JP5357480B2 - Semiconductor device and imaging device - Google Patents

Description

  The present invention relates to a semiconductor device for controlling vibration caused by camera shake or the like, and more particularly to a logic chip for processing a signal for vibration control.

Imaging devices such as video cameras and digital still cameras are required to prevent the subject image from being shaken by vibrations typified by camera shake, making it difficult to see the captured video, and are provided with an anti-vibration function. This anti-vibration function is known to detect the vibration of the imaging device with respect to the subject and shift-correct the optical system (lens) or the like with a motor in accordance with the vibration (see cited documents 1, 2, 3, etc.). ).
JP-A-7-23277 JP-A-10-213832 JP 11-187308 A JP 2002-57270 A

  Patent Documents 1 to 3 show that a microcomputer is used for signal processing for calculating a correction amount according to vibration. By using a microcomputer for signal processing, a single microcomputer can cope with various processes. On the other hand, when the amount of signal processing increases, the processing speed decreases, so that the processing by the microcomputer becomes more difficult as the functionality of the device equipped with the image stabilization function increases.

  Therefore, in order to improve the processing speed, it is effective to integrate a dedicated signal processing circuit (dedicated circuit). However, when the dedicated circuit is integrated, it is necessary to change the dedicated circuit every time the design is changed, leading to an increase in manufacturing cost.

  Therefore, it is desired to develop a semiconductor device having an anti-vibration function having a wide adaptive range and capable of high-speed processing.

  The present invention is a semiconductor device in which a driver chip having an analog circuit and a logic chip having a digital circuit are sealed in the same package, and the driver chip is in a device on which the semiconductor device is mounted. A vibration correction control unit for an anti-vibration function, the logic chip calculates a vibration amount of the device based on a vibration detection signal supplied from a vibration detection element, and generates a correction signal; and a correction signal processing unit A control signal output unit that outputs a vibration control signal according to the correction signal to a vibration correction control unit that executes vibration correction control of the optical component according to vibration, and the control signal output unit includes the control signal output unit, A driver output terminal for outputting the vibration control signal to a driver chip; an external output terminal for outputting a control signal to an external circuit other than the driver chip; and the optical unit. In order to output the vibration control signal corresponding to the drive unit that drives the signal, one signal output unit is connected to the driver output terminal from among a plurality of types of signal output units, and the control signal corresponding to the external circuit is output. Therefore, an output switching unit that connects another signal output unit among the plurality of types of signal output units to the external output terminal is provided.

  In another aspect of the present invention, in the semiconductor device, the plurality of types of signal output units include a signal output unit for controlling a voice coil motor, a signal output unit for controlling a stepping motor, and a signal output unit for controlling a piezo element. Includes at least two of them.

  In another aspect of the present invention, in the semiconductor device, the plurality of types of signal output units include a signal output unit for controlling a voice coil motor, and the signal output unit for controlling the voice coil motor includes the correction signal processing. A digital-analog conversion circuit that converts a digital signal supplied from the digital signal into an analog signal, and a pulse width modulation unit that generates a pulse width modulation signal from the digital signal supplied from the correction signal processing unit, and the output switching The unit connects one of the digital-analog conversion circuit and the pulse width modulation unit to the driver output terminal, and is included in the other of the digital-analog conversion circuit and the pulse width modulation unit or the plurality of types of signal output units Any one of the signal output units other than the signal output unit for controlling the voice coil motor is connected to the external output terminal.

  Another aspect of the present invention is an invention relating to an imaging apparatus, wherein the imaging apparatus detects a lens, an imaging element, the driving unit that drives the lens or the imaging element, and the vibration of the device. A vibration detection element and the semiconductor device described above are provided.

  In addition to the output terminals for the driver chips that are packaged with the logic chip and the multichip, external output terminals are provided. Corresponding control signals can be output from both the output terminal for the driver chip and the external output terminal. Therefore, the vibration control signal can be supplied to other vibration correction control units that are not packaged, and the applicable range of the chip can be expanded.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a schematic configuration of a semiconductor device 10 having a vibration isolation function according to this embodiment. The semiconductor device 10 is a semiconductor device having a multi-chip package (MCP) configuration. That is, the driver chip 20 having an analog circuit and the logic chip 30 having a digital circuit are mounted on a common substrate and sealed in the same package.

