CN101436006A - Double-surface position alignment apparatus and method - Google Patents
Double-surface position alignment apparatus and method Download PDFInfo
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- CN101436006A CN101436006A CNA2008102047740A CN200810204774A CN101436006A CN 101436006 A CN101436006 A CN 101436006A CN A2008102047740 A CNA2008102047740 A CN A2008102047740A CN 200810204774 A CN200810204774 A CN 200810204774A CN 101436006 A CN101436006 A CN 101436006A
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Abstract
The invention provides a double-side position aligning device and a double-side position aligning method. The double-side position aligning device comprises a mask plate provided with a mask aligning mark, a work piece table provided with a reference aligning mark, a silicon chip illuminating system and an optical projecting system, and also comprises a mask position aligning device, an exposure object, a first side position aligning device, a second side position aligning device, an image collecting and processing system, and a control system, wherein the mask plate is horizontally arranged. The double-side position aligning device and the method can complex structural design and assembly of the exposure object and the work piece table, and can also improve technological adaptability of a back position aligning device for a silicon chip to a back aligning mark of the silicon chip.
Description
Technical field
The invention relates to a kind of double-surface position alignment device and method, and particularly relevant for a kind of double-surface position alignment device and method of utilizing ultraviolet lamp optical system, visible illumination optical system and infrared illumination optics system.
Background technology
Along with people's living standard improves constantly and semiconductor technology growing, following semi-conductor market requires and will improve constantly the intellectuality of semiconductor packing device and the degree of miniaturization, not only want cube to urinate as digital products such as camera, mobile phone, PDA, more require its functional diversities and cost performance low in carrying.In order to realize the demand for development of packaging intellectuality and miniaturization, the needs to polycrystalline sheet (silicon chip) encapsulation solution have appearred.The encapsulation of polycrystalline sheet is a kind of silicon chip level packaging methods that two or more planar devices are piled up and couple together, and this packaged type is also referred to as three-dimensional (3D) encapsulation.3D encapsulation implementation mainly contains three kinds at present: lead-in wire bonding (Wire Bonding), flip-chip bonding (Flip Chip Bonding) and run through silicon chip through hole (TSV:Through Silicon Via), the traditional relatively lead key closing process mode of TSV technology mode wherein, have that interconnected wire length is short, lead-in wire density height, package area is little and packaging cost can not increase and advantage such as not increase substantially along with encapsulated wafer quantity, so TSV packaging technology mode be considered to future the most potential, also be one of the most promising 3D packaged type.The TSV packaging process is to form micro through-hole in the front of semiconductor wafer to the back side, to go up lower wafer with electric means then couples together, owing to adopt 3D vertical interconnect mode, thereby shortened the interconnected wire length between the wafer greatly, increased substantially thereby packaging has all been had on volume, performance and signal access transmission speed.
TSV packaging technology mode requires silicon chip is carried out double-sided exposure, therefore require semiconductor lithography equipment to have the double-sided alignment location means to satisfy the process requirements of double-sided exposure, this device can not only carry out position alignment to the front of silicon chip, and requirement can be aimed at silicon chip back.The double-surface position alignment device comprises silicon chip anterior locations alignment device and silicon chip back position alignment device, and the measuring accuracy of double-surface position alignment device will directly determine the alignment error of silicon chip front and rear surfaces litho pattern.
Realize that at present the method that the silicon chip back position is aimed at mainly contains two kinds: visible light mensuration and Infrared survey method.The visible light mensuration mainly is at two side bottoms of silicon chip wafer-supporting platform light path turnover and imaging system to be installed, and utilizes illumination and the imaging of visible light realization to the silicon chip rear indicia; The Infrared survey method is to utilize infrared light that the penetration capacity of silicon chip is realized illumination and imaging to rear indicia.Yet mainly there is following shortcoming in above-mentioned two kinds of silicon chip back position alignment methods on structure realizes: alignment light source is a visible light, requirement optical projection object lens are at visible light alignment wave band achromatism or require the position alignment device that the optical projection object lens are compensated at the aberration of aiming at the wave band generation, will increase the complexity of optical projection object lens or position alignment device design like this and increase design cost; In bottom, silicon chip wafer-supporting platform both sides two cover light path turnover systems are installed, cause Workpiece platform structure design and assembling more complicated; The position of alignment mark on silicon chip, the silicon chip back side there is particular requirement, need make corresponding silicon chip back side alignment mark in the silicon chip specified location, so the Technological adaptability of back side alignment mark is poor; Be subjected to the position limit of bottom, silicon chip wafer-supporting platform both sides light path turnover system, can only carry out the whole audience to whole silicon wafer and aim at, can not pursue an aligning to the alignment precision demand according to technology.
