CN110424014A - Plastic products and plastic basis material surface selective metallization method - Google Patents
Plastic products and plastic basis material surface selective metallization method Download PDFInfo
- Publication number
- CN110424014A CN110424014A CN201910696729.XA CN201910696729A CN110424014A CN 110424014 A CN110424014 A CN 110424014A CN 201910696729 A CN201910696729 A CN 201910696729A CN 110424014 A CN110424014 A CN 110424014A
- Authority
- CN
- China
- Prior art keywords
- plastic
- plastic membrane
- binder course
- membrane product
- activating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of plastic membrane product, and at least three-layer metal film, respectively binder course, chemosphere and protective layer are deposited on the plastic membrane product；The binder course is by combining plastic layer and forming in conjunction with metal layer；The binder course with a thickness of 2-500nm.
Description
Technical field
The present invention relates to a kind of method for processing plastic surface, are more related to plastic membrane product and the choosing of plastic basis material surface
Selecting property method for metallising.
Background technique
Frosting, which carries out the common method of metalized modified, to be had: gold doping in chemical treatment, Vacuum Deposition, spraying plating and material
Belong to powder or metal salt etc..The metal film coating that Vacuum Deposition, spraying plating obtain is very thin, electric conductivity, shielding properties and wear-resisting property
It is poor；The method that metal powder or metal salt are mixed in high molecular material is troublesome in poeration, at high cost, and decorative performance is poor, using few；
Method of chemical treatment is common method, and application is wider, have decorative strong, binding force is good, excellent electric conductivity, metal layer thickness can
The advantages that control.
It can be metallized by electroless plated metal method by the product that non-conductance plastics manufacture.In the method, the system
Product are cleaned first and etch, then handled with noble metal and finally metallize.The etching is usually carried out by chromatosulfuric acid.Erosion
It carves for making the surface of product be easy to receive subsequent metallization, so that the surface of product is in being followed by subsequent processing step with corresponding
Solution soaks well, and deposited metal finally has sufficiently tight attachment on the surface.
Chemical nickel belongs to self-catalysis system, especially sensitive to Metal Palladium, easy selfdecomposition, and frosting metal at this stage
Changing just is to make catalyst using Metal Palladium compared with mature technology, this is very high to the technology stability requirement of chemical sinking nickel, careless slightly
It will cause solution decomposition, therefore chemical nickel stabilizer must be added in use.And chemical nickel conventional now is stablized
Agent is all made of the high contamination type heavy metal such as lead, cadmium, mercury, thallium, this does not meet the environmental requirement of today's society.
There are significant limitation, most of electroless coatings for the practical application of the plastics existing in the prior art to metallize
The plating grade plastics that the common plastics of grade cannot achieve metallization, and can metallize, can only all metallize, it is difficult to realize metal
The selectivity of change, the technical issues of influencing industry development.Such as such as PC, PET, PMMA plastics, it is difficult to realize metallization, and right
In conventional plating grade plastics, also its surface can only all be metallized, it is difficult to realize the selectivity of metallization.
Summary of the invention
The present invention provides a kind of plastic membrane product, and at least three-layer metal film is deposited on the plastic membrane product,
Respectively binder course, chemosphere and protective layer；The binder course is by combining plastic layer and forming in conjunction with metal layer；
The binder course with a thickness of 2-500nm.
As one embodiment of the present invention, the binder course with a thickness of 2-50nm.
As one embodiment of the present invention, the plastic film with a thickness of 2-1000 μm.
As one embodiment of the present invention, the plastic film with a thickness of 2-100 μm.
The second aspect of the present invention provides the preparation method of above-mentioned plastic membrane product, and the method includes walking as follows
It is rapid:
The method that S01 uses Vacuum Deposition, metallizes in non-metal layer surface, forms binder course；
S02 forms chemosphere by the way of chemical plating, on the surface of binder course；
S03 forms protective layer by the way of electroplated metallization, on the surface of chemosphere.
As one embodiment of the present invention, the plating steps of the chemical plating include at least copper facing and following steps group
It is one or more in conjunction；
The step combination includes:
It is bulk, remove glue, neutralization, adjustment, activating pretreatment, activation, activating and reducing.
As one embodiment of the present invention, the plating steps of the chemical plating include at least copper facing and following steps group
It is one or more in conjunction；
The step combination includes: activation, activating and reducing.
As one embodiment of the present invention, the metallic film prepares raw material in Ni, Co, Cr, Mn, Cu
It is one or more.
As one embodiment of the present invention, the raw material for preparing of the binder course is selected from one of Ni, Co, Cr, Mn
Or it is a variety of.
Plastic membrane product is prepared described in the third aspect of the present invention offer, is applied to electromagnetic signal and conducts field.
The utility model has the advantages that a kind of plastic products of the present invention, by described for contacting to the plastic film bottom
The face of the coat of metal is handled, and the bond strength of plastic film bottom and metal is improved, to realize metal layer and modeling
Expect good adhesion property between film substrate, using two layers of coating structure, improves production efficiency, reduce production cost.
Specific embodiment
In conjunction with preferred implementation method of the invention below detailed description and including embodiment can be further understood that this hair
Bright content.Unless otherwise indicated, all technologies used herein and scientific term all have general with the application fields
Logical technical staff's is generally understood identical meaning.If mentioned in the definition and the application of the concrete term disclosed in the prior art
Any definition supplied is inconsistent, then term provided herein of being subject to defines.
