CN104332214B - A kind of low-temperature cured conductive silver slurry and preparation method thereof - Google Patents
A kind of low-temperature cured conductive silver slurry and preparation method thereof Download PDFInfo
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- CN104332214B CN104332214B CN201410587410.0A CN201410587410A CN104332214B CN 104332214 B CN104332214 B CN 104332214B CN 201410587410 A CN201410587410 A CN 201410587410A CN 104332214 B CN104332214 B CN 104332214B
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- conductive silver
- low
- temperature cured
- cured conductive
- epoxy resin
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- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 70
- 239000004332 silver Substances 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title description 9
- 238000007613 slurry method Methods 0.000 title description 3
- 239000002002 slurry Substances 0.000 claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 31
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 31
- 238000003756 stirring Methods 0.000 claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000006185 dispersion Substances 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N Isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 13
- 150000002513 isocyanates Chemical class 0.000 claims description 12
- 229920005749 polyurethane resin Polymers 0.000 claims description 12
- 238000004321 preservation Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- QGBSISYHAICWAH-UHFFFAOYSA-N cyanoguanidine Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 8
- -1 ethanedioic acid ethyl ether acetate ester Chemical class 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- XHEDLZYGAQSNTR-UHFFFAOYSA-N ethene;hexanedioic acid Chemical compound C=C.C=C.OC(=O)CCCCC(O)=O XHEDLZYGAQSNTR-UHFFFAOYSA-N 0.000 claims description 7
- 150000002460 imidazoles Chemical class 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 229920002456 HOTAIR Polymers 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000004848 polyfunctional curative Substances 0.000 claims description 5
- 239000003208 petroleum Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 14
- 230000001070 adhesive Effects 0.000 abstract description 14
- 229920002521 Macromolecule Polymers 0.000 abstract description 10
- 239000000969 carrier Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- OHBRHBQMHLEELN-UHFFFAOYSA-N acetic acid;1-butoxybutane Chemical compound CC(O)=O.CCCCOCCCC OHBRHBQMHLEELN-UHFFFAOYSA-N 0.000 description 6
- 238000007711 solidification Methods 0.000 description 5
- KVXNKFYSHAUJIA-UHFFFAOYSA-N acetic acid;ethoxyethane Chemical compound CC(O)=O.CCOCC KVXNKFYSHAUJIA-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920002472 Starch Polymers 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000006838 isophorone group Chemical group 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
A kind of low-temperature cured conductive silver is starched, and this conductive silver paste is made up of the component of following mass percentage content: argentum powder: 60～80；Macromolecule resin carrier: 5～20；Epoxy resin oligomer: 5～20；Solvent: 5～10；Firming agent: 0.1～5.A kind of method preparing conductive silver paste, comprises the following steps: first prepares performed polymer, then prepares dispersion, prepares presoma afterwards, be eventually adding argentum powder in stirring box in, after mixing, through grinding, filter, i.e. obtain conductive silver paste.The low-temperature cured conductive silver slurry slurry of the present invention can reach low-temperature setting effect, and specifically adhesive force and the performance of hardness excellence.
Description
Technical field
The present invention relates to a kind of low-temperature cured conductive paste and preparation method thereof.
Background technology
At present, the development that electronics industry is being advanced by leaps and bounds, and conductive silver paste is the critical function preparing electronic devices and components
Material, current electrocondution slurry is broadly divided into thin film switch, capacitance plate, touch screens, solar energy slurry.It is divided into again according to condition of cure
Low-temperature solidified silver paste, intermediate temperature setting silver slurry, high-temperature sintered silver paste, conductive silver paste for touch screens is mainly low-temperature solidified silver paste.Low
Temperature solidification silver slurry first has to meet low temperature and can solidify, and after solidification, electric conductivity, adhesive force, hardness, environmental stability meet
Requirement.
At present touch screen low-temperature solidified silver paste mostly is imported product, domestic in preparation electric conductivity, adhesive force, hardness etc. all
Meet the silver-colored slurry aspect required to be short of.Therefore, high conductivity, adhesive force and hardness the most excellent, can continuous printing
The research and development of low-temperature solidified silver paste cause extensive concern in the industry.