Summary of the invention
The object of the present invention is to provide a kind of double-surface position alignment device and method, to improve the disappearance of prior art.
The present invention proposes a kind of double-surface position alignment device, comprise the mask with mask alignment mark, work stage, silicon chip illuminator and optical projection system with benchmark alignment mark, and mask is for being horizontally disposed with, and more comprises mask position alignment device, exposure object, first position alignment device, second position alignment device, image acquisition and disposal system and control system.
The mask position alignment device is arranged at the top of mask, and the mask position alignment device comprises the ultraviolet imagery sensitive detection parts, and mask alignment mark and benchmark alignment mark image in respectively on the ultraviolet imagery sensitive detection parts.Exposure object is arranged at work stage, and exposure object comprises first and second, and first face comprises the primary importance alignment mark, and second face comprises second place alignment mark.First position alignment device is arranged at the top of exposure object and a side of optical projection system, and first position alignment device comprises the visual light imaging sensitive detection parts, and benchmark alignment mark and primary importance alignment mark image in respectively on the visual light imaging sensitive detection parts.Second position alignment device is arranged at the top of exposure object, and be arranged at the same side of optical projection system with first position alignment device, and comprise infrared imaging detector spare, benchmark alignment mark and second place alignment mark image on the infrared imaging detector spare respectively.Image acquisition and disposal system gather mask alignment mark and benchmark alignment mark on the ultraviolet imagery sensitive detection parts imaging with alignment mask version and work stage, gather benchmark alignment mark and primary importance alignment mark on the visual light imaging sensitive detection parts imaging aiming at first and work stage of exposure object, and gather benchmark alignment mark and second place alignment mark on infrared imaging detector spare imaging to aim at second and work stage of exposure object.Control system, first of control mask and exposure object faced accurate, and controls second of mask and exposure object and face accurate.
The present invention proposes a kind of double-surface position alignment methods in addition, comprises the following steps:
Mask and work stage are provided, and mask comprises mask alignment mark, and work stage comprises the benchmark alignment mark;
Exposure object is provided, is arranged at work stage, and exposure object comprises first and second, and first face comprises the primary importance alignment mark that second face comprises second place alignment mark;
Mask position alignment device, first position alignment device and second position alignment device are provided, and the mask position alignment device comprises the ultraviolet imagery sensitive detection parts, first position alignment device comprises the visual light imaging sensitive detection parts, and second position alignment device comprises infrared imaging detector spare;
Alignment mask position alignment device and benchmark alignment mark are determined the image space of benchmark alignment mark at the ultraviolet imagery detector;
Alignment mask position alignment device and mask alignment mark are determined the image space of mask alignment mark on the ultraviolet imagery detector;
According to mask alignment mark on the ultraviolet imagery detector image space and the benchmark alignment mark at the image space of ultraviolet imagery detector, determine the primary importance of mask with respect to work stage;
Aim at first position alignment device and benchmark alignment mark, determine the image space of benchmark alignment mark in the visual light imaging sensitive detection parts;
Aim at first position alignment device and primary importance alignment mark, determine the image space of primary importance alignment mark in the visual light imaging sensitive detection parts;
First second place determining exposure object at the image space of visual light imaging sensitive detection parts at the image space and the benchmark alignment mark of visual light imaging sensitive detection parts according to the primary importance alignment mark with respect to work stage;
With respect to the primary importance of work stage and first second place of exposure object, determine first the 3rd position of exposure object according to mask with respect to work stage with respect to work stage;
Aim at second position alignment device and benchmark alignment mark, determine the image space of benchmark alignment mark at infrared imaging detector spare;
Aim at second position alignment device and second place alignment mark, determine the image space of second place alignment mark at infrared imaging detector spare;
According to second place alignment mark in the image space and the benchmark alignment mark of infrared imaging detector spare are determined exposure object at the image space of infrared imaging detector spare second the 4th position with respect to work stage;
According to second four position with respect to work stage of mask, determine second the 5th position of exposure object with respect to workpiece with respect to the primary importance and the exposure object of work stage; And
According to first of the 3rd position exposure exposure object, and according to second of the 5th position exposure exposure object.