It is used in the present context, unless being clearly dictated in context, otherwise without the spy of the single plural form of restriction
Sign is also intended to the feature including plural form.It will also be appreciated that term as used herein " by ... preparation " it is synonymous with "comprising",
" comprising ", " including ", " having ", "comprising" and/or " including " indicate stated group when used in this manual
Object, step, method, product or device are closed, but does not preclude the presence or addition of one or more of the other composition, step, method, system
Product or device.In addition, using " preferred ", " preferably ", " preferred " etc. to be when describing presently filed embodiment
Refer to, can provide the embodiment of the present invention of certain beneficial effects in some cases.However, under identical circumstances or other feelings
Under condition, other embodiments are also likely to be preferred.In addition to this, not dark to the statement of one or more preferred embodiments
Show that other embodiments are unavailable, is also not intended to exclude other embodiments except the scope of the present invention.
First aspect present invention provides a kind of plastic membrane product, and at least three layers are deposited on the plastic membrane product
Metallic film, respectively binder course, chemosphere and protective layer；The binder course is by combining plastic layer and forming in conjunction with metal layer；
The binder course with a thickness of 2-500nm.
Plastic film
As one embodiment of the present invention, the plastics be selected from polyethylene, polypropylene, polyvinyl chloride, polystyrene,
Acrylonitrile-butadiene-styrene (ABS) co-polymer, polymethacrylates, polyethylene terephthalate, poly terephthalic acid
One of butyl ester or polyurethane are a variety of.
From the angle for the binding force for improving non-metallic layer and metal layer, the plastics be selected from polypropylene, polyethylene and
Polyvinyl chloride, one of polyethylene terephthalate, PA polybutyleneterephthalate and polyurethane.
From the light transmittance angle for reducing metalized article, the non-metallic layer is made of plastic film, the plastics
Film with a thickness of 2-1000 μm；It is more preferred with a thickness of 2-100 μm.
The second aspect of the present invention provides the preparation method of above-mentioned plastic membrane product, which is characterized in that the method packet
Include following steps:
The method that S01 uses Vacuum Deposition, metallizes in non-metal layer surface, forms binder course；
S02 forms chemosphere by the way of chemical plating, on the surface of binder course；
S03 forms protective layer by the way of electroplated metallization, on the surface of chemosphere.
Vacuum Deposition
Vacuum Deposition mainly includes vacuum evaporation, sputtering plating and ion plating several types, they are all utilized in vacuum condition
Under, various metals and nonmetal film are deposited on plastic surface by the modes such as distilling or sputtering, it in this way can be with
Obtain very thin overlay coating.
Metallization is mainly carried out in the present invention by the way of sputter coating and forms binder course.
Sputter coating
Common sputter coating mode mainly includes d.c. sputtering, radio-frequency sputtering, magnetron sputtering and reactive sputtering.
In the present invention, the mode of the sputter coating can be known to the skilled in the art any sputter coating
Mode, illustrated with magnetron sputtering, the present invention in, the magnetron sputtering specific steps are as follows:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film, to non-gold
Belong to material and carry out plated film, bias mains voltage sets 80-180V, and grid bias power supply duty ratio sets 30-50%, intermediate frequency power supply electric current
15A-25A is set, argon flow is set as 150-180Sccm, and reaction gas flow requires to be gradually added into according to membrane system, when plated film
Between setting required according to membrane system and film thickness, vacuum degree is down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product.
In the present invention, the metal layer for using sputter coating to be formed is binder course；The binder course is by combining plastic layer and knot
Metal layer composition.
As one embodiment of the present invention, the binder course with a thickness of 2-50nm.
The raw material for preparing of the binder course is selected from one of Ni, Co, Cr, Mn or a variety of.
Chemical plating
Chemical plating is also referred to as electroless plating or autocatalytic plating, is in the case where no impressed current by suitable reduction
Agent makes metal ion in plating solution be reduced into metal, and deposits to a kind of coating method of piece surface.
Electroless plating technology is that the deposition of metal is generated by controllable redox reaction under the catalytic action of metal
Process.Compared with plating, electroless plating technology is with coating is uniform, pin hole is small, is not required to DC power supply device, can sink on non-conductor
Accumulate and have the characteristics that certain properties.
As one embodiment of the present invention, the chemosphere that the chemical plating is formed is copper film.
As one embodiment of the present invention, the plating steps of the chemical plating include at least copper facing and following steps group
It is one or more in conjunction；
The step combination includes:
It is bulk, remove glue, neutralization, adjustment, activating pretreatment, activation, activating and reducing.
As one embodiment of the present invention, the plating steps of the chemical plating include at least copper facing and following steps group
It is one or more in conjunction；
The step combination includes: activation, activating and reducing.
It is bulk
Bulk is that the precondition of a uniform, ideal hole wall is provided for subsequent step.
The leavening agent used in the present invention is made of water, bulk additive, pH correction agent；And every liter of leavening agent contains
The water of 849ml, the bulk additive of 150ml and the pH correction agent of 1ml.
The bulk additive is by the N-Methyl pyrrolidone of 30-100g/L, the sodium hydroxide of 40-60g/L and 30-
The DMF of 100g/L is formed.
The pH correction agent is the sodium hydroxide solution of 32wt%.
The bulk processing step is as follows:
Object to be processed is placed in bulk solution, standing time 45-110s, bulk solution temperature is that 70-80 is Celsius
Degree.
The bulk solution refers to the mixture of leavening agent and water, and the bulk addition in 1 liter of bulk solution containing 150ml
Agent.
The pH value of the bulk solution is 10-12.
Except glue
Except glue primarily to high-efficiency cleaning hole wall and perforating residue, effectively prevent hole wall to separate；It simultaneously can be effective
Increase the binding force of hole wall and substrate, reduces separation risk.
The adhesive remover used in the present invention is formed by water, except glue additive, pH adjusting agent；And every liter of leavening agent contains
The water of 770ml, 125ml except glue additive and 105ml pH adjusting agent.
The glue additive that removes is permanganate, compares preferably sodium permanganate.
