CN101397667A - Wet etching apparatus and method - Google Patents
Wet etching apparatus and method Download PDFInfo
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- CN101397667A CN101397667A CNA2007100464881A CN200710046488A CN101397667A CN 101397667 A CN101397667 A CN 101397667A CN A2007100464881 A CNA2007100464881 A CN A2007100464881A CN 200710046488 A CN200710046488 A CN 200710046488A CN 101397667 A CN101397667 A CN 101397667A
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Abstract
The invention relates to a wet etching device which comprises a liquid supply device used for supplying an etchant, a transportation pipe communicated with the liquid supply device, as well as a liquid discharge pipe communicated with the transportation pipe and used for transporting the rest etchant, and a liquid discharge device used for receiving the rest etchant transported by the liquid discharge pipe and discharging the rest etchant. The invention also relates to a wet etching method which comprises the steps of providing the etchant, receiving the etchant to carry out wet etching to a wafer and discharging the rest etchant after finishing the wet etching. The wet etching device and the wet etching method solve the problem of the prior art that the rest etchant remains in the transportation pipe, therefore, the quality of wet etching is improved.
Description
Technical field
The present invention relates to wet etching process, particularly wet etching apparatus and corresponding wet etch process.
Background technology
Along with the development of semiconductor technology, the area of semi-conductor chip is more and more littler, and the live width in the chip is also constantly dwindled, so the test that the semiconductor technology ability is subjected to is also increasing, and the control of the precision of technology and technology variation also becomes more important.In the technology of making semi-conductor chip, important is exactly etch process.In the process of making semi-conductor chip, the size of functional device in the definition chip, technologies such as manufacturing through hole all can use etching.Thereby etched quality can directly have influence on the performance of chip.
At present, etch process has two big classes: wet etching and dry etching.Wherein wet etching has methods such as silicon wet etching, silicon-dioxide wet etching, aluminium film wet etching, deposited oxide wet etching, silicon nitride wet etching, wet spraying etching and vapor etch.And dry etching has methods such as plasma etching, ion beam milling and reactive ion etching.With the wet etching is example, and traditional wet etch process is to treat that etched wafer immerses in the etching solution, and etching solution can need etched material to carry out etching to crystal column surface.Etched depth needs the rate of etch and the etching period of etched material to determine that jointly etching period is long more according to etching solution relatively, and etch depth is also dark more.And newer technology is that etching solution is carried and utilized shower nozzle to be sprayed on crystal column surface and carry out wet etching by transmission pipeline at present, and the precision of wet etching can be higher like this.
At for example application number is to find more information about wet etch process in 200510118748.2 the Chinese patent application.This patent application is rotated wafer after wafer is placed etching solution, make that the time of each surperficial contact etch liquid of wafer is identical, thereby has avoided the uneven problem of wafer surface etching.
Correspondingly, be useful on the device of wet etching at present, be applicable to single chemical reagent or number of chemical reagent mix wet etching process as etching solution.This device generally includes the transmission pipeline that is used to carry etching solution, and is communicated with transmission pipeline and is used for etching solution is sprayed on the shower nozzle that crystal column surface carries out wet etching.But, in present wet processing, often find, because also having some remaining etching solutions after wet etching process finishes is trapped in the transmission pipeline of carrying etching solution, when these remaining etching solutions converge in the shower nozzle and are dropped in crystal column surface owing to the effect of gravity, not only can influence etched precision, etched depth is deepened, wafer is faded, these all can have a strong impact on the quality of wafer.Thereby the situation that etching solution residues in the transmission pipeline also becomes urgent problem instantly.
Summary of the invention
The invention provides a kind of wet etching apparatus and method, solve the transmission pipeline in the prior art wet etching apparatus, after wet etching finishes, have residual etching solution, and be dropped in the problem that crystal column surface influences wafer quality.