Double-surface position alignment device of the present invention and method have following beneficial effect:
1, because the mask position alignment device adopts ultraviolet source, its wavelength coverage is approaching or identical with the exposure light source wavelength; Therefore reduce optical projection object lens rete design complexities and complex structural designs degree, and finally reduced optical projection object lens processing and manufacturing cost;
2, no mechanical interface intercouples between first position alignment device and second position alignment device and the exposure object work stage, thereby has reduced the complexity of design of exposure object Workpiece platform structure and assembling;
3, the position of silicon chip back side alignment mark on silicon chip do not have specific (special) requirements, do not need to increase related process and makes silicon chip back side alignment mark, thereby improve the Technological adaptability of silicon chip back position alignment device to silicon chip back side alignment mark;
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1 shows that the synoptic diagram of double-surface position alignment device according to an embodiment of the invention.
Figure 2 shows that the image-forming principle synoptic diagram of the primary importance alignment mark of double-surface position alignment device according to an embodiment of the invention.
Figure 3 shows that visible light ray shines in the index path of primary importance alignment mark according to an embodiment of the invention.
Figure 4 shows that the image-forming principle synoptic diagram of the second place alignment mark of double-surface position alignment device according to an embodiment of the invention.
Figure 5 shows that Infrared is shone in the index path of second place alignment mark according to an embodiment of the invention.
Fig. 6 and Figure 7 shows that the process flow diagram of double-surface position alignment device according to an embodiment of the invention.
Embodiment
Figure 1 shows that the synoptic diagram of double-surface position alignment device according to an embodiment of the invention.Figure 2 shows that the image-forming principle synoptic diagram of the primary importance alignment mark of double-surface position alignment device according to an embodiment of the invention.Figure 3 shows that visible light ray shines in the index path of primary importance alignment mark according to an embodiment of the invention.Figure 4 shows that the image-forming principle synoptic diagram of the second place alignment mark of double-surface position alignment device according to an embodiment of the invention.Figure 5 shows that Infrared is shone in the index path of second place alignment mark according to an embodiment of the invention.
Please refer to Fig. 1 to Fig. 5, double-surface position alignment device 100 comprises mask 11, optical projection system 10, silicon chip illuminator 9, work stage 15, mask position alignment device 1, exposure object 16, first catoptron 6, beam splitting element 7, second catoptron 8, first position alignment device 2, second position alignment device 3, image acquisition and disposal system 4 and control system 5.
Mask 11 comprises mask alignment mark 12, and mask 11 is for being horizontally disposed with. and optical projection system 10 is arranged at mask 11 belows.Work stage 15 comprises benchmark alignment mark 20.
Mask position alignment device 1 is arranged at the top of mask 11, mask position alignment device 1 comprises ultraviolet lamp optical system (not marking among the figure), ultraviolet imagery optical system (not marking among the figure) and ultraviolet imagery sensitive detection parts 55, the ultraviolet lamp optical system is sent ultraviolet light, the ultraviolet light uniform irradiation is in mask alignment mark 12, and ultraviolet light is successively via mask 11, optical projection system 10 uniform irradiations are in benchmark alignment mark 20, on ultraviolet imagery sensitive detection parts 55, benchmark alignment mark 20 is successively through optical projection system 10 through the ultraviolet imagery optical system imaging for mask alignment mark 12, mask 11, the ultraviolet imagery optical system imaging is on ultraviolet imagery sensitive detection parts 55.
In the present embodiment, the ultraviolet lamp optical system is made of ultraviolet source (not marking among the figure), lighting fiber 50, condenser 51, ultraviolet beam splitter prism 52 and catoptron 53, realizes the even illumination to mask mark 12.Ultraviolet beam splitter prism 52 is coated with beam splitting coating on the inclined-plane of an one right-angle prism, ultraviolet beam splitter prism 52 also can be the ultraviolet beam splitting chip.The ultraviolet imagery optical system is made up of catoptron 53, ultraviolet beam splitter prism 52, ultraviolet imagery object lens 54 successively from mask alignment mark 12.
