CN101517356A - Inspecting apparatus - Google Patents

Abstract

A shape of a cream solder is accurately detected, irrespective of a cream solder composition. An illumination setting section (95b) sets intensity of infrared light to be applied onto an illuminating apparatus (5) in accordance with the cream solder composition. An imaging apparatus (6) applies infrared light having the intensity set by the illuminating apparatus (5) onto a substrate coated with the cream solder. An imaging apparatus (6) images the substrate irradiated with the infrared light by the illuminating apparatus (5). Thus, an image including an image of reflection light from the substrate surface can be acquired.

Description

Testing fixture

Technical field

The present invention relates to check the testing fixture of the state of the pasty state scolder that is coated on the substrate.

Background technology

From in the past, disclose for the steady quality of the substrate that guarantees to be equipped with electronic component and the testing fixture that the state of developing to scolder is checked.

For example, Jap.P. open communique spy open in flat 9-89536 number, discloses a kind of to being formed on substrate and the method that the scolder between the polyimide substrate of semiconductor unit is checked being installed.In the method, irradiation comprises the light of region of ultra-red wavelength to substrate, see through the reflected light by the wavelength of the region of ultra-red of solder surface reflection of polyimide substrate by camera, thereby and its image signal data is carried out the AD conversion obtain the shading image signal, the area that constitutes by pixel by instrumentation greater than predefined concentration value in the regulation zone, check the state of scolder, especially detect scolder and have or not the bad or cross-over connection of coating.

The installation of electronic component, by with the pasty state solder coating on substrate, electronic component is installed on the assigned position of the substrate that is coated with this pasty state scolder, the substrate that this electronic component is installed is carried out reflow soldering is carried out.At this moment, if before electronic component is installed that is after having applied the pasty state scolder, the state of pasty state scolder is checked, the electronic component of when abnormal conditions appear in the state of pasty state scolder, can avoiding waste, thereby can enhance productivity.

In order to realize above-mentioned target, can consider with in the past to engaging the method for the polyimide substrate irradiation infrared light after back that is the reflow soldering, in the testing fixture that is applied to the state that is coated in the pasty state scolder on the substrate is checked, the inspection method.That is, by from being coated with the substrate top irradiation infrared light of pasty state scolder, and detect reflected light, thereby can check the state of pasty state scolder from the pasty state scolder.Particularly, as long as detect reflected light, just can check the profile of the pasty state scolder on the substrate from the pasty state solder surface; As long as detect through the pasty state scolder, from the reflected light of the sheet metal on the substrate, just can check the internal state of pasty state scolder.

Yet, because scolder is formed differently because of the kind of different its contents of kind or mixture ratio etc., therefore, the catoptrical intensity that reflects from solder surface or substrate surface is also different thereupon, its result can't correctly detect scolder profile or internal state.

And the characteristic of pasty state scolder and infrared LEDs changes along with the process of time, therefore, also changes from the catoptrical light intensity of substrate surface thereupon.For example, with regard to the pasty state scolder, if be exposed among the atmosphere, along with the process of time, deterioration can take place and for example curing etc. take place the surface in its characteristic.This is, due to the solder flux that for example comprises macromolecule component and the solder flux generation deterioration in the solder powder that constitute the pasty state scolder.Thus, diffusion or decay can take place in the infrared light through solder flux.And with regard to infrared LEDs, along with the process of time, the infrared light intensity of its output can change to some extent.Based on above-mentioned influence, can't correctly detect the state of scolder inside.

Summary of the invention

The present invention makes for addressing the above problem, and its purpose is to provide no matter how the composition of pasty state scolder etc. all can measure the testing fixture of the state of pasty state scolder.

In order to address the above problem, testing fixture involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of above-mentioned infrared light-struck aforesaid substrate; According to the image that above-mentioned image unit obtained, detect the detecting unit of the shape of above-mentioned pasty state scolder; Corresponding to the composition of above-mentioned pasty state scolder, set setup unit by the infrared light intensity of above-mentioned illumination unit.

In addition, another testing fixture involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of above-mentioned infrared light-struck aforesaid substrate; The image that above-mentioned image unit was obtained is carried out 2 value unit of 2 values with the brightness of defined threshold; According to the 2 value images that above-mentioned 2 value unit are obtained, detect the detecting unit of the shape of above-mentioned pasty state scolder; Corresponding to the composition of pasty state scolder, set the setup unit of the above-mentioned threshold value of 2 value unit.

In addition, another testing fixture involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of above-mentioned infrared light-struck aforesaid substrate; According to the image that above-mentioned image unit obtained, detect the detecting unit of the shape of above-mentioned pasty state scolder; Corresponding in above-mentioned lighting unit and the above-mentioned pasty state scolder at least one through the time change, set the 1st setup unit by the infrared light intensity of above-mentioned illumination unit.

In addition, a testing fixture more involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of above-mentioned infrared light-struck aforesaid substrate; The image that above-mentioned image unit was obtained is carried out 2 value unit of 2 values with the brightness of defined threshold; According to the 2 value images that above-mentioned 2 value unit are obtained, detect the detecting unit of the shape of above-mentioned pasty state scolder; Corresponding in above-mentioned lighting unit and the above-mentioned pasty state scolder at least one through the time change, set the setup unit of the above-mentioned threshold value of above-mentioned 2 value unit.

Adopt the present invention, by the infrared light of intensity that the substrate irradiation that is coated with scolder is set corresponding to the composition of pasty state scolder, and take by this infrared light-struck substrate, thus, no matter the kind of pasty state scolder how, all can correctly detect the shape of pasty state scolder.

Perhaps, by to the substrate irradiation that is coated with scolder corresponding to lighting unit or pasty state scolder through the time change the infrared light of the intensity of setting, and take by this infrared light-struck substrate, thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the shape that is coated in pasty state scolder on the substrate.

Description of drawings

Fig. 1 is the front view of the outward appearance of expression testing fixture of the present invention.

Fig. 2 is the vertical view of the inner structure of expression testing fixture of the present invention.

Fig. 3 is the block scheme that the control system of expression testing fixture of the present invention constitutes.

Fig. 4 is the mode chart of the structure of expression camera assembly.

Fig. 5 is the mode chart of the structure of expression pasty state scolder.

Fig. 6 (a) is to be the template of the 50 μ m reflected light image when having applied the substrate irradiation infrared light of pasty state scolder to utilizing thickness, (b) is the figure of the light intensity distributions under expression (a) situation.

Fig. 7 (a) is to be the template of the 70 μ m reflected light image when having applied the substrate irradiation infrared light of pasty state scolder to utilizing thickness, (b) is the figure of the light intensity distributions under expression (a) situation.

Fig. 8 (a) is to be the template of the 100 μ m reflected light image when having applied the substrate irradiation infrared light of pasty state scolder to utilizing thickness, (b) is the chart of the light intensity distributions under expression (a) situation.

Fig. 9 (a)～(c) is the mode chart of the vertical cross-section of expression pasty state scolder.

The mode chart of the reflected light image when Figure 10 (a)～(c) is the infrared light of representing respectively Fig. 9 (a)～(c) irradiation same intensity.

Figure 11 is the synoptic diagram of the relation between the brightness of the thickness of expression pasty state scolder and pixel.

The synoptic diagram of the catoptrical image when Figure 12 is expression change infrared light intensity.

Figure 13 is the figure of progression that is used for illustrating the infrared light of pasty state scolder.

Figure 14 is the process flow diagram that action is checked in expression.

Figure 15 is the synoptic diagram of the relation between the exposure intensity of the kind of expression pasty state scolder and infrared light.

Figure 16 is the process flow diagram of expression the 1st Flame Image Process.

Figure 17 is that expression is by the mode chart of the view data of 2 values.

Figure 18 is the process flow diagram of expression the 2nd Flame Image Process.

Figure 19 is the process flow diagram of expression the 3rd Flame Image Process.

Figure 20 is the process flow diagram of the fine or not judgment processing of expression.

Figure 21 is the block scheme that the control system of the related testing fixture of expression the 2nd embodiment of the present invention constitutes.

Figure 22 is the performance plot of one of expression scolder related data example.

Figure 23 is the performance plot of one of expression LED related data example.

Embodiment

Below, with reference to accompanying drawing, be elaborated with regard to embodiments of the present invention.

[the 1st embodiment]

(structure of testing fixture)

As shown in Figure 1 and Figure 2, the testing fixture 1 that present embodiment is related, as a whole, its cover 10 that roughly is rectangular shape surrounds, and in the inside of this cover 10, has the inner roughly pedestal 11 of rectangular shape that is for cavity.As Fig. 1～testing fixture 1 shown in Figure 3, such, comprise substrate transferring portion 2, worktable conveying unit 3, camera head conveying unit 4, lighting device 5, camera head 6, display device 7, input media 8, control device 9.

As shown in Figure 2, substrate transferring portion 2 is arranged on the pedestal 11, is used for conveyance as the printed base plate P that checks object (below, be referred to as substrate P), and is made of three parts that possess a pair of belt transport mechanism respectively and arrange along X-direction.Particularly, on the specialized range of the substrate transferring direction both sides of testing fixture 1, be provided with possess belt transport mechanism 20A, 21A and 20C, 21C move into/take out of the 2A of portion, 2C, and move into/take out of between the 2A of portion, the 2C at this, be provided with the movable part 2B that possesses the belt transport mechanism 20B, the 21B that are installed on the aftermentioned worktable 30.In addition, in the present embodiment, the conveyance direction of substrate P (being left and right directions among Fig. 2) is called X-direction, the direction (being above-below direction among Fig. 2) with the X-axis quadrature on surface level is called Y direction.

Move into/take out of the 2A of portion, 2C, connecting gear 20A, the 20C of its front side are fixed on the pedestal 11, and connecting gear 21A, the 21C of its rear side can move on Y direction.Connecting gear 21A, the 21C of rear side moves by the driving of motor (not shown), thereby can adjust the interval of connecting gear corresponding to the size of substrate P.

Movable part 2B, its a pair of connecting gear 20B, 21B are arranged on the worktable 30 that can move along Y direction, and wherein, the connecting gear 20B of front side is fixed on worktable 30, and the connecting gear 21B of rear side is supported on the worktable 30 movably along Y direction.And the connecting gear 21B of rear side moves by the driving of motor (not shown), thereby can change the interval between connecting gear 20B, the 21B, with the change in size of counterpart substrate P.

On above-mentioned each connecting gear 20A, 21A, 20B, 21B, 20C, 21C, with the state that is sleeved on belt pulley conveying belt (not shown) is installed, when connecting gear 20B, the 21B of movable part 2B be positioned at other connecting gear 20A, 21A, 20C, the corresponding position of 21C on the time (when worktable 30 is positioned on the front position of mobile range), each conveying belt links mutually, by being arranged on the driving of the motor 22 on the worktable 30, conveyance substrate P.

Adopt said structure, substrate P, connecting gear along substrate transferring portion 2, move into testing fixture main body 1 from the device left side, and after processing is checked in the inspection operating area of the substantial middle that is arranged in pedestal 11, take out of from the device right side (being the direction shown in the hollow arrow in Fig. 2) the next operation.

As shown in Figure 2, worktable conveying unit 3, comprise, roughly rectangular worktable 30 when overlooking, be fixed on the pedestal 11 and the pair of guide rails 31 of extending along Y direction, be supported on the pedestal 11 and the ballscrew shaft 32 that extends along Y direction, the motor 33 that is connected with an end of this ballscrew shaft 32 rotationally.At this, worktable 30 can move along guide rail 31, and has the nut portions (not shown) that screws togather with ballscrew shaft 32.Therefore, worktable conveying unit 3 by the above-mentioned ballscrew shaft 32 of motor 33 rotating drive, thereby makes worktable 30 move on Y direction along guide rail 31.

As shown in Figure 2, camera head conveying unit 4 comprises, on the table top of pedestal 11, erects the locational door shape brace table 41 after fore-and-aft direction (being above-below direction among Fig. 2) central portion that is arranged on respect to pedestal 11 leans on slightly.This brace table 41 comprises, respectively the foot section of holding up (not shown) from the both ends of left and right directions, across the crossbeam portion 42 between the upper end of this foot section.In the crossbeam portion 42 of brace table 41, be provided with the camera assembly 43 that is used to take substrate P and comprises lighting device 5 and camera head 6, the drive unit 44 that this camera assembly 43 is moved along brace table 41.This drive unit 44, comprise, the ballscrew shaft 46 that is arranged on motor 45 in the crossbeam portion 42 of brace table 41, is connected and extends along left and right directions, be arranged on pair of guide rails 47 in the crossbeam portion 42 abreast with this ballscrew shaft 46 with the output shaft of this motor.At this, camera assembly 43 is supported on the supporting frame 48 that screws togather with above-mentioned ballscrew shaft 46.Therefore, camera head conveying unit 4 by the driving of above-mentioned motor 45, makes camera head 6 move in X-direction along above-mentioned guide rail 47 with supporting frame 48.

Lighting device 5 is made of the lighting device of output such as infrared LEDs (Light Emitting Diode) infrared light, the voltage by supplying with by control device 9 (below, be referred to as " service voltage ") drive.As shown in Figure 4, above-mentioned lighting device 5 as camera assembly 43, together is arranged on the top of substrate P with camera head 6, and can moves by camera head conveying unit 4.At this, constitute the infrared LEDs 5a of lighting device 5, be arranged on the top of substrate P, axle inclination 10 degree ± 6 degree that its optical axis is vertical with respect to the first type surface of substrate P.As shown in Figure 4, when being provided with a pair of infrared LEDs 5a, they can be arranged to respect to above-mentioned vertical axis symmetry.Above-mentioned lighting device 5 can output wavelength be the infrared light of 875 ± 30nm.In addition, as shown in Figure 4, lighting device 5 except infrared LEDs 5a, can also be provided with the visible light LED5b of irradiation visible light.

Camera head 6 by formations such as CCD (Charge Coupled Device) cameras, has region of ultra-red wavelength sensitivity.Camera head 6 is taken according to the instruction of control device 9.As shown in Figure 4, above-mentioned camera head 6 as camera assembly 43, together is arranged on the top of substrate P with lighting device 5, and can moves by camera head conveying unit 4.

Display device 7 is by formations such as CRT (Cathode Ray Tube), LCD (Liquid CrystalDisplay) or FED known display device such as (Field Emission Display) or signal towers.Above-mentioned display device 7 shows various information according to the instruction of control device 9.As shown in Figure 1, in the present embodiment, display device 7 comprises, is arranged on the display 7a of cover 10 side, from covering 10 the outstanding upward signal tower 7b of upper surface.

Input media 8, the device that is detected outside input information by keyboard, mouse, indicator (pointing device), button, touch panel (touch panel) etc. constitutes.The information that input media 8 is detected is input to control device 9.As shown in Figure 1, in the present embodiment, input media 8 comprises being arranged on display 7a neighbouring keyboard 8a, mouse 8b.

Control device 9 is used to control the running of testing fixture 1 integral body, and as shown in Figure 3, it comprises drive control part 91, lighting control section 92, image processing part 93, I/F portion 94, master control part 95 and storage part 96.

Drive control part 91, be instruction, generate and send the function portion of drive signal of motor 45 of motor 33, the camera head conveying unit 4 of the motor (not shown) that is used for driving substrate conveying unit 2 and motor 22, worktable conveying unit 3 according to master control part 95.Thus, realize moving of substrate P, worktable 30 or camera assembly 43.

Lighting control section 92 is the instructions according to master control part 95, sets the service voltage of the light intensity of the infrared light that shines corresponding to lighting device 5, and outputs it to the function portion of lighting device 5.Thus, the infrared light of lighting device 5 output prescribed strengths.

Image processing part 93, it is instruction according to master control part 95, send the instruction of taking to camera head 6, and carry out Flame Image Process such as A/D conversion taking the image that is acquired according to this instruction by camera head 6, and the function portion that exports this view data.Thus, generate as shown in Figure 5 represent the view data (below, be referred to as " view data ") of the light intensity of each pixel with the depth.

I/F portion 94 according to the instruction of master control part 95, is presented at various information on the display device 7.And the various information that input media 8 is detected send master control part 95 to.And, with the printing machine 101 that substrate is printed the pasty state scolder or to check the fitting machine 102 of the substrate installation electronic component that finishes by testing fixture 1, carry out for example transmitting-receiving of various information such as following data, that is, with by the relevant kind data of the kind of the coated pasty state scolder of printing machine 101, the substrate data relevant with the shape of the substrate that is coated with the pasty state scolder, with printing in the relevant template data of shape of employed template.

Master control part 95, be that basis is for example from external commands such as user or principal computers, lighting control section 92, image processing part 93, drive control part 91 and I/F portion 94 are sent instruction, thereby realization inspection is printed on the function portion that the inspection of the state of the pasty state scolder on the substrate is moved.Above-mentioned master control part 95, comprise from the outside or storage part 96 obtains the condition acquisition unit 95a of various conditions required the inspection of pasty state scolder, set the illumination configuration part 95b of light intensity of the infrared light of lighting device 5 irradiation corresponding to the kind of pasty state scolder, make camera head 6 take the image pickup part 95c of the substrate that is coated with the pasty state scolder, 2 95d of value portion that view data and defined threshold are relatively carried out 2 values, from this by the view data of 2 values (below, be called " secondary image data ") extract highlights and dark portion boundary line (level line) (below, be called " cubic graph is as data ") extracting part 95e, detect the cross sectional shape of pasty state scolder and calculate the area calculating part 95f of its sectional area from secondary image data, calculate the 95g of volume calculation portion of the volume of pasty state scolder according to the sectional area that calculates, according to the sectional area or the volume of the pasty state scolder that calculates, judge the judging part 95h of the quality of this pasty state scolder.

Storage part 96 is storage function portions for the various information of the running that realizes testing fixture 1.Above-mentioned storage part 96, storage at least: a view data that generates by the captured image that is acquired of camera head 6, by image processing part 93, carry out the cubic graph of the boundary line (level line) that secondary image (2 value image) data, expression after 2 values are extracted by extracting part 95e as view data 96a such as data by 2 95d of value portion; Relevant reference information 96b such as employed threshold value when employed threshold value, judging part 95h judge pasty state scolder fine or not with various conditions required in the inspection of pasty state scolder, when 2 95d of value portion make secondary image data; The judged result 96c of judging part 95c; And, about the kind related data 96d of the kind and the relation between the infrared light intensity of pasty state scolder.

Above-mentioned control device 9 comprises computing machine, is installed in the program in this computing machine.This computing machine comprises: calculation apparatus such as CPU; Storer, HDD memory storages such as (Hard Disc Drive); Receive and dispatch the I/F device of various information etc. by the Internet, LAN (Local Area Network), WAN communication lines such as (Wide AreaNetwork).That is,,, realize above-mentioned drive control part 91, lighting control section 92, image processing part 93, I/F portion 94, master control part 95 and storage part 96 by the above-mentioned hardware resource of programmed control by the cooperation of hardware unit and software.In addition, said procedure can be provided with the state that is stored in the storage mediums such as floppy disk, CD-ROM, DVD-ROM, storage card.

(principle of work)

Below, describe with regard to the principle of work of the related testing fixture 1 of present embodiment.

The pasty state scolder is made of solder powder and solder flux, and solder powder and solder flux are mixed fully to be stirred, and almost is uniformly dispersed in paste-like in the solder flux thereby become solder powder.If to being coated with the substrate irradiation infrared light of above-mentioned pasty state scolder, this infrared light, its part is reflected by the solder powder of the surface of pasty state scolder and near surface, the solder flux that another part then sees through in the pasty state scolder is walked in the pasty state scolder, the battery lead plate that arrival is made of metal level (electrodepad) is reflected by this battery lead plate.The reflected light that is reflected sees through the solder flux F in the pasty state scolder once more, thereby by the infrared light of camera head 6 detection of reflected to pasty state scolder outside.

Infrared light when so seeing through in the pasty state scolder, is spread by solder powder, is perhaps decayed by solder flux.Therefore, the pasty state scolder is thick more, and the distance that infrared light passes through in the pasty state scolder is just long more, thereby the composition of diffusion or decay is also just many more, its result, and catoptrical light intensity can die down.

For example, as shown in Figure 5,, shine the edge part of this pasty state scolder H, shine the central portion of this pasty state scolder H by infrared light I2 by infrared light I1 if the battery lead plate E of substrate P is gone up the roughly pasty state scolder H of semicircular in shape shape of coated cross section.At this moment, infrared light I1, because shorter apart from x1 from the surface of pasty state scolder H to battery lead plate E, diffusion or attenuance component are less, thereby catoptrical light intensity is stronger.On the other hand, infrared light I2 because longer apart from x2 from the surface of pasty state scolder H to battery lead plate E, diffusion or attenuance component are more, thus catoptrical light intensity a little less than.

Fig. 6 (a), Fig. 7 (a), Fig. 8 (a) be when carrying out mould printing respectively used thickness be 50 μ m, 70 μ m, 100 μ m mould printing the substrate of pasty state scolder, the infrared light of irradiation prescribed strength, and the image that is acquired by camera head 6 these substrates of shooting.The pixel count of each gray scale when Fig. 6 (b), Fig. 7 (b), Fig. 8 (b) represent with the light intensity of each pixel of the image of 256 gray scale chart diagrammatic sketch 6 (a)～Fig. 8 (a) respectively.In Fig. 6 (a), Fig. 7 (a), Fig. 8 (a), the brightness of each pixel, the light intensity of the infrared light that expression is reflected by substrate surface, light intensity is high more be shown as white more, light intensity is low more be shown as black more.

Shown in Fig. 6 (a), Fig. 7 (a), Fig. 8 (a), produce reflected light hardly so the silicon of formation substrate is penetrated by infrared light, thereby show blackly.Formed battery lead plate reflects infrared light then on the substrate, thereby show in vain.

Shown in Fig. 7 (a), Fig. 8 (a), when the thickness of pasty state scolder is thicker (70 μ m, 100 μ m), catoptrical light intensity a little less than, therefore, the pasty state scolder on the battery lead plate shows blackly.And shown in Fig. 7 (b), Fig. 8 (b), scope z pixel count represented and the corresponding brightness of pasty state scolder becomes many.

On the other hand, shown in Fig. 6 (a), during the thinner thickness of pasty state scolder (50 μ m), catoptrical light intensity is stronger, thereby shows in vain, therefore almost can't distinguish with battery lead plate.Shown in Fig. 6 (b), the pixel count among the scope z also tails off.

As mentioned above, owing to the thickness of catoptrical light intensity according to the pasty state scolder becomes, therefore,,, can detect the cross sectional shape of pasty state scolder in other words according to the brightness of image according to catoptrical intensity distributions.That is,, can think that infrared light has penetrated the pasty state scolder of same distance, therefore, we can say that the thickness of pasty state scolder is identical for the pixel portion of same brightness.And, for the zone below certain brightness, can be described as the zone that is coated with the above pasty state scolder of certain thickness.

Therefore, when the pasty state scolder that is coated on the substrate P, for example, have respectively under the situation in the cross section (perpendicular to the direction of substrate surface) shown in Fig. 9 (a)～Fig. 9 (c), when these substrate P are shone the infrared light of prescribed strengths and are taken this substrate P, just their image is such shown in Figure 10 (a)～Figure 10 (c).In addition, the substrate P of Fig. 9 and Figure 10 is electroplate with the metal that is equivalent to battery lead plate on its entire upper surface, and the pasty state solder coating is on the specialized range on this battery lead plate.

Particularly, shown in Fig. 9 (a), when pasty state scolder a is applied as truncated cone shape, infrared light, at the plane domain of the frustum of a cone central portion of pasty state scolder, longer by the distance of pasty state scolder inside, and it is more close towards periphery from central portion, then then short more by the distance of pasty state scolder inside.If take the substrate P that is coated with above-mentioned pasty state scolder a, the image that is acquired is shown in Figure 10 (a).Particularly, with the corresponding part of battery lead plate around the pasty state scolder a,, thereby be shown as the brightest because infrared light does not pass through the inside of pasty state scolder.From the edge part of pasty state scolder a to the part the central portion of pasty state scolder a (symbol e1), because along with elongated by the distance of pasty state scolder inside, thereby along with showing secretly near central portion near the central portion infrared light.The central portion of pasty state scolder a (symbol e2) because infrared light is the longest by the distance of pasty state scolder inside, thereby is shown as the darkest.

On the other hand, shown in Fig. 9 (b), when pasty state scolder b was thinner than pasty state scolder a, infrared light shortened by the distance of pasty state scolder inside.Therefore, shown in Figure 10 (b), pasty state scolder b is presented in the image with the dark portion (symbol f1) brighter than the dark e1 of portion among Figure 10 (a).In addition, in the dark f1 of portion, the central portion that the thickness of pasty state scolder is thicker than edge part (symbol f2) because the distance that infrared light passes through is longer, thereby shows secretly than the dark f1 of portion.

And shown in Fig. 9 (c), when there was bubble d in the inside of the pasty state scolder c of truncated cone shape, on the position corresponding to this bubble d, infrared light shortened by the distance of pasty state scolder inside.If take this pasty state scolder c, the image that is acquired is shown in Figure 10 (c).Particularly, the corresponding part of battery lead plate with pasty state scolder c periphery is shown as the brightest.To the part the central portion of pasty state scolder c (symbol g1), along with near central portion, infrared light is elongated by the distance of pasty state scolder inside from the edge part of pasty state scolder c, thereby along with showing secretly near central portion.Especially with the central portion adjoining position, be shown as the darkest.Central portion (symbol g2) with bubble d because the existence of bubble, infrared light shortens by the distance of pasty state scolder inside, thereby be shown as compared with the bright dark portion of ring-type of part of the symbol g1 of central portion adjacency.

The cross sectional shape of the pasty state scolder of specific thickness for example can detect by making characteristic pattern as shown in figure 11 in advance.Figure 11 is that the substrate to the pasty state scolder that is coated with known thickness shines the infrared light of a plurality of light intensities (h1, h2 wait and represent, the light intensity of the big more infrared ray LED5a of numeral output is big more) time the thickness of pasty state scolder and the brightness of pixel (in the characteristic pattern of Figure 11, be comprise the infrared light that reflected by substrate surface and from the original brightness of the not processing reflex components of pasty state solder surface, that camera head 6 is captured) between graph of a relation.In this characteristic pattern, each curve h1～h6 represents, along with the thickness thickening of pasty state scolder, reflex components from substrate surface reduces, and in case above specific thickness, then only left reflex components from the pasty state solder surface is kept almost certain brightness respectively.But also expression is big more as the light intensity of the infrared light LED5a of light source, the catoptrical light intensity on specific thickness X also big more (be not only the reflex components from substrate surface, also become big from the reflex components of pasty state solder surface).In addition, in Figure 11, dot-and-dash line h7, the light intensity in zone that expression is in the below of this line is the composition of surface reflection.In other words, be in the light intensity in zone of the top of dot-and-dash line h7, comprise from the reflected light of pasty state solder surface and from the two the brightness of the reflected light of electrode plate surface.

For example,, want to detect the cross section of X thickness when irradiation during with the infrared light of the corresponding intensity of curve h6, then can be according to the degree of tilt of curve h6, detect with the corresponding pixel in the cross section of X thickness be the pixel of brightness Y.Therefore, by the pixel of sensed luminance Y, the perhaps pixel of the following brightness of sensed luminance Y can detect the cross section of thickness X.At this moment, by view data is carried out 2 values, can detect the cross sectional shape of pasty state scolder more clearly.At this moment, according to the corresponding curve h1～h6 of infrared light intensity that is shone with lighting device 5, obtain the brightness with the corresponding pixel of thickness that will detect, and as threshold value view data is carried out 2 values with its value.Thus, can obtain to represent the secondary image data in cross section of the pasty state scolder of specific thickness.

Because the section thickness that can detect changes with the light intensity of infrared light, therefore,, can detect the different a plurality of cross sections of cutting thickness (highly) by in the process of the light intensity that changes infrared light, taking the substrate that is coated with the pasty state scolder.By so obtaining a plurality of cross sections of pasty state scolder, and arrange corresponding to height separately and to show these cross sections, just can show approx the pasty state scolder 3D shape.At this moment, by little by little changing the light intensity of infrared light gradually, increase and take number of times, thus, the number of cross sections of the pasty state scolder that is obtained is many more, can show the 3D shape of pasty state scolder more more approx.

In addition, catoptrical intensity, proportional with the infrared light intensity that is shone.For example, as shown in figure 12, infrared light intensity is high more, and catoptrical intensity is also high more, and therefore, the brightness of the pixel corresponding with the pasty state scolder brightens.Particularly, the brightness of the pasty state scolder r on the battery lead plate q along with the increase of infrared light intensity, becomes brighter from image s to image u gradually.Therefore, can think that even the brightness of image is identical, if the infrared light intensity of being shone is strong, then the pasty state scolder of this part is just thick.

As mentioned above, the thickness in the pasty state scolder cross section that can detect from a view data is based on the variation of the light intensity of the variation of the threshold value of view data being carried out 2 values or infrared light and change.Therefore, by changing infrared light intensity and repeatedly take making under the changeless state of the threshold value of carrying out 2 values, perhaps under being fixed on the state of value of regulation, the light intensity that makes the infrared light that will shine changes the threshold value when a captured view data carried out 2 values, perhaps with above-mentioned both combinations, thus, can obtain the different a plurality of secondary image data of section thickness of pasty state scolder.Therefore, according to these secondary image data, can detect the 3D shape of pasty state scolder.

In addition, from the catoptrical light intensity of substrate surface, also based on the kind of pasty state scolder, especially based on the difference of the components in proportions in the pasty state scolder and difference.To this, describe with reference to Figure 13.

As shown in figure 13, as the infrared LEDs 5a from lighting device 5, during the substrate P irradiation infrared light of the pasty state scolder that the potpourri that is coated with on the battery lead plate E by solder powder H and solder flux F is constituted, this infrared light is advanced shown in arrow a～d.The infrared light of arrow a arrives the surface of battery lead plate E point-blank from the surface of pasty state scolder, by this battery lead plate E reflection, and once more point-blank by the inside of solder flux, arrive camera head 6.The infrared light of arrow b is by near the solder powder H diffuse reflection of the part pasty state scolder top layer.The infrared light of arrow c, though near the part pasty state scolder top layer by between the solder powder H, reflected by the surface of the solder powder H of lower floor more, finally do not arrive camera head 6.The infrared light of arrow d is arrived the surface of battery lead plate E repeatedly by the surface reflection of solder powder H, and is reflected by this battery lead plate E.In the infrared light of this arrow d, comprise composition that is arrived camera head 6 repeatedly by the surface reflection of solder powder H and the composition that is not finally arrived camera head 6 by the surface reflection of solder powder H.

Effective constituent when the cross sectional shape that carries out the pasty state scolder detects that is from the reflected light of substrate surface is the part (arriving the composition of camera head 6) of arrow a and arrow d.These compositions, just low by the probability of this solder powder h reflex when the density of the solder powder H in the pasty state scolder is hanged down, thereby their light intensity is just high.On the contrary, just high by the probability of this solder powder h reflex when the density of solder powder H is high, thereby their light intensity is just low.Equally, when the density of solder powder H is identical, the particle diameter of solder powder H is more little, in process by the solder flux between the solder powder, infrared light and solder powder H collide and the just increase of frequency of generation diffusion, thereby the IR transmittance of pasty state scolder descends the just minimizing of the substrate reflected light of the infrared light of arrival camera head 6.So, from the catoptrical light intensity of substrate surface, based on the variation of the particle diameter of the ratio of solder powder H in the pasty state scolder and solder flux or solder powder H and change.Especially, little at the particle diameter of the density height of solder powder H or solder powder H, under the low situation of the catoptrical light intensity of substrate surface, if do not increase the light intensity of the infrared light that infrared LEDs 5a shone, camera head 6 can't detect its reflected light.To this, in the present embodiment,, set light intensity by the infrared light of lighting device 6 irradiations according to the kind of pasty state scolder, especially according to the solder powder H in the pasty state scolder and the composition of solder flux.

In addition, except the reflected light from substrate surface, the reflected light of pasty state solder surface also can be based on the difference of the components in proportions in the pasty state scolder and difference.

For example, the density of solder powder H in the pasty state scolder is low, perhaps, when identical and particle diameter solder powder H of the density of solder powder H is big, collide and the light that is reflected is just many at top layer and solder powder H, the composition that sees through the pasty state scolder in the infrared light that the pasty state scolder is shone is just many, thereby just few from the reflected light of pasty state solder surface.Therefore, around the pasty state scolder, do not have the part of sheet metal, be difficult to obtain the contrast with the dark portion of polyimide substrate, thereby the outer peripheral shape of pasty state scolder is not obvious.On the contrary, the part in the sheet metal inboard since with the hard of sheet metal, thereby the outer peripheral shape of pasty state scolder is obvious.

On the contrary, when the density of the solder powder H in the pasty state scolder was high, the composition that sees through the pasty state scolder in the infrared light was just few, thereby just many from the reflected light of pasty state solder surface.Therefore, around the pasty state scolder, do not have the part of sheet metal since with the hard of the dark portion of polyimide substrate, thereby the outer peripheral shape of pasty state scolder is obvious.On the contrary, the part in the sheet metal inboard, owing to be difficult to obtain contrast with sheet metal, thereby the outer peripheral shape of pasty state scolder is not obvious.

Therefore,, set light intensity, can detect solder surface or the outer peripheral shape of scolder more clearly by the infrared light of lighting device 5 irradiations by composition corresponding to solder powder in the pasty state scolder and solder flux.

(running of testing fixture)

Below, with reference to Figure 14, describe with regard to the inspection of the related testing fixture 1 of present embodiment action.

At first, the condition acquisition unit 95a of master control part 95 obtains and checks the required various data (step S1) of state that are coated in the pasty state scolder on the substrate.These various data are meant, for example, with the shape of substrate or be formed on relevant substrate data such as wiring pattern on the substrate, the relevant template data of shape of employed template with to substrate printing pasty state scolder the time, with the position of taking substrate and the relevant camera site alphabetic data of order thereof, with carry out substrate on the relevant inspection position data in position of inspection, the relevant thickness data of thickness with the pasty state scolder that is detected, the height correlation data of the relation between the depth of section of the brightness of the light intensity of the infrared light that expression lighting device 5 is shone and the pixel of detection and the scolder that can detect, the Flame Image Process relevant with selected Flame Image Process selected data, with be coated in substrate on the relevant kind data of kind of pasty state scolder, and kind related data 96d etc.These data can be obtained from principal computer on storage part 96, printing machine 101, the hookup wire etc.

Obtain and check after the data, illumination configuration part 95b according to kind related data 96d, sets the infrared light intensity (step S2) by lighting device 5 irradiations.Kind related data 96d, for example as shown in figure 15, by the kind of pasty state scolder and the infrared light intensity information in correspondence with each other of this pasty state scolder of irradiation are constituted.In Figure 15, the infrared light intensity of irradiation scolder A, that sets than other scolders is low.This is because the ratio of solder powder in the composition of scolder A is low or the reason of big any at least one in the two of the particle diameter of solder powder, the transmissivity height that causes the infrared light in scolder A, thereby need not increase infrared light intensity, camera head 6 also can detect the reflected light from substrate.On the other hand, the infrared light intensity of irradiation scolder B is set than the height of other scolders.This is because the reason of little any at least one in the two of the particle diameter of ratio height of solder powder in the composition of scolder B or solder powder, cause the transmissivity of the infrared light in scolder B low, thereby must increase infrared light intensity, otherwise camera head 6 can't detect the reflected light from substrate.

Illumination configuration part 95b, according to the relevant kind data of obtaining from printing machine 101 that are coated in the kind of the pasty state scolder on the substrate, determine the kind of pasty state scolder, and obtain the intensity level of the infrared light that should shine when determined pasty state scolder checked from kind related data 96d.Thus, can shine infrared light corresponding to the intensity of the composition of the kind of pasty state scolder that is pasty state scolder.In addition, kind related data 96d can shine the cross section that infrared light detects the pasty state scolder by reality and generate.

In addition, as mentioned above, obtain the method for a plurality of secondary image data, the method that has under the state of the threshold value of fixing 2 values the light intensity that changes infrared light repeatedly take, perhaps under the state of the fixing light intensity of infrared light, change the method for the threshold value when captured view data carried out 2 values, perhaps make up the two method.But in the following explanation, thereby the light intensity that will change infrared light under the state of the threshold value of fixing 2 values is repeatedly taken the situation of obtaining a plurality of secondary image data and is described as an example.Promptly, obtain after the inspection condition, illumination configuration part 95b according to height correlation data, thickness data and kind related data 96d, obtains at the number of times of taking as each pasty state scolder of checking object with at every turn by the value of the light intensity of the infrared light of lighting device 5 irradiations.This time logarithmic data and intensity data and camera site alphabetic data, inspection position data and Flame Image Process are selected data together, do corresponding related with each substrate that will check.This for simplicity, is called the inspection data by corresponding related data.

After the infrared light intensity that lighting device 5 is shone is set, image pickup part 95c, by drive control part 91 driving substrate conveying units 2, move into the substrate that has applied the pasty state scolder by printing machine 101, and it is disposed on the assigned position on the worktable 30 (step S3).Substrate is moved into after the assigned position, image pickup part 95c, according to camera site alphabetic data and inspection position data, drive worktable conveying unit 3 and camera head conveying units 4 by drive control part 91, make camera assembly 4 be configured to the top of the pasty state scolder of the conduct inspection object on the substrate.

Camera assembly 4 is configured to conduct on the substrate and checks after the top of pasty state scolder of object, image pickup part 95c, according to checking data, shine the infrared light of varying strength respectively by lighting device 5, and make camera head 6 take substrate (step S4) corresponding to each intensity of infrared light that lighting device 5 shines.At this, infrared light intensity is set according to intensity data.And the number of times that the size of the infrared light intensity that lighting device 5 is shone and camera head 6 are captured is set according to inferior logarithmic data.Thus, obtain the different a plurality of images of light intensity of the infrared light that substrate is shone.As mentioned above, because the infrared light that shone of lighting device 5,96d is set according to the kind related data, thereby in the captured image of camera head 6, comprises the catoptrical picture from substrate surface.

The shooting that camera head 6 is carried out also can be according to the camera site alphabetic data, till all camera sites that proceed to a substrate have been taken.At this moment, according to the inferior logarithmic data and the intensity data of correspondence, carry out each and take.And the image that is obtained with the light intensity of camera site or infrared light, is stored in the storage part 96.In addition, image processing part 93 carries out Flame Image Process to obtaining image, generates a view data with the light intensity of deep or light each pixel of expression.

Generate after view data, master control part 95 according to selecting data, is selected any one processing (step S5) in the 1st～the 3rd Flame Image Process, and is carried out selected Flame Image Process (step S6～8).Being described as follows of relevant each Flame Image Process.

(the 1st Flame Image Process)

The 1st Flame Image Process is that a view data is carried out 2 values, calculates the processing of the sectional area of pasty state scolder.Below, with reference to Figure 16, this processing is described.

At first, 2 95d of value portion, for a view data is carried out 2 values with defined threshold, and obtain view data generating by image pickup part 95c with pasty state solder coating relevant template data (step S11) of printing machine 101 employed templates when the captured substrate.As this template data, comprise with the aperture position of template and shape that is be coated in the position and the relevant information of shape of the pasty state scolder on the substrate.In addition, template data also can use the data that strengthen setting than template opening.Thus, can detect the seepage of pasty state scolder or cross-over connection etc.

Obtain after view data and the template data, 2 95d of value portion from the view data that image pickup part 95c is generated, cut the view data (step S12) with the corresponding zone of pasty state scolder (object shapes K) of wanting detection sectional plane.The position of object shapes K is determined according to template data, thereby obtains a view data in the zone that comprises object shapes K, and for example pixel is arranged in a view data of the matrix shape of the capable J row of I.

Cut after the view data that comprises object shapes K, 2 95d of value portion carry out 2 values (step S13) as threshold value to this view data with the brightness of regulation.At this, threshold value for example according to characteristic pattern shown in Figure 11, is set corresponding to the thickness in the cross section of the pasty state scolder of wanting to obtain.Therefore, when from captured under the state of fixing infrared light intensity view data, obtaining a plurality of secondary image data,, from a view data, can obtain the secondary image data in the cross section of all thickness by changing threshold value.

By a view data being carried out 2 values, generate secondary image data as shown in figure 17 with the threshold value of regulation.Figure 17 represents to be arranged in the secondary image data (below, be called " area I, J ") of the matrix shape of the capable J row of I, and this area I includes object shapes K among the J.In each pixel, the above brightness of " 1 " expression threshold value, " 0 " expression is less than the brightness of threshold value.That is, the boundary member of pixel " 1 " and pixel " 0 ", the thickness that is exactly the pasty state scolder is the part of specific thickness, " 0 " part is exactly that specific thickness is with top.Therefore, with the corresponding part of pixel " 0 ", mean the cross section of the pasty state scolder of specific thickness.So with threshold value a view data is carried out 2 values, can make the edge of cross sectional shape of pasty state scolder more detailed, it is more clear that profile becomes, and therefore, can judge the cross sectional shape of pasty state scolder more clearly.

After carrying out 2 values,, among the J, be the dark portion of " 0 " as the subject area K of the cross-section of pasty state scolder in area I.2 95b of value portion also can make area I, and the secondary image data of J is presented on the display device 7.Thus, the user can discern the cross sectional shape of pasty state scolder more easily.Therefore, by user's naked eyes, also can judge the quality of pasty state scolder.

The area calculating part 95c of master control part 95 by measuring the quantity of pixel corresponding with dark portion in the secondary image data, measures the area of section S (step S14) of the pasty state scolder of specific thickness.Particularly, area calculating part 95c, the area I after the mensuration image transitions, the pixel quantity of the dark portion among the J.Thus, measure the sectional area S of the pasty state scolder of specific thickness.In addition, the sectional area S of pasty state scolder also can carry out in step S7 after 2 values, implementing area I, the pixel transitions of " 1 " among the J becomes dark portion (on the data " 0 "), and the pixel transitions of " 0 " is become after the data-switching of highlights (on the data " 1 "), measures.At this moment, if view data is presented on the display device 7, the cross section part of pasty state scolder shows brightly, and other parts show secretly.So, also can with the naked eye easily judge the quality of pasty state scolder.Carry out the mensuration of the sectional area S of pasty state scolder by the mensuration and the pixel quantity in the cross section corresponding " 1 " of pasty state scolder.

(the 2nd Flame Image Process)

The 2nd Flame Image Process is to detect the processing of the cubic graph of the boundary line of representing highlights and dark portion as data from secondary image data.Below, with reference to Figure 18, should handle describing.

At first, by 2 95d of value portion and area calculating part 95f, carry out above-mentioned the 1st Flame Image Process (step S21).

Carried out after the 1st Flame Image Process, extracting part 95e detects the highlights pixel region (step S22) in the dark portion zone that is included in the secondary image data.For example, zone (the I of Figure 17, J) under the situation, have the zone of the pixel of " 0 " that means dark portion in the inside of the pixel of " 1 " of the outermost of expression battery lead plate etc., have the zone of pixel that expression bubble etc. means " 1 " of highlights in the inside of the pixel of this " 0 ".Extracting part 95e detects this highlights area B.The detection of such highlights area B, for example, can by will more close zone (I, the highlights at center J) is set at highlights area B etc., confirm the zone (I, J) highlights in and secretly the position of portion concern and carry out.

Detect after the highlights area B, extracting part 95e, detect from the pixel region of representing dark portion become the highlights area B coordinate P1 (i, m) and become coordinate P1 (i, n) (the step S23) of the pixel region of the dark portion of expression from the highlights area B.For example, at the zone of Figure 17 (I, J) under the situation, on each row I, row J (is for example changed, make it from the left side to move to the right), detection each the row on from the pixel region of representing dark portion become the pixel of highlights area B coordinate P1 (i, m) and become from this highlights area B dark portion pixel region pixel coordinate P1 (i, n).Because the highlights area B is represented the bubble in the pasty state scolder, thereby coordinate P1, mean the border of pasty state scolder and bubble.

After the detection coordinates P1, extracting part 95e connects coordinate P1, and be set into cubic graph as data (level line) L1 (step S24).By the level line L1 that this continuous coordinate P1 constitutes, just represent the outer rim of the bubble in the pasty state scolder.

Set after the level line L1, extracting part 95e detects the dark portion pixel region (step S25) in the highlights zone that is included in the secondary image data.For example, (I under situation J), meaning that battery lead plate etc. means the inside of pixel of " 1 " of the outermost of highlights, has to mean that pasty state scolder etc. means the pixel of " 0 " of dark portion in the zone of Figure 17.Extracting part 95e detects this dark portion zone C.Therefore, secretly include the highlights area B in portion's zone C.The detection of dark portion zone C like this, for example, can by will more close zone (I, the dark portion at center J) is set at dark portion zone C etc., confirm the zone (I, J) highlights in and secretly the position of portion concern and carry out.

Detect after the dark portion zone C, extracting part 95e, detect from the pixel region of expression highlights become the pixel of dark portion zone C coordinate P2 (i, o) and become coordinate P2 (i, p) (the step S26) of pixel of the pixel region of expression highlights from dark portion zone C.For example, zone (the I of Figure 17, J) under the situation, on each row I, row J (is for example changed, make it from the left side to move to the right), detection each the row on from the expression highlights pixel region become dark portion zone C coordinate P2 (i, o) and from this dark portion zone C become the expression highlights pixel region coordinate P2 (i, p).Because dark portion zone C is represented the pasty state scolder on the battery lead plate, thereby coordinate P2, mean the battery lead plate on the represented cross section of this secondary image data and the border of pasty state scolder.

Detect after the coordinate P2, extracting part 95e connects coordinate P2, and be set into cubic graph as data (level line) L2 (step S27).By the level line L2 that this continuous coordinate P2 constitutes, just represent the outer rim of the pasty state scolder on the battery lead plate.

By carrying out the 2nd Flame Image Process as described above, can detect the pasty state scolder of specific thickness or the outward flange of scolder air entrapment clearly.

In addition, area calculating part 95f also can calculate the sectional area of pasty state scolder according to the cubic graph that is extracted as data (level line) L1, L2.At this moment, by the pixel of instrumentation level line L1, L2 inside separately, and the pixel count that deducts level line L1 from the pixel count of level line L2 inside calculates.Thus, can calculate the sectional area of pasty state scolder more accurately.

(the 3rd Flame Image Process)

The 3rd Flame Image Process is to obtain secondary image data and cubic graph as data (level line) by above-mentioned the 1st Flame Image Process and the 2nd Flame Image Process, and detects the processing of the volume of pasty state scolder from these data.Below, with reference to Figure 19, this Flame Image Process is described.

At first, the 95g of volume calculation portion is set at 1 with the value D of inferior logarithmic data, and the volume V0 of the bubble in the pasty state scolder is set at 0, and the volume V1 of pasty state scolder is set at 0 (step S31).

Set after the value of D, V0, V1, the 95g of volume calculation portion by extracting part 95e, carries out the 2nd Flame Image Process (step S32) according to the inspection data corresponding with the value of inferior logarithmic data.Thus, calculate cubic graph based on the secondary image data of carrying out taking for the D time as data (level line) L1, L2.

Carry out after the 2nd Flame Image Process, the 95g of volume calculation portion, according to the level line L1 that calculates, the volume v1 (step S33) of the bubble of computational rules thickness.Particularly, at first, the 95g of volume calculation portion obtains the area S1 in the level line L1.This area S1 can calculate by the pixel of instrumentation level line L1 inside.Then, obtain from based on the secondary image data of i.e. (D-1) inferior shooting of last time to based on i.e. height F till the secondary image data of the D time shooting this time.This height F, expression is perpendicular to the height of the direction of substrate, can be when for example carrying out 2 values by 2 95c of value portion obtains the characteristic pattern of employed threshold value or Figure 11.Obtain after the height F, this height F and area S1 are multiplied each other, obtain volume v1.This volume v1 means the highly volume of the bubble of F.In addition, when D=1, height F means from the summit of substrate surface or pasty state scolder to based on the height till the secondary image data of the D time shooting.

Calculate after the volume v1, the 95g of volume calculation portion, according to the level line L2 that calculates, the volume v0 (step S34) of the pasty state scolder of computational rules thickness.Particularly, at first, the 95g of volume calculation portion obtains the area S2 in the level line L2.This area S2 calculates by the pixel of instrumentation level line L2 inside.Then, obtain the poor S0 of S2 and S1.This S0 just represents the sectional area of pasty state scolder self.Then, obtain from based on the secondary image data of i.e. (D-1) inferior shooting of last time to based on i.e. height F till the secondary image data of the D time shooting this time.This height F, expression is perpendicular to the height of the direction of substrate, can be when for example carrying out 2 values by 2 95c of value portion obtains the characteristic pattern of employed threshold value or Figure 11.Obtain after the height F, this height F and area S0 are multiplied each other, obtain volume v0.This volume v0 means the volume apart from the pasty state scolder of the thickness of F.In addition, when D=1,, mean the summit of substrate surface or pasty state scolder and the distance of the secondary image data of taking based on the D time apart from F.

Calculate after v1 and the v0, the 95g of volume calculation portion, the value that V1 is added v1 is as V1, and the value that V0 is added v0 is as V0 (step S35).Thus, just can with and the pasty state scolder of the thickness of the distance of the corresponding pasty state scolder of number of times data value D cross section between the summit of the position of short transverse and substrate surface or pasty state scolder and the volume of bubble, calculate as V1, V0.

After V1 and V0 were updated, the 95g of volume calculation portion confirmed whether time logarithmic data D is maximal value (step S36).

When the value of inferior logarithmic data D is not maximal value (step S36:NO), makes the value of time logarithmic data D increase by 1 (step S37), and turn back to the processing of step S32.On the other hand, when the value of inferior logarithmic data D is maximal value (step S36:YES), finish the 3rd Flame Image Process.

By carrying out the 3rd Flame Image Process as described above, can calculate the volume of pasty state scolder or pasty state scolder air entrapment.

In addition, the 95g of volume calculation portion also can make all cubic graphs that extracted by extracting part 95e be shown in the display device 7 with the state that is disposed on the height separately as data (level line) L1, L2.Thus, can show the 3D shape of the state that comprises pasty state scolder inside approx, therefore, operating personnel can discern the state of pasty state scolder more clearly.At this moment, by increasing the value of time logarithmic data, that is,, can show the 3D shape of pasty state scolder more approx by obtaining secondary image data in a large number.

(fine or not judgment processing)

By above-mentioned the 1st～the 3rd Flame Image Process, calculate after the sectional area of pasty state scolder, the volume of pasty state scolder, the volume of bubble etc., judging part 95h carries out fine or not judgment processing to judge the quality (step S9) as the pasty state scolder of checking object.Below, with reference to Figure 20, should fine or not judgment processing describe.

At first, judging part 95h, the Flame Image Process of having confirmed to carry out (step S41).(step S41: in the time of 1st, the 2nd Flame Image Process), judging part 95h according to the sectional area of the pasty state scolder of being calculated, judges the quality of pasty state scolder when having carried out the 1st or the 2nd Flame Image Process.On the other hand, (step S41: in the time of the 3rd Flame Image Process), judging part 95h according to the pasty state scolder of being calculated and the volume of bubble, judges the quality of pasty state scolder when having carried out the 3rd Flame Image Process.

When having carried out the 1st, 2 Flame Image Process, judging part 95h, for whether the coating of judging the pasty state scolder is correct, compare to the value of the sectional area S of the pasty state scolder of being calculated with by the threshold alpha that the value of regulation constitutes, judge that sectional area S is whether more than threshold alpha (step S42).This judgement, for example, when the amount of coated pasty state scolder is few, perhaps there is bubble in its inside, and when causing sectional area S less than threshold alpha, judging part 95h judges that the area of pasty state scolder is not more than setting.Thus, it is very few or have a bubble to detect the amount of pasty state scolder.At this, if detect a plurality of cross sections, judging part 95h also can carry out above-mentioned judgement to each cross section.At this moment, also can be at each height setting threshold alpha in cross section.Thus, can more correctly judge.In addition, threshold alpha by the height in the size of pasty state scolder, shape, cross section etc., suitably and freely is set.

When the sectional area S of pasty state scolder is that threshold alpha is when above (step S42:YES), judging part 95h, by drive control part 91 driving substrate conveying units 2 and worktable conveying unit 3, substrate is taken out of the outside (step S43) of testing fixture 1 from the assigned position on the worktable 30.Take out of the substrate of the outside of testing fixture 1, moved into fitting machine 102, carry out the installation of electronic component by this fitting machine 102.

On the other hand, when the sectional area S of pasty state scolder is not when threshold alpha is above (step 42:NO), judging part 95h judges that the pasty state scolder is bad, drives display device 7 by I/F portion 94 and carries out alerts action (step S44).As this alerts action, for example, can make display 7a show that there is bad content in the pasty state scolder, perhaps can make signal tower 7b light the lamp of expression warning.Thus, can prevent that the substrate that is coated with bad pasty state scolder from being taken out of.

When having carried out the 3rd Flame Image Process, judging part 95h judges whether the bubble volume V1 in the pasty state scolder of being calculated is setting β (step S45) below 1.For example, when the bubble of the inside of coated pasty state scolder is bigger, when causing volume V1 greater than threshold value beta 1, judging part 95h judges that coated pasty state scolder is bad.In addition, threshold value beta 1 by the size of pasty state scolder or shape etc., suitably and freely is set.

When volume V1 is a threshold value beta 1 when following (step S45:YES), judging part 95h judges whether the volume V0 of the pasty state scolder of being calculated is that threshold value beta is more than 0 (step S46).For example, when the amount of coated pasty state scolder is few, when causing volume V0 less than threshold value beta 0, judging part 95h judges that coated pasty state scolder is bad.In addition, threshold value beta 1 by the size of pasty state scolder or shape etc., suitably and freely is set.

When volume V0 is a threshold value beta 0 when above (step S46:YES), judging part 95h by drive control part 91 driving substrate conveying units 2 and worktable conveying unit 3, takes out of substrate the outside (step S43) of testing fixture 1 from the assigned position on the worktable 30.Take out of the substrate of the outside of testing fixture 1, moved into fitting machine 102, carry out the installation of electronic component by this fitting machine 102.

On the other hand, when volume V1 greater than threshold value beta 1 (step S45:NO), when perhaps volume V0 is less than threshold value beta 0 (step S46:NO), judging part 95h judges that the pasty state scolder is bad, drives display device 7 by I/F portion 94 and carries out alerts action (step S44).

As mentioned above, adopt present embodiment, illumination configuration part 95b, according to the kind of pasty state scolder promptly according to the composition of pasty state scolder, setting is by the infrared light intensity of lighting device 5 irradiations, therefore, camera head 6 can obtain the image that comprises from the catoptrical picture of substrate surface, can detect the cross section of pasty state scolder from this image.Therefore, no matter the composition of pasty state scolder how, all can detect the internal state of pasty state scolder.

And, shine the infrared light of a plurality of varying strengths by the substrate that is coated with the pasty state scolder by 5 pairs of lighting devices, take by infrared light-struck substrate corresponding to each intensity of infrared light by camera head 6, thus, the different a plurality of images of infrared light intensity can be obtained, and the 3D shape of pasty state scolder can be gone out from this image detection to the substrate irradiation.Therefore, by taking out of substrate by the state of pasty state scolder inside or warning, can prevent that the substrate that is coated with bad pasty state scolder from being taken out of.Especially owing to can detect comprising of pasty state scolder of inner 3D shape, thereby can discern the cross sectional shape of pasty state scolder more clearly.

In addition, in the present embodiment, by under the state of the threshold value of fixing 2 values, changing the light intensity of infrared light, repeatedly take, obtain a plurality of secondary image data, still, also can be by under the state of the fixing light intensity of infrared light, changing to a captured threshold value that a view data is carried out 2 values, perhaps the method for the method that will repeatedly take and change threshold value combines, and obtains a plurality of secondary image data.At this moment, in the 1st Flame Image Process, the quantity of employed threshold value and the light intensity of value and number of times of taking and infrared light when making the quantity and the value of employed threshold value in the time of will carrying out 2 values or carrying out 2 values, with the camera site alphabetic data, check that position data and Flame Image Process select data together, the inspection data that are mapped with each substrate of checking.And, with the inferior logarithmic data D in the 3rd Flame Image Process,, perhaps change the threshold value of 2 values and the order of taking number of times as the order of the threshold value that changes 2 values.Thus, even changing the threshold value of 2 values, perhaps the method that will repeatedly take and changing under the situation of method combination of threshold value also can access a plurality of secondary image data, and can detect the 3D shape etc. of pasty state scolder from this secondary image data.

And, in the running of testing fixture, can also end the illumination of the step S2 shown in Figure 14 that carried out according to kind related data 96d shown in Figure 15 and set.At this moment, the threshold value of employed regulation brightness among the step S13 of the 1st Flame Image Process shown in Figure 16 according to characteristic pattern shown in Figure 11, and according to the density of solder powder or the particle diameter of solder powder, is set.That is, the scolder A of kind is such as shown in figure 15, on scolder is formed, when than scolder B shown in Figure 15 or scolder C, when the low or scolder particle diameter of the ratio of solder powder is big, is big value with the threshold setting of regulation brightness, carries out 2 values of view data.On the contrary, under the situation of scolder B, on scolder was formed, the ratio height or the scolder particle diameter of solder powder were little, thereby during than scolder A, were little value with the threshold setting of regulation brightness, carried out 2 values of view data.So, by utilizing suitable threshold view data is carried out 2 values, no matter the kind of pasty state scolder how, all can detect along the outer shape of the above-mentioned pasty state scolder on aforesaid substrate surface, perhaps detect along the cross sectional shape of the above-mentioned pasty state scolder of the face that leaves mutually with substrate.

[the 2nd embodiment]

In the 2nd embodiment, corresponding at least one side in lighting device and the pasty state scolder through the time change, set infrared light intensity to the substrate irradiation that is coated with the pasty state scolder.Below, with reference to accompanying drawing 21～Figure 23, the 2nd embodiment is described.

(structure of testing fixture)

The physical construction of testing fixture, identical with the 1st embodiment (with reference to Fig. 1, Fig. 2).

Figure 21 represents to be used to control the control device 9 of testing fixture overall operation.This control device 9 comprises drive control part 91, lighting control section 92, image processing part 93, I/F portion 94, master control part 95 and storage part 96, and this is identical with the 1st embodiment.And, the function of drive control part 91, lighting control section 92, image processing part 93 and I/F portion 94 is also identical with the 1st embodiment.

Master control part 95 comprises condition storage part 95a, configuration part 95b ', image pickup part 95c, 2 95d of value portion, extracting part 95e, area calculating part 95f, the 95g of volume calculation portion and judging part 95h.Wherein, the function of each 95a of, the 95c except the 95b ' of configuration part, 95d, 95e, 95f, 95g, 95h is all identical with the 1st embodiment.

Configuration part 95b ', corresponding to pasty state scolder or lighting device 5 through the time change, set by the light intensity of the infrared light of lighting device 5 irradiations, take the number of times of substrates, the threshold value when carrying out 2 values etc. by 2 95d of value portion described later by camera head 6.

In addition, storage part 96, storing image data 96a, reference information 96b, fine or not 96c as a result (these are identical with the 1st embodiment), and at least also store relevant pasty state scolder through the time change and the light intensity of view data between the scolder related data 96e of relation and relevant infrared LEDs 5a through the time variation and view data light intensity between the LED related data 96f of relation.

(principle of work)

The relevant image that is obtained by infrared light-struck substrate according to shooting detects the principle of work of the shape of pasty state scolder, and is identical with the 1st embodiment basically.

During to substrate irradiation infrared light, as mentioned above, intensity of reflected light is proportional with the infrared light intensity that is shone.Therefore, along with infrared LEDs 5a through the time change (, the variation that its ultrared intensity descends gradually along with the increase of new infrared LEDs accumulative total service time), catoptrical intensity also can descend.

To this, in the present embodiment, corresponding to infrared LEDs 5a through the time change, set infrared light intensity by lighting device 5 irradiations.Should being set as follows by the infrared light intensity of lighting device 5 irradiation.On lighting device 5, be connected with electric power supply line (not shown).This electric power supply line is connected in infrared LEDs 5a via the electric power adjuster (not shown) that connects midway.At configuration part 95b ', be set with corresponding to infrared LEDs 5a through the time change the increase modified value of the delivery of (electric energy converts the variation that the efficient of infrared light descends along with the process of time to), and, increase supply capability to infrared LEDs 5a by lighting control section 92 control electric power adjusters.Thus, by the infrared light intensity of lighting device 5 irradiation, can not be subjected to infrared LEDs 5a through the time influence that changes, can keep prescribed strength all the time.

And, from the catoptrical light intensity of substrate surface, along with the pasty state scolder through the time change and change.At this point, with reference to above-mentioned Figure 13, describe.

As mentioned above, as infrared LEDs 5a from lighting device 5, during the substrate P irradiation infrared light of the pasty state scolder that the potpourri that is coated with on the battery lead plate E by solder powder H and solder flux F is constituted, this infrared light, direction advance (with reference to Figure 13) shown in arrow a～d.

Effective constituent when the cross sectional shape that carries out the pasty state scolder detects that is from the reflected light of substrate surface is the part (arriving the composition of camera head 6) of arrow a and arrow d.In factory modulation and seal pasty state scolder in container up for safekeeping, in order to be coated in by dispenser (dispenser) or printing machine on the substrate and after the depressurization, process along with the time, perhaps after supplying to the pasty state scolder on the template again, along with the increase of moving the print pass that the pasty state scolder is printed by scraper plate, solvent in the solder flux can evaporate, and perhaps solder flux itself can take place to go bad, and perhaps solder powder precipitation takes place and the high part of solder powder density occurs.If take place such through the time change, the infrared light that sees through solder flux can be decayed halfway, perhaps by solder powder H diffuse reflection, therefore, is reflected by substrate surface and the infrared light intensity that arrives camera head 6 will reduce.At this moment, if do not increase the light intensity of the infrared light that is shone by infrared LEDs 5a, camera head 6 can't detect its reflected light.To this, in the present embodiment, corresponding to the pasty state scolder through the time change, set light intensity by the infrared light of lighting device 5 irradiations.That is, corresponding to the pasty state scolder through the time change, set the increase modified value of delivery, to increase the infrared light intensity of infrared LEDs 5a irradiation.

(running of testing fixture)

The inspection action of present embodiment, identical with the 1st embodiment basically, its process flow diagram according to above-mentioned steps S14 is checked.

But, in step S1, in the various data that condition acquisition unit 95a is obtained, comprise scolder related data 96d and LED related data 96e.

Obtain and check after the data, configuration part 95b ' according to scolder related data 96d and LED related data 96e, sets the infrared light intensity (the step S2 among Figure 14) by lighting device 5 irradiations.

Scolder related data 96d for example is made of characteristic pattern shown in Figure 22.This Figure 22, when being illustrated in substrate to the pasty state scolder that is coated with known thickness and shining the infrared light of a plurality of light intensities, the service time of pasty state scolder that is printing machine 101 relation between the brightness of the pixel of time of printing continuously under the state of not changing the pasty state scolder and camera head 6 captured images.In Figure 22, curve a1～a6, (direction from curve a1 toward curve a6) the infrared light intensity of turning right more is just strong more.

For example, when the infrared light intensity of establishing camera head 6 initial irradiations was a1, the catoptrical light intensity from substrate that camera head 6 is detected was c1.From this state through h1 after the time since the pasty state scolder through the time change, from the catoptrical light intensity of substrate descend (c2).If under the state that catoptrical light intensity descends, take, because thereby 2 95d of value portion described later carry out the secondary image data that 2 values generate the pasty state scolder cross section of specific thickness with defined threshold to the light intensity value of pixel, therefore, just can become not to be the secondary image data in cross section of the pasty state scolder of specific thickness.For this reason, configuration part 95b ' according to the characteristic pattern of Figure 22, sets the infrared light intensity by lighting device 5 outputs.For example, from using the pasty state scolder to begin to have passed through h1 during the time, under by the situation of camera head 6 detections,, set infrared light intensity according to following formula (1) from the catoptrical light intensity of the substrate of c1 value.

a2+(a3-a2)b/1…(1)

In following formula (1), the length of 1 expression straight line L, the length that the P on b represents from curve a2 to straight line L is ordered.And, in Figure 22, the distance between that the intersection point of P point express time h1 and light intensity c1, straight line L are represented to order by P, curve a2 and the curve a3.

So, configuration part 95b ' according to scolder related data 96d, sets the infrared light intensity by lighting device 5 outputs, thus, can shine corresponding to the pasty state scolder through the time intensity that changes infrared light.In addition, scolder related data 96d can shine the cross section that infrared light detects the pasty state scolder by reality and be generated.In addition, scolder related data 96d can also corresponding to the print pass that the pasty state scolder is printed that moves by scraper plate, set the infrared light intensity by lighting device 5 outputs after the pasty state scolder supplies on the template again.At this moment, scolder related data 96d is made of the characteristic pattern of the horizontal ordinate in the characteristic pattern of Figure 22 being changed into print pass.

In addition, LED related data 96e, same with above-mentioned scolder related data 96d, the characteristic pattern of the relation by expression between the brightness of the pixel of the captured image of stream time during to the infrared light of the substrate irradiation prescribed strength that is coated with the pasty state scolder, infrared LEDs 5a and camera head 6 constitutes.Configuration part 95b ' according to this characteristic pattern, sets the infrared light intensity by lighting device 5 outputs, thus, can shine corresponding to lighting device 5 through the time intensity that changes infrared light.In addition, LED related data 96e can shine the cross section that infrared light detects the pasty state scolder by reality and be generated.

LED related data 96e for example is made of characteristic pattern shown in Figure 23.In Figure 23, ordinate is represented the luminous intensity by the infrared light of infrared LEDs 5a output, and horizontal ordinate is represented the accumulation service time of new infrared LEDs 5a after bring into use, v1, v2 ..., v6 is the magnitude of voltage that puts on infrared LEDs 5a.That is, magnitude of voltage is high more, and the electric weight that supplies to infrared LEDs 5a is just big more.

When using new infrared LEDs 5a, if the service voltage value is the electric power of v1, the luminous intensity of infrared LEDs 5a is r1, and accumulative total is when being h1 service time, and then luminous intensity is r2.In order also to keep identical luminous intensity r1,, set the supply capability (, being the magnitude of voltage that puts on infrared LEDs 5a) of lighting device 5 at this according to following formula (2) at accumulative total h1 place service time.

v2+(v3-v2)d/l…(2)

In following formula (2), 1 expression by P point and between curve v2 and curve v3 apart from the length of the shortest straight line L, d represents the length from the point of the P on the straight line L to curve v2, the intersection point of P point express time h1 and luminous intensity r1.

So, configuration part 95b ' according to LED related data 96e, sets the infrared light intensity by lighting device 5 outputs, thus, even infrared LEDs 5a take place through the time change, also can shine the infrared light of the prescribed strength that remains unchanged.In addition, in Figure 23, infrared LEDs 5a, the magnitude of voltage that is applied is big more, and the infrared light of being exported is brighter slightly than the infrared light of prescribed strength sometimes.At this moment, infrared ray sensor can be set, when using new infrared LEDs 5a by detected value that this infrared ray sensor detected as desired value, even thereby under the situation of accumulative total increase service time, delivery by carry out changing infrared LEDs 5a is the FEEDBACK CONTROL of magnitude of voltage for example, and the detected value from the infrared light of infrared LEDs 5a that can make also that infrared ray sensor detects is identical with desired value as far as possible.

In the present embodiment, configuration part 95b ' according to above-mentioned scolder related data 96d and LED related data 96e, sets the infrared light intensity by lighting device 5 outputs.Particularly, for example, configuration part 95b ' according to LED related data 96e, calculates the infrared light intensity by lighting device 5 output, and according to the value and the scolder related data 96d of this infrared light, sets the infrared light intensity by lighting device 5 outputs.Thus, can shine corresponding to pasty state scolder and infrared LEDs 5a through the time intensity that changes infrared light.

Illumination is set (step S2) afterwards, carries out the processing of step S3～S9 of Figure 14.And the 1st～3 Flame Image Process of step S6～S8 is carried out according to the process flow diagram of Figure 16, Figure 18, Figure 19, and the fine or not judgment processing of step S9 is carried out according to the process flow diagram of Figure 20.These processing, identical with the 1st embodiment.

Adopt present embodiment, by configuration part 95b ', corresponding to pasty state scolder or lighting device 5 through the time change, setting is by the infrared light intensity of lighting device 5 irradiations, therefore, camera head 6 can detect the reflected light from substrate surface, in this substrate, has the regulation light intensity with the corresponding pixel of the specific thickness of pasty state scolder.Therefore, the image captured according to camera head 6 can detect the state of pasty state scolder.Its result, though pasty state scolder or infrared LEDs 5a take place through the time change, also can detect the state of pasty state scolder.

In addition, in the present embodiment, configuration part 95b ', according to scolder related data 96d and LED related data 96e the two, setting is by the infrared light intensity of lighting device 5 outputs, but, also can set infrared light intensity according among scolder related data 96d and the LED related data 96e at least one.

In addition, in the present embodiment, corresponding to the pasty state scolder through the time change, infrared LEDs 5a through the time change, setting is by the infrared light intensity of lighting device 5 irradiations, that is, set for electric weight, still toward infrared LEDs 5a, in the running of testing fixture, also can not carry out the illumination of the step S2 among Figure 14 and set.At this moment, also the threshold value of employed regulation brightness among the step S13 of the 1st Flame Image Process shown in Figure 16 can be arranged to low value.So, by utilizing suitable threshold view data is carried out 2 values, even do not change the infrared light intensity of lighting device 5 irradiations, can not be subjected to yet the pasty state scolder through the time change or infrared LEDs 5a through the time influence that changes, thereby can detect along the cross sectional shape of the above-mentioned pasty state scolder of the face that leaves mutually with substrate.

As mentioned above, testing fixture of the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of described infrared light-struck described substrate; According to the image that this image unit obtained, detect the detecting unit of the shape of described pasty state scolder; Corresponding to the composition of described pasty state scolder, set setup unit by the infrared light intensity of described illumination unit.

Adopt this invention, by the infrared light of intensity that the substrate irradiation that is coated with scolder is set corresponding to the composition of pasty state scolder, and take by this infrared light-struck substrate, thus, no matter the kind of pasty state scolder how, all can correctly detect the shape of pasty state scolder.

In described testing fixture, comparatively it is desirable to, also comprise the 2 value unit that the image that image unit was obtained carried out 2 values with the brightness of defined threshold, described detecting unit according to the 2 value images that 2 value unit are obtained, detects the shape of pasty state scolder.At this, described detecting unit also can detect the cross sectional shape of the face that leaves mutually along itself and substrate of pasty state scolder.And, detecting unit, also can detect the 3D shape of pasty state scolder according to the infrared light intensity that lighting unit was shone being mutually different a plurality of image a plurality of 2 value images of carrying out 2 values and obtaining, being that the image of an intensity carries out a plurality of 2 value images that 2 values obtain and is that mutually different a plurality of image carries out one 2 value image in a plurality of 2 value images that 2 values obtain with a plurality of threshold values to the infrared light intensity that lighting unit was shone with a plurality of threshold values to the infrared light intensity that lighting unit was shone with defined threshold.And detecting unit also can comprise the extracting unit of the boundary line of each dark portion of 2 value image contracts and highlights and calculates the computing unit of the volume of described pasty state scolder according to a plurality of boundary lines that this extracting unit extracted.

In described testing fixture, detecting unit also can detect along the outer shape of the described pasty state scolder of substrate surface.At this, detecting unit, also the 2 value images that can be obtained according to 2 value unit detect along the outer shape of the pasty state scolder of substrate surface.

Described testing fixture can comprise also that also the testing result that detects according to detecting unit judges the judging unit of the state of pasty state scolder.

In addition, another testing fixture involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of infrared light-struck substrate; The image that this image unit was obtained is carried out 2 value unit of 2 values with the brightness of defined threshold; According to the 2 value images that this 2 value unit is obtained, detect the detecting unit of the shape of pasty state scolder; Corresponding to the composition of pasty state scolder, set the setup unit of the threshold value of 2 value unit.

Adopt this invention, by set the threshold value of 2 value unit corresponding to the composition of pasty state scolder, therefore, no matter the kind of pasty state scolder how, all can correctly detect the shape of pasty state scolder.

In described testing fixture, detecting unit, also 2 value images that can be obtained according to 2 value unit detect along at least one shape in the cross sectional shape of the face that leaves mutually along itself and substrate of the outer shape of the pasty state scolder of substrate surface and pasty state scolder.And, can comprise also that also the testing result that detects according to detecting unit judges the judging unit of the state of pasty state scolder.

In addition, another testing fixture involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of infrared light-struck substrate; According to the image that this image unit obtained, detect the detecting unit of the shape of pasty state scolder; Corresponding in lighting unit and the pasty state scolder at least one through the time change, set the 1st setup unit by the infrared light intensity of illumination unit.

Adopt this invention, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the shape that is coated in the pasty state scolder on the substrate.

In described testing fixture, setup unit, the accumulation service time after also can utilizing the use of lighting unit to begin, as lighting unit through the time change, set infrared light intensity by illumination unit.Thus, no matter how, all can correctly detect the shape of the pasty state scolder that is coated on the substrate service time of lighting unit.

In described testing fixture, setup unit, also can utilize in the printing machine that the pasty state solder coating is used template print in substrate, the pasty state scolder by after newly supplying on the template to being printed to as time till on the substrate of checking object and in the print pass at least one, as the pasty state scolder through the time change, set infrared light intensity by illumination unit.Thus, can not be subjected to the elapsed time of pasty state scolder after supplying on the template and the influence of the use of the pasty state scolder print pass after beginning, correctly detect the shape that is coated in the pasty state scolder on the substrate by printing machine.

In described testing fixture, lighting unit also can be supplied with and shines infrared light by accepting electric power, and setup unit also can be set the amount that electric power is supplied with.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, only set the electric power that supplies to lighting unit, just can correctly detect the shape of the pasty state scolder that is coated on the substrate.

Described testing fixture, also can also comprise the 2 value unit that expression carried out 2 values by the image of the intensity distributions of the infrared light of substrate reflection with defined threshold, detecting unit according to by the image of 2 values, detects the cross sectional shape of the face that leaves mutually along itself and substrate of pasty state scolder.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the cross sectional shape of the face that leaves mutually along itself and this substrate of the pasty state scolder that is coated on the substrate.

Described testing fixture, also can also comprise the infrared light intensity that sets according to setup unit and set the 2nd setup unit of a plurality of infrared light intensities by illumination unit corresponding to the pasty state scolder, detecting unit, according to the infrared light intensity that image unit obtained is mutually different a plurality of image, detects the 3D shape of pasty state scolder.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the 3D shape that is coated in the pasty state scolder on the substrate.

In described testing fixture, detecting unit also can comprise the extracting unit of the boundary line of dark portion of each image contract and highlights and calculates the computing unit of the volume of pasty state scolders according to a plurality of boundary lines that this extracting unit extracted.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the volume that is coated in the pasty state scolder on the substrate.

Described testing fixture can comprise also that also the testing result that detects according to detecting unit judges the judging unit of the state of pasty state scolder.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, the state of the pasty state scolder that judges rightly.

In addition, a testing fixture more involved in the present invention comprises: the lighting unit that the substrate that is coated with the pasty state scolder is shone the infrared light of prescribed strength; Shooting is by the image unit of infrared light-struck substrate; The image that this image unit was obtained is carried out 2 value unit of 2 values with the brightness of defined threshold; According to the 2 value images that 2 value unit are obtained, detect the detecting unit of the shape of pasty state scolder; Corresponding in lighting unit and the pasty state scolder at least one through the time change, set the setup unit of the threshold value of 2 value unit.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the shape that is coated in the pasty state scolder on the substrate.

In described testing fixture, detecting unit, also 2 value images that can be obtained according to 2 value unit detect the cross sectional shape of the face that leaves mutually along itself and substrate of pasty state scolder.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, correctly detect the cross sectional shape that is coated in the pasty state scolder on the substrate.

Described testing fixture can comprise also that also the testing result that detects according to detecting unit judges the judging unit of the state of pasty state scolder.Thus, can not be subjected to lighting unit and pasty state scolder through the time influence that changes, judging rightly is coated in the shape of the pasty state scolder on the substrate.

Utilizability on the industry

The present invention is applicable to inspection method and the testing fixture of the substrate that is coated with the pasty state scolder.

Claims (22)

1. testing fixture is characterized in that comprising:

The substrate that is coated with the pasty state scolder is shone the lighting unit of the infrared light of prescribed strength;

Shooting is by the image unit of described infrared light-struck described substrate;

Detecting unit according to the shape of the described pasty state scolder of the image detection that described image unit obtained;

Set setup unit corresponding to the composition of described pasty state scolder by the infrared light intensity of described illumination unit.

2. testing fixture according to claim 1 is characterized in that also comprising,

The 2 value unit that the image that described image unit was obtained carried out 2 values with the brightness of defined threshold, wherein,

Described detecting unit according to the 2 value images that described 2 value unit are obtained, detects the shape of described pasty state scolder.

3. testing fixture according to claim 2 is characterized in that:

Described detecting unit according to the 2 value images that described 2 value unit are obtained, detects the cross sectional shape of the face that leaves mutually along itself and described substrate of described pasty state scolder.

4. testing fixture according to claim 2 is characterized in that:

Described detecting unit, according to being that mutually different a plurality of image carries out a plurality of 2 value images that 2 values obtain to the infrared light intensity that described lighting unit was shone with defined threshold, is that the image of an intensity carries out a plurality of 2 value images that 2 values obtain with a plurality of threshold values to the infrared light intensity that described lighting unit was shone, and be that mutually different a plurality of image carries out one 2 value image in a plurality of 2 value images that 2 values obtain with a plurality of threshold values to the infrared light intensity that described lighting unit was shone, detect the 3D shape of described pasty state scolder.

5. testing fixture according to claim 4 is characterized in that:

Described detecting unit comprises the extracting unit of the boundary line of each described dark portion of 2 value image contracts and highlights and calculates the computing unit of the volume of described pasty state scolder according to a plurality of boundary lines that described extracting unit extracted.

6. testing fixture according to claim 1 is characterized in that:

Described detecting unit detects along the outer shape of the described pasty state scolder of described substrate surface.

7. testing fixture according to claim 2 is characterized in that:

Described detecting unit, 2 value images according to described 2 value unit are obtained detect along the outer shape of the described pasty state scolder of described substrate surface.

8. according to any described testing fixture in the claim 1 to 7, it is characterized in that also comprising,

Judge the judging unit of the state of described pasty state scolder according to the testing result that described detecting unit detected.

9. testing fixture is characterized in that comprising:

The substrate that is coated with the pasty state scolder is shone the lighting unit of the infrared light of prescribed strength;

Shooting is by the image unit of described infrared light-struck substrate;

The image that described image unit was obtained is carried out 2 value unit of 2 values with the brightness of defined threshold;

The detecting unit of the shape of the described pasty state scolder of 2 value image detection that is obtained according to described 2 value unit;

Set the setup unit of the described threshold value of described 2 value unit corresponding to the composition of described pasty state scolder.

10. testing fixture according to claim 9 is characterized in that:

Described detecting unit, the 2 value images that obtained according to described 2 value unit detect along at least one shape in the cross sectional shape of the face that leaves mutually along itself and described substrate of the outer shape of the described pasty state scolder of described substrate surface and described pasty state scolder.

11. according to claim 9 or 10 described testing fixtures, it is characterized in that also comprising,

Judge the judging unit of the state of described pasty state scolder according to the testing result that described detecting unit detected.

12. a testing fixture is characterized in that comprising:

The substrate that is coated with the pasty state scolder is shone the lighting unit of the infrared light of prescribed strength;

Shooting is by the image unit of described infrared light-struck described substrate;

Detecting unit according to the shape of the described pasty state scolder of the image detection that described image unit obtained;

Corresponding in described lighting unit and the described pasty state scolder at least one through the time change to set setup unit by the infrared light intensity of described illumination unit.

13. testing fixture according to claim 12 is characterized in that:

Described setup unit, the accumulation service time after utilizing the use of described lighting unit to begin as described lighting unit through the time change, set infrared light intensity by described illumination unit.

14. testing fixture according to claim 12 is characterized in that:

Described setup unit, utilization is in the printing machine that described pasty state solder coating is used template print in described substrate, described pasty state scolder by after newly supplying on the described template to being printed to as time till on the described substrate of checking object and in the print pass at least one, as described pasty state scolder through the time change, set infrared light intensity by described illumination unit.

15. testing fixture according to claim 12 is characterized in that:

Described lighting unit is supplied with and is shone infrared light by accepting electric power,

Described setup unit is set the amount that described electric power is supplied with.

16. testing fixture according to claim 12 is characterized in that also comprising,

The 2 value unit that expression carried out 2 values by the image of the intensity distributions of the infrared light of described substrate reflection with defined threshold, wherein,

Described detecting unit according to by the image of 2 values, detects the cross sectional shape of the face that leaves mutually along itself and described substrate of described pasty state scolder.

17. testing fixture according to claim 12 is characterized in that also comprising,

The described infrared light intensity that sets according to described setup unit is also set the 2nd setup unit of a plurality of infrared light intensities by described illumination unit corresponding to described pasty state scolder, wherein,

Described detecting unit is mutually different a plurality of image according to the described infrared light intensity that described image unit obtained, and detects the 3D shape of described pasty state scolder.

18. testing fixture according to claim 17 is characterized in that:

Described detecting unit comprises the extracting unit of the boundary line of each dark portion of described image contract and highlights and calculates the computing unit of the volume of described pasty state scolder according to a plurality of described boundary line that described extracting unit extracted.

19. according to any described testing fixture in the claim 12 to 18, it is characterized in that also comprising,

Judge the judging unit of the state of described pasty state scolder according to the testing result that described detecting unit detected.

20. a testing fixture is characterized in that comprising:

The substrate that is coated with the pasty state scolder is shone the lighting unit of the infrared light of prescribed strength;

Shooting is by the image unit of described infrared light-struck described substrate;

The image that described image unit was obtained is carried out 2 value unit of 2 values with the brightness of defined threshold;

The detecting unit of the shape of the described pasty state scolder of 2 value image detection that is obtained according to described 2 value unit;

Corresponding in described lighting unit and the described pasty state scolder at least one through the time change to set the setup unit of the described threshold value of described 2 value unit.

21. testing fixture according to claim 20 is characterized in that:

Described detecting unit according to the 2 value images that described 2 value unit are obtained, detects the cross sectional shape of the face that leaves mutually along itself and described substrate of described pasty state scolder.

22. according to claim 20 or 21 described testing fixtures, it is characterized in that also comprising,

Judge the judging unit of the state of described pasty state scolder according to the testing result that described detecting unit detected.

Images