For addressing the above problem, the invention provides a kind of wet etching apparatus, comprise, be used to supply the liquid feed device of etching solution; The transmission pipeline that is communicated with liquid feed device; Be communicated with the Drainage pipe that transmission pipeline is used to carry remaining etching solution, and receive the remaining etching solution of Drainage pipe conveying and the pumping equipment that remaining etching solution is discharged.
Optionally, described pumping equipment is an air pump, and described air pump extracts remaining etching solution in the transmission pipeline by Drainage pipe, and remaining etching solution is discharged.
Optionally, described pumping equipment is the flow type suction pump, and described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.Described " T " font pipeline links to each other with Drainage pipe.Described flow type suction pump passes through the mobile generation suction of the tap water in " T " font pipeline, by the remaining etching solution in the Drainage pipe extraction transmission pipeline, and with remaining etching solution discharge.
Optionally, described wet etching apparatus also comprises, second recovery channel that is communicated with first recovery channel that transmission pipeline reclaims in order to the etching solution that liquid feed device is provided, receives the recovery etching solution that first recovery channel carries and the retrieving arrangement that will reclaim etching solution output and the recovery etching solution that retrieving arrangement is exported is delivered to liquid feed device.
Optionally, described liquid feed device, transmission pipeline link to each other by welding or riveted way.
Optionally, described transmission pipeline, Drainage pipe and pumping equipment link to each other by welding or riveted way.
Optionally, described transmission pipeline, first recovery channel, retrieving arrangement, second recovery channel and liquid feed device link to each other by welding or riveted way.
Optionally, described wet etching apparatus also comprises be used for first valve that the control transmission pipeline opens or close on the transmission pipeline between the Drainage pipe and first recovery channel.
Optionally, described wet etching apparatus also comprises being positioned at and is used for controlling second valve that Drainage pipe is opened or closed on the Drainage pipe.
Optionally, described wet etching apparatus also comprises being positioned at and is used for controlling the 3rd valve that first recovery channel is opened or closed on first recovery channel.
Optionally, described Drainage pipe be following any: the pipeline that is independent of pumping equipment and transmission pipeline; Solidify on pumping equipment, as with the pipeline of the connecting path of transmission pipeline; Solidify on transmission pipeline, as with the pipeline of the connecting path of pumping equipment.
Correspondingly, the present invention also provides a kind of wet etch process, comprise the following steps,
Etching solution is provided;
Receive etching solution wafer is carried out wet etching;
After finishing wet etching, remaining etching solution is discharged.
Optionally, described remaining etching solution is discharged by pumping equipment.
Optionally, described pumping equipment can be an air pump.
Optionally, described pumping equipment can also be the flow type suction pump, and described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.
Optionally, finishing wet method after the moment, reclaim the etching solution that is provided.
Compared with prior art, above-mentioned disclosed wet etching apparatus and method have the following advantages: above-mentioned disclosed wet etching apparatus and method are discharged the remaining etching solution in the transmission pipeline when wafer is finished wet etching by pumping equipment, thereby preventing influences wafer quality owing to action of gravity makes remaining etching solution be dropped on the wafer.
Description of drawings
Fig. 1 is a kind of embodiment synoptic diagram of wet etching apparatus of the present invention;
Fig. 2 is the another kind of embodiment synoptic diagram of wet etching apparatus of the present invention;
Fig. 3 is a kind of embodiment schema of wet etch process of the present invention;
Fig. 4 is a kind of embodiment synoptic diagram of the pumping equipment of wet etching apparatus of the present invention.
Embodiment
Wet etching apparatus of the present invention and method are when finishing wet etching the etching solution of remnants to be discharged, thereby prevent owing to action of gravity makes remaining etching solution be dropped on the wafer.
Wet etching apparatus of the present invention and method are elaborated by preferred implementation, so that wet etch process of the present invention and device are clearer.