First position alignment device 2 is arranged at the top of exposure object 16 and a side of optical projection system 10, first position alignment device 2 comprises visible illumination optical system (not marking among the figure), visual light imaging optical system (not marking among the figure) and visual light imaging sensitive detection parts 34, the visible illumination optical system is sent visible light ray, visible light ray is successively via the visible illumination optical system, beam splitting element 7 and first catoptron, 6 uniform irradiation benchmark alignment mark 20 and primary importance alignment marks 19, benchmark alignment mark 20 and primary importance alignment mark 19 are successively through first catoptron 6, beam splitting element 7 and visual light imaging optical system image in respectively on the visual light imaging sensitive detection parts 34.
In the present embodiment, the visible illumination optical system is made of visible light source (not marking among the figure), lighting fiber 30, condenser 31, visible light beam splitter prism 32, beam splitting chip 7 and first catoptron 6, realizes the even illumination to silicon chip primary importance alignment mark 19 and work stage reference mark 20.The visual light imaging optical system is made of first catoptron 6, beam splitting chip 7, visible light beam splitter prism 32 and visual light imaging object lens 33 successively from silicon chip primary importance alignment mark 19.Plated film beam splitting coating on the inclined-plane of visible light beam splitter prism 32, reality also can be designed as the visible light beam splitting chip as required.Visible light source in first position alignment device 2, its wavelength coverage is away from the exposure wave band, to prevent the photoresist generation sensitization in the silicon chip process layer 17.
Second position alignment device 3 is arranged at the top of exposure object 16, and be arranged at the same side of optical projection system 10 with first position alignment device 2, second position alignment device 3 comprises infrared illumination optics system (not marking among the figure), infrared imaging optical system (not marking among the figure) and infrared imaging detector spare 44, infrared illumination optics system sends Infrared, Infrared is through infrared illumination optics system, second catoptron 8, beam splitting element 7 and first catoptron, 6 uniform irradiation benchmark alignment mark 20 and second place alignment marks 21, benchmark alignment mark 20 and second place alignment mark 21 are through first catoptron 6, beam splitting element 7, second catoptron 8, and infrared imaging optical system, image in respectively on the infrared imaging detector spare 44.
In the present embodiment, infrared illumination optics system is made of infrared light supply (not marking among the figure), lighting fiber 40, condenser 41, infrared beam splitter prism 42, external reflection right-angle prism 8, beam splitting chip 7 and catoptron 6.Infrared imaging optical system is made of catoptron 6, beam splitting chip 7, external reflection right-angle prism 8, infrared beam splitter prism 42 and infrared imaging object lens 43 successively from second place alignment mark 21, realizes that second place alignment mark 21 or work stage benchmark alignment mark 20 blur-free imagings are to infrared imaging detector spare 44.
Image acquisition and disposal system 4 are determined the primary importance of mask 11 with respect to work stage 15 according to mask alignment mark 12 image space and benchmark alignment mark 20 of 55 on the ultraviolet imagery detector at the image space of ultraviolet imagery detector 55.The position of imaging on image acquisition and disposal system 4 benchmark alignment marks 20 and the primary importance alignment mark 19 visual light imaging sensitive detection parts 34, can determine the second place of first 16a of exposure object 16, thereby determine three position of first 16a of exposure object 16 with respect to mask 11 according to the primary importance and the second place with respect to work stage 15.The position of imaging on image acquisition and disposal system 4 benchmark alignment marks 20 and the second place alignment mark 21 visual light imaging sensitive detection parts 44, can determine four position of second 16b of exposure object 16, determine second the 5th position of exposure object 16 according to primary importance and the 4th position with respect to mask with respect to work stage 15.
