CN101446736B - Semiconductor device and imaging capturing apparatus - Google Patents
Semiconductor device and imaging capturing apparatus Download PDFInfo
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- CN101446736B CN101446736B CN 200810177441 CN200810177441A CN101446736B CN 101446736 B CN101446736 B CN 101446736B CN 200810177441 CN200810177441 CN 200810177441 CN 200810177441 A CN200810177441 A CN 200810177441A CN 101446736 B CN101446736 B CN 101446736B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
Abstract
A MCP semiconductor device with an 'anti-shake' function includes a driver chip and a logic chip. The logic chip includes a correction signal processing unit which obtains a value for vibration of apparatus based on a vibration detection signal to generate a correction signal and a control signal output unit having a plurality of types of signal output sections which output a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The logic chip further includes a driver output terminal which outputs the vibration control signal to the driver chip, an external output terminal which outputs the control signal to an external circuit other than the driver chip, and also an output switch unit which connects one of the plurality of signal output sections with the driver output terminal or the external output terminal. The invention provides a logic chip with shake repair function suitable for large wide.
Description
Technical field
The present invention relates to a kind of be used to the to control semiconductor device of trembling etc. the vibration that causes by hand, the particularly logic chip that the signal that is used for vibration Restrained Control is handled.
Background technology
In picture pick-up devices such as video camera, digital camera, require to prevent because of tremble with hand be the shot object image of generation such as vibration of representative fuzzy, make a video recording that drawing a portrait becomes is difficult to see clearly, thereby be provided with anti-vibration functions.Known this anti-vibration functions detects the vibration of picture pick-up device with respect to subject, according to this vibration, by motor to the corrections that are shifted such as optical system (camera lens) (referring to citing document 1,2,3 etc.).
Patent documentation 1: the spy opens flat 7-23277 communique
Patent documentation 2: the spy opens flat 10-213832 communique
Patent documentation 3: the spy opens flat 11-187308 communique
Patent documentation 4: the spy opens the 2002-57270 communique
In above-mentioned patent documentation 1～3, the situation of utilizing microcomputer with the signal Processing of vibrating corresponding correction being used for calculating is disclosed.By in signal Processing, utilizing microcomputer, can the corresponding multiple processing of enough single microcomputers.On the other hand, because if the signal Processing amount increases then that processing speed can reduce, so it is just difficult more to be equipped with the progressive more processing by microcomputer of multifunction of equipment of anti-vibration functions.
Therefore, in order to improve processing speed, the signal processing circuit of integrated special use (special circuit) is effective.But if integrated special circuit, then each design all needs to change special circuit when changing, so be accompanied by the rising of manufacturing expense.
Therefore, need exploitation applied widely and have a semiconductor device of anti-vibration functions that can high speed processing.
Summary of the invention
The invention provides a kind of chip for driving that will have mimic channel and be packaged in the interior semiconductor device of same encapsulation with logic chip with digital circuit, described chip for driving has the vibration Correction and Control portion that the anti-vibration functions of the equipment that has loaded described semiconductor device is used, described logic chip has: the corrected signal handling part, thus its vibratory output of obtaining equipment based on the vibration detection signal of supplying with from vibration detecting element generates corrected signal; With the control signal efferent, it is to carrying out the described vibration Correction and Control portion with the vibration Correction and Control of the corresponding optics of vibration, output and the corresponding oscillation control signal of described corrected signal; Described control signal efferent has: drive output, and it exports described oscillation control signal to described chip for driving; Outside lead-out terminal, it is to other external circuit output control signals except that described chip for driving; With the output switching part, it is for the corresponding described oscillation control signal of the drive division of exporting and drive described optics, a signal efferent in the signal efferent of described multiple class is connected to described driving with on the lead-out terminal, and, other signal efferents in the signal efferent of described multiple class are connected on the described outside lead-out terminal in order to export and the corresponding described control signal of described external circuit.
In other forms of the present invention, in above-mentioned semiconductor device, the signal efferent of described multiple class comprises at least two kinds in the signal efferent of the signal efferent of voice coil motor control usefulness, signal efferent that Step-motor Control is used and piezoelectric element control usefulness.
In other forms of the present invention, in above-mentioned semiconductor device, the signal efferent of described multiple class comprises the signal efferent of voice coil motor control usefulness, the signal efferent of described voice coil motor control usefulness comprises: DA converter circuit, and its digital signal conversion that will supply with from described corrected signal handling part is a simulating signal; With pulse-length modulation portion, it is according to the digital signal production burst bandwidth modulation signals of supplying with from described corrected signal handling part; Described output switching part, side in described DA converter circuit and the described pulse-length modulation portion is connected to described driving with on the lead-out terminal, and in other signal efferents except that the signal efferent of described voice coil motor control usefulness that the signal efferent of the opposing party in described DA converter circuit and the described pulse-length modulation portion or described multiple class is included any one is connected on the described outside lead-out terminal.
Other forms of the present invention are the inventions about camera head, the described drive division that camera head comprises camera lens, imaging apparatus, drive described camera lens or described imaging apparatus, described vibration detecting element and described semiconductor device that the vibration of described equipment is detected.
