CN101493554B - Manufacturing method of optical waveguide device and optical waveguide connecting structure used for the same - Google Patents
Manufacturing method of optical waveguide device and optical waveguide connecting structure used for the same Download PDFInfo
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- CN101493554B CN101493554B CN2009100060904A CN200910006090A CN101493554B CN 101493554 B CN101493554 B CN 101493554B CN 2009100060904 A CN2009100060904 A CN 2009100060904A CN 200910006090 A CN200910006090 A CN 200910006090A CN 101493554 B CN101493554 B CN 101493554B
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- optical waveguide
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D5/00—Sheets united without binding to form pads or blocks
- B42D5/04—Calendar blocks
- B42D5/046—Suspension devices therefor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G5/00—Screens; Draught-deflectors
- A47G5/02—Roll-up screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D17/00—Hanging or securing devices for books, newspapers or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42P—INDEXING SCHEME RELATING TO BOOKS, FILING APPLIANCES OR THE LIKE
- B42P2241/00—Parts, details or accessories for books or filing appliances
- B42P2241/10—Means for suspending
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The present invention provides an optical waveguide device for optically coupling optical waveguide to receiving light-emitting element with excellent accuracy by simple process, and method of manufacturing the same and optical waveguide connecting structure. Preparing optical waveguide film with protruding core pattern (11) formed on the under cladding layer (10) and on the surface of sealing resin layer (7) which sealing the light-receiving element (2) mounted on base board (1) formed a recess of which the bottom being overlapped with light-receiving section (2a) of the light-receiving element (2). Through jogging the protruding core pattern (11) of optical waveguide film with the recess of sealing resin layer to couple light-receiving element (2) with optical waveguide of the optical waveguide film optically. Furthermore, utilizing the section out of the jogging section of protruding core pattern (11) covered by the upper cladding layer (13).
Description
Technical field
The present invention relates to a kind of in optical communication, optical information processing, other general optics manufacturing approach and the optical waveguide device that obtains by this manufacturing approach and the optical waveguide syndeton of in optical waveguide device, using of the optical waveguide device of widespread use.
Background technology
Usually; Optical waveguide device is propagated the light that sends from light-emitting component through optical waveguide, on the contrary, photo detector is received by optical waveguide propagate the light of coming; Thereby carry out optically-coupled (optical coupling); But when carrying out this optically-coupled, it is important that mutual optical axis is set on coaxial, and demanding bearing accuracy.
For example, proposed a kind of connector, this connector receives light-emitting component and three-dimensional light path part (being built-in with the part of optical waveguide) to carry out high-precision position involutory (with reference to patent documentation 1) between light-emitting component and the optical waveguide to receiving through combination; It is involutory and be installed on the location-plate that this receives light-emitting component and location-plate to carry out accurately the position; This three-dimensional light path part utilizes the chimeric of convex-concave and carries out with above-mentioned location-plate that the position is involutory accurately.
Patent documentation 1: TOHKEMY 2006-309113 communique
; There is following problem in this connector: at first; Need make to receive light-emitting component and location-plate to carry out that the position is involutory accurately, secondly three-dimensional light path part and above-mentioned location-plate assembled accurately the operation in two such stages, so need loaded down with trivial details labour and time, production rate variance.Also have following problems in addition: not only respectively to location-plate and the demanding machining precision of three-dimensional light path part, and both assembly precisions also are important, and it is difficult for adjustment.
Summary of the invention
The present invention In view of the foregoing makes, and its purpose is to provide a kind of can make the manufacturing approach of the optical waveguide device that receives light-emitting component and optical waveguide to carry out optically-coupled reach optical waveguide device that is obtained by this manufacturing approach and the optical waveguide syndeton of in optical waveguide device, using with high precision through simple operation.
In order to achieve the above object, the 1st technical scheme of the present invention provides a kind of manufacturing approach of optical waveguide device, and it comprises following operation: the operation of preparing on following coating, to be formed with the optical waveguide of convex core pattern; Preparation is formed with the operation of the mould of protuberance, this protuberance be used to be shaped can with the recess of the specified part tabling of the convex core pattern of above-mentioned optical waveguide; Prepare to be equipped with on the upper surface operation of the substrate that receives light-emitting component; Above-mentioned installation receive light-emitting component around dispose above-mentioned mould, make end face and the above-mentioned operation that with receiving illuminating part overlaid position that receive light-emitting component of the shaping of above-mentioned mould with protuberance; Through in above-mentioned mould, fill sealed resin material and sealed resin material solidified, form be provided with can with the operation of the sealing resin layer of the recess of the specified part tabling of the convex core pattern of above-mentioned optical waveguide; After the demoulding, the specified part of the convex core pattern through making above-mentioned optical waveguide and the recess tabling of above-mentioned sealing resin layer make the operation that receives illuminating part and optical waveguide to carry out optically-coupled that receives light-emitting component; The operation of the last coating of the remainder of the convex core pattern of the above-mentioned optical waveguide of formation covering.
