position exists skew.
Above-mentioned side-play amount and grating are apart from gd, mark and relevant with reference to the rotation amount of grating.As shown in Figure 2, grating is the distance of grating to the grating center line apart from gd.In order to obtain correct alignment position, then need the influence that rotation causes is compensated calibration.
From Fig. 2, can clearly find out, be by mark 1 and with reference to the offset that rotation caused between the grating 2:
delta＝Rz*gd......(1)
Wherein, delta is a side-play amount, and Rz is a rotation amount, and gd is the grating distance of this direction, direction shown in Fig. 2 be level to.So actual position is:
act_pos＝align_pos-delta......(2)
In formula (1) substitution formula (2):
act_pos＝align_pos-Rz*gd......(3)
Wherein, align_pos is for aiming at the position that obtains automatically, and act_pos is actual position.By formula (3) as can be seen, Shi Ji position act_pos is relevant apart from gd with rotation amount Rz and grating.Yet grating is known apart from gd, thus as long as know rotation amount Rz, just can use Rz calibration scan aligned position, to obtain actual aligned position.In actual applications, the rotation of mark is unknown, and what the Rz rotation was used is exactly the silicon chip rotation, thinks that promptly being marked in the silicon chip is not rotate.
Prior art is generally carried out coarse alignment earlier and is measured the silicon chip rotation.The effect of coarse alignment is catch position and proofreaies and correct rotation.Because before measurement, rotation amount is unknown, suppose that at first rotation amount is zero, because there is rotation in actual capabilities, can have deviation with physical location so measure the position of two silicon chip marks, by two thick aligned positions, can calculate parameters such as a thick rotation amount and silicon chip skew, it is less with actual deviation that the thick rotation amount that calculates can be thought, in calibration equation calculates, can ignore.
According to thick rotation amount two kinds of disposal routes are arranged, the one, with thick rotation amount rotation silicon chip platform, purpose makes mark without spin for ajusting mark, carries out fine alignment on this basis more earlier, the position that obtains is exactly a physical location; The 2nd, do not rotate the silicon chip platform, but directly carry out locating tab assembly, rotation is worth substitution formula (3) calibration aligned position, obtain physical location.
Use coarse alignment to proofread and correct the rotation back and measure,, obtain aligned position more accurately, have some problems although can reduce error:
The one, still may there be deviation in aligned position and physical location after the calibration.It is without spin that coarse alignment needs the relative silicon chip of mark, and its prerequisite is to guarantee by the rotation of first calibration marker mask before the silicon chip of exposure mark.That is to say the correct rotation amount that can't learn mark, may there be deviation in aligned position with physical location.
The 2nd, can introduce unnecessary step.In order to obtain the rotation of silicon chip, also need to carry out the bigness scale amount earlier one time, comprise the aligning of two marks at least, therefore reduced efficient.
Summary of the invention
The present invention is intended to solve in the prior art, the deviation that real marking and silicon chip exist rotation to cause, and the product yield that causes is low, and production efficiency is hanged down inferior technical matters.
In view of this, the present invention proposes a kind of device of calibrating mark position, is used to obtain the rotation amount of mark with respect to the reference grating.The device of calibrating mark position comprises: first collecting unit and graphics processing unit.First collecting unit is used to gather and export the static image data of described mark.Graphics processing unit couples first collecting unit, and comprises storage unit and computing unit.Storage unit is used to receive the static image data of described mark, and the static image data of described mark is converted into digital signal.Computing unit couples storage unit, receives described digital signal to calculate, and obtains described rotation amount.
Further, described device also comprises second collecting unit, couples described first collecting unit, is used to monitor the image of described mark.
Further, described second collecting unit is arranged at the optical diffraction place of described mark.
Further, the sensor of described second collecting unit is CCD.
Further, described computing unit comprises image processing algorithm.
Further, described first collecting unit is a shutter.
Further, described graphics processing unit is an image pick-up card.
The present invention also proposes a kind of method of calibrating mark position, is used to obtain the rotation amount of mark with respect to the reference grating.The method of calibrating mark position comprises: the static image data of gathering and export described mark; Receive and the static image data of described mark is converted into digital signal; And receive described digital signal, and calculate described rotation amount by computing unit.