The present invention also provides a kind of semiconductor device, the chip for driving that will have mimic channel is installed on the public substrate with the logic chip with digital circuit, thereby be encapsulated in the same encapsulation, described chip for driving has the vibration Correction and Control portion that the anti-vibration functions of the equipment that has loaded described semiconductor device is used, described logic chip has: the corrected signal handling part, thus its vibratory output of obtaining described equipment based on the vibration detection signal of supplying with from vibration detecting element generates corrected signal; The control signal efferent, it is to described vibration Correction and Control portion, output and the corresponding oscillation control signal of described corrected signal; Described control signal efferent has: drive output, and it exports described oscillation control signal to described chip for driving; Outside lead-out terminal, it is to other external circuit output control signals except that described chip for driving; With the output switching part, it is for the corresponding described oscillation control signal of the drive division of exporting and drive described optics, a signal efferent in the signal efferent of described multiple class is connected to described driving with on the lead-out terminal, and, other signal efferents in the signal efferent of described multiple class are connected on the described outside lead-out terminal in order to export and the corresponding described control signal of described external circuit; Described corrected signal handling part is made of described central arithmetic processing apparatus and special circuit, described special circuit is carried out the signal Processing that is used for generating according to described vibration detection signal described corrected signal, at least a portion in the calculation process that described central arithmetic processing apparatus can replace being carried out by described special circuit.
In other forms of the present invention, in above-mentioned semiconductor device, the signal efferent that is connected with described outside lead-out terminal in the signal efferent of described multiple class is based on the signal of being exported regulation by the signal of described central arithmetic processing apparatus output.
In other forms of the present invention, in above-mentioned semiconductor device, the signal Processing that in described central arithmetic processing apparatus, is used for generating described corrected signal according to described signal detection signal, the signal efferent that is connected with described outside lead-out terminal in the signal efferent of described multiple class, the described corrected signal that acceptance is generated by described central arithmetic processing apparatus, and the control signal of output regulation.
In other forms of the present invention, in above-mentioned semiconductor device, the signal efferent of described multiple class comprises at least two kinds in the signal efferent of the signal efferent of voice coil motor control usefulness, signal efferent that Step-motor Control is used and piezoelectric element control usefulness.
The invention relates to the invention of camera head, the described drive division that camera head comprises camera lens, imaging apparatus, drive described camera lens or described imaging apparatus, described vibration detecting element and described semiconductor device that the vibration of described equipment is detected.
(invention effect)
In addition, outside the lead-out terminal at the chip for driving that is encapsulated by the multicore sheet with logic chip outside lead-out terminal is set also.Can export corresponding control signal respectively from lead-out terminal and outside lead-out terminal both sides at chip for driving.Therefore, even also can supply with oscillation control signal, thereby can enlarge the scope of application of chip for non-encapsulated other vibration Correction and Control portions etc.
As the handling part of the corrected signal in the logic chip, utilize central arithmetic processing section and the signal processing circuit portion that has utilized special circuit, and they are switched optionally to utilize.In view of the above, can tackle and utilize the unity logic chip to carry out high speed processing, also can tackle the processing of the high universalizable that has utilized central arithmetic processing section based on special circuit.
Description of drawings
Fig. 1 is the figure of the summary circuit configuration example of the multicore sheet encapsulation in the expression embodiments of the present invention.
Fig. 2 is the key diagram of the summary of expression multicore sheet package semiconductor device 10.
Fig. 3 is the figure of the configuration example of the logic chip in the expression embodiments of the present invention.
Fig. 4 is the figure of another configuration example of the logic chip in the expression embodiments of the present invention.
Fig. 5 is the figure of the more detailed part configuration example of expression logic chip shown in Figure 4.
Fig. 6 is the figure of the another configuration example of the logic chip in the expression embodiments of the present invention.
Among the figure: the semiconductor device of 10-multicore sheet encapsulation (MCP); 20-chip for driving, logic chip; 40-logic chip power circuit; 50-moulded parts; 100-substrate; 220-vibration Correction and Control portion; 300-corrected signal handling part; 310-analog-to-digital conversion circuit (ADC); 320-vibration operational part; 330-position operational part; 340-central arithmetic processing section; 350-control signal efferent; 352d-DAC circuit; 352p-PWM translation circuit.
Embodiment
Below, with reference to accompanying drawing preferred implementation of the present invention is described.
Fig. 1 is that expression has the figure that the summary of the semiconductor device 10 of the anti-vibration functions in the present embodiment constitutes.This semiconductor device 10 is semiconductor devices of multicore sheet encapsulation (MCP) structure.The logic chip 30 that promptly has the chip for driving 20 of mimic channel and have a digital circuit is installed on the public substrate and is packaged in the same encapsulation.
It is the debugging functions that so-called hand is trembled etc. that semiconductor device 10 is used for carrying out anti-vibration functions that camera head such as video camera, digital camera for example adopts.In addition, though the anti-vibration functions among the present invention is not limited to the camera head purposes, is changed to example with the semiconductor device of the anti-vibration functions that is used to realize camera head and describes.
In camera head, if be that the vibration etc. of representative causes shot object image to blur because of trembling with hand, then photographed images becomes and is difficult to see clearly, so adopt anti-vibration functions mostly.This anti-vibration functions can realize by the following method, that is, detect picture pick-up device with respect to the vibration of subject and according to this vibration by motor to the be shifted method of correction of optics, or the method that camera data is revised etc.In the present embodiment, the semiconductor device at the anti-vibration functions of realizing revising based on displacement describes.In addition, in optics, comprise imaging apparatuss such as optical systems such as camera lens or CCD etc.
When carrying out vibration detection, or when carrying out mechanical correction based on the oscillation control signal of obtaining according to the vibration that is detected, need Analog signals by vibration detecting element.Therefore, suit to handle by 20 pairs of simulating signals of chip for driving with mimic channel.
On the other hand, when generating the oscillation control signal that is used for vibration is revised based on detected vibration, suitable vibration detection signal is carried out logical operation as digital signal.The generation of such oscillation control signal is suitable to be carried out by the logic chip 30 with digital circuit.