Fig. 6 and Figure 7 shows that the process flow diagram of double-surface position alignment device according to an embodiment of the invention.The double-surface position alignment methods comprises the following steps:
S601 provides mask 11 and work stage 15, and mask 11 comprises mask alignment mark 12, and work stage 15 comprises benchmark alignment mark 20;
S603 provides exposure object 16, is arranged at work stage 15, and exposure object 16 comprises first 16a and second 16b, and first 16a comprises that 19, the second 16b of primary importance alignment mark comprise second place alignment mark 21;
S605, mask position alignment device 1, first position alignment device 2 and second position alignment device 3 are provided, and mask position alignment device 1 comprises ultraviolet imagery sensitive detection parts 55, first position alignment device comprises that 34, the second position alignment devices of visual light imaging sensitive detection parts comprise infrared imaging detector spare 44;
S607, alignment mask position alignment device 1 and benchmark alignment mark 20 are determined the image space of benchmark alignment mark 20 at ultraviolet imagery detector 55;
S609, alignment mask position alignment device 1 and mask alignment mark 12 are determined the image space of mask alignment mark 12 on ultraviolet imagery detector 55;
S611 determines the primary importance of mask 11 with respect to work stage 15 according to the image space and the benchmark alignment mark 20 of mask alignment mark 12 on ultraviolet imagery detector 55 at the image space of ultraviolet imagery detector 55;
S701 aims at first position alignment device 2 and benchmark alignment mark 20, determines the image space of benchmark alignment mark in visual light imaging sensitive detection parts 34;
S703 aims at first position alignment device 2 and primary importance alignment mark 19, determines the image space of primary importance alignment mark 19 in visual light imaging sensitive detection parts 34;
S705 determines first 16a of exposure object 16 the second place with respect to work stage 15 at the image space and the benchmark alignment mark 20 of visual light imaging sensitive detection parts 34 at the image space of visual light imaging sensitive detection parts 34 according to primary importance alignment mark 19;
S707 with respect to first 16a of the primary importance of work stage 15 and exposure object 16 second place with respect to work stage 15, determines three position of first 16a of exposure object 16 with respect to mask 11 according to mask 11;
S709 aims at second position alignment device 3 and benchmark alignment mark 20, determines the image space of benchmark alignment mark 20 at infrared imaging detector spare 44;
S711 aims at second position alignment device 3 and second place alignment mark 21, determines the image space of second place alignment mark 21 at infrared imaging detector spare 44;
S713 determines second 16b of exposure object 16 four position with respect to work stage 15 at the image space and the benchmark alignment mark 20 of infrared imaging detector spare 44 at the image space of infrared imaging detector spare 44 according to second place alignment mark 21;
S715 with respect to second 16b of the primary importance of work stage 15 and exposure object 16 the 4th position with respect to work stage 15, determines five position of second 16b of exposure object 16 with respect to mask 11 according to mask 11; And
S717, according to first 16a of the 3rd position exposure exposure object 16, and second 16b of foundation the 5th position exposure exposure object 16.
Double-surface position alignment device of the present invention and method, because the mask position alignment device adopts ultraviolet source, its wavelength coverage is approaching or identical with the exposure light source wavelength, therefore reduce optical projection object lens rete design complexities and complex structural designs degree, and finally reduced optical projection object lens processing and manufacturing cost; No mechanical interface intercouples between first position alignment device and second position alignment device and the exposure object work stage, thereby has reduced the complexity of design of exposure object Workpiece platform structure and assembling; The position of alignment mark on silicon chip, the silicon chip back side do not have specific (special) requirements, do not need to increase related process and makes silicon chip back side alignment mark, thereby improve the Technological adaptability of silicon chip back position alignment device to silicon chip back side alignment mark.
Concrete case study on implementation only is a preferable case study on implementation of the present invention described in the present invention, is not to be used for limiting practical range of the present invention.Be that all equivalences of doing according to the content of the present patent application claim change and modification, all should be as technology category of the present invention.
Claims (25)
1, a kind of double-surface position alignment device has the mask of mask alignment mark, the work stage with benchmark alignment mark, silicon chip illuminator and optical projection system, and the aforementioned mask version is characterized in that comprising for being horizontally disposed with:
The mask position alignment device is arranged at the top of aforementioned mask version, and aforementioned mask position alignment device comprises the ultraviolet imagery sensitive detection parts, and aforementioned mask alignment mark and said reference alignment mark image in respectively on the above-mentioned ultraviolet imagery sensitive detection parts;
Exposure object is arranged at above-mentioned work stage, and above-mentioned exposure object comprises first and second, and above-mentioned first face comprises the primary importance alignment mark, and above-mentioned second face comprises second place alignment mark;
First position alignment device, be arranged at the top of above-mentioned exposure object and a side of above-mentioned optical projection system, and above-mentioned first position alignment device comprises the visual light imaging sensitive detection parts, and said reference alignment mark and above-mentioned primary importance alignment mark image in respectively on the above-mentioned visual light imaging sensitive detection parts;
Second position alignment device, be arranged at the top of above-mentioned exposure object, and be arranged at the same side of above-mentioned optical projection system with above-mentioned first position alignment device, and above-mentioned second position alignment device comprises infrared imaging detector spare, and said reference alignment mark and said second position alignment mark image in respectively on the above-mentioned infrared imaging detector spare;
Image acquisition and disposal system, gather aforementioned mask alignment mark and said reference alignment mark on above-mentioned ultraviolet imagery sensitive detection parts imaging to aim at aforementioned mask version and above-mentioned work stage, gather said reference alignment mark and above-mentioned primary importance alignment mark on above-mentioned visual light imaging sensitive detection parts imaging aiming at above-mentioned first and the above-mentioned work stage of above-mentioned exposure object, and gather said reference alignment mark and said second position alignment mark on above-mentioned infrared imaging detector spare imaging to aim at above-mentioned second and the above-mentioned work stage of above-mentioned exposure object; And
Control system, above-mentioned first of control aforementioned mask version and above-mentioned exposure object faced accurate, and controls above-mentioned second of aforementioned mask version and above-mentioned exposure object and face accurate.
2. double-surface position alignment device according to claim 1, it is characterized in that aforementioned mask position alignment device more comprises the ultraviolet illumination optical system ultraviolet imagery optical system of unifying, above-mentioned ultraviolet lamp optical system is sent ultraviolet light, above-mentioned ultraviolet light uniform irradiation is in the aforementioned mask alignment mark, and above-mentioned ultraviolet light is successively via the aforementioned mask version, above-mentioned optical projection system uniform irradiation is in the said reference alignment mark, on above-mentioned ultraviolet imagery sensitive detection parts, the said reference alignment mark is successively through the aforementioned mask version through above-mentioned ultraviolet imagery optical system imaging for the aforementioned mask alignment mark, above-mentioned optical projection system and above-mentioned ultraviolet imagery optical system imaging are on above-mentioned ultraviolet imagery sensitive detection parts.
3. double-surface position alignment device according to claim 2, it is characterized in that above-mentioned ultraviolet lamp optical system comprises ultraviolet source, first lighting fiber, first condenser, ultraviolet beam splitting element and the 3rd catoptron, above-mentioned ultraviolet source sends above-mentioned ultraviolet light, and above-mentioned ultraviolet light passes through above-mentioned first lighting fiber, above-mentioned first condenser, above-mentioned ultraviolet beam splitting element and above-mentioned the 3rd catoptron successively.
4. double-surface position alignment device according to claim 3 is characterized in that above-mentioned ultraviolet beam splitting element is ultraviolet beam splitter prism or ultraviolet beam splitting chip.
5. double-surface position alignment device according to claim 1, it is characterized in that above-mentioned double-surface position alignment device more comprises: first catoptron, the beam splitting element and second catoptron, and above-mentioned first position alignment device comprises visible illumination optical system and visual light imaging optical system, above-mentioned visible illumination optical system is sent visible light ray, above-mentioned visible light ray is successively via above-mentioned visible illumination optical system, above-mentioned beam splitting element and above-mentioned first catoptron uniform irradiation said reference alignment mark and above-mentioned primary importance alignment mark, said reference alignment mark and above-mentioned primary importance alignment mark pass through above-mentioned first catoptron successively, above-mentioned beam splitting element, above-mentioned visual light imaging optical system images in respectively on the above-mentioned visual light imaging sensitive detection parts.
6. double-surface position alignment device according to claim 5, it is characterized in that above-mentioned visible illumination optical system comprises visible light source, second lighting fiber, second condenser and visible light beam splitting element, above-mentioned visible light source sends above-mentioned visible light ray, and above-mentioned visible light ray passes through above-mentioned second lighting fiber, above-mentioned second condenser and above-mentioned visible light beam splitting element successively.
