CN101513687A - Reflux brazier soldering flux collection device and using method thereof - Google Patents
Reflux brazier soldering flux collection device and using method thereof Download PDFInfo
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- CN101513687A CN101513687A CNA2008100336939A CN200810033693A CN101513687A CN 101513687 A CN101513687 A CN 101513687A CN A2008100336939 A CNA2008100336939 A CN A2008100336939A CN 200810033693 A CN200810033693 A CN 200810033693A CN 101513687 A CN101513687 A CN 101513687A
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Abstract
The invention provides a reflux brazier soldering flux collection device and a using method thereof. The collecting device comprises at least two collecting units with a same structure, a tee inlet pipeline and a ventilation pipeline, wherein the collecting units are connected in series sequentially, every collecting unit comprises a heat exchange post and a collecting bottle, and each collecting bottle is arranged below the heat exchange post and is communicated with the heat exchange post; the heat exchange posts comprise post bodies and cooling water pipelines arranged in the post bodies; air inlets and air outlets are arranged on the post bodies, the air inlet of the first heat exchange post is connected with the tee inlet pipe, the air outlet of the previous heat exchange post is connected with the air inlet of the latter heat exchange post, and the air outlet of the last heat exchange post is connected with the ventilation pipeline. The using method comprises the steps of recovering soldering flux and cleaning the heat exchange posts. The reflux brazier soldering flux collection device has the advantage of good collection effect and the function of automatic cleaning, and the service life of the reflux brazier soldering flux collection device is more than five times of that of the traditional collection device.
Description
Technical field
The present invention relates to a kind of auxiliary equipment that is used to produce electronic devices and components, particularly a kind of reflux brazier soldering flux collection device and using method thereof.
Background technology
Reflow soldering (Reflow Oven) is the equipment that is used for the circuit board that is loaded with electronic devices and components is carried out soldering.It is by providing a kind of heating environment, thereby solder(ing) paste being heated melt allows surface-pasted components and parts and circuit board combine reliably by the solder(ing) paste alloy.The solder(ing) paste that soldering is used is that the scaling powder and the powder scolder of smectic are made paste, be coated in the soldering position of each components and parts of circuit board by printing, and accurate thereon mounted with electronic components, utilize reflow soldering to carry out heat fused, reach reliable soldering to components and parts.
Scaling powder in the solder(ing) paste is the mixture of main component with rosin normally, is the auxiliary material that guarantee that brazing process carries out smoothly.The main effect of scaling powder is to remove scolder and by the oxide on weldering mother metal surface, make the metal surface reach necessary cleannes, and the oxidation once more on surface when preventing to weld reduces solder surface tension force, improves welding performance.During the heat fused solder(ing) paste, scaling powder can gasify and become steam.Can liquefy when low-temperature space (about below 110 ℃) time that the scaling powder of gasification touches in the reflow ovens.If when temperature was enough low, scaling powder can be become solid-state by liquid state, this is the state of temperature characteristic of scaling powder.
Except heating module, all there is a refrigerating module to guarantee metallurgy characteristic and reduce plate temperature in the reflow soldering.In the air reflow soldering, scaling powder steam was directly discharged body of heater before cooling, can not stay the scaling powder condensate in refrigerating module., in most nitrogen protection reflow solderings, in order to reduce nitrogen (N
2) consumption, internal mix gas will recycle, scaling powder steam can not directly be discharged body of heater, therefore scaling powder steam has an opportunity fully to contact with refrigerating module, make its temperature be lower than 110 ℃, and condensation appears, on the backflow orifice plate of these scaling powder condensate liquids cognition attached to refrigerating module.When the scaling powder of liquid state is stacked into certain degree, just can form drop, finally drip, and have very big probability to drop onto on the wiring board (PCB), cause the off quality of wiring board even scrap.In order to prevent this type of incident, general way is the scaling powder of regular manual wipping cleaning cooling zone backflow orifice surface in the industry, and maintenance is cleaned in return-flow system inside.The skilled worker that abundant maintenance technology and general knowledge generally need be shut down and be arranged to have to this work operates, and also needs to dismantle correlated parts sometimes, to clear up easily and thoroughly and to safeguard.But increased the time and the work difficulty of maintenance so again, thereby remote-effects are to production efficiency and the output of using the client.
In order to reduce the continuous accumulation of scaling powder in burner hearth, reduce the scaling powder probability that condensation is piled up in refrigerating module, strengthen the lower circuit board of cooling effect acquisition simultaneously and go out plate temperature, reflow soldering should be equipped with soldering flux collection device, and the scaling powder of gasification is collected.To improve the service efficiency and the production efficiency of reflow soldering, for enterprise realizes bigger economic benefit.
Summary of the invention
Purpose of the present invention is exactly in order to provide a kind of reflux brazier soldering flux collection device and using method thereof.
Technical scheme of the present invention is: a kind of reflux brazier soldering flux collection device comprises at least two collector unit, a threeway air inlet pipeline and exhausting pipelines that structure is identical; Each collector unit is connected in proper order, and each collector unit respectively comprises a heat exchange posts and a receiving flask, and receiving flask is arranged on the below of heat exchange posts and connects with heat exchange posts; Described heat exchange posts comprises cylinder and is installed in the interior cooling water pipeline of cylinder, on cylinder, be provided with gas feed and outlet, wherein the gas feed of first heat exchange posts connects the threeway air inlet pipeline, the gas vent of previous heat exchange posts connects the gas feed of a back heat exchange posts, and the gas vent of last heat exchange posts connects the exhausting pipeline.
It is cooling water pipe that the described cooling water pipeline that is arranged in the heat exchange posts adopts corrugated stainless steel tubing.
Described corrugated stainless steel tubing cooling water pipe adopts random coil wound form structure.
In the described threeway air inlet pipeline one is logical to link to each other with the scaling powder gas vent of reflow soldering, and another leads to and links to each other with the high-temperature gas pipeline.
The using method of above-mentioned reflux brazier soldering flux collection device comprises following two aspects:
The recovery of A, scaling powder
The threeway air inlet pipeline is communicated with the scaling powder gas vent of reflow soldering, and the cooling water pipeline in heat exchange posts feeds cooling water, and opens exhausting pipeline exhausting, promptly realizes the recovery of scaling powder;
The cleaning of B, heat exchange posts
Close the cooling water pipeline in the heat exchange posts,, in heat exchange posts, feed high-temperature gas, and open exhausting pipeline exhausting, promptly realize the cleaning of heat exchange posts threeway air inlet pipeline and high-temperature gas pipeline connection.
The temperature of described cooling water is controlled at 0 ℃-25 ℃.
The temperature of described high-temperature gas is controlled at 150 ℃-250 ℃.
Reflux brazier soldering flux collection device collecting effect of the present invention is good, and has automatic cleaning function, in actual use, need only carry out periodic maintenance and maintenance to device, can use for a long time, and be more than five times of traditional gathering-device its service life.
Description of drawings
Fig. 1 is the basic structure schematic diagram of reflux brazier soldering flux collection device of the present invention;
Fig. 2 is the decomposition texture schematic diagram of reflux brazier soldering flux collection device of the present invention.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing.
Referring to Fig. 1, Fig. 2, reflux brazier soldering flux collection device of the present invention comprises at least two collector unit (present embodiment is depicted as 5 collector units), a threeway air inlet pipeline (not shown) and exhausting pipelines (not shown) that structure is identical.Each collector unit is connected in proper order, and each collector unit respectively comprises a heat exchange posts 1 and a receiving flask 2, and receiving flask 2 is arranged on the below of heat exchange posts and connects by a connecting line and a heat exchange posts 1 that has ball valve 3.Heat exchange posts 1 comprises cylinder 11 and is installed in the interior cooling water pipeline 12 of cylinder, be provided with gas feed 111 and outlet 112 on cylinder 11.The gas feed of first heat exchange posts connects the threeway air inlet pipeline, and the gas vent of previous heat exchange posts connects the gas feed of a back heat exchange posts, and the gas vent of last heat exchange posts connects the exhausting pipeline.It is cooling water pipe that cooling water pipeline 12 adopts corrugated stainless steel tubing, and this corrugated stainless steel tubing cooling water pipe adopts random coil wound form structure.The import of cooling water pipeline 12 and outlet all are arranged on the top cover 113 of cylinder 11, and top cover 113 links to each other with cylinder 11 sealings with sealing ring 115 by a quick clip 114 of health level.
In the threeway air inlet pipeline among the present invention one is logical to link to each other with the scaling powder gas vent of reflow soldering, and another leads to and links to each other with the high-temperature gas pipeline.
The using method of reflux brazier soldering flux collection device of the present invention comprises two aspects:
The one, be used for the recovery of scaling powder.When the recovery that is used for scaling powder, be the threeway air inlet pipeline to be switched to the scaling powder gas vent of reflow soldering be communicated with, cooling water pipeline in each heat exchange posts feeds cooling water (temperature of cooling water is controlled at 0 ℃-25 ℃), to open towards the ball valve of the connecting line of each receiving flask, and open exhausting pipeline exhausting, can realize the recovery of scaling powder.In removal process, high temperature scaling powder gas from reflow soldering enters each heat exchange posts in proper order, contact with the corrugated stainless steel tubing cooling water pipe, with the cooling water generation heat exchange in the cooling water pipe, the receiving flask that is condensed into liquid (even have be condensed into solid on a small quantity and condense on cylinder or the corrugated stainless steel tubing cooling water pipe) gradually and falls into the below is collected.
Another using method of reflux brazier soldering flux collection device of the present invention is the cleaning that is used for heat exchange posts.After reflux brazier soldering flux collection device of the present invention uses a period of time, one deck solid scaling powder that may condense on its inboard wall of cylinder and the corrugated stainless steel tubing cooling water pipe, this will reduce the cooling effectiveness of gathering-device, therefore must cleaned at regular intervals.Reflux brazier soldering flux collection device of the present invention has self-cleaning ability.When being used for the cleaning of heat exchange posts, close the cooling water pipeline in the heat exchange posts, the threeway air inlet pipeline is switched to and the high-temperature gas pipeline connection, in heat exchange posts, feed high-temperature gas (temperature of high-temperature gas is controlled at 150 ℃-250 ℃), device is heated, and open exhausting pipeline exhausting, can realize the cleaning of heat exchange posts.In cleaning course, enter each heat exchange posts in proper order from the high-temperature gas of high-temperature gas pipeline, with the solid scaling powder heating and gasifying that condenses on inboard wall of cylinder and the corrugated stainless steel tubing cooling water pipe, extract out through the exhausting pipeline then, realize the cleaning of heat exchange posts.