The sodium hydroxide solution that the pH adjusting agent is 32%, 32% sodium hydroxide solution refer to 432g/L NaOH.
It is described except the processing step of glue is as follows:
Object to be processed is placed on except in sol solution, standing time 90-300s, removing sol solution temperature is that 75-85 is Celsius
Degree.
The mixture for referring to adhesive remover and water except sol solution, and 1 liter of glue that removes removed in sol solution containing 50g adds
Agent；1 liter except the NaOH containing 45g in sol solution.
It neutralizes
In the present invention, the neutralization is the acidic materials neutralized except during glue, improves binding force.
The neutralizer used in the present invention is made of water, sulfuric acid, hydrogen peroxide and neutralization additive；And every liter of neutralizer contains
There are the water of 860ml, the sulfuric acid of the 50wt% of 100ml and the 35wt%H of 15ml2O2。
The processing step of the neutralization is as follows:
Object to be processed is placed on and is neutralized in solution, standing time 35-60s, neutralizing solution temperature is that 25-35 is Celsius
Degree.
The neutralization solution refers to the mixture of neutralizer and water, the sulphur of the 50wt% containing 100ml in 1 liter of neutralization solution
Acid；The 35wt%H of 15ml2O2。
Adjustment
Heretofore described adjustment is the residue in order to effectively remove de-smear in hole, while adjusting pore wall charge, is made
The surface that hole wall becomes extremely strong adsorption capacity is obtained, provides ideal hole wall treatment effect for subsequent copper facing.
The regulator used in the present invention is made of water and adjustment additive；And every liter of regulator contains the water of 960ml,
The adjustment additive of 40ml.
The adjustment additive is selected from one kind of dopamine, Dopamine hydrochloride, pyrroles, hydramine or nitrate.
The processing step of the adjustment is as follows:
Object to be processed is placed in adjustment solution, standing time 60s, adjustment solution temperature is 50 degrees Celsius.
Activating pretreatment
In the present invention, the activating pretreatment is adjusted simultaneously primarily to the pollutant before activating in device to hole is handled
Economize on electricity lotus, prepares for subsequent activation.
In the present invention, the activating pretreatment agent is sodium chloride solution, and 980ml water is contained in every 1 liter of activating pretreatment agent
Sodium chloride, 10ml activating pretreatment additive with 10ml.
The activating pretreatment additive is tartrate, citrate, edetate, nitrilotriacetic acid salt, three
One of ethanol amine.
The processing step of the activating pretreatment is as follows:
Object to be processed is placed in activating pretreatment agent, standing time 20s, neutralizing solution temperature is 25 degrees Celsius.
Activation
Heretofore described activation processing, which refers to, activates the hole wall for having adjusted charge, to be copper facing below
Good covering provide optimal conditions.
The activator used in the present invention is made of water, activating additive and alkaline matter；And every liter of activator contains
The water of 774ml, the activating additive of 225ml and the sodium hydroxide solution of 1ml.
The concentration of the sodium hydroxide solution is 32wt%.
As one embodiment of the present invention:
The activating additive is main composition and adjuvant；The two weight ratio is 10:1.
The main composition is palladium sulfate, and the adjuvant is ethylenediamine tetra-acetic acid or ethylenediamine.
The processing step of the activation is as follows at this time:
Object to be processed is placed in activated solution, standing time 45s, activated solution temperature is 45 degrees Celsius；PH value
It is 10.0.
As another embodiment of the invention:
The activating additive is main composition and adjuvant；The two weight ratio is 10:1.
The main composition is silver nitrate, and the adjuvant is sodium hypophosphite or EDETATE SODIUM.
The processing step of the activation is as follows at this time:
Object to be processed is placed in activated solution, standing time 45s, activated solution temperature is 45 degrees Celsius；PH value
For 3-6.
Activating and reducing
Activating and reducing is primarily to catalysis accelerates later period copper-plated process.
The activating and reducing agent used in the present invention is made of water, boric acid and activating and reducing additive；And every liter activation also
Former agent contains the water of 990ml, the boric acid of 25g, the activating and reducing additive of 10mg.
The activating and reducing additive is potassium borohydride.
The processing step of the activating and reducing is as follows:
Object to be processed is placed in activating and reducing agent, standing time 35s, activating and reducing solution temperature is 35 Celsius
Degree；PH value is 6 or so.
Electroless copper
In the present invention, every 1 liter of chemical copper solution includes 852.5ml water, copper-based agent of 85ml, 2.5ml copper stabilizer, 45ml
Copper additives, 15ml copper reduction agent, 9g sodium hydroxide.
The copper-based agent is complexing agent, and the complexing agent is selected from preferably at least two or up to 10 carbon atoms
Amino acid, polycarboxylic acids, usually aminoacetic acid, such as nitrilotriacetic acid, alternatively, the usually poly- second of alkylen polyamine
Acid, it includes ethylenediamine tetra-acetic acid (EDTA), diethylenetriamine pentaacetic acid (DTPA), N-hydroxyethyl-ethylenediamine tetraacethyl, 1,
3- diamino -2- propyl alcohol-N, N, N ',-four acetic acid of N ', two acetic acid of dihydroxyphenyl ethylene diamine, four acetic acid of diaminocyclohexane
Or ethylidene glycol-bis- ((beta-aminoethyl ether)-N, N '-four acetic acid) and N, N, N ', N '-four-(2- hydroxypropyl) ethylene
Amine, citrate, tartrate, N, N-2- (ethoxy) glycine, gluconate, lactate, citrate, tartrate,
Coronal ether and/or cryptand.
The copper additives are copper sulphate.
The copper reduction agent is selected from one of vanillic aldehyde and formaldehyde, glyoxalic acid, sodium hypophosphite or elegreen or more
Kind.
