CN101414565B - 形成预成型引线框的方法 - Google Patents

形成预成型引线框的方法 Download PDF

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CN101414565B
CN101414565B CN2007101802438A CN200710180243A CN101414565B CN 101414565 B CN101414565 B CN 101414565B CN 2007101802438 A CN2007101802438 A CN 2007101802438A CN 200710180243 A CN200710180243 A CN 200710180243A CN 101414565 B CN101414565 B CN 101414565B
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lead frame
band
moulding compound
lead
mould
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CN101414565A (zh
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徐雪松
白志刚
许南
姚晋钟
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Freescale Carle Semiconductor (china) Co Ltd
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Abstract

一种形成增加括脚的预成型引线框的方法，该方法包括以下步骤：将第一带附接到引线框的第一面和将第二带附接到引线框的第二面。将附接了带的引线框放进模具中，并开始模塑料的第一流。该模塑料的第一流填进第一带和模具的上模套之间的空间。然后，开始模塑料的第二流。该模塑料的第二流填进引线框的管芯焊盘和引线之间的空间。接着，将第一带和第二带从引线框中移走。由于模塑料的第一流压低了第一带，所以提供了增大的括脚。

Description

形成预成型引线框的方法
技术领域
[01]本发明涉及集成电路(IC)的封装，尤其涉及一种形成预成型引线框的方法，该预成型引线框用于形成半导体封装。
背景技术
[02]引线框是向半导体管芯提供电互连的结构。也就是说，将管芯附接到引线框上，接着，通常通过引线接合工艺用导线将管芯的焊盘电连接到引线框的引线上。然后，利用塑性模塑料(mold compound)对管芯、引线框和导线进行封装。引线的暴露区向管芯提供电互连。
[03]为了向其它器件提供优良的电连接，必须使引线的一些部分充分暴露。如果该引线区域由模塑料覆盖、或者未被充分暴露、或者不易接触到，就会出现诸如引线与衬底或印刷电路板(PCB)的可焊性问题。
[04]图1-4图解说明了半导体封装工艺的步骤。图1示出了一对包括半蚀刻部分12的引线框10。集成电路14附接到引线框10的台板(flag)16处。通常通过引线接合工艺用导线18将集成电路14电连接到引线框10的引线20。在附图中，两个引线框10是引线框的条的部分，该引线框条被安装到带22上。图2示出了放置在模套(mold chase)24中的引线框10。箭头表示模流的方向。图3示出了注入模套24中的模塑料26。模塑料26覆盖了引线框10、集成电路14和导线18。
[05]图4是引线框10之一的接触区的放大视图，其具体为台板16和引线20的半蚀刻部分。注意，模塑料26填进了台板16和引线20之间的空间，此外，模塑料26和引线框的底部表面是平坦的。能增加引线框和模塑料之间的括脚(stand-off)是有益的。
附图说明
[06]当结合附图阅读时，能更好地理解以下本发明的优选实施例的详细描述。通过示例来说明本发明，而附图不限制本发明，其中，相同的附图标记表示相同的元素。应该明白：为了便于理解本发明，附图未按比例且被简化。
[07]图1是其上被附接有管芯的传统引线框条的放大截面视图；
[08]图2是放置在模套中的、图1的引线框的放大截面视图；
[09]图3是其中注入模塑料的图2的模套中的引线框的放大截面视图；
[10]图4是从模套中移走后的、图1的引线框的部分的放大截面视图；
[11]图5-9是图解说明根据本发明实施例的形成预成型引线框的方法的放大截面视图；和
[12]图10是图解说明根据本发明实施例的封装半导体集成电路的方法的放大截面视图。
具体实施方式
[13]以下结合附图给出的详细说明旨在描述本发明的当前优选实施例，而并不代表可实施本发明的唯一形式。应该理解：通过被认为包括在本发明的精神和范围内的不同实施例可实现相同的和等同的功能。在附图中，相同的附图标记始终表示相同的元素。
[14]在一实施例中，本发明提供了一种形成预成型引线框的方法，该方法包括以下步骤：将第一带附接到引线框的第一面，该引线框包括引线和管芯焊盘，而将第二带附接到所述引线框的相反的第二面。将附接了带的引线框装入模具，而将模塑料的第一流注入模具，使得该模塑料流进第一带和上模套之间的空间。开始将模塑料的第二流注入模具，并且该模塑料流进第一带和第二带之间(即，引线框的引线和管芯焊盘之间)的空间。将引线框从模具中移走，且将第一带和第二带移走，使得引线和管芯焊盘暴露。或者，可将第二带移走，而留下第一带以进行进一步处理。
[15]在另一实施例中，本发明提供了一种预成型多个引线框的方法。除了给多个引线框附接带并放置在模具中，该方法类似于上述方法。引线框可以条或阵列形式来提供，随后利用单切处理而将其分开。
[16]在本发明的又一实施例中，提供了一种封装半导体集成电路的方法。该方法包括：将第一带附接到引线框的第一面，该引线框包括引线和管芯焊盘；将第二带附接到引线框的相反的第二面；将引线框装入模具；开始将模塑料的第一流注入模具，其中，该模塑料流进第一带和模具的上模套之间的空间；开始将模塑料的第二流注入模具，其中，该模塑料流进第一带和第二带之间的空间；将引线框从模具中移走；和将第二带从引线框移走，从而使得引线框的引线和管芯焊盘暴露。接着，将半导体集成电路附接到管芯焊盘，并执行引线接合工艺以将导线附接在集成电路的焊盘和引线框的引线之间。用模塑料对所述引线框、集成电路和导线进行封装，然后，将第一带从引线框的第一面移走，从而提供封装好的半导体集成电路。模塑料的第一流压低引线和管芯焊盘之间的第一带，使得在移走第一带时形成括脚。
[17]现在将参考附图5-9来描述一种形成预成型引线框的方法。
[18]现在参考附图5，提供了一个或多个引线框100(在该示例中，示出了两个)。引线框100包括可环绕相应的管芯焊盘104的引线102。引线框100可由侧条106界定。通过切割、压印或蚀刻片料(sheet stock)可将引线框100形成条或阵列形式。形成引线框100的片料是如铜或铝的导电金属，然而，可以使用和涂敷其它金属或合金。在一实施例中，导电材料片102由诸如铜箔的裸金属形成，并且约0.5mm厚。然而，金属片102的特定材料、大小或厚度不限制本发明。在现有技术中，众所周知引线框，并且众所周知这样的引线框的材料厚度和强度等。引线框被广泛用于半导体工业并可容易地从许多商业提供商处获得。引线框100的第一面或顶面已被蚀刻，使得引线102和管芯104之间的空间增加，如108所示。
[19]将第一带110设置在引线框100的第一表面。优选地，第一带110从侧条106中的一个几乎延伸到与侧条106相对的另一个，并且覆盖引线框100的蚀刻面。第一带110覆盖引线框100的第一面大约95％。将第二带112设置在引线框100的第二面。第二面与附接了第一带110的第一面相反。优选地，第二带112从一侧条106延伸到另一侧条106。第一带110和第二带112由坚固并有弹性的耐高温材料制成。这样的带众所周知并在半导体工业中可容易地通过商业获得。
[20]参考图6，在引线框100的两个面附接到带之后，将引线框100装进模具120。也就是说，将引线框100在上模套122和下模套124的边沿之间夹紧，使得能将模塑料注入上模套122和下模套124之间的槽126内。根据本发明，将模塑料的第一流开始注入模具120，使得模塑料流进第一带110和上模套122之间的空间，如粗水平箭头所示。将模塑料的第二流也开始注入模具120。模塑料的第二流流进第一带和第二带之间的空间，即，流进侧条106和引线框100之间的空间以及引线102和管芯焊盘104之间的空间，如细箭头所示。
[21]图7示出了流进模腔126时的模塑料128。如图所示，在第一带110上的模塑料128的第一流压低引线102和管芯焊盘104之间的扩大空间上的第一带110上，使得形成增大的括脚(参看图9)。模塑料128的第二流流进第一带110和侧条106(图中的右侧条)之间的空间，使得模塑料流进引线102和管芯焊盘104之间的空间。在本发明的一实施例中，在开始注入第二模流之前，模塑料128的第一流已基本填满上模套122和第一带110之间的空间。模塑料128的第一流的速度大于模塑料的第二流的速度。
[22]在模塑料128填满模具120之后，将引线框100从模具中移走，如图8所示。如图所示，第一带110下降到引线102和管芯焊盘104之间的空间。图9示出了在通过解带处理而移走第一带110使得引线102和管芯焊盘104的表面暴露后的引线框100。在移走了第一带110的情况下，能够看到以130所示的增加的括脚。
[23]参考图10，在一实施例中，在从模具120中移走引线框100后，移走第二带112，而将第一带110留在引线框100上。注意，置于引线和管芯焊盘104之间的模塑料128留了下来。将半导体集成电路132附接到管芯焊盘104的暴露部分，然后执行引线接合工艺以将导线134附接在集成电路132上的焊盘和相应的引线102之间。集成电路132可以是诸如数字信号处理器(DSP)的处理器、微控制器、诸如存储地址发生器的专用功能电路或执行任何其它类型功能的电路。集成电路132不限于诸如CMOS的特定技术，或源自任何特定的晶片技术。此外，如将被本领域的技术人员所理解的，本发明能适应各种管芯大小。典型的示例是具有约6mm×6mm大小的闪存器件。
[24]然后，将组件放置在诸如模具120的模具中，并围绕集成电路132和导线134注入更多模塑料。在从模具120中移走后，沿着以虚线A-A、B-B和C-C表示的锯开通道执行单切或切割处理来形成独立封装的器件。在图10中，封状的器件包括四方扁平无引线型(QFN)器件。然而，上述形成预成型引线框的方法不限于QFN型引线框。
[25]根据上述讨论显而易见，本发明提供了增大引线括脚的预成型引线框。为了说明和描述，已经呈现了本发明优选实施例的描述，但不企图是详尽的或限制本发明到所描述的形式。本发明的技术人员将理解在不偏离其宽的发明原理的情况下能够对上述实施例做出改变。因此，可以理解，本发明不限于所公开的特定实施例，但涵盖在如所附权利要求限定的本发明的精神和范围内的修改。