  The semiconductor device 10 is used for executing processing for realizing a vibration-proof function employed in an imaging device such as a video camera or a digital still camera, for example, a so-called camera shake correction function. Note that the image stabilization function according to the present invention is not limited to the use of the imaging apparatus, but hereinafter, a semiconductor device for realizing the image stabilization function of the imaging apparatus will be described as an example.

  In an imaging apparatus, when a subject image is shaken due to vibration or the like typified by camera shake, it is difficult to see a captured image, and thus an image stabilization function is often employed. This anti-vibration function can be realized by a method of detecting vibration of the imaging device with respect to the subject and correcting the shift of the optical component by a motor or a method of correcting the imaging data in accordance with the vibration. In this embodiment, a semiconductor device that realizes an image stabilization function by shift correction will be described. The optical component includes an optical system such as a lens and an image pickup device such as a CCD.

  When vibration is detected by the vibration detection element, or when mechanical correction is performed using a vibration control signal obtained from the detected vibration, it is necessary to handle an analog signal. For this reason, it is preferable to process an analog signal by the driver chip 20 having an analog circuit.

On the other hand, in order to generate a vibration control signal for correcting the vibration based on the detected vibration, it is preferable to perform a logical operation using the vibration detection signal as a digital signal. Such generation of the vibration control signal is preferably executed by the logic chip 30 having a digital circuit.

  In the example illustrated in FIG. 1, vibration is detected by a vibration detection element 510 attached to the semiconductor device 10. The detected vibration is amplified by an analog-digital conversion circuit (ADC) 310. The amplified signal is used for calculating the correction amount as a vibration detection signal. As the vibration detection element 510, for example, an angular velocity sensor such as a gyro sensor is used.

  A vibration control signal generated by the logic chip 30 is supplied to the vibration correction control unit 220 for vibration correction of the driver chip 20. The vibration correction control unit 220 has a function corresponding to the drive unit (vibration correction element) 520 employed.

  In the example of FIG. 1, the position of the optical component is adjusted using a drive unit 520 or the like externally attached to the semiconductor device 10 so as to cancel the displacement of the imaging device with respect to the subject due to vibration. For example, a voice coil motor (VCM) can be used as the drive unit 520. When a VCM is used as the drive unit 520, the VCM is provided in the pitch direction 520p and the yaw direction 520y. And vibration correction is enabled by shifting a lens position to a pitch direction and a yaw direction, respectively. The vibration correction control unit 220 is used to drive the drive unit 520. Further, the vibration correction control unit 220 is provided with a circuit for driving the VCM coil by BTL (Bridged Transless). The vibration control signal is shifted to a desired level by the level shift included in the vibration correction control unit 220, the level-shifted signal is amplified by the BTL amplifier, supplied to the coil of the VCM, and the VCM is driven.

  The position of the lens is detected by driving a position detection element 530 externally attached to the semiconductor device 10. As the position detection element 530, for example, a Hall element is used. Two position detecting elements 530 are provided for the x-axis and the y-axis. A position detection signal detected by the position detection element 530 is supplied to the logic chip 30 and used for lens driving feedback by the driving unit 520.

  The position detection element circuit 230 is provided in the driver chip 20. The position detection element circuit 230 includes a hall bias circuit 232 that applies a bias voltage to the position detection element 530 and a hall amplifier 234 that amplifies a signal obtained from the position detection element 530 and generates a position detection signal.

  The logic chip 30 includes an ADC 310, a correction signal processing unit 300 that generates a correction signal from the position detection signal, and a control signal output unit 350 that outputs a vibration control signal corresponding to the correction signal.

  The ADC 310 converts an analog signal such as a vibration detection signal obtained from the vibration detection element 510 and a position detection signal obtained from the hall amplifier 234 into a digital signal.

  The correction signal processing unit 300 includes a vibration calculation unit 320 and a position calculation unit 330. The vibration calculation unit 320 obtains a movement amount signal (vibration amount) from the vibration detection signal output from the ADC 310. The position calculation unit 330 obtains a correction signal for correcting the position of the optical component from the position detection signal and the movement amount signal. Further, the operation of the vibration calculation unit 320 and the position calculation unit 330 can be controlled, or part or all of the vibration calculation and the position calculation processed by the vibration calculation unit 320 and the position calculation unit 330 can be executed as will be described later. A central processing unit (CPU) 340 is provided.