The processing step of the electroless copper is as follows:
Object to be processed is placed in chemical copper solution, standing time 240-450s, chemical copper solution temperature is taken the photograph for 35
Family name's degree.
The liquid medicine service life: tank liquor produces area 100m2/ L or tank liquor specific gravity are more than 1.09g/cm3。
The third metal with a thickness of 0.05-3 μm.
Electroplated metallization
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing (as corroded), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
Electroplate liquid used in the present invention includes the cupric sulfate pentahydrate of 60-90g/L；The sulfuric acid of 180-220g/L；40-
The chloride ion of 80ppm；The open cylinder agent of 8-12ml/L；The brightener of 3-5ml/L and the regulator of 0.1-0.5ml/L.
The open cylinder agent is sulfonate, azacyclo- copolymer and surfactant.
The sulfonate be selected from one of dodecyl sodium sulfate, acyl methylamine alkane sulfonic acid sodium or paratoluenesulfonic acid sodium salt or
It is a variety of；The azacyclo- copolymer is poly- (vinyl imidazole -2- acrylamide-2-methyl propane sulfonic-methacrylic acid 18
Ester).The surfactant is selected from one of sodium isethionate, succinic acid dihexyl sodium sulfonate, lauryl sodium sulfate.
The brightener is mercaptopropanesulfonic acid sodium and N, and N- dimethyl disulfide is for formamide propane sulfonic acid sodium, ratio 2:
1。
The regulator is polyethylene glycol of the hydroxyl value in 8~14mg KOH/g.
The step of plating, is as follows:
01. plating solution opens cylinder
1, cylinder body cleans
A), clean cylinder body and each pipeline are washed with water；
B), cylinder body and filtration system 2-4 hours are impregnated with 5wt%NaOH；
C), 5wt%H is used after cleaning up cylinder body and each pipeline with clear water2SO4 impregnates 2-4 hours；
D), cylinder can be opened after washing with water clean cylinder body and each pipeline；
2, cylinder step is opened
A), the water of 2/3 cylinder volume is placed, filtering is opened and is inflated；
B), it is slowly added to the AR grade sulfuric acid of 200g/L；
C), 75g/L copper sulphate is added；
D), it is linked into cleaned copper anode, and changes cotton core after filtering 4 hours using carbon core and filters；
E), when temperature is cooled to 30 DEG C or less, 10ml/L open cylinder agent, 5ml/L brightener, 0.5ml/L regulator is added；
F), using 0.5-2.0 ASD current density electrolysis 4-8 hours；
G), can be test-manufactured after test and chemical analysis adjustment each component to normal range (NR).
02 plating conditions are as follows:
Operating temperature: 20-30 degrees Celsius；Cathode-current density is 1-6A/dm2, voltage 1-3.5V；Anode is cupric
99.9% phosphorous copper balls or phosphor-copper angle (phosphorous 0.03-0.06wt%).Anode and cathode area ratio is 1:(1.5-2.5)；Agitating mode
For air stirring (using low-pressure oil-free hair dryer and oily-water seperating equipment and filter device must be passed through) and movable cathode；Filtering
Mode is that 5-10 μm of cotton core or carbon core continuously filter.
03 plating solution maintenance:
1, because the plating solution of evaporation loss can be added with deionized water；
2, periodic analysis sulfuric acid copper content, sulfuric acid content and chloride content；
3, additive is adjusted according to hull trough test；
4, every operation 1000AH need to add brightener 200ml during normal production.
The protective layer with a thickness of 100-50000nm.
The third aspect of the present invention provides above-mentioned plastic membrane product, is applied to electromagnetic signal and conducts field.
Technology of the invention is described in detail combined with specific embodiments below.
Embodiment 1:
The present embodiment provides a kind of plastic membrane product, three-layer metal film is deposited on the plastic membrane product, point
It Wei not binder course, chemosphere and protective layer；The binder course is by combining plastic layer and forming in conjunction with metal layer；The thickness of plastic film
Degree is 50 μm.
The binder course carries out plated film in a manner of sputtering, and chemosphere carries out plated film in a manner of chemical plating；Protective layer with
The mode of plating carries out plated film.
Wherein, the combination plastic layer is formed by Ni metal, is formed in conjunction with metal layer by Cr metal, chemosphere and protective layer
There is copper metal to be formed.
The mode of the sputtering is as follows:
S01. under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film is right
Nonmetallic materials carry out plated film, and bias mains voltage sets 110V, and grid bias power supply duty ratio setting 35%, intermediate frequency power supply electric current is set
Determine 20A, argon flow is set as 165Sccm, and reaction gas flow requires to be gradually added into according to membrane system, starts plated film time setting
15min, vacuum degree are down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product obtain being coated with the product in conjunction with plastic layer.
S02. according to S01 step, the metallization operations for combining the product of plastic layer to be combined metal layer will be coated with.
Wherein, as follows in conjunction with the metallization operations parameter of metal layer:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film starts to plate
Film, bias mains voltage set 150V, and grid bias power supply duty ratio setting 25%, intermediate frequency power supply electric current sets 20A, and argon flow is set
It is set to 150Sccm, reaction gas flow requires to be gradually added into according to membrane system, starts plated film time and sets 10min, vacuum degree is down to
2.3×10-1Pa。
Chemical plating:
In the present invention, the chemical plating includes the following steps:
S001:
It is bulk: will to be placed in bulk solution by the product of sputter coating, standing time 62s, bulk solution temperature
It is 75 degrees Celsius；
S002:
Except glue: will be placed on by bulk processed product except in sol solution, standing time 125s removes sol solution temperature
Degree is 80 degrees Celsius；
S003
It neutralizes: it will be by being neutralized in solution except the processed product of glue is placed on, standing time 42s neutralizes solution temperature
Degree is 30 degrees Celsius；
S004:
Adjustment: the product crossed by neutralisation treatment being placed in regulator, standing time 61s, adjusts solution temperature
It is 50 degrees Celsius.
S005:
Activating pretreatment: will be adjusted processed product and be placed in activating pretreatment agent, standing time 22s,
Neutralizing solution temperature is 25 degrees Celsius.
S006:
Activation: the product crossed by activating pretreatment is placed in activator, standing time 46s, activated solution temperature
Degree is 45 degrees Celsius.
S007:
Activating and reducing: it will be placed in activating and reducing agent by the product being activated, standing time 36s, activation
Reducing agent temperature is 35 degrees Celsius.
S008:
Copper facing: it will be placed in chemical copper solution by the processed product of activating and reducing, standing time 299s, chemistry
Heavy copper liquid temperature is 35 degrees Celsius.
The leavening agent is made of water, bulk additive, pH correction agent；And every liter of leavening agent contains the water of 849ml,
The bulk additive of 150ml and the pH correction agent of 1ml.The pH correction agent is the sodium hydroxide solution of 32wt%.
The bulk additive of 150ml is by the N-Methyl pyrrolidone of 60g/L, the sodium hydroxide of 50g/L and 70g/L
DMF composition.
The adhesive remover is formed by water, except glue additive, pH adjusting agent；And every liter of adhesive remover contains the water of 770ml,
125ml except glue additive and 105ml pH adjusting agent.The glue additive that removes is sodium permanganate；The pH adjusting agent is
32% sodium hydroxide solution, 32% sodium hydroxide solution refer to 432g/L NaOH.
The neutralizer is made of water, sulfuric acid, hydrogen peroxide and neutralization additive；And every liter of neutralizer contains 885ml's
Water, the sulfuric acid of the 50wt% of 100ml and the 35wt%H of 15ml2O2。
The regulator is made of water and adjustment additive；And every liter of regulator contains the water of 960ml, the adjustment of 40mg
Additive.The adjustment additive is dopamine.
The activating pretreatment agent is sodium chloride solution, the chlorine containing 980ml water and 10ml in every 1 liter of activating pretreatment agent
Change sodium, 10ml triethanolamine.
The activator is made of water, activating additive and alkaline matter；And every liter of activator contains the water of 774ml,
The activating additive of 225ml and the sodium hydroxide solution of 1ml.The concentration of the sodium hydroxide solution is 32wt%.The activation
Additive is main composition and adjuvant；The two weight ratio is 10:1.
The main composition is palladium sulfate, and the adjuvant is ethylenediamine tetra-acetic acid.
The activating and reducing agent is made of water, boric acid, potassium borohydride；And every liter of activating and reducing agent contains the water of 990ml,
The boric acid of 25g, the potassium borohydride of 10mg.
Every 1 liter of chemical copper solution adds comprising 852.5ml water, copper-based agent of 85ml, 2.5ml copper stabilizer, 45ml copper
Add agent, 15ml copper reduction agent, 9g sodium hydroxide.The copper-based agent, copper stabilizer, copper additives and copper reduction agent are bought from wide
East is large at Science and Technology Ltd..
The copper-based agent is N-hydroxyethyl-ethylenediamine tetraacethyl；The copper additives are copper sulphate；The copper reduction agent
For elegreen.
Plating
The step of plating, is as follows:
01. plating solution opens cylinder
1, cylinder body cleans
A), clean cylinder body and each pipeline are washed with water；
B), cylinder body and filtration system 3 hours are impregnated with 5wt%NaOH；
C), 5wt%H is used after cleaning up cylinder body and each pipeline with clear water2SO4 impregnates 2 hours；
D), cylinder can be opened after washing with water clean cylinder body and each pipeline；
2, cylinder step is opened
A), the water of 2/3 cylinder volume is placed, filtering is opened and is inflated；
B), it is slowly added to the AR grade sulfuric acid of 200g/L；
C), 75g/L copper sulphate is added；
D), it is linked into cleaned copper anode, and changes cotton core after filtering 4 hours using carbon core and filters；
E), when temperature is cooled to 30 DEG C or less, 10ml/L open cylinder agent, 5ml/L brightener, 0.5ml/L regulator is added；
F), using 1.5 ASD current density electrolysis 6 hours；
G), can be test-manufactured after test and chemical analysis adjustment each component to normal range (NR).
02 plating conditions are as follows:
Operating temperature: 25 degrees Celsius；Cathode-current density is 4A/dm2, voltage 1.8V；Anode is cupric 99.9%
Phosphorous copper balls or phosphor-copper angle (phosphorous 0.03-0.06wt%).Anode and cathode area ratio is 1:2；Agitating mode is that air stirring (must be adopted
With low-pressure oil-free hair dryer and pass through oily-water seperating equipment and filter device) and movable cathode；Filter type is 5-10 μm of cotton core
Continuous filtering.
03 plating solution maintenance:
1, because the plating solution of evaporation loss can be added with deionized water；
2, periodic analysis sulfuric acid copper content, sulfuric acid content and chloride content；
3, additive is adjusted according to hull trough test；
4, every operation 1000AH need to add brightener 200ml during normal production.
Electroplate liquid used in the present embodiment includes the cupric sulfate pentahydrate of 80g/L；The sulfuric acid of 190g/L；The chlorine of 60ppm from
Son；The open cylinder agent of 9ml/L；The brightener of 4ml/L and the regulator of 0.3ml/L.There is hydrochloric acid in the source of chloride ion in the present embodiment.
The open cylinder agent is dodecyl sodium sulfate, poly- (vinyl imidazole -2- acrylamide-2-methyl propane sulfonic-methyl
Octadecyl acrylate), sodium isethionate, ratio 5:1:1.
