CN101410323A - Stamping methods and devices - Google Patents

Abstract

A method of forming an embossing structure P on a substrate S includes: applying a plurality of embossing tooling sections (32, 40a, 40b, 40c, 50, 60, 70, 80, 92) onto at least one surface of the substrate. A device for forming the embossing structure P on the substrate S includes a plurality of embossing tooling sections (32, 40a, 40b, 40c, 50, 60, 70, 80, 92) which can be driven separately, driven in phase in a plurality of groups, or driven by combined by both.

Description

Method for stamping and device

Technical field

The present invention relates generally to the method and the device of material impression in the manufacturing process.The field of the invention also relates to the manufacturing of fluid treatment member, optical light guides, metal deposition, chemistry and biology face coat, and the formation of conduction and conductive structure.

Background technology

In the discussion hereinafter, some structure and/or method have been introduced.Yet introduction hereinafter should not be interpreted as a kind of understanding, and promptly these structures and/or method have been formed prior art.The applicant has specially kept and has illustrated that such structure and/or method are not taken as the power of prior art.

Stamping technique (stamping techniques) comprises the transmission of figure, embossing, be shaped, cutting, with transmit material on substrate or in the substrate, such as the thermoprint of utilize transmitting the paper tinsel pattern with by the deposition of the chemistry or the biochemical reagents of contact print, for example deposition of ink and biosensor molecules.Moulding process (stamping prcess) generally copies to pattern in the substrate by the application of figuratum instrument, or copies on the substrate, or duplicates and pass substrate.

Embossing is that a kind of coining tool is pressed in the substrate, and make around the instrument material transfer and in substrate, form the technology of the structure of duplicating.The structure of duplicating that generates is the negative-appearing image of knurling tool.Shaping is to be similar to the technology of embossing and to carry out on than the thin substrate of the structure that will form pattern usually, and common example is the shaping in the blister package.The die-cut application that also comprises figuratum instrument, however instrument pattern contour substrate is all around passed in its general partially or even wholly cutting.The leaf stamping method can be used to film as metal level or structure sheaf, is delivered on the substrate from carrier layer.This process generally includes the layer that will deposit by temperature and pressure and is connected on the substrate, and this also impels coating to peel off from the carrier band.The technology that the impression paper tinsel often is used to comprises the deposition of the metal level that is used for decorative coating.Wax that such metal level general using melts under imprint temperature discharges (wax release) and generates on the carrier band at for example polyester.Similarly, contact printing process generally is a liquid form with material, is delivered on the substrate surface from coining tool.

The Apparatus and method for of the prior art of material impression generally comprises and uses the instrument that the pattern that forms is especially arranged, and instrument is used to form complete figuratum structure or zone.Example is in micro-optics and microfluid, wherein the manufactured pattern that is used to duplicate whole needs of instrument.The limitation of this method is just to need whole different instrument for each different pattern of needs.

In some impression occasion such as embossing, the quality of duplicating depends on as time, these factors of pressure and temperature.Therefore, the pattern that will be replicated is size-constrained in the ability of processing machine.Material is shifted the required power and the time of staying also can increase from the zone that is replicated along with the size of the pattern that will be replicated increases.For bigger structure, along with the material require that is transferred when the embossing flows to other zone in the bulk material, this will become more difficult.Lax and the tensioning problem of material after the embossing process can cause the malformation of duplicating.

The development that forms the embossed technology of microfluidic structures starts from nineteen ninety for the end, and it uses stamp or imprint process.Form such structure and often need high aspect ratio.Research field is duplicated and generally be used in to the development of hot moulding flower process to promote structure, " Polymer microfabricationmethods for microfluidic analytical applications (the miniature manufacture method of polymer that is used for the application of microfluid parsing) " as people such as Becker, Electrophoresis 2000,21 volumes, the 12-26 page or leaf; People's such as Becker " Polymer microfouidic devices (micro polymer fluid device) ", Talanta 2002, the 267-28 page or leaf; With people's such as Heckele " Review of on micro molding of thermoplastic polymers (review of thermoplastic polymer's micro shaping) ", J.Micromech.Microeng.2004,14 volumes, the 3rd phase, described in the R1-R14 page or leaf.The hot moulding flower process is the subclass of standard embossed technology, and glass transition temperature and the embossing pressure near material is lower especially to remove storage temperature.For all embossing technology, the quality of the structure of duplicating depends on a number of factors, and comprises stamp pressure, temperature, time and materials character.The problem of this technology is in order to obtain the difficult point of structure temperature in the cycle and the required time of high aspect ratio, and than the tendency of macrostructure traps air bubble.In addition, the suitable material that is used for this technology is limited, and this has limited the obtainable quantity that the appropriate materials of suitable volume and surface nature is arranged in the product application conversely.

The production technology of the high-throughput that has developed generally comprises the use of the reel-to-reel production system of the part manufacturing that is used for film.These examples comprise UK Patent Application No.9623185.7, and it has described the ultraviolet curing process of evolving and coming from the optics industry of miniature manufacturing film.This technology is by with thin ultraviolet ray-curable resin coated substrates, use then the template embossed pattern and with process that template contacts in cured resin operate.U.S. Patent No. 6375871 has been described the expressing technique on the film, and it then is thin slice or resin on the running roller embossed sheet.U.S. Patent No. 6375776 has been described the forming tool of the sheet material system that is used for miniature manufacturing film.The main limitation of these technology is: the substrate of the relative thin that they are confined to operate on sheet material, or film; The obtainable material that is applicable to this technology is limited, and this has also limited the obtainable quantity that the material of suitable bulk properties and surface nature is arranged in the product application conversely; Each pattern needs independent relatively costly instrument; And generally there be the long adjustment relevant to postpone with tool changing.

