CN101463985A - 发光二极管灯具 - Google Patents

发光二极管灯具 Download PDF

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CN101463985A
CN101463985A CNA2007102032948A CN200710203294A CN101463985A CN 101463985 A CN101463985 A CN 101463985A CN A2007102032948 A CNA2007102032948 A CN A2007102032948A CN 200710203294 A CN200710203294 A CN 200710203294A CN 101463985 A CN101463985 A CN 101463985A
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emitting diode
radiator
light
light emitting
led
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CN101463985B (zh
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徐弘光
王君伟
江文章
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Foxsemicon Integrated Technology Shanghai Inc
Foxsemicon Integrated Technology Inc
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Foxsemicon Integrated Technology Shanghai Inc
Foxsemicon Integrated Technology Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种发光二极管灯具，包括一第一发光二极管及一第二发光二极管，其中第一发光二极管的发光强度随温度的变化小于第二发光二极管，该发光二极管灯具还包括分离设置的第一及第二散热器，其中第一散热器与第一发光二极管热性连接，第二散热器与第二发光二极管热性连接，该第二散热器的散热效率高于第一散热器的散热效率，从而使各种发光二极管工作在适当的温度，输出稳定的白光。

Description

发光二极管灯具
技术领域
本发明关于一种照明装置，尤其是关于发光二极管灯具。
背景技术
目前，发光二极管(Light Emitting Diode，LED)因具光质佳、发光效率高、长寿命、低耗能等特性而逐渐取代冷阴极荧光灯(Cold Cathode Fluorescent Lamp，CCFL)作为照明装置的发光元件，广泛应用于交通指挥灯、汽车车灯、室内照明灯、路灯等。
然而，LED本身发出波长频谱极窄，要使用LED制作照明灯具，通常要通过混合多种色光以获得白光。例如，先利用蓝光与荧光粉搭配组合成白光，再搭配红色光提高其演色性，并同时提高其色温度，或者利用蓝光、蓝绿色光、橘色光以及红光组合成白光。然而，虽然搭配各种色光能获得白光，但由于琥珀色LED、红光LED、黄光LED、橘色光LED等LED的温度特性变异很大，特别是使用AlInGaP与GaAs材料的LED其温度变化影响其发光特性甚大，当由室温(约20℃)升高至80℃时，其发光强度会衰减约45％，使得LED照明灯具的颜色、色温度、混光后的照度都大幅改变。因此本发明希望能设计一种工作温度稳定，从而产生稳定白光的发光二极管灯具。
发明内容
有鉴于此，有必要提供一种具有稳定白光输出的发光二极管灯具。
一种发光二极管灯具，包括一第一发光二极管及一第二发光二极管，其中第一发光二极管的发光强度随温度的变化小于第二发光二极管，该发光二极管灯具还包括分离设置的第一及第二散热器，其中第一散热器与第一发光二极管热性连接，第二散热器与第二发光二极管热性连接，该第二散热器的散热效率高于第一散热器的散热效率。
上述发光二极管灯具针对不同的发光二极管的不同温度特性，利用分离式的散热器，使不同的发光二极管均工作在适当的温度，从而输出稳定的白光。
附图说明
下面参照附图，结合实施例作进一步说明：
图1是本发明发光二极管灯具的组合示意图；
图2是红光、蓝光、绿光发光二极管的发光强度与温度的关系图；
图3是本发明发光二极管灯具另一实施例示意图；
图4是本发明发光二极管灯具再一实施例示意图。
具体实施方式
如图1所示，本发明发光二极管(Light Emitting Diode，LED)灯具100包括一基板30，设置于基板30上的LED阵列，设置于基板30上的散热装置，及一罩设于LED阵列上的反射罩40。
该实施例中，基板30为一金属芯印刷电路板(Metal Core PCB，MCPCB)，该基板30通过对一铝板进行绝缘处理，即于其表面上形成一绝缘层(图未示)，而后于该绝缘层上建立一线路层而形成。可以理解的，基板30是为提供线路以安装该LED阵列，该基板30也可以是一普通的印刷电路板(printed circuit board，PCB)、陶瓷电路板等。相对于普通的电路板，本实施例金属芯印刷电路板具有更高的导热系数，可以快速的将LED产生的热量传导出去。
所述LED阵列包括若干排布于基板30上的颜色不同的LED，所述LED通过打线方式(wirebonding)或者覆晶方式(flipchip)与基板30的线路实现电性连接。该实施例中，所述LED阵列包括两种LED，即白光LED部分60与红光LED部分50，白光LED部分60与红光LED部分50所产生的光线在反射罩40内混合，产生白光照明。为达成高演色性的白光照明灯具100，白光LED部分60采用蓝光LED芯片，该蓝光LED芯片的表面设有黄色荧光粉，从而由蓝光LED芯片激发黄色荧光粉产生黄光，蓝光与黄光相混合而产生白光。该蓝光LED芯片的材料可为GaInN(氮化铟镓)或GaN(氮化镓)，波长在450~470nm。红光LED部分50采用红光LED芯片，其材料可为AlInGaP(铝铟镓磷化物)或GaAs(砷化镓)，波长610~635nm，通过红光与白光的搭配，混合后灯具100所产生白光的演色性可达90以上。
由于LED在工作时部分电能转化为热能，继而导致LED温度的升高，而在温度上升时，各色LED的发光强度与波长的变动并不相同，如图2所示为三种不同颜色LED的发光强度与温度的关系图，其中Tb线所示为蓝光LED的发光强度随温度的变化，Tr线表示红光LED的发光强度随温度的变化，Tg线表示绿光LED的发光强度随温度的变化，由图示可知，随温度的变化蓝光LED的发光强度改变最小，基本上不受温度变化的影响；绿光LED在温度由20℃上升至80℃时，发光强度大约下降15％，而红光LED在温度由20℃上升至40℃时，发光强度已大约下降15％。因此当温度上升时，应首先控制红光LED的温度，当绿光LED的环境温度达到80℃时，若能控制红光LED在40℃以下，即能够将混色后白光的变异控制于较低的范围。
根据各色LED的温度特征，本发明LED灯具100的散热装置包括对应各色LED设置的多个相分离的散热器。该实施例中，对应白光LED部分60与红光LED部分50分别设置一散热器，即第一、第二散热器10、20，该两散热器均为铝材质散热器，每一散热器10、20包括一底板170、270及若干散热鳍片180、280，每一底板170、270均呈台体状，包括一底面172、272及与该底面172、272相对的一顶面174、274，所述底面172、272贴设于基板30上，所述散热鳍片180、280自顶面174、274向上延伸。其中第一散热器10的底板170的横截面积沿厚度方向自底面172向顶面174逐渐减小，而第二散热器20的底板270的横截面积沿厚度方向自底面272向顶面274逐渐增加，从而第一散热器10的底板170的顶面174的面积小于底面172的面积，而第二散热器20的底板270的顶面274的面积大于底面272的面积。为保证鳍片180、280能将热量有效的散发至环境中，设置于各散热器10、20的顶面174、274的鳍片180、280的密度相当，从而相对于相应的底面172、272而言，第二散热器20相较于第一散热器10单位面积内具有更多的散热鳍片，第二散热器20相较于第一散热器10具有更高的散热效率。而各散热器10、20的底面172、272与各色LED的设置相对应，从而红光LED部分50相对于白光LED部分60具有更多的散热鳍片，有助于热量的快速散发，维持红光LED部分50在较低的温度下工作，保证红光LED部分50的发光强度与稳定性，从而维持LED灯具100所形成的白光的稳定性。
如图3所示为本发明LED灯具200的另一实施例示意图，与前一实施例相同的是同样通过于反射罩240内混合白光LED部分260与红光LED部分250的光线形成白光，白光LED部分60采用蓝光LED芯片，该蓝光LED芯片的表面设有黄色荧光粉，红光LED部分50采用红光LED芯片。所述白光LED部分260与红光LED部分250均电连接于金属芯电路基板230上。对应白光LED部分260与红光LED部分250分别设置一散热器210、220，其不同之处在于：该实施例中，两散热器210、220的材料不同，其中对应白光LED部分260的第一散热器210的材质为铝，对应红光LED部分250的第二散热器220的材质为铜，众所周知，同体积的铜其热容为同体积的铝的1.8倍，而铜的热传系数约为铝的1.6倍，因此第一散热器210采用铝材、第二散热器220采用铜材，第二散热器220相较于第一散热器210具有更高的散热效率，可有效增强红光LED部分250的散热效率，使红光LED部分250维持在较低的工作温度。
如图4所示为本发明LED灯具300的再一实施例示意图，该实施例中，通过混合蓝光LED、绿光LED、黄光LED与红光LED四种不同比例的色光达成高演色性的白光照明灯，而不采用荧光粉。其中蓝光LED与绿光LED构成第一发光部分360，该蓝光LED与绿光LED的芯片均采用GaInN或GaN材料，蓝光LED的波长在450~470nm，绿光LED的波长在510~540nm；红光LED与黄光LED构成第二发光部分350，红光LED与黄光LED的芯片均采用AlInGaP或GaAs材料，红光LED的波长为610~635nm，黄光LED的波长为580～600nm。所有LED的外侧罩设一散射片340，从而各色LED所产生的光线经散射片340混光后产生白光，本实施例LED灯具300能够使演色性达到95以上。同样，所述四色LED均设置于金属芯印刷电路基板330上，基板330的另一侧同时设置两铝材质散热器310、320，每一散热器310、320上均设置若干散热鳍片380、390，其中第一散热器310与蓝光LED及绿光LED(即第一发光部分360)对应设置，第二散热器320与红光LED及黄光LED(即第二发光部分350)对应设置。两散热器310、320的不同之处在于：第一散热器310的鳍片380的长度小于第二散热器320的鳍片390的长度。从而第二散热器320具有更大的散热面积，相较于第一散热器310具有更高的散热效率，从而使红光LED及黄光LED维持在较低的工作温度。
如上所述，本发明LED灯具根据各种LED的不同的温度特性，设置散热效率不同的散热器，可有效保证各色LED均工作在适当的温度，维持各色LED的发光效率，进而获得更为稳定的白光照明。以上仅列举本发明LED灯具的几种具体实施方式，本领域技术人员还可在本发明精神内做其它变化，只要其不偏离本发明的技术效果，都应包含在本发明所要求保护的范围之内，如各色LED的组合设置，可根据需要而变更。而散热器材质的选择并不限于铝、铜，其它导热性能较佳的材料，如银等均可作为散热器的材料，同样，散热器的设计可综合考虑鳍片的高度、底座的宽度以及材料的选择，只要能满足散热需求，维持适当的工作温度即可。

Claims (9)

  1. 【权利要求1】一种发光二极管灯具，包括一第一发光二极管及一第二发光二极管，其中第一发光二极管的发光强度随温度的变化小于第二发光二极管，其特征在于：该发光二极管灯具还包括分离设置的第一及第二散热器，其中第一散热器与第一发光二极管热性连接，第二散热器与第二发光二极管热性连接，该第二散热器的散热效率高于第一散热器的散热效率。
  2. 【权利要求2】如权利要求1所述的发光二极管灯具，其特征在于：该第一散热器的材料为铝，第二散热器的材料的热传导系数大于第一散热器的热传导系数。
  3. 【权利要求3】如权利要求1所述的发光二极管灯具，其特征在于：该第一、第二散热器分别包括一与相应发光二极管热连接的底座及自底座延伸的若干散热鳍片，该第一散热器的基座的面积沿远离发光二极管的方向逐渐减小，而第二散热器的基座的面积沿远离发光二极管的方向逐渐增加。
  4. 【权利要求4】如权利要求1所述的发光二极管灯具，其特征在于：该第一、第二散热器分别包括一与相应发光二极管热连接的底座及自底座延伸的若干散热鳍片，该第二散热器的鳍片的长度大于第一散热器的鳍片的长度。
  5. 【权利要求5】如权利要求1所述的发光二极管灯具，其特征在于：该发光二极管灯具还包括一设置于第一及第二发光二极管与第一及第二散热器之间的金属芯电路基板，所述第一及第二发光二极管电连接于该基板上。
  6. 【权利要求6】如权利要求1所述的发光二极管灯具，其特征在于：所述第一发光二极管为蓝光发光二极管，第二发光二极管为红光发光二极管。
  7. 【权利要求7】如权利要求6所述的发光二极管灯具，其特征在于：还包括一反射罩，该蓝光发光二极管的表面设有黄色荧光粉，由蓝光二极管产生的蓝光激发黄色荧光粉产生黄光，蓝光与黄光在该反射罩相混合而产生白光。
  8. 【权利要求8】如权利要求1所述的发光二极管灯具，其特征在于：第一发光二极管为绿光发光二极管与蓝光发光二极管的组合；第二发光二极管为红光发光二极管与黄光发光二极管的组合。
  9. 【权利要求9】如权利要求8所述的发光二极管灯具，其特征在于：该发光二极管灯具还包括一罩设于第一发光二极管与第二发光二极管外侧的散射片，第一发光二极管与第二发光二极管所产生的光线经散射片混光后产生白光。
CN2007102032948A 2007-12-21 2007-12-21 发光二极管灯具 Expired - Fee Related CN101463985B (zh)

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