CN101410250A - Methods for low cost manufacturing of complex layered materials and devices - Google Patents

Abstract

A process for manufacturing a device includes performing a plurality of non-bonding processes during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. The processes may be performed by a plurality of modules. The modules may be independently controlled and/or monitored. The modules may be interchangeable. One or more modules may receive and/or pass material to another module. The devices that are manufactured may be a layered device, a smart card, a sensor, an actuator, an in vitro diagnostic device, a microfluidic device, or a laminar product. An apparatus for manufacturing device includes at least one web-based manufacturing component and at least one sheet-based manufacturing component. The at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.

Description

The low-cost manufacture method of complex layered materials and device

Technical field

The present invention relates generally to have the complex layered materials of one or more layers suitable modification, change or admixture and the manufacturing of device.More particularly, the present invention relates to change manually or under the control degree automatically with low-cost, with variable number and the method for making these materials and device with the variability and the precision complexity of height simultaneously.In addition, the invention still further relates to the effective manufacturing function of the same manufacturing facility stratified material different and the method for device utilized with complexity.Field of the present invention also extends to effective manufacturing of complicated polymeric material and device, and its manufacturing feature is a size from centimetre changing and can control to nanometer.

Background technology

In the following discussion, with reference to specific structure and/or method.Yet this is with reference to not being interpreted as admitting that these structures and/or method constitute prior art.The special reserved power of the applicant proves that this structure and/or method are not construed to prior art.

Many industries have been transferred to stratified material with the material behavior of the enhancing that utilizes this synthetic material and provide and functional.A simple case is meteorological protection, the intensity that coating provides steel to provide.A complex examples is to make the minisize fluid tank circuit and minisize reaction chamber by bonding through the plane sheets (planar sheets) of the suitable material of etching and cutting.Another complex examples is to make multilayer board, allow circuit than the circuit complexity of once utilizing individual layer or double layer material to realize many.Another example is the supporting course that bonds on high-count fabric, thereby improves their durability and do not sacrifice texture and visual appearance.One example of stratiform multifunction device is " SMART " card, and wherein, the many layers that contain figure, electronics, magnetic and tactile feature are included in the multilayer device.

Having made great efforts to research and develop new technology impels higher productivity ratio and the lower cost of usefulness to make this complex layered materials.Along with the past of time, two kinds of basic craft course have been developed.A kind of method is devoted to individual devices and is made technology form streamline so that complexity and/or functional layering or stack.Other method is devoted to make in batches long stratiform sheet material (long layered sheets), cuts out individual devices by this stratiform sheet material after modification.

Every kind of advantage that all has them in these methods.First method can be made high material of complexity and device, but the cost height.Another kind method can low-cost manufactured materials and device in batches, but complexity correspondingly reduces.

Other of these methods is not enough and obstacle has caused production harm, and this has further hindered the target that realizes making in batches with low cost complex layered device.Attempted in conjunction with these technologies realizing these purposes, but effect is indefinite and limited.

From 1840s, polymer has been used as the more cheaper alternative of metal and has made consumptive material especially, and in 1890s in early days, polymer has been used to produce in batches composite and the device that uses for instrument.Because the advantage that polymer is used in the low-cost manufacturing in batches is significant, so this argumentation relates to the employing polymer, but be applied to equally adopt other material, comprise thin or the thick film surface coating or their combination of metal, metal oxide, metal forming, pottery, glass and these materials.

The same with above-mentioned two kinds of main general technology methods, later stage in the last century surface characteristics manufacturing technology of research and development can be divided into two kinds of other classifications usually.

At first be to adopt the direct mechanical processing method, wherein, directly on the aspect of making by suitable material, generate the expection patterns of features.These methods comprise little mill, based on wet chemistry UV photoetching, soft lithographic, X-ray lithography and the print-head deposition of the photoetching of laser and beam scanning, plasma etching, employing photoresist.In these technology, based on the technology of laser because be easy to handle and they can be in various materials limited and anisotropic character submicron-scale of the span demonstrate maximum development.

Second method relates to the technology that adopts caster to form the expection pattern.These feature duplication process comprise soft lithographic, embossing, compression moulding, thermoforming, injection moulding and reactive injection moulding, and are particularly suitable for adopting polymer, although these technology also can adopt other material that comprises low-melting-point metal and frit.

Great majority in these materials or the device making method all only limit to generate 2 dimensions or 2 ¹/ ₂The structure of dimension.The maximum common ground of these methods is one or more in the little mill of employing computer numerical control (CNC), injection moulding or the heat embossing, and this can only generate very limited feature complexity.For making 3 complicated dimensional polymers parts, these microtexture methods need be assembled several parts that generate separately usually.Yet assembling microcosmic parts are a kind of continuously manufacturings of aiming at challenge that exist, and technology is required great effort, output is lower and the cost height of Related product and this further causes.

The another kind of method recently of making complicated polymeric material and device is to pile up, aim at and engage the thin layer (film) that (bonding) several layers has made.Better simply 2 dimension manufacturing technologies (for example, press polish, cross cutting and laser treatment) of this laminating method permission employing and the joining technique of having established (bondingtechnologies) generate 3 complicated dimension material or devices.This 3 dimension methods for designing are particularly suited for adopting the high power capacity manufacturing of spool to spool (reel-to-reel) processing, as Mehalso (" TheMicrosystems Road in the USA (the micro-system highway of the U.S.) ", Mstnews, the 4/02nd volume, 6-8 page or leaf (2002)) and Schuenemann (" Packaging f Disposable Chips forBioanalytical Applications (packing that is used for the disposable chip of biologicall test) ", IEEE electronic component and technology conference, the state of Nevada, U.S. (2004)) etc. described.

Market pressure has impelled to be made in batches strategy and leaves the manufacturing system development of traditional fixedly product line method towards mobility and response, with provide speed and rapidly adaptability meet the need of market.This new manufacturing method flexibly is used for individual machine usually, perhaps when be used to flexibly to give a plurality of production line modules directed again or ordering again under the situation of making discreet component on the assembly line.Yet, for production line be the spool of continuous processing for the spool system, this is more difficult suggestion.Although United States Patent (USP) 4805111 has been described a kind of modularization sheet volume system (modularized websystem) of restructural production line, because the continuous feature of raw material supply when using in system, the complexity of the mobility of system and the device that generates is limited.

So far, for the manufacturing of stratiform polymerization device, only described in batches, serial or continuous spool be to the spool treatment technology.

In common batch process, utilize a large amount of or many products of a collection of manufacturing of a system handles.In the microscopic techniques, batch process is quite general in making based on the device of silicon or glass.An example is the manufacturing of integrated circuit, and wherein, silicon wafer is used as substrate, and subsequently it is carried out a large amount of plus-minuss and handle to form electronic component for example gate circuit and transistor in the surface of this substrate or on it.After these treatment steps are finished, separate and packaged devices.In another batch process example, utilize print principle to print polymer banknote, wherein, handle sheet material or the ticket that contains tens banknotes simultaneously, in final treatment step, separate then.Recently technology combines in this print principle and the surface that false proof microscopic feature is pressed into polymer banknote.

Yet manufacturing technology is quite expensive in batches for these, especially when relating to microscopic feature.Using according to the key industry of the device of the method manufacturing is to be the product of direction with the high yield in assembly large scale industry, science and the Government Laboratory that can be reused, thereby amortizes cost in the working life of device.For the many potential application of miniature stratiform biologicall test device, be particularly useful for immediately/promptly use the disposable unit of device, this high production cost is inappropriate.

Can be used for based on the batch manufacturing of the device of layered polymer that for example cross cutting, joint, grinding and laser cutting form a plurality of microdevices via a series of processing.Yet, since microminiaturized with need this device to be connected the technological challenge of real world sample and instrument reliably, the stratiform polymerization device that makes in this manner silicon or the glass duplicate than them usually is big, and has rare packing challenge.In addition, these batch process are difficult to automation, and making storage, manipulation, aim at and assemble the micro-component itself that is generated becomes commerce and technological challenge.As a result, can be limited via the number of devices that the polymer batch process is made concurrently and economically, make this method only be suitable for produced in small quantities.

The serial manufacturing is the interactional manufacturing strategy of continuity of a kind of manufacturing process and single workpiece (perhaps quite a small amount of workpiece).Example is injection moulding, heat embossing or machine mill.Although some automation strategies that in the technology that extensively adopts in these industry every kind all is most appropriate to high yield and is used to connect a series of processing can be used for traditional product well, but for the microscopic structure device, the cycle of required increasingly automated process, complexity and cost all significantly increase.Under emulative industrial environment, store, handle, assemble and aim at micro-component and remain a technology and economic challenges.Therefore, serial manufacturing process is suitable for small-sized product line to medium size most.

A kind of prospect substitute mode that has to batch and serial manufacturing technology is that spool arrives reel process or so-called technology based on sheet volume (web-based).This is the high yield manufacturing process that is used for the composition polymer stratified material that generally adopts in conjunction with the packages printing industry, and recently has been described the manufacturing that is used for complex layered device, referring to above-mentioned Mehalso and Scheunaman etc.In addition, referring to United States Patent (USP) 6803019 and 6878345.

Therefore the flexible layer (film) that process using according to the present invention is carried continuously from the spool that comprises individual devices, is making individual devices in the substrate continuously.Then, prepared device or according to using on spool with mode similar described in United States Patent (USP) 6803019 and 6878345 is perhaps as being separated into their single parts as described in the above-mentioned Mehalso.

This production line based on the sheet volume is easy to increasingly automated, therefore quite economizes the labour.The major advantage of in this continuous and automatic system, handling be usually can be lower cost realize high yield.Although the initial outlay expense based on the production line of sheet volume is higher than Serial Production Line, for suitable large-scale production line, the manufacturing cost of unit product is quite low.

This spool is that they are quite responsive to machining deviation usually to the major advantage of spool production line.If the tolerance of the single processing component overshoot on the production line or defective, owing to the continuous feature of production line, all parts at this place of process all are affected and output significantly reduces so.Stopping production line can causing the operation of whole production line to suspend to repair problematic parts.

These production lines are devoted to a specific products usually, and when mounted and parameter optimization aspect needs bigger investment, especially when the strictness of processing tolerance have the device of microscopic feature the time.Because this set-up time, based on the length of the system of sheet volume with because there are many spillages of material usually in wearing and tearing and tearing or the gross effect of the misalignment that unit failure causes.Business system allows the fringe cost of this loss as fixed percentage usually, and the final price of product correspondingly changes.Spool is to another shortcoming of spool system speed of whole production system that has been process limitation the slowest in the system.

In addition, spool need be flexible to the substrate in the reel process, uses for the roll operation system.Referring to for example United States Patent (USP) 6827906.This has limited layer thickness that is adopted and the number of plies amount that can make up and operate on this production line.This uses the speech existing problems for the bigger environmental interface of needs, bigger fluid displacement, bigger operating structure or higher strength of parts or many stratified materials of a large amount of knitting layers (bonded layer), and all these features all trend towards making the quite firm and therefore strict applicability that limits spool to the spool production method of resulting device.

Spool is that substrate need keep common flat shape and outer surface almost not to have or do not have projection fully to another shortcoming of spool treatment system.Because the method also defines substrate thickness, this has further limited the design of product, usually need 3 bigger dimension shaped objects with provide functional for example with being connected of external devices or providing of internal liquid apotheca.

This specification or not should not be counted as approval or any type of suggestion to the reference of any prior art, and prior art forms the part of common practise.

Summary of the invention

The present invention overcomes above-mentioned restriction when keeping advantage, and the introducing new method is eliminated or minimizing deficiency substantially and obstruction.

The present invention relates to make the method for complex layered materials and above-mentioned different process combined with the novel artistic novelty and the device that obtains with low-cost, high yield, these technologies in conjunction with the time in the reservation advantage and overcome the restriction of present practice when introducing new advantage substantially.Although can adopt any base material and any subsequent material to make stratified material, one embodiment of the present of invention relate to and have at least one layer material and have from centimetre manufacturing to the composite polymeric device of the functional character of nanometer.The present invention also introduces non-cohesive material technology and accurately locatees these materials to allow the integrated functionality of low-cost and high yield.

According to a kind of embodiment of the present invention, a kind of device fabrication is provided, comprise and carry out at least one manufacturing step and at least one manufacturing step based on sheet material (sheet-based) based on the sheet volume.In another embodiment, a kind of device fabrication is provided, comprise and carry out at least one manufacturing step and at least one manufacturing step based on sheet material based on the sheet volume, wherein, (a) at least one or in more than a manufacturing step based on the sheet volume, and, carry out a plurality of no joint technologies (non-bonding process) (b) at least one or in more than a manufacturing step based on sheet material.Among this embodiment, carrying out a plurality of no joint technologies based on the single step of sheet volume or in based on the single step of sheet material, perhaps in a plurality of each based in the steps of sheet volume or in a plurality of each based in the step of sheet material, carry out a no joint technology, as long as based on the single step of sheet volume or based on the single step of sheet material or form whole technology based on the set of steps of sheet volume or based in the set of steps of sheet material at least one, technology all comprises a plurality of no engagement step.

In certain embodiments, technology is modular, and a plurality of modules execution of technology utilization and each module are by independent control." no engagement step (non-bonding stage) " do not need to refer to from the parts of continuous lines with from the components bonding of sheet material (or discrete) line (for example, connect or cooperate) to together technology.An example is laminated.

Some modularization embodiment comprise a plurality of modules, select particular module according to production history and manufacturing Devices Characteristics from a plurality of modules.Module is also can exchange as required, and can receive or transmit material to another processing module.

Can make the device of wide scope according to the technology of this embodiment of the present invention, these devices for example comprise a) become layer device, b) smart card, c) sensor or actuator, d) electronic device, e) in-vitro diagnosis device or f) in the microfluidic device one or more.

Manufacturing process according to first embodiment of the invention has many advantages.For example, it has been simplified the variation of product category by increasing flexibility, has improved production line operation and cut the waste.

Technology according to this embodiment of the present invention also comprises control system, and this control system is optionally in module or between a plurality of modules.In certain embodiments, each module is by independent control.In addition, administered by distribution control system or distribution monitoring system according to technology of the present invention to small part.

The route selection of technology inner assembly of the present invention, route change or orientation can utilize proper technology or device to finish.In one embodiment, device assembles on the line and/or stores at least partially in making.In addition, in some embodiments, the identity according to assembly in the manufacture process guides them.Therefore, in one embodiment, increase (for example additional) code to assembly, and this code provides the identity of assembly.In addition, add assembly or remove assembly for other assembly according to the identity of assembly from other assembly.

In another embodiment of the present invention, a kind of like this technology is provided, wherein, the one or more aspects that provide at least one to adopt spool to make device based on other module of sheet material technology to module and at least one employing of reel process.This embodiment is suitable for making the device of wide scope.For example, it is suitable for making a) layer device, b) smart card, c) sensor/actuators, d) electronic device, e) IVD device and f) at least a in the microfluidic device.

Can be used for making any suitable product according to technology of the present invention.In one embodiment, it is used to make laminated product.This laminated product can be any suitable type.In addition, it is suitable for making complex product, and these product selectivity ground comprise: multiple material, for example polymer, timber, paper, silicon, pottery and/or metal; And/or multiple shape and/or thickness of material; And/or preform assembly.

In other embodiments, this technology makes device or the assembly that will make repeatedly pass through at least one module or station.In addition, the device that make or assembly are advanced towards a plurality of directions along making line or being independent of all the other production technologies.

Can make the various devices that comprise folding device according to technology of the present invention.

Technology of the present invention comprises additionally that also at least one buffered station is to handle buffer stock.It also comprises a plurality of production arms, and at least one production arm comprises a plurality of technologies.

According to another embodiment, the laminated device of manufacturing is a diagnostic device, and in one embodiment, it is a microfluidic device.Can make multiple device in this manner, comprise it for example being the folding device of folding microfluidic device.

Mechanical processing technique also forms part of the present invention, and an embodiment comprises multilayer processing, wherein, forms the machining figure on multilayer.Sacrifice layer also can be used for machining, and optionally, machining is two-sided.

In other embodiments, other technology of embossing and at least one combines to improve structure and duplicates.For example, it can comprise employing otch (cut-outs), groove (undercuts), Laser Processing or any other suitable technology.

Alignment system based on optics also forms part of the present invention, and comprises diffraction optical device or adopt conoscope image for example mole figure or any other suitable optical system.

The part that conducting element can be used as technology of the present invention is merged in the device.This conducting element conduction heat or electric power.In giving an embodiment of device supplemantary electrode, electrode is oriented to cover at least in part the smart card carrier module.Utilize for example hot paper tinsel thermoprint of various technology and device, counterdiffusion or printing technology additional conductive element mutually.

Other technology is optionally incorporated at least one wave guide member in the device into.Can adopt any proper technology, for example: surface-coated, fill at least one preformed configuration, insert at least one preform assembly.

The suitable joint technology that the present invention adopts comprises: adopt at least one techonosphere to reduce as far as possible or avoid malformation, mechanical interlocking technology or process for modifying surface.

According to another embodiment, adopt based on the technology of sheet volume (spool is to spool) with based on the technology of sheet material in different production steps according to the characteristic of required technology.When the production of particular type product need only utilize the step that one of these technologies or another finish, this embodiment was particularly useful.

In another embodiment, provide a plurality of modules, from a plurality of modules, select particular module according to the characteristic of production history and manufacturing product.In another embodiment, a plurality of modules can be exchanged as required.Preferably, this exchange is automatic.

Foundation spool of the present invention can be any suitable type to the aspect of reel process and the manufacturing of sheet material technology.For example, they relate to size, shape, function, add-on assemble, feature of described product etc.

According to another embodiment of the present invention, one or more processing modules can receive or transmit material and give another processing module.This processing module can be any suitable type, and for example, they are can receive new material and the sheet material that can work or spool to spool (conveying) processor under the situation that the material direction changes.Similarly, processing module can be carry out that one or more processing are for example constructed, engage, printed, the station of deposition, cleaning, surface treatment, drying, detection etc.

Can utilize any proper technology or device to control according to module of the present invention.For example, they can be by independent control, and perhaps they are subjected to the control of system or the control of another module.This module for example also comprises the feedback control system along the diverse location of production line.

Have many advantages according to modularization technology of the present invention, comprising:

● be convenient to remove and insert semi-finished product to boost productivity and meet the need of market better;

● can easier and more promptly carry out and safeguard and trouble hunting;

● be easy to change module and interference minimum to producing;

● module is quit work and do not damage the ability that manufactures a product at least in part;

● can further optimize technology;

● be easier to satisfy the requirement of particular consumer owing to the flexibility of the independence of module and system's design;

● waste of material is less;

● total output is higher;

● because many production lines are easier to share load, the ability of dealing with changes in demand strengthens;

● by detecting with system level and module level, quality control is better; And

● duplicating of module improved quality, reduced the research and development executory cost and quickened payment.

Another embodiment of the present invention comprises the distributed monitoring control system that spreads all over whole process.According to this embodiment, each manufacturing step can the oneself control, and monitoring output material and give the output material put on by or do not pass through so that subsequently or the controller of other separation can read this information and also correspondingly handle material.

The advantage of some embodiment of the present invention is that the shop lumber material of buffer stock can be identified (for example machinery identification) and carry out correct processing according to this recognition result subsequently, and does not need to utilize the degree of treatment and the position of computer permanent storage product.Another advantage is that material can be manually actuated processing, return production line, discerns and correspondingly handle.Thereby this system has avoided specific store line and special-purpose line of transference, because where material enters system is all suitably discerned and sends.This a example is that the half volume base volume in blocks that returns input point after safeguarding carries production, and sheet volume product next predetermined process in its arrival technology will be discerned and ignore to completed procedure of processing, thereby also avoid to adapting to any unnecessary variation that semi-finished product carry out production line.Another example is that this material will return production line at any step place, is identified and is sent out according to its next procedure of processing to the manual repairing of discarded plate substrate material.

According to another embodiment of the present invention, a kind of technology that is used to make microfluidic device is provided, comprises: during at least one is based on manufacturing step of sheet volume and at least one carry out at least one during based on the manufacturing step of sheet material and do not have and engage and do not have a final separation processes.The microfluidic device of Zhi Zaoing for example comprises folding microfluidic device like this.In certain embodiments, technology is modular." the final separation " refers to device or makes the step of assembly in last and other assembly or the isolation of components of assembly or device assembling.

In another embodiment, provide a kind of technology that also comprises multilayer stack step, and in another embodiment, be connected with the identical faces of same parts or assembly or device from one or more materials based on sheet volume technology.

In another embodiment, a kind of technology that is used to make multilayer device is provided, comprise at least one manufacturing step and at least one manufacturing step based on sheet material based on the sheet volume, wherein, carry out one or more technologies one or more in based on the steps of sheet volume, as long as this technology is not that graphic printing or cutting device are so that final isolation of components.

According to another embodiment of the present invention, a kind of device manufacture apparatus is provided, comprise at least one manufacturing assembly and at least one manufacturing assembly based on sheet material based on the sheet volume, wherein, at least one manufacturing assembly and at least one manufacturing assembly based on sheet material based on the sheet volume are configured to carry out a plurality of no joint technologies.Be suitable for making the device of wide scope according to the device of this embodiment of the present invention.In certain embodiments, this device is suitable for making a) layer device, b) smart card, c) sensor or actuator, d) electronic device, e) IVD device and f) at least a in the microfluidic device.In addition, this device also is suitable for making laminated (multilayer) product.

In another embodiment, provide a kind of device that is used to make microfluidic device, comprise at least one manufacturing assembly based on the sheet volume; And at least one is based on the manufacturing assembly of sheet material, and wherein, at least one manufacturing assembly and at least one manufacturing assembly based on sheet material based on the sheet volume are configured to carry out a plurality of no joint technologies.

In another embodiment, provide a kind of manufacturing module based on the sheet volume that is used to make device, comprising: spool is configured to the conveying sheet volume; Spool is used for carrying out manufacturing process with respect to the aspect of device on the sheet volume to the roll operation device; And interactive device, be used to make sheet volume and at least one sheet material processing module to interact.

In another embodiment, provide a kind of sheet material processing module that is used to make device, comprising: the sheet material operating means is used for carrying out manufacturing process with respect to the aspect of device on sheet material; And interactive device, be used to make sheet material and at least one spool to interact to the spool processing module.

In another embodiment of the present invention, according to technology of the present invention or the product that utilizes apparatus of the present invention to make.

In another embodiment, provide a kind of technology that is used to make multilayer device, wherein, other technology of embossing and at least one combines with replicated architecture.At least one other technology comprises employing otch, groove, Laser Processing or any other suitable technology.

The invention still further relates to a kind of like this manufacturing process of multilayer device, it comprises the optical alignment of assembly.Optical alignment for example comprises employing diffraction optical device or conoscope image (for example mole figure).

In another embodiment of the present invention, a kind of technology that is used to make multilayer device is provided, comprise and incorporate at least one conducting element into device that wherein, conducting element utilizes mold pressing to incorporate into.In another embodiment, a kind of technology that is used to make multilayer device comprises and incorporates at least one conducting element into device that wherein, multilayer circuit is formed on the multilayer that is engaged to electrically non-conductive material together.In another embodiment again, a kind of technology that is used for forming cross tie part and/or passage between the conducting element on the device is provided, comprise a part via non-conductive layer mold pressing conductive material.

In another embodiment, a kind of technology that is used for forming cross tie part and/or passage between the conducting element on the device is provided, comprise the technology that forms cross tie part and/or passage, be included in and form first conductive layer on the substrate, one or more electrically non-conductive materials are added on first conductive layer, optionally remove electrically non-conductive material and form second conductive layer on the electrically non-conductive material that covers the electrically non-conductive material zone that is removed by selectivity at least in part.

The present invention also comprises a kind of technology that is used to make smart card, comprises that keeper electrode is to cover the smart card carrier module at least in part.

In another embodiment, the present invention relates to a kind of technology that is used to make microfluidic device, comprise that the identity according to the assembly of device guides this assembly.This embodiment also comprises the step to the assembly extracode, and wherein, this code provides the identity of assembly, and directing assembly comprises according to the identity of assembly and to add assembly for other assembly and/or remove assembly from other assembly.

In another embodiment of the present invention, a kind of multilayer device is provided, comprise that at least one stress relief structure is to reduce the stress of substrate.This structure can eliminate stress in any appropriate manner, and for example, it can eliminate stress or the interior stress of device in a plurality of adjacent devices.In one embodiment, device is a microfluidic device.

In whole specification (comprising appended any claim), unless context needs, step or the group that comprises in described integral body or integral body or the Overall Steps be will be understood that to mean otherwise word " comprises ", but step or group in any other integral body or integral body or the Overall Steps do not got rid of.

Description of drawings

With reference to description of drawings various embodiment of the present invention, in the accompanying drawings, same reference numerals is represented same characteristic features, and wherein:

Figure 1A represents the general module production unit;

Figure 1B represents to be set up in order to form 3 * 3 production units of common production unit;

Fig. 2 represents to have two common production units of 2 * 3 production units of mutual polyphone;

Fig. 3 represents to be used for the example of the sheet volume production system (web production system) that blister-pack is shaped;

Fig. 4 A represents to have the common production unit of 11 production units;

Fig. 4 B represents three in these production units, and they have different modular units and are located in the single production line that is used for the manufacturing of composite multi-layer device;

Fig. 5 represents unidirectional card production line;

Fig. 6 represents to have the sheet material and the spool production line (sheet andreel production line) of multichannel module and a plurality of production arms;

Fig. 7 represents sheet material and the two-way production line of spool (sheet and reel bi-direction productionline);

Fig. 8 A represents to have the sheet material and the two-way production line of spool of off-line Transport Desk and buffering memory block;

Fig. 8 B represents the sheet material and the spool production line of production module, and this production module is connected to handle independent Transport Desk;

Fig. 9 A represents each layer of stratiform microfluidic device;

The top view and the side view of the binder course of microfluidic device shown in Fig. 9 B presentation graphs 9A;

Figure 10 A-10C represents the example through folding lamination device, and wherein, Figure 10 A represents to have the side view of the lamination device of fold domain, and Figure 10 B represents the folding of this device, and Figure 10 C represents the side view through folding device;

The parts that Figure 11 A-11C represents in batches or serial is made, these parts independent or be installed on the pallet;

Figure 12 A and 12B represent being connected of articles injection-moulded and card device;

Figure 13 A represents to have the top view of the microfluidic device of waveguide assemblies;

Figure 13 B represents the waveguide assemblies of making is separately incorporated in the microfluidic device;

Figure 14 represents the embossing of square rim member;

Figure 15 represents to utilize the material block of removing before the embossing to extrude big member;

A kind of like this member of Figure 16 A representative is handled, and wherein, this member is less than the thickness of embossed layers;

Figure 16 B represents that embossed configuration is pushed into the example in the space below the embossed layers;

Figure 17 represents laser and the embossed technology through combination;

Figure 18 A-18C is illustrated in the two-layer separated minisize fluid structure of assembling that goes up;

Figure 19 represents to be used to have two technology that lift away from of sacrificing the individual layer of bed course;

Figure 20 A-20D represents to have the use of the two-sided machining of local pattern;

Figure 21 represents the formation of the path in the multi-ply construction;

Figure 22 represents because the formation that the inside that the diffusion between the laminate layers causes connects;

Figure 23 represents hot paper tinsel impression structure;

Figure 24 A and 24B are illustrated on the device with smart card electrode and form conductive trace layer, wherein, and electronic shell before and after cutaway view is represented to engage and card assembly;

Figure 25 A and 25B represent mutatis mutandis diffraction is formed the top view and the side view of structure respectively;

Figure 26 be illustrated in obtain on the several layers to mutatis mutandis diffraction pattern;

Figure 27 represents the Mohr diagram that formed by parallel lines;

Figure 28 represents the Mohr diagram that formed by circular pattern;

Figure 29 represents the not firm joint that formed by the single stage splice program;

Figure 30 is illustrated in the same member of the Figure 29 that forms in the rapid splice program of multistep;

Figure 31 represents not have the loss of supporting otch in the machining layer;

Figure 32 A and 32B represent the use of supporting material in the machining processes;

Figure 33 represents the interior floating prominent structure of the face between the same suprabasil stratiform device;

Figure 34 represents the floating prominent structure of the face between the same suprabasil stratiform device outward;

Figure 35 represents to be used to engage the mechanical interlocked method of multilayer material;

Figure 36 represents to be used to form the filling of the passage of waveguide;

Figure 37 represents the simple control loop structure relevant with processing module;

Figure 38 represents that the inside and outside feedback of processing module constructs with control loop;

Figure 39 represents that the feedback relevant with single and a plurality of processing modules construct with control loop;

Figure 40 A-40D represents to utilize the cutaway view of the multilayer circuit that method for stamping makes; And

Figure 41 A-41C represents to utilize method for stamping to make the example of the production line of circuit.

The specific embodiment

Here with respect to the present invention being described with the relevant disclosed embodiment of microfluidic device.Yet the present invention can be applicable to circumstances and product widely, and will be appreciated that other structure and layout also are considered within the scope of the invention.Various distortion, change, variation and/or interpolation to structure described here and layout also are considered to drop in boundary of the present invention and the scope.

Can make any thickness and have accurate 3 dimension surface and the plane of internal feature and the flexible manufacturing strategies of nonplanar device by spool is combined into to spool process technology and sheets processing system, manufacture method of the present invention has overcome the restriction to spool manufacturing stratified material and device of above-mentioned batch, serial and spool.Other novel process for preparing is combined with further enhancing practicality of the present invention.

Advantage of this combination manufacturing process comprises can make thickness range multilayer device (quite thick from being thinned to) and flexibility multilayer device (from unusual softness to firm) quite widely quite widely, all on a production line, adopt and make to the assembly of spool with based on the assembly in other source based on spool, thus can store bigger quantity, to external devices and environment provide more abundant and easier configuration interface, comprise than the situation more function that adopts prior art.

According to one embodiment of present invention, carry out the middle process as independent process, and the output that stores for the latter is transfused to can be with other technology of a kind of speed execution, this speed is different from the speed of middle process.In the spool system, carry out various middle process at a continuous high speed reel, and on one or more volumes, carry out ownership manufacturing operation with a kind of speed.This embodiment avoids all technologies must be with the situation of the speed operation of operation the most slowly.Therefore, this embodiment of the present invention allows the operation of fast assembly to carry out with their optimum speed, need the reconstruct device to carry out the situation of other operation thereby exempt, the remainder (the perhaps operation of slow assembly at least) of technology can its slowest service speed operation simultaneously.Thus, total output increases and the manufacturing cost reduction.

In another embodiment of the present invention, the stratified pieces volume structure of manufacturing can be cut, play up (render) or be separated into sheet material (sheets) to adapt to a kind of like this technology, and the feature of this technology itself needs batch process or makes the too firm product of technology based on the sheet volume.This embodiment can improve the complexity of product and not sacrifice and adopt high speed reel to arrive the ability of reel process substantially.This spool can any stage in manufacture process be carried out according to production line structure and product lot quantity to " exchange (swap) " between spool and the batch process.This production strategy further reduces the cost of small-scale production process by the semi-finished product that allow to be manufactured on the final stage completion, can make to adopt spool to spool and utilize the production process of the common component that special-purpose batch process finishes more effective then.Specific special process can according to various demands for example the demand of batch process (as above) or small-scale production process independently finish common component.According to an embodiment, the deposition of unstable reagent is delayed with the life-span that prolongs product itself and the demand of rigid product.

Similarly, in another embodiment of the present invention, articles of sheet material be introduced into spool to reel process to utilize complexity possible in some batch process substantially, keep simultaneously based on the spool of sheet volume overall efficiency to reel process.

With reference to Figure 1A, module manufacturing cell 1 carries out to have material input 2, control input 3 and exports one or more manufacturing process of 4.The example of processing module comprises can insert new material or the more sheet material or the spool conveying device of conversion materials direction, perhaps can be used for material oppositely, the work station of structure, joint, printing, deposition, cleaning, surface treatment, drying, inspection or other manufacturing process.Represented a kind of reconstruct production unit that contains 3 * 3 module production units among Figure 1B.In this example, the roller spare with selectivity analyses of drying machine with unwinding unit 5 is located between each production unit 6.Three exportable independent supply lines 7 of giving other production unit or unit have been represented in this unit.Optionally, these supply lines can combination or separation before unit output.Be provided for the selective area 8 of laminar flow hood, chip cover, sheet material or the change of spool level.

Fig. 2 represents a kind of example that may construct that is used to contain two production units of 3 * 2 production units.In this example, sheet material or spool delivery unit 9 process rotors 10 are to the modular unit 11 that is used to construct, print or deposit, then through being used to clean, surface treatment, drying and/or the unit 12 that detects, be engaged on another layer 13 of handling on the similar module line engaging (bonding station) 14 places, station afterwards.The output that engages station 14 can be sent into the input of another processing module so that further processing.Optionally, the output 17 of first 2 * 3 production unit 15 can be separately through next production unit 16 and without formerly engaging.Chip cover or laminar flow hood 18 can be located between each processing line.

Arbitrary module all has they oneself independently controller and driver and under the control of system or another module.This comprises the feedback control system from difference in the production line.For further specifying this point, Fig. 3 represent a kind of comprise be used to form, the spool of filling and sealing film packing is to the embodiment of spool sheet material and spool production line.In this example, shown in the module production unit be scattered with material conveying device 29 and comprise: shaping materials in storage input 19, film form 20, fill 21, engage 22, printing 23, sclerosis 24, tension force control 25, material guiding and debatching 26, embossing and perforation 27, cross cutting 28 and final parts collect 30.Production module with control system for example printing element 23 guarantees that their inter-process is optimised, and the internal module feedback system is used to provide the best connectivity of disparate modules to satisfy the needs of production line.This a example is tension force control 25 and from internal module feedback and control between the demand of its input of hardening unit 24 and splice module 22.

Further specify modularization of the present invention, mixing and matching process with reference to Fig. 4 A and 4B.Operation is divided into independently production unit, allows a kind of reconfigurable production line.Construct this system by the interconnectivity between the change production unit or by the production unit that changes in each production unit.In this example, the single public production unit 31 shown in Fig. 4 A comprises seven production units 32, and each production unit is configured to one or more production technologies.This elasticity processing station can be made a plurality of products in a production line.Although the invention is not restricted to the production unit of any specific dimensions and/or quantity or be not limited to adopt the production unit or the device of same type, but the embodiment shown in Fig. 4 B has represented to adopt three production units (33 of the same race, 34,35) and the different production line of production unit.These modularization production units can be represented one or more production technologies, such as but not limited to: sheet material or spool load 36, spool loads and procedure construction 37, material carry 38, lamination 39, microstructure 40, assembly and cement deposition and harden 42, cross cutting 41, reverse 43, fill 44, printing 45 and detection and parts collect 46 stations.The modularization production unit can require and exchange when needed according to the overall product manufacturing.

Compare with the modular system based on sheet volume, the present invention is by allowing to handle sheet material and spool raw material on the same line, can also make thicker and complex devices more.In Fig. 4 B, input unit 36 can receive sheet material or spool raw material both, and main leaf volume production line 47 can utilize continuous and discrete production material to operate.Manufacturing based on the multi-layer laminate of serialgram volume needs continuous flexible material by around roll gap and the roller guiding element usually.The present invention allows to make firm, thicker and complex devices more by combination on same production line based on the assembly treatment technology of sheet volume and discontinuous assembly treatment technology, thereby overcomes this restriction.

With reference to Fig. 5,6 and 7, sheet material and reel assembly are used for making the multilayer card base device on tinuous production.Typical automated card manufacturing and hommization system adopt in batches or the serial production strategy, and are limited to the reference format card operation system.The card operation system that Fig. 5 represents to have the personalized technology of typical card of I/O accumulator (48,49) and only receives ID-1 (ISO7816) format material 50.The technology of operation comprises on card in turn: the covering stack 52 of printing or laser engraving 51, preformed lamination 56, embossing 53, chromatography 54 and final programming or encode 55.These adopt the preform lamination to have standard size as the system of card usually, and do not need customization.The present invention allows to adopt processing station (being different from only printing) to make special lamination or other dissimilar arm from processing line gathers to assembly together.

For example, Fig. 6 represents to have the blocking fabrication technique of a plurality of production arms, and has spool (57,58) or sheet material 59 input units more than one, this spool or sheet material process at a plurality of production modules 60 places and by poly-to together to be for further processing.In this embodiment, discontinuous card assembly and the stack of treated input raw material (57,58) before stack.In addition, this example can be made the multilayer device of a plurality of complexity,, by the repeatedly stack of 61 execution at the multichannel station, adds multilayer can for parts here.Although this multichannel superpositing unit provides certain flexibility ratio, every layer shape is subjected to the restriction of the processing station order on the every line.By the Design of Production Line that can cushion or insert and remove assembly between processing station is provided, can overcome this restriction.

Fig. 7 provides a kind of workpiece that allows to move around to the two-way production line 62 of any processing station 63.In this example, bidirectional lines 62 has the I/O accumulator 64 that is positioned at its arbitrary end place, and has two production arms that connect bidirectional lines and spool raw material (65,66).This two-way processing line method provides sufficient flexibility, but has limited output, because the once only processing or by parts of each processing station.Therefore, the processing station that is in the work stops another parts to pass through.

Fig. 8 A overcomes this restriction by one or more completely reversibilities or two-way line are provided, and this line has one or more transport platform 68, and this transport platform is independent of processing line 67 and can moves into and shift out parts so that the line maximizing efficiency in each in stage along this line.Independently bidirectional lines 68 allows parts by the processing station in using.In the example of Fig. 8 A, production line is similar to Fig. 7 and comprises that two-way processing line 67, two are from spool raw material (69,70) the production arm of feed, processing station 71 and I/O accumulator (72,73) add one or more independently bidirectional lines and have the transport platform 68 of buffered station 74.

The example of Fig. 8 B is similar to Fig. 8 A, but does not depend on the two-way processing line of processing module.Replace, only be connected along the processing station 71 of processing line, and buffered station 74 is also as the I/O accumulator with one or more independently two-way transport platform 68.In all these structures, the use of buffered station has further improved the efficient between each processing station.Yet off-line buffering is especially effective for the efficient that improves the whole production line shown in Fig. 8 A and the 8B, wherein, can automatically perform at suitable processing station arbitrarily and half-finishedly removes, inserts and store.

According to other embodiment, the inventive method allows a kind of firm production line flexibly, and this production line provides more completely detection method and by helping test to improve the quality in system and each modularization level place.Inter process test system is not subjected to the restriction of the time of staying between the stage, thereby no longer becomes according to processing factors of the present invention.In addition, the manual procuratorial work to key component becomes possibility.At certain phase technological problems is detected and revises, for most of parts, raw-material loss minimizes.

Another advantage that the present invention compares with legacy system is separating of each module and independent of allowing design technology to concentrate on the functional and efficient of individual module and do not damage these character for connectivity and improve designing quality.For these identical reasons, research and development and executory cost reduce, the payment of new module the and therefore payment and the execution of new production line are all quickened.

The fault of the single part that another advantage again of the present invention is a production process is less to the impact of whole production.If one section of production process or a part break down in based on the traditional mode of production process of sheet volume, then will to stop be that whole production stops to whole process of production.According in the production process of the present invention, not manufactured a product by all stages of fault effects, and the product of manufacturing is temporarily stored in position and reenter production process with wait with continuing.Another advantage of this feature of the present invention is that waste materials reduces.In spool or continuous process system, the stopping production that is caused by fault makes that the whole or most of materials on the whole production line all are compromised and waste when breaking down at current spool.And situation of the present invention obviously is not like this.

Another advantage of the present invention is arbitrarily and in cold blood to freeze and stored prod in the specific time end stage, in the inferior end stage, semi-finished product await orders until needs finished product (for example, being replenishment of inventory), partly become subassembly to be inserted production process and for example additional perishable or sell the reagent or the assembly of appointment before final processing and packing again.This feature allows with minimum time, minimum cost and minimum additional mass guarantees and quality control process is made the stratiform device of consumer or purposes appointment in time.

Another advantage of the present invention is not need the stage of final processing can be re-constructed the inferior last product that is used for the stratiform device of other design with manufacturing, perhaps be formed on other production line in the same device and repeat production process the most slowly, thereby make the use maximization of immobilising device and enhance productivity.

Therefore, compare, for the device of making the various product of little output, utilize this modular method can realize higher total output with the output that legacy system can be realized.

The stratiform device designer is utilized these elasticity production features further to improve design now and is improved product flexibility, is accompanied by with it, has previous irrealizable advantage aspect cost and the market.

Another advantage of the present invention is can be easier and more promptly carry out and safeguard and fault is got rid of, and, allows to make and the storage semi-finished product to the minimum interference of producing and can stop moment so that safeguard because can easily change module.

Fig. 9 A and 9B represent an embodiment of stratiform microfluidic device.Fig. 9 A represents each layer (75,76,77,78,79,80,81,82) of this device, and Fig. 9 B represents top view Figure 83 and side-looking Figure 84 of synthesizing.These layers can be made by the sheet material or the spool of continuous material, are converted to sheet material by machining then, perhaps upward are converted to continuous material by joining other layer to.

Figure 10 represents to have the multilayer device of two multilayer modules (85,86) that utilize thin flexible substrate connection, and this thin flexible substrate can be folding so that two multilayer modules are joined to together along flexible region 87.Optionally, this device can be multilayer or the multicompartment device with at least one flexible folding zone.Make and thisly have the device of flexible region or the advantage of assembly comprises:

-connectivity of electronics, optics and similar assembly is improved, because not too need loss and troublesome cross tie part or through hole.

Cooperation between the-assembly or between the production process strengthens, and wherein, those production processes are tasked more than one deck by branch usually.For example, assembly can utilize single datum mark and/or instrument to be deposited on one deck in a processing, and this layer is folded to relocate this assembly on device then.

-utilize the processing on the same production process matching layer.A simple example is the manufacturing in interlayer hole.If division on plurality of single layer, then every processing needs each layer of alignment.If utilize method for folding, then can adopt individual tool, with reference to each other hole and identical processing parameter is provided.

-by on individual layer, handling and folding then, compare with on two or more individual course, handling, can reduce production process.

-because the number of plies reduces simple to operateization.

In another embodiment of the present invention, the structure film is laminated on other assembly, and other assembly can be or not be continuous substrate sheet, can be or is not the plane, and can be made by single or multiple parts.This assembly comprises separately or is installed in parts, the single or multiple lift parts that batch on the pallet or serial are made, shown in Figure 11 A-C.

The microfluidic components 88 of Figure 11 A comprises electrode 89 and microfluid component 90, and is represented as the part of big sheet material or sheet volume 91 in Figure 11 B, and this sheet material or sheet volume 91 comprise a plurality of parts that have mating holes 92 and sacrifice brace 93.Figure 11 C represents to be installed in carrier tray 93A upward so that through four microfluidic components 88 between the processing station.

According to the present invention, material layer can be connected with other assembly via the whole bag of tricks.The preform layer that is cut into certain size can join (single sheet joins on the discontinuous assembly) on other discontinuous assembly separately to.The preform layer can pass to discontinuous assembly on the carrier layer that has more than a preform layer, and can be continuous (single sheet on the carrier joins on the discontinuous assembly).These layers can be used as the pantostrat with preform point of tension and pass to discontinuous parts, the preform point of tension is for example bored a hole or the partial cut material, and these layers certain point before or after joining discontinuous parts to utilizes applied force to separate (preformed self-separation thin slice joins on the discontinuous assembly).These layers pass to discontinuous parts as pantostrat, and before the zygophase or during completely or partially cut and wear and utilize applied force to separate (form and also engage the self-separation thin slice to discontinuous assembly).These layers can be used as pantostrat and pass to discontinuous parts, and before the zygophase or during separate (form and also engage the self-separation thin slice to discontinuous assembly) with pantostrat.These layers can be used as pantostrat and pass to discontinuous parts, and certain point after on joining discontinuous parts to is cut (repairing this pantostrat after joining on the discontinuous parts).

Figure 12 A and 12B represent a kind of like this embodiment, and wherein, sheet material can be to join the assembly that independent batch on film or other sheet material or serial are made to.In this embodiment, thicker moulding 94 joins on the microfluidic card 95, and interface and reagent storage area are provided.Figure 12 A and 12B represent respectively to assemble before and two parts afterwards.The interpolation of serial or batch manufacture component is included in attachment between the layered film that is used in the integrated ripple layer portion of optical module.This a example is illustrated among Figure 13 A and the 13B, and wherein, the assembling of microfluidic device shown in Figure 13 A is indicated among Figure 13 B, and this microfluidic device comprises the preformed wave guide member 96 that is inserted in the substrate 97 that contains microfluid structure 98.Preformed wave guide member 96 is placed into microfluid and constructs locating structure 99 in the substrate 97 on 98 next doors.Then, adopt sealant 100 air lockings, give microfluid structure on the end face 102 only provide access 101 and waveguide via 103 input and output of side mouth.

The material that uses according to the present invention comprises nonmetal or metallic film or the sheet material as the part of techonosphere, heat-conducting layer, electromagnetic shielding component or integrated package.Techonosphere is important for the passage of avoiding engaging process to cause sink, and it is the subject matter of utilizing the big microfluid structure of diaphragm seal that passage sink, thereby allows to utilize this 3 dimension stratification strategy to make the passage of broad.

Heat-conducting layer provides the improvement thermal control to device, and this is important for optimizing reaction condition.Electromagnetism (EM) shielding prevents that sensor and actuator on the disposable device are subjected to electromagnetic interference (EMI), and reduces the EM field of dispersing or being used to strengthen use for some actuator (handling as magnetic and paramagnetic particle) of chip component in some cases.

Other material also can be incorporated in the product, and this material requires to include but not limited to paper, nitrocellulose, glass according to purposes and based on the product of fiber.

In the formerly described micro-fabrication technique, the method for cross cutting, laser treatment, embossing, hot forming and print-head deposition all is to be easy to be integrated into spool to the intrasystem technology of spool.For according to technology of the present invention, other manufacturing technology for example injection moulding and little mill also can be incorporated in the manufacture process.

But macroscopic Shooting Technique be suitable for adopting heating (variotherm) handle or adopt the non-thermal energy polymerization for example UV reaction moulding make micro-component.The difficult point of micro-injection moulding is needed high pressure and low viscosity in the microscopic structure of polymer injection die cavity.The size of microscopic structure reduces, and manufacturing cycle and difficulty will increase.Because from the difficult point of mould spray assembly, it is infeasible that complete 3 dimension microfluid structures only utilize this technology.Replace, common a plurality of structures are aligned and join to together to realize imbedding passage.

According to grinding similar mode with traditional computer numerical control (CNC), little mill adopts the milling tool that is subjected to computer drives to decide the route of member.Compare with standard C NC grinding, little mill is with higher allowable deviation work and adopt less drill bit (being lower than 100 μ m).This is the 2-2.5D technology normally, imbeds passage because can not make under not the situation of other components bonding to the passage.

Cross cutting is the technology that cuts out member fully via basalis.This technology relates to the instrument with regulation edge, towards another surface or edges matched this regulation edge is pressed into and penetrates substrate.Usually, the member that utilizes these methods to obtain is bigger than minisize fluid standard, and general using is revolved cutter and limited member greater than micron, and template realizes being lower than the size of 100 μ m.

So far in the most of work aspect the laser capture microdissection machining all by means of ultraviolet laser and mainly utilize excimer laser to carry out, excimer laser can generate and be lower than one micron meticulous anisotropic etching member.Unfortunately this system expensive and slower.Recently, focused on according to material thickness and adopted the shorter wavelength UV laser instrument that can machining be lower than 100 μ m passages.Unfortunately these systems provide bigger heat affected zone, and this has limited the geometry of minisize fluid.In a comparable manner, near infrared ray CO ₂Laser instrument has been proved the manufacturing (order of magnitude of hundreds of micron) of the microfluidic channels that only is used for big member.The intrasystem challenge that these technology are incorporated into based on the sheet volume relates to the form that laser instrument is finished required time of its mechanical processing process and resultant cutting product.

Embossing is a kind of technology of duplicating member with formation in this polymer in the polymeric material that mould is pressed into.What generated duplicates the negative-appearing image that member is a mould.Embossing can be duplicated the member of sub-micrometer range.Yet for bigger member, this becomes more difficult, because the material require that is moved during embossing flows to other zone in the bulk materials.Material is loose behind the embossed technology causes duplicating the deformation of member with problem stress.For being directed usually and itself being for the thin polymer film of thin and firmer substrate, this problem is exaggerated.

Heat pressing process is similar to the standard embossed technology, fallen operating temperature usually near the material glass attitude transform glass and embossing pressure low beyond.The same with the embossing technology, the quality of duplicating member depends on the several parameters that comprises coining, temperature, time and materials characteristic.

This embossing technology adopts flat clamp and long residence time to realize the micro parts of high aspect ratio usually, and the high yield spool that generally is not useable for using for this class A of geometric unitA is to the spool system.United States Patent (USP) 6375871 and 6375776 is incorporated miniature embossing into spool to the spool manufacturing system by before giving the melted material embossing molten resin being expressed on the film, thereby overcomes this restriction.BP GB9623185.7 discloses a kind of employing method of extruding and the UV hardening epoxy resin of embossing in a similar way before sclerosis.The problem of this system comprises and limited material applicatory, and thereby limited the volume and the surface characteristic of obtainable microfluidic device.

Thermoforming be a kind of by the heating film to the softening point of plastics, utilize vacuum pressure or air pressure to give the film application of force then so that it constructs the method for thermoplastic film with respect to die forming.This technology is because be difficult to realize the wedge angle radius, so be suitable for most than 200 microns big members usually.Confirming that this technology is used for only having done considerably less work aspect the minisize fluid.

Print-head deposition is a kind of for example syringe, binder spray or Inkjet Cartridge method of coming deposition materials of scanning and printing head of utilizing.These methods comprise some obtainable rapid forming techniques, for example, and optical three-dimensional molded object (SLA) and selective laser sintering (SLS).Minisize fluid is used, and these rapid forming techniques have excessive allowable deviation usually, yet, researching and developing the new repacking that can form the minisize fluid member.Utilize laser printing to make the deposition of having described the cement that is used to form conduit wall in the United States Patent (USP) 6509085 and 6074725 of Lago etc. of microfluidic channels.There is restriction in these systems to the chemical compatibility and their the permeability aspect of deposition materials.

In production strategy flexibly, made up spool according to technology of the present invention and comprised the assembly that is used for the micro parts that fluid, electronics and optics controls with manufacturing to spool treatment technology and sheets processing system.Gou Zao device can generate by a structure thin layer is pressed onto together and/or thin layer is pressed onto on the sheet material like this.Sheet material be can utilize other technology for example heat embossing and injection moulding come the firm non-flexible member of machining, and can be set to single component or form a plurality of assemblies of pallet.

Film can constitute in interior processing by including but not limited to embossing, laser treatment, cross cutting or thermoforming.Every kind of design rule that is used for optimum configuration that all has them and oneself be correlated with in these technology.These design rules include but not limited to limit for example for example speed, temperature, pressure, tension force etc. of wedge angle, processing sequence and many other operating parameters in the fluid passage of sharp edge.In these technologies any all also do not combine to reel process with the spool that is used for making in a large number complicated microfluidic device.

For manufacturing low-cost, high yield, consider that below item can be used for confirming according to material type, size and machined parameters the applicability of constructing technology:

The ■ rolling cut is only applicable to very large member＞1000 μ m.

The match cross cutting of mould of ■ can utilize upgrade kit to be used for big member＞＞200 μ m.

The ■ excimer laser is handled slower, only be suitable for member＞1 μ m very fine, rapid excision, and the overall area scope is little.

The IR laser technique of writing direct of ■ cheapness only is suitable for big member and melt region is allowed＞＞200 μ m.

The embossing of ■ film is suitable for duplicating＜10 μ m of meticulous member most usually according to the volume that is transferred material.

In these technology, the manufacturing selection mode that embossing representative is the most cheap, but strict at a high speed the restriction is used for film or even the size of bulk material.According to a kind of embodiment of the present invention, this technology in conjunction with embossing and other technology with the performance of raising embossing and overcome some restrictions of other building method.Compare the geometry that this allows the member to all sizes to carry out embossing and improve passage with conventional art.

The stratification technology that is used to form 3 dimension microfluidic devices is usually directed to make packing ring shape film stratification and generates the channel component with square rim or burr.Constructing these edges again by embossing allows other geometry to improve liquid stream and device function.

Figure 14 represents that the square shaped edge gateway carries out embossing has circular cross-section with generation channel geometries.In this example, the layer with square rim path 10 5 joins on another firmer under embossing temperature layer 106, and makes the knurling tool 107 with circular edge press to channel component.When instrument 109 cooperates with techonosphere 108, be formed on around the tool component than soft material.When instrument 104 separated, techonosphere 110 showed as the embossed configuration duplicate of instrument.

In a comparable manner, less by the material that removes the lot of materials in the structure realm and in embossing process, need to guarantee to move, can form big patterned member.This permission is carried out embossing to very big member and be need not the long mold pressing time of staying or can not cause bigger material stress.The embodiment of Figure 15 represents the embossing of Mnltilayered structures 111, wherein, utilizes instrument 113 to remove bulk materials in the structure realm 112 by processing before embossing.In embossing process, building material 114 is formed on around the instrument 115, stays the shaping picture of instrument 116 in the building material 117.

Another advantage of the present invention is that the smear metal and the burr that utilize cutting technique such as laser instrument cutting and cross cutting to produce also can be embossed to improve channel performance behind structure.In these situations, the smear metal of machined surface, fragment and burr can be embossed and be reshaped in the overall structure so that the structural plane of cleaning to be provided.

According to another technology of duplicating that is used to improve structure in the film of the present invention be adopt groove layers below the embossed configuration make the material that is transferred shift to the next door and do not enter around discrete material in, as shown in Figure 16 A and 16B.The glass transition temperature that embossed material is lower than material below owing to groove has.One-tenth layer assembly shown in two figure has embossed layers 118, contains the layer 119 of relief structure 121 or groove and the bottom 120 with pore 122.The volume that can calculate groove 121 to be being complementary with the material that is transferred, thereby guarantees well duplicating of mould, and can adopt pore 122 or gas container to reduce the negative pressure of air pressure to groove.The construction process that Figure 16 A representative structure is littler than the thickness of embossed layers is pressed onto instrument 123 on the embossed layers, make tool component 124 via this embossed layers projection half, some materials are moved in the bellings structure 121 from layer 118.Analogous cases are illustrated among Figure 16 B, and wherein, tool component 124 is than the degree of depth height of embossed layers 118, and resulting embossed configuration pushes in the space below this embossed layers.

Compare with the embossed configuration that the device of based thin film can normally be realized, these methods allow to duplicate sizable embossed configuration, especially those incomplete unbodied materials.Compare with normal embossing, this technology also provides short method of a kind of time of staying, because only near the zone of feature need be heated to allow backflow.All need to be heated to allow the mobile heat pressing process of material or to compare with whole material, make the inherent strain of material bigger with the standard embossed technology that more material require is moved.

Can more promptly duplicate the embossing feature than normal embossing and heat embossing according to laser embossed technology of the present invention.By using the embossed regional area of laser pre-treated, change this local material, this makes the reorganization of (a) local material structure, and for some polymer, softening point reduces (especially under the situation of orientation film), (b) preheats the exposure area, (c) material reflow, and (d) in some cases, excise or remove the material of embossed area.Before institute film to be processed zone is impressed, but heat local regions or instrument flow to improve this instrument material on every side.Laser beam can or only want the zone of embossing to expose to whole substrate surface.Also can adopt automated system to utilize the image recognition of computer documents direction or instrument or material to come suitably guiding laser beam in the figure.Figure 17 is illustrated in and utilizes instrument 127 to be pressed into the focussed laser beam 125 that scans before the exposure area 128 on material 126.When contacting with instrument, radiative material 129 is formed on around this instrument, stays structural plane 130 when separating.In a comparable manner, can adopt other material processed chemistry for example described later, corona and UV to handle and change near the material characteristics of embossed area to improve embossed technology.

With expensive and slowly UV quasi-molecule system compare, be to form fine structures, this technology allows the laser instrument that adopts wavelength long.Unlike their quasi-molecule copy, the long system of this wavelength produces more fire damage and has bigger focal spot size usually, and this has seriously limited them to the spatial resolution of microscopic structure and relatively poor cut quality is provided.By in conjunction with laser technology and embossing, compare with laser technology only, can make the microscopic structure of meticulousr and more accurate shaping, and compare with embossing only, the time of staying is shorter and form bigger structure, thereby the rapider and inexpensive method more than PRK technology is provided.Technology according to this feature of the present invention also can arrive the spool system compatible with spool.

According to the big fluid structure on the mould pressing method separate multiple layer of the present invention.The method is carried out the mold process with " printing machine " similar type, promptly utilizes the mold pressing of modularization and interchangeable molding tool.Do not need the stratification process, the separation between each modularization molding tool provides the sealing of formed channel.Figure 18 A represents two-layer through mold pressing to have segment fluid flow structure 133 on two separating layers (131,132).Ground floor is represented by three discontinuous fluid spares that second techonosphere connects are set.Figure 18 B and 18C represent these two-layer (131,132) how alignment and join the individual layer 134 that has continuous fluid structure 135 together with formation on top mutually.

Optionally, if between the hole that utilizes the modularization molding tool to make, form the embossing cross tie part, then can adopt single-layer methods.

In addition, also can adopt into layer method and avoid in the layer structure because not lining up that some geometries of freedom of movement cause is provided, geometrical shapes greater than 90 ° of angles comprises as having in the U.S. Patent Application Publication document 2002/0112961 substantially.

The technology of lifting away from is the ordinary skill that adopts in the film conversion, and it utilizes the laying of being installed to handle (mold pressing, roll-in and laser cutting etc.) film, removes these layings then before engaging.The method guarantees that film kept clean before engaging, and helps to remove smear metal and other related fragment.In laser treatment, this laying helps improve cut quality by convex ridge that removes any shaping and the first surface that removes the Stimulated Light influence with last surface.In these boundary layer place heat conduction is two-dimentional substantially, and along with cutting the material that intensification and laser enter substrate, the heat conduction becomes three-dimensional substantially, and littler heat affected zone is provided.One or more substrates, laying are joined to can be provided further heat conduction and be convenient to remove refuse to improve processing on the bigger surface.

Figure 19 is illustrated in an example that adopts the technology that lifts away from during the laser structure is handled.The substrate 136 that is machined joins on one or more sacrifice layers (137,138), carries out machining, removes this sacrifice layer, stays the structure substrate 139 of cleaning.In addition, this technology can be used for providing the contact mask of substrate to be exposed to other technology of the present invention so that substrate is shaped.

The present invention uses automation and material adopts protective layer, carrier layer or mask layer.For overcoming the restriction of the material processed that removes aforementioned layers, the present invention adopts the double treatment of using split pattern.The different piece that adopts single figure can provide careful control to material cut and discontinuity zone from handle material more than one side.Attached to the quantity of material in each incision tract on every layer, can remove material in the incision tract by control by removing one or more layers.For example, the figure of Figure 20 A provides three incision tract (140,141,142).If utilize this figure that material is carried out machining fully, then all these otch will be not supported.In addition, skin makes the sacrifice layer of otch or discontinuity zone top or removing of useless zone become problem with discontinuous.If pass one deck of multilayer device whole figure is carried out machining, then outer field subsequently removing will not remove whole graphics field.By outer sacrificial layers being provided and utilizing discontinuous figure to carry out machining from the two sides, then can remove selected layer fully, and the interior layer 143 of finishing machining still is provided.As utilizing the cutaway view shown in Figure 20 B visible, two skins (144,145) are only by machining partly, and central stratum 143 is cut fully along the machining figure and worn.

Double treatment can be carried out on independent process station place and the two sides at material, perhaps material can overturn and on the same side through missing the stop.In the one embodiment of the invention shown in Figure 20 C; adopt the material processed roller to handle sheet material and spool material; allow to utilize station 150 before structure, substrate material 146 reversibly to be joined on the end face and two protective layers (147,148) on the bottom surface that is delivered to substrate 146 from spool 149.After the processing of locating in one or more stations (150,151), utilize uncoiler 152 to remove the incision tract (140,141,142) of protective layer (147,148) and accompanying they, stay discontinuous part 153.

In another embodiment of the present invention, material is processed to less discontinuous assembly, and is processed into attached to the continuous material on one or more carrier layer or the part.With reference to Figure 20 D, only remove a protective layer 154 with allow continuously operated material and join New Parent to or carrier layer 158 on, remove second sacrifice layer 155 then.As a result, stay cleaning and handling part 157 that otch is removed, and join on New Parent or the carrier layer 158.

Can combine or use separately other technology to comprise with preceding method to improve cut quality and to remove fragment:

The heating of zero baker

Zero Fast Heating

Zero laser scanning (lower energy or faster scan rate with the cleaning rather than etch substrate)

Zero air sprays

Zero chemical bath

Zero mechanical blades

Conducting channel on the polymer matrix film is made via etching, wire mark or electroplating process usually.

Etching is used in printed circuit board (PCB) (PCB) industry of making flexible circuit.Usually, the polyimides that covers copper is coated with photoresist, forms pattern then, and chemically etches away resulting pattern.The major defect of the method is the material category that has limited adoptable substrate and conductor.

Printing is easy to carry out, have low processing cost aborning and allows to adopt rationally material widely.Printing technology comprises channel fill, contact mask, wire mark, protruding seal, gravure and printing.This processing needs the problem of consideration to comprise the material thickness (＜25 μ m) that is restricted and can not be welded on the resulting electrode.

Electroplate or electroless plating is difficult to carry out aborning, but can control spatial resolution (＞10 μ m) well, can be electroplated almost any thickness and be easy in PCB industry, set up according to exposure time.The method that forms Seed Layer comprises wet chemistry preliminary treatment and plating, laser ablation deposition, horizontal evaporation, PVD (PVD) and chemical vapor deposition (CVD) technology.

The thin polymer film that foundation process using of the present invention is constructed and the layer of sheet material form complicated fluid-operated device.In those embodiments relevant with employing electrode in these devices, need provide to make internal electrode and outer electrode Interworking Technology, this need pass passage of each layer and the cross tie part between the layer.

Cross tie part in the thin polymer film and passage have been researched and developed widely is used for the flexible PCB industry, and wherein, the electroplates in hole and riveted joint are used to provide the connection of passing between each layer and each layer.Referring to for example U.S. Patent Application Publication document 2001/0047880A1.The electroplates in hole can be realized close tolerance, and riveted joint provides firm connection.Yet, compare the spatial discrimination rate variance of riveted joint and be difficult to realize buried channel with plating.These two kinds of technology for the spool of high yield to spool or continuous process system slowly and trouble.

According in the technology of the present invention, use and contain the film of electroplating track and/or passage.Yet the printing process that also can adopt power supply sub-track and passage deposition to use in due course is because their representatives are than cheapness and the higher manufacture method of output.Any proper method that prints electrode all can be used in combination with the present invention.They are generally used for making membrane keyboard and electrode sensor (for example diabetes test-strips).Technology comprises gravure, protruding seal, contact and does not contact wire mark.Other method that is used for electrode forming is that conductive material is deposited in the recessed passage, described in United States Patent (USP) 6103033.In the technology that these sub-tracks of powering are shaped according to technology utilization of the present invention any, and except that electroplating, form passage by the hole of filling in the stratiform substrate.

This example that is used for making the technology of buried channel and electric contact is illustrated in Figure 21, in substrate 160, form hole 159, and this substrate joined on another substrate 162, this substrate 162 has near the electric contact 161 the hole that is positioned at the substrate 163 that is engaged, utilize conductive material 16 then) the filling shrinkage pool, another substrate 165 that has electric contact 166 at last joins on the another side of passage to connect two electric contacts (161,166) via filler opening.Utilize this technology, but the combination of multilayer layer laminate ground, and the interconnection track is connected the opposed end place.The method of filling channel comprises that wire mark and scraper fill, as audio identification device (RFID) and sensor manufacturing proved.Respectively referring to for example U.S. Patent Application Publication document 2005/0072595A1 and United States Patent (USP) 6103033.

What be used for the electrical design of low level signal collection and electrochemical electrode and Sensor Design provides reliable and firm electrical connection on the other hand.In for this reason ordinary electronic system so far, major concern be connector design between each electronic module.In the electronics and sensing system of layering, the intraconnection between the assembly is also extremely important.In the PCB industry, electroplating passage and welding is the method for having established.Still need to research and develop the reliable electrical connection between the polymeric layer for making for the inapplicable layered polymer device of these technology owing to material temperature requirement or machined parameters.In foundation technology of the present invention, the counterdiffusion of metal phase is to be used to one of means that influence by the electricity joint.By adopting compatible soft metal, on opposite layer, join to together, can realize permanent and lasting joint.

This a example is illustrated among Figure 22, wherein, directly goes up or form the figure of soft gold electrode the apparent surface of layer (169,170) on the end face of other conductive material 168, joins to by contacting with physics with electrode overlap joint 171 then.To several days short period, gold forms the joint 172 that continues from two-layer the other side inside that is diffused into through several hrs.In another embodiment, soft gold is deposited to another material for example on the end face of carbon or silver electrode, makes these gold-plated electron orbits to together then.

This interconnecting method allow to engage between the layer of layered electronic package and these devices and integrated circuit, actuator or sensor between engage, for example, smart card is integrated.

According to and conductor between the similar mode of mutual diffusion technique, form the printing process of electrode interconnection part.As an example, printing made these substrates to together to improve the bond strength of electric conductivity and electrode superposed positions before the abundant drying of printing ink based on the electrode of silver-colored carbon printing ink then on relative substrate.

Hot foil stamping process can be used for from the carrier layer divert film for example metal or graphite linings to substrate.This technology relates to via temperature and pressure joins on the substrate sedimentary deposit to, and this also causes coating stripping carrier band.Usually the impression paper tinsel that adopts relates to the deposition of the metal level that is used for decorative coating.These metal levels are manufactured on the carrier band for example on the polyester usually, and wax fusion under imprint temperature is peeled off.Figure 23 represents hot-die 173, and this hot-die 173 will be transferred on the substrate surface from peel ply with the matched patterns this mould on the paper tinsel 174 that moves between two rollers (175,176) be pressed onto the surface of substrate 177.

For the electrode forming of the thicker conductive layer of needs, can adopt embossed layer as the Seed Layer of electroplating.This has simplified the traditional electrical depositing process, PVD (PVD)/chemical vapor deposition (CVD) processing that the traditional electrical depositing process needs mask and is difficult to carry out on tinuous production.

In one embodiment, by being impressed into conductive material on the substrate, electrically non-conductive material being added on the conductive material of impression, making multilayer printed circuit then.In this manner, many conductive material layers can superpose.By the zone that do not have electrically non-conductive material is provided so that conductive region connects or by conductive material being pressed non-conductive layer to contact cross tie part and the passage of making between the conductive layer with following conductive layer.For example, the cutaway view of Figure 40 A-40D is represented the example of the cutaway view of multilayer impression circuit.Figure 40 A represents the cutaway view by the two-tier circuit of two conductive layers (401,403) and two non-conductive layers (402,404) formation, and cross tie part 405 is formed in the zone 406 of non-conductive layer (402,404) and conductive layer (401,403) stack.The opening of electrically non-conductive material can utilize any proper method to make before or after joining on the impression circuit.For example, can adopt laser instrument to utilize laser cutting optionally to remove electrically non-conductive material after engaging, this laser instrument general is etching electrically non-conductive material and stay unaffected conductive material optionally.Figure 40 B represents the identical cross tie part with Figure 40 A.Yet in this embodiment, the conductive layer 403 below the part of conductive material 407, layer 401 or another piece conductive material are pressed into is interior to form firm cross tie part.Figure 40 C represents do not have opening in the non-conductive layer 402.Yet, impress conductive materials 408 so that the electrical interconnection between the conductive layer (401,403) to be provided via non-conductive layer 402.Figure 40 D represents to comprise the cutaway view of the multilayer circuit of three impression cross tie parts (409,410,411), and wherein, a cross tie part 409 passes non-conductive layer (412,413,414).These multilayer interconnection parts can utilize the repeatedly stack impression action of passing all once impression actions of three layers or carrying out on different layers to realize.

The embodiment that comprises the production line of the processing station that is used for the multilayer circuit manufacturing is illustrated in Figure 41 A-41C.Figure 41 A represents that 416, three processing stations of buffered station that directly are connected with three processing stations 415 comprise for example stack station, laser-induced thermal etching station and impression station.In this example, buffered station is used for parts being moved into and moving apart 417 processing stations and moving-member between internal damping module 418.Figure 41 B represents to have the two-way production line of identical processing station, and this processing station aligns in order and has input and output accumulator 419.Figure 41 C is and similar two-way production line shown in Figure 41 B, and has more processing station 420, and this processing station comprises: printing station is used to print solder flux, electroconductive binder and resistive ink; The assembly deposition station is used for the arranging electronic assembly; And cure the station, be used to cure solder flux or electroconductive binder.In comprising the production line of resistive ink deposition, the film that can adopt laser instrument to repair to be deposited is with the specification that reaches deposit film resistance value for example.

In some cases biology and chemical reagent are deposited in the device, be used for being pre-loaded into agreement automation in the box with the DNA sensor manufacturing the same with reagent with protein microarray.The technology that is used for chemical deposition comprises:

● little point sample (microspotting) (contact or not contact print);

● wire mark;

● syringe or injector output;

● it is crosslinked that lithoprinting activates

● flushing is also bonding or be reacted on preactivate point/zone;

● dipping bath;

● dried reagent (Robotic placement of dried reagents) is placed by robot.

Reagent can be transported on the surface before further processing and sealing or structure device for example in well, bag and other container.Under the situation of injector delivery, syringe needle can pass multilayer material so that reagent is injected in the closed chamber.In some cases, after deposition, also need heating or UV to expose with fully or partly drying or modification deposition materials.

The standard surface mounting technique that is used for the IC setting and engages is utilized robot to pick up placement machine, glue/solder flux deposition and cure the station usually single electronic building brick is arranged on PCB.Can not suffer in the certain situation of normal welding procedure at device, adopt UV vulcanized conducting epoxides or other electroconductive binder (for example PSA band).

Above-mentioned all methods all can adopt according to assembly depositing operation of the present invention.Adopting in process can be with continuously but not mode is in batches being made device inner surface deposition or package assembling completely or partially according to material deposition methods of the present invention.Deposition step is integrated into the process automation that allows higher degree in the production line, and helps to reduce as far as possible the cost of resulting devices.Component package for example needs to reduce as far as possible the protection that evaporation and antipollution liquid sample provide higher degree usually to assembly.

Other printing process also is suitable for the chemistry and biology deposition.These methods comprise recessed or protruding seal.

Figure 24 A and 24B represent to engage smart card electrode and other electronic sensor and circuit via stack track, diffusion inside or electroconductive binder.The contact intelligent card electrode module is represented as an example, but is equally applicable to the contactless type smart card module that electrode module does not all expose on a surface at device inside.Represented to join to the example to allow to be electrically connected on the smart card electrode module with other zone of polymer device.In this example, Figure 24 A represents the top view of this card, and Figure 24 B is illustrated in the cutaway view that two electrode layers joint passes electrode module before and afterwards.The electrode 178 of other parts of Connection Card 179 can be electrically connected with electrode module 180 by the electrode that is added to from opposite layer.In this example, the electrical connector 178 that is formed on the lower surface of substrate is engaged on the electrical bonding pads 181 of smart card electronic module.The electrode pad 181 that is engaged can cover the only part of pads from electrode module 180, and shown in Figure 24 A and 24B, perhaps they can be via the electrode that is engaged or the complete coated electrode module of lamination to provide environmental protection.

Usually adopt index hole or mark when spool is handled to spool, film for example is to provide space control accurately to substrate.Adopt alignment mark to aim at exactly and be widely used in accuracy and the repeatability to guarantee assembly and device in many industries more than one deck.

Aligning in the minisize fluid stratiform device has proposed special challenge because of the size little (μ m) of structure.Can adopt two kinds of methods to help to reduce device because the fault rate that misalignment causes and improving the quality.At first, adopt alignment mark to provide check system, secondly, can improve structure so that their their alignings of rely heavily on not by the aligning of determining laminated assembly.

Adopting alignment mark is the common method that is used to aim in Micro Electro Mechanical System.

When possibility,, comprise being provided for reducing as far as possible the feature of difficulty to realize that tolerance requires for the manufacturability deisgn product.This example is illustrated in the United States Patent (USP) 6322683 that is used for solving small misalignment, etch well in than the big substrate of the port that is connected with substrate.Similarly, in U.S. Patent Application Publication document 2004/0018115A1, in the big surveyed area of ratio sensor or along the axis that the maximum alignment error may occur, form passage and well.

An embodiment according to technology of the present invention adopts aforesaid control system to help aim at and provide quality control.Parameter in the control system loop includes but not limited to regulate relevant optical pickocff feedback with the tension force and the speed of film/sheet material, aims to improve.

The relevant any feature in edge that limits with the same with the aligning resolution ratio of seeking to realize at least high resolution ratio can be used as detected characteristics.The sensing system that is used to detect this feature can adopt one or more discrete sensors that are used for single position probing or regional imaging.Can adopt image recognition and/or other detection algorithm formula.For the micro-features of optical measurement, the reasonable high-precision image that this need be in the adequate focusing zone.Comprise interference figure for example the pattern identification of the projected image of mole pattern, diffraction pattern and micro-features all can be used for helping improve the optical pickocff imaging.

According to another embodiment of the present invention, adopt the diffraction pattern that produces by the mark on each layer with slit.Change owing to aim at, slit width changes, therefore the diffraction pattern difference that is produced by the external light source illumination.With reference to Figure 25 A and 25B, each black rectangle is represented the mark on the different layers.Shown in Figure 25 A, density bullet (182,183) and therefore the misalignment of each layer their interval is changed.Variation at interval can come from not only direction, for example, long density bullet 182 and the interval between the little density bullet 183 indicate with little density bullet 188 between the aiming at of interval vertical direction.Figure 25 B represents to utilize the diffraction 187 of the light beam 184 of slit 185 diffraction that produce diffraction pattern 186.Figure 26 represents the diffraction pattern 188 by illumination 190 generations of the alignment mark 189 of Figure 25 A.For simply, only represent along the diffraction pattern of an axis, however also can be in conjunction with adopting other axis to indicate the mutual misalignment of all directions.

In other embodiments of the invention, adopt interference figure to come marker to aim at.The mole pattern can be generated by the overlapping and evenly spaced pattern with angle difference or different cycles.Therefore, by all or part of of repetitive construct is set on each layer, the variation that layer is aimed at can generate the different pattern that is associated with layer misalignment.The interference figure that Figure 27 and 28 expressions are obtained by the even septal line that is located on each layer with different interval frequency or angular alignment.Figure 27 represents the even septal lines in two hurdles (191,192) on the different layers, and the mole pattern is generated by two-layer angle misalignment.Figure 28 represents by the mole pattern 193 that generates with the overlapping circular pattern of the even septal line in a hurdle.

Being bonded on all becomes problem and has developed many technology in many industries, that these technology relate to is mechanical interlocked, engage between electron attachment, boundary layer and boundary, one or more mechanism in absorption, diffusion and the chemical bond.Although these mechanism are known and joint method successfully is used in many industries, engage and still caused a difficult problem.Successful joint depends on many factors, and these factors comprise: the state on grafting material, composition surface, joint method and running parameter thereof and environmental condition.In the minisize fluid field, owing to keep the integrality of microscopic structure when need form excellent sealing around the minitype channel, be bonded into and be a difficult problem.

Joining technique broadly is divided into two kinds: the zone engages, and wherein all surfaces of two substrates all joins to together; And the selectivity joint, wherein lip-deep selective area is engaged to together.Two kinds of technology all can be applicable to minisize fluid and engage.Usually, it is expensive technology that selectivity is bonded in the production practices, but engages sealed space control better, reduces to disturb the risk of microscopic structure.

To further considering to whether needing auxiliary material to form joint of joining technique, if like this, then whether material will and be used compatible with current technology in use.Table 1 is listed several in these joining techniques.

Table 1: joining technique

Method of diffusion is a kind of common batch techniques, and it relates to exerts pressure and temperature substrate surface in together, and reserves for strand and be diffused into time in the other side lentamente from each material.Usually, this needs strand to have enough ambulant similar material.Although can engage many layers simultaneously, need take care to make the space that knitting layer weakens and need long process time.

The surface modification of utilization such as plasma, corona or UV assist in engagement technology relates to change surface chemistry family and improves joint to be coupled via electronics or covalency.Usually, utilize a kind of in these technology that polymer is exposed to and will cause surperficial chalcogen to increase in the aerobic environment, this increases surface energy and promotes that also many substrates engage.Also but other gas on the exposed surface and liquid are to generate other functional surface family.The many reaction paths that generated by these exposure technology relate to unsettled free root material.Therefore, this surface preparation need be carried out before engaging immediately.Similarly process for modifying surface has been used for changing surface nature by the material of softening next-door neighbour's near surface.For example, adopted chemistry, UV and plasma to expose and made the depolymerization of surface, under low interface temperature, engaged thereby reduce material glass attitude conversion temperature and make.

If the employing mask technique also can realize that selectivity engages, and guarantees that exposed region is limited by surface modification.

Adhesive bond is to adopt another material to come two surface engagement are arrived together as attachment.Adhesive can be by sprayer, seal ingot, scraper, roller spare etc. is coated on the whole surface, perhaps lays as sheet material or band, perhaps utilizes printing technology or utilizes adhesive sheet or the band of forming pattern optionally to deposit.Typical adhesive comprises: cyanoacrylate, silicones, epoxy resin and acrylic resin sill.Two misgivings that this class engages are that adhesive is used with the compatibility and the expection of the material that uses.Performance, toxicity and surface interaction also are considerations throughout one's life, especially for area/volume ratio big microfluidic device like this.

Lamination is a kind of popular technique that makes material connect plastic sheeting to coming together, and one of this film has adhesive layer.This adhesive layer can be aforesaid adhesive or polymer with low glass state conversion temperature, this polymer the temperature and pressure current downflow with another surface engagement.These methods extensively are used in the printing packaging industry of spool in the spool system, and successfully are applied to microfluidic device." Microchannel Networks for Electrophoresis Separations (the minitype channel network that is used for electrophoretic separation) " 20 Electrophoresis 727 (1999) referring to for example Schwarz etc.

The solvent assist in engagement utilize solvent swell polymer the surface and increase the chain mobility so that two diffusion into the surfaces to inside each other.The problem of this technology is to be difficult to handle solvent under production environment.For fluid device, the solvent residue provides pollution sources, and for microdevice, solvent makes the microscopic structure distortion.

The welding of transmission laser device comes work for this optical maser wavelength as absorber with another material to the optical maser wavelength of institute's radiation is transparent by a kind of material.This makes laser beam optionally heat between two materials, produces local welding when heating surpasses glass transition temperature.In order to be integrated in the production environment, major limitation is process time, and compatible material and the restriction that can process the number of plies.

Except the laser instrument absorption that utilizes the base plate place generated heat, the reverse conduction welding was worked according to welding similar mode with transmission layer.The thin polymer film that is clipped in the absorbed layer top is from its surperficial heat conduction and partial melting.Because the uniform heat conduction of the polymer inside of restricted quarter resolution ratio, this technology only is suitable for film and bigger structure.

High frequency or dielectric heating are a kind of by making the AC electric current engage the technology of this polar material through polar material.The method can engage the material of degrading usually effectively near its softening point.This is because heat generates equably at material internal, rather than in the surface generation and then to conducted inside.Yet for microscopic structure, this can be because nonspecific heating and initiation problem and cause distortion.

Ultrasonic bonding depends on the vibrational energy via material transfer.At two materials at the interface, vibrational energy is converted into heat.Feature can be used to focused energy, and by careful energy control and the geometry designs around the structural member, can realize good sealing and unlikely all the other material deformations.

Therefore the particular energy absorbing material also can be set near the junction impel partial melting, and when utilizing suitable energy radiation, realize the selectivity joint.Acceptor of energy comprises film metal, Clearweld (trade mark), polyaniline, polypyrrole, poly-alkylthrophene, metallicity milimicron particle, magnetic and paramagnetic particles and other suitable dopant material.The energy comprises electromagnetism, microwave, UV/ is visible and infra-red radiation.In order to seal microscopic structure, render a service the restriction of depending on usually the material deposition technique.

Above-mentioned all technologies all can be used in the continuous manufacturing, and can be applicable in the foundation described here technology of the present invention.

Comprise according to a kind of embodiment of technology of the present invention and to adopt control system to control engaging process.Parameter in the control system loop includes but not limited to that temperature, pressure, time, speed and membrane tension are to realize joint preferably.

Particular design-rule can be used for engaging the stratiform device.These design rules comprise the operating parameter relevant with the specific engagement process, for example temperature profile, the time of staying, tension force, pressure and preliminary treatment requirement.Yet they also comprise the design rule that makes the design of device can improve processing characteristics.Design rule comprises the designing for manufacturing rule, and the acutance of the spacing of the size of minimal characteristic, feature, aspect ratio and feature for example is to improve otch and to avoid material to mix instrument.Design rule also comprises and is used to expect the design rule of device purposes separately.The example of using design rule includes but not limited to the fluid control that is used to control dead volume, mixes diffusivity, surface area contacted geometry and be used for passive or active component.

When adopting crimp technology to come articulamentum columnar structure, the joint sequency of each layer is a consideration in the fluid device.This is because the space that microscopic structure forms causes being close to the structure top and exerting pressure of lower zone reduces.If engaging process depends on pressure, then the formed joint of knitting layer on next door, space is firm unlike the joint that the place of exerting pressure forms.Typical case shown in Figure 29 be illustrated in (194,195,196,197) before the joint and engage after the cutaway view of passage in (198,199,200,201) four-layer device.In this example of a step joint technology, the stack film of passage top is not subjected to other layer supporting and is deformed to the passage area 202 that leaves the space or is close in the weak engaging zones 203 of this passage top.This can be avoided by the layer that engaged this microscopic structure next door before joining in the microscopic structure.As shown in figure 30, adopt two step joint technologies.At first, knitting layer 204 and 205 is knitting layer 206 and 207 also, then four layers is joined to together.

The another consideration item is that the layout of techonosphere is to avoid opening sedimentation and feature misalignment.As shown in figure 31, make the adapter ring 208 of microfluid structure 209 not be subjected to substrate 210 supportings.If structure is fully via stacked Calais machining and formation island material, if then this island is not supported with disengaged configuration.Similarly, if structure is except that straight line, the foundation size of constructing and then with respect to the angle of crossing of straight line situation, the part substrate can have some one-movement-freedom-degrees.This blocks and distortion the expection microscopic structure.Avoid the method for opening and misalignment to comprise design is segmented in (referring to Figure 20 A-D) on the multilayer, described in the construction process of describing as previous U.S. Patent Application Publication document 2002/0112961, be used for angle and sink greater than the film of 90 ° structural geometry substantially.

Another avoids the method for opening sedimentation or misalignment to provide support base.This a example is illustrated among Figure 32 A and 32B that is respectively top view and side view.At first, before microfluid structure 214 was carried out machining 213, the layer 211 that will construct joined on the sacrifice layer 212.Before feature broke away from expendable material 212, substrate temporarily or was for good and all joined on another substrate 215 preventing and is moved.If construction process occurs in before the joint, then structure only partly forms before joint and finishes thereafter.The structure before joint relate to the structure after and remove sacrifice layer 212 before only partly the joint, join to then on another substrate 215.Optionally, if before operation, carry out to engage and construction process only experiences one deck (as previous described in Figure 20 A-D), then according to removing resulting structure with the similar mode of the technology that lifts away from.

In some cases, since the internal stress of the material that adopts, formed device warpage behind joint.The method that overcomes this problem comprises the tension force that utilizes differential thermal roller for example to regulate each layer before engaging, before or after engaging one layer or more is carried out preliminary treatment or the method is provided in engaging process.Provide pretreated method to comprise laser instrument, IR and frame, and relate to hurried each layer of heating before engaging, to give each layer prestress.Optionally, provide different tension force can control the stress that obtains of the structure that forms to different layers.An example that adopts this is to give the tension force, stress or the forces associated that provide opposite in the device to offset the trend that this device curls around roller spare before joint.

Another technology relates to the structure that is provided for helping to remove the substrate stress that is caused on practical devices.Figure 33 and 34 represents these example of structure respectively in plane stress He outside the plane stress.Figure 33 represents the top view of an example of the stress relieving structure 217 between multilayer device 216.Figure 34 represents to comprise the part through the cutaway view of the four-layer device 218 of the stress relieving structure 219 of end face and bottom surface.

Also allow according to technology of the present invention and to utilize mechanical interlocked adhesive-free to engage.This is to adopting metal and fluorinated polymer useful.Structure is formed on around one deck and/or passes this layer formation, and this layer allows another laminar flow to go in this structure to generate mechanical connection two materials to together groove.The visible Figure 35 of this embodiment, wherein, top layer 220 flows into during engaging process in the 3rd layer 222 the space 223 with the mechanical interlocked second layer 221.

Surface modification impels joint method need engage immediately after the surface exposes usually.By being provided, automation and integrated exposure engagement step be particularly suited for these methods according to of the present invention volume system and technology.

Engage for ultrasonic wave, joint around the minisize fluid edge forms lip with the key point place or flange helps focused energy and improve to engage being usually located at.According in the technology of the present invention, can adopt mold pressing, cutting, embossing and/or Laser Processing to form this flange.

Process for modifying surface has been used in many industries to improve the surface nature of material.Especially, polymer generally includes needed whole physicochemical properties, but lacks the needed surface characteristic of application-specific.In printing packaging industry, developed many technology and improved that these are used for engaging, wetting and characteristics showed.Table 2 is listed some in these technology.

Table 2: process for treating surface

Technology	Technology	Type	State of the art	Estimate
					Grind	Machinery	Do or wet abrasive blasting manual or mechanical sand milling	Outmoded	Effort, dirty, only be suitable for low yield, must handle residue
Solvent clean	Physical chemistry	Wiping, dipping, injection or vapour degreasing	Outmoded	Safety, disposal and environmental problem (that is, dispersing)
					Water base cleaning	Physics	Multistage energy flushing	Modern	The environmental system impact is low, capacity is high, cost is lower
Chemistry	Chemistry	Flood, scrub	Outmoded	Problem safe in utilization
					With acid or alkaline etching		Rinsing, injection		Corrosivity, toxic materials and hazardous waste handling problems
Chemistry priming paint	Chemistry	Polyvinylamine, polyurethane, acrylate, chlorinated polymeric, nitre	Ripe	Need specific equipment, and specific final use needs different priming paint

		The solution of chemical fibre dimension or lacca applies
					Flame treatment	Heat chemistry	Can be used for flat film or three-dimensional structure	Ripe	Fire, non-thermo-sensitive material is limited to a certain degree
Corona discharge	Electrochemistry	Can be used for conductive substrate and dielectric substrate	Modern	Be mainly used in film and sheet volume
					Gas plasma	Electrochemistry	Can be used for film or three-dimensional applications, can adopt AC, DC or microwave frequency	Modern	Convenience and saving cost; Avirulence material or handling problems; To not isostructure is all effective in a large number
UV and UV/ ozone	Electrochemistry	The different parts that are used for batch system	Development, the modern times	General only with the batch form and the long time of staying of needs
					The evaporation acrylate applies	Physical chemistry	Current sheet volume and the film of only being used for	Development, the modern times	Still just researching and developing and be used for plant-scale application
Fluoridize	Chemistry	Short burst is exposed to element fluorine can batch or continuous	Development, the modern times	Need particular device to carry and monitor fluorine
					Static discharge control	Electricity	Form with electric charge dispersion or charging neutrality	Modern	Equipment is simple and complicated and expensive according to using

The Wiley Encyclopaedia of Packaging Technology, second edition, Aaron L.Brody and Kenneth S.Marsh edit, ISBN 0-471-083975-5

1997, John Wiley ﹠amp; Sons, Inc

Aspect execution, life-span and performance characteristic, aforementioned every kind of technology all has their shortcoming.For microfluidic device, because the size of structure is little and surface/volume is big, items such as joint and surface interaction are important.For these application, adopt process for modifying surface to come dealing with various requirements.Table 3 is listed some improvement that can realize by microfluidic device is carried out surface modification.

Table 3: surface modification purpose

Integrated and the cleaning of product	Fluid control	The interaction of molecule and biocompatibility
			Make surface modification to engage	Control surface energy of wetting (that is, hydrophily and hydrophobicity)	Prevent that protein/enzyme from sticking on the fluidic structures

Change optical property	Reduce as far as possible because the flow losses that the steam permeability of water causes	Impel protein/enzyme to stick on the fluidic structures
			Increasing the surface that is used for sensor and actuator can be basic with the surface	Reduce as far as possible because the flow losses that water imbibition causes	Prevent because surface characteristics/drop goes out thing and the prevention process
Remove pollutant		Be provided for the surface base of molecule attached

As mentioned above, joint is the problem in many industries, and surface interaction works in the mechanisms such as joint, absorption, diffusion and chemical bond between electron attachment, boundary layer and boundary.The variation of surface molecular base can come to produce directly or indirectly change of refractive by changing the surface, forms surface-coated with the molecule in the absorption environment.Change the surface and can be able to directly apply to many sensors and the actuator that relies on surface charge.Surface modifying method also is used to remove lip-deep absorption or bond material, perhaps changes the surface and can repel other particle for example to avoid pollution.

Fluid control in capillary and other microstructure is subjected to liquid level interaction domination.It is for these passive and active fluid operating assembly control surface energy and be important for hydrophily and the hydrophobicity therefore.In the limited bulk fluid was stored in application in the device, restriction water was important via the loss that absorbs and infiltration causes.This is even more important for the important small size reactant of concentration, and the loss meeting of fluid causes device fault by the concentration that changes reactant.

Be the receptive surface of guaranteeing to expect in using, in some cases, can be to surface modification to improve this compatibility.In other cases, be used to improve the surface modification process that a kind of character for example engages and damage device performance.For biomolecule can be adsorbed to lip-deep biologic applications, often there is this situation.Protein be if absorption can hinder and weaken the function of device from the teeth outwards securely, and the lip-deep barrier layer of needs prevents to suppress molecule and separates out material and enter device.Selectivity needs protein, DNA or other molecule and surface to be connected in conjunction with, electricity absorption or via the covalent bond chemistry.

Can adopt the method that comprises above-mentioned arbitrary method to come according to technology of the present invention to material surface modifying.Concrete, wet chemistry, laser instrument and UV exposure, corona, flame and plasma method all can be integrated into according in the high yield technology of the present invention.In order to form pattern, some in these methods need mask technique to limit exposed region.These masking methods comprise contact or contactless masking process, and according to relating to the technology of lifting away from previous described similar mode.

Waveguide or light pipe manufacturing are important for the response of improving sensor by directs excitation light and/or diverging light and design.Waveguide is by coming work in reflection of material interface place or transmission incident light.In the past, the typical manufacture method of microfluidic device has related to and adopts whole planar materials, optical fiber is directly inserted in the sensing system, perhaps according to utilizing lithography to form pattern from the teeth outwards with the similar mode of the manufacturing of semiconductor devices.

An example of improving the waveguide performance of transparent material is the difference that increases material interface place refractive index.Change these surface propertys at the interface and can cause change of refractive to improve reflection or transmission.Especially, deposit film can provide waveguide surface and the reflecting surface through improvement.This a example is that the silver coating of deposition of thin (nm) is to provide negative index.

For in complex geometric shapes, guiding light, can utilize pre-techonosphere to form passage.Then, fill this passage as required.These structures can be filled by any proper method, for example, and by spraying and curing light transmissive material or put into hollow structure by the light pipe that will be shaped.Figure 36 represents to apply the passage that is filled with liquid by scraper.In this example, the multi layer substrate 224 with preform passage 225 is filled with liquid 227 by means of scraper 226, to produce waveguide 228 in this substrate 224.Incorporate prefabricated light pipe in the layer structure a example in conjunction with Figure 13 A and 13B explanation.

Printing word, mark and decorative layer are with in the mill to provide device function, applicability and mark to show.Printing can be carried out on the outer surface of device, and can generate on the internal layer at product under the situation of stratiform device.The following classification of possible typography:

Zero wire mark forces printing ink to pass through the net or the version of local mask;

Zero method from the surperficial transfer of ink of carrying required design, for example, aniline printing or protruding seal;

Zero thermal transfer method, for example laser printer and thermocolour band printing machine;

The method that zero printing ink shifts from concave surface, for example gravure;

Zero printing ink is from the method for planar transfer, for example lithographic printing;

Zero utilizes point or continuous printing ink to handle the method for deposited picture, for example ink-jet printer.

Certain device information for example director data, traceability, history and function are provided for the ability of one-board memory spare programming on chip.

Coded message comprises:

Zero sequence number;

Zero makes history;

Zero operation instruction;

Zero service data;

Zero function order.

The method of programming on one-board memory spare comprises: electric contact, wireless antenna, magnetic coupling, induction and optics.

In quality control clearance, system is provided in order to guarantee to keep the proper standard of obtained product.In manufacture method, find, analyze, improve, monitoring, carry out and check all can be used for controlling product quality.Because will control to whole process, thus the method for finding or monitoring is provided, and if desired, provide feedback path to come change procedure.This can occur in the last of any step in the technical process or technology.Monitoring in the technical process is by earlier discerning and the elimination problem reduces the wasting of resources potentially.Inspection also provides the method for feedback signal to relate to human observation, machinery, acoustics, electronics, electromagnetism and/or optical system.

Another problem that high yield sheet volume production line and sheet production line face when carrying out is to be used for monitoring and the computer of a plurality of steps of control procedure and the finite capacity of industrial control unit (ICU).This difficult point influences quality control, quality assurance and has limited output.

Therefore, another embodiment of the present invention comprises the distributed monitoring control system that spreads all over whole process.According to this embodiment, each manufacturing step can the oneself control, and monitoring output material and give the output material put on or compile by or do not pass through so that subsequently or the controller of other separation can read this information and also correspondingly handle material.Another advantage of this system is that the semi-finished product of buffer stock can and carry out correct processing according to this recognition result subsequently by machinery identification, and does not need to utilize the degree of treatment and the position of computer permanent storage product.Another advantage is that material can be manually actuated processing, return production line, discerns and correspondingly handle.Thereby this system has avoided specific store line and special-purpose line of transference, because where material enters system is all suitably discerned and sends.This a example is that the half volume base volume in blocks that returns input point after for example safeguarding carries production (partially completed web based reel loadedproduction), and sheet volume product next predetermined process in its arrival technology will be discerned and ignore to completed procedure of processing, thereby also avoid to adapting to any unnecessary variation that semi-finished product carry out production line.Another example is that this material will return production line at any step place, is identified and is sent out according to its next procedure of processing to the manual repairing of discarded plate substrate material.

Another advantage of this embodiment is that material is automatically sent to buffer storage when the production module breaks down, and returns after this module is repaired or changed.This characteristic use preparation is made the loss that preceding following process is avoided false add worker stock is taken place.

Another advantage is to produce only work under supervision and do not control it of computing system, thereby allows the fault tolerance of dynamic flexible and high level, and data are handled bottleneck and do not hindered fault recovery and high yield.

Feedback system is the part according to technology of the present invention.Feedback system can any appropriate format provides and can be in the appropriate location that spreads all over whole process.For example, feedback system can be located in each modular unit, as shown in figure 37.According to this embodiment, feedback system is used for multiple may the application, for example, select material or processing type, control engagement roller temperature and pressure, optical check to fragment and cut quality is provided, guarantees suitable film tension force, regulate material velocity and aligning and guarantee suitable the processing station time of staying and operating parameter.

Also provide feedback between the module to guarantee suitable material transfer rate and material type and transmission of control signals between checkpoint and technology.Figure 38 and 39 expressions are as some basic feedback systems of the feedback between processing module inside, each operation outside and a plurality of operations.