In addition; The 2nd technical scheme of the present invention provides a kind of manufacturing approach of optical waveguide device; Wherein particularly as above-mentioned mould, use at least one in quartz glass and the silicon and the transparent mould that forms, when disposing above-mentioned mould; In the perspective mould, make the end face of the protuberance that is formed at mould and receive positioning of light-emitting component with receiving the illuminating part overlaid.
And the 3rd technical scheme of the present invention provides a kind of optical waveguide device, and it comprises: the optical waveguide that on following coating, is formed with convex core pattern; Be installed in the light-emitting component that receives on the upper surface of base plate; Seal the above-mentioned sealing resin layer that receives light-emitting component.Be configured on above-mentioned sealing resin layer, form the recess with the specified part tabling of the convex core pattern of above-mentioned optical waveguide with the bottom surface of recess with the above-mentioned mode that receives the illuminating part overlaid and the profile of utilizing mould to make above-mentioned recess and above-mentioned sealing resin layer is formed as one that receives light-emitting component; The specified part tabling of the recess through making above-mentioned sealing resin layer and the convex core pattern of optical waveguide; Make to receive the illuminating part and the optical waveguide of light-emitting component to carry out optically-coupled, use the remainder that coating covers the convex core pattern of above-mentioned optical waveguide.
In addition, the 4th technical scheme of the present invention provides a kind of optical waveguide syndeton, and it is used in the optical waveguide device, and it comprises: the optical waveguide that on following coating, is formed with convex core pattern; Be installed in the light-emitting component that receives on the upper surface of base plate; Seal the above-mentioned sealing resin layer that receives light-emitting component.Be configured on above-mentioned sealing resin layer, form the recess with the specified part tabling of the convex core pattern of above-mentioned optical waveguide with the bottom surface of recess with the above-mentioned mode that receives the illuminating part overlaid and the profile of utilizing mould to make above-mentioned recess and above-mentioned sealing resin layer is formed as one that receives light-emitting component; The specified part tabling of the recess through making above-mentioned sealing resin layer and the convex core pattern of optical waveguide makes to receive the illuminating part and the optical waveguide of light-emitting component to carry out optically-coupled.
In addition; In the present invention; " be shaped with the end face of protuberance ... with receive positioning of light-emitting component with receiving the illuminating part overlaid " purport be not limited to above-mentioned end face and receive the direct overlapping situation of illuminating part, also comprise both opposed situation under the state that is separated from each other.In addition; In the present invention; The bottom surface that the purport that " is configured to and receives the equitant mode of illuminating part of light-emitting component to form recess with the bottom surface of recess " likewise is not limited to above-mentioned recess with receive directly overlapping configuration of illuminating part, also comprise both opposed situation under the state that is separated from each other.
That is, the inventor is for simply and the method that receives light-emitting component and optical waveguide to carry out optically-coupled is furtherd investigate repeatedly.The result finds; Use on the one hand the optical waveguide that exposes convex core pattern, and the light-emitting component that receives on the substrate is carried out when resin-sealed, and carry out this resin-sealed the time; With with receive light-emitting component receive illuminating part relatively the mode of configuration form can with the recess of the convex core pattern tabling of above-mentioned optical waveguide; Make the convex core pattern of above-mentioned recess and optical waveguide directly chimeric, thus can be simply and make both carry out optically-coupled exactly, finally accomplished the present invention.
The manufacturing approach of optical waveguide device of the present invention as stated; Use is exposed the optical waveguide of convex core pattern as optical waveguide; And the light-emitting component that receives on the substrate is carried out when resin-sealed; With carry out this resin-sealed the time, with receive light-emitting component receive illuminating part relatively the mode of configuration form can with the recess of the convex core pattern tabling of above-mentioned optical waveguide, make the convex core pattern of above-mentioned recess and optical waveguide directly chimeric.According to this method, can be simply and make with excellent accuracy and to receive light-emitting component and optical waveguide to carry out optically-coupled through convex-concave up and down chimeric.Therefore, have and do not need such in the past loaded down with trivial details labour and time, can significantly reduce manufacturing cost and such advantage of running time.