Further, described method also comprises the image of monitoring described mark by second harvester.
Further, the sensor of described second collecting unit is CCD.
Further, described computing unit comprises image processing algorithm.
The device and method of this calibrating mark position provided by the invention can reduce because the deviation that real marking and silicon chip exist rotation to cause has improved measuring accuracy, save simultaneously and measure the silicon chip rotation, and then the step of ajusting or revising, improved production efficiency, increased the product yield.
Description of drawings
Figure 1 shows that mark and with reference to do not have between the grating rotation synoptic diagram.
Figure 2 shows that mark and the synoptic diagram that rotates with reference to existence between the grating.
Figure 3 shows that the schematic representation of apparatus of calibrating mark position according to an embodiment of the invention.
Figure 4 shows that the process flow diagram of the method for calibrating mark position according to an embodiment of the invention.
Embodiment
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Figure 3 shows that the schematic representation of apparatus of calibrating mark position according to an embodiment of the invention.See also Fig. 2, the device 3 of the calibrating mark position that present embodiment provided is used to obtain the rotation amount of mark 1 with respect to reference grating 2.The device 3 of calibrating mark position comprises first collecting unit 10, graphics processing unit 20, second collecting unit 30, coupling mechanism 40, video card 50 and display unit 60.
In the present embodiment, first collecting unit 10 is used to gather and export the static image data of described mark.Graphics processing unit 20 couples first collecting unit 10, and comprises storage unit 200 and computing unit 201.Wherein, storage unit 200 is used to receive the still image of described mark, and the still image of described mark is converted into digital signal.Computing unit 201 couples storage unit 200, and receiving digital signals obtains rotation amount to calculate.
In the present embodiment, first collecting unit 10 is arranged at after second collecting unit 30, in other embodiments, first collecting unit 10 also can be arranged at before second collecting unit 30, and the present invention does not limit the relative position of first collecting unit 10 and second collecting unit 30.
Specifically, the diffraction light of mark 1 reflection can be divided into two-way, and one the tunnel for the grating alignment use, and another road is aimed at for silicon chip and used.In the present embodiment, second collecting unit 30 is arranged at the optical diffraction place of mark 1, and second collecting unit 30 couples first collecting unit 10, is used to monitor the image of described mark.In the present embodiment, second collecting unit 30 is a ccd detector, and in other embodiments, second collecting unit 30 also can be other equivalents, and the present invention does not make restriction to this.
As shown in Figure 3, second collecting unit 30 is constantly monitored the view data that obtains mark 1, and image is drawn from optical fiber, is divided into the consistent light beam of two bundles by coupling mechanism 40.Wherein, a branch of light is introduced into video card 50.Video card 50 receiving optical signals, and be converted into electric signal, output to display unit 60.Therefore, the image of mark 1 is shown on the display unit 60 dynamically, observes mark 1 scanning situation in real time for operating personnel.In the present embodiment, display unit 60 is a display, yet the present invention does not make restriction to this.
Among Fig. 3, another Shu Guang that is told by coupling mechanism 40 enters first collecting unit 10, and in the present embodiment, first collecting unit 10 is a shutter, yet the present invention does not make restriction to this.First collecting unit 10 can obtain the static image data of mark 1.
Above-mentioned static image data input picture processing unit 20, in the present embodiment, graphics processing unit 20 is an image pick-up card, the present invention does not make restriction to this.Graphics processing unit 20 comprises storage unit 200 and computing unit 201.Wherein, storage unit 200 changes into digital signal corresponding with above-mentioned static image data, and computing unit 201 receives this digital signal, to calculate, obtains the rotation amount of mark 1 with respect to reference grating 2.Aforementioned calculation unit 201 comprises image processing algorithm.
At last, demarcate the rotation amount that obtains, will calculate, obtain correct alignment position with the aligned position that grating alignment measures.
Figure 4 shows that the process flow diagram of the method for calibrating mark position according to an embodiment of the invention, the relevant detailed description in detail please be in the lump with reference to Fig. 3.As shown in Figure 4, process step comprises:
Step S40 gathers and exports the static image data of described mark.