Summary of the invention
The technical problem to be solved in the present invention is, not enough for conductive silver paste adhesive force of the prior art and hardness
Defect, it is provided that a kind of low-temperature cured conductive silver slurry.
The technical solution adopted for the present invention to solve the technical problems is: a kind of low-temperature cured conductive of structure
Silver is starched, and this conductive silver paste is made up of the component of following mass percentage content:
Argentum powder: 60～80；
Macromolecule resin carrier: 5～20；
Epoxy resin oligomer: 5～20；
Solvent: 5～10；
Firming agent: 0.1～5.
In low-temperature cured conductive silver of the present invention is starched, this conductive silver paste is by following percent mass
Make than the component of content:
Argentum powder: 65～75；
Macromolecule resin carrier: 10～15；
Epoxy resin oligomer: 10～15；
Solvent: 6～8；
Firming agent: 1～3.
In low-temperature cured conductive silver of the present invention is starched, this conductive silver paste is by following percent mass
Make than the component of content:
Argentum powder: 70；
Macromolecule resin carrier: 10；
Epoxy resin oligomer: 11；
Solvent: 7；
Firming agent: 2.
In low-temperature cured conductive silver of the present invention is starched, the mean diameter of described argentum powder is 1.0～5.0 microns, than
Surface area is 1.0～2.2 meters squared per gram, and the purity of argentum powder is more than 99.95%.
In low-temperature cured conductive silver of the present invention is starched, described macromolecule resin carrier is high molecular polyurethane tree
Fat, its molecular weight is more than 100000, and its glass transition temperature is more than 50 DEG C.
In low-temperature cured conductive silver of the present invention is starched, described solvent is high boiling solvent, and it is isophorone, stone
In cerebrol, two ethanedioic acid ethyl ether acetate esters, diethylene adipate, ethanedioic acid ethyl ether acetate ester, ethanedioic acid monobutyl ether acetate, DBE
One.
Low-temperature cured conductive silver of the present invention starch in, described firming agent is epoxy hardener, its be isocyanates,
One in imidazoles, dicyandiamide.
Another technical problem that the invention solves the problems that is, for conductive silver paste adhesive force of the prior art and hardness not
The defect of foot, it is provided that a kind of method preparing low-temperature cured conductive silver slurry.
The present invention solves its another technical problem and be the technical scheme is that structure one prepares low-temperature cured conductive silver
The method of slurry, it is characterised in that comprise the following steps:
Each component of conductive silver paste as described in claims 1 to 3 weighs；First prepare performed polymer:
S1 is sequentially added into epoxy resin and firming agent in stirring box, stirs 1 minute with stirring deaeration machine, then deaeration 1
After minute；It is added thereto to isocyanates again, is again stirring for 1 minute, after deaeration 1 minute, gained mixture is transferred to three mouthfuls
In flask；
S2 puts in hot-air oven after being sealed by above-mentioned there-necked flask, takes out after completion of the reaction, the epoxy oligomer that will obtain
Thing is put into 5～10 DEG C of cold preservations in refrigerator after being transferred in sample bottle seal and is deposited, standby.
Of the present invention prepare low-temperature cured conductive silver slurry method in, also include prepare dispersion step:
S3, by adding solvent in flask, adds macromolecule resin granule, stirs after within 4 hours, being completely dispersed to resin,
And taking-up is transferred in described sample bottle, in the airtight preservation of room temperature, standby；
In the method preparing low-temperature cured conductive silver slurry of the present invention, also include the step preparing presoma:
S4 takes described dispersion and described epoxy oligomer in stirring box, and adds catalyst, stirs 1 minute, then take off
Steep 1 minute, obtain presoma, deposit in 5～10 DEG C of cold preservations, standby；
S5 takes above-mentioned presoma, and adds argentum powder in described stirring box, after mixing, through grinding, filters, is i.e. weighed
Profit requires the conductive silver paste described in 1～3.
The low-temperature cured conductive silver slurry slurry of the present invention can reach low-temperature setting effect, and adhesive force and hardness excellent
Different.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with embodiment, to the present invention
It is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to
Limit the present invention.
Embodiment 1
Argentum powder: apparent density 0.8-1.7g/ml；Tap density 2.5-3.5g/ml, mean diameter is 1.0-4.0um；Compare table
Area is less than 2m2/g；Burn out rate (550 DEG C, 0.5h) is less than 1%；Silver purity more than 99.95%.
Epoxy resin oligomer: mainly comprise isocyanates 15-25%, imidazoles epoxy hardener 0.5-5%, epoxy resin
70-80%, prepares at 70-120 DEG C of reaction 0.5-4h after three's mixing, and described epoxy resin oligomer accounts for the weight of silver slurry system
Amount percentage ratio is 25-35%.
Solvent: isophorone, Petroleum, two ethanedioic acid ethyl ether acetate esters, diethylene adipate, ethanedioic acid ethyl ether acetate
One in ester, ethanedioic acid monobutyl ether acetate, DBE, in silver slurry system, weight ratio is 5-10%.
Firming agent: for the one in isocyanates, imidazoles, dicyandiamide, percentage by weight is the 0.1-5% of system.
Macromolecule resin carrier is the mechanical performance that high molecular polyurethane resin has excellence, and molecular weight is more than 100000,
Glass transition temperature > 50 DEG C, mass ratio is 5-10%.
Weigh argentum powder 259g, isophorone 40g, epoxy resin oligomer 25g, isocyanates 0.3g, high-molecular-weight poly ammonia
Ester resin 15g.
Prepare performed polymer:
S1 is sequentially added into epoxy resin oligomer 25g and catalyst in stirring box, stirs deaeration machine with Thinky() stir
Mix 1 minute, then after deaeration 1 minute；It is added thereto to isocyanates 0.3g again, is again stirring for 1 minute, after deaeration 1 minute, by institute
Obtain mixture to be transferred in there-necked flask；
S2 puts in hot-air oven after being sealed by above-mentioned there-necked flask, takes out after completion of the reaction, the epoxy resin that will obtain
Oligomer is put into 5-10 DEG C of cold preservation in refrigerator after being transferred in sample bottle seal and is deposited, standby；
Preparation dispersion:
S3 by flask add isophorone 40g, add high molecular polyurethane resin particle 15g, stir 4 little
Time, take out after being completely dispersed to resin and be transferred in sample bottle, the airtight preservation of room temperature, standby；
Prepare presoma:
S4 takes the above-mentioned dispersion prepared and epoxy oligomer in stirring box, and adds catalyst, stirs 1 minute,
Again after deaeration 1 minute, obtain presoma, deposit in 5-10 DEG C of cold preservation, standby；
Preparation silver slurry:
Take above-mentioned presoma, and add 259g argentum powder in stirring box, after mixing, grind, filter, i.e. obtain conductive silver
Slurry.
The conductive silver paste prepared according to the present embodiment 1, its performance is as follows:
Solidification temperature: 130 DEG C, 1h,
Resistivity≤7*10-5 Ω .cm,
Adhesive force: 5B is without coming off；
Hardness: H
Constant temperature and humidity test: 85 DEG C of 80% humidity repetition measurement adhesive force 5B without coming off, hardness H, change in resistance < 15%.
Embodiment 2
Argentum powder: apparent density 0.8-1.7g/ml；Tap density 2.5-3.5g/ml, mean diameter is 1.0-4.0um；Compare table
Area is less than 2m2/g；Burn out rate (550 DEG C, 0.5h) is less than 1%；Silver purity more than 99.95%.
Epoxy resin oligomer: mainly comprise isocyanates 15-25%, imidazoles epoxy hardener 0.5-5%, epoxy resin
70-80%, prepares at 70-120 DEG C of reaction 0.5-4h after three's mixing, and described epoxy resin oligomer accounts for the weight of silver slurry system
Amount percentage ratio is 25-35%.
Solvent: isophorone, Petroleum, two ethanedioic acid ethyl ether acetate esters, diethylene adipate, ethanedioic acid ethyl ether acetate
One in ester, ethanedioic acid monobutyl ether acetate, DBE, in silver slurry system, weight ratio is 5-10%.