The brightener is mercaptopropanesulfonic acid sodium and N, and N- dimethyl disulfide is for formamide propane sulfonic acid sodium, ratio 2:
1。
The regulator is polyethylene glycol of the hydroxyl value in 10mg KOH/g.
Embodiment 1-1:
The present embodiment and the difference of embodiment 1 are as follows:
Potassium borohydride is changed to sodium borohydride in the activating and reducing agent.
Embodiment 2:
The present embodiment the difference from embodiment 1 is that, in conjunction with metal layer metal be Mn；And concrete operations parameter is as follows:
The mode of the sputtering is as follows:
S01. under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film is right
Nonmetallic materials carry out plated film, and bias mains voltage sets 95V, and grid bias power supply duty ratio setting 35%, intermediate frequency power supply electric current is set
Determine 18A, argon flow is set as 160Sccm, and reaction gas flow requires to be gradually added into according to membrane system, starts plated film time setting
15min, vacuum degree are down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product obtain being coated with the product in conjunction with plastic layer.
S02. according to S01 step, the metallization operations for combining the product of plastic layer to be combined metal layer will be coated with.
Wherein, as follows in conjunction with the metallization operations parameter of metal layer:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film starts to plate
Film, bias mains voltage set 150V, and grid bias power supply duty ratio setting 35%, intermediate frequency power supply electric current sets 24A, and argon flow is set
It is set to 160Sccm, reaction gas flow requires to be gradually added into according to membrane system, starts plated film time and sets 11min, vacuum degree is down to
2.3×10-1Pa。
The bulk processing step is as follows:
Object to be processed is placed in bulk solution, standing time 75s, bulk solution temperature is 75 degrees Celsius.
Embodiment 3:
The present embodiment the difference from embodiment 1 is that, in conjunction with plastic layer metal be Cr metal, in conjunction with the metal of metal layer
For Mn metal.
Operating parameter is same as Example 1, and unused operating parameter is as follows:
The mode of the sputtering is as follows:
S01. under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film is right
Nonmetallic materials carry out plated film, and bias mains voltage sets 115V, and grid bias power supply duty ratio setting 32%, intermediate frequency power supply electric current is set
Determine 17A, argon flow is set as 160Sccm, and reaction gas flow requires to be gradually added into according to membrane system, starts plated film time setting
12min, vacuum degree are down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product obtain being coated with the product in conjunction with plastic layer.
S02. according to S01 step, the metallization operations for combining the product of plastic layer to be combined metal layer will be coated with.
Wherein, as follows in conjunction with the metallization operations parameter of metal layer:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film starts to plate
Film, bias mains voltage set 100V, and grid bias power supply duty ratio setting 40%, intermediate frequency power supply electric current sets 21A, and argon flow is set
It is set to 160Sccm, reaction gas flow requires to be gradually added into according to membrane system, starts plated film time and sets 10min, vacuum degree is down to
2.3×10-1Pa。
Embodiment 4:
The present embodiment and the difference of embodiment 3 are that the metal in conjunction with metal layer is Ni metal.
Operating parameter is same as Example 3, and unused operating parameter is as follows:
The mode of the sputtering is as follows:
S01. under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film is right
Nonmetallic materials carry out plated film, and bias mains voltage sets 80V, and grid bias power supply duty ratio setting 50%, intermediate frequency power supply electric current is set
Determine 20A, argon flow is set as 150Sccm, and reaction gas flow requires to be gradually added into according to membrane system, starts plated film time setting
13min, vacuum degree are down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product obtain being coated with the product in conjunction with plastic layer.
S02. according to S01 step, the metallization operations for combining the product of plastic layer to be combined metal layer will be coated with.
Wherein, as follows in conjunction with the metallization operations parameter of metal layer:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film starts to plate
Film, bias mains voltage set 160V, and grid bias power supply duty ratio setting 45%, intermediate frequency power supply electric current sets 25A, and argon flow is set
It is set to 155Sccm, reaction gas flow requires to be gradually added into according to membrane system, starts plated film time and sets 5min, vacuum degree is down to
2.3×10-1Pa。
Embodiment 5:
The present embodiment and the difference of embodiment 4 are that the metal in conjunction with plastic layer is Mn metal；In conjunction with the metal of metal layer
For Ni metal.
Operating parameter is same as Example 4, and unused operating parameter is as follows:
The mode of the sputtering is as follows:
S01. under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film is right
Nonmetallic materials carry out plated film, and bias mains voltage sets 110V, and grid bias power supply duty ratio setting 45%, intermediate frequency power supply electric current is set
Determine 20A, argon flow is set as 160Sccm, and reaction gas flow requires to be gradually added into according to membrane system, starts plated film time setting
15min, vacuum degree are down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product obtain being coated with the product in conjunction with plastic layer.
S02. according to S01 step, the metallization operations for combining the product of plastic layer to be combined metal layer will be coated with.
Wherein, as follows in conjunction with the metallization operations parameter of metal layer:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film starts to plate
Film, bias mains voltage set 122V, and grid bias power supply duty ratio setting 40%, intermediate frequency power supply electric current sets 18A, and argon flow is set
It is set to 165Sccm, reaction gas flow requires to be gradually added into according to membrane system, starts plated film time and sets 10min, vacuum degree is down to
2.3×10-1Pa。
Embodiment 6:
The present embodiment and the difference of embodiment 5 are that the metal in conjunction with metal layer is Cr.
Operating parameter is same as Example 5, and unused operating parameter is as follows:
The mode of the sputtering is as follows:
S01. under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film is right
Nonmetallic materials carry out plated film, and bias mains voltage sets 120V, and grid bias power supply duty ratio setting 30%, intermediate frequency power supply electric current is set
Determine 20A, argon flow is set as 160Sccm, and reaction gas flow requires to be gradually added into according to membrane system, starts plated film time setting
11min, vacuum degree are down to 2.3 × 10-1Pa；
Various pump valves are successively closed according to magnetron sputtering coater operating instruction after plated film, deflating to open the door to take out produces
Product obtain being coated with the product in conjunction with plastic layer.
S02. according to S01 step, the metallization operations for combining the product of plastic layer to be combined metal layer will be coated with.
Wherein, as follows in conjunction with the metallization operations parameter of metal layer:
Under argon gas and reaction gas environment, grid bias power supply is opened, the intermediate frequency power supply of target needed for opening plated film starts to plate
Film, bias mains voltage set 130V, and grid bias power supply duty ratio setting 45%, intermediate frequency power supply electric current sets 22A, and argon flow is set
It is set to 150Sccm, reaction gas flow requires to be gradually added into according to membrane system, starts plated film time and sets 12min, vacuum degree is down to
2.3×10-1Pa。
Embodiment 7:
The present embodiment the difference from embodiment 1 is that, sputter coating has only plated one layer of metal layer, i.e. Ni metal layer.
Embodiment 8:
The present embodiment the difference from embodiment 1 is that, a kind of non-metal material surface metallization system provided in this embodiment
Product do not contain chemosphere, i.e., without chemical deposit, only to sputter the two metal layers formed and the one layer of gold formed is electroplated
Belong to layer.
Embodiment 9:
The present embodiment the difference from embodiment 1 is that, in the present embodiment in chemical plating without containing adjustment, activating pretreatment,
Activation and this four step of activating and reducing, only include it is bulk, except glue, neutralization and copper facing.
Embodiment 10:
The present embodiment the difference from embodiment 1 is that, the nonmetallic materials are polypropylene, and its weight average molecular weight is
30000。
Remaining operating parameter and embodiment 1 are consistent.
Embodiment 11:
The present embodiment the difference from embodiment 1 is that, the copper reduction agent be formaldehyde.
Embodiment 12:
The present embodiment the difference from embodiment 1 is that, the brightener be N, N- dimethyl disulfide is for formamide propane sulphur
Sour sodium.
Performance test:
1. extensibility
Test method: taking long 10cm × wide 10cm sample, go horizontal drawing with the strength of constant force 30N, until fracture, record
Elongate length.
Extensibility=(length at break -10)/10 × 100%.
2. binding force
Test method: taking long 10cm × wide 10cm sample, be sticked on sample with 3M adhesive tape, adhesive tape is uncovered, and observes sample
Whether the metal on product surface is taken off, changes the adhesive tape of different viscosity until the metal layer of sample surfaces is destroyed.Record adhesive tape
Sticky specification, sticky specification is related with power, and conversion obtains the size of corresponding power.
3. light transmittance
Using optical microphotograph sem observation sample, observe whether sample surfaces have luminous point.Have luminous point be it is unqualified, without luminous point
For qualification.
Test result:
| Embodiment | Extensibility | Binding force | Light transmittance |
| Embodiment 1 | 30.2% | 0.62N | It is qualified |
| Embodiment 1-1 | 28.6% | 0.42N | It is unqualified |
| Embodiment 2 | 29.9% | 0.59N | It is qualified |
| Embodiment 3 | 29.2% | 0.57N | It is qualified |
| Embodiment 3-1 | 28.0% | 0.47N | It is qualified |
| Embodiment 4 | 29.3% | 0.58N | It is qualified |
| Embodiment 5 | 29.1% | 0.55N | It is qualified |
| Embodiment 6 | 30.0% | 0.56N | It is qualified |
| Embodiment 7 | 28.3% | 0.58N | It is qualified |
| Embodiment 8 | 29.2% | 0.59N | It is qualified |
| Embodiment 9 | 29.0% | 0.59N | It is qualified |
| Embodiment 10 | 29.6% | 0.60N | It is qualified |
| Embodiment 11 | 27.2% | 0.37N | It is unqualified |
| Embodiment 12 | 27.2% | 0.34N | It is unqualified |
At last it is pointed out that the foregoing is merely illustrative of the preferred embodiments of the present invention, it is not intended to limit the invention, it is all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in protection model of the invention within the spirit and principle of invention
Within enclosing.
Claims (10)
1. plastic membrane product, which is characterized in that be deposited at least three-layer metal film on the plastic membrane product, respectively
Binder course, chemosphere and protective layer；The binder course is by combining plastic layer and forming in conjunction with metal layer；
The binder course with a thickness of 2-500nm.
2. plastic membrane product described in claim 1, which is characterized in that the binder course with a thickness of 2-50nm.
3. plastic membrane product described in claim 1, which is characterized in that the plastic film with a thickness of 2-1000 μm.
4. plastic membrane product described in claim 1, which is characterized in that the plastic film with a thickness of 2-100 μm.
5. a kind of preparation method of the described in any item plastic membrane products of claim 1-5, which is characterized in that the method packet
Include following steps:
The method that S01 uses Vacuum Deposition, metallizes in non-metal layer surface, forms binder course；
S02 forms chemosphere by the way of chemical plating, on the surface of binder course；
S03 forms protective layer by the way of electroplated metallization, on the surface of chemosphere.
6. the method as claimed in claim 6 for preparing plastic membrane product, which is characterized in that the plating steps of the chemical plating are extremely
Less comprising one or more in copper facing and following steps combination；
The step combination includes:
It is bulk, remove glue, neutralization, adjustment, activating pretreatment, activation, activating and reducing.