With reference to shown in Figure 1, comprise as the wet etching apparatus of one embodiment of the present invention,
Be used to supply the liquid feed device 10 of etching solution;
Be communicated with liquid feed device 10, be used to carry the transmission pipeline 14 of etching solution;
Be communicated with transmission pipeline 14, be used for the etching solution that transmission pipeline 14 is carried is sprayed on crystal column surface, carry out the releasing device 11 of wet etching;
Be communicated with transmission pipeline 14, be used to carry the Drainage pipe 16 of remaining etching solution;
Receive the remaining etching solution that Drainage pipe 16 is carried, and the pumping equipment 12 that remaining etching solution is discharged.
Described wet etching apparatus also comprises, on the transmission pipeline 14 between Drainage pipe 16 and the liquid feed device 10, is used for the first valve 11a that control transmission pipeline 14 opens or close.
Described wet etching apparatus also comprises, is positioned on the Drainage pipe 16, is used for controlling the second valve 12a that Drainage pipe 16 is opened or closed.
Described releasing device 11 comprises the motor (not shown), connect the suspension (not shown) of motor and be fixed in shower nozzle (not shown) on the suspension.Described shower nozzle is used for that the etching solution that transmission pipeline 14 is carried is sprayed on crystal column surface and carries out wet etching.Described motor rotation and drive shower nozzle rotation on suspension and the suspension makes the etching solution that shower nozzle sprayed can cover crystal column surface.
Described pumping equipment 12 can be an air pump, the remaining etching solution that described air pump extracts in the transmission pipeline 14 by Drainage pipe 16, and with remaining etching solution discharge.
Described pumping equipment 12 can also be the flow type suction pump, and described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.Described " T " font pipeline links to each other with Drainage pipe 16.Described flow type suction pump passes through the mobile generation suction of the tap water in " T " font pipeline, thereby passes through the remaining etching solution that Drainage pipe 16 extracts in the transmission pipelines 14, and remaining etching solution is discharged with the tap water in " T " font pipeline.
Link to each other by welding or riveted way between described liquid feed device 10, transmission pipeline 14 and the releasing device 11.
Link to each other by welding or riveted way between described transmission pipeline 14, Drainage pipe 16 and the pumping equipment 12.
Described Drainage pipe 16 can for following any: the independent tubes that is independent of pumping equipment 12 and transmission pipeline 14; Solidify on pumping equipment 12, as with the pipeline of the connecting path of transmission pipeline 14; Solidify on transmission pipeline 14, as with the pipeline of the connecting path of pumping equipment 12.
Described pumping equipment 12 is discharged the remaining etching solution in the transmission pipeline 14 after wet etching is finished.
With reference to shown in Figure 2, comprise as the wet etching apparatus of another embodiment of the invention,
Be used to supply the liquid feed device 10 of etching solution;
Be communicated with liquid feed device 10, be used to carry the transmission pipeline 14 of etching solution;
Be communicated with transmission pipeline 14, be used for the etching solution that transmission pipeline 14 is carried is sprayed on crystal column surface, carry out the releasing device 11 of wet etching;
Be communicated with transmission pipeline 14, be used to carry the Drainage pipe 16 of remaining etching solution;
Receive the remaining etching solution that Drainage pipe 16 is carried, and the pumping equipment 12 that remaining etching solution is discharged;
Be communicated with the transmission pipeline 14 between Drainage pipe 16 and the liquid feed device 10, the first recovery channel 15a that reclaims in order to the etching solution that liquid feed device 10 is provided;
Receive the recovery etching solution that the first recovery channel 15a carries, and will reclaim the retrieving arrangement 13 of etching solution output;
The recovery etching solution of retrieving arrangement 13 outputs is delivered to the second recovery channel 15b of liquid feed device 10.
Described wet etching apparatus also comprises, on the transmission pipeline 14 between the Drainage pipe 16 and the first recovery channel 15a, is used for the first valve 11a that control transmission pipeline 14 opens or close.
Described wet etching apparatus also comprises, is positioned on the Drainage pipe 16, is used for controlling the second valve 12a that Drainage pipe 16 is opened or closed.
Described wet etching apparatus also comprises, is positioned to be used for controlling the 3rd valve 13a that the first recovery channel 15a opens or closes on the first recovery channel 15a.
Described releasing device 11 comprises the motor (not shown), connect the suspension (not shown) of motor and be fixed in shower nozzle (not shown) on the suspension.Described shower nozzle is used for that the etching solution that transmission pipeline 14 is carried is sprayed on crystal column surface and carries out wet etching.Described motor rotation and drive shower nozzle rotation on suspension and the suspension makes the etching solution that shower nozzle sprayed can cover crystal column surface.
Described pumping equipment 12 can be an air pump, the remaining etching solution that described air pump extracts in the transmission pipeline 14 by Drainage pipe 16, and with remaining etching solution discharge.
Described pumping equipment 12 can also be the flow type suction pump, and described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.Described " T " font pipeline links to each other with Drainage pipe 16.Described flow type suction pump passes through the mobile generation suction of the tap water in " T " font pipeline, thereby passes through the remaining etching solution that Drainage pipe 16 extracts in the transmission pipelines 14, and remaining etching solution is discharged with the tap water in " T " font pipeline.
Link to each other by welding or riveted way between described liquid feed device 10, transmission pipeline 14 and the releasing device 11.
Link to each other by welding or riveted way between described transmission pipeline 14, Drainage pipe 16 and the pumping equipment 12.
Described Drainage pipe 16 can for following any: the independent tubes that is independent of pumping equipment 12 and transmission pipeline 14; Solidify on pumping equipment 12, as with the pipeline of the connecting path of transmission pipeline 14; Solidify on transmission pipeline 14, as with the pipeline of the connecting path of pumping equipment 12.
Described pumping equipment 12 is discharged the remaining etching solution in the transmission pipeline 14 after wet etching is finished.
Described retrieving arrangement 13 can be an air pump, and described air pump extracts the etching solution that feeding mechanism 10 is delivered to transmission pipeline 14 by the first recovery channel 15a, and flows to liquid feed device 10 again by the second recovery channel 15b.
Described retrieving arrangement 13 extracts the etching solution that feeding mechanism 10 is delivered to transmission pipeline 14 by the first recovery channel 15a after wet etching is finished, and flows to liquid feed device 10 again by the second recovery channel 15b.
Link to each other by welding or riveted way between described transmission pipeline 14, the first recovery channel 15a, retrieving arrangement 13, the second recovery channel 15b and the liquid feed device 10.
With reference to shown in Figure 3, embodiment of the invention wet etch process comprises,
Step s1 provides etching solution;
Step s2 receives etching solution wafer is carried out wet etching;
Step s3, finish wet etching after, remaining etching solution is discharged.
Described remaining etching solution is discharged by pumping equipment.
Described pumping equipment can be an air pump, and described air pump passes through to extract remaining etching solution, and remaining etching solution is discharged.
Described pumping equipment can also be the flow type suction pump, and described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.Described flow type suction pump extracts remaining etching solution by the mobile generation suction of the tap water in " T " font pipeline, and remaining etching solution is discharged.
Be described in detail below in conjunction with the process of accompanying drawing for wet etching.
In conjunction with Fig. 3 and Fig. 1, provide etching solution.When beginning was carried out wet etching for wafer, liquid feed device 10 was opened to transmission pipeline 14 supply etching solutions.The wet etching apparatus of the embodiment of the invention can be applicable to adopt the wet etching of single etching solution, also can be applied to adopt the number of chemical reagent mix to form the wet etching of etching solution.Therefore, the liquid feed device 10 of the embodiment of the invention can only be communicated with single transmission pipeline 14 and to transmission pipeline 14 supply etching solutions, also can be communicated with many transmission pipelines 14 and supply the corresponding chemical reagent to each bar transmission pipeline 14 respectively.The material that described transmission pipeline 14 adopts should not react with etching solution, and described transmission pipeline 14 can adopt riveted joint, screw thread to screw or latch mode such as fix links to each other with liquid feed device 10.Described transmission pipeline 14 also can adopt the mode of welding to link to each other with liquid feed device 10.
In conjunction with Fig. 3 and Fig. 1, receive etching solution and carry out wet etching for wafer.Open behind transmission pipeline 14 supply etching solutions when liquid feed device 10, the first valve 11a also opens thereupon, makes etching solution flow to releasing device 11 by liquid feed device 10 through transmission pipeline 14.And this moment, the second valve 12a did not open, and therefore, etching solution can not flow to pumping equipment 12 via Drainage pipe 16 yet.
And releasing device 11 will be opened and etching solution is sprayed on crystal column surface and carry out wet etching behind the etching solution that receives transmission pipeline 14 conveyings.Described transmission pipeline 14 can adopt riveted joint, screw thread to screw or latch is fixing etc. that mode links to each other with releasing device 11.Described transmission pipeline 14 also can adopt the mode of welding to link to each other with releasing device 11.
To be applied to single etching solution is example, and then releasing device 11 comprises a shower nozzle that will disengage from the etching solution that transmission pipeline 14 receives, and by shower nozzle etching solution is sprayed on crystal column surface and carries out wet etching.To form etching solution be example and to be applied to the number of chemical reagent mix, then releasing device 11 comprises that one will form pre-mixing container and the shower nozzle that the etching solution the pre-mixing container is disengaged of etching solution from the number of chemical reagent mix that transmission pipeline 14 receives, and will mix etching solution by shower nozzle and be sprayed on crystal column surface and carry out wet etching.
And the shower nozzle of described releasing device 11 is installed on the suspension, and described suspension is connected with motor.Thereby suspension and the shower nozzle that is installed on the suspension can be by the motor driven rotary.When releasing device 11 is sprayed on crystal column surface when carrying out wet etching with etching solution, the shower nozzle that motor drives on suspension and the suspension rotates with certain angle, and the angle of motor rotation should be able to make the etching solution of shower nozzle ejection to be covered on the wafer equably.
Control for wet etch process in the present embodiment is controlled by timing device.Stored in the timing device and carried out the required time of wet etching, the required time of described wet etching determines according to etched thickness and etch-rate, and described etch-rate is exactly etched layer the thickness that etching solution institute can etch away in the unit time.Represent etch-rate with a, represent etched thickness, represent the time that described wet etching is required, then the required time of wet etching with t with s
Be that the required time of wet etching is exactly the ratio of etched thickness and etch-rate.
In conjunction with Fig. 3 and Fig. 1, stop to provide etching solution, and remaining etching solution is discharged.When wafer was carried out wet etching, timing device indication releasing device 11 was opened, and sprays etching solution to wafer, and begins the process timing to wet etching.
Described timing device indication releasing device 11 is opened and can be realized by following manner, is connected an electric switch between timing device and releasing device 11, controls the unlatching of releasing device 11 or closes by the closed and disconnected of described electric switch.When wafer is carried out wet etching, the timing device engage relay, then releasing device 11 is opened, and sprays etching solution to wafer and carry out wet etching.When timing time reaches the time of the wet etching that timing device stores, the timing device block system relay, then releasing device 11 is closed, stop to spray etching solution to wafer, thereby to the wet etch stop of wafer.Certainly, the method that timing device control releasing device is opened or closed is not limited in described, can also be by for example mode of instruction control, when wafer is carried out wet etching, timing device sends open command to releasing device 11, and beginning was sprayed etching solution to wafer after releasing device 11 received open command.And when timing time reached the time of the wet etching that timing device stores, timing device sent out codes to releasing device 11, after releasing device 11 receives out code, stopped to spray etching solution to wafer.
And this moment, timing device can indicate the first valve 11a to cut out by the method identical with above-mentioned timing device control releasing device 11 equally, stops liquid feed device 10 and carries etching solutions by transmission pipeline 14 to shower nozzle 11.Owing to have the transmission pipeline 14 of certain distance between the first valve 11a and the releasing device 11, therefore when the first valve 11a and releasing device 11 are all closed, the residual etching solution of meeting in the transmission pipeline 14 between the first valve 11a and releasing device 11, and along with the effect of gravity, residual etching solution can be dropped in crystal column surface by releasing device 11 gradually, thereby may continue to corrode crystal column surface.Because wet etching process is very high for the accuracy requirement of etched thickness, described situation will cause the downgrade of wet etching process, thereby influences the quality of the finished product.