The formation of on-chip conducting channel is usually by etching, serigraphy, or electroplating technology is finished.Because relevant instrument and operating cost, all these are all relatively costly concerning small-sized production run.The milling of electroplating substrate is to form the selection scheme that prototype is known fast, but is limited to the capacity in space and needs smooth substrate, and commercially available this material seldom.

Contact print generally is used for forming from the teeth outwards the pattern of small amount of liquid.These liquid comprise ink and other chemistry or biological reagent, and it is applied in as the information coding, as has character; The coating of ornamental or protectiveness; Be used for the surface characteristic wetting and variation that is connected, comprise hydrophily, permeability, the surface can and change molecular surface; And the deposition that is used for the reagent of sensor or actuator manufacturing.

The major defect of all these production technologies is and relevant time and the cost of instrument that new pattern needs is set, and the operating cost of small-sized production run.For bigger production run, these costs can be shared by the quantity of the parts of making, but for small-sized production running, the cost of independent parts becomes and can not suppress the ground costliness.

And, not having fully to improve under the situation of existing equipment, impression is problematic than macrostructure, the time of staying of technology increases along with the size of structure through regular meeting.

So, need to be used for the low-cost apparatus and method of the small-sized production run of the impression of separate part or different pattern in the prior art, and need not the processing of special pattern.Also need to produce the processing unit (plant) and the method for big area of the pattern, and need not to increase size, cost or the complexity of existing machine.

In this specification quoting of any prior art is not, also should be counted as a kind of understanding or any type of hint, promptly prior art constitutes the part of common practise.

Summary of the invention

Invention comprises unit, method and the product that relates to improvement impression in the manufacturing.The advantage that the present invention can provide comprises following one or more: the debug time of minimizing; The required driving force of impression that reduces; The process time that reduces; Cost reduces; The flexibility of producing; Improved impression performance than macrostructure; The a large amount of customization with making parts.

According to an aspect of the present invention, it provides the method that constitutes stamping structure (stampedfeature) on substrate, and this method comprises that (i) is applied to a plurality of coining tool sections (stamping tool segments) at least one surface of substrate.As used herein, term " impression element " and " instrument section (tool segments) " use convertibly, just as term " stamping structure " and " imprinted pattern ".

According to an embodiment, thereby this method comprises with the first coining tool section it being thereby that at least one surperficial second sub pattern that upward forms that forms first sub pattern thereon and the second coining tool section is applied to substrate is gone up at least one surface that is applied to substrate thereon.The impression element can be made stamping structure by any suitable method.For example, they can be jointly corresponding to stamping structure, and/or comprises coining tool jointly.

And first sub pattern and second sub pattern can be identical or different and can be optionally overlapped at least or engage.In certain embodiments, they combine the formation stamping structure.

Be applicable to large-scale manufacturing setting according to technology of the present invention, equipment and device, for example based on (continuous) of sheet material with based on (discrete) substrate setting of thin slice.

As using herein, " impression " be meant on substrate or form the technology or the technology of structure and/or pattern in the substrate, and comprise, for example: embossing, be shaped, cutting, thermoprint (as, paper tinsel), the transmission of patterns of material, use die, and contact print.

In addition, technology of the present invention can comprise further that at least one in advance or the imprint process in later stage.

Be included in the aligning of the different parts in the impression, for example impress element, substrate and any member wherein can obtain with any suitable method.For example, can use control system and to will definitely be by using alignment mark, notch, groove, margin guide device and based on one or more acquisition the in sensor machinery, sound wave, heat energy or optics.Such sensor, or sensing system can comprise the sensory spot or the regional imaging of separation, and can combine with signal processing technology, as combining with image recognition.

Moulding process itself can be undertaken by the impression machine that comprises a plurality of impression elements.In certain embodiments, impression machine itself is full automatic.

The stamping structure that explained hereafter according to the present invention goes out can have different forms.For example, they can be optionally by the overlapping pattern that forms on the identical layer of substrate or separating layer.In addition, stamping structure or pattern can comprise structure sawtooth or projection and be produced by the projection of correspondence or the impression element of sawtooth.

In certain embodiments, a plurality of impression elements move together to make stamping structure.For example, they can impress and impress element and can move together on a plurality of surfaces, as be matched to or in groups.

Other element can be added in this technology, can obtain better quality like this, for example, comprises that by use the substrate that the element of at least one special construction is avoided being stamped is out of shape.Give an example in passing, such special construction can comprise the wide processing bearing of the substrate around the structure that is used to constitute, and perhaps the use of sacrificial structure is to control flowing of material in the last impression action.

Equipment of the present invention, some embodiment of apparatus and method especially are suitable for some and use, as the manufacturing of microfluidic element or device, electronic circuit, conductive pieces, electromagnetic structure, waveguide, light pipe, sensor, actuator or similar structures.

As use herein, " microfluid " is meant and comprises that size is micron or the fluid handling structure of sub-micron grade or the member of element, system or method.For example, such structure or element can have at least about 1 micron to about 1000 micron-sized one dimension sizes.

And in certain embodiments, invention is suitable for being applied in as surface treatment, sensor manufacturing, perhaps decorates or the character detailed design.

The present invention further aspect, it provides the device that is used on substrate forming stamping structure, device comprises and can drive individually; The a plurality of driving in groups together or a plurality of coining tool sections of the two combination.Zhuan Zhi operation in certain embodiments is that part is automatic at least.In addition, a plurality of coining tool sections can be installed in by actuator separately on structure wheel or the head (structuring wheel or machinehead).

In certain embodiments, device comprises the installation system that allows structure wheel or head to move on both direction at least.Substrate also can move relative to coining tool.

In certain embodiments, equipment comprises a plurality of impression elements, and they are jointly corresponding to stamping structure.A plurality of impression elements can comprise it self being automatic coining tool jointly.

Run through this explanation (comprising additional any claim), unless require in the context, word " comprises (comprise) ", reach " comprising (comprising) " with variant as " comprising (comprises) ", comprise described integral body or the group in stage or integral body or stage with being understood that to have hinted but do not get rid of any other the integral body or group in stage or integral body or stage.

Description of drawings

Fig. 1 is the system diagram of card or thin plate production system.

Fig. 2 is the system diagram of the production system of sheet material or continuous substrate.

Fig. 3 is the system diagram of the device that comprises the automatic stamping press device according to an aspect of the present invention.

Fig. 4 A-4C illustrates and comprises the applying continuously to form the embossing device and the technology of embossed pattern of three impression elements.

Fig. 5 A-5C illustrates the impression element and is applied to substrate simultaneously in succession to form the device and the technology of embossed pattern.

Fig. 6 A-6C illustrates and impress device and the technology that element is applied to substrate in succession in the running that is shaped.

Thereby Fig. 7 A-7C illustrates device and technology that the impression element is applied to substrate execution cutting operation in succession.

Thereby Fig. 8 A-8C illustrates device and technology that the impression element is applied to substrate execution electroless copper deposition operation in succession.

Thereby Fig. 9 applies required pattern imprinted pattern is applied to the device of substrate and the system diagram of technology by using a plurality of coining tool sections together.

Figure 10 is that it illustrates the end face of the substrate of the imprinted pattern that has the selection that is applied on it along the view of the line 10-10 among Fig. 9.

Figure 11 A-11B illustrates according to the present invention further aspect the imprinted pattern of selecting is applied to the device and the technology of substrate, and it comprises the synchronous operation of a plurality of coining tool sections.

Figure 12 is the side view of overlapping embossed pattern formed in accordance with the principles of the present invention.

Figure 13 is further aspect according to the present invention, has the side view of the substrate of the pressed and overlapped floral pattern that is applied in above.

Figure 14 is according to another aspect of the present invention, has the side view of a plurality of substrates of the pressed and overlapped floral pattern that is applied in above.

Figure 15 A-15B illustrates according to of the present invention embossed pattern is applied to device and technology on the substrate opposition side.

Figure 16 A-16B illustrates the further aspect according to the present invention, embossed pattern is applied to the device and the technology of substrate.

Figure 17 A-17B illustrates according to an aspect of the present invention, and embossed pattern is applied to the device and the technology of substrate, and it comprises the use of swelling structure on the knurling tool.

Figure 18 A-18B illustrates the further aspect according to the present invention, and embossed pattern is applied to the device of substrate and the side view of technology, and it comprises the use of swelling structure on the knurling tool.

Figure 19 A-19B illustrates according to a further aspect of the invention, is used for the device of deposition materials on substrate and the side view of technology.

The exploded view of the microfluidic device that Figure 20 is formed according to the present invention.

Figure 21 is the exploded view according to the multiple field microfluidic device of further aspect formation according to the present invention.

Figure 22 is the exploded view of the multiple field microfluidic device that forms according to a further aspect in the invention.

Figure 23 is the exploded view of the multiple field microfluidic device that forms according to a further aspect of the present invention.

Figure 24 is the exploded view of the multiple field microfluidic device that further aspect forms according to the present invention.

Figure 25 A-25C is that principle according to the present invention is used for forming the device of micro optical structure and the side view of technology on substrate.

Figure 26 is the system diagram that forms the coining tool group of microfluidic device.

Figure 27 is the system diagram that forms the coining tool group of printed circuit.

Figure 28 is that principle according to the present invention is used for the device of leaf stamping and the system diagram of technology.

Figure 29 A-29C illustrates the waveguide member that will make separately according to principle of the present invention and merges to device and technology in the established passage of substrate.

Figure 30 A-30D illustrates the cross section of the multiple field circuit that produces by stamping technique.

The specific embodiment

Here the contact embodiment relevant with microfluidic device and electronic circuit describes invention with more convenient.Yet invention is applicable to large-scale occasion and product and is to be appreciated that it is other application that construction and device also is considered to fall into scope of invention.

The device of invention and technology mainly overcome the limitation that tradition impresses by instrument being divided into a plurality of coining tool sections or element.

Moulding process generally copies to pattern in the substrate or on the substrate by using single pattern instrument.By using a plurality of coining tool sections or element manufacturing continuous imprinted pattern or structure, instrument can standardization, forms general pattern and sets type.This has just allowed to realize with identical instrument the customization production of impression product, thereby avoids the replacing of instrument, so reduced cost small-sized or the single-piece production operation.

The advantage of unit of the present invention and method can comprise following one or more:

Make the debug time that each new design reduces by the combination of using standardization member or set of tools;

Pattern is impressed into driving force required on the substrate by what impress discretely that less sub pattern reduces;

Reduce the high throughput of some occasions that cause the time of staying owing to embossing or when forming than minor structure;

By replacing little so not complicated other tool elements or instrument section rather than replacing complicated instrument for whole pattern and reduced cost;

The flexibility of producing has reduced cost small-sized or the single-piece production operation, and has allowed a large number of usersization of impression product;

Owing to having used instrument section deposition or having shifted the less quality of improving of required material than macrostructure; With

Be applied to as microfluid the part privatization of identification card embossing and similar applications or the new example of a large number of usersization.

Polymer and metal can be stamped or merge in the impression product according to the present invention.Can use any suitable material.Other the material that can be used is including, but not limited to silicon, metal oxide; Metal forming; Paper; Nitrocotton; Glass; Photoresist; Pottery; Timber; The product of fabric base; With their combination.

The impression product can made on the discrete substrate or on the substrate material of continuous rolling.Fig. 1 has shown an embodiment of the production line that is used for constructing discrete product such as card.In this example, in the card stock of discrete substrate form, input hopper 1 before being loaded into output card hopper 6 in succession by print 2, embossing 3, lamination 4 and 5 stations of programming.The example of the production line that is used for making continuous product or makes on the sheet material roller is shown in Fig. 2.In this example of tinuous production, processing module has been interspersed, and material is supplied with conveying device 7 and execution is following operates: form storage material input 8; Be shaped 9; Fill 10; Connect 11; Printing 12; Solidify 13; Tension force control 14; Material guides and launches 15; Embossing and punching 16; Die-cut 17; Collection 18 with final parts.

As shown in Figure 3, according to one embodiment of present invention, it provides the device 30 that comprises the automatic stamping press device.The purpose that illustrated device 30 is described among Fig. 3 only is diagram.As shown here, device 30 comprises structure wheel or head 31, and it can be by computer control.A plurality of impression elements or instrument section 32 are connected thereto by actuator 33 separately.Though illustrated among Fig. 3 only is the impression element or the instrument section of limited quantity, it should be understood that the more tools section can occur with multiple different array or layout.Such additional arrays or layout are also in design scope of the present invention.Structure wheel or head 31 can be individually, perhaps a plurality of drive actuator 33 in phase mutually.The precision mechanism of drive actuator 33 is believed fully in those skilled in the art's limit of power.Suitable driving mechanism includes, but are not limited to: mechanical device; Electromechanical assembly; And pneumatic means.As further illustrated among Fig. 3, impression element 32 and their actuators 33 separately can move along arrow 34 indicated directions.Structure wheel or head 31 can be installed pair of tracks 35 as shown by any suitable device.Structure wheel or head 31 can move as shown in arrow 36 relative to attachment rail 34.Track 35 optionally is installed on a pair of cross track 37.Track 35 relative cross tracks 37 are removable, and are indicated as arrow 38.Therefore, in accordance with the embodiments illustrated, structure wheel or head 31, with its impression element that is associated or instrument section 32 relatively at least three the different directions in substrate S edge move.Relatively moving and can finish by any suitable mechanism between track mentioned above and structure wheel or the head, this is fully in those skilled in the art's limit of power.Suitable mechanism includes, but are not limited to: servomotor, the pulley system of dynamo-electric engagement; Perhaps similar.In addition, or as optionally, install 30 and can comprise a kind of mechanism, substrate S can move relative to constructing wheel or head 31 by this mechanism, and indicated as arrow 39, this relatively moves can be along longitudinally with respect to substrate S.Any suitable mechanism can be provided for and finish moving of substrate S.In those skilled in the art's limit of power, the mechanism of suitable mobile substrate includes, but are not limited to: conveying arrangement or conveyer belt fully in the realization of such mechanism.The use of the private type of ID card system is provided in certain embodiments.In such system, cartoon is crossed the roller nip (roller nips) between the different processing stations, comprises through having the embossing station of character embossed wheel.In some instances, card can pass through (x axle) head (z axle), and head in other example (y-z-axle) and card (x axle) all move.

Optionally, device 30 further comprises aligning guide or the system of being convenient to impress element 32 relative substrate s location.For example, align structures 30AF can be aligned sensor 30AS and survey or read in, and alignment sensor can produce beginning then or stop the control mark C that moves with respect to substrate s.Align structures 30AF can comprise the breakpoint or the structure of surface or bulk material, mark, notch, groove or margin guide device.In the device of replacing, sensor 30AS is that image-forming sensors and pattern identification are used to judge aligning and/or quality Control.

As mentioned above, according to an aspect of the present invention, impression element or instrument section can be by driven in synchronism to apply the pattern of selection to substrate.Replace, shown in Fig. 4 A-4C, the pattern P of selection can be applied on the substrate by a plurality of different impression elements of sequential use or instrument section, and the pattern P of Xuan Zeing is limited by a plurality of sub pattern overlapping or that engage like this.So, shown in Fig. 4 A, form the first sub pattern 44a thereon thereby the first impression element or instrument section 40a are applied to substrate 42.Then, shown in Fig. 4 B, after applying the first sub pattern 44a, then the second impression element or instrument section 40b are applied to substrate 42 and produce applying of the second sub pattern 44b, and second sub pattern is overlapped at least with the first sub pattern 44a or engaged.Subsequently, the 3rd impression element or instrument section 40c is applied to substrate 21 and produces applying of the 3rd sub pattern 44c on it.The 3rd sub pattern 44c is overlapped at least with the second sub pattern 44b or is engaged.So (44a, 44b is 44c) in conjunction with the pattern P that constitutes the selection on the substrate 21 for three sub pattern that applied in succession.

In another embodiment, identical impression element, or the difference impression element with identical imprinted pattern can be used in succession to form sub pattern overlapping or that engage on the layer of the same one deck of substrate or separation.Fig. 5 A-8C illustrates the use in succession that is used for embossing (Fig. 5 A-5C), is shaped (Fig. 6 A-6C), cuts the instrument section of (Fig. 7 A-7C) and deposition (Fig. 8 A-8C).

In Fig. 5 A-5C, (52a 52b) is embossing in the substrate 54 and stays patterned surface instrument 50 with sub pattern.In Fig. 6 A-6C, instrument 60 forms sub pattern in substrate 62 (64a 64b) stays the blister shaped region.In Fig. 7 A-7C, (74a 74b) removes figuratum zone to the sub-opening in the instrument 70 cutting substrates 72.In Fig. 8 A-8C, instrument 80 is pressed onto material 82 in the substrate surface 84 or stays son deposition on the substrate surface (86a, 86b), this a little deposition has constituted the figuratum zone of deposition materials together when instrument is removed.

The further embodiment of the present invention is shown among Fig. 9-11B.Here the device of describing among the device of describing 90 and the Fig. 3 that describes before 30 is in structure and operate all similar.So go through its different elements and member with reference to the description of installing 30 before.According to illustrated device 90 and technology among Fig. 9-11B, a plurality of impression elements or instrument section 92 by separately actuator 93 by structure wheel or head 91 by driven in synchronism, in order that to one or more surfaces of substrate S apply separately sub pattern (94a, 94b, 94c).As shown in Figure 9, all form the required impression element instrument section 92 of described pattern P and are driven and be applied to the surface of substrate S simultaneously, thus apply all needs each sub pattern (94a, 94b is 94c) to limit the pattern (P of selection; Figure 10).

The improvement of this device and technology is shown among Figure 11 A-11B.As illustrated herein, at least one group of a plurality of impression element or instrument section 92 are applied simultaneously at least one surface of substrate, in step in succession then are to use one or more additional impression elements or instrument section 92 in order that finish the pattern P of selection.In more detail, shown in Figure 11 A, (94a 94b) is delivered to the surface of substrate S thereby the surface that first group of a plurality of impression element or instrument section 92 are applied to substrate S is with sub pattern.Subsequently, substrate changes with respect to the position of structure wheel or head 91.The change of this position can be passed through mobile substrate S, and is indicated as arrow 96, or by moving structure wheel or head 91, indicated as arrow 98, and influenced.This moving can be aligned system's control, as previously described.As shown in Figure 11 B, in case structure wheel or head 91 are determined with respect to the relative position of substrate S, impression element that at least one is additional or instrument section 92 are driven so that one or more additional sub pattern 94c are applied to the surface of substrate S by separately actuator 93, thereby finish the pattern (P of selection; Figure 10).Though illustrate only two steps according to exemplary embodiment above, it should be understood that the independent driving and/or the mutual in groups synchronously driven additional step that comprise one or more impression elements or instrument section.

The patterned structure that overlaps on different surfaces or the layer is presented among Figure 12-14.Figure 12 has shown the overlay structure (100,102) on the separating layer of same substrate S (104,106).Figure 13 illustrates the hole of passing substrate S 108 that connects two structures (104,106).Figure 14 illustrates the overlay structure (110,112) on the adjacently situated surfaces of two substrates (114,116), and structure (110,112) joins to together in the overlapping region and comprises inlet/outlet opening (118,120).The structure of impression or embossing also can form the part of the structure of being made by other method, or merges with the structure of being made by other method.Figure 12-14 illustrates and the overlapping impression of other structure of microfluid or the example of patterned structure, and wherein embossed area is connected to the hole (108,118,120) of passing substrate.According to the present invention, the hole can be made before or after the surface structure is finished.The hole can form by other technology.

In certain embodiments impression or embossed characters can comprise on impression element or the instrument section just and/or negative figuratum structure and can mate ground in pairs or running in groups.The example that Figure 15 A-15B shows illustrates the positive instrument section 150 of coupling of the formation that is used for raised design and the running of negative instrument section 152.In this example, instrument section (150,152) and the substrate between them 154 gather together, and make substrate 154 be shaped around instrument, produce patterned material 156 when instrument is removed.The example of other embossing comprises that will impress element 160 drivings with bearing flat instrument 162 enters substrate 164 to avoid the distortion of pattern opposite side, and shown in Figure 16 A-16B, wherein figuratum substrate 166 includes patterned side 168 and planar side 169.

In some preferred embodiment, coining tool comprises special structure, to avoid the distortion of substrate and adjacent structure.Tool construction includes, but are not limited to, and is used for the extra wide processing bearing that is positioned at the structure structure periphery of substrate, to guarantee that substrate keeps its original profile except imprinted pattern.This bearing can be used to prevent that substrate is crooked under force of impression.

Other tool construction can comprise that the impression geometry is to avoid material and flow into and or to remove the undesired pattern deformation of adjacent structure.Such processing design can comprise the tool geometry structure with overlapping with adjacent patterns and or use and the close temporary structure of pattern, but not necessarily overlapping, it allows in structure or the construction process afterwards material mobile.These examples that are used for the geometry of improved passage formation are presented at Figure 17 A and 17B.Figure 17 A illustrates the vertical view of coining tool 170, and coining tool has the pattern 171 of protrusion, and it has and is used for the swelling structure 172 that passage forms.After pattern 174 that the instrument pattern is pressed in the substrate 173 and forms and existing pattern 175 are overlapping, substitute material transfer to existing pattern channel design 175 be that material stream 176 moves in the established swelling structure 177.As shown here, (173a 178b) constitutes whole pattern P by the sub pattern with overlapping region 178c.

Figure 18 B-18B illustrates example, wherein extra dark or extra wide imprinted pattern 180 can be used to by continuous impression action approaching overlapping some patterned structure 182 in substrate 183 on the instrument 181, flows into these interim structures 184 that forms to allow material.As shown, (186a 186b) constitutes global pattern P by the sub pattern with overlapping region 186c.

In some imprint process, material is deposited on the substrate or in the substrate.In these technologies, special structure can be used to anchor to material in the substrate or in the overlapping sub pattern.Such grappling part is particularly useful when connecting conductive material.In the example of Figure 19 A-19B, figuratum instrument 190 is used to forming pattern on the substrate and conductive foil 191 is anchored on the substrate 192, and when leaf stamping can comprise use protuberance as on the instrument 190 pin (pin) of projection or drift (punch) 195 in moulding process, to make material deformation and optionally on one side of material in punching 196 and the figuratum paper tinsel that its propelling is overlapping, overlapping multi-disc conductive foil (193,194) is joined together.Such deforming step can cause the perforation fully of material, and perhaps it can simply make the two layers of material engagement, and for example, machinery is installed.This two-layer can be separated by one or more other layers and strained layer can be deformed so that advance and passes this layer and other layer engagement before this step.

The microfluidic device and/or the member that form according to the embodiment of the invention are presented among Figure 20-24.The miniflow member can be created by the present invention, for example by using device described herein and technology to come imprinted substrate, then another part is connected to the passage that seals formation on the substrate.

Figure 20 has shown the microfluidic device 200 that has the passage 202 of embossing in the substrate 204, and another layer 206 lamination or be connected to the passage 202 that constituted on of passage by will having ingate 208 seal.Figure 21 has shown similar device 210, and it has the passage 211 that has constituted, and passage is cut break-through fully and crossed substrate 212 and then be closed subsequently by being connected other layer (213,214) at the top with the bottom, and upper layer comprises ingate 215.

Figure 22 illustrates the device 220 of 3 laminars, and its passage (221,222) embossing is in the top surface of bottom two substrates (223,224), and connecting hole 226 passes middle substrate 224, and ingate (227,228,229) pass intermediate layer 87 and upper layer 88.

Figure 23 illustrates similar device 230, and wherein the passage (231,232) of embossing is communicated with by opening 234 on the top surface of middle substrate 233 and the basal surface.The inlet of channel design is provided at the end by the opening (235,236,237) that passes layer (233,238).Figure 24 illustrates between top and the bottom layer (244,245) device 240 that has the passage (241,242) of embossing on two adjacent surfaces.When connecting, structure is engaged by overlapping region 243 and the inlet of structure provides by opening (246,247).

In another aspect of this invention, use the passage of device described herein and technology embossing to be formed on the substrate, passage applies by suitable technology such as scraping blade then and is filled other material, shown in Figure 25 A-25C.This formation to conduction road and heat conduction area in micro-optics or waveguide manufacturing and the electronic circuit all is particularly useful.In this example, the multiple field substrate 250 that has embossing passage 252 (Figure 25 A) is filled with liquid 254, generates waveguide 258 by means of scraping blade 256 (Figure 25 B) in substrate 250 (Figure 25 C).

The imprinted pattern of microfluid can be multiple single point or zone in its simplest and prevailing form, and they are overlapping to form required pattern.Duplicate for faster and better structure, can construct a more specifically set of tools 260.The example that is used for the coining tool group of microfluid manufacturing is shown in Figure 26, and wherein each the element representative in the grid has the independent instrument 262 of stamping structure 264.

The structure instrument is used to the manufacturing of electronic circuit in another preferred embodiment, and conductive material is embossed or be impressed in the parts, or is used to fill the zone of embossing, so that the connection of electronic circuit to be provided in device.The example that is used for the coining tool group 270 of circuit board manufacturing is shown in Figure 27, and wherein each the element representative in the grid has the independent instrument 272 of the structure 274 that forms pattern.

In order further to explain this aspect of invention, exemplary embodiment has used the stamping technique that is similar to leaf stamping to be electrically connected to form.Figure 28 illustrates the device 280 that comprises heated die 282, heated die paper tinsel 284 is pressed onto in the reel-to-reel system 288 and substrate surface 286 on, the pattern of coupling is delivered to the surface of substrate from free layer.For the formation of electrode, need thicker conductive layer, can add a plurality of layers that are stamped then or the layer that is stamped can be used as the original layers of plating.This has simplified needs face shield or dull and stereotyped technology to produce traditional electroplating technology of figuratum substrate.

The printed circuit of multiple field creates by cover non-conducting material on the conductive material that impresses conductive material on the substrate and impressing then in one embodiment.In this mode, can cover the conductive material of many layers.Interconnecting with path between the conductive material can not have the zone of non-conducting material to form by for example providing, so that conductive region engages, or the conductive material impression passed the conductive layer of non-conductive layer with the contact below.For example, the cross section of Figure 30 A-30D has shown the example of multiple field impression circuit partial cross-section.Figure 30 A has shown the cross section of the two-tier circuit that is formed by two conductions (301,303) and two non-conductive (302,304) layer, interconnects portion 305 and is formed on and does not have in non-conductive layer 302 and conductive layer (301, the 303) overlapping areas 306.Figure 30 B has shown the portion that interconnects that shows among similar Figure 30 A, and wherein conductive material 307, and promptly a part or another sheet conductive material of layer 301 are stamped in the bottom conductive layer 303 to form more firm interconnecting.Figure 30 C has shown that non-conductive layer 302 does not have opening, but conductive material 308 is stamped and passes non-conductive layer 302 so that the mutual electrical connection between the conductive layer (301,303) to be provided.Figure 30 D has shown the partial cross-section of multiple field circuit, comprise three impressions the portion that interconnects (309,310,311) one of them interconnect portion 309 through three non-conductive layers (312,313,314).These multiple field portions of interconnecting can be finished by an impression action, and it is finished on different layers to all three layer punchings or by a plurality of overlapping impression actions.

In another embodiment of invention, use device of the present invention and technical construction substrate can be used to be shaped, or become the part of forming technology, so that heat conduction structure to be provided on device.Heat conduction layer is all very important for the heat flow in control microfluid and the electronic circuit.According to an exemplary embodiment, heat conducting material be stamped in the parts or parts on, or embossed zone is filled conductive material so that improved thermal control to be provided in device.

In another embodiment of invention, structure or embossing device and technology can be used to be shaped, or become guiding or stop the part of forming technology of the conductive region of electromagnetic radiation.Well-known is electromagnetism (EM) shielding protection conducting element, as fluid or electronic circuit, from the sensor or the actuator of electromagnetic interference (EMI), and can be used to weaken the radiation of chip component.Other embodiment can use the conductive region of having constructed for other purpose guide the electromagnetism zone, and as with sensor or driver, an example is to be used for manipulation or induced magnetism and or paramagnetic particle.

Invention is used to waveguide in another embodiment, or the light pipe manufacturing.Both comprised the use of all planarization materials in the typical microfluidic device manufacture method in the past, optical cable had directly been inserted sensor-based system, and comprised again in being similar to the manufacture method of semiconductor device forming pattern at surperficial lithographic plate.Waveguide can be filled by any suitable method by the structure of embossing and form in one embodiment, for example, and by spraying in channel interior or apply optically transparent material, or by established light pipe being placed in the empty structure.The example that passage is filled by the scraping blade coating is presented among Figure 25 A-25C and illustrates prefabricated light pipe is merged among Figure 29 A-29C of the device 290 of having constructed.Example among Figure 29 A-29C illustrates the step group of microfluidic device, comprises prefabricated waveguide 291 inserted comprising in the substrate 292 of microfluidic structures 293, is shown among Figure 29 B.Prefabricated waveguide 291 is placed in the location structure 294 of contiguous microfluidic structures 293 in the substrate 292.Confining bed 295 is used to closure means then, provides an only opening 296 and waveguide of leading to microfluidic structures on top surface 297 to pass through side mouth 298 input and output.

In other embodiment of invention, the structure of Chan Shenging can be cut like this, bending or be divided into less parts.

The parts that are stamped can be connected on other element, and it can be or not necessarily continuous substrate, and can be smooth or uneven, and can be made by single or multiple members.

In other embodiments, imprint process can combine with other technology; Including, but not limited to impression or embossed technology, construction process such as injection-molded, littlely mill, die-cut, Laser Processing, embossing, thermoplastic, print head deposition, light absorption and other building method.

The present invention also can combine with other technology to promote imprint process.In one embodiment of the invention, its combine with pretreating process with at impression (as embossing) thus the softener material quality that shortens the time of staying and improve reproduction component before.Pretreating process can for example comprise volume or surface treatment method, for example uses baking oven, infrared heater, chemicals, ultraviolet lamp, plasma, laser and/or face coat.The post-processed process also can be used, and for example parts is cured, surface treatment, applies or play up (render).

Alignment mark, notch, groove and or the use of margin guide device be the commonsense method of using in a lot of manufacturing systems.In a preferred embodiment of this technology, the present invention uses control system to help aim at and provide quality control.Parameter in the control system includes, but are not limited to, sensor feedback machinery and/or optics, and these feedbacks are relevant with part translation or the adjustment of embossing head, aim to improve.

Numeral expression component, composition, therefore the quantity of reaction condition is used in will be understood to be in all examples in this concrete occasion and is revised by term " about ".Though be provided with digital scope and parameter, being similar on a large scale of the theme of Xian Shiing herein, the digital value indication ground of setting is accurate as much as possible.Yet any digital value comprises some necessary error inherently, and this is caused by the standard deviation of finding in their measuring techniques separately.

Though the present invention gets in touch preferred embodiment herein and describes, those skilled in the art are appreciated that interpolation, deletion, improvement and the displacement of non-detailed description can make under the situation that does not depart from spirit of the present invention and accessory claim institute restricted portion.

The application advocates the priority of the U. S. application 60/761746 of application on January 25th, 2006, and its all the elements are merged herein by reference.The application also advocates the priority of the U. S. application 60/811436 of application on June 7th, 2006, and its all the elements are merged herein by reference.The application also advocates the priority of Australia's application 2006903100 of application on June 7th, 2006, and its all the elements are merged herein by reference.The application also advocates the priority of Australia's application 2006900345 of application on January 24th, 2006, and its all the elements are merged herein by reference.

Claims (64)

1. method that on substrate, forms stamping structure, this method comprises:

(i) a plurality of coining tool sections are applied at least one surface of substrate.

2. the method for claim 1, wherein (i) thus thereby comprising that at least one surface that the first coining tool section is applied to described substrate goes up to form first sub pattern and at least one surface that the second coining tool section is applied to described substrate gone up forms second sub pattern.

3. method as claimed in claim 2, wherein said first sub pattern is different with second sub pattern.

4. as claim 2 or 3 described methods, wherein said first sub pattern and second sub pattern are overlapped at least.

5. as each described method of claim 2-4, wherein said first sub pattern and second sub pattern combine to form stamping structure.

6. as each described method of claim 2-4, wherein (i) comprises that further the coining tool section that at least one is additional is applied at least one surface of described substrate, thereby forms at least one additional sub pattern.

7. method as claimed in claim 6, wherein each sub pattern combines to form stamping structure.

8. the method for claim 1, wherein (i) thus thereby comprising that at least one surface that the first coining tool section is applied to described substrate goes up to form first sub pattern and at least one surface that the first coining tool section is applied to described substrate gone up forms second sub pattern.

9. method as claimed in claim 8, wherein said first sub pattern is identical with second sub pattern.

10. method as claimed in claim 8 or 9, wherein said first sub pattern and second sub pattern are overlapped at least.

11. as each described method of claim 8-10, wherein said first sub pattern and second sub pattern combine to form stamping structure.

12. as each described method of claim 8-10, wherein (i) further comprises the additional at least once first coining tool section being applied at least one surface of described substrate, thereby forms at least one additional sub pattern.

13. method as claimed in claim 12, wherein each sub pattern combines to form stamping structure.

14. as each described method of claim 1-13, wherein (i) comprises following one or more: embossing at least one surface of substrate, shaping, cutting or deposition materials.

15. method as claimed in claim 14, wherein said deposition materials comprise following at least one: conductive material; The coating of ornamental or protectiveness; Be used for surface-treated chemistry or biological reagent, comprise to the material of small part actuator or sensor marker material or optical material.

16. the method for claim 1, wherein (i) thus comprising at least simultaneously that at least one surface that the first coining tool section and the second coining tool section are applied to described substrate is gone up forms first and second sub pattern.