And; In above-mentioned manufacturing approach,, use at least one in quartz glass and the silicon and the transparent mould that forms particularly as above-mentioned mould; When the above-mentioned mould of configuration; In the perspective mould, make the end face of the protuberance that is formed at mould and receive positioning of light-emitting component with receiving the illuminating part overlaid, therefore have the such advantage of positioning action in the time of can being configured mould simply.
In addition, optical waveguide device of the present invention receives concavo-convex directly chimeric each other on light-emitting component and the optical waveguide through making to be arranged at, and under the hi-Fix state, carries out optically-coupled, therefore, and propagates light expeditiously.
And, be employed in the optical waveguide syndeton of using in the above-mentioned optical waveguide device, have the loss that can reduce optically-coupled, simply and at low cost implement high efficiency light and propagate such advantage.
Description of drawings
(a) of Fig. 1 is the key diagram as the optical waveguide device manufacturing process of one embodiment of the invention, and (b) of Fig. 1 is the A-A ' cut-open view of Fig. 1 (a).
(a) of Fig. 2 is the key diagram of above-mentioned manufacturing process, and (b) of Fig. 2 is the B-B ' cut-open view of Fig. 2 (a).
Fig. 3 is the key diagram of above-mentioned manufacturing process.
(a) of Fig. 4, (b) of Fig. 4 are the key diagram of above-mentioned manufacturing process.
Fig. 5 is in above-mentioned manufacturing process, the key diagram of the variation of mounting means.
Fig. 6 is the key diagram of the manufacturing process of above-mentioned variation.
Fig. 7 is the key diagram of another embodiment of the present invention.
Embodiment
Then, be example so that light-emitting component and optical waveguide carry out the optical waveguide device of the incompatible manufacturing of optocoupler, preferred forms of the present invention is elaborated.
According to the example of this preferred forms of expression, at first shown in Fig. 1 (a), prepare the substrate 1 of tabular or sheet, after the assigned position on surface has been installed photo detector 2, around photo detector 2, dispose mould (overlook and be quadrilateral) 3 above that.(b) of Fig. 1 is the A-A ' cut-open view of Fig. 1 (a).
As the material that forms aforesaid substrate 1, for example enumerate out glass, quartz glass, silicon, resin, metal etc.In addition; Thickness according to the material of substrate 1, the suitable setting substrate 1 of desired characteristic; For example; When substrate 1 is with vibrin (PET), polycarbonate resin (PC), PEN (PEN) etc. during as the flexible printed wiring board (FPC) of base material, preferred thickness is 30～300 μ m usually; When substrate 1 is with glass plate or quartz plate during as the rigid substrates of base material, preferred thickness is 1～5mm usually.
In addition,, enumerate out unencapsulated photodiode (PD) array chip, unencapsulated phototransistor etc., in this example, use 3 light accepting part 2a that formed by photodiode are arranged in a row the array chip that forms sidewards as above-mentioned photo detector 2.Then, through wire-bonded etc. this photo detector 2 is installed on the substrate 1.Among the figure, Reference numeral 4 is closing lines.
And above-mentioned mould 3 is used for above-mentioned mounted photo detector 2 is carried out resin-sealed, therefore, comprising: the space 3a, the space 3b that is mainly used in sealed engagement line 4 and the resin inlet 5 that are mainly used in sealing photo detector 2.And, the end face of the mould 3 in above-mentioned space 3a, with the opposed respectively part of each light accepting part 2a of photo detector 2 on be provided with outstanding protuberance 6 downwards, the end face of each protuberance 6 from directly over dispose overlappingly with each light accepting part 2a of photo detector 2.
As the material of above-mentioned mould 3, for example enumerate out metal, resin, silicon, quartz glass etc., wherein, transparent moulds such as preferred quartz glass, silicon.That is has following advantage when, above-mentioned mould 3 is for transparent mould: when the location,, can confirm the end face of the protuberance 6 in the mould 3 and the equitant position of light accepting part 2a of photo detector 2 simply, position operation easily through in the perspective mould 3.