The control signal output unit 350 includes a plurality of types of signal output units as will be described later. Each signal output unit outputs the correction signal obtained in the correction signal processing unit 300 to the corresponding vibration correction control unit. Note that there are a plurality of types of vibration correction control units that execute vibration correction control of optical components, and each signal output unit corresponds to each vibration correction control unit.

  Also integrated in the logic chip 30 are a memory unit 360 such as a ROM or SRAM that stores data necessary for calculation, an external input / output terminal circuit (I / O port) 370, and the like.

  Here, in the logic chip 30, the I / O port 370 operates by receiving the supply of 3.3V power supplied from an external device power supply circuit. On the other hand, in the present embodiment, the correction signal processing unit 300 employs a low-voltage circuit that operates by receiving a 1.2 V power supply. In the present embodiment, the power (1.2 V power) supplied to the correction signal processing unit 300 is generated by the logic chip power circuit 40. The logic chip power supply circuit 40 is formed in the driver chip 20 sealed in the same package as the logic chip 30. In addition to the logic chip power supply circuit 40, the driver chip 20 includes analog circuits such as a vibration correction control unit 220 and a position detection element circuit 230. The circuit included in the driver chip 20 can be formed on the same semiconductor substrate including a bipolar transistor or the like. The logic chip power supply circuit 40 can also be formed by a bandgap constant voltage circuit including bipolar transistors or the like.

  FIG. 2 shows a state where the driver chip 20 and the logic chip 30 are mounted on a common substrate 100 and sealed in the same package by a molding material 50 such as resin. In the example of FIG. 2, the two chips are obtained by stacking the driver chip 20 on the logic chip 30 mounted on the substrate 100 and covering the whole with the molding material 50. The chips are not limited to the stacking method, and may be arranged in the horizontal direction. The substrate 100 may be a core substrate, but a packaging method in which a chip is directly mounted on a wiring pattern film for higher density and thinner mounting may be employed. Furthermore, the number of chips to be packaged is not limited to two, and other chips may be mounted together if necessary.

  Next, a more specific configuration of the logic chip 30 according to the present embodiment will be described with reference to FIG.

  The vibration detection signal supplied from the vibration detection element (for example, gyro sensor) 510 to the ADC 310 and converted into a digital signal is supplied to the vibration calculation unit (for example, gyro-equalizer) 320. The vibration calculation unit 320 includes a dedicated circuit that executes each process for calculation.

  The vibration detection signal output from the ADC 310 is supplied to a high-pass filter circuit (HPF) 380. The HPF 380 removes a frequency component lower than the frequency component of vibration due to hand shake from the vibration detection signal.

  The pan / tilt determination circuit 382 determines the pan operation and tilt operation of the imaging apparatus based on the vibration signal (angular velocity signal) from which the hand shake component output from the HPF 380 is extracted. Note that the pan operation is an operation of moving the imaging device in the horizontal direction in accordance with the movement of the subject, and the tilt operation is an operation of moving the imaging device in the vertical direction. At the time of shooting, when the imaging device is moved according to the movement of the subject, the vibration detection element 510 outputs a vibration detection signal according to the movement. However, fluctuations in the angular velocity signal due to panning and tilting operations are not due to camera shake, and it may not be necessary to correct the positions of optical components such as lenses. The pan / tilt determination circuit 382 is provided so as not to perform position correction control in the case of such pan operation and tilt operation.

  The gain adjustment circuit 384 adjusts the gain according to the determination result from the pan / tilt determination circuit 382 so as to maintain the intensity of the vibration signal (angular velocity signal) for the camera shake component obtained from the HPF 380.

  The low-pass filter circuit (LPF) 386 functions as an integration circuit. In other words, the LPF 386 performs filtering using a digital filter, integrates the vibration signal with the gain adjusted, and generates a movement amount signal (angle signal) representing the movement amount (vibration amount) of the imaging apparatus.

  The centering processing circuit 388 subtracts a predetermined value from the movement amount signal output from the LPF 386. When camera shake correction processing is performed in the imaging apparatus, the lens position may gradually move away from the reference position and continue to be near the limit point of the movable range of the lens while the correction processing is continuously executed. If the camera shake correction process is continued at this time, the lens can move in one direction but cannot move in the other direction. That is, it can move in the direction of the reference position of the lens, but cannot move in the direction beyond the movable range. Therefore, the centering processing circuit 388 is provided to make it difficult to reach the limit of such correction. That is, the centering processing circuit 388 performs control so as not to approach the limit of the movable range of the lens by subtracting a predetermined value from the movement amount signal.