Claims (9)

1.一种预成型引线框的方法，包括：
将第一带附接到引线框的第一面，该引线框包括引线和管芯焊盘；
将第二带附接到所述引线框的相反的第二面；
将所述引线框装入模具；
开始将模塑料的第一流注入所述模具，其中，该模塑料流进所述第一带和所述模具的上模套之间的空间；
开始将所述模塑料的第二流注入所述模具，其中，该模塑料流进所述第一带和所述第二带之间的空间；
将所述引线框从所述模具中移走；以及
将所述第一带和所述第二带从所述引线框移走，从而使得所述引线框的所述引线和管芯焊盘暴露，
其中，所述模塑料的所述第一流压低所述引线和所述管芯焊盘之间的所述第一带，使得在移走所述第一带时形成括脚。
2.如权利要求1所述的预成型引线框的方法，其中，所述模塑料的所述第一流的速度大于所述模塑料的所述第二流的速度。
3.如权利要求1所述的预成型引线框的方法，其中，在开始所述模塑料的第二流之前，所述模塑料的第一流基本上填满了所述上模套和所述第一带之间的所述空间。
4.如权利要求1所述的预成型引线框的方法，其中，所述引线框包括裸金属引线框。
5.如权利要求1所述的预成型引线框的方法，其中，所述引线框包括方形扁平无引线型引线框。
6.一种封装半导体集成电路的方法，该方法包括以下步骤：
将第一带附接到引线框的第一面，该引线框包括引线和管芯焊盘；
将第二带附接到所述引线框的相反的第二面；
将所述引线框装入模具；
开始将模塑料的第一流注入所述模具，其中，该模塑料流入所述第一带和所述模具的上模套之间的空间；
开始将所述模塑料的第二流注入所述模具，其中，该模塑料流入所述第一带和所述第二带之间的空间；
将所述引线框从所述模套中移走；
将所述第二带从所述引线框移走，从而使得所述引线框的所述引线和管芯焊盘暴露，并且其中，所述模塑料的所述第一流压低所述引线和所述管芯焊盘之间的所述第一带，使得在移走所述第一带时形成括脚；
将半导体集成电路附接到所述管芯焊盘上；
执行引线接合工艺，以将导线附接在所述集成电路上的焊盘和所述引线框的所述引线之间；
用模塑料对所述引线框、集成电路和导线进行封装；以及
将所述第一带从所述引线框移走，从而提供封装好的半导体集成电路。
7.如权利要求6所述的封装半导体集成电路的方法，其中，所述模塑料的所述第一流的速度大于所述模塑料的所述第二流的速度。
8.如权利要求6所述的封装半导体集成电路的方法，其中，在开始所述模塑料的第二流之前，所述模塑料的第一流基本上填满了所述上模套和所述第一带之间的所述空间。
9.如权利要求6所述的封装半导体集成电路的方法，其中，所述引线框包括方形扁平无引线型引线框。
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