In addition, when using opaque metal die, for example, on above-mentioned mould 3 and substrate 1, alignment mark (not shown) is set respectively in advance, carries out the active contraposition through two alignment marks being made a video recording to wait from the rear side of substrate 1 as above-mentioned mould 3.At this moment, preferably directly on mould 3, engrave alignment mark, on substrate 1, form alignment mark through printing or copper facing.
And, as shown in the figure, preferred on the left and right side of the protuberance 6 of above-mentioned mould 3, pattern draft is set in advance.If use protuberance 6 with above-mentioned pattern draft; Then this gradient is copied on the left and right side of recess 8 (with reference to (a) of Fig. 2) of the sealing resin layer 7 that is shaped by this protuberance 6; Therefore; Be described below, have at core pattern 11 (with reference to Fig. 3) and embed recess 8 and when carrying out optically-coupled, embed such advantage easily the convex of optical waveguide.
In addition, the overhead height H1 of space 3b above-mentioned mould 3, that be mainly used in sealed engagement line 4 need be set at enough height, so that the closing line 4 of photo detector 2 does not contact with end face.Be in order to make above-mentioned end face can not cause broken string etc. like this, thereby carry out resin-sealed reliably because of pushing closing line 4.In addition, in the space 3a that is mainly used in sealing photo detector 2, if from and the core of the chimeric optical waveguide of recess 8 and the light propagation efficiency between the light accepting part 2a consider protuberance 6 end faces among the 3a of space and the clearance gap H between the light accepting part 2a
2More little good more, be preferably set to 0～50 μ m usually.In addition, be described below, as above-mentioned H
2=0 o'clock, on light accepting part 2a, do not form resin-sealed layer, core pattern 11 directly embeds the upper surface (with reference to Fig. 7) of light accepting part 2a.
Then,, form sealing resin layer 7, carry out the demoulding through sealed resin material being filled in the above-mentioned mould 3 and sealed resin material being solidified.So, shown in Fig. 2 (a), photo detector 2 is by sealing resin layer 7 sealing, and sealing resin layer 7 upper surfaces can obtain to be formed with following be used for the recess 8 of the convex core pattern tabling of optical waveguide in the middle of article.In addition, Fig. 2 (b) is the B-B ' cut-open view of Fig. 2 (a).
As above-mentioned sealed resin material; Usually the suitable material that adopts the formation sandwich layer that is widely used as optical waveguide; For example, can enumerate out heat-curing resins such as photoresists such as photonasty epoxy resin, photosensitive polyimide resin, photonasty polyamide, photonasty silicone, non-photosensitive epoxy resin, polyimide resin.Above-mentioned material is dissolved into solvent and usually as varnish (varnish).Use, wherein, preferably used the varnish of photonasty epoxy resin.
And when using photoresist, the irradiation of ultraviolet ray point is adopted in the curing of above-mentioned sealed resin material usually.The ultraviolet irradiation amount is generally 100～5000mJ/cm
2, be preferably 2000～3000mJ/cm
2In addition, irradiation time is 1～3 second.In addition, when using non-photosensitive heat reactive resin such as polyimide resin, the heat treated through 300～400 ℃ * 60～180 minutes makes its curing usually.
On the other hand, as shown in Figure 3, the core pattern 11 that constitutes through the core that forms by 3 convexs that extend in parallel, thus on the one side of the following coating 10 of elongated film like, make the optical waveguide film.Then, coating be not set on the above-mentioned core pattern 11, is making core pattern 11 keep being the state that convex is exposed.
Above-mentioned down coating 10 is films that the material by coating under common formation such as photoresist, polyimide resin, epoxy resin forms, the not special qualification of its thickness.
In addition; The material that forms above-mentioned core pattern 11 also can be the material of common formation sandwich layer such as photoresist, polyimide resin, epoxy resin, and the refractive index of the convex core of core pattern 11 must be greater than above-mentioned coating 10 down and the following refractive index that goes up coating 13 (with reference to (b) of Fig. 4).For example, through select to form above-mentioned coating 10 down, core pattern 11, go up coating 13 various materials kind or adjust the composition of above-mentioned various materials, can adjust above-mentioned refractive index.
