CN101373646A - Middle and low temperature curing conductive silver slurry - Google Patents
Middle and low temperature curing conductive silver slurry Download PDFInfo
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- CN101373646A CN101373646A CNA2008102316639A CN200810231663A CN101373646A CN 101373646 A CN101373646 A CN 101373646A CN A2008102316639 A CNA2008102316639 A CN A2008102316639A CN 200810231663 A CN200810231663 A CN 200810231663A CN 101373646 A CN101373646 A CN 101373646A
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Abstract
The invention relates to a middle and low temperature curing conductive silver paste. The conductive silver past (by mass percentage )contains 60 to 80 percent of silver powder, 1 to 10 percent of glass powder, 10 to 30 percent of organic solvent, 0.1 to 5 percent of macromolecule resin, and the remaining amount of additive. Compared with the prior art, the curing temperature is 300 to 400 DEG C, the conductive silver paste can be used as a plasma TV dielectric paste and a DBD plane light source paste. Since the curing temperature of the paste is lower, the quality of the product and the production efficiency can be improved.
Description
Technical field
The present invention relates to the electrocondution slurry of silk screen printing, especially a kind of electrocondution slurry of middle low-temperature setting.
Background technology
Flat florescent lamp in the flat panel display industry owing to realizing that advantages such as large tracts of land uniformly light-emitting, life-span be long, pollution-free enjoy attention.Simultaneously, flat florescent lamp can also be used as the general lighting light source, as ceiling light, pendent lamp and wall lamp etc., has decorative effect preferably.
In the application of flat florescent lamp, glass substrate is the most a kind of base material of normal use.According to different needs, often will be on glass substrate the printing conductive slurry to reach its technology purpose.Because the shape of required glass baseplate, thickness, material etc. are not quite similar, the segment glass base material is met high temperature softening, distortion is easily taken place, therefore if the temperature control of the drying and sintering process need after the temperature of high temperature slurry printing is had relatively high expectations in adopting, if the effect after bad meeting has influence on base material and slurry printing is adjusted in temperature control.And the silver paste that solidifies at low temperatures is low owing to its curing temperature, and for glass substrate, its cementability and adhesive force are strong inadequately again, influence its useful life.
Summary of the invention:
Purpose of the present invention be exactly in order to overcome above-mentioned silver paste because its curing temperature is low, and cementability and adhesive force are strong inadequately, useful life long and propose a kind of in the silver paste of low-temperature setting.This slurry reaches the identical effect of intermediate temperature setting slurry, can be used as plasm TV dielectric paste and DBD planar light source slurry system uses, because sintering temperature is lower, in the sintering process process, can avoid because the too high problems such as base plate deformation that cause of sintering temperature, in addition because the curing temperature of this slurry is lower, also can shorten the drying time in multi-sheet printed and dry run, to improve the efficient of production.
For achieving the above object, conductive silver paste of the present invention contains by mass percentage: 60～80% silver powder, 1～10% glass dust, 10～30% organic solvent, 0.1～5% macromolecule resin, surplus are additive.
Silver powder of the present invention is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is dichloroethanes, acetone, phenmethylol, butyl carbitol acetate, terpinol or diethylene glycol dimethyl ether; Additive is a phenolic resins, 2,4-methylimidazole, 2-phenyl-4-methylimidazole, HHPA, chlorendic anhydride, inner methylidyne tetrahydric phthalic anhydride, m-phenylene diamine (MPD), 4, the mixture of one or more arbitrary proportions among 4 '-diamino-diphenyl sulfone, metatitanic acid three isopropyl alcohol tertiary amine esters, the F-51A.
The present invention compared with prior art, its curing temperature is 300-400 ℃, can be used as plasm TV dielectric paste and DBD planar light source slurry system uses, because sintering temperature is lower, in the sintering process process, can avoid because the too high problems such as base plate deformation that cause of sintering temperature, simultaneously because the curing temperature of this slurry is lower, also can shorten the drying time in multi-sheet printed and dry run, to improve the efficient of production, slurry of the present invention has reached the identical technique effect of intermediate temperature setting slurry.
Embodiment
Embodiment 1: conductive silver paste of the present invention contains by mass percentage: 60% silver powder, 8% glass dust, 30% organic solvent, 0.1% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is a dichloroethanes; Additive is phenolic resins PF-213.
Embodiment 2: conductive silver paste of the present invention contains by mass percentage: 70% silver powder, 5% glass dust, 20% organic solvent, 1% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is an acetone; Additive is 2, the 4-methylimidazole.
Embodiment 3: conductive silver paste of the present invention contains by mass percentage: 68% silver powder, 3% glass dust, 15% organic solvent, 5% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is a phenmethylol; Additive is a HHPA.
Embodiment 4: conductive silver paste of the present invention contains by mass percentage: 76% silver powder, 6% glass dust, 10% organic solvent, 3% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is the butyl carbitol acetate; Additive is a m-phenylene diamine (MPD).
Embodiment 5: conductive silver paste of the present invention contains by mass percentage: 65% silver powder, 10% glass dust, 23% organic solvent, 0.5% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is a terpinol; Additive is that high temperature resistant curing agent is F-51A.
Embodiment 6: conductive silver paste of the present invention contains by mass percentage: 73% silver powder, 2% glass dust, 12% organic solvent, 4% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is a diethylene glycol dimethyl ether; Additive is phenolic resins PF-213 and 2, the mixture of 4-methylimidazole.
Embodiment 7: conductive silver paste of the present invention contains by mass percentage: 80% silver powder, 1% glass dust, 11% organic solvent, 2% macromolecule resin, surplus are additive; Wherein macromolecule resin is bisphenol A type epoxy resin E51, and silver powder is spherical silver powder, and this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml; Glass dust is glass powder with low melting point, and its softening point is 300 ℃, and fusing point is 340 ℃; Organic solvent is an acetone; Additive is the mixture of 2-phenyl-4-methylimidazole, HHPA, chlorendic anhydride and metatitanic acid three isopropyl alcohol tertiary amine esters.
Conductive silver paste of the present invention can adopt the method for silk screen printing that it is printed on the glass substrate, and having lower curing temperature and cementability will good conductive silver paste than general low-temperature solidified silver paste.Its preparation method is: at first additive is put into pulverizer and pulverize, particle after will pulverizing again joins in the organic solvent, 50～70 ℃ of stirrings, until forming homogeneous liquid, at last silver powder is added in the liquid, be stirred to silver powder and liquid mixes with planetary mixer.Again mixture is ground 3-5 time with three-roll grinder, finally obtain conductive silver paste.
Claims (5)
1. low-temperature cured conductive silver paste in a kind, it is characterized in that this conductive silver paste contains by mass percentage: 60～80% silver powder, 1～10% glass dust, 10～30% organic solvent, 0.1～5% macromolecule resin, surplus are additive.
2. according to the described middle low-temperature cured conductive silver paste of claim 1, it is characterized in that described silver powder is spherical silver powder, this silver powder particles diameter is 1～10 μ, and tap density is 2.0～2.5g/ml.
3. according to the described middle low-temperature cured conductive silver paste of claim 1, it is characterized in that described glass dust is glass powder with low melting point, its softening point is 300 ℃, and fusing point is 340 ℃.
4. according to the described middle low-temperature cured conductive silver paste of claim 1, it is characterized in that described organic solvent is dichloroethanes, acetone, phenmethylol, butyl carbitol acetate, terpinol or diethylene glycol dimethyl ether.
5. according to the described middle low-temperature cured conductive silver paste of claim 1, it is characterized in that, described additive is a phenolic resins, 2,4-methylimidazole, 2-phenyl-4-methylimidazole, HHPA, chlorendic anhydride, inner methylidyne tetrahydric phthalic anhydride, m-phenylene diamine (MPD), 4, the mixture of one or more arbitrary proportions among 4 '-diamino-diphenyl sulfone, metatitanic acid three isopropyl alcohol tertiary amine esters, the F-51A.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102316639A CN101373646A (en) | 2008-10-09 | 2008-10-09 | Middle and low temperature curing conductive silver slurry |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102316639A CN101373646A (en) | 2008-10-09 | 2008-10-09 | Middle and low temperature curing conductive silver slurry |
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| CN101373646A true CN101373646A (en) | 2009-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008102316639A Pending CN101373646A (en) | 2008-10-09 | 2008-10-09 | Middle and low temperature curing conductive silver slurry |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872652A (en) * | 2010-05-26 | 2010-10-27 | 广东风华高新科技股份有限公司 | Lead-free soldering-resistant full-silver conductive paste |
| CN101937737A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN101950595A (en) * | 2010-09-27 | 2011-01-19 | 彩虹集团公司 | Low-temperature cured conductive paste with ultra-low silver content and preparation method thereof |
| CN102361152A (en) * | 2011-09-08 | 2012-02-22 | 苏州市新诚氏电子有限公司 | New production process of end electrode conduction |
| CN102054881B (en) * | 2009-10-29 | 2012-07-18 | 上海宝银电子材料有限公司 | Solderable conductive silver paste with low-temperature back of crystalline silicon solar cell and preparation method |
| CN102903418A (en) * | 2011-07-29 | 2013-01-30 | 硕禾电子材料股份有限公司 | Conductive composition |
| CN103021570A (en) * | 2012-12-18 | 2013-04-03 | 安徽金大仪器有限公司 | Method for preparing conductive paste containing rosin resin |
| CN103117105A (en) * | 2012-12-07 | 2013-05-22 | 蚌埠市智峰科技有限公司 | Electric conduction paste |
| CN103117104A (en) * | 2012-12-07 | 2013-05-22 | 蚌埠市智峰科技有限公司 | Solar cell conductive paste containing phthalic acid ester |
| CN103165216A (en) * | 2011-12-14 | 2013-06-19 | 上海宝银电子材料有限公司 | Silver paste for antenna and preparation method thereof |
| CN104332214A (en) * | 2014-10-28 | 2015-02-04 | 深圳市思迈科新材料有限公司 | Low-temperature curing conductive silver paste and preparation method thereof |
| CN104332214B (en) * | 2014-10-28 | 2017-01-04 | 深圳市思迈科新材料有限公司 | A kind of low-temperature cured conductive silver slurry and preparation method thereof |
| CN107234366A (en) * | 2017-06-16 | 2017-10-10 | 深圳市赛雅电子浆料有限公司 | One kind welds silver paste and its preparation technology and applies welding procedure |
| CN107705877A (en) * | 2017-09-19 | 2018-02-16 | 合肥惠科金扬科技有限公司 | A kind of AMOLED display screens electrode slurry |
-
2008
- 2008-10-09 CN CNA2008102316639A patent/CN101373646A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054881B (en) * | 2009-10-29 | 2012-07-18 | 上海宝银电子材料有限公司 | Solderable conductive silver paste with low-temperature back of crystalline silicon solar cell and preparation method |
| CN101872652A (en) * | 2010-05-26 | 2010-10-27 | 广东风华高新科技股份有限公司 | Lead-free soldering-resistant full-silver conductive paste |
| CN101937737A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN101950595A (en) * | 2010-09-27 | 2011-01-19 | 彩虹集团公司 | Low-temperature cured conductive paste with ultra-low silver content and preparation method thereof |
| CN101937737B (en) * | 2010-09-27 | 2012-01-04 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN102903418A (en) * | 2011-07-29 | 2013-01-30 | 硕禾电子材料股份有限公司 | Conductive composition |
| CN102903418B (en) * | 2011-07-29 | 2018-02-27 | 硕禾电子材料股份有限公司 | Electrode formed from sintered conductive composition and related solar cell |
| CN102361152A (en) * | 2011-09-08 | 2012-02-22 | 苏州市新诚氏电子有限公司 | New production process of end electrode conduction |
| CN103165216A (en) * | 2011-12-14 | 2013-06-19 | 上海宝银电子材料有限公司 | Silver paste for antenna and preparation method thereof |
| CN103117105A (en) * | 2012-12-07 | 2013-05-22 | 蚌埠市智峰科技有限公司 | Electric conduction paste |
| CN103117104A (en) * | 2012-12-07 | 2013-05-22 | 蚌埠市智峰科技有限公司 | Solar cell conductive paste containing phthalic acid ester |
| CN103117104B (en) * | 2012-12-07 | 2016-05-11 | 蚌埠市智峰科技有限公司 | A kind of solar cell conductive paste that contains phthalic acid ester |
| CN103117105B (en) * | 2012-12-07 | 2016-08-03 | 蚌埠市智峰科技有限公司 | A kind of electrocondution slurry |
| CN103021570A (en) * | 2012-12-18 | 2013-04-03 | 安徽金大仪器有限公司 | Method for preparing conductive paste containing rosin resin |
| CN104332214A (en) * | 2014-10-28 | 2015-02-04 | 深圳市思迈科新材料有限公司 | Low-temperature curing conductive silver paste and preparation method thereof |
| CN104332214B (en) * | 2014-10-28 | 2017-01-04 | 深圳市思迈科新材料有限公司 | A kind of low-temperature cured conductive silver slurry and preparation method thereof |
| CN107234366A (en) * | 2017-06-16 | 2017-10-10 | 深圳市赛雅电子浆料有限公司 | One kind welds silver paste and its preparation technology and applies welding procedure |
| CN107705877A (en) * | 2017-09-19 | 2018-02-16 | 合肥惠科金扬科技有限公司 | A kind of AMOLED display screens electrode slurry |
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Open date: 20090225 |