17. method as claimed in claim 16, wherein said first sub pattern is identical with second sub pattern.

18. as claim 16 or 17 described methods, wherein said first sub pattern and second sub pattern are overlapped at least.

19. as each described method of claim 16-18, wherein said first sub pattern and second sub pattern combine to form stamping structure.

20. as each described method of claim 16-19, wherein this method comprises that further the coining tool section that at least one is additional is applied at least one surface of described substrate, thereby forms at least one additional sub pattern.

21. as each described method of claim 16-19, wherein this method further comprises a plurality of additional coining tool sections is applied at least one surface of described substrate, thereby forms a plurality of additional sub pattern.

22. as claim 20 or 21 described methods, wherein each sub pattern combines to form stamping structure.

23. as each described method of claim 20-22, wherein a plurality of at least sub pattern are identical.

24. as each described method of claim 20-22, wherein a plurality of at least sub pattern are different.

25. as each described method of claim 1-24, wherein said substrate comprises: silicon, polymer; Metal; Metal oxide; Metal forming; Paper; Nitrocotton; Glass; Photoresist; Pottery; Timber; The product of fabric base; And/or their combination.

26. as each described method of claim 1-25, wherein stamping structure has about 0.1 at least to about 1000 microns one dimension size.

27. as each described method of claim 1-26, wherein said substrate is continuous sheet material.

28. as each described method of claim 1-27, wherein said substrate is sheet or the parts that disperse.

29., wherein further comprise as each described method of claim 1-28:

(ii) following is one or more: cut or divide described substrate; And/or described substrate is connected on other member.

30., wherein further comprise one or more preliminary treatment substrates of optionally using in baking oven, infrared heater, chemicals, ultraviolet lamp, plasma, laser and/or the face coat as each described method of claim 1-29.

31., wherein further comprise one or more post-processed substrates of optionally using in infrared heater, chemicals, ultraviolet lamp, plasma, laser, curing and the face coat as each described method of claim 1-30.

32. as described method of claim 1-31 and following one or more combining: injection-molded; Little milling; Die-cut; Laser Processing; Embossing; Thermoforming; The print head deposition; And photoetching.

33. a method that forms microfluidic device comprises according to each described method of claim 1-32 forming stamping structure.

34. a method that forms electronic circuit comprises according to each described method of claim 1-32 forming stamping structure.

35. a method that forms the multiple field circuit comprises according to each described method of claim 1-32 forming stamping structure.

36. method as claimed in claim 35, wherein said circuit are formed on a plurality of layers of the non-conducting material that links together.

37. one kind forms the method that electricity interconnects portion or electric pathway, comprises according to each described method of claim 1-32 forming stamping structure.

38. one kind forms the method that electricity interconnects portion and/or electric pathway, comprises that the part with conductive material impressed non-conductive layer.

39. a method that forms micro-optical device comprises according to each described method of claim 1-32 forming stamping structure.

40. a method that forms heat conduction structure in device comprises according to each described method of claim 1-32 forming stamping structure.

41. a method that forms the electromagnetic shielding device comprises according to each described method of claim 1-32 forming stamping structure.

42. one kind is carried out the surface-treated method to device, comprises according to each described method of claim 1-32 forming stamping structure.

43. a method that forms decorative coating on device comprises according to each described method of claim 1-32 forming stamping structure.

44. one kind is applied to the method for device with sensor, comprises according to each described method of claim 1-32 forming stamping structure.

45. one kind is applied to the method for device with actuator, comprises according to each described method of claim 1-32 forming stamping structure.

46. the described method of each in the aforementioned claim, wherein stamping structure is by overlapping formation on layer identical or that separate.

47. the described method of each in the aforementioned claim, wherein the coining tool section impresses on a plurality of surfaces.

48. the described method of each in the aforementioned claim, wherein impress element with the coupling in phase the action.

49. a device that forms stamping structure on substrate, this device comprises a plurality of coining tool sections that can drive in the following manner: drive individually; Drive in groups and in phase more than one; Or the two drives combinedly.

50. it is automatic that device as claimed in claim 49, the operation of wherein said device are part at least.

51. as claim 49 or 50 described devices, wherein said a plurality of coining tool sections are installed on structure wheel or the head by actuator separately.

52. device as claimed in claim 51 wherein further comprises the installation system that allows structure wheel or head to move along one dimension at least.

53. device as claimed in claim 52, wherein said installation system comprises a plurality of tracks.

54., wherein further comprise substrate as each described device of claim 49-53.

55. device as claimed in claim 54 wherein further comprises the mechanism that moves described substrate.

56. as each described device of claim 49-55, comprise further that wherein purpose is the control system that is used to aim at one or more coining tool sections of coining manipulation, described control system comprises following one or more: alignment mark, notch, groove, margin guide device and sensor machinery, sound wave, heat energy or optics.

57., wherein further be associated with the image recognition processes that is used for quality control and/or aims at purpose as each described device of claim 49-55.

58. as each described device of claim 49-56, wherein at least one coining tool section is included in the stamping structure zone wide bearing that is used for substrate on every side.

59. as each described device of claim 49-58, wherein at least one coining tool section comprises extra wide or extra dark geometry, is used for making in substrate interim structure.

60. as each described device of claim 49-59, wherein at least one coining tool section is included in the geometry of manufacturing temporary structure in the most close pattern place in the substrate, is used for the interior improved pattern of substrate and duplicates.

61. as each described device of claim 49-60, wherein at least one coining tool section comprises the protuberance that is used to make substrate or deposition materials distortion.

62. device as claimed in claim 61, wherein said protuberance are pin or drift.

63. one kind forms the device that electricity interconnects portion or electric pathway, comprises the coining tool section that forms stamping structure.

64. as the described device of claim 63, wherein the coining tool section can impress non-conductive layer with the part of conductive material.

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