And; Form not special qualification of method of above-mentioned core pattern 11, for example will form the varnish that the resin dissolves of the material of core forms in the solvent, be coated on the above-mentioned upper surface that descends coating 10 through spin-coating method, infusion process, casting method, injection, ink-jet method etc. after; Through photoetching process etc. predetermined pattern is copied to coated varnish; Coated varnish is developed, remove the no part of varnish, thereby can obtain core pattern 11.
The thickness of above-mentioned core pattern 11 is not special to be limited, but recess 8 tablings on the sealing resin layer 7 of the resin seal that must consider to utilize the convex form of core pattern 11 and be located at above-mentioned photo detector 2.
For example; As shown in Figure 3; To be configured with respect to the vertically upright state of substrate 1 that is equipped with by resin-sealed above-mentioned photo detector 2, shown in Fig. 4 (a), the end face of this core pattern 11 embeds in the recess 8 of sealing resin layer 7 with the optical waveguide film that obtains like this.Then, 3 light accepting part 2a with above-mentioned photo detector 2 are relative respectively for the top ends of 3 convex cores through making above-mentioned core pattern 11, can under the state of accurate location, carry out the optically-coupled of optical waveguide film and photo detector 2.
Under this state; The coating that for example in the past was widely used as optical waveguide is formed the resin material of the resin material of material as fitting portion sealing usefulness; Be injected in the above-mentioned fitting portion, and it is solidified, thereby the end face and the chimeric of recess 8 of core pattern 11 are fixed.Then, with above-mentioned same, use the coating that for example in the past was widely used as optical waveguide to form the resin material of material, cover optical waveguide part film, that core pattern 11 exposes and it is solidified, shown in Fig. 4 (b), coating 13 in the formation.Optical waveguide film that so, can obtain core pattern 11 is covered by following coating 10 and last coating 13 and photo detector 2 carry out optically-coupled and the optical waveguide device that forms.In addition, in (b) of Fig. 4, Reference numeral 12 is represented the firming body to the chimeric resin material of fixing of the end face of above-mentioned core pattern 11 and recess 8.
As above-mentioned fitting portion sealing resin material; For example, can enumerate out heat-curing resins such as photoresists such as photonasty epoxy resin, photosensitive polyimide resin, photonasty polyamide, photonasty silicone, non-photosensitive epoxy resin, polyimide resin.Usually above-mentioned material is dissolved in the solvent and uses as varnish.Wherein, preferably used the varnish of photonasty epoxy resin.
In addition, be used to form the above-mentioned resin material of going up coating 13 and also can enumerate out material same as described above.But,, preferably set the refractive index of the refractive index of the above-mentioned upward light of coating 13 less than the light of above-mentioned core in order to suppress loss from the light of the core ejaculation that constitutes core pattern 11.
The optical waveguide device that obtains like this can make photo detector 2 and both mutual optical axises carried out carrying out optically-coupled under the involutory state in position with high precision as the core pattern 11 of optical waveguide; Therefore; The light loss of optically-coupled portion is less, expeditiously propagates light.
And, adopt the manufacturing approach of above-mentioned optical waveguide device, can chimericly realize that simply above-mentioned high-precision position is involutory through concavo-convex, therefore produce above-mentioned high-quality optical waveguide device, good practical effect with can not spending labour and short time.
In addition, in above-mentioned example, the optical waveguide film is configured to perpendicular to the substrate that photo detector 2 is installed 1, the end face of the core pattern 11 of optical waveguide film is embedded in the recess 8 of the sealing resin layer 7 that seals photo detector 2, thereby make both tablings.But chimeric mode is not limited thereto, and can set suitable mode.
For example; As shown in Figure 5; Also can the optical waveguide film be configured to be parallel to the substrate 1 that photo detector 2 is installed, the length direction of recess 8 of length direction and the sealing resin layer 7 of sealing photo detector 2 that makes the core pattern 11 of optical waveguide film be carry out under the state of equidirectional chimeric.Chimeric state is as shown in Figure 6.At this moment, utilize the optically-coupled of this fitting portion, can with above-mentioned example propagates light expeditiously likewise.
In addition; In above-mentioned example, covered the upper surface of photo detector 2 fully with sealing resin layer 7, utilize the thickness of sealing resin bed 7 to form concavo-convex; Thereby the recess 8 of core pattern 11 tablings of setting and optical waveguide film; But as shown in Figure 7, with predetermined distance sealing resin layer 7 is set as the muscle shape at the upper surface of photo detector 2, with the upper surface of photo detector 2 as also no problem with the bottom surface of the recess 8 of core pattern 11 tablings of optical waveguide film.This example is as stating, the H in (b) of Fig. 1
2=0 o'clock example.
And, in above-mentioned example, used the optical waveguide film as optical waveguide; But; Even when using whole no flexible, tabular etc. optical waveguide, identical with above-mentioned example, the core pattern 11 of convex is set on the surface of the optical waveguide of tabular grade; Recess 8 tablings of the sealing resin layer 7 on the core pattern 11 that makes convex and the upper surface that is formed at photo detector 2 can obtain the effect identical with above-mentioned example.
In addition, in above-mentioned example, make the photo detector 2 of the array type that is provided with a plurality of light accepting part 2a carry out a plurality of optically-coupled simultaneously, but also can make single optical waveguide and single light accepting part 2a carry out optically-coupled with core pattern 11 tablings of a plurality of raised lines extensions.
And; Above-mentioned example is that the present invention is applied in the example of making in the method for optical waveguide device that the core pattern 11 make photo detector 2 and optical waveguide film etc. carries out optically-coupled; But do not limit therewith, can be applied in yet and make in the method for optical waveguide device that the core pattern 11 make light-emitting component and optical waveguide film etc. carries out optically-coupled.
Then, embodiment is described.But the present invention is not limited to following embodiment.
Embodiment
The preparation of optical waveguide film
As the optical waveguide film that is used for propagating optical signal, be ready on the surface of the following coating that the epoxy resin that by thickness is 20 μ m constitutes, be formed with line width/spacing (Line/Space)=50 μ m/125 μ m, highly be the optical waveguide film of the convex core pattern of 80 μ m.
The installation of photo detector
Use with thickness be the polyimide resin sheet of 50 μ m as the flexible circuit board (FPC) of base material as substrate, will be connected on the substrate assigned position and install as the unencapsulated PD array chip of photo detector (being spaced apart between light accepting part 62.5 μ m * 50 μ m, the adjacent light accepting part 125 μ m) through wire-bonded.
The preparation of mould
Through polymethylmethacrylate (PMMA resin) is flowed in the ultraprecise metal die, prepared the transparent resin mould.In this mould, be provided with the sealing of resin inlet, wire-bonded and use the space, seal in aforementioned body and be formed with the downward protuberance (with reference to Fig. 1) that has with the opposed end face of illuminating part of photo detector on the end face with the mould in the space with space, photo detector body seal.
The modulation of sealed resin material
With two Phenoxyethanol fluorenyl glycidol ethers (composition A): 70 weight portions, 1; 3; 3-three { 4-[2-(3-oxetanes)] butoxy phenyl } butane: 30 weight portions, 4; 4 '-(light acid propellant: composition B): 0.5 weight portion is dissolved in the lactic acid ethane of 28 weight portions, is modulated into sealed resin material for the 50% propylene carbonate solution of two [two (β hydroxyl-oxethyl) phenyl thionyl] phenyl sulfuric acid-two-hexafluoro antimonate.
The sealing of photo detector
Then, cover with above-mentioned mould the photo detector that is installed on the substrate around, inject above-mentioned sealed resin material and make its curing from the resin inlet of mould, thus sealing photo detector and closing line.After making the solidfied material demoulding, can obtain by article (with reference to Fig. 2) in the middle of the resin-sealed photo detector.
The modulation of fitting portion sealing resin material
Through with mentioned component A:35 weight portion, (3 '; 4 '-7-oxa-bicyclo[4.1.0) methyl 3 '; 4 '-the epoxycyclohexyl carboxylate: (Daicel chemical industrial company makes for 40 weight portions, alicyclic epoxy resin; CELLOXIDE2021P): 25 weight portions and mentioned component B:1 weight portion mix, and are modulated into following fitting portion sealing resin material.
Concavo-convex chimeric and sealing and fixing
Then; The optical waveguide film that above-mentioned convex core pattern is exposed with by article arranged perpendicular in the middle of the resin-sealed above-mentioned photo detector; Embed in the recess on the upper surface of being located at sealing resin layer through the convex core pattern that makes the optical waveguide film; Thereby make both tablings, under the involutory state in position accurately, make the optical waveguide of optical waveguide film and the light accepting part of photo detector carry out optically-coupled.Then, with under the above-mentioned fitting portion sealing resin droplets of material in the fitting portion between convex core pattern and the recess, and carry out ultraviolet ray point irradiation and make its curing, and with above-mentioned fitting portion sealing and fixing.
The protection of optical waveguide film
Then; The identical resin material of material that will be modulated into being used for above-mentioned optically-coupled portion's sealing drips and the incorporate optical waveguide film of photo detector; After utilizing the spin coated machine all to be coated with slightly; Through the ultraviolet ray irradiation it is solidified, formed the last coating that covers the convex core pattern that separates.Like this, can obtain optical waveguide device as purpose.
Can know, 60～90% of the light quantity of the light quantity that incides photo detector via optical waveguide when transferring core fully through the active contraposition, the coupling loss of light is little, quality is high.
Claims (4)
1. the manufacturing approach of an optical waveguide device is characterized in that, it comprises following operation: the operation of preparing on following coating, to be formed with the optical waveguide of convex core pattern; Preparation is formed with the operation of the mould of protuberance, this protuberance be used to be shaped can with the recess of the specified part tabling of the convex core pattern of above-mentioned optical waveguide; Prepare to be equipped with on the upper surface operation of the substrate that receives light-emitting component; Above-mentioned installation receive light-emitting component around dispose above-mentioned mould, make end face and the above-mentioned operation that with receiving illuminating part overlaid position that receive light-emitting component of the shaping of above-mentioned mould with protuberance; Through in above-mentioned mould, fill sealed resin material and sealed resin material solidified, form be provided with can with the operation of the sealing resin layer of the recess of the specified part tabling of the convex core pattern of above-mentioned optical waveguide; After the demoulding, the specified part of the convex core pattern through making above-mentioned optical waveguide and the recess tabling of above-mentioned sealing resin layer make the operation that receives illuminating part and optical waveguide to carry out optically-coupled that receives light-emitting component; The operation of the last coating of the remainder of the convex core pattern of the above-mentioned optical waveguide of formation covering.
2. the manufacturing approach of optical waveguide device according to claim 1 is characterized in that,
As above-mentioned mould, use at least one in quartz glass and the silicon and the transparent mould that forms, when the above-mentioned mould of configuration, in the perspective mould, make the end face that is formed at the protuberance on the mould and receive positioning of light-emitting component with receiving the illuminating part overlaid.
3. an optical waveguide device is characterized in that, comprising: the optical waveguide that on following coating, is formed with convex core pattern; Be installed in the light-emitting component that receives on the upper surface of base plate; Seal the above-mentioned sealing resin layer that receives light-emitting component; Be configured on above-mentioned sealing resin layer, form the recess with the specified part tabling of the convex core pattern of above-mentioned optical waveguide with the bottom surface of recess with the above-mentioned mode that receives the illuminating part overlaid and the profile of utilizing mould to make above-mentioned recess and above-mentioned sealing resin layer is formed as one that receives light-emitting component; The specified part tabling of the recess through making above-mentioned sealing resin layer and the convex core pattern of optical waveguide; Make to receive the illuminating part and the optical waveguide of light-emitting component to carry out optically-coupled, use the remainder that coating covers the convex core pattern of above-mentioned optical waveguide.
4. an optical waveguide syndeton is used in the optical waveguide device, it is characterized in that, comprising: the optical waveguide that on following coating, is formed with convex core pattern; Be installed in the light-emitting component that receives on the upper surface of base plate; Seal the above-mentioned sealing resin layer that receives light-emitting component; Be configured on above-mentioned sealing resin layer, form the above-mentioned recess with the specified part tabling of the convex core pattern of above-mentioned optical waveguide with the bottom surface of recess with the above-mentioned mode that receives the illuminating part overlaid and the profile of utilizing mould to make above-mentioned recess and above-mentioned sealing resin layer is formed as one that receives light-emitting component; The specified part tabling of the recess through making above-mentioned sealing resin layer and the convex core pattern of optical waveguide makes to receive the illuminating part and the optical waveguide of light-emitting component to carry out optically-coupled.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008011886A JP4881329B2 (en) | 2008-01-22 | 2008-01-22 | Optical waveguide device manufacturing method, optical waveguide device obtained thereby, and optical waveguide connection structure used therefor |
| JP2008011886 | 2008-01-22 | ||
| JP2008-011886 | 2008-01-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101493554A CN101493554A (en) | 2009-07-29 |
| CN101493554B true CN101493554B (en) | 2012-10-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100060904A Expired - Fee Related CN101493554B (en) | 2008-01-22 | 2009-01-22 | Manufacturing method of optical waveguide device and optical waveguide connecting structure used for the same |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7760981B2 (en) |
| JP (1) | JP4881329B2 (en) |
| KR (1) | KR20090080902A (en) |
| CN (1) | CN101493554B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7920431B2 (en) | 2008-06-02 | 2011-04-05 | Micron Technology, Inc. | Asynchronous/synchronous interface |
| US7976740B2 (en) * | 2008-12-16 | 2011-07-12 | Microsoft Corporation | Fabrication of optically smooth light guide |
| FI124221B (en) * | 2009-04-24 | 2014-05-15 | Valtion Teknillinen | User Feed Arrangement and Related Production Method |
| JP2014182202A (en) | 2013-03-18 | 2014-09-29 | Fujitsu Ltd | Electronic equipment, and optical connector |
| KR101628777B1 (en) * | 2013-11-29 | 2016-06-16 | 티엔에스(주) | A plastic injection mold and method for manufacturing polymer substrate |
| CN114683463A (en) * | 2022-03-28 | 2022-07-01 | 业成科技（成都）有限公司 | Optical waveguide jig and preparation method of optical waveguide |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1022822A1 (en) * | 1998-08-05 | 2000-07-26 | Seiko Epson Corporation | Optical module and method of manufacture thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885579A (en) | 1981-11-17 | 1983-05-21 | Matsushita Electric Ind Co Ltd | Semiconductor device and manufacture thereof |
| JPS63280206A (en) * | 1987-05-13 | 1988-11-17 | Nec Corp | Optical connection circuit |
| JP3311641B2 (en) * | 1997-05-30 | 2002-08-05 | 矢崎総業株式会社 | Terminal and connection structure between terminal and electric wire |
| JPH11202158A (en) | 1998-01-20 | 1999-07-30 | Nippon Telegr & Teleph Corp <Ntt> | Optical element |
| JP2001156377A (en) * | 1999-11-25 | 2001-06-08 | Toshiba Corp | Optical-fiber output semiconductor device |
| JP2002062459A (en) | 2000-08-21 | 2002-02-28 | Toshiba Corp | Optical module device |
| JP3952722B2 (en) * | 2001-10-03 | 2007-08-01 | 富士ゼロックス株式会社 | OPTICAL WIRING BOARD, OPTICAL BUS SYSTEM, AND OPTICAL WIRING BOARD MANUFACTURING METHOD |
| JP4062403B2 (en) | 2001-11-06 | 2008-03-19 | セイコーエプソン株式会社 | Manufacturing method of optical module |
| JP3994839B2 (en) * | 2002-09-25 | 2007-10-24 | 住友電気工業株式会社 | Optical module |
| JP2005331535A (en) * | 2004-05-18 | 2005-12-02 | Sony Corp | Optical waveguide, its manufacturing method, optical coupler, its manufacturing method |
| JP4705432B2 (en) | 2005-03-28 | 2011-06-22 | 富士通コンポーネント株式会社 | connector |
-
2008
- 2008-01-22 JP JP2008011886A patent/JP4881329B2/en not_active Expired - Fee Related
-
2009
- 2009-01-21 KR KR1020090004934A patent/KR20090080902A/en not_active Application Discontinuation
- 2009-01-22 US US12/357,748 patent/US7760981B2/en not_active Expired - Fee Related
- 2009-01-22 CN CN2009100060904A patent/CN101493554B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1022822A1 (en) * | 1998-08-05 | 2000-07-26 | Seiko Epson Corporation | Optical module and method of manufacture thereof |
Non-Patent Citations (7)
| Title |
|---|
| JP昭58-85579A 1983.05.21 |
| JP昭63-280206A 1988.11.17 |
| JP特开2002-62459A 2002.02.28 |
| JP特开2003-114353A 2003.04.18 |
| JP特开2003-140008A 2003.05.14 |
| JP特开2004-117708A 2004.04.15 |
| JP特开平11-202158A 1999.07.30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4881329B2 (en) | 2012-02-22 |
| JP2009175275A (en) | 2009-08-06 |
| CN101493554A (en) | 2009-07-29 |
| KR20090080902A (en) | 2009-07-27 |
| US20090185775A1 (en) | 2009-07-23 |
| US7760981B2 (en) | 2010-07-20 |
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