  The movement amount signal centered by the centering processing circuit 388 is supplied to the position calculation unit (for example, a hall equalizer) 330 via the switch SW1. The position calculation unit 330 includes an addition circuit 332 and a servo circuit 334.

  The adder circuit 332 is supplied from the position detection element 530 for detecting the lens position of the imaging apparatus to the ADC 310 via the position detection element circuit 230, and is supplied with a position detection signal digitally converted by the ADC 310. The adder circuit 332 adds the movement amount signal supplied from the centering processing circuit 388 to the position detection signal corresponding to the current lens position.

  The servo circuit 334 generates a correction signal for controlling the driving of the driving unit 520 based on the signal supplied from the adding circuit 332. In the servo circuit 334, filter processing using a digital filter is performed.

  The correction signal output from the servo circuit 334 is supplied to the control signal output unit 350. The control signal output unit 350 outputs the correction signal output from the servo circuit 334 as a vibration control signal corresponding to the vibration correction control unit 220 that can be employed as a camera shake correction mechanism for optical components.

  In the example of FIG. 3, the control signal output unit 350 includes a VCM control signal output unit 352, a stepping motor control signal output unit 354, and a piezo element control signal output unit 356. Each signal output unit is connected to the servo circuit 334 via a corresponding switch SW52, SW54, SW56. A correction signal is supplied to any one of the signal output units 352, 354, and 356 selected by the switches SW52, SW54, and SW56, and a vibration control signal is generated at the selected signal output unit. For example, when a VCM is employed as the drive unit 520, the VCM control signal output unit 352 capable of outputting a vibration control signal corresponding to the VCM vibration correction control unit 220 is selected. That is, the signal output unit 352 for VCM control is selected by SW52. Note that a digital-analog conversion (DAC) circuit can be employed as the signal output unit 352 for VCM control. The vibration control signal converted into an analog signal by the signal output unit 352 for VCM control is output to the vibration correction control unit 220 for driving the VCM.

  When a stepping motor is used as the driving unit 520 instead of the VCM, the signal output unit 354 for controlling the stepping motor is selected by the switch SW54. When the piezoelectric element is used, the switch SW56 is used for controlling the piezoelectric element. The signal output unit 356 is selected.

  Here, since the driving of the stepping motor is determined depending on how many pulses of the driving signal are output with respect to the current position of the motor, control by the servo circuit is unnecessary. Therefore, when a stepping motor is employed as the driving unit 520, when a correction signal is output to the signal output unit 354 for controlling the stepping motor via the servo circuit 334, the function of the servo circuit 334 is substantially canceled. Thus, the signal output unit 354 is controlled. Further, as indicated by a dotted line in FIG. 3, the correction signal may be calculated by the CPU 340 instead of the dedicated circuit for the signal output unit 354 for controlling the stepping motor. In this case, the correction signal is supplied from the CPU 340 to the signal output unit 354 for controlling the stepping motor via the switch SW2. As described above, the corresponding vibration control signal may be generated by the signal output unit 354 based on the correction signal supplied from the CPU 340.

  In addition to the stepping motor, the CPU 340 can execute the calculation of the vibration calculation unit 320 configured by a dedicated circuit in FIG. When vibration correction is executed using the calculation result (movement amount signal) of the CPU 340, the switch SW1 is switched to the CPU 340, and the calculation result of the CPU 340 is output to the addition circuit 332. When the servo function is unnecessary as described above, the calculation result (correction signal) of the CPU 340 is directly output to the control signal output unit 350 via the switch SW2.

