CN101483141A - Multilayer module encapsulation method for LED and construction thereof - Google Patents
Multilayer module encapsulation method for LED and construction thereof Download PDFInfo
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- CN101483141A CN101483141A CN 200810002555 CN200810002555A CN101483141A CN 101483141 A CN101483141 A CN 101483141A CN 200810002555 CN200810002555 CN 200810002555 CN 200810002555 A CN200810002555 A CN 200810002555A CN 101483141 A CN101483141 A CN 101483141A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a light emitting diode multiple layer module encapsulation method and a structure thereof characterized in that a printed circuit layer with staggered nodes is arranged on a substrate with frames all around, a protruding inclined pier is surroundingly arranged in the frame inner wall hemline, a plurality of protruding reflection microstructure points are made on the printed circuit layer surface, a chip and wire bonding are arranged on the printed circuit layer, a reflectorized paint is precisely coated on the substrate surface except the chip and the frame inner wall, a silica gel diffusion layer mixed by the silica gel and the diffusion powder is filled in the frame, another fluorescent gel layer evenly mixed by the silica gel and the fluorescent powder is evenly coated on the silica gel diffusion layer after above silica diffusion layer is dried and solidified. Thereby the encapsulated light emitting diode of the invention has a uniform optical output surface, can change a point luminescence of the chip irradiancy to a surface luminescence and improve the luminescence efficiency by reflecting the original ineffective light ray.
Description
Technical field
The present invention relates to a kind of Light-Emitting Diode, particularly a kind of multilayer module encapsulation method for LED and structure thereof
Background technology
There are many problems in the traditional lighting light fixture now, and for example: though incandescent lamp bulb is cheap, incandescent lamp bulb has shortcomings such as low, the high power consumption of luminous efficiency, life-span be short, frangible.Though and very power saving of fluorescent lamp, the discarded object of fluorescent lamp has problems such as mercury pollution, frangible life-span be short.Comparatively speaking, the products such as light-emitting diode (LED), cold light light source that meet various countries' energy-conserving and environment-protective safety standard just produce relative advantage, and its characteristic and advantage are: life-span length, low power consumption, pure, the high shock resistance of light color, safety is non-friable, pollution-free and miniaturization can encapsulate or the like.
Though above-mentioned multiple advantage is arranged, but be subjected to the restriction of light-emitting diode (LED) luminous efficiency, above-mentioned light-emitting diode (LED) light source product still is not enough to be applied in fully among human lives's the various products, Fig. 1 and Fig. 2 are LED chip structure schematic diagram commonly used, proper alignment is equipped with a plurality of illuminating source chips 11 on its substrate 10, and illuminating source chip 11 utilizes gold thread 12 to be connected with circuit, be arranged with frame 13 at substrate 10 peripheries, can fill out at last in this frame 13 and cover transparent silica gel 14, and at transparent silica gel 14 surface coated fluorescence coatings 15.This design commonly used is as the problem of illuminating source product:
First, occur product in the market and mostly be on a circuit substrate 10, to install a plurality of illuminating source chips 11, because each illuminating source chip 11 emits beam towards different directions and angle, so its light that sends towards circuit substrate 10 directions and frame 13 directions to no effect, and then allow general light-emitting diode (LED) light source product occur that luminance is low excessively, temperature is too high and can produce the problem of a plurality of shadows; Though this design still can be combined into illumination such as similar conventional bulb luminosity, the energy waste of invalid light and temperature shortcoming too high and the shadow overlapping but is the problem that can't ignore of making us; So relevant manufacturer of global light source and the continuous active research of research unit are made every effort to seek and can be filled part design of all light ray energy of performance light source.
Second; can use transparent silica gel 14 coatings location, protection illuminating source chip 11 on the circuit substrate 10 commonly used; but when full-filling transparent silica gel 14; can produce capillarity (Capillarity) by relative frame 13 during transparent silica gel 14 liquid state; so transparent silica gel 14 surfaces after solidifying can be recess in central authorities; and cause the fluorescence coating 15 interior fluorescent particles of coating subsequently also to concentrate on central authorities; form the illumination effect inequality of finished product, and uneven distribution reflection will produce more invalid light.
The 3rd, the frame 13 of line 12 (gold thread) commonly used, substrate 10 and periphery all can be subjected to the irradiate light of illuminating source chip 11, but line 12 (gold thread) not only can produce bad shadow, and the sunken joint place of substrate 10 and frame 13 also can absorb light, forms the waste of light once again.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of multilayer module encapsulation method for LED, and this method can be produced no ghost image, high brightness and high heat dissipation efficiency, low consumption undermines the uniform light-emitting diode (LED) module of light.
For solving the problems of the technologies described above, the basic procedure of light-emitting diode multilayer module encapsulation method of the present invention is:
1. at seal carving brush circuit layer on the substrate: on this layer printed circuit board, make the staggered a plurality of nodes that set;
2. make frame and protrude oblique pier: around substrate, fix a white box (gummed), and be arranged with the oblique pier of protrusion, and the reflective white paint of spraying is dried on the frame inwall again at this frame inwall root edge;
3. system is protruded reflection micro-structural point: make a plurality of semicircular protrusions reflection micro-structural points at the printed circuit laminar surface, and each reflection micro-structural point is corresponding is configured between a plurality of nodes, and baking is fixed;
4. positioning chip and routing: on this layer printed circuit board, toast fixed chip (chip of light-emitting diode), carry out routing (welding gold thread) again;
5. spray paint: and precision sprays reflectorised paint on each assembly surface except the chip;
6. some glue: in this frame, insert the silica gel diffusion layer that silica gel mixes with spread powder, and oven dry is fixing;
7. cloth fluorescence glue-line: and after fluorescent material and silica gel evenly stirred into the fluorescence glue-line, the fluorescence glue-line is covered on the surface of silica gel diffusion layer.
By this, light-emitting diode of the present invention can reflect invalid light and then promote luminous efficiency, and the less advantage of not having the overlapping shadow again of smooth, the invalid light of fluorescence glue-line more can be strengthened efficient of the present invention.
Second step made frame and protruded oblique pier step and the 3rd step system protrusion reflection micro-structural point step in the said method, might not limit sequencing, also can be to make frame again or protrude oblique pier after making protrusion reflection micro-structural point earlier.
By this, the light usable reflection that the present invention sends chip promotes luminous efficiency, and the design of the structural arrangement of chip, and the irradiation that can reduce each other heats (preventing decay), effectively reduces the generation of temperature and invalid light.
The reflection micro-structural point that above-mentioned printed circuit laminar surface is made can be the shape that adopts the tool refraction action, for example semicircle, taper, inclined-plane bulk, column or triangle bulk, and each reflects micro-structural point and can bring into play invalid ray refraction function equally.
Above-mentioned light-emitting diode multilayer module encapsulation method is the integration of every technology, if only adopt the basic procedure of the present invention that system is protruded reflection micro-structural point and reflectorised paint technology to be:
1. at seal carving brush circuit layer on the substrate: on this layer printed circuit board, make a plurality of nodes;
2. system is protruded reflection micro-structural point: protrude reflection micro-structural point what the printed circuit laminar surface was made most semicircle, and each reflection micro-structural point is corresponding is configured between most nodes, and toast and fix;
3. positioning chip and routing: positioning chip on layer printed circuit board (chip of light-emitting diode) and routing (welding gold thread), and baking is fixing;
4. spray paint: and precision sprays reflectorised paint on each assembly surface except the chip;
5. encapsulation is fixing.
Above-mentioned light-emitting diode multilayer module encapsulation method is the integration of every technology, if only adopt the basic procedure of the present invention that system is protruded reflection micro-structural point and oblique pier technology to be:
1. at seal carving brush circuit layer on the substrate: a plurality of nodes of on this layer printed circuit board, making;
2. system is protruded reflection micro-structural point: make most semicircular protrusions reflection micro-structural points at the printed circuit laminar surface, and each reflection micro-structural point is corresponding is configured between a plurality of nodes, and baking is fixed;
3. make frame and protrude oblique pier: around substrate, fix a white box (gummed), and be arranged with the oblique pier of protrusion at this frame inwall root edge;
4. positioning chip and routing: positioning chip on this layer printed circuit board (chip of light-emitting diode) and routing (welding gold thread), and baking is fixing;
5. some glue: the fixing or cloth fluorescence glue-line of encapsulation is on the surface of this resin.
Cooperate said method, being described as follows of unique texture of the present invention, effect:
Make the staggered a plurality of nodes that set on the layer printed circuit board of this substrate, and a plurality of semicircular protrusion reflection micro-structural points are interconnected between a plurality of nodes equally, it is interconnected to utilize above-mentioned design to allow chip present, can not produce excessively covering of light, cooperate protrude the chip light refraction utilization toward each other of naming a person for a particular job of reflection micro-structural again.
This frame is positioned at around this substrate, and is white, particularly utilizes the precision technology accurate spraying reflectorised paint on each assembly surface that sprays paint, and only avoiding spraying cloth influences chip; Spraying reflectorised paint a kind of means of only making reflector layer for the present invention are not limited only to the technology of emanation spraying paint, and for example reflecting metal sputter or reflectorized material surface deposition technique can be made reflector layer of the present invention for other; By this, the light of each chip output of the present invention can not absorbed by gold thread, frame or substrate, but once more by effectively reflection utilization.
This frame inwall root edge is arranged with and protrudes oblique pier, this cross section of protruding oblique pier can be a rectangle, the geometry of triangle or tool cambered surface, and it utilizes the precise glue dispensing facility to have to allow glue prolong the characteristics that frame inwall upper limb adheres to the back landing, protrude the capillarity (Capillarity) of oblique pier can breakdown point glue step the time by this, make silica gel diffusion layer glue face can not be subjected to capillarity (Capillarity) influence and be recess, so the fluorescence glue-line that the present invention is coated with subsequently can be smooth, fluorescent particles in it can not concentrate on central authorities yet, effectively promotes the luminous uniformity of finished product.
Description of drawings
The present invention is further detailed explanation below in conjunction with accompanying drawing and embodiment:
Fig. 1 is light-emitting diode (LED) module structure side view commonly used;
Fig. 2 is light-emitting diode (LED) module structure vertical view commonly used;
Fig. 3 is embodiment of the invention process step figure;
Fig. 4 is the present invention's seal carving brush circuit layer schematic diagram on substrate;
Fig. 5 makes frame for the present invention and protrudes oblique pier schematic diagram;
Fig. 6 protrudes oblique pier schematic cross-section for the present invention;
Fig. 7 protrudes oblique pier schematic cross-section for another shape of the present invention;
Fig. 8 protrudes reflection micro-structural point schematic diagram for system of the present invention;
Fig. 9 is positioning chip of the present invention and routing schematic diagram;
Figure 10 is the present invention's schematic diagram that sprays paint;
Figure 11 puts the glue schematic diagram for the present invention;
Figure 12 is a cloth fluorescence glue-line schematic diagram of the present invention.
[primary clustering symbol description]
" using always "
Transparent silica gel 14 fluorescence coatings 15
" the present invention "
Inclined-plane 311
Reflection micro-structural point 40
Reflectorised paint A
Silica gel diffusion layer 60 fluorescence glue-lines 61
Embodiment
Describe light-emitting diode multilayer module encapsulation method of the present invention in detail according to Fig. 3 flow chart of the present invention below, may further comprise the steps:
1. in seal carving brush circuit layer (see figure 4) on the substrate: at first on a substrate 20, make one deck layer printed circuit board 21, and on this layer printed circuit board 21, make staggered a plurality of nodes 211 that are equipped with;
2. make frame and protrude oblique pier (see figure 5): around these substrate 20 surfaces, fix a white box 30 of protruding, and white box 30 adopts gummed to be fixed in substrate 20, and utilize the precise glue dispensing facility to adhere to landing bottom surface, back by the inwall upper limb that glue is prolonging this frame 30, and then being formed on the oblique pier 31 of protrusion of these frame 30 inwall root edge windings, this protrudes the inclined-plane 311 that oblique pier 31 has expansion outwardly (Fig. 6 is the oblique pier 31 of protrusion of triangular-section, Fig. 7 oblique pier 31 of protrusion for the square-section);
3. system is protruded reflection micro-structural point (see figure 8): make a plurality of semicircular protrusion reflection micro-structural points 40 at these layer printed circuit board 21 surface point glue, and each reflection micro-structural is put between the 40 corresponding a plurality of nodes 211 that are configured in these layer printed circuit board 21 surfaces, subsequently again with the fixing reflection micro-structural point 40 that protrudes of roasting mode;
4. positioning chip and routing (see figure 9): the chip 50 of location light-emitting diode on this layer printed circuit board 21, with the routing facility gold thread 51 is welded on the layer printed circuit board 21 again, and baking is fixing;
5. the (see figure 10) of spraying paint: accurate spraying reflectorised paint A on aforementioned each assembly (substrate 20, line 51, node 211) surface, and utilize accurate flush coater to guarantee that chip 50 can be by spray cloth;
6. put glue (seeing Figure 11): in frame 30 around this substrate 20, insert the silica gel diffusion layer 60 (the normal some glue that claims) that silica gel mixes with spread powder, allow silica gel diffusion layer 60 cover or to flush in this and protrude oblique pier 31, utilize the capillarity of the expansion inclined-plane 311 reduction silica gel diffusion layers 60 that protrude oblique pier 31, and under smooth state, toast fixing;
7. cloth fluorescence glue-line (seeing Figure 12): after fluorescent material and silica gel evenly stirred into fluorescence glue-line 61, be coated with even fluorescence glue-line 61 and be covered on the surface of this silica gel diffusion layer 60.
By this, light-emitting diode multilayer module of the present invention can fully reflect the invalid light between the chip 50, and then promotes luminous efficiency; And above-mentioned fluorescence glue-line 61 is smooth and do not have particle and gather problem, promotes outgoing light homogeneity of the present invention more.
Above-mentioned light-emitting diode multilayer module encapsulation method is the integration of every technology, if only adopt system to protrude when reflecting micro-structural point and reflectorised paint technology, method step basic procedure of the present invention is as follows:
1. seal carving are brushed circuit layer on substrate;
2. system is protruded reflection micro-structural point;
3. positioning chip and routing:
4. spray paint;
5. encapsulation fixing (general common encapsulation fixed form).
Above-mentioned light-emitting diode multilayer module encapsulation method is the integration of every technology, if it is as follows only to adopt system to protrude the basic procedure of the present invention that reflects micro-structural point and oblique pier technology:
1. seal carving are brushed circuit layer on substrate;
2. system is protruded reflection micro-structural point;
3. make frame and protrude oblique pier;
4. positioning chip and routing;
5. some glue;
6. cloth fluorescence glue-line.
A plurality of semicircular protrusion reflection micro-structural point 40 of the present invention is configured between a plurality of chips 50, cooperate protrusion reflection micro-structural point 40 that chip 50 light refraction is toward each other utilized again again, reduce the ratio of invalid light, the utilance of enhancing chip 50 light;
For strengthening the effect of the invalid light of aforementioned protrusion reflection micro-structural point 40 refractions, the present invention is the following special structure design of innovative design in addition, and following technology not only can cooperate alone protrudes reflection micro-structural point 40, also can integrate to be implemented in the identical product:
One, make the staggered a plurality of nodes 211 that set on the layer printed circuit board 21 of substrate 20, also present interconnected after utilizing above-mentioned design to allow chip 50 locate, and each chip 50, gold thread 51 can not overlap and form excessively covering of light, and cooperating a plurality of protrusion reflection micro-structural points 40 is interconnected between a plurality of nodes equally, by this, the present invention can guarantee that the light of this embodiment can be reflected utilization more fully.
They are two years old, on this substrate 20 if when being manufactured with frame 30, frame 30 is positioned around this substrate 20, and frame 30 can be selected white (total reflection color) for use, and utilize the precision technology of spraying paint to reflect accurate spraying reflectorised paint A on the micro-structural point 40 at layer printed circuit board 21, gold thread 51, seam and protrusion, only avoiding spraying cloth influences this chip 50.By this, the light of each chip 50 outputs of the present invention can not be printed circuit layer 21, gold thread 51, seam and protrude reflection micro-structural point 40 and absorb, but (for example: white paint vehicle) effectively reflection utilizes by reflectorised paint A once more.
They are three years old, these frame 30 inwall root edges are arranged with and protrude oblique pier 31, this cross section of protruding oblique pier 31 can be the geometry of rectangle (see figure 7), triangle (see figure 6) or tool cambered surface, and its be utilize the precise glue dispensing facility by glue prolonging frame inwall upper limb adhere to the back landing form, by this capillarity (Capillarity) of protruding oblique pier 31 silica gel diffusion layer 60 peripheries can breakdown point glue the time, make silica gel diffusion layer 60 surfaces can not be subjected to capillarity (Capillarity) influence and be recess.By this, silica gel diffusion layer 60 surfacings of the present invention, Tu Bu fluorescence glue-line 61 also can smoothly be coated with subsequently, and the fluorescent particles in it will can not concentrate on central authorities, effectively promote the light refraction uniformity of finished product.
In addition, the coloured light that has that above-mentioned even fluorescence glue-line 61 convertible chips 50 are sent becomes white light, and can one optical lens (this is prior art) be set in addition thereon according to design requirement.
Among the top of the present invention various embodiment that say, evenly the fluorescence glue-line can utilize methods such as vacuum suction system embrane method, pulvis high pressure-temperature pressing, ink jet type or coating to make.Also can adopt gummed or integrally formed mode to combine between frame and the substrate.The reflector layer that protrudes reflection micro-structural point can be to adopt the long-pending fabrication techniques in the surperficial Shen of spraying reflectorised paint, reflecting metal sputter or reflectorized material to form.In addition, this protrude reflection micro-structural point shaping position can any one in illuminating source week side or two illuminating sources between, can both bring into play the effect that reflects the invalid light of horizontal direction.At last, this refraction protuberance shape can be designs such as common semi-circular, the pyramid type of general refractive design, square type, droplet-shaped, can both be according to the change in refraction under the various demands of design performance.
The most important thing is, structure another feature of the present invention's design, its glue is to insert the silica gel diffusion layer 60 (the normal some glue that claims) that silica gel mixes with spread powder in frame 30 around the substrate 20; After cloth fluorescence glue-line step then evenly stirs into fluorescence glue-line 61 with fluorescent material and silica gel, be coated with even fluorescence glue-line 61 and cover on the surface of this silica gel diffusion layer 60; By this, after the silica gel diffusion layer 60 (ground floor) that silica gel of the present invention mixes with spread powder solidifies, again the fluorescence glue-line 61 after another silica gel and the even stirring of fluorescent material is uniformly coated on (second layer) on the silica gel diffusion layer 60; Light-emitting diode (LED) module of the present invention can use silica gel diffusion layer 60 diffusion light with chip light emitting earlier, and is luminous by the luminous face that becomes of point, makes exiting surface evenly can not produce the multiple spot shadow, with fluorescence glue-line 61 light transferred to white light and promotes luminous efficiency again.
In sum, light-emitting diode multilayer module encapsulation method of the present invention and structure thereof, it is the layer printed circuit board that on substrate, sets the staggered node of tool, and around substrate, be manufactured with frame, this frame inwall root edge is arranged with and protrudes oblique pier, make a plurality of protrusion reflection micro-structural points at the printed circuit laminar surface in addition, positioning chip and routing on layer printed circuit board, and precision sprays reflectorised paint on the surface except the chip, and in frame, insert silica gel diffusion layer (some glue), and be coated with even fluorescence glue-line and be covered on the silica gel diffusion layer.By this, light-emitting diode of the present invention can reflect original invalid light and promote luminous efficiency, and the less advantage that can not produce the multiple spot shadow of even, the invalid light of the smooth exiting surface of fluorescence glue-line, more can strengthen efficient of the present invention.
