CN101489372A

CN101489372A - Protection cover manufacturing method capable of preventing electromagnetic wave interference

Info

Publication number: CN101489372A
Application number: CNA2008100011509A
Authority: CN
Inventors: 郑育仁
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-01-17
Filing date: 2008-01-17
Publication date: 2009-07-22

Abstract

The present invention relates to a method for manufacturing a protecting cover which can prevent the electromagnetic wave interference, wherein the method comprises the following steps: preparing a mold; executing compression fitting with the mold to the plastic film which is formed with a base board, side boards and dividing strips for forming the casing with a protecting cover; and plating the metal coating layer on the surface of casing. Therefore the mutual interference of electromagnetic wave of each module in different areas can be effectively prevented.

Description

Can prevent the over cap manufacture method of Electromagnetic Interference

Technical field

The present invention refers to a kind of over cap manufacture method that prevents Electromagnetic Interference especially about a kind of over cap.

Background technology

Communication products mostly is the high frequency product greatly, and each electronic building brick of portion is easy to generate electromagnetic waves within it, produces the electromagnetic wave of mutual interference mutually between the electronic building brick that closes or the module and influences signal transmission quality for fear of hardening with machine; The general masking structure that can prevent Electromagnetic Interference that all coats around each electronic building brick or module is with head it off.

The known masking structure manufacture method that prevents Electromagnetic Interference, mainly on the machine plate that is laid with most electronic building bricks, make cover cap with corresponding respectively each electronic building brick of most metal cover bodies, be coated with tin cream during making on the part copper foil circuit of machine plate, the end face with each metal cover body amplexiforms corresponding to aforementioned copper foil circuit and tin cream again; Afterwards, the machine plate and the combining structure of each metal cover body sent in the brazier combine with surface adhering technology (SMT), solid welding is connected on the machine plate by tin cream to make each metal cover body; So, can finish the combination of machine plate and cover body.

Yet, the known masking structure manufacture method that prevents Electromagnetic Interference, on using, reality still has following problem points, because it engages each metal cover body one by one with the machine plate, need amplexiform work do contraposition with great amount of manpower, and carry out combination, produce during the course and also can't dismantle separation once more when bad with welding manner, handle in the mode of scrapping often, and make manufacturing cost high; It is with the metal cover body each electronic building brick to be made cover cap in addition, and not only the combining structure that material cost is high and whole is also quite heavy, and can not meet the lightness requirement of electronic product; Really remain to be improved.

Summary of the invention

In view of this, one object of the present invention is to provide a kind of over cap manufacture method that prevents Electromagnetic Interference, can prevent each the module electromagnetic wave phase mutual interference in the zones of different effectively.

Another object of the present invention is to provide a kind of over cap manufacture method that prevents Electromagnetic Interference, can reach the effect of lightweight and easy machine-shaping.

In order to reach above-mentioned purpose, the invention provides a kind of over cap manufacture method that prevents Electromagnetic Interference, step comprises:

Mould is provided;

Plastic film is provided, plastic film is done pressing, on this plastic film, form base plate, coaming plate and divider, form the housing of over cap with this mould; And

The metal coating layer is being plated on the surface of this housing.

As can be seen from the above technical solutions, the over cap manufacture method that prevents Electromagnetic Interference of the present invention, first: it has two or more area of isolation by straight forming on the housing of over cap, can prevent each the module electromagnetic wave phase mutual interference in the zones of different effectively; Second: it utilizes the integral structure of housing, can shorten significantly to make flow process and reduce cost; The 3rd: it is a plastic material by housing, and reaches the effect of lightweight and easy machine-shaping; The 4th: it combines in the packing mode with the machine plate by housing, and between is folded with conducting resinl, to overcome housing end face out-of-flatness problem and to have the effect of being repeatedly used.

Description of drawings

Fig. 1 is a making flow chart of the present invention;

Fig. 2 is that plastic film of the present invention is inserted the sectional view in the mould;

Fig. 3 is subjected to the sectional view of mould pressing and forming for plastic film of the present invention;

Fig. 4 carries out the sectional view of processing of cutting for the housing of over cap of the present invention;

Fig. 5 is the stereogram after the housing moulding of the present invention;

Fig. 6 is an over cap stereogram of the present invention;

Fig. 7 is over cap of the present invention and mobile phone machine plate three-dimensional exploded view;

Fig. 8 is over cap of the present invention and mobile phone machine plate combination schematic diagram;

Fig. 9 is the cutaway view along the 9-9 line of Fig. 8.

Description of reference numerals

Plastic film 10 housings 1

Base plate 11 coaming plates 12

Divider 13 area of isolation 14

Lug 15 cylindrical column 16

Fixing hole 17

Metal coating layer 20

Cover pad 30

Conducting resinl 40

Mobile phone machine plate 5

Copper foil circuit 51 wireless modules 52

Mould 6

Upper module 61 protuberances 611

Lower module 62 recessed grooves 621

Embodiment

Relevant detailed description of the present invention and technology contents, conjunction with figs. is described as follows, however appended accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.

The over cap of the prevented Electromagnetic Interference that the present invention makes, it mainly comprises housing 1 and metal coating layer 20, wherein, housing 1 is made by plastic material.

Please refer to Fig. 1 to shown in Figure 6, the invention provides a kind of over cap manufacture method that prevents Electromagnetic Interference, its step comprises:

A), provide mould 6 (as shown in Figure 2); In this step, this mould 6 is made up of upper module 61 and lower module 62, is processed with the recessed groove 621 of over cap shape in lower module 62 inside, in addition then convexes with protuberance 611 with recessed groove 621 mutual corresponding matching at upper module 61 bottom end faces; Aforesaid upper and

lower module

61,62 can be installed respectively and be fixed on the pressing machine (not shown).

B), plastic film 10 is provided, do pressing with 6 pairs of plastic films 10 of this mould, on this plastic film 10, form base plate 11, coaming plate 12 and divider 13, whereby, form the housing 1 of over cap; In this step, earlier plastic film 10 is inserted lower module 62 inside (as shown in Figure 2), these plastic film 10 materials are good with polystyrene (PS), Merlon (PC), acrylonitrile-butadiene-styrene (ABS) (ABS), polypropylene (PP), polyethylene terephthalate (PET), polyether-ether-ketone (PEEK), polytetrafluoroethylene (PTFE) or polyimides (PI).Secondly, impose by the action of pressing machine and to upper and

lower module

61,62 and to heat, and make upper module 61 move, and the protuberance 611 of upper module 61 is pressed on plastic film 10 in the hot pressing mode towards the direction of lower module 62; Then plastic film 10 is pressed into the recessed groove 621 interior (as shown in Figure 3) of lower module 62, and on aforesaid plastic film 10, form base plate 11 (as shown in Figure 5), at the base plate 11 peripheries bending forming that makes progress closed coaming plate 12 is arranged, on the base plate 11 of coaming plate 12 inside, form two or more divider 13, the height of these dividers 13 flushes with the height of coaming plate 12, so as to being formed with two or more closed area of isolation 14 at base plate 11,

coaming plate

12 and 13 of dividers, and not connected each other between each area of isolation 14.In addition, on divider or part divider 13, form cylindrical column 16 (as shown in Figure 5) simultaneously.

C), tool is provided, with this tool this housing 1 is cut or punching (as shown in Figure 4); In this step, this housing 1 is via after abovementioned steps hot-forming, the end face outer peripheral edges that make coaming plate 12 are produced concavo-convex uneven phenomenon, the outer peripheral edges of coaming plate 12 end faces are carried out processing of cutting, form two or more lugs 15 simultaneously with instrument of cutting or tool (not shown).In addition, also can be by the design of tool, in the process of cutting, the lug 15 of this housing 1 and cylindrical column 16 central authorities are dashed be provided with two or more fixing holes 17 in the lump.

D), metal coating layer 20 is being plated on the surface of this housing 1 (as shown in Figure 5); In this step, metal coating layer 20 is being plated on the inside or outer surface of base plate 11, coaming plate 12 and divider 13 with sputtering way.

E), will cover the surface, inside (as shown in Figure 5) that pad 30 is adhered to this housing 1; In this step, each base plate 11 position of covering 30 pairs of housings 1 of pad with insulation such as adhesive tapes are pasted and are covered; This step can be implemented before step d) or afterwards, and present embodiment is after step d); Do not produce recess so as to the base plate 11 that makes housing 1, or the electronic building brick (not shown) that order is located in each area of isolation 14 is subjected to amplexiforming of base plate 11 and does not cause short circuit phenomenon.