Claims (7)
1. a reflux brazier soldering flux collection device is characterized in that: comprise two collector unit, a threeway air inlet pipeline and exhausting pipelines that structure is identical at least; Each collector unit is connected in proper order, and each collector unit respectively comprises a heat exchange posts and a receiving flask, and receiving flask is arranged on the below of heat exchange posts and connects with heat exchange posts; Described heat exchange posts comprises cylinder and is installed in the interior cooling water pipeline of cylinder, on cylinder, be provided with gas feed and outlet, wherein the gas feed of first heat exchange posts connects the threeway air inlet pipeline, the gas vent of previous heat exchange posts connects the gas feed of a back heat exchange posts, and the gas vent of last heat exchange posts connects the exhausting pipeline.
2. reflux brazier soldering flux collection device according to claim 1 is characterized in that: it is cooling water pipe that the described cooling water pipeline that is arranged in the heat exchange posts adopts corrugated stainless steel tubing.
3. reflux brazier soldering flux collection device according to claim 2 is characterized in that: described corrugated stainless steel tubing cooling water pipe adopts random coil wound form structure.
4. reflux brazier soldering flux collection device according to claim 1 is characterized in that: one in the described threeway air inlet pipeline is logical to link to each other with the scaling powder gas vent of reflow soldering, and another leads to and links to each other with the high-temperature gas pipeline.
5. the using method of reflux brazier soldering flux collection device according to claim 1 is characterized in that, comprises following two aspects:
The recovery of A, scaling powder
The threeway air inlet pipeline is communicated with the scaling powder gas vent of reflow soldering, and the cooling water pipeline in heat exchange posts feeds cooling water, and opens exhausting pipeline exhausting, promptly realizes the recovery of scaling powder;
The cleaning of B, heat exchange posts
Close the cooling water pipeline in the heat exchange posts,, in heat exchange posts, feed high-temperature gas, and open exhausting pipeline exhausting, promptly realize the cleaning of heat exchange posts threeway air inlet pipeline and high-temperature gas pipeline connection.
6. the using method of reflux brazier soldering flux collection device according to claim 5, it is characterized in that: the temperature of described cooling water is controlled at 0 ℃-25 ℃.
7. the using method of reflux brazier soldering flux collection device according to claim 5, it is characterized in that: the temperature of described high-temperature gas is controlled at 150 ℃-250 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2008100336939A CN101513687B (en) | 2008-02-19 | 2008-02-19 | Reflux brazier soldering flux collection device and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2008100336939A CN101513687B (en) | 2008-02-19 | 2008-02-19 | Reflux brazier soldering flux collection device and using method thereof |
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| CN101513687A true CN101513687A (en) | 2009-08-26 |
| CN101513687B CN101513687B (en) | 2011-01-26 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801840A (en) * | 2014-01-28 | 2015-07-29 | 上海朗仕电子设备有限公司 | Air cooling type soldering flux gathering device for reflow soldering furnace |
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108723539A (en) * | 2018-06-04 | 2018-11-02 | 武汉倍普科技有限公司 | A kind of removing method of the smog of reflow ovens |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102794524A (en) * | 2011-05-24 | 2012-11-28 | 上海朗仕电子设备有限公司 | Device for collecting gas heat exchange cooling soldering flux |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000140502A (en) * | 1998-11-16 | 2000-05-23 | Tdk Corp | Liquid cooling type flux recovery apparatus |
| EP1867424B1 (en) * | 2005-02-07 | 2012-04-18 | Senju Metal Industry Co., Ltd. | Method for removing fume in reflow furnace and reflow furnace |
| JP2007067061A (en) * | 2005-08-30 | 2007-03-15 | Furukawa Electric Co Ltd:The | Flux recovery system |
| CN101115357A (en) * | 2006-07-26 | 2008-01-30 | 有限会社横田技术 | Counter-current welding equipment and welding flux reclaiming device |
| CN201183154Y (en) * | 2008-02-19 | 2009-01-21 | 上海朗仕电子设备有限公司 | Reflow soldering furnace scaling powder flux collecting device |
-
2008
- 2008-02-19 CN CN2008100336939A patent/CN101513687B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801840A (en) * | 2014-01-28 | 2015-07-29 | 上海朗仕电子设备有限公司 | Air cooling type soldering flux gathering device for reflow soldering furnace |
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108723539A (en) * | 2018-06-04 | 2018-11-02 | 武汉倍普科技有限公司 | A kind of removing method of the smog of reflow ovens |
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| CN101513687B (en) | 2011-01-26 |
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