Claims (24)
1, a kind of light-emitting diode (LED) module method for packing is characterized in that: seal carving brush circuit layer on substrate; And make a plurality of reflection micro-structural points at the printed circuit laminar surface, each reflects, and micro-structural point is corresponding to be configured between a plurality of nodes; Positioning chip and routing on described layer printed circuit board, and encapsulation is fixing.
2, according to the described light-emitting diode (LED) module method for packing of claim 1, it is characterized in that: also comprise following steps:
Seal carving brush circuit layer is made the staggered a plurality of nodes that set on described layer printed circuit board on substrate;
The system frame is fixed a frame around substrate;
System is protruded reflection micro-structural point, and baking is fixing subsequently;
Positioning chip and routing, chip presents interconnected, and baking is fixing subsequently;
Point glue is inserted the silica gel diffusion layer in described frame, and baking is fixing;
Cloth fluorescence glue-line, and be coated with even fluorescence glue-line and cover on the surface of described silica gel diffusion layer.
3, according to the described light-emitting diode (LED) module method for packing of claim 1, it is characterized in that: also comprise the step of spraying paint, accurate spraying reflectorised paint on described each assembly surface, and described chip is got rid of in spray cloth zone.
4, according to the described light-emitting diode (LED) module method for packing of claim 3, it is characterized in that: the described step of spraying paint sorted before a glue step.
5, a kind of light-emitting diode (LED) module structure that adopts the described method preparation of claim 1 is characterized in that: include in its encapsulation:
One substrate;
At least one chip is installed on the described substrate;
At least one protrusion reflection micro-structural point is positioned at by the described chip, and reflects the light of described chip.
6, according to the described light-emitting diode (LED) module structure of claim 5, it is characterized in that: described protrusion reflection micro-structural point semicircular in shape, taper shape, box-shaped or water droplet shape.
7, according to the described light-emitting diode (LED) module structure of claim 5, it is characterized in that: described protrusion reflection micro-structural point surface makes a reflector layer.
8, according to the described light-emitting diode (LED) module structure of claim 7, it is characterized in that: described reflector layer is the reflectorised paint in the surface spraying of described protrusion reflection micro-structural point.
9, according to the described light-emitting diode (LED) module structure of claim 5, it is characterized in that: behind the described chip routing, on described line, spray reflectorised paint.
10, according to the described light-emitting diode (LED) module structure of claim 7, it is characterized in that: described reflector layer is to form with reflecting metal sputter or reflectorized material surface deposition on described protrusion reflection micro-structural point surface.
11, a kind of light-emitting diode multilayer module encapsulation method is characterized in that, comprises following steps:
Seal carving brush circuit layer on substrate;
Make frame and protrude oblique pier, around substrate, fix a frame, and be arranged with the oblique pier of protrusion at described frame inwall root edge;
System reflection micro-structural point is made a plurality of reflection micro-structural points at the printed circuit laminar surface;
Positioning chip and routing;
Point glue is inserted the silica gel diffusion layer in described frame;
Cloth fluorescence glue-line, and be coated with even fluorescence glue-line and be covered on the surface of described silica gel diffusion layer.
12, according to the described light-emitting diode multilayer module encapsulation method of claim 11, it is characterized in that: in system reflection micro-structural point step, each reflects, and micro-structural point is corresponding to be configured between each chip, and baking is fixing; Fixing to toast after described positioning chip and routing step.
13, according to the described light-emitting diode multilayer module encapsulation method of claim 11, it is characterized in that: the oblique pier of described protrusion be utilize the precise glue dispensing machine by glue prolonging frame inwall upper limb adhere to the back landing form the capillarity of silica gel diffusion layer periphery (Capi llarity) when using breakdown point glue.
14, according to the described light-emitting diode multilayer module encapsulation method of claim 11, it is characterized in that: described cloth fluorescence glue-line step is to utilize vacuum to suck system embrane method, pulvis high pressure-temperature pressing, ink jet type or rubbing method to make.
15, a kind of light-emitting diode multilayer module encapsulation method is characterized in that, comprises following steps:
Seal carving brush circuit layer is made staggered many each nodes that set on described layer printed circuit board on substrate;
Make frame and protrude oblique pier, around substrate, fix a frame, and be arranged with the oblique pier of protrusion at described frame inwall root edge;
Make and protrude reflection micro-structural point, make a plurality of protrusions reflection micro-structural points at the printed circuit laminar surface, and each protrusion reflects, and micro-structural point is corresponding to be configured between a plurality of nodes;
Positioning chip and routing;
Spray paint, and precision sprays reflectorised paint on default assembly surface, and described chip is got rid of in the described cloth zone of spraying paint;
Point glue is inserted the silica gel diffusion layer in described frame;
Cloth fluorescence glue-line covers even fluorescence glue-line on the surface of described silica gel diffusion layer.
16, according to the described light-emitting diode multilayer module encapsulation method of claim 15, it is characterized in that: the fluorescence glue-line in the described cloth fluorescence glue-line step is to utilize vacuum to suck system embrane method, pulvis high pressure-temperature pressing, ink jet type or rubbing method to make.
17, according to the described light-emitting diode multilayer module encapsulation method of claim 15, it is characterized in that: the oblique pier of described protrusion be utilize the precise glue dispensing machine by glue prolonging frame inwall upper limb adhere to the back landing form the capillarity (Capillarity) of silica gel diffusion layer periphery when using breakdown point glue.
18, according to the described light-emitting diode multilayer module encapsulation method of claim 15, it is characterized in that: in described system reflection micro-structural point step, each reflects, and micro-structural point is corresponding to be configured between each chip, and baking is fixing; Fixing to toast after described positioning chip and routing step.
19, a kind of light-emitting diode (LED) module structure that adopts the method preparation of claim 15 includes in its encapsulation:
One substrate;
One frame is around described substrate;
Protrude oblique pier, be arranged on described frame inwall root edge, and the face of expanding outwardly;
At least one chip is installed on the described substrate, and is positioned at described frame;
At least one protrusion reflection micro-structural point is positioned at by the described chip, and reflects the light of described chip;
One silica gel diffusion layer, smooth filling out is overlying in the described frame;
One fluorescence glue-line evenly covers on the surface of described silica gel diffusion layer.
20, according to the described light-emitting diode (LED) module structure of claim 19, it is characterized in that: described protrusion reflection micro-structural point semicircular in shape, taper shape, box-shaped or water droplet shape.
21, according to the described light-emitting diode (LED) module structure of claim 19, it is characterized in that: described protrusion reflection micro-structural point surface spraying reflectorised paint.
22, according to the described light-emitting diode (LED) module structure of claim 19, it is characterized in that: behind the described chip routing, spraying reflectorised paint on the described line He on the described substrate.
23, according to the described light-emitting diode (LED) module structure of claim 19, it is characterized in that: the cross section of the oblique pier of described protrusion is the geometry of rectangle, triangle or tool cambered surface.
24, according to the described light-emitting diode (LED) module structure of claim 19, it is characterized in that: described frame is a white box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810002555 CN101483141A (en) | 2008-01-10 | 2008-01-10 | Multilayer module encapsulation method for LED and construction thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810002555 CN101483141A (en) | 2008-01-10 | 2008-01-10 | Multilayer module encapsulation method for LED and construction thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101483141A true CN101483141A (en) | 2009-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810002555 Pending CN101483141A (en) | 2008-01-10 | 2008-01-10 | Multilayer module encapsulation method for LED and construction thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347419A (en) * | 2010-08-03 | 2012-02-08 | 许凯淳 | Light emitting diode (LED) multilayer packaging method and structure thereof |
| CN104576633A (en) * | 2014-12-06 | 2015-04-29 | 广东聚科照明股份有限公司 | Full color COB light source |
-
2008
- 2008-01-10 CN CN 200810002555 patent/CN101483141A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347419A (en) * | 2010-08-03 | 2012-02-08 | 许凯淳 | Light emitting diode (LED) multilayer packaging method and structure thereof |
| CN104576633A (en) * | 2014-12-06 | 2015-04-29 | 广东聚科照明股份有限公司 | Full color COB light source |
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