7. double-surface position alignment device according to claim 6 is characterized in that above-mentioned visible light beam splitting element is visible light beam splitter prism or visible light beam splitting chip.
8. double-surface position alignment device according to claim 5 is characterized in that above-mentioned second catoptron is external reflection right-angle prism, plane mirror or internal reflection right-angle prism.
9. double-surface position alignment device according to claim 5, it is characterized in that above-mentioned second position alignment device more comprises infrared illumination optics system and infrared imaging optical system, above-mentioned infrared illumination optics system sends Infrared, the above-mentioned infrared illumination optics of above-mentioned Infrared process system, above-mentioned second catoptron, above-mentioned beam splitting element and above-mentioned first catoptron uniform irradiation said reference alignment mark and the said second position alignment mark, said reference alignment mark and said second position alignment mark are through above-mentioned first catoptron, above-mentioned beam splitting element, above-mentioned second catoptron, and above-mentioned infrared imaging optical system, image in respectively on the above-mentioned infrared imaging detector spare;
10. double-surface position alignment device according to claim 9, it is characterized in that above-mentioned infrared illumination optics system comprises infrared light supply, the 3rd lighting fiber, the 3rd condenser and infrared beam splitting element, and above-mentioned infrared light supply sends above-mentioned Infrared, and above-mentioned Infrared is passed through above-mentioned the 3rd lighting fiber, above-mentioned the 3rd condenser and above-mentioned infrared beam splitting element successively.
11. double-surface position alignment device according to claim 10 is characterized in that above-mentioned infrared beam splitting element is infrared beam splitter prism or infrared beam splitting chip.
12. double-surface position alignment device according to claim 1 is characterized in that above-mentioned exposure object is a silicon chip.
13. double-surface position alignment device according to claim 1 is characterized in that above-mentioned ultraviolet imagery sensitive detection parts, above-mentioned visual light imaging sensitive detection parts, above-mentioned infrared imaging detector spare are charge coupled device camera or complementary metal oxide semiconductor (CMOS) video camera.
14. a double-surface position alignment methods is characterized in that comprising:
Mask and work stage are provided, and the aforementioned mask version comprises mask alignment mark, and above-mentioned work stage comprises the benchmark alignment mark;
Exposure object is provided, is arranged at above-mentioned work stage, and above-mentioned exposure object comprises first and second, and above-mentioned first face comprises the primary importance alignment mark that above-mentioned second face comprises second place alignment mark;
Mask position alignment device, first position alignment device and second position alignment device are provided, and aforementioned mask position alignment device comprises the ultraviolet imagery sensitive detection parts, above-mentioned first position alignment device comprises the visual light imaging sensitive detection parts, and above-mentioned second position alignment device comprises infrared imaging detector spare;
Aim at aforementioned mask position alignment device and said reference alignment mark, determine the image space of said reference alignment mark at above-mentioned ultraviolet imagery detector;
Aim at aforementioned mask position alignment device and aforementioned mask alignment mark, determine the image space of aforementioned mask alignment mark on above-mentioned ultraviolet imagery detector;
According to the aforementioned mask alignment mark on above-mentioned ultraviolet imagery detector image space and the said reference alignment mark at the image space of above-mentioned ultraviolet imagery detector, determine the primary importance of aforementioned mask version with respect to above-mentioned work stage;
Aim at above-mentioned first position alignment device and said reference alignment mark, determine the image space of said reference alignment mark in above-mentioned visual light imaging sensitive detection parts;
Aim at above-mentioned first position alignment device and above-mentioned primary importance alignment mark, determine the image space of above-mentioned primary importance alignment mark in above-mentioned visual light imaging sensitive detection parts;
The above-mentioned primary importance alignment mark of foundation is determined above-mentioned exposure object at the image space and the said reference alignment mark of above-mentioned visual light imaging sensitive detection parts at the image space of above-mentioned visual light imaging sensitive detection parts above-mentioned first second place with respect to above-mentioned work stage;
With respect to the above-mentioned primary importance of above-mentioned work stage and above-mentioned first said second position of above-mentioned exposure object, determine above-mentioned first the 3rd position of above-mentioned exposure object according to the aforementioned mask version with respect to above-mentioned workpiece with respect to above-mentioned work stage;
Aim at above-mentioned second position alignment device and said reference alignment mark, determine the image space of said reference alignment mark at above-mentioned infrared imaging detector spare;
Aim at above-mentioned second position alignment device and said second position alignment mark, determine the image space of said second position alignment mark at above-mentioned infrared imaging detector spare;
According to the said second position alignment mark in the image space and the said reference alignment mark of above-mentioned infrared imaging detector spare are determined above-mentioned exposure object at the image space of above-mentioned infrared imaging detector spare above-mentioned second the 4th position with respect to above-mentioned work stage;
According to above-mentioned second above-mentioned four position with respect to above-mentioned work stage of aforementioned mask version, determine above-mentioned second the 5th position of above-mentioned exposure object with respect to above-mentioned workpiece with respect to the above-mentioned primary importance and the above-mentioned exposure object of above-mentioned work stage; And
According to expose above-mentioned first of above-mentioned exposure object of above-mentioned the 3rd position, and according to expose above-mentioned second of above-mentioned exposure object of above-mentioned the 5th position.