  In addition, the calculation processing in each circuit block of the vibration calculation unit 320 can be replaced with calculation processing by the CPU 340. The calculation result replaced by the CPU 340 by the switches SW30, SW32, SW34, SW36, and SW38 is supplied to a dedicated circuit that executes the corresponding calculation in the next stage. For example, when the filtering process in the HPF circuit 380 is executed by the CPU 340, the switch SW30 is controlled to skip the calculation process by the HPF circuit 380. Instead, the CPU 340 extracts a shake component from the vibration detection signal supplied from the ADC 310 to the CPU 340 and calculates the vibration signal by arithmetic processing. The arithmetic processing result is sent from the CPU 340 to the pan / tilt determination circuit 382 and the gain adjustment circuit 384. Output. Similarly, by switching the corresponding switches SW32, SW34, SW36, and SW38, the calculation results by the CPU 340 can be individually adopted for pan / tilt determination, gain adjustment, LPF, and centering processing. In this way, the arithmetic processing in the arithmetic units (320, 330), particularly the arithmetic processing in the vibration arithmetic unit 320 here, part, plural or all of the arithmetic processing can be replaced with arithmetic in the CPU 340. For this reason, for example, when it is difficult to deal with a change in required accuracy in the drive unit (vibration correction element) 520 by processing in a dedicated circuit block, the processing can be replaced by the CPU 340. . Therefore, it is possible to flexibly cope with a change in a device that uses the logic chip 30.

  The signal output unit included in the control signal output unit 350 is not limited to the signal output unit 352 for VCM control, the signal output unit 354 for stepping motor control, and the signal output unit 356 for piezoelectric element control. . Only two of these can be employed as signal output units, and other signal output units can be employed. For example, when an ultrasonic motor is employed as the vibration correction control unit 220, the control signal output unit 350 is provided with a signal output unit for the ultrasonic motor.

Further, the driver chip 20 in which the vibration correction control unit 220 is integrated is not limited to being sealed in the same package as the logic chip 30 as shown in FIGS. That is, the driver chip 20 in which the vibration correction control unit 220 is integrated may be packaged separately from the logic chip 30. In this case, a vibration control signal is output from the logic chip 30 to the driver chip 20 from one of the signal output units 352, 354, and 356 depending on the type of the driving unit 520.

  As described above, the vibration correction function can be executed by the driver chip 20 and the logic chip 30 having the MCP configuration or by the combination of the driver chip 20 and the logic chip 30 having different packages. Hereinafter, this vibration correction function will be outlined.

  When there is no vibration such as camera shake, the movement amount signal output from the vibration calculation unit 320 that processes the detection signal from the vibration detection element 510 is [0]. In this case, the lens position of the imaging device driven by the drive unit 520 matches the optical axis with the center of the imaging device provided in the imaging device. Therefore, the position detection signal output from the ADC 310 of the logic chip 30 to the position calculation unit 330 indicates the position [0]. When the value of the position detection signal is [0], the servo circuit 334 outputs a correction signal for controlling the drive unit 520 so as to maintain the current lens position.

  When the optical axis of the lens does not coincide with the center of the image sensor, the adder circuit 332 is supplied with a position detection signal indicating a value different from [0] from the ADC 310. Therefore, the servo circuit 334 outputs a correction signal for driving the vibration unit 520 so that the position detection signal becomes [0] with respect to the position detection signal that is not [0].

  By repeating such an operation process, the lens position is controlled so that the optical axis of the lens coincides with the center of the image sensor when vibration such as camera shake does not occur.

  When camera shake occurs, the imaging apparatus moves. Therefore, the vibration calculation unit 320 indicates the movement amount (vibration amount) of the imaging apparatus obtained based on the vibration detection signal detected by the vibration detection element 510. A movement amount signal is output. At this time, when a VCM is used as the driving unit 520, the lens optical axis driven by the VCM coincides with the center of the image sensor, so that the position detection signal supplied from the ADC 310 is [0]. Show. Therefore, the servo circuit 334 is supplied with an addition signal of the position detection signal indicating [0] and the movement amount signal other than [0] output from the vibration calculation unit 320, and the servo circuit 334 is not [0]. A correction signal for moving the lens so as to cancel the movement amount signal is output. This correction signal is converted into an analog signal by the signal output unit 352 for VCM control and output to the vibration correction control unit 220, and the VCM is driven to move the lens position. Therefore, an image in which blurring of the subject due to camera shake is suppressed is supplied from the lens to the imaging device of the imaging device. By repeating such control, vibration correction control due to camera shake or the like is performed.

  Next, more specific configuration examples and modification examples of the logic chip 30 will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the structure which is common in FIG. 3, and description is abbreviate | omitted.

In the example of the logic chip 30 shown in FIG. 4, separately from the driver output terminal that outputs the vibration control signal from the control signal output unit 350 to the driver chip 20 having the MCP configuration as shown in FIGS. And an external output terminal. Switching between the driver output terminal and the external output terminal can be controlled by a switching unit such as switches SW51, SW53, and SW55 provided between the signal output units 352, 354, and 356 and the driver output terminal and the external output terminal. it can. With such a configuration, even when the driver chip 20 including a circuit for driving the driving unit 520 and the logic chip 30 as shown in FIG. 4 are sealed in the same package, an arbitrary output terminal can be used. A control signal from the signal output unit can be output. That is, for example, for a device using a stepping motor or a piezo element other than the VCM as the drive unit 520, the stepping motor is connected from the external output terminal of the logic chip 30 sealed in the same package as the VCM driver chip 20. Vibration control signals can be supplied for use in piezo elements. For this reason, even if the mechanism of the drive unit 520 and the mechanism of the vibration correction circuit 220 do not correspond, the common MCP can be used without changing the packaging.

  Further, the present invention is not limited to the lens driving mechanism in which the mechanism of the driving unit 520 and the mechanism of the vibration correction circuit 220 are not compatible, and as shown in FIG. 5, for example, a driver chip 20 having an MCP configuration, It is also possible to adopt a mode in which the output from the signal output unit 352 for VCM control is supplied to both of the output terminals. For example, the VCM vibration control signal supplied to the driver chip 20 uses the output from the DAC circuit 352d, but the PWM signal from the PWM circuit 352p that outputs the VCM control signal by pulse width modulation is output from the external output terminal. It can be selected and output as a vibration control signal. Of course, the reverse case may be used. When a vibration control signal with higher accuracy than the corresponding number of bits of the DAC circuit 352d is required, analog conversion is not performed and the output from the PWM conversion circuit 352p is used, and this is output via an LPF provided outside. It can also be supplied to another external VCM drive circuit. The PWM conversion circuit 352p can be configured by a digital circuit, and can cope with an increase in the number of bits more easily than the DAC circuit 352d. For this reason, it is easy to raise bit precision by adopting the PWM conversion circuit 352p.

  Further, as shown in FIG. 5, the configuration is not limited to one external output terminal, and each signal output unit can output to the driver chip 20 that is externally or multi-chip packaged. good. For example, in applications where control signals are output to both an external stepping motor that does not require control of the servo circuit 334 and an external VCM, the external VCM is connected to the vibration calculation unit 320 and the position calculation unit 330 using dedicated circuits. A vibration control signal based on the correction signal is output from the PWM circuit 352p. On the other hand, the control signal for the external stepping motor is input to the signal output unit 354 for controlling the stepping motor via the switch SW2 in parallel with the VCM signal. Then, a control signal based on the signal calculated by the CPU 340 is output from the signal output unit 354 for controlling the stepping motor.

  In the configuration example shown in FIG. 6, the output from the position calculation unit 330 and the output from the CPU 340 are selected by the switches SW52s, SW52c, SW54s, SW54c, SW56s, and SW56c for the signal output units 352, 354, and 356. Supply is possible. Further, each signal output unit 352, 354, 356 is configured to be switchable between the output to the MCP driver chip and the output to the external output terminal by the switches SW51, SW53, SW55 as in FIG.

With such a switching configuration, correction that is generated in whole or in part by a dedicated circuit according to the type, required accuracy, and the like of the vibration correction mechanism used in the imaging device that finally employs the logic chip 30 according to the present embodiment. Either a signal or a correction signal generated by the CPU 340 can be selected. In addition, it is possible to select whether to output the vibration control signal from any of the signal output units 352, 354, and 356. By adopting such a switchable configuration, the logic chip 30 according to the present embodiment can be easily adopted for a very wide range of uses. Further, since the supply path from the position calculation unit 330 and the supply path from the CPU coexist as a signal supply path to the control signal output unit 350, for example, the vibration calculation unit 320 and A control signal is generated from the signal obtained by the position calculation unit 330 and supplied to the driver chip 20, and the CPU 340 is used for driving other than camera shake correction from an external output terminal, for example, lens driving for autofocus, zooming, etc. The control signal obtained by calculating can be output from the corresponding signal output unit. In the example shown by the one-dot chain line in FIG. 6, the control signal from the signal output unit 356 for controlling the piezo element can be output to the external output terminal. In this case, a signal calculated by the CPU 340 is supplied to the signal output unit 356 for controlling the piezoelectric element.

It is a figure which shows the schematic circuit structural example of the multichip package which concerns on embodiment of this invention. It is explanatory drawing which shows the outline | summary of the semiconductor device 10 of a multichip package. It is a figure which shows the structural example of the logic chip which concerns on embodiment of this invention. It is a figure which shows the other structural example of the logic chip which concerns on embodiment of this invention. FIG. 5 is a diagram showing a more detailed partial configuration example of the logic chip shown in FIG. 4. It is a figure which shows the other structural example of the logic chip which concerns on embodiment of this invention.

Explanation of symbols

10 Semiconductor device of multi-chip package (MCP), 20 driver chip, logic chip, 40 power supply circuit for logic chip, 50 mold material, 100 substrate, 220 vibration correction control unit, 300 correction signal processing unit, 310 analog-digital conversion circuit ( ADC), 320 vibration calculation unit, 330 position calculation unit, 340 central calculation processing unit, 350
Control signal output unit, 352d DAC circuit, 352p PWM conversion circuit.

Claims (4)

A semiconductor device in which a driver chip having an analog circuit and a logic chip having a digital circuit are sealed in the same package,
The driver chip has a vibration correction control unit for an anti-vibration function in a device on which the semiconductor device is mounted,
The logic chip is
A dedicated circuit that calculates the amount of vibration of the device based on the vibration detection signal supplied from the vibration detection element and generates a correction signal using a servo circuit;
In addition to generating a control signal for an external circuit other than the driver chip, the amount of vibration of the device is calculated based on the vibration detection signal instead of the dedicated circuit, depending on the type of drive unit that drives the optical component. A calculation unit for obtaining the correction signal by obtaining
A control signal for outputting a vibration control signal corresponding to the correction signal generated by either the dedicated circuit or the arithmetic unit to the vibration correction control unit that executes vibration correction control of the optical component according to vibration An output section;
A driver output terminal for outputting the vibration control signal to the driver chip;
An external output terminal for outputting the control signal to the other external circuit;
The control signal output unit is
A plurality of types of signal output portion,
In order to output the vibration control signal corresponding to the drive unit, one signal output unit among the plurality of types of signal output units is connected to the driver output terminal, and the dedicated circuit generates the correction signal and drives the drive When the unit requires control by a servo circuit, the vibration control signal corresponding to the correction signal generated by the dedicated circuit is output to the driver output terminal, and the dedicated circuit generates the correction signal and drives the drive If part of a stepping motor which does not require control by the servo circuit, the said control one of the signal output section as function of the servo circuit is canceled, depending on the correction signal generated by the dedicated circuit and the When the vibration control signal is output to the driver output terminal and the calculation unit generates the correction signal, the correction generated by the calculation unit In order to output the vibration control signal corresponding to the signal to the driver output terminal, and to output the control signal corresponding to the external circuit, another signal output unit from the plurality of types of signal output units is connected to the external output terminal And an output switching unit that outputs the control signal generated by the arithmetic unit to the external output terminal ,
A semiconductor device characterized by the above. The semiconductor device according to claim 1,
The plurality of types of signal output units include at least two of a signal output unit for voice coil motor control, a signal output unit for stepping motor control, and a signal output unit for piezoelectric element control,
When a voice coil motor is used as the drive unit, the voice coil motor control signal output unit outputs the vibration control signal according to the correction signal generated by the dedicated circuit,
When a stepping motor is used as the driving unit, the signal output unit for controlling the stepping motor outputs the vibration control signal corresponding to the correction signal generated by the arithmetic unit. The semiconductor device according to claim 1,
The plurality of types of signal output units include a signal output unit for voice coil motor control,
The signal output unit for controlling the voice coil motor generates a pulse width modulation signal from a digital-analog conversion circuit that converts a digital signal supplied from the dedicated circuit into an analog signal, and a digital signal supplied from the dedicated circuit A pulse width modulation unit,
The output switching unit connects one of the digital analog conversion circuit and the pulse width modulation unit to the driver output terminal, and outputs the other of the digital analog conversion circuit and the pulse width modulation unit or the plurality of types of signal outputs. Any one of the signal output units other than the signal output unit for controlling the voice coil motor included in the unit is connected to the external output terminal. A lens,
An image sensor;
The drive unit for driving the lens or the imaging device;
The vibration detecting element for detecting vibration of the device;
An imaging apparatus comprising: the semiconductor device according to claim 1.

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