Step S41 receives and the static image data of described mark is converted into digital signal.
Step S42 by computing unit 201 receiving digital signals, and calculates the rotation amount of mark 1 with respect to reference grating 2.
For instance, in the grating measuring process, switch first collecting unit 10 is to obtain the static image data of mark at first rapidly, this static image data is transferred to graphics processing unit 20, utilize storage unit 200 that static image data is converted into digital signal, calculate above-mentioned rotation amount by computing unit 201 utilization image processing algorithms.At last the rotation amount that calculates is compensated in the aligned position of grating alignment, finish whole calibration steps.
In sum, the device and method of the calibrating mark position that the embodiment of the invention provided, can reduce because the deviation that real marking and silicon chip exist rotation to cause, improved measuring accuracy, save simultaneously and measure the silicon chip rotation, and then the step of ajusting or revising, improved production efficiency, increased the product yield.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (11)
1. the device of a calibrating mark position is used to obtain the rotation amount of mark with respect to the reference grating, it is characterized in that, comprising:
Second collecting unit is used for the view data that constantly monitoring obtains described mark;
Coupling mechanism sees through optical fiber and is connected with described second collecting unit, is divided into the consistent light beam of two bundles in order to the image that described second collecting unit is drawn through described optical fiber;
Video card in order to receiving the light beams in the described two light beams, and becomes electric signal output with described Beam Transformation;
Display unit is connected with described video card, is used for the electric signal of described video card output is shown;
First collecting unit is connected with described coupling mechanism, is used for another light beams of described two light beams is gathered and exported the static image data of described mark; And
Graphics processing unit couples described first collecting unit, comprising:
Storage unit is used to receive the static image data of described mark, and the static image data of described mark is converted into digital signal; And
Computing unit couples described storage unit, receives described digital signal to calculate, and obtains described rotation amount.
2. the device of calibrating mark position according to claim 1 is characterized in that, also comprises second collecting unit, couples described first collecting unit, is used to monitor the image of described mark.
3. the device of calibrating mark position according to claim 2 is characterized in that, described second collecting unit is arranged at the optical diffraction place of described mark.
4. the device of calibrating mark position according to claim 2 is characterized in that, the sensor of described second collecting unit is CCD.
5. the device of calibrating mark position according to claim 1 is characterized in that, described computing unit comprises image processing algorithm.
6. the device of calibrating mark position according to claim 1 is characterized in that, described first collecting unit is a shutter.
7. the device of calibrating mark position according to claim 1 is characterized in that, described graphics processing unit is an image pick-up card.
8. the method for a calibrating mark position is used to obtain the rotation amount of mark with respect to the reference grating, it is characterized in that, may further comprise the steps:
See through second collecting unit and constantly monitor the view data that obtains described mark;
The image of described second collecting unit being drawn through optical fiber through coupling mechanism is divided into the consistent light beam of two bundles;
Seeing through video card becomes electric signal to export display unit demonstration to a branch of Beam Transformation in the described two light beams;
See through first collecting unit and another light beams in the described two light beams is gathered and exported the static image data of described mark;
Receive and the static image data of described mark is converted into digital signal; And
Receive described digital signal by computing unit, and calculate described rotation amount.
9. the method for calibrating mark position according to claim 8 is characterized in that, also comprises the image of monitoring described mark by second collecting unit.
10. the method for calibrating mark position according to claim 9 is characterized in that, the sensor of described second collecting unit is CCD.
11. the method for calibrating mark position according to claim 8 is characterized in that, described computing unit comprises image processing algorithm.
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| CN112697186B (en) * | 2019-10-23 | 2022-03-25 | 上海微电子装备（集团）股份有限公司 | Measurement correction device and measurement correction method |
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| CN101140422A (en) * | 2007-08-20 | 2008-03-12 | 上海微电子装备有限公司 | Mask alignment making and aligning used for light scribing device |
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| CN101140422A (en) * | 2007-08-20 | 2008-03-12 | 上海微电子装备有限公司 | Mask alignment making and aligning used for light scribing device |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |