CN101518851A - 靶材与背板的焊接结构及方法 - Google Patents
靶材与背板的焊接结构及方法 Download PDFInfo
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- CN101518851A CN101518851A CN200910005687A CN200910005687A CN101518851A CN 101518851 A CN101518851 A CN 101518851A CN 200910005687 A CN200910005687 A CN 200910005687A CN 200910005687 A CN200910005687 A CN 200910005687A CN 101518851 A CN101518851 A CN 101518851A
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- target
- backboard
- intermediate layer
- welding
- copper
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000003466 welding Methods 0.000 title claims abstract description 45
- 239000013077 target material Substances 0.000 title abstract description 20
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 65
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 30
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 238000002294 plasma sputter deposition Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 7
- 238000001513 hot isostatic pressing Methods 0.000 abstract 1
- 150000002739 metals Chemical group 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 238000009924 canning Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
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Priority Applications (1)
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CN2009100056877A CN101518851B (zh) | 2009-02-19 | 2009-02-19 | 靶材与背板的焊接结构及方法 |
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CN2009100056877A CN101518851B (zh) | 2009-02-19 | 2009-02-19 | 靶材与背板的焊接结构及方法 |
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CN101518851A true CN101518851A (zh) | 2009-09-02 |
CN101518851B CN101518851B (zh) | 2011-07-20 |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102513789A (zh) * | 2011-12-21 | 2012-06-27 | 宁波江丰电子材料有限公司 | 钨靶材的制作方法 |
CN102699519A (zh) * | 2012-05-26 | 2012-10-03 | 烟台希尔德新材料有限公司 | 一种大型平面靶材和背板的粘接方法 |
CN103074654A (zh) * | 2013-01-05 | 2013-05-01 | 江苏鼎启科技有限公司 | 二元假合金电子封装材料的表面处理方法 |
CN103801820A (zh) * | 2012-11-13 | 2014-05-21 | 宁波江丰电子材料有限公司 | 钽靶材和铝背板的热等静压扩散焊焊接方法 |
CN106378493A (zh) * | 2015-07-27 | 2017-02-08 | 宁波江丰电子材料股份有限公司 | 靶材组件的表面处理方法和工具 |
CN106471151A (zh) * | 2014-06-27 | 2017-03-01 | 攀时复合材料有限公司 | 溅镀靶 |
CN107511599A (zh) * | 2016-06-15 | 2017-12-26 | 宁波江丰电子材料股份有限公司 | 钽靶材组件的焊接方法 |
CN108687492A (zh) * | 2017-04-12 | 2018-10-23 | 宁波江丰电子材料股份有限公司 | 靶材组件的制造方法 |
CN109536898A (zh) * | 2018-12-05 | 2019-03-29 | 爱发科电子材料(苏州)有限公司 | 液晶显示、半导体、电子用靶材的粘接工艺 |
CN109604802A (zh) * | 2019-01-03 | 2019-04-12 | 中国兵器工业第五九研究所 | 钨或钨合金与钢的连接方法、型材的连接方法以及型材接头 |
CN109822248A (zh) * | 2019-02-28 | 2019-05-31 | 华中科技大学 | 一种用于薄壁结构的热等静压-钎焊复合成形方法 |
CN111014930A (zh) * | 2019-12-23 | 2020-04-17 | 有研亿金新材料有限公司 | 一种钨靶材组件两步热等静压扩散焊接方法 |
CN115121928A (zh) * | 2022-08-01 | 2022-09-30 | 宁波江丰电子材料股份有限公司 | 一种钽-钛异种金属的焊接方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102366856A (zh) * | 2011-10-20 | 2012-03-07 | 宁波江丰电子材料有限公司 | 钴靶材组件的焊接方法 |
CN102500908A (zh) * | 2011-10-20 | 2012-06-20 | 宁波江丰电子材料有限公司 | 钨靶材组件的焊接方法 |
-
2009
- 2009-02-19 CN CN2009100056877A patent/CN101518851B/zh active Active
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102513789B (zh) * | 2011-12-21 | 2014-04-09 | 宁波江丰电子材料有限公司 | 钨靶材的制作方法 |
CN102513789A (zh) * | 2011-12-21 | 2012-06-27 | 宁波江丰电子材料有限公司 | 钨靶材的制作方法 |
CN102699519A (zh) * | 2012-05-26 | 2012-10-03 | 烟台希尔德新材料有限公司 | 一种大型平面靶材和背板的粘接方法 |
CN103801820A (zh) * | 2012-11-13 | 2014-05-21 | 宁波江丰电子材料有限公司 | 钽靶材和铝背板的热等静压扩散焊焊接方法 |
CN103074654A (zh) * | 2013-01-05 | 2013-05-01 | 江苏鼎启科技有限公司 | 二元假合金电子封装材料的表面处理方法 |
CN103074654B (zh) * | 2013-01-05 | 2015-06-17 | 江苏鼎启科技有限公司 | 二元假合金电子封装材料的表面处理方法 |
CN106471151B (zh) * | 2014-06-27 | 2019-06-18 | 攀时复合材料有限公司 | 溅镀靶 |
CN106471151A (zh) * | 2014-06-27 | 2017-03-01 | 攀时复合材料有限公司 | 溅镀靶 |
US10109468B2 (en) | 2014-06-27 | 2018-10-23 | Plansee Composite Materials Gmbh | Sputtering target |
CN106378493A (zh) * | 2015-07-27 | 2017-02-08 | 宁波江丰电子材料股份有限公司 | 靶材组件的表面处理方法和工具 |
CN106378493B (zh) * | 2015-07-27 | 2018-08-10 | 合肥江丰电子材料有限公司 | 靶材组件的表面处理方法和工具 |
CN107511599A (zh) * | 2016-06-15 | 2017-12-26 | 宁波江丰电子材料股份有限公司 | 钽靶材组件的焊接方法 |
CN108687492A (zh) * | 2017-04-12 | 2018-10-23 | 宁波江丰电子材料股份有限公司 | 靶材组件的制造方法 |
CN109536898A (zh) * | 2018-12-05 | 2019-03-29 | 爱发科电子材料(苏州)有限公司 | 液晶显示、半导体、电子用靶材的粘接工艺 |
CN109604802A (zh) * | 2019-01-03 | 2019-04-12 | 中国兵器工业第五九研究所 | 钨或钨合金与钢的连接方法、型材的连接方法以及型材接头 |
CN109822248A (zh) * | 2019-02-28 | 2019-05-31 | 华中科技大学 | 一种用于薄壁结构的热等静压-钎焊复合成形方法 |
CN111014930A (zh) * | 2019-12-23 | 2020-04-17 | 有研亿金新材料有限公司 | 一种钨靶材组件两步热等静压扩散焊接方法 |
CN111014930B (zh) * | 2019-12-23 | 2022-01-18 | 有研亿金新材料有限公司 | 一种钨靶材组件两步热等静压扩散焊接方法 |
CN115121928A (zh) * | 2022-08-01 | 2022-09-30 | 宁波江丰电子材料股份有限公司 | 一种钽-钛异种金属的焊接方法 |
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