In example shown in Figure 1, by detecting vibration at the semiconductor device 10 outside vibration detecting elements of installing 510.Detected vibration is amplified by analog-to-digital conversion circuit (ADC) 310.Signal after the amplification is used for the computing of correction as vibration detection signal.In addition, as vibration detecting element 510, utilize for example gyro sensor constant angular velocity sensor.
Vibration Correction and Control portion 220 to the vibration correction usefulness of chip for driving 20 supplies with the oscillation control signal that is generated by logic chip 30.In addition, vibration Correction and Control portion 220 has and the drive division that is adopted (vibration correction is used element) 520 corresponding functions.
In the example of Fig. 1, utilize at the semiconductor device 10 outside drive divisions of installing 520 etc., to adjusting the position of optics, to eliminate the skew of the camera head that causes by vibration with respect to subject.In addition, as drive division 520, can utilize for example voice coil motor (VCM).Under the situation of utilizing VCM as drive division 520, VCM is arranged at pitch orientation 520p and azimuth direction 520y.Therefore, can vibrate correction by lens location is changed respectively on pitch orientation and azimuth direction.Vibration Correction and Control portion 220 is used for drive division 520 is driven.And the coil that is provided with VCM in vibration Correction and Control portion 220 carries out the circuit that BTL (BridgedTransless) drives.Oscillation control signal moves to desirable level by vibration Correction and Control portion 220 included level shifters, and the signal after level moves is amplified by the BTL amplifier, supply to the coil of VCM, thereby VCM is driven.
About the position of camera lens, the position detecting element of installing in the outside of semiconductor device 10 530 is driven and detects.For example utilize Hall element as position detecting element 530.Position detecting element 530 by the x axle with, y axle with being provided with two.And, offer logic chip 30 by position detecting element 530 detected position detection signals, and be used for the feedback of the lens driving of being undertaken by drive division 520.
Position detecting element is arranged in the chip for driving 20 with circuit 230.Position detecting element has with circuit 230: apply the Hall biasing circuit 232 of bias voltage and will amplify from the signal that position detecting element 530 obtains and generate the Hall amplifier 234 of position detection signal to position detecting element 530.
ADC310, the simulating signal of the vibration detection signal that will obtain from vibration detecting element 510 and position detection signal of obtaining from Hall amplifier 234 etc. is transformed to digital signal.
Corrected signal handling part 300 involving vibrations operational parts 320 and position operational part 330.Vibration operational part 320 is according to calculating movement amount signal (vibratory output) by the vibration detection signal of ADC310 output.The corrected signal that position operational part 330 is used according to position detection signal and the correction of movement amount signal calculating optical position component.In addition, has central arithmetic processing section (CPU) 340, can control the action of vibration operational part 320 and position operational part 330, or can carry out as described later by vibration operational part 320 and the vibration computing of position operational part 330 processing and part or all of position computing.
Control signal efferent 350 has the signal efferent of multiple class as described later.Each signal efferent will be exported to the vibration Correction and Control portion of correspondence at the corrected signal that corrected signal handling part 300 obtains.In addition, the vibration Correction and Control portion of the vibration Correction and Control of execution optics has multiple, and each signal efferent is corresponding to each vibration Correction and Control portion.
In logic chip 30, the data that need when also being integrated with computing etc. are carried out storage parts such as stored ROM or SRAM 360 and outside input/output terminal electronic circuit (I/O port) 370 etc.
Here, in logic chip 30, for I/O port 370, reception is worked by the supply of the 3.3V power supply of the device power circuit supply of outside.On the other hand, corrected signal handling part 300 in the present embodiment, adopts the low-voltage type circuit of accepting the supply of 1.2V power supply and working.In the present embodiment, the power supply of supplying with to corrected signal handling part 300 (1.2V power supply) is generated with power circuit 40 by logic chip.Logic chip is with power circuit 40, is formed on logic chip 30 to be encapsulated in the chip for driving 20 in the same package.Chip for driving 20 except that logic chip with go back the power circuit 40 involving vibrations Correction and Control portion 220 or position detecting element with mimic channel such as circuit 230 at the included circuit of logic chip 20, can on same semiconductor substrate, comprise bipolar transistor etc. and form.For logic chip with power circuit 40, also can be by the formation such as band gap constant-voltage circuit that comprise that bipolar transistor etc. constitutes.
In Fig. 2, represented that chip for driving 20 and logic chip 30 are installed on the public substrate 100, the moulded parts 50 by resin etc. is encapsulated in the situation in the same encapsulation.In the example of Fig. 2, these two chips overlapping chip for driving 20 on the logic chip of installing on the substrate 30 all covers these and disposes moulded parts 50.In addition, chip not only is defined in overlap mode, also can arrange in the horizontal direction and disposes.And substrate 100 can adopt core substrate, but also can adopt the method for packing that chip directly is installed in order to carry out higher, the slim installation of density on the wiring pattern film.And the chip of encapsulation not only is defined in two, also can as required other chip be installed together.
Below, describe for concrete structure by the logic chip in the present embodiment 30 referring to Fig. 3.
To the vibration detection signal that ADC310 supplied with and be converted to digital signal, offer vibration operational part (for example gyroscope balanced device) 320 from vibration detecting element (for example gyro sensor) 510.Vibration operational part 320 has carries out each special circuit handled that is used for computing.
Offer high-pass filtering circuit (HPF) 380 from the vibration detection signal of ADC310 output.HPF380 removes the low frequency content of frequency content of trembling the vibration that causes than hand from vibration detection signal.
Pan inclination decision circuitry 382, according to from the removal of HPF380 output hand tremble the vibration signal (angular velocity signal) of composition, judge the pan action and the tilting action of camera head.In addition, pan action is to make the movable in the horizontal direction action of camera head according to subject mobile, and tilting action is the action that camera head is moved in vertical direction.When shooting, if move according to the mobile camera head that makes of subject, then vibration detecting element 510 is exported and should be moved corresponding vibration detection signal.But, not to tremble the change that causes by the change of the angular velocity signal that pan moves, tilting action causes by hand, do not need the position of opticses such as camera lens is revised.Pan inclination decision circuitry 382 is not to be provided with in order not carry out position correction control under the situation of such pan action and tilting action.
Low-pass filter circuit (LPF) 386 is as integrating circuit performance function.That is, LPF386 is by having utilized the Filtering Processing of digital filter, and the vibration signal after gain is adjusted carries out integration, generates the movement amount signal (angle signal) of the amount of movement (vibratory output) of expression camera head.
Centering treatment circuit 388 deducts setting to the movement amount signal from LPF386 output.Carry out hand when trembling correcting process at camera head, during continuing to carry out correcting process, lens location can slowly depart from from the reference position, reaches the boundary point of camera lens movable range sometimes.Tremble correcting process if at this moment proceed hand, then becoming camera lens can move and can not move to other directions to a direction.That is to say, become and to move and can not move to the reference position of camera lens direction to the direction that surpasses movable range.Therefore, centering treatment circuit 388 is provided with in order to be difficult for arriving such correction boundary.That is, centering treatment circuit 388 is controlled it and is difficult to boundary near the movable range of camera lens by deduct setting from movement amount signal.
Movement amount signal by 388 centering of centering treatment circuit were handled offers position operational part (for example Hall balanced device) 330 by switch SW 1.Position operational part 330 has adder operation circuit 332 and servo circuit 334.
Supply with position detection signals to adder operation circuit 332, this position detection signal is to supply to ADC310 by position detecting element with circuit 230 and through the position detection signal of ADC310 digital conversion from the position detecting element 530 of the lens location that detects camera head.Adder operation circuit 332 for the position detection signal corresponding with present lens location, adds the movement amount signal of supplying with from centering treatment circuit 388.
Servo circuit 334 is based on the corrected signal that generates the driving that is used for controlling and driving portion 520 from adder operation circuit 332 signal supplied.In addition, in this servo circuit 334, utilized the Filtering Processing of digital filter.
Offer control signal efferent 350 from the corrected signal of servo circuit 334 outputs.Control signal efferent 350 will be trembled the vibration Correction and Control portion 220 pairing oscillation control signals of correction mechanism and export from the corrected signal of servo circuit 334 outputs as the hand that can be used as optics.
Here, in the example of Fig. 3,, possess the signal efferent 352 of VCM control usefulness, the signal efferent 354 that Step-motor Control is used, the signal efferent 356 of piezoelectric element control usefulness as control signal efferent 350.Each signal efferent, switch SW 52, SW54, SW56 by correspondence are connected with servo circuit 334.Supply with corrected signal to arbitrary signal efferent 352,354,356 of selecting by these switch SW 52, SW54, SW56, generate oscillation control signal by selected signal efferent.For example, adopting as drive division 520 under the situation of VCM, selecting to export the signal efferent 352 of the corresponding oscillation control signal of the vibration Correction and Control portion that uses with VCM 220.That is, select the signal efferent 352 of VCM control usefulness by SW52.In addition, the signal efferent 352 as this VCM control usefulness can adopt digitaltoanalogconversion (DAC) circuit.In addition, be transformed to oscillation control signal after the simulating signal, export to the vibration Correction and Control portion 220 that is used to drive VCM by the signal efferent 352 of VCM control usefulness.
As drive division 520, do not adopt under the situation of stepping motor not adopting VCM, by the signal efferent 354 that switch SW 54 selects Step-motor Control to use, under the situation that adopts piezoelectric element, select the signal efferent 356 of piezoelectric element control usefulness by switch SW 56.
Here, stepping motor is because decide driving for the current location of motor according to the drive signal of whether exporting a few pulse parts, so do not need the control by servo circuit.Therefore, adopting under the situation of stepping motor as drive division 520, during the signal efferent 354 output corrected signals used to Step-motor Control by servo circuit 334, according to the mode control signal efferent 354 of the function of cancelling servo circuit 334 in fact.And shown in dashed lines among Fig. 3, the signal efferent 354 for Step-motor Control is used can carry out the computing of corrected signal without special circuit in CPU340.At this moment, become the signal efferent 354 supply corrected signals of using to Step-motor Control from CPU340 by switch SW 2.Thus, can in signal efferent 354, generate corresponding oscillation control signal based on the corrected signal of supplying with from CPU340.
And, being not limited only to stepping motor usefulness, the computing of the vibration operational part 320 that is made of special circuit in Fig. 3 also can be carried out by CPU340.Utilizing the operation result of CPU340 (movement amount signal) to carry out under the situation of vibration correction, switch SW 1 is switched to CPU340, the operation result of CPU340 is exported to adder operation circuit 332.In addition, when not needing servo function, the operation result (corrected signal) of CPU340 is directly exported to control signal efferent 350 as mentioned above by switch SW 2.