Firming agent: for the one in isocyanates, imidazoles, dicyandiamide, percentage by weight is the 0.1-5% of system.
Macromolecule resin carrier is the mechanical performance that high molecular polyurethane resin has excellence, and molecular weight is more than 100000,
Glass transition temperature > 50 DEG C, mass ratio is 5-10%.
Weigh argentum powder 259g, ethanedioic acid monobutyl ether acetate 45g, epoxy resin oligomer 30g, dicyandiamide 0.3g, macromolecule
Weight polyurethane resin 15g.
Prepare performed polymer:
S1 is sequentially added into epoxy resin oligomer 30g and catalyst in stirring box, stirs deaeration machine with Thinky() stir
Mix 1 minute, then after deaeration 1 minute；It is added thereto to dicyandiamide 0.3g again, is again stirring for 1 minute, after deaeration 1 minute, by gained
Mixture is transferred in there-necked flask；
S2 puts in hot-air oven after being sealed by above-mentioned there-necked flask, takes out after completion of the reaction, the epoxy resin that will obtain
Oligomer is put into 5-10 DEG C of cold preservation in refrigerator after being transferred in sample bottle seal and is deposited, standby；
Preparation dispersion:
S3, by adding ethanedioic acid monobutyl ether acetate 45g in flask, adds high molecular polyurethane resin particle 15g, stirs
Mix 4 hours, take out after being completely dispersed to resin and be transferred in sample bottle, the airtight preservation of room temperature, standby；
Prepare presoma:
S4 takes the above-mentioned dispersion prepared and epoxy resin oligomer in stirring box, and adds catalyst, stirs 1 point
After clock, then deaeration 1 minute, obtain presoma, deposit in 5-10 DEG C of cold preservation, standby；
Preparation silver slurry:
Take above-mentioned presoma, and add 259g argentum powder in stirring box, after mixing, grind, filter, i.e. obtain conductive silver
Slurry.
The conductive silver paste prepared according to the present embodiment 2, its performance is as follows:
Solidification temperature: 130 DEG C, 1h,
Resistivity≤7*10-5 Ω .cm,
Adhesive force: 5B is without coming off；
Hardness: H
Constant temperature and humidity test: 85 DEG C of 80% humidity repetition measurement adhesive force 5B without coming off, hardness H, change in resistance < 15%.
Embodiment 3
Argentum powder: apparent density 0.8-1.7g/ml；Tap density 2.5-3.5g/ml, mean diameter is 1.0-4.0um；Compare table
Area is less than 2m2/g；Burn out rate (550 DEG C, 0.5h) is less than 1%；Silver purity more than 99.95%.
Epoxy resin oligomer: mainly comprise isocyanates 15-25%, imidazoles epoxy hardener 0.5-5%, epoxy resin
70-80%, prepares at 70-120 DEG C of reaction 0.5-4h after three's mixing, and described epoxy resin oligomer accounts for the weight of silver slurry system
Amount percentage ratio is 25-35%.
Solvent: isophorone, Petroleum, two ethanedioic acid ethyl ether acetate esters, diethylene adipate, ethanedioic acid ethyl ether acetate
One in ester, ethanedioic acid monobutyl ether acetate, DBE, in silver slurry system, weight ratio is 5-10%.
Firming agent: for the one in isocyanates, imidazoles, dicyandiamide, percentage by weight is the 0.1-5% of system.
Macromolecule resin carrier is the mechanical performance that high molecular polyurethane resin has excellence, and molecular weight is more than 100000,
Glass transition temperature > 50 DEG C, mass ratio is 5-10%.
Weigh argentum powder 259g, diethylene adipate 35g, epoxy resin oligomer 30g, imidazoles 0.3g, high-molecular-weight poly ammonia
Ester resin 16g.
Prepare performed polymer:
S1 is sequentially added into epoxy resin oligomer 30g and catalyst in stirring box, stirs deaeration machine with Thinky() stir
Mix 1 minute, then after deaeration 1 minute；It is added thereto to imidazoles 0.3g again, is again stirring for 1 minute, after deaeration 1 minute, gained is mixed
Compound is transferred in there-necked flask；
S2 puts in hot-air oven after being sealed by above-mentioned there-necked flask, takes out after completion of the reaction, the epoxy resin that will obtain
Oligomer is put into 5-10 DEG C of cold preservation in refrigerator after being transferred in sample bottle seal and is deposited, standby；
Preparation dispersion:
S3, by adding diethylene adipate 35g in flask, adds high molecular polyurethane resin particle 16g, stirs 4
Hour, take out after being completely dispersed to resin and be transferred in sample bottle, the airtight preservation of room temperature, standby；
Prepare presoma:
S4 takes the above-mentioned dispersion prepared and epoxy resin oligomer in stirring box, and adds catalyst, stirs 1 point
After clock, then deaeration 1 minute, obtain presoma, deposit in 5-10 DEG C of cold preservation, standby；
Prepare conductive silver paste:
Take above-mentioned presoma, and add 259g argentum powder in stirring box, after mixing, grind, filter, i.e. obtain conductive silver
Slurry.
The conductive silver paste prepared according to the present embodiment 3, its performance is as follows:
Solidification temperature: 130 DEG C, 1h,
Resistivity≤7*10-5 Ω .cm,
Adhesive force: 5B is without coming off；
Hardness: H
Constant temperature and humidity test: 85 DEG C of 80% humidity repetition measurement adhesive force 5B without coming off, hardness H, change in resistance < 15%.
The low-temperature cured conductive silver slurry of the present invention can reach low-temperature setting effect, and adhesive force and hardness excellent.
Although being disclosed the present invention by above example, but protection scope of the present invention is not limited thereto,
Under conditions of without departing from present inventive concept, the deformation of being done above each component, replacement etc. all will fall into the right of the present invention
In claimed range.
Claims (10)
1. a low-temperature cured conductive silver slurry, it is characterised in that this conductive silver paste is by following quality hundred
The component of proportion by subtraction content is made:
Argentum powder: 60～80；
High molecular polyurethane resin: 5～20；
Epoxy resin oligomer: 5～20；
Solvent: 5～10；
Firming agent: 0.1～5；
Wherein, described epoxy resin oligomer mainly comprises isocyanates 15-25%, imidazoles epoxy hardener 0.5-5%, epoxy
Resin 70-80%, prepares at 70-120 DEG C of reaction 0.5-4h after three's mixing.
2. low-temperature cured conductive silver slurry as claimed in claim 1, it is characterised in that this conductive silver paste
It is made up of the component of following mass percentage content:
Argentum powder: 65～75；
High molecular polyurethane resin: 10～15；
Epoxy resin oligomer: 10～15；
Solvent: 6～8；
Firming agent: 1～3.
3. low-temperature cured conductive silver slurry as claimed in claim 1, it is characterised in that this conductive silver paste
It is made up of the component of following mass percentage content:
Argentum powder: 70；
High molecular polyurethane resin: 10；
Epoxy resin oligomer: 11；
Solvent: 7；
Firming agent: 2.
4. as claimed any one in claims 1 to 3 low-temperature cured conductive silver slurry, it is characterised in that described argentum powder average
Particle diameter is 1.0～5.0 microns, and specific surface area is 1.0～2.2 meters squared per gram, and the purity of argentum powder is more than 99.95%.
5. low-temperature cured conductive silver is starched as claimed any one in claims 1 to 3, it is characterised in that described high-molecular-weight poly
Urethane resin, its molecular weight is more than 100000, and its glass transition temperature is more than 50 DEG C.
6. low-temperature cured conductive silver is starched as claimed any one in claims 1 to 3, it is characterised in that described solvent is high boiling
Point solvent, it is the one in isophorone, Petroleum, diethylene adipate, ethanedioic acid ethyl ether acetate ester, DBE.
7. low-temperature cured conductive silver is starched as claimed any one in claims 1 to 3, it is characterised in that described firming agent is ring
Oxygen firming agent, it is the one in isocyanates, imidazoles, dicyandiamide.
8. the method preparing low-temperature cured conductive silver slurry, it is characterised in that comprise the following steps:
Each component of conductive silver paste as described in claims 1 to 3 weighs；First prepare performed polymer:
S1 is sequentially added into epoxy resin oligomer and catalyst in stirring box, stirs 1 minute with stirring deaeration machine, then deaeration
After 1 minute；It is added thereto to dicyandiamide again, is again stirring for 1 minute, after deaeration 1 minute, gained mixture is transferred to three mouthfuls of burnings
In Ping；
S2 puts in hot-air oven after being sealed by above-mentioned there-necked flask, takes out after completion of the reaction, is turned by the epoxy oligomer obtained
Put into 5～10 DEG C of cold preservations in refrigerator after moving to sample bottle seals to deposit, standby.
The method preparing low-temperature cured conductive silver slurry the most as claimed in claim 8, it is characterised in that also include preparing dispersion
Step:
S3, by adding solvent in flask, adds high molecular polyurethane resin particle, stirs and be completely dispersed to resin for 4 hours
After, and take out be transferred in described sample bottle, in the airtight preservation of room temperature, standby.
The method preparing low-temperature cured conductive silver slurry the most as claimed in claim 9, it is characterised in that also include preparing forerunner
The step of body:
S4 takes described dispersion and described epoxy oligomer in stirring box, and adds catalyst, stirs 1 minute, then deaeration 1 point
Clock, obtains presoma, deposits in 5～10 DEG C of cold preservations, standby；
S5 takes above-mentioned presoma, and adds argentum powder in described stirring box, after mixing, through grinding, filters, i.e. obtains right and want
Seek the conductive silver paste described in 1～3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410587410.0A CN104332214B (en) | 2014-10-28 | A kind of low-temperature cured conductive silver slurry and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410587410.0A CN104332214B (en) | 2014-10-28 | A kind of low-temperature cured conductive silver slurry and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104332214A CN104332214A (en) | 2015-02-04 |
| CN104332214B true CN104332214B (en) | 2017-01-04 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05120914A (en) * | 1991-10-30 | 1993-05-18 | Sumitomo Bakelite Co Ltd | Conductive resin paste for semiconductor |
| CN101373646A (en) * | 2008-10-09 | 2009-02-25 | 彩虹集团公司 | Middle and low temperature curing conductive silver slurry |
| CN101436442A (en) * | 2008-12-09 | 2009-05-20 | 彩虹集团公司 | Low-temperature conductive slurry |
| CN101824204A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Novel halogen-free electronic paste, and preparation method and use thereof |
| CN102054881A (en) * | 2009-10-29 | 2011-05-11 | 上海宝银电子材料有限公司 | Solderable conductive silver paste with low-temperature back of crystalline silicon solar cell and preparation method |
| CN102610296A (en) * | 2012-03-13 | 2012-07-25 | 江苏金陵特种涂料有限公司 | Thermosetting carbon/silver composite nano conductive silver paste and preparation method thereof |
| CN103879164A (en) * | 2014-03-31 | 2014-06-25 | 苏州昭奇凯虹精细化工有限公司 | Process for printing mobile phone antenna |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05120914A (en) * | 1991-10-30 | 1993-05-18 | Sumitomo Bakelite Co Ltd | Conductive resin paste for semiconductor |
| CN101373646A (en) * | 2008-10-09 | 2009-02-25 | 彩虹集团公司 | Middle and low temperature curing conductive silver slurry |
| CN101436442A (en) * | 2008-12-09 | 2009-05-20 | 彩虹集团公司 | Low-temperature conductive slurry |
| CN101824204A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Novel halogen-free electronic paste, and preparation method and use thereof |
| CN102054881A (en) * | 2009-10-29 | 2011-05-11 | 上海宝银电子材料有限公司 | Solderable conductive silver paste with low-temperature back of crystalline silicon solar cell and preparation method |
| CN102610296A (en) * | 2012-03-13 | 2012-07-25 | 江苏金陵特种涂料有限公司 | Thermosetting carbon/silver composite nano conductive silver paste and preparation method thereof |
| CN103879164A (en) * | 2014-03-31 | 2014-06-25 | 苏州昭奇凯虹精细化工有限公司 | Process for printing mobile phone antenna |
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