F), conducting resinl 40 is adhered on this coaming plate 12 and this divider 13 end faces (as shown in Figure 6); In this step, utilize screen painting method, a pouring curtain rubbing method, spraying process, pressure sintering or dotting glue method to be adhered on the end face of coaming plate 12 and divider 13 with conducting resinl 40.

Please refer to Fig. 7 to shown in Figure 9; be respectively the three-dimensional exploded view, combination schematic diagram of over cap of the present invention and mobile phone machine plate and along the cutaway view of the 9-9 line of Fig. 8; over cap of the present invention can be in order to make up with mobile phone machine plate 5; but do not exceed with this kind of machine plate; on the plane of this mobile phone machine plate 5, form closed copper foil circuit 51; and this copper foil circuit 51 cooperatively interacts with aforesaid coaming plate 12 peripheral shapes; be laid with most wireless modules 52 in addition on mobile phone machine plate 5, each wireless module 52 is made of various electronic building brick respectively.During combination with plastic film 10 cover caps on mobile phone machine plate 5, and make conducting resinl 40 do to attach contact corresponding to copper foil circuit 51; At last, wear aforesaid each fixing hole 17 with fixation kit (not shown)s such as screws again, be fixed on the mobile phone machine plate 5, and between plastic film 10 and mobile phone machine plate 5, be formed with the effect that presses packing and be spirally connected; So, can significantly promote this over cap electromagnetic wave is prevented effect.

Claims

1, a kind of over cap manufacture method that prevents Electromagnetic Interference is characterized in that, comprising:

Mould is provided;

The metal coating layer is being plated on the surface of this housing.

2, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1; it is characterized in that; in the described step that mould is provided; described mould comprises upper module and lower module; form recessed groove in this lower module inside, in addition convex with protuberance with the mutual corresponding matching of this recessed groove at this upper module bottom end face.

3, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, describedly plastic film is done in the step of pressing with this mould, adopts the hot pressing mode.

4, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1; it is characterized in that; describedly plastic film is done in the step of pressing with this mould, described plastic film is any in polystyrene, Merlon, acrylonitrile-butadiene-styrene (ABS), polypropylene, polyethylene terephthalate, polyether-ether-ketone, polytetrafluoroethylene or the polyimides.

5, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, describedly plastic film is done in the step of pressing with this mould, and described coaming plate is closed.

6, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, describedly plastic film is done in the step of pressing with this mould, and the height of described divider flushes with the height of described coaming plate.

7, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1; it is characterized in that; describedly plastic film is done in the step of pressing with this mould; be formed with two or more area of isolation between described base plate, described coaming plate and described divider, respectively not connected each other between this area of isolation.

8, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, describedly plastic film is done form cylindrical column on the described divider simultaneously in the step of pressing with this mould.

9, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, describedly with this mould plastic film is done also to comprise tool is provided after the pressing step, this housing is cut or the step of punching with this tool.

10, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 9 is characterized in that, described with this tool this housing is cut or the punching step after, also comprise being adhered to the step on surface, inside of this housing with covering pad.

11, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 10 is characterized in that, the described pad that will cover is adhered in the step on surface, inside of this housing, covers pad with insulation and described base plate is pasted is covered.

12, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, described the metal coating layer is being plated in the step on the surface of this housing, is plating with sputtering way.

13, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 12; it is characterized in that; described the metal coating layer is being plated in the step on the surface of this housing, described metal coating layer is plating on the surface, inside of this base plate, this coaming plate and this divider.

14, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 12; it is characterized in that; described the metal coating layer is being plated in the step on the surface of this housing, described metal coating layer is plating on the outer surface of this base plate, this coaming plate and this divider.

15, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, described the metal coating layer is being plated after this housing step, also comprises being adhered to the step on the surface, inside of this housing with covering pad.

16, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 15 is characterized in that, the described pad that will cover is adhered in the step on surface, inside of this housing, covers pad with insulation and described base plate is pasted is covered.

17, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 1 is characterized in that, described the metal coating layer is being plated after the step on the surface of this housing, also comprises the step that conducting resinl is adhered to this coaming plate and this divider end face.

18, the over cap manufacture method that prevents Electromagnetic Interference as claimed in claim 17; it is characterized in that; in the described step that conducting resinl is adhered to this coaming plate and this divider end face, described conducting resinl is adhered with screen painting method, any mode of drenching in a curtain rubbing method, spraying process, pressure sintering or the dotting glue method.