CN101417374A - 一种无铅焊料减渣方法 - Google Patents
一种无铅焊料减渣方法 Download PDFInfo
- Publication number
- CN101417374A CN101417374A CNA2008102194909A CN200810219490A CN101417374A CN 101417374 A CN101417374 A CN 101417374A CN A2008102194909 A CNA2008102194909 A CN A2008102194909A CN 200810219490 A CN200810219490 A CN 200810219490A CN 101417374 A CN101417374 A CN 101417374A
- Authority
- CN
- China
- Prior art keywords
- content
- solder
- slag
- alloy
- tin stove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910052718 tin Inorganic materials 0.000 claims abstract description 89
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 78
- 239000002893 slag Substances 0.000 claims abstract description 65
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 59
- 239000000956 alloy Substances 0.000 claims abstract description 59
- 239000000203 mixture Substances 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 238000005070 sampling Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000009466 transformation Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 238000005275 alloying Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007792 addition Methods 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 229910052733 gallium Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000010733 inhibited oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000007634 remodeling Methods 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000006385 ozonation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
Description
编号 | 抗渣合金 | 实验时间h | 总出渣量kg | 减渣率% |
对比例1 | 无 | 120 | 66 | — |
实施例1 | 有 | 120 | 27.5 | 58.3 |
对比例2 | 无 | 120 | 3.4 | — |
实施例2 | 有 | 120 | 0.92 | 72.6 |
对比例3 | 无 | 120 | 93.7 | — |
实施例3 | 有 | 120 | 65.3 | 30.2 |
对比例4 | 无 | 96 | 41.3 | — |
实施例4 | 有 | 96 | 21.7 | 47.5 |
对比例5 | 无 | 96 | 49.2 | — |
实施例5 | 有 | 96 | 24 | 51.2 |
对比例6 | 无 | 96 | 31.4 | — |
实施例6 | 有 | 96 | 23.1 | 26.4 |
Claims (10)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102194909A CN101417374B (zh) | 2008-11-28 | 2008-11-28 | 一种无铅焊料减渣方法 |
EP09828560A EP2359981A4 (en) | 2008-11-28 | 2009-06-11 | METHOD FOR REDUCING LEAD FREE SOLDER SCRUB |
PCT/CN2009/072221 WO2010060299A1 (zh) | 2008-11-28 | 2009-06-11 | 一种无铅焊料减渣方法 |
JP2011537822A JP2012509992A (ja) | 2008-11-28 | 2009-06-11 | 無鉛はんだドロス低減方法 |
US13/125,261 US8557016B2 (en) | 2008-11-28 | 2009-06-11 | Reducing dross method of lead-free solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102194909A CN101417374B (zh) | 2008-11-28 | 2008-11-28 | 一种无铅焊料减渣方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101417374A true CN101417374A (zh) | 2009-04-29 |
CN101417374B CN101417374B (zh) | 2011-05-18 |
Family
ID=40628475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102194909A Active CN101417374B (zh) | 2008-11-28 | 2008-11-28 | 一种无铅焊料减渣方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8557016B2 (zh) |
EP (1) | EP2359981A4 (zh) |
JP (1) | JP2012509992A (zh) |
CN (1) | CN101417374B (zh) |
WO (1) | WO2010060299A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010060299A1 (zh) * | 2008-11-28 | 2010-06-03 | 广州瀚源电子科技有限公司 | 一种无铅焊料减渣方法 |
WO2010133048A1 (zh) * | 2009-05-19 | 2010-11-25 | 广州瀚源电子科技有限公司 | 一种无铅焊料的减渣方法 |
CN107012362A (zh) * | 2017-05-08 | 2017-08-04 | 广州柏仕达新材料有限公司 | 一种锡磷合金的制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9984049B2 (en) | 2015-07-14 | 2018-05-29 | Google Llc | Systems and methods for providing call context to content providers |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1931285A (en) * | 1930-10-07 | 1933-10-17 | Us Smelting Refining & Mining | Process of treating drosses |
JPS5484817A (en) * | 1977-12-19 | 1979-07-06 | Topii Fuasunaa Kk | Alloy for removing acid |
JP4039594B2 (ja) * | 1998-05-22 | 2008-01-30 | 株式会社日本スペリア社 | 無鉛はんだ用添加合金 |
JP2002336988A (ja) * | 2001-05-15 | 2002-11-26 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
EP1464431B1 (en) * | 2002-01-10 | 2011-03-02 | Senju Metal Industry Co., Ltd. | Soldering method with refiling with solder having an oxidation suppressing element |
JP4151409B2 (ja) * | 2002-01-10 | 2008-09-17 | 千住金属工業株式会社 | はんだ付け方法 |
JP2003266193A (ja) * | 2002-01-10 | 2003-09-24 | Senju Metal Ind Co Ltd | はんだ浴供給用鉛フリーはんだ |
CA2389446A1 (en) * | 2002-06-10 | 2003-12-10 | David Wai-Yin Leung | Pb-free solder alloy compositions comprising essentially sn, ag, cu, and/or p |
JP2004259963A (ja) * | 2003-02-26 | 2004-09-16 | Minebea Co Ltd | 噴流式半田付け装置 |
US7335269B2 (en) * | 2005-03-30 | 2008-02-26 | Aoki Laboratories Ltd. | Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P) |