15. double-surface position alignment methods according to claim 14 is characterized in that above-mentioned exposure object is a silicon chip.
16. double-surface position alignment methods according to claim 14 is characterized in that above-mentioned ultraviolet imagery sensitive detection parts, above-mentioned visual light imaging sensitive detection parts, above-mentioned infrared imaging detector spare are charge coupled device camera or complementary metal oxide semiconductor (CMOS) video camera.
17. double-surface position alignment methods according to claim 14 is characterized in that aforementioned mask position alignment device more comprises the ultraviolet illumination optical system ultraviolet imagery optical system of unifying.
18. double-surface position alignment methods according to claim 17, it is characterized in that above-mentioned ultraviolet lamp optical system comprises ultraviolet source, first lighting fiber, first condenser, ultraviolet beam splitting element and the 3rd catoptron, above-mentioned ultraviolet source sends above-mentioned ultraviolet light, and above-mentioned ultraviolet light passes through above-mentioned first lighting fiber, above-mentioned first condenser, above-mentioned ultraviolet beam splitting element and above-mentioned the 3rd catoptron successively.
19. double-surface position alignment methods according to claim 18 is characterized in that above-mentioned ultraviolet beam splitting element is ultraviolet beam splitter prism or ultraviolet beam splitting chip.
20. double-surface position alignment methods according to claim 14 is characterized in that above-mentioned first position alignment device comprises visible illumination optical system and visual light imaging optical system.
21. double-surface position alignment methods according to claim 20, it is characterized in that above-mentioned visible illumination optical system comprises visible light source, second lighting fiber, second condenser and visible light beam splitting element, above-mentioned visible light source sends above-mentioned visible light ray, and above-mentioned visible light ray passes through above-mentioned second lighting fiber, above-mentioned second condenser and above-mentioned visible light beam splitting element successively.
22. double-surface position alignment methods according to claim 21 is characterized in that above-mentioned visible light beam splitting element is visible light beam splitter prism or visible light beam splitting chip.
23. double-surface position alignment methods according to claim 14 is characterized in that above-mentioned second position alignment device more comprises infrared illumination optics system and infrared imaging optical system.
24. double-surface position alignment methods according to claim 23, it is characterized in that above-mentioned infrared illumination optics system comprises infrared light supply, the 3rd lighting fiber, the 3rd condenser and infrared beam splitting element, and above-mentioned infrared light supply sends above-mentioned Infrared, and above-mentioned Infrared is passed through above-mentioned the 3rd lighting fiber, above-mentioned the 3rd condenser and above-mentioned infrared beam splitting element successively.
25. double-surface position alignment methods according to claim 24 is characterized in that above-mentioned infrared beam splitting element is infrared beam splitter prism or infrared beam splitting chip.
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| CN2008102047740A CN101436006B (en) | 2008-12-17 | 2008-12-17 | Double-surface position alignment apparatus and method |
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| CN101436006B CN101436006B (en) | 2011-10-12 |
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| CN2008102047740A Active CN101436006B (en) | 2008-12-17 | 2008-12-17 | Double-surface position alignment apparatus and method |
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