And the calculation process in each circuit block of vibration operational part 320 can be replaced into the calculation process of being undertaken by CPU340.Be replaced into the operation result of CPU340 by switch SW 30, SW32, SW34, SW36, SW38, offer the special circuit of the computing of the correspondence of carrying out next stage.For example, when the Filtering Processing in the HPF circuit 380 was carried out by CPU340, gauge tap SW30 skipped the calculation process based on HPF circuit 380.Replace, from from ADC310 to the vibration detection signal that CPU340 supplies with, extract hand by CPU340 and tremble composition and calculate vibration signal, this calculation process result is exported to pan inclination decision circuitry 382 or gain adjustment circuit 384 from CPU340 by calculation process.Equally,, handle, also can adopt the operation result that obtains by CPU340 separately respectively for pan inclination judgement or gain adjustment or LPF and centering by switching corresponding switch SW 32, SW34, SW36, SW38.Thus,, refer to the calculation process in vibration operational part 320 here especially, a plurality of or whole calculation process of its part can be replaced by the computing among the CPU340 for the calculation process in the operational part (320,330).Therefore, for example, for the precision prescribed variation in drive division (vibration revise use element) 520 etc., the processing that is difficult to the circuit block by special use can be replaced into this processing the processing in CPU340 at once.Therefore, can the corresponding neatly variation of adopting the equipment of logic chip 30.
In addition, the signal efferent that control signal efferent 350 is included not merely is defined in the signal efferent 352 of VCM control usefulness, signal efferent 354 that Step-motor Control is used and the signal efferent 356 of piezoelectric element control usefulness.Can only adopt in these any two kinds as the signal efferent, and also can adopt signal efferent beyond these.For example, under the situation that adopts the ultrasonic motor as vibration Correction and Control portion 220, the signal efferent that the ultrasonic motor is used is set in control signal efferent 350.
And the chip for driving 20 of integrated vibration Correction and Control portion 220 as shown in Figure 1 and Figure 2, not merely limits and logic chip 30 is encapsulated in the interior situation of same encapsulation.That is the chip for driving 20 of, integrated vibration Correction and Control portion 220 also can be packaged in the encapsulation different with logic chip 30.At this moment, according to the classification of drive division 520, by in the signal efferent 352,354,356 any one, from 30 pairs of chip for driving of logic chip, 20 output oscillation control signals.
As mentioned above, can pass through chip for driving 20 and logic chip 30, or, carry out the vibration debugging functions by as the chip for driving 20 of different encapsulation and the combination of logic chip 30 as the MCP structure.Below, these vibration debugging functions are carried out simple declaration.
Under the situation of the vibration that does not have hand to tremble etc., be [0] from movement amount signal to vibration operational part 320 outputs handled based on the detection signal of vibration detecting element 510.At this moment, the lens location of the camera head that drives by drive division 520, its optical axis is consistent with the center of the imaging apparatus that is provided with in camera head.Therefore, the ADC310 from logic chip 30 represents position [0] to the position detection signal of position operational part 330 outputs.When servo circuit 334 is [0] in the value of position detection signal, export the corrected signal of controlling and driving portion 520 in the mode of keeping current lens location.
When inconsistent, supply with the position detection signal of the expression value different at the center of the optical axis of camera lens and imaging apparatus to adder operation circuit 332 from ADC310 with [0].Therefore, from servo circuit 334, for the position detection signal that is not [0], output drives the corrected signal of vibration section 520 according to the mode that makes this position detection signal become [0].
Handle by so repeatedly action, when the vibration that does not take place that hand is trembled etc., the controls lens position is so that the optical axis of camera lens is consistent with the center of imaging apparatus.
When hand having taken place tremble, camera head can move, therefore from the movement amount signal of vibration operational part 320 output expressions based on the amount of movement (vibratory output) of the camera head of being obtained by vibration detecting element 510 detected vibration detection signal.At this moment, consistent by the camera lens optical axis that VCM drives under the situation of utilizing VCM as drive division 520 with the center of imaging apparatus, so represent [0] from the position detection signal of ADC310 supply.Therefore, supply with to servo circuit 334: the position detection signal of this expression [0] with from 320 outputs of vibration operational part be not the sum signal of the movement amount signal of [0], servo circuit 334 is not that the mode of amount of movement amount signal of [0] is exported the corrected signal that camera lens is moved eliminating.This corrected signal is converted into simulating signal in the signal efferent 352 of VCM control usefulness, output to vibration Correction and Control portion 220 then, thereby drives VCM moving lens position.Therefore, supply with the fuzzy image that has suppressed to tremble the subject of generation to the imaging apparatus of camera head from this camera lens by hand.By repeating such control, carry out trembling etc. the Correction and Control of the vibration that produces by hand.
Below, referring to Fig. 4～Fig. 6, describe for configuration example more specifically, the variation of logic chip 30.In addition, the identical symbol of the structure filling identical with Fig. 3 is also omitted explanation.
In the example of logic chip shown in Figure 4 30, have with to chip for driving 20 outputs of as shown in Figure 1 and Figure 2 MCP structure the different outside lead-out terminal of drive output from the oscillation control signal of control signal efferent 350.The switching of drive output and outside lead-out terminal can be controlled by the switch SW 51 that is provided with between each signal efferent 352,354,356 and drive output and outside lead-out terminal, the switching part of SW53, SW55 etc.According to such structure, be encapsulated in the same package even will possess the chip for driving 20 and the logic chip as shown in Figure 4 30 of the circuit that drive division 520 is driven, also can from by the output of outside lead-out terminal from the control signal of signal efferent arbitrarily.Promptly, for example, for the equipment that utilizes stepping motor beyond the VCM or piezoelectric element as drive division 520, can be from being encapsulated in the outside lead-out terminal of the logic chip 30 in the identical encapsulation with chip for driving 20 with VCM, to stepping motor with or piezoelectric element with supplying with oscillation control signal.Therefore, not corresponding even the mechanism of drive division 520 and vibration are revised with the mechanism of circuit 220, also can not change encapsulation and utilize common MCP.
And, be not only limited to the mechanism of drive division 520 and vibrate situation about revising with the not corresponding lens driving mechanism of the mechanism of circuit 220, as shown in Figure 5, also can adopt for for example the chip for driving 20 of MCP structure and outside lead-out terminal both sides being supplied with mode from the output of the signal efferent 352 of VCM control usefulness.For example, the VCM oscillation control signal of supplying with to chip for driving 20 is used to the output from DAC circuit 352d, and can select to export as oscillation control signal from the pwm signal of the pwm circuit 352p that the VCM control signal is carried out export after the pulse-length modulation from outside lead-out terminal.Certainly, also can adopt opposite situation.Under situation about requiring than the more high-precision oscillation control signal of the pairing figure place of DAC circuit 352d, also can not carry out analog converting, and be used to output from PWM translation circuit 352p, it is supplied with to other outside VCM driving circuit by being arranged on outside LPF.PWM translation circuit 352p can be made of digital circuit, thereby can be than the easier increase of answering number of bits of DAC circuit 352d.Therefore, by adopting PWM translation circuit 352p to improve the figure place precision easily.
And as shown in Figure 5, outside lead-out terminal is not only limited to one, and can adopt can be from the other structure that the chip for driving 20 of outside or the encapsulation of multicore sheet is exported of each segment signal output.For example, in purposes that outside stepping motor and outside VCM both sides to the control that does not need servo circuit 334 export control signal etc., from pwm circuit 352p to outside VCM output based on oscillation control signal from the corrected signal of vibration operational part 320 that has utilized special circuit and position operational part 330.On the other hand, for the control signal that outside stepping motor is used, with VCM with side by side, will carry out the signal that computing obtains by CPU340 by switch SW 2 and output to the signal efferent 354 that Step-motor Control is used.And, the control signal of the signal that signal efferent 354 outputs of using from Step-motor Control are obtained based on carrying out computing by CPU340.
In configuration example shown in Figure 6,, can optionally supply to each signal efferent 352,354,356 by switch SW 52s, SW52c, SW54s, SW54c, SW56s, SW56c from the output of position operational part 330 with from the output of CPU340.And, constitute from each signal efferent 352,354,356 and Fig. 4 and similarly can switch to the output of MCP chip for driving still to outside lead-out terminal output by switch SW 51, SW53, SW55.
By such switching construction, finally can be according to the kind of the vibration correction mechanism that utilizes in the camera head that has adopted the logic chip 30 in the present embodiment, precision prescribed etc., select all or part of corrected signal of generating by special circuit or the corrected signal that generates by CPU340 in any one.And, can select whether to export oscillation control signal from any one signal efferent 352,354,356.By adopting the such structure that can switch, the logic chip 30 of present embodiment can easily be used for purposes very widely.And, as signal feed path to control signal efferent 350, as mentioned above and have from the feed path of position operational part 330 with from the feed path of CPU, revise in the usefulness so for example tremble at hand, supply to chip for driving 20 after also can generating control signal according to the signal of obtaining by vibration operational part 320 and position operational part 330, also can be from outside lead-out terminal the output of the signal efferent from correspondence CPU340 tremble correction lens driving such as automatic focus or convergent-divergent etc. and carry out the resulting control signal of computing for example beyond revising for hand.In the example shown in the single-point line of Fig. 6, can be to the control signal of outside lead-out terminal output from the signal efferent 356 of piezoelectric element control usefulness.At this moment, supply with that CPU340 carry out computing and the signal obtained to the signal efferent 356 of piezoelectric element control usefulness.
Claims (15)
1. semiconductor device, the logic chip that will have the chip for driving of mimic channel and have a digital circuit is encapsulated in the same encapsulation,
Described chip for driving has the vibration Correction and Control portion that the anti-vibration functions of the equipment that has loaded described semiconductor device is used,
Described logic chip has:
The corrected signal handling part, thus its vibratory output of obtaining equipment based on the vibration detection signal of supplying with from vibration detecting element generates corrected signal;
The control signal efferent, it possesses the signal efferent of multiple class, to carrying out the described vibration Correction and Control portion with the vibration Correction and Control of the corresponding optics of vibration, output and the corresponding oscillation control signal of described corrected signal;
Drive and use lead-out terminal, it exports described oscillation control signal to described chip for driving;
Outside lead-out terminal, it is to other external circuit output control signals except that described chip for driving; With
The output switching part, it is for the corresponding described oscillation control signal of the drive division of exporting and drive described optics, a signal efferent in the signal efferent of described multiple class is connected to described driving with on the lead-out terminal, and, other signal efferents in the signal efferent of described multiple class are connected on the described outside lead-out terminal in order to export and the corresponding described control signal of described external circuit.
2. semiconductor device according to claim 1 is characterized in that,
The signal efferent of described multiple class comprises at least two kinds in the signal efferent of the signal efferent of voice coil motor control usefulness, signal efferent that Step-motor Control is used and piezoelectric element control usefulness.
3. semiconductor device according to claim 1 is characterized in that,
The signal efferent of described multiple class comprises the signal efferent of voice coil motor control usefulness,
The signal efferent of described voice coil motor control usefulness comprises: DA converter circuit, and its digital signal conversion that will supply with from described corrected signal handling part is a simulating signal; With pulse-length modulation portion, it is according to the digital signal production burst bandwidth modulation signals of supplying with from described corrected signal handling part;
Described output switching part, side in described DA converter circuit and the described pulse-length modulation portion is connected to described driving with on the lead-out terminal, and in other signal efferents except that the signal efferent of described voice coil motor control usefulness that the signal efferent of the opposing party in described DA converter circuit and the described pulse-length modulation portion or described multiple class is included any one is connected on the described outside lead-out terminal.
4. according to any described semiconductor device in the claim 1～3, it is characterized in that,
The signal efferent of described multiple class and can be as the corresponding setting of vibration Correction and Control portion of the multiple class of the described vibration Correction and Control portion of the vibration Correction and Control of carrying out described optics.
5. picture pick-up device comprises:
Camera lens;
Imaging apparatus;
Drive the drive division of described camera lens or described imaging apparatus;
Detect the vibration detecting element of the vibration of described picture pick-up device; With
Semiconductor device, its chip for driving that will have mimic channel is encapsulated in the same encapsulation with the logic chip with digital circuit;
The described chip for driving of described semiconductor device has the vibration Correction and Control portion that the anti-vibration functions of described picture pick-up device is used,
The described logic chip of described semiconductor device has:
The corrected signal handling part, thus its vibratory output of obtaining described picture pick-up device based on the vibration detection signal of supplying with from described vibration detecting element generates corrected signal;
The control signal efferent, it possesses the signal efferent of multiple class, to carrying out the described vibration Correction and Control portion with the vibration Correction and Control of corresponding described camera lens of vibration or described imaging apparatus, output and the corresponding oscillation control signal of described corrected signal;
Drive and use lead-out terminal, it exports described oscillation control signal to described chip for driving;
Outside lead-out terminal, it is to other external circuit output control signals except that described chip for driving; With
The output switching part, it is in order to export and the corresponding described oscillation control signal of described drive division, a signal efferent in the signal efferent of described multiple class is connected to described driving with on the lead-out terminal, and, other signal efferents in the signal efferent of described multiple class are connected on the described outside lead-out terminal in order to export and the corresponding described control signal of described external circuit.
6. picture pick-up device according to claim 5 is characterized in that,
The signal efferent of described multiple class comprises at least two kinds in the signal efferent of the signal efferent of voice coil motor control usefulness, signal efferent that Step-motor Control is used and piezoelectric element control usefulness.
7. picture pick-up device according to claim 5 is characterized in that,
The signal efferent of described multiple class comprises the signal efferent of voice coil motor control usefulness,
The signal efferent of described voice coil motor control usefulness comprises: DA converter circuit, and its digital signal conversion that will supply with from described corrected signal handling part is a simulating signal; With pulse-length modulation portion, it is according to the digital signal production burst bandwidth modulation signals of supplying with from described corrected signal handling part;
Described output switching part, side in described DA converter circuit and the described pulse-length modulation portion is connected to described driving with on the lead-out terminal, and in other signal efferents except that the signal efferent of described voice coil motor control usefulness that the signal efferent of the opposing party in described DA converter circuit and the described pulse-length modulation portion or described multiple class is included any one is connected on the described outside lead-out terminal.
8. semiconductor device, the logic chip that will have the chip for driving of mimic channel and have a digital circuit is installed on the public substrate, thereby is encapsulated in the same encapsulation,
Described chip for driving has the vibration Correction and Control portion that the anti-vibration functions of the equipment that has loaded described semiconductor device is used,
Described logic chip has:
The corrected signal handling part, thus its vibratory output of obtaining described equipment based on the vibration detection signal of supplying with from vibration detecting element generates corrected signal;
The control signal efferent, it possesses the signal efferent of multiple class, to described vibration Correction and Control portion, output and the corresponding oscillation control signal of described corrected signal;
Drive and use lead-out terminal, it exports described oscillation control signal to described chip for driving;
Outside lead-out terminal, it is to other external circuit output control signals except that described chip for driving;
The output switching part, it is for the corresponding described oscillation control signal of the drive division of exporting and drive described optics, a signal efferent in the signal efferent of described multiple class is connected to described driving with on the lead-out terminal, and, other signal efferents in the signal efferent of described multiple class are connected on the described outside lead-out terminal in order to export and the corresponding described control signal of described external circuit; With
Central authorities' arithmetic processing apparatus, it carries out the Signal Processing used in the described equipment;
Described corrected signal handling part is made of any one party or the both sides in described central arithmetic processing apparatus and the special circuit, and described special circuit is carried out the signal Processing that is used for generating according to described vibration detection signal described corrected signal,
From described central arithmetic processing apparatus the signal efferent that is connected with described outside lead-out terminal the signal efferent of described multiple class is supplied with signal, the described control signal that generates based on described signal supplied is by described outside lead-out terminal output.
9. semiconductor device according to claim 8 is characterized in that,
The signal efferent of described multiple class comprises at least two kinds in the signal efferent of the signal efferent of voice coil motor control usefulness, signal efferent that Step-motor Control is used and piezoelectric element control usefulness.
10. according to Claim 8 or 9 described semiconductor devices, it is characterized in that,
Described central arithmetic processing apparatus can be carried out at least a portion of the described signal Processing in the described special circuit of described corrected signal handling part.
11. according to Claim 8 or 9 described semiconductor devices, it is characterized in that,
The signal efferent of described multiple class and can be as the corresponding setting of vibration Correction and Control portion of the multiple class of the described vibration Correction and Control portion of the vibration Correction and Control of carrying out described optics.