CA2502747A1 (en) * | 2005-03-30 | 2006-09-30 | David Wai-Yin Dl Leung | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus |
US7754343B2 (en) * | 2005-08-17 | 2010-07-13 | Oracle America, Inc. | Ternary alloy column grid array |
CN1919522A (zh) * | 2005-09-23 | 2007-02-28 | 东莞市千岛金属锡品有限公司 | 一种环保型高温抗氧化焊料 |
CN101077552A (zh) * | 2006-05-24 | 2007-11-28 | 喜星素材株式会社 | 焊接用的无铅合金 |
CN100469511C (zh) * | 2006-06-14 | 2009-03-18 | 浙江亚通焊材有限公司 | 无铅软钎料 |
CN101417374B (zh) * | 2008-11-28 | 2011-05-18 | 广州瀚源电子科技有限公司 | 一种无铅焊料减渣方法 |
-
2008
- 2008-11-28 CN CN2008102194909A patent/CN101417374B/zh active Active
-
2009
- 2009-06-11 WO PCT/CN2009/072221 patent/WO2010060299A1/zh active Application Filing
- 2009-06-11 US US13/125,261 patent/US8557016B2/en active Active
- 2009-06-11 JP JP2011537822A patent/JP2012509992A/ja active Pending
- 2009-06-11 EP EP09828560A patent/EP2359981A4/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010060299A1 (zh) * | 2008-11-28 | 2010-06-03 | 广州瀚源电子科技有限公司 | 一种无铅焊料减渣方法 |
WO2010133048A1 (zh) * | 2009-05-19 | 2010-11-25 | 广州瀚源电子科技有限公司 | 一种无铅焊料的减渣方法 |
CN107012362A (zh) * | 2017-05-08 | 2017-08-04 | 广州柏仕达新材料有限公司 | 一种锡磷合金的制备方法 |
CN107012362B (zh) * | 2017-05-08 | 2019-07-05 | 广州柏仕达新材料有限公司 | 一种锡磷合金的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101417374B (zh) | 2011-05-18 |
US8557016B2 (en) | 2013-10-15 |
US20110219914A1 (en) | 2011-09-15 |
EP2359981A1 (en) | 2011-08-24 |
JP2012509992A (ja) | 2012-04-26 |
EP2359981A4 (en) | 2011-10-05 |
WO2010060299A1 (zh) | 2010-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100534699C (zh) | 无铅焊料合金 | |
CN100566913C (zh) | Sn-Zn-Ga-Ce无铅钎料 | |
JP4577888B2 (ja) | Fe喰われ防止用はんだ合金とFe喰われ防止方法 | |
CN101716702B (zh) | 多元合金无镉低银钎料 | |
CN101417374B (zh) | 一种无铅焊料减渣方法 | |
CN101157162A (zh) | 具有抗氧化性能的SnAgCu无铅钎料 | |
CN1654159A (zh) | 无铅钎料活性合金添加剂及无铅合金钎料 | |
CN101342642A (zh) | 一种抗氧化低银无铅焊料 | |
CN102554490B (zh) | 一种抗溶铜锡铜无铅钎料合金 | |
CN102489892A (zh) | 一种含Cr的SnZn基无铅钎料 | |
CN101376196A (zh) | 一种SnAgCu无铅钎料 | |
JP5773444B2 (ja) | アルミニウム接合用はんだ合金 | |
CN1651179B (zh) | Fe熔食防止用焊料合金和Fe熔食防止方法 | |
CN112322929A (zh) | 一种用于提高焊料抗氧化性的中间合金 | |
CN101920406B (zh) | Sn-Ag-Zn-Cr共晶无铅焊料 | |
CN100491055C (zh) | 磷铜合金焊料 | |
CN1201896C (zh) | 一种无铅焊料 | |
CN103753047B (zh) | 一种无铅钎料 | |
CN108866364A (zh) | 一种向Sn基钎料中添加易氧化元素的方法 | |
JP4151409B2 (ja) | はんだ付け方法 | |
TWI684645B (zh) | 無鉛錫合金 | |
CN101554684A (zh) | 一种无铅焊料的减渣方法 | |
CN100348361C (zh) | Sn-Zn-Cr合金无铅焊料 | |
KR20040035458A (ko) | 납땜용 무연합금 | |
KR20050040099A (ko) | 무연 납땜 합금 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GUANGZHOU SOLDERWELL ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: GUANGZHOU TIAN SHUO ELECTRONIC TECHNOLOGY CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou Patentee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Address before: 510730, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou Patentee before: Guangzhou Solderwell Enterprise Co.,Ltd. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou Patentee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Address before: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
|
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20090429 Assignee: Science City (Guangzhou) Finance Leasing Co.,Ltd. Assignor: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Contract record no.: X2020980000921 Denomination of invention: Leadless solder dregs-reducing method Granted publication date: 20110518 License type: Exclusive License Record date: 20200323 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Leadless solder dregs-reducing method Effective date of registration: 20200325 Granted publication date: 20110518 Pledgee: Science City (Guangzhou) Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Registration number: Y2020980001026 |
|
EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Science City (Guangzhou) Finance Leasing Co.,Ltd. Assignor: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Contract record no.: X2020980000921 Date of cancellation: 20220223 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220223 Granted publication date: 20110518 Pledgee: Science City (Guangzhou) Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Registration number: Y2020980001026 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230802 Address after: No. 58, South Yun'er Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510000 Patentee after: Guangzhou Hanyuan microelectronic packaging material Co.,Ltd. Address before: 510663 No.58, Nanyun 2nd Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |