CN101398638A - Detergent for photo resist - Google Patents

Detergent for photo resist Download PDF

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Publication number
CN101398638A
CN101398638A CNA2007100466995A CN200710046699A CN101398638A CN 101398638 A CN101398638 A CN 101398638A CN A2007100466995 A CNA2007100466995 A CN A2007100466995A CN 200710046699 A CN200710046699 A CN 200710046699A CN 101398638 A CN101398638 A CN 101398638A
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CN
China
Prior art keywords
out system
ether
photoresist clean
photoresist
clean
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Pending
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CNA2007100466995A
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Chinese (zh)
Inventor
史永涛
彭洪修
曹惠英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anji Microelectronics Shanghai Co Ltd
Anji Microelectronics Co Ltd
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Anji Microelectronics Shanghai Co Ltd
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Publication date
Application filed by Anji Microelectronics Shanghai Co Ltd filed Critical Anji Microelectronics Shanghai Co Ltd
Priority to CNA2007100466995A priority Critical patent/CN101398638A/en
Priority to PCT/CN2008/001693 priority patent/WO2009046637A1/en
Priority to CN200880109166.XA priority patent/CN101842746B/en
Publication of CN101398638A publication Critical patent/CN101398638A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)

Abstract

The invention discloses a photoresist cleaning agent which contains quaternary ammonium hydroxide, water, alkyl glycol aryl ether, dimethyl sulfoxide, a polycarboxylate inhibitor and an aminoimidazole inhibitor. The photoresist cleaning agent can effectively remove the photoresist (light blockage) and other etching residues on metals, metal alloys or dielectric substrates and has very low corrosivity to metals such as aluminum, copper and the like as well as non-metal materials such as silicon dioxide and the like. The photoresist cleaning agent can further prevent metal surface from generating oxide and has good application prospect in the microelectronics fields such as semiconductor chip cleaning and the like.

Description

A kind of photoresist clean-out system
Technical field
The present invention relates to a kind of clean-out system in the semiconductor fabrication process, be specifically related to a kind of photoresist clean-out system.
Background technology
In common semiconductor fabrication process,, utilize wet method or dry etching to carry out figure transfer after the exposure by going up the mask that forms photoresist on surfaces such as silicon dioxide, Cu metals such as (copper) and low-k materials.Low temperature cleaning fast is the important directions of semiconductor wafer fabrication process development.The negative photoresist of the above thickness of 20 μ m is applied in the semiconductor wafer fabrication process just gradually, and industrial most photoresist clean-out system is better to the cleansing power of positive photoresist at present, but can not thoroughly remove the negative photoresist with cross-linked structure after exposure and etching on the wafer.In addition, carry out in the chemical cleaning process of photoresist at semiconductor wafer, clean-out system regular meeting causes the corrosion of wafer pattern and base material.Particularly utilizing chemical to remove in the process of photoresist and etch residue, metal (especially aluminium and copper etc. are than the active metal) oxidation and corrosion are comparatively generally and very serious problem, often cause the remarkable reduction of wafer yield.
At present, the photoresist clean-out system mainly is made up of polar organic solvent, highly basic and/or water etc., by immersing semiconductor wafer in the clean-out system or utilizing clean-out system flushing semiconductor wafer, removes the photoresist on the semiconductor wafer.
Patent documentation WO03104901 utilizes Tetramethylammonium hydroxide (TMAH), sulfolane (SFL), water and anti--1,2-CDTAs (CyDTA) etc. are formed alkaline cleaner, wafer is immersed in this clean-out system, in 50～70 ℃ of following submergence 20～30min, remove the photoresist on metal and the dielectric substrate.This alkaline cleaner is slightly high to the corrosion of semiconductor wafer base material, and can not remove the photoresist of semiconductor wafer, cleansing power deficiency fully.
WO04059700 utilizes Tetramethylammonium hydroxide (TMAH), N-methylmorpholine-N-oxide (MO), water and 2-mercaptobenzimidazole (MBI) etc. to form alkaline cleaner, wafer is immersed in this clean-out system, in 70 ℃ of following submergence 15～60min, remove the photoresist on metal and the dielectric substrate.The cleaning temperature of this alkaline cleaner is higher, and is slightly high to the corrosion of semiconductor wafer base material, and cleaning speed is relatively slow, is unfavorable for improving the cleaning efficiency of semiconductor wafer.
JP1998239865 utilizes TMAH, dimethyl sulfoxide (DMSO) (DMSO), 1,3 '-dimethyl-2-imidazolidinone (DMI) and water etc. are formed alkaline cleaner, wafer is immersed in this clean-out system the thick film photolithography glue more than the 20 μ m that remove under 50～100 ℃ on metal and the dielectric substrate.This alkaline cleaner is more serious to the corrosion of semiconductor wafer base material under higher cleaning temperature.
JP2001215736 utilizes TMAH, dimethyl sulfoxide (DMSO) (DMSO), ethylene glycol (EG) and water etc. to form alkaline cleaner, wafer is immersed in this clean-out system, in the photoresist of removing under 50～70 ℃ on metal and the dielectric substrate.This alkaline cleaner is more serious to the corrosion of semiconductor wafer base material under higher cleaning temperature.
JP200493678 utilizes TMAH, N-Methyl pyrrolidone (NMP), water or methyl alcohol etc. to form alkaline cleaner, wafer is immersed in this clean-out system, in the photoresist of removing under 25～85 ℃ on metal and the dielectric substrate.This alkaline cleaner is along with the rising of cleaning temperature, and the corrosion of semiconductor wafer base material is obviously strengthened.
Above clean-out system or cleansing power deficiency, perhaps stronger to semiconductor wafer base material corrosion, can not satisfy the demand for development of semiconductor wafer cleaning technique.
Summary of the invention
The objective of the invention is provides a kind of have higher photoresist cleansing power and the lower corrosive photoresist clean-out system of base material in order to solve the not enough and problem stronger to the corrosivity of semiconductor wafer base material of cleansing power of photoresist clean-out system of the prior art to photoresist.
Photoresist clean-out system of the present invention contains: quaternary ammonium hydroxide, water, alkyl diol aryl ether, dimethyl sulfoxide (DMSO), polycarboxylic acid corrosion inhibiter and amino azole corrosion inhibiter.
Wherein, what described quaternary ammonium hydroxide was preferable is Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, TPAOH, TBAH and/or benzyltrimethylammonium hydroxide, better is Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide and/or TBAH, and best is Tetramethylammonium hydroxide.What the content of described quaternary ammonium hydroxide was preferable is mass percent 0.1～10%, and better is mass percent 0.5～5%.
Wherein, what the content of described water was preferable is mass percent 0.1～30%, and better is mass percent 0.5～15%.
Wherein, the carbon atom number of alkyl diol is 3～18 in the described alkyl diol aryl ether, what described alkyl diol aryl ether was preferable is propylene glycol list phenyl ether, Isopropanediol list phenyl ether, diethylene glycol list phenyl ether, the single phenyl ether of dipropylene glycol, di-isopropylene glycol list phenyl ether, triethylene glycol list phenyl ether, tripropylene glycol list phenyl ether, three Isopropanediol list phenyl ethers, six condensed ethandiol list phenyl ethers, the six propylene glycol list phenyl ethers that contract, the six Isopropanediol list phenyl ethers that contract, the propylene glycol single-benzyl ether, Isopropanediol single-benzyl ether and/or hexanediol list naphthyl ether, better is propylene glycol list phenyl ether, single phenyl ether of dipropylene glycol and/or propylene glycol single-benzyl ether.What the content of described alkyl diol aryl ether was preferable is mass percent 1～60%, and better is mass percent 5～30%.The alkyl diol aryl ether can improve the solubleness of Tetramethylammonium hydroxide in dimethyl sulfoxide (DMSO), and the harm of environment is lower than alkylene glycol alkyl ether etc., is more conducive to the protection of environment.
Wherein, what the content of described dimethyl sulfoxide (DMSO) was preferable is mass percent 1～98%, and better is mass percent 50～90%.