12. a picture pick-up device comprises:
Camera lens;
Imaging apparatus;
Drive the drive division of described camera lens or described imaging apparatus;
Detect the vibration detecting element of the vibration of described picture pick-up device; With
Semiconductor device, the chip for driving that will have mimic channel is installed on the public substrate with the logic chip with digital circuit, thereby is encapsulated in the same encapsulation;
The described chip for driving of described semiconductor device has the vibration Correction and Control portion that the anti-vibration functions of described picture pick-up device is used,
The described logic chip of described semiconductor device has:
The corrected signal handling part, thus its vibratory output of obtaining described equipment based on the vibration detection signal of supplying with from described vibration detecting element generates corrected signal;
The control signal efferent, it possesses the signal efferent of multiple class, to described vibration Correction and Control portion, output and the corresponding oscillation control signal of described corrected signal;
Drive and use lead-out terminal, it exports described oscillation control signal to described chip for driving;
Outside lead-out terminal, it is to other external circuit output control signals except that described chip for driving;
The output switching part, it is in order to export and the corresponding described oscillation control signal of described drive division, a signal efferent in the signal efferent of described multiple class is connected to described driving with on the lead-out terminal, and, other signal efferents in the signal efferent of described multiple class are connected on the described outside lead-out terminal in order to export and the corresponding described control signal of described external circuit; With
Central authorities' arithmetic processing apparatus, it carries out the Signal Processing used in the described picture pick-up device;
Described corrected signal handling part is made of any one party or the both sides in described central arithmetic processing apparatus and the special circuit, and described special circuit is carried out the signal Processing that is used for generating according to described vibration detection signal described corrected signal,
From described central arithmetic processing apparatus the signal efferent that is connected with described outside lead-out terminal the signal efferent of described multiple class is supplied with signal, the described control signal that generates based on described signal supplied is by described outside lead-out terminal output.
13. picture pick-up device according to claim 12 is characterized in that,
The signal efferent of described multiple class comprises at least two kinds in the signal efferent of the signal efferent of voice coil motor control usefulness, signal efferent that Step-motor Control is used and piezoelectric element control usefulness.
14. according to claim 12 or 13 described picture pick-up devices, it is characterized in that,
Described central arithmetic processing apparatus can be carried out at least a portion of the described signal Processing in the described special circuit of described corrected signal handling part.
15. according to claim 12 or 13 described picture pick-up devices, it is characterized in that,
The signal efferent of described multiple class and can be as the corresponding setting of vibration Correction and Control portion of the multiple class of described vibration Correction and Control portion.
Applications Claiming Priority (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007307699 | 2007-11-28 | ||
| JP2007-307699 | 2007-11-28 | ||
| JP2007-307698 | 2007-11-28 | ||
| JP2007307698 | 2007-11-28 | ||
| JP2007307699 | 2007-11-28 | ||
| JP2007307698 | 2007-11-28 | ||
| JP2008244571 | 2008-09-24 | ||
| JP2008-244572 | 2008-09-24 | ||
| JP2008244572A JP5329162B2 (en) | 2007-11-28 | 2008-09-24 | Semiconductor device and imaging device |
| JP2008-244571 | 2008-09-24 | ||
| JP2008244572 | 2008-09-24 | ||
| JP2008244571A JP5357480B2 (en) | 2007-11-28 | 2008-09-24 | Semiconductor device and imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101446736A CN101446736A (en) | 2009-06-03 |
| CN101446736B true CN101446736B (en) | 2010-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200810177441 Expired - Fee Related CN101446736B (en) | 2007-11-28 | 2008-11-27 | Semiconductor device and imaging capturing apparatus |
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| JP (1) | JP5357480B2 (en) |
| CN (1) | CN101446736B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6113579B2 (en) * | 2013-05-31 | 2017-04-12 | ローム株式会社 | Voice coil motor drive circuit and drive method, and lens module and electronic apparatus using the same |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04348739A (en) * | 1990-08-23 | 1992-12-03 | Olympus Optical Co Ltd | Endoscope device |
| JPH05101562A (en) * | 1991-10-09 | 1993-04-23 | Hitachi Ltd | Head positioning controller |
| JPH1165632A (en) * | 1997-08-11 | 1999-03-09 | Nachi Fujikoshi Corp | Controller |
| JPH1164720A (en) * | 1997-08-15 | 1999-03-05 | Canon Inc | Signal converter |
| JP4708525B2 (en) * | 2000-02-29 | 2011-06-22 | キヤノン株式会社 | Servo control device for motor |
| JP2001136789A (en) * | 1999-11-05 | 2001-05-18 | Nidec Copal Corp | Ic drive circuit |
| JP2002359998A (en) * | 2001-05-31 | 2002-12-13 | Nidec Copal Corp | Motor drive unit |
| JP2005292659A (en) * | 2004-04-02 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Imaging apparatus, lens barrel used in the imaging apparatus and camera body |
| JP4303653B2 (en) * | 2004-07-16 | 2009-07-29 | 富士フイルム株式会社 | Intermediate adapter |
| JP4892829B2 (en) * | 2004-11-15 | 2012-03-07 | ソニー株式会社 | Vibration generator, input / output device with tactile function, and electronic device thereof |
| JP2007017706A (en) * | 2005-07-07 | 2007-01-25 | Matsushita Electric Ind Co Ltd | Camera module |
| WO2007077705A1 (en) * | 2005-12-07 | 2007-07-12 | Matsushita Electric Industrial Co., Ltd. | Camera system, camera body, interchangeable lens, and method of controlling camera system |
| JP2008065205A (en) * | 2006-09-11 | 2008-03-21 | Nidec Copal Corp | Hand shake correcting device |
| JP2008116640A (en) * | 2006-11-02 | 2008-05-22 | Renesas Technology Corp | Autofocus controller and semiconductor integrated circuit device |
-
2008
- 2008-09-24 JP JP2008244571A patent/JP5357480B2/en active Active
- 2008-11-27 CN CN 200810177441 patent/CN101446736B/en not_active Expired - Fee Related
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| JP2009153101A (en) | 2009-07-09 |
| JP5357480B2 (en) | 2013-12-04 |
| CN101446736A (en) | 2009-06-03 |
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