7. the method as claimed in claim 6 for preparing plastic membrane product, which is characterized in that the plating steps of the chemical plating are extremely
Less comprising one or more in copper facing and following steps combination；
The step combination includes: activation, activating and reducing.
8. claim 1-5 is described in any item to prepare plastic membrane product, which is characterized in that the preparation of the metallic film is former
Material is selected from one of Ni, Co, Cr, Mn, Cu or a variety of.
9. claim 1-5 is described in any item to prepare plastic membrane product, which is characterized in that the binder course prepares raw material
Selected from one of Ni, Co, Cr, Mn or a variety of.
10. claim 1-5 is described in any item to prepare plastic membrane product, it is applied to electromagnetic signal and conducts field.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910696729.XA CN110424014B (en) | 2019-07-30 | 2019-07-30 | Plastic product and method for selectively metallizing surface of plastic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910696729.XA CN110424014B (en) | 2019-07-30 | 2019-07-30 | Plastic product and method for selectively metallizing surface of plastic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110424014A true CN110424014A (en) | 2019-11-08 |
| CN110424014B CN110424014B (en) | 2022-03-15 |
Family
ID=68411521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910696729.XA Active CN110424014B (en) | 2019-07-30 | 2019-07-30 | Plastic product and method for selectively metallizing surface of plastic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110424014B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3267007A (en) * | 1966-08-16 | Bonding metal deposits to electrically non-conductive material | ||
| CN1696345A (en) * | 2004-05-14 | 2005-11-16 | 吴东兴 | Method for metallizing surface of nonmetallic material, and composing structure of surface |
| CN1699623A (en) * | 2004-05-20 | 2005-11-23 | 佛山市顺德区汉达精密电子科技有限公司 | Method for surface metallization of non-metallic material products |
| CN101489372A (en) * | 2008-01-17 | 2009-07-22 | 郑育仁 | Protection cover manufacturing method capable of preventing electromagnetic wave interference |
| CN103088321A (en) * | 2011-10-27 | 2013-05-08 | 深圳市微航磁电技术有限公司 | Structure and manufacturing method for selectively forming metal on plastic substrate |
-
2019
- 2019-07-30 CN CN201910696729.XA patent/CN110424014B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3267007A (en) * | 1966-08-16 | Bonding metal deposits to electrically non-conductive material | ||
| CN1696345A (en) * | 2004-05-14 | 2005-11-16 | 吴东兴 | Method for metallizing surface of nonmetallic material, and composing structure of surface |
| CN1699623A (en) * | 2004-05-20 | 2005-11-23 | 佛山市顺德区汉达精密电子科技有限公司 | Method for surface metallization of non-metallic material products |
| CN101489372A (en) * | 2008-01-17 | 2009-07-22 | 郑育仁 | Protection cover manufacturing method capable of preventing electromagnetic wave interference |
| CN103088321A (en) * | 2011-10-27 | 2013-05-08 | 深圳市微航磁电技术有限公司 | Structure and manufacturing method for selectively forming metal on plastic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110424014B (en) | 2022-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5908543A (en) | Method of electroplating non-conductive materials | |
| JP2020045574A (en) | Composition and method for metallizing non-conductive plastic surface | |
| CN101146934A (en) | Alkaline galvanizing bath comprising a filtration membrane | |
| CN202415725U (en) | System for copper plating on yellow brass substrate | |
| CN108000794B (en) | A kind of method of high-bond aluminum or aluminum alloy nano surface injection molding | |
| CN108611667B (en) | Environment-friendly composite coating on copper alloy substrate and preparation method thereof | |
| CN101649477A (en) | Preparation method of metal carbon aerogel composite material | |
| CN101922031B (en) | Double-plating steel belt and plating process | |
| CN102733179A (en) | Method for chemically plating and electroplating copper on artificial fibers and textile | |
| CN106894005B (en) | A kind of chemical bronze plating liquid, preparation method and a kind of method of Chemical Plating of Non metal Material | |
| CN110438499A (en) | A kind of non-metal material surface metalized article and its method for metallising | |
| CN100552093C (en) | Special activating agent for plastic electroplating and electroplating technology | |
| CN110424014A (en) | Plastic products and plastic basis material surface selective metallization method | |
| CN105908156A (en) | Method for electroplating golden coating on plastic surface | |
| US3698939A (en) | Method and composition of platinum plating | |
| CN110438500A (en) | A kind of plastic/metal product and preparation method thereof | |
| CN110424013A (en) | A kind of Plastic product surface metallization method and product | |
| CA1062649A (en) | Electrodeposition of tin-containing alloys and bath therefor | |
| CN112962128B (en) | Coarsening process method of high-peeling-resistance copper foil | |
| CN104233296A (en) | Method for silvering aluminum and aluminum alloy | |
| CN109652806B (en) | Deplating solution and deplating process for bright tin automobile parts by taking red copper or brass as base material | |
| CN110453257B (en) | Super-hydrophobic Zn-PTFE composite electrodeposition layer and preparation method thereof | |
| JP2000080482A (en) | Ion plating method of synthetic resin and synthetic resin molding having ion plating film | |
| Kamel et al. | Electrodeposition of nanocrystalline copper deposits using lactic acid-based plating bath | |
| CN111020574A (en) | Low-temperature preparation method of hydrophobic heat exchange material based on stainless steel and graphene |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 512000 chlor alkali characteristic industrial base of hougongdu Economic Development Zone, Rucheng Town, Ruyuan County, Shaoguan City, Guangdong Province Applicant after: Guangdong Shuocheng Technology Co.,Ltd. Address before: 512700 chlor alkali characteristic industrial base of hougongdu Economic Development Zone, Rucheng Town, Ruyuan Yao Autonomous County, Shaoguan City, Guangdong Province Applicant before: GUANGDONG SHUOCHENG TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |