CN101436216B - 用于评估掩模的被评估图案的方法和系统 - Google Patents

用于评估掩模的被评估图案的方法和系统 Download PDF

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Publication number
CN101436216B
CN101436216B CN200810001014XA CN200810001014A CN101436216B CN 101436216 B CN101436216 B CN 101436216B CN 200810001014X A CN200810001014X A CN 200810001014XA CN 200810001014 A CN200810001014 A CN 200810001014A CN 101436216 B CN101436216 B CN 101436216B
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China
Prior art keywords
pattern
moments
evaluated
nominal
image
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Expired - Fee Related
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CN200810001014XA
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Chinese (zh)
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CN101436216A (zh
Inventor
伊谢·施瓦茨班德
肖穆里克·曼根
钱姆·布劳德
迈克尔·本-伊谢
加迪·格林伯格
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Applied Materials Israel Ltd
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Applied Materials Israel Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/66—Analysis of geometric attributes of image moments or centre of gravity
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Quality & Reliability (AREA)
  • Image Analysis (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
CN200810001014XA 2007-01-10 2008-01-10 用于评估掩模的被评估图案的方法和系统 Expired - Fee Related CN101436216B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88430807P 2007-01-10 2007-01-10
US60/884,308 2007-01-10

Publications (2)

Publication Number Publication Date
CN101436216A CN101436216A (zh) 2009-05-20
CN101436216B true CN101436216B (zh) 2013-03-06

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CN200810001014XA Expired - Fee Related CN101436216B (zh) 2007-01-10 2008-01-10 用于评估掩模的被评估图案的方法和系统

Country Status (4)

Country Link
US (1) US8098926B2 (https=)
JP (1) JP5140437B2 (https=)
KR (1) KR101267873B1 (https=)
CN (1) CN101436216B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2008957A (en) * 2011-07-08 2013-01-09 Asml Netherlands Bv Methods and systems for pattern design with tailored response to wavefront aberration.
US9341580B2 (en) * 2014-06-27 2016-05-17 Applied Materials, Inc. Linear inspection system
CN109891319B (zh) * 2016-10-24 2023-11-10 Asml荷兰有限公司 用于优化图案化装置图案的方法
US11321835B2 (en) * 2020-03-17 2022-05-03 Applied Materials Israel Ltd. Determining three dimensional information

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226417B1 (en) * 1997-08-04 2001-05-01 Ricoh Company, Ltd. Method and system for recognizing a rotated image pattern with reduced processing time and memory space
US6289499B1 (en) * 1997-12-31 2001-09-11 Avant! Corporation Proximity correction software for wafer lithography

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996642A (ja) * 1982-11-24 1984-06-04 Hamamatsu Photonics Kk 二次電子増倍器の製造方法
JPS6033679A (ja) * 1983-08-04 1985-02-21 Nec Corp モ−メント算出回路
JP2700260B2 (ja) * 1988-11-18 1998-01-19 株式会社日立製作所 画像処理装置
JP3247823B2 (ja) * 1995-06-26 2002-01-21 株式会社日立製作所 欠陥検査方法およびその装置並びに薄膜磁気ヘッド用の素子の製造方法
JPH09147109A (ja) * 1995-11-20 1997-06-06 Ricoh Co Ltd 特定マーク検出方法及び特定マーク検出装置
JPH1049684A (ja) * 1996-07-31 1998-02-20 Nec Corp 高速モーメント計算装置
US6603873B1 (en) 1999-11-12 2003-08-05 Applied Materials, Inc. Defect detection using gray level signatures
JP2004013095A (ja) 2002-06-11 2004-01-15 Fujitsu Ltd パターン画像比較方法、パターン画像比較装置及びプログラム
JP2004212277A (ja) * 2003-01-07 2004-07-29 Orbotech Ltd パターンを検査するための方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226417B1 (en) * 1997-08-04 2001-05-01 Ricoh Company, Ltd. Method and system for recognizing a rotated image pattern with reduced processing time and memory space
US6289499B1 (en) * 1997-12-31 2001-09-11 Avant! Corporation Proximity correction software for wafer lithography

Also Published As

Publication number Publication date
US20080166038A1 (en) 2008-07-10
KR101267873B1 (ko) 2013-05-27
CN101436216A (zh) 2009-05-20
JP5140437B2 (ja) 2013-02-06
JP2008181124A (ja) 2008-08-07
US8098926B2 (en) 2012-01-17
KR20080065942A (ko) 2008-07-15

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