Wherein, what described polycarboxylic acid corrosion inhibiter was preferable is polyacrylic acid (PAA) or its multipolymer, polymethylacrylic acid (PMAA) or its multipolymer, polyacrylic acid alcohol amine salt, polymethylacrylic acid alcohol amine salt, polyoxyethylene modified polyacrylic acid or derivatives thereof, polyoxyethylene modified polymethyl acid or derivatives thereof, poly-epoxy succinic acid, poly-aspartate, carboxylic polycaprolactone and/or carboxylic polylactide, better is polyacrylic acid, polymethylacrylic acid, polyacrylic acid alcohol amine salt, polymethylacrylic acid alcohol amine salt, carboxylic polycaprolactone and/or carboxylic polylactide.What the molecular weight of described polycarboxylic acid corrosion inhibiter was preferable is 500～20000, and better is 1000～10000.What the content of described polycarboxylic acid corrosion inhibiter was preferable is mass percent 0.01～5%, and better is mass percent 0.05～2.5%.Described polycarboxylic acid corrosion inhibiter shows the good restraining effect to the corrosion of aluminium.
Wherein, described amino azole corrosion inhibiter is a 3-amino-1,2,4-triazole, 4-amino-1,2,4-triazole, 5-amino-tetrazole, 3,5-diaminostilbene, 2,4-triazole, 2-aminooimidazole, the amino benzimidazole of 2-, diamido benzo imidazoles, thiazolamine, 2-aminobenzothiazole, 2-ammonia base oxazole, the amino benzoxazole of 2-, 3-amino-pyrazol, 3-aminocarbazole, 6-Aminoindazole, 2-amino-1,3,4-thiadiazoles and/or 5-amino-1,2, the 3-thiadiazoles.Wherein, preferable is 3-amino-1,2,4-triazole, 4-amino-1,2,4-triazole and/or 5-amino-tetrazole.What the content of described amino azole corrosion inhibiter was preferable is mass percent 0.01～5%, and better is mass percent 0.05～2.5%.Described amino azole corrosion inhibiter can prevent the generation of oxidation on metal surface thing very effectively, improves the wafer surface state.
Among the present invention, described photoresist clean-out system also can contain one or more in polarity organic cosolvent, surfactant and other corrosion inhibiter except that polycarboxylic acid and amino azole.
Wherein, what the content of described polarity organic cosolvent was preferable is mass percent 0～50%, and better is mass percent 5～30%; What the content of described surfactant was preferable is mass percent 0～5%, and better is mass percent 0.05～3%; What the content of described other corrosion inhibiter except that polycarboxylic acid and amino azole was preferable is mass percent 0～10%, and better is mass percent 0.1～5%.
Wherein, described polarity organic cosolvent is preferable is in sulfoxide, sulfone, imidazolidinone, hydramine and the alkylene glycol monoalkyl ether one or more; The carbon atom number of alkyl diol is 3～18 in the alkylene glycol monoalkyl ether.What wherein, described sulfoxide was preferable is the diethyl sulfoxide and/or the first and second basic sulfoxides; What described sulfone was preferable is methyl sulfone, ethyl sulfone and/or sulfolane, and better is sulfolane; What described imidazolidinone was preferable is 2-imidazolidinone, 1,3-dimethyl-2-imidazolidinone and/or 1, and 3-diethyl-2-imidazolidinone, better is 1,3-dimethyl-2-imidazolidinone; What described hydramine was preferable is monoethanolamine, diethanolamine, triethanolamine, isopropanolamine, methyldiethanolamine, dimethylethanolamine and/or AEEA, and better is monoethanolamine, triethanolamine and/or methyldiethanolamine; Described alkylene glycol monoalkyl ether is preferable is the single ether of diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol, dipropylene glycol monobutyl ether, triethylene glycol monomethyl ether, tripropylene glycol monomethyl ether, tripropylene glycol list ether, tripropylene glycol monobutyl ether, six condensed ethandiol monomethyl ethers, six propylene glycol monomethyl ether and/or the six Isopropanediol monomethyl ether that contracts that contracts, and better is diethylene glycol monomethyl ether and/or dipropylene glycol monomethyl ether.
What wherein, described surfactant was preferable is polyvinyl alcohol (PVA) (PVG), polyvinylpyrrolidone (PVP) and/or polyoxyethylene ether (POE).What the molecular weight of described surfactant was preferable is 500～20000, and better is 1000～10000.
Wherein, described other corrosion inhibiter is preferable is alcamines, the azole except that amino azole, the carboxylic acids except that polycarboxylic acid and/or phosphonic acid based corrosion inhibiter.Wherein, what described alcamines corrosion inhibiter was preferable is monoethanolamine (MEA), diethanolamine (DEA), triethanolamine (TEA), isopropanolamine, methyldiethanolamine, dimethylethanolamine and/or AEEA, and better is monoethanolamine, triethanolamine and/or methyldiethanolamine; What described azole corrosion inhibiter except that amino azole was preferable is benzotriazole (BTA), methyl benzotriazazole (TTA), benzotriazole triethanolamine salt (BTA-TEA), 1-phenyl-5-mercapto tetrazole (PMTA), 2-mercaptobenzimidazole (MBI), 2-mercaptobenzothiazole (MBT), 2-mercaptobenzoxazole (MBO) and/or dimercaptothiodiazole (DMTDA), and better is benzotriazole, methyl benzotriazazole, 1-phenyl-5-mercapto tetrazole and/or 2-mercaptobenzothiazole; What described carboxylic acids corrosion inhibiter except that polycarboxylic acid was preferable is phthalic acid, gallic acid, citric acid, malic acid and/or glycollic acid, and better is citric acid and/or glycollic acid; What described phosphonic acid based corrosion inhibiter was preferable is 1,3-(hydroxyethyl)-2,4,6-tri methylene phosphonic acid, Amino Trimethylene Phosphonic Acid, 2-phosphonic acids butane-1,2,4-tricarboxylic acids, ethylenediamine tetramethylene phosphonic acid and/or diethylenetriamine pentamethylene phosphonic acids, better is 2-phosphonic acids butane-1,2,4-tricarboxylic acids, ethylenediamine tetramethylene phosphonic acid and/or diethylenetriamine pentamethylene phosphonic acids.
Photoresist clean-out system of the present invention is simply mixed and can be made by top described component.Agents useful for same of the present invention and raw material are all commercially available to be got.Photoresist clean-out system of the present invention can use (room temperature to 85 ℃ between) in bigger temperature range.Cleaning method can be with reference to following steps: the semiconductor wafer that will contain photoresist immerses in the clean-out system, utilizes constant temperature oscillator slowly to vibrate under room temperature to 85 ℃, dries up with high pure nitrogen behind deionized water wash then.
Positive progressive effect of the present invention is: clean-out system of the present invention can comparatively promptly clean photoresist (photoresistance) and other etch residue of removing the above thickness of 20 μ m on metal, metal alloy or the dielectric substrate under room temperature to 85 ℃; Simultaneously; contained alkyl diol aryl ether and polycarboxylic acid corrosion inhibiter can form layer protecting film at wafer figure and substrate surface; stop the attack to wafer figure and base material such as halogen atom, hydroxide ion; thereby reduce to the wafer figure with to metals such as aluminium and copper; and the corrosion of non-metallic substrate such as silicon dioxide; especially its polycarboxylic acid corrosion inhibiter that contains shows good inhibition effect to the corrosion of metallic aluminium; and the amino azole corrosion inhibiter can prevent the generation of oxidation on metal surface thing very effectively, improves the wafer surface state.Photoresist clean-out system of the present invention has a good application prospect at microelectronics such as semiconductor wafer cleanings.
Embodiment
Mode below by embodiment further specifies the present invention, but does not therefore limit the present invention among the described scope of embodiments.
Embodiment 1～29
Table 1 has provided the prescription of photoresist clean-out system embodiment 1～29, presses listed component and content thereof in the table 1, simply mixes, and promptly makes each clean-out system.
Table 1 photoresist clean-out system embodiment 1～29
Figure A200710046699D00141
Figure A200710046699D00151
Figure A200710046699D00161
Effect embodiment contrasts clean-out system 1 '～7 ' and photoresist clean-out system 30～45 of the present invention
Table 2 has provided the prescription of contrast clean-out system 1 '～7 ' and photoresist clean-out system 30～45 of the present invention, presses listed component and content thereof in the table 1, simply mixes, and promptly makes each clean-out system.
The component and the content of table 2 contrast clean-out system 1 '～7 ' and photoresist clean-out system 30～45 of the present invention
Embodiment Tetramethylammonium hydroxide Deionized water Propylene glycol list phenyl ether Dimethyl sulfoxide (DMSO) (molecular weight is the polyacrylic acid diethanolamine salt 4-amino-1,2, the 4-ribavirin 1,3-dimethyl-2-imidazolidinone Polyoxyethylene ether (molecular weight is 10000) Monoethanolamine Triethanolamine Benzotriazole Methyl benzo three
20000) The nitrogen azoles
1’ 1.00 5.00 \ 94.00 \ \ \ \ \ \ \ \
2’ 1.00 5.00 \ 93.50 \ \ \ \ \ \ 0.50 \
3’ 1.50 8.50 \ 89.50 \ \ \ \ \ \ \ 0.50
4’ 2.00 8.00 \ 89.90 \ \ \ 0.10 \ \ \ \
5’ 2.50 12.00 \ 84.90 \ \ \ 0.10 \ \ 0.50 \
6’ 3.00 12.00 2.00 81.60 0.10 \ \ 0.30 0.50 \ 0.50 \
7’ 3.00 12.00 \ 84.70 \ \ \ 0.30 \ \ \ \
30 0.50 5.00 1.00 93.48 0.01 0.01 \ \ \ \ \ \
31 1.00 5.00 3.00 90.85 0.05 0.10 \ \ \ \ \ \
32 1.50 5.00 5.00 88.25 0.05 0.20 \ \ \ \ \ \
33 2.00 5.00 5.00 87.55 0.10 0.25 \ 0.10 \ \ \ \
34 2.50 5.00 5.00 86.80 0.20 0.30 \ 0.10 0.10 \ \ \
35 3.00 6.00 6.00 83.60 0.30 0.50 \ 0.10 0.50 \ \ \
36 3.00 12.00 2.00 80.60 0.10 1.00 \ 0.30 0.50 \ 0.50 \
37 3.50 7.00 6.00 80.20 0.30 1.50 \ \ 1.00 \ 0.50 \
38 4.00 7.50 7.00 77.20 0.30 2.50 \ \ 1.00 \ \ 0.50
39 4.50 8.50 10.00 56.00 0.50 3.00 15.00 \ 1.00 0.50 1.00 \
40 5.00 10.00 10.00 68.00 0.50 3.50 \ \ 2.00 \ 0.50 0.50
41 7.50 15.00 15.00 40.70 1.50 4.00 \ 0.30 15.00 \ 1.00 \
42 10.00 20.00 15.00 24.50 3.00 5.00 \ 0.50 20.00 \ 1.00 1.00
43 3.00 7.00 10.00 73.00 1.00 2.00 \ \ 2.00 \ 1.00 1.00
44 3.00 7.00 10.00 68.50 1.00 2.50 \ \ 6.00 \ 1.00 1.00
45 3.00 7.00 10.00 63.50 1.00 3.50 \ \ 10.00 \ 1.00 1.00
Annotate: be not add this component.
Each component in the table 2 is proportionally mixed, make contrast clean-out system 1 '～7 ' and clean-out system 30～45.Wherein, except that contrast has in the clean-out system 7 ' a small amount of Tetramethylammonium hydroxide can not dissolve, contrast clean-out system 1 '～6 ' and clean-out system 30～45 are the homogeneous phase solution of clear.
To contrast clean-out system 1 '～6 ' and clean-out system 30～45 and be used to clean blank Cu wafer, measure its corrosion situation for metal Cu.Method of testing and condition: the blank Cu wafer of 4 * 4cm is immersed clean-out system, under 23～85 ℃, utilize constant temperature oscillator with about 60 rev/mins vibration frequency vibration 60 minutes, behind deionized water wash, dry up then, utilize four utmost point probe machines to measure blank Cu chip etching front and rear surfaces changes in resistance and calculate with high pure nitrogen.The result is as shown in table 3.
To contrast clean-out system 1 '～6 ' and clean-out system 30～45 and be used to clean blank Al wafer, measure its corrosion situation for metal A l.Method of testing and condition: the blank Al wafer of 4 * 4cm is immersed clean-out system, under 23～85 ℃, utilize constant temperature oscillator with about 60 rev/mins vibration frequency vibration 60 minutes, behind deionized water wash, dry up then, utilize four utmost point probe machines to measure blank Al chip etching front and rear surfaces changes in resistance and calculate with high pure nitrogen.The result is as shown in table 3.
To contrast clean-out system 1 '～6 ' and clean-out system 30～45 and be used to clean blank tetraethoxysilane (TEOS) wafer, measure its corrosion situation for nonmetal TEOS.Method of testing and condition: the blank TEOS wafer of 4 * 4cm is immersed clean-out system, under 23～85 ℃, utilize constant temperature oscillator, behind deionized water wash, dry up then with high pure nitrogen with about 60 rev/mins vibration frequency vibration 60 minutes.The change calculations of utilizing the Nanospec6100 thicknessmeter to measure blank TEOS wafer cleaning front and back TEOS thickness obtains, and the result is as shown in table 3.
Among the present invention, utilize the method for photoresist on the photoresist clean-out system cleaning semiconductor wafer as follows: (thickness is about 50 microns will to contain negativity esters of acrylic acid photoresist, and through overexposure and etching) semiconductor wafer (containing pattern) immerse in the clean-out system, under 23～85 ℃, utilize constant temperature oscillator with about 60 rev/mins vibration frequency vibration 1～30 minute, behind deionized water wash, dry up then with high pure nitrogen.The cleaning performance of photoresist and clean-out system are as shown in table 3 to the corrosion situation of wafer pattern.
The corrosivity of table 3 contrast clean-out system 1 '～6 ' and 30～45 couples of metal Cu of clean-out system and Al and nonmetal TEOS and to the cleaning situation of negative photoresist
Clean-out system Cleaning temperature (℃) The corrosion situation of metal Cu The corrosion situation of metal A l The corrosion situation of nonmetal TEOS Photoresist scavenging period (min) The photoresist wash result The corrosion situation of wafer pattern
Contrast 1 ' 40 × × ○ 30 ○ ◎
Contrast 2 ' 35 × × ○ 30 ○ ◎
Contrast 3 ' 30 × × ○ 30 ◎ ○
Contrast 4 ' 23 × × △ 25 ◎ △
Contrast 5 ' 23 × × △ 20 ◎ ×
Contrast 6 ' 23 ◎ (utmost point slight oxidation film) ◎ (utmost point slight oxidation film) ◎ 15 ◎ ◎
30 40 ◎ ◎ ◎ 30 ○ ◎
31 35 ◎ ◎ ◎ 30 ○ ◎
32 30 ◎ ◎ ◎ 30 ◎ ◎
33 23 ◎ ◎ ◎ 25 ◎ ◎
34 23 ◎ ◎ ◎ 20 ◎ ◎
35 23 ◎ ◎ ◎ 15 ◎ ◎
36 23 ◎ (No oxided film) ◎ (No oxided film) ◎ 15 ◎ ◎
37 23 ◎ ◎ ◎ 10 ◎ ◎
38 23 ◎ ◎ ◎ 10 ◎ ◎
39 23 ◎ ◎ ◎ 10 ◎ ◎
40 23 ◎ ◎ ◎ 10 ◎ ◎
41 23 ◎ (No oxided film) ◎ (No oxided film) ◎ 5 ◎ ◎
42 23 ◎ (No oxided film) ◎ (No oxided film) ◎ 5 ◎ ◎
43 45 ◎ ◎ ◎ 5 ◎ ◎
44 60 ◎ ◎ ◎ 5 ◎ ◎
45 85 ◎ (No oxided film) ◎ (No oxided film) ◎ 1 ◎ ◎
Annotate:
Figure A200710046699D00191
As can be seen from Table 3, compare with contrast clean-out system 1 '～6 ', 30～45 pairs of negativity esters of acrylic acids of photoresist clean-out system of the present invention photoresist has good cleansing power, the serviceability temperature scope is wide, corrosivity to metal Cu and Al and nonmetal TEOS is low simultaneously, and wafer pattern is not had damage.

Claims (31)

1. a photoresist clean-out system contains: quaternary ammonium hydroxide, water, alkyl diol aryl ether, dimethyl sulfoxide (DMSO), polycarboxylic acid corrosion inhibiter and amino azole corrosion inhibiter.
2. photoresist clean-out system as claimed in claim 1, described quaternary ammonium hydroxide are Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, TPAOH, TBAH and/or benzyltrimethylammonium hydroxide.
3. photoresist clean-out system as claimed in claim 1, the content of described quaternary ammonium hydroxide are mass percent 0.1～10%.
4. photoresist clean-out system as claimed in claim 3, the content of described quaternary ammonium hydroxide are mass percent 0.5～5%.
5. photoresist clean-out system as claimed in claim 1, the content of described water are mass percent 0.1～30%.
6. photoresist clean-out system as claimed in claim 5, the content of described water are mass percent 0.5～15%.
7. photoresist clean-out system as claimed in claim 1, the carbon atom number of alkyl diol is 3～18 in the described alkyl diol aryl ether.
8. photoresist clean-out system as claimed in claim 7, described alkyl diol aryl ether are the single phenyl ether of propylene glycol list phenyl ether, Isopropanediol list phenyl ether, diethylene glycol list phenyl ether, dipropylene glycol, di-isopropylene glycol list phenyl ether, triethylene glycol list phenyl ether, tripropylene glycol list phenyl ether, three Isopropanediol list phenyl ethers, six condensed ethandiol list phenyl ethers, six contract propylene glycol list phenyl ether, six contract Isopropanediol list phenyl ether, propylene glycol single-benzyl ether, Isopropanediol single-benzyl ether and/or hexanediol list naphthyl ether.
9. photoresist clean-out system as claimed in claim 1, the content of described alkyl diol aryl ether are mass percent 1～60%.
10. photoresist clean-out system as claimed in claim 9, the content of described alkyl diol aryl ether are mass percent 5～30%.
11. photoresist clean-out system as claimed in claim 1, the content of described dimethyl sulfoxide (DMSO) are mass percent 1～98%.
12. photoresist clean-out system as claimed in claim 11, the content of described dimethyl sulfoxide (DMSO) are mass percent 50～90%.
13. photoresist clean-out system as claimed in claim 1, described polycarboxylic acid corrosion inhibiter are polyacrylic acid or its multipolymer, polymethylacrylic acid or its multipolymer, polyacrylic acid alcohol amine salt, polymethylacrylic acid alcohol amine salt, polyoxyethylene modified polyacrylic acid or derivatives thereof, polyoxyethylene modified polymethyl acid or derivatives thereof, poly-epoxy succinic acid, poly-aspartate, carboxylic polycaprolactone and/or carboxylic polylactide.
14. photoresist clean-out system as claimed in claim 1, the content of described polycarboxylic acid corrosion inhibiter are mass percent 0.01～5%.
15. photoresist clean-out system as claimed in claim 14, the content of described polycarboxylic acid corrosion inhibiter are mass percent 0.05～2.5%.
16. photoresist clean-out system as claimed in claim 1, described amino azole corrosion inhibiter is a 3-amino-1,2,4-triazole, 4-amino-1,2,4-triazole, 5-amino-tetrazole, 3, the 5-diaminostilbene, 2,4-triazole, 2-aminooimidazole, the amino benzimidazole of 2-, diamido benzo imidazoles, thiazolamine, 2-aminobenzothiazole, 2-ammonia base oxazole, the amino benzoxazole of 2-, 3-amino-pyrazol, 3-aminocarbazole, 6-Aminoindazole, 2-amino-1,3,4-thiadiazoles and/or 5-amino-1,2, the 3-thiadiazoles.
17. photoresist clean-out system as claimed in claim 1, the content of described amino azole corrosion inhibiter are mass percent 0.01～5%.
18. photoresist clean-out system as claimed in claim 17, the content of described amino azole corrosion inhibiter are mass percent 0.05～2.5%.
19. photoresist clean-out system as claimed in claim 1, described photoresist clean-out system also contain in polarity organic cosolvent, surfactant and other corrosion inhibiter except that polycarboxylic acid and amino azole one or more.
20. photoresist clean-out system as claimed in claim 19, the content of described polarity organic cosolvent are mass percent 0～50%; The content of described surfactant is mass percent 0～5%; The content of described other corrosion inhibiter except that polycarboxylic acid and amino azole is mass percent 0～10%.
21. photoresist clean-out system as claimed in claim 20, the content of described polarity organic cosolvent are mass percent 5～30%; The content of described surfactant is mass percent 0.05～3%; The content of described other corrosion inhibiter except that polycarboxylic acid and amino azole is mass percent 0.1～5%.
22. photoresist clean-out system as claimed in claim 19, described polarity organic cosolvent is one or more in sulfoxide, sulfone, imidazolidinone, hydramine and the alkylene glycol monoalkyl ether, and wherein the carbon atom number of alkyl diol is 3～18 in the alkylene glycol monoalkyl ether; Described surfactant is polyvinyl alcohol (PVA), polyvinylpyrrolidone and/or polyoxyethylene ether; Described other corrosion inhibiter is an alcamines, the azole except that amino azole, the carboxylic acids except that polycarboxylic acid and/or phosphonic acid based corrosion inhibiter.
23. photoresist clean-out system as claimed in claim 22, described sulfoxide are the diethyl sulfoxide and/or the first and second basic sulfoxides.
24. photoresist clean-out system as claimed in claim 22, described sulfone are methyl sulfone, ethyl sulfone and/or sulfolane.
25. photoresist clean-out system as claimed in claim 22, described imidazolidinone are 2-imidazolidinone, 1,3-dimethyl-2-imidazolidinone and/or 1,3-diethyl-2-imidazolidinone.
26. photoresist clean-out system as claimed in claim 22, described hydramine are monoethanolamine, diethanolamine, triethanolamine, isopropanolamine, methyldiethanolamine, dimethylethanolamine and/or AEEA.
Propylene glycol monomethyl ether and/or the six Isopropanediol monomethyl ether that contracts 27. photoresist clean-out system as claimed in claim 22, described alkylene glycol monoalkyl ether single ether that is diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol, dipropylene glycol monobutyl ether, triethylene glycol monomethyl ether, tripropylene glycol monomethyl ether, tripropylene glycol list ether, tripropylene glycol monobutyl ether, six condensed ethandiol monomethyl ethers, six contract.
28. photoresist clean-out system as claimed in claim 22, described alcamines corrosion inhibiter is monoethanolamine, diethanolamine, triethanolamine, isopropanolamine, methyldiethanolamine, dimethylethanolamine and/or AEEA.
29. photoresist clean-out system as claimed in claim 22, described azole corrosion inhibiter are benzotriazole, methyl benzotriazazole, benzotriazole triethanolamine salt, 1-phenyl-5-mercapto tetrazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole and/or dimercaptothiodiazole.
30. photoresist clean-out system as claimed in claim 22, described carboxylic acids corrosion inhibiter is phthalic acid, gallic acid, citric acid, malic acid and/or glycollic acid.
31. photoresist clean-out system as claimed in claim 22, described phosphonic acid based corrosion inhibiter is 1,3-(hydroxyethyl)-2,4,6-tri methylene phosphonic acid, Amino Trimethylene Phosphonic Acid, 2-phosphonic acids butane-1,2,4-tricarboxylic acids, ethylenediamine tetramethylene phosphonic acid and/or diethylenetriamine pentamethylene phosphonic acids.
CNA2007100466995A 2007-09-29 2007-09-29 Detergent for photo resist Pending CN101398638A (en)

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CN200880109166.XA CN101842746B (en) 2007-09-29 2008-10-06 A kind of photoetching gluing cleaning agent

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