Based on above-mentioned situation, be provided with pumping equipment 12 and Drainage pipe 16 in the present embodiment described residual etching solution is discharged.Described Drainage pipe 16 can for following any: the independent tubes that is independent of pumping equipment 12 and transmission pipeline 14; Solidify on pumping equipment 12, as with the pipeline of the connecting path of transmission pipeline 14; Solidify on transmission pipeline 14, as with the pipeline of the connecting path of pumping equipment 12.
After timing device indicates the first valve 11a to cut out, also can indicate the second valve 12a and pumping equipment 12 to open by the method identical with above-mentioned timing device control releasing device 11.Give an example as a kind of, described second valve 12a and pumping equipment 12 are closed the back at the first valve 11a and are opened for example 1 second, 1.2 seconds, 1.4 seconds, 1.6 seconds, 1.8 seconds, 2 seconds, 2.2 seconds, 2.4 seconds, 2.6 seconds, 2.8 seconds, 3 seconds etc. after 1 to 3 second.Certainly, the time that the second valve 12a and pumping equipment 12 are opened not is only to be confined to the described time, and it is late in the time that the first valve 11a closes as long as the second valve 12a and pumping equipment 12 are opened.
After the second valve 12a and pumping equipment 12 unlatchings, pumping equipment 12 is discharged the remaining etching solutions in the transmission pipeline 14 by Drainage pipe 16.The material of described Drainage pipe 16 also would not react with etching solution.Mode links to each other can to adopt riveted joint, screw thread to screw between described transmission pipeline 14, Drainage pipe 16 and the pumping equipment 12 or latch is fixing etc.Also can adopt the mode of welding to link to each other between described transmission pipeline 14, Drainage pipe 16 and the pumping equipment 12.After transmission pipeline 14 described herein is meant that the first valve 11a closes, that part of transmission pipeline 14 between the first valve 11a and the releasing device 11.Described pumping equipment 12 can be an air pump, also can be other devices that can be used for extracting liquid.
With pumping equipment 12 is that air pump is given an example, the transmission pipeline 14 interior remaining etching solutions that air pump passes through between Drainage pipe 16 extraction first valve 11a and the releasing device 11 are also discharged, and make that the transmission pipeline 14 interior no etching solutions between the releasing device 11 and the first valve 11a are residual.
And as a kind of better implement mode of the present invention, described pumping equipment can also be the flow type suction pump.With reference to shown in Figure 4, described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.Described flow type suction pump extracts remaining etching solution by the mobile generation suction of the tap water in " T " font pipeline, and remaining etching solution is discharged.
Below described flow type suction pump is elaborated, the vertical ducting 121 of described " T " font pipeline links to each other with Drainage pipe 16, and the horizontal pipe 120 of " T " font pipeline connects the device of supply tap water, the subnormal ambient that tap water produced by transmission in horizontal pipe 120, after the described first valve 11a closed, remaining etching solution sucking-off in that part of transmission pipeline 14 between the first valve 11a and the releasing device 11, and make remaining etching solution discharge via vertical ducting 121 and horizontal pipe 120 successively by Drainage pipe 16.The pressure of described supply tap water is more than or equal to 3.18MPa, for example 3.18MPa, 3.2MPa, 3.4MPa, 4MPa, 4.2MPa, 4.6MPa, 5MPa, 5.5MPa etc.Adopt the benefit of this kind pumping equipment to be described remaining etching solution when being discharged from, can not residue in the Drainage pipe 16 and be back to once more in the transmission pipeline 14 along with current.By pumping equipment 12 the remaining etching solution discharge in the transmission pipeline between the first valve 11a and the releasing device 11 14 is just avoided etching solution because action of gravity is dropped in crystal column surface by releasing device 11, promptly influenced wafer quality.
The process of the remaining etching solution of described discharge can be by after closing for the described first valve 11a, and the monitoring of that part of transmission pipeline 14 between the first valve 11a and the shower nozzle 11 realizes control.With above-mentioned flow type suction pump is example, and when finding to also have remaining etching solution for the monitoring of described transmission pipeline 14, the device continuous firing of then supplying tap water produces magnetism and extracts remaining etching solution, and remaining etching solution is discharged.And when finding not had remaining etching solution for the monitoring of described transmission pipeline 14, the device of supply tap water will be closed, and the process of then discharging remaining etching solution stops.
In addition, for liquid feed device 10, if etching solution or to be used for mixing the chemical reagent that forms etching solution oversize in the time that liquid feed device 10 is deposited, the quality that can influence etching solution or be used to mix the chemical reagent that forms etching solution, and then influence the quality of wet etching.Thereby the another kind of embodiment of wet etching apparatus of the present invention also has further improvement.
With reference to shown in Figure 2, the first recovery channel 15a that is communicated with transmission pipeline 14 and reclaims in order to the etching solution that liquid feed device 10 is provided is set in wet etching apparatus, receives the recovery etching solution that the first recovery channel 15a carries and the retrieving arrangement 13 that will reclaim etching solution output and the recovery etching solution that retrieving arrangement 13 is exported is delivered to the second recovery channel 15b of liquid feed device 10, and liquid feed device 10 is arranged to provide continuously etching solution.The material of the described first recovery channel 15a and the second recovery channel 15b should not react with etching solution yet.Can be between described transmission pipeline 14, the first recovery channel 15a, retrieving arrangement 13, the second recovery channel 15b and the liquid feed device 10 by riveted joint, screw thread screws or latch is fixing etc., and mode links to each other.Also can link to each other between described transmission pipeline 14, the first recovery channel 15a, retrieving arrangement 13, the second recovery channel 15b and the liquid feed device 10 by the mode of welding.
After timing device indicates the first valve 11a to cut out, also can indicate the 3rd valve 13a and retrieving arrangement 13 also to open by the method identical with above-mentioned timing device control releasing device 11 thereupon.Give an example as a kind of, described the 3rd valve 13a and retrieving arrangement 13 are closed the back at the first valve 11a and are opened for example 1 second, 1.2 seconds, 1.4 seconds, 1.6 seconds, 1.8 seconds, 2 seconds, 2.2 seconds, 2.4 seconds, 2.6 seconds, 2.8 seconds, 3 seconds etc. after 1 to 3 second.Certainly, the time that the 3rd valve 13a and retrieving arrangement 13 are opened not is only to be confined to the described time, and it is late in the time that the first valve 11a closes as long as the 3rd valve 13a and retrieving arrangement 13 are opened.
Described retrieving arrangement 13 is by being communicated with the first recovery channel 15a of transmission pipeline 14, after receiving the first valve 11a and closing, the etching solution that liquid feed device 10 provides to transmission pipeline 14, and the etching solution that reception obtains is transferred to liquid feed device 10 more again by the second recovery channel 15b.Thereby, after the first valve 11a closes, liquid feed device 10, transmission pipeline 14, the first recovery channel 15a, retrieving arrangement 13, the second recovery channel 15b have just formed the circle transmission pipeline of an etching solution, and etching solution just can keep its quality in circle transmission.
As one embodiment of the present invention, retrieving arrangement 13 can be an air pump.With the air pump is example, obtains the etching solution that liquid feed device 10 provides by extracting the first recovery channel 15a that is communicated with transmission pipeline 14, and by the second recovery channel 15b etching solution is transmitted back liquid feed device 10.
In sum, above-mentioned disclosed wet etching apparatus and method, are discharged transfer tube when wafer is finished wet etching by pumping equipment to interior remaining etching solution, thereby preventing influences wafer quality owing to action of gravity makes remaining etching solution be dropped on the wafer.
And above-mentioned disclosed wet etching apparatus and method also provide retrieving arrangement, make the etching solution circle transmission, thereby have guaranteed the quality of etching solution, have further guaranteed the quality of wet etching.
Though the present invention discloses as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art without departing from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.
Claims (14)
1. wet etching apparatus comprises:
Be used to supply the liquid feed device of etching solution;
The transmission pipeline that is communicated with liquid feed device,
It is characterized in that, also comprise, be communicated with the Drainage pipe that transmission pipeline is used to carry remaining etching solution, and receive the remaining etching solution of Drainage pipe conveying and the pumping equipment that remaining etching solution is discharged.
2. wet etching apparatus as claimed in claim 1 is characterized in that described pumping equipment is an air pump.
3. wet etching apparatus as claimed in claim 1 is characterized in that, described pumping equipment is the flow type suction pump, and described flow type suction pump comprises the device of supplying tap water, and " T " font pipeline that is communicated with the device of supply tap water.
4. wet etching apparatus as claimed in claim 1 is characterized in that, links to each other by welding or riveted way between described liquid feed device, transmission pipeline, Drainage pipe and the pumping equipment.
5. wet etching apparatus as claimed in claim 4, it is characterized in that, also comprise second recovery channel that is communicated with first recovery channel that transmission pipeline reclaims in order to the etching solution that liquid feed device is provided, receives the recovery etching solution that first recovery channel carries and the retrieving arrangement that will reclaim etching solution output and the recovery etching solution that retrieving arrangement is exported is delivered to liquid feed device.
6. wet etching apparatus as claimed in claim 5 is characterized in that, described transmission pipeline, first recovery channel, retrieving arrangement, second recovery channel and liquid feed device link to each other by welding or riveted way.
7. wet etching apparatus as claimed in claim 5 is characterized in that, also comprises, first valve that is used for the unlatching of control transmission pipeline or closes on the transmission pipeline between the Drainage pipe and first recovery channel.
8. wet etching apparatus as claimed in claim 5 is characterized in that, also comprises, is positioned to be used for controlling second valve that Drainage pipe is opened or closed on the Drainage pipe.
9. wet etching apparatus as claimed in claim 5 is characterized in that, also comprises, is positioned to be used for controlling the 3rd valve that first recovery channel is opened or closed on first recovery channel.
10. a wet etch process is characterized in that, comprise the following steps,
Etching solution is provided;
Receive etching solution wafer is carried out wet etching;
After finishing wet etching, remaining etching solution is discharged.
11. wet etch process as claimed in claim 10 is characterized in that, described remaining etching solution is discharged by pumping equipment.
12. wet etch process as claimed in claim 11 is characterized in that, described pumping equipment is an air pump.
13. wet etch process as claimed in claim 11 is characterized in that, described pumping equipment is the flow type suction pump.
14. wet etch process as claimed in claim 10 is characterized in that, also comprises, finishing wet method after the moment, reclaims the etching solution that is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100464881A CN101397667A (en) | 2007-09-26 | 2007-09-26 | Wet etching apparatus and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007100464881A CN101397667A (en) | 2007-09-26 | 2007-09-26 | Wet etching apparatus and method |
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| CN101397667A true CN101397667A (en) | 2009-04-01 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102212824A (en) * | 2010-04-09 | 2011-10-12 | 中国科学院微电子研究所 | Single-side silicon wafer wet etching equipment |
| CN103227234A (en) * | 2012-01-31 | 2013-07-31 | 张陆成 | Maskless local etching device, maskless local eteching method and maskless local eteching system |
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2007
- 2007-09-26 CN CNA2007100464881A patent/CN101397667A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102212824A (en) * | 2010-04-09 | 2011-10-12 | 中国科学院微电子研究所 | Single-side silicon wafer wet etching equipment |
| CN103227234A (en) * | 2012-01-31 | 2013-07-31 | 张陆成 | Maskless local etching device, maskless local eteching method and maskless local eteching system |
| CN103227234B (en) * | 2012-01-31 | 2016-06-22 | 张陆成 | The Etaching device of local without mask, method and system |
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