The example of concrete method for sensing comprises:

Zero as at the temperature described in the above joint, pressure, time, speed and film tension force;

Zero as discerning at the figure described in the above aligning;

Zero based on the figure identification of relatively discerning product structure with known image;

Zero utilizes gas or fluid die and fluorescence to observe the globality of passage;

Zero at specified conditions for example temperature, pressure or be exposed under other material face coat and the material that changes color or fluorescence;

Zero adopts neutral net, fuzzy logic and similarly adapts to the control processing method.

Allow to come the continuous monitoring single component according to technology of the present invention for the purpose of tracking of products and control.Component recognition can realize with any proper method, for example: printing process, for example visible and UV indicator mark, literal or bar code; Semiconductor provides memory; Perhaps adopt other technology, for example RFID.

According to being easy to carry out packing method in the technology of the present invention, not only because its flexible, and because some technology that the practical devices manufacturing is adopted are identical with the technology of packing business employing.The Traditional Packing technology is used for any combiner, comprises that device level packing, user class are packed and transportation is single with packing, a plurality of or becomes wound module.In some cases, carry out disinfection, comprise ethylene oxide,1,2-epoxyethane, γ radiation, electron beam and autoclaving.

Although describe the present invention in conjunction with embodiment disclosed herein, but it will be appreciated by those skilled in the art that interpolation, deletion, distortion and the replacement that not to be specified and do not break away from the spirit and scope of the present invention that limit in the appended claims.

The application requires to enjoy the priority of the U. S. application of submitting on January 25th, 2,006 60/761746, and the full content that is incorporated herein this application for your guidance.The application also requires to enjoy the priority of the U. S. application of submitting on June 7th, 2,006 60/811436, and the full content that is incorporated herein this application for your guidance.The application also requires to enjoy the priority of Australia's application 2006903100 of submitting on June 7th, 2006, and the full content that is incorporated herein this application for your guidance.The application also requires to enjoy the priority of Australia's application 2006900345 of submitting on January 24th, 2006, and the full content that is incorporated herein this application for your guidance.

Claims (96)

1. device fabrication comprises:

Carry out at least one manufacturing step and at least one manufacturing step based on sheet material based on the sheet volume, wherein,

(a) at least one or in more than a manufacturing step based on the sheet volume, and

(b) at least one or in more than a manufacturing step based on sheet material,

Carry out a plurality of no joint technologies.

2. technology according to claim 1 wherein, utilizes a plurality of modules to carry out described technology.

3. technology according to claim 2 wherein, also comprises independent each described module of control.

4. technology according to claim 2 wherein, also comprises:

From described a plurality of modules, select module according to production history and manufacturing Devices Characteristics.

5. technology according to claim 2, wherein, described a plurality of modules are interchangeable.

6. technology according to claim 2, wherein, one or more modules are configured to receive material and/or transmit material to another module.

7. technology according to claim 1, wherein, described device comprises into one or more in layer device, smart card, sensor, actuator, in-vitro diagnosis device, stratiform device or the microfluidic device.

8. technology according to claim 2 wherein, also comprises:

Utilize control system to control at least one module.

9. technology according to claim 1 wherein, also comprises:

Make at least some described no joint technologies administered by distribution control system and/or distribution monitoring system.

10. technology according to claim 1 wherein, also comprises:

On the manufacturing line, assemble and/or store described device.

11. technology according to claim 1 wherein, also comprises:

The identity of the assembly of the described device of foundation guides them.

12. technology according to claim 11 wherein, also comprises:

Give described assembly extracode, described code provides the described identity of described assembly.

13. technology according to claim 11, wherein, directing assembly comprises according to the identity of assembly to be added assembly for other assembly and/or removes assembly from other assembly.

14. technology according to claim 2, wherein, at least one module is configured to carry out based on the technology of sheet volume and at least one other module and is configured to carry out technology based on sheet material.

15. technology according to claim 1, wherein, described device comprises:

Multiple material comprises polymer, timber, paper, silicon, pottery and/or metal; And/or

The multiple shape and/or the thickness of described material; And/or

Preform assembly.

16. technology according to claim 2, wherein, described device or its assembly repeatedly pass through at least one module.

17. technology according to claim 2, wherein, described device or its assembly are advanced towards a plurality of directions along the manufacturing line that is formed by described module.

18. technology according to claim 1 wherein, also comprises:

At at least one buffered station buffering buffer stock.

19. technology according to claim 18 wherein, also comprises:

Give technology input buffering stock from described buffered station.

20. technology according to claim 18 wherein, also comprises:

Export buffer stock to described buffered station from technology.

21. technology according to claim 1 wherein, also comprises:

A plurality of production arms are provided.

22. technology according to claim 21, wherein, at least one is produced arm and comprises a plurality of technologies.

23. technology according to claim 1, wherein, described device is a diagnostic device.

24. technology according to claim 23, wherein, described diagnostic device is a microfluidic device.

25. technology according to claim 1, wherein, described device comprises folding device and optionally folding microfluidic device.

26. technology according to claim 1 wherein, also comprises:

The feature of the technology that needs according to each step adopts described at least one technology and described at least one technology based on sheet material based on the sheet volume at different manufacturing steps.

27. technology according to claim 1, wherein, one of described no joint technology is included in that machining goes out figure on the multilayer.

28. technology according to claim 27 also comprises and adopts one or more sacrifice layers to come machining.

29. technology according to claim 28, wherein, described machining is two-sided.

30. technology according to claim 1, wherein, other technology of embossing and at least one combines with replicated architecture.

31. technology according to claim 30, wherein, described at least one other technology comprises the employing otch.

32. technology according to claim 30, wherein, described at least one other technology comprises the employing groove.

33. technology according to claim 30, wherein, described at least one other technology comprises Laser Processing.

34. technology according to claim 1, wherein, one of described no joint technology comprises optical alignment.

35. technology according to claim 34, wherein, described optical alignment comprises the employing diffraction optical device.

36. technology according to claim 34, wherein, described optical alignment comprises the employing conoscope image.

37. technology according to claim 36, wherein, described conoscope image is a mole figure.

38. technology according to claim 1, wherein, one of described no joint technology comprises to be incorporated at least one conducting element in the described device into.

39. according to the described technology of claim 38, wherein, described conducting element conduction heat and/or electric power.

40. according to the described technology of claim 38, wherein, described device comprises smart card, and one of described no joint technology comprises that keeper electrode is to cover the smart card carrier module at least in part.

41. according to the described technology of claim 38, wherein, described conducting element utilizes hot paper tinsel thermoprint to incorporate into.

42. according to the described technology of claim 38, wherein, described conducting element utilizes the phase counterdiffusion to incorporate into.

43. according to the described technology of claim 38, wherein, described conducting element utilization printing is incorporated into.

44. according to the described technology of claim 38, wherein, described conducting element utilizes mold pressing to incorporate into.

45. according to the described technology of claim 38, wherein, multilayer circuit is formed on the multilayer that is engaged to electrically non-conductive material together.

46. according to the described technology of aforementioned arbitrary claim, wherein, also comprise the technology that forms cross tie part and/or passage, comprise a part via non-conductive layer mold pressing conductive material.

47. according to the described technology of aforementioned arbitrary claim, wherein, also comprise the technology that forms cross tie part and/or passage, the technology of this formation cross tie part and/or passage is included in and forms first conductive layer on the substrate, one or more electrically non-conductive materials are added on described first conductive layer, optionally remove described electrically non-conductive material, and on the electrically non-conductive material that covers the electrically non-conductive material zone that is removed by selectivity at least in part, form second conductive layer.

48. technology according to claim 1, wherein, one of described no joint technology comprises to be incorporated at least one wave guide member in the described device into.

49. according to the described technology of claim 48, wherein, described wave guide member is incorporated into by surface-coated.

50. according to the described technology of claim 48, wherein, described wave guide member is incorporated into by filling at least one preformed configuration.

51. according to the described technology of claim 48, wherein, described wave guide member is incorporated into by inserting at least one preform assembly.

52. technology according to claim 1 wherein, also comprises joint technology.

53. according to the described technology of claim 52, wherein, described joint technology comprises that at least one techonosphere of employing reduces malformation.

54. according to the described technology of claim 52, wherein, described joint technology comprises mechanical interlocking.

55. according to the described technology of claim 52, wherein, described joint technology comprises the surface modification that makes sheet volume or sheet material.

56., comprise multilayer build-up according to the described technology of aforementioned arbitrary claim.

57., wherein, be connected with identical faces with same parts, assembly or device from the material of described one or more technologies based on sheet volume according to the described technology of aforementioned arbitrary claim.

58., comprise multilayer build-up according to the described technology of aforementioned arbitrary claim.

59., wherein, be connected with the identical faces of same parts, assembly or device from the material of described one or more technologies based on sheet volume according to the described technology of aforementioned arbitrary claim.

60. technology that is used to make multilayer device, comprise at least one manufacturing step and at least one manufacturing step based on sheet material based on the sheet volume, wherein, in one or more steps of rolling up, carry out one or more technologies, as long as this technology is not graphic printing or cuts described device so that final isolation of components based on sheet.

61. a technology that is used to make microfluidic device comprises:

During at least one is based on manufacturing step of sheet volume and at least one carry out at least one during based on the manufacturing step of sheet material and do not have and engage and do not have a final separation processes.

62. according to the described technology of claim 61, wherein, described at least one nothing engages and does not have final separation processes and carried out by module.

63. according to claim 61 or 62 described technologies, wherein, also comprise in the described key element of claim 2 to 60 each or multinomial.

64. a device manufacture apparatus comprises:

At least one is based on the manufacturing assembly of sheet volume; And

At least one is based on the manufacturing assembly of sheet material, and wherein, described at least one manufacturing assembly and described at least one manufacturing assembly based on sheet material based on the sheet volume are configured to carry out a plurality of no joint technologies.

65. according to the described device of claim 64, wherein, described device comprises into layer device; Smart card; Sensor; Actuator; The in-vitro diagnosis device; The stratiform device; One of and/or microfluidic device.

66. according to the described device of claim 65, wherein, described device is a laminar product.

67. a device that is used to make microfluidic device comprises:

At least one is based on the manufacturing assembly of sheet volume; And

At least one is based on the manufacturing assembly of sheet material, and wherein, described at least one manufacturing assembly and described at least one manufacturing assembly based on sheet material based on the sheet volume are configured to carry out a plurality of no joint technologies.

68. according to the described device of claim 67, wherein, described at least one assembly and described at least one assembly based on sheet material based on the sheet volume comprise module.

69. according to the described device of claim 67, wherein, described device is folding microfluidic device.

70. the manufacturing module based on the sheet volume that is used to make device comprises:

Spool is configured to the conveying sheet volume;

Spool is used for carrying out manufacturing process with respect to the aspect of described device on described volume to the roll operation device; And

Interactive device is used to make described volume and at least one sheet material processing module to interact.

71. a sheet material processing module that is used to make device comprises:

The sheet material operating means is used for carrying out manufacturing process with respect to the aspect of described device on described sheet material; And

Interactive device is used to make described sheet material and at least one spool to interact to the spool processing module.

72. a technology that is used to make multilayer device, wherein, other technology of embossing and at least one combines with replicated architecture.

73. according to the described technology of claim 72, wherein, described at least one other technology comprises the employing otch.

74. according to the described technology of claim 72, wherein, described at least one other technology comprises the employing groove.

75. according to the described technology of claim 72, wherein, described at least one other technology comprises Laser Processing.

76. a technology that is used to make multilayer device comprises the optical alignment of assembly.

77. according to the described technology of claim 76, wherein, described optical alignment comprises the employing diffraction optical device.

78. according to the described technology of claim 76, wherein, described optical alignment comprises the employing conoscope image.

79. according to the described technology of claim 78, wherein, described conoscope image is a mole figure.

80. a technology that is used to make multilayer device comprises and incorporates at least one conducting element into described device that wherein, described conducting element utilizes mold pressing to incorporate into.

81. a technology that is used to make multilayer device comprises and incorporates at least one conducting element into described device that wherein, multilayer circuit is formed on the multilayer that is engaged to electrically non-conductive material together.

82. a technology that is used for forming cross tie part and/or passage between the conducting element on the device comprises the part via non-conductive layer mold pressing conductive material.

83. technology that is used between the conducting element on the device, forming cross tie part and/or passage, comprise the technology that forms cross tie part and/or passage, the technology of this formation cross tie part and/or passage is included in and forms first conductive layer on the substrate, one or more electrically non-conductive materials are added on described first conductive layer, optionally remove described electrically non-conductive material, and on the electrically non-conductive material that covers the electrically non-conductive material zone that is removed by selectivity at least in part, form second conductive layer.

84. a technology that is used to make smart card comprises that keeper electrode is to cover the smart card carrier module at least in part.

85. a technology that is used to make microfluidic device comprises:

The identity of the assembly of the described device of foundation guides described assembly.

86. 5 described technologies according to Claim 8 wherein, also comprise:

Give described assembly extracode, described code provides the described identity of described assembly.

87. 5 described technologies according to Claim 8, wherein, directing assembly comprises to be added assembly for other assembly according to the identity of assembly and/or removes assembly from other assembly.

88. device according to described technology of aforementioned arbitrary claim or device manufacturing.

89. a multilayer device comprises that at least one stress relief structure is to reduce the stress of substrate.

90. 9 described devices according to Claim 8, wherein, described structure is eliminated the stress in a plurality of adjacent devices.

91. 9 described devices according to Claim 8, wherein, described structure is eliminated the stress in the described device.

92. each described technology in 9 to 91 according to Claim 8, wherein, described structure is eliminated the stress in manufacturing, transportation or the use.

93. each described technology in 9 to 92 according to Claim 8, wherein, described device is a microfluidic device.

94. multilayer or multicompartment device, wherein, described device comprises at least one folding element, and feature is aimed on arbitrary of at least one fold.

95. according to the described device of claim 94, wherein, described device is a microfluidic device.

96. according to the described device of claim 94, wherein, described device comprises circuit.

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