CN101373205B - 集成电路芯片接口模块的回环测试结构 - Google Patents
集成电路芯片接口模块的回环测试结构 Download PDFInfo
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- CN101373205B CN101373205B CN2007100450893A CN200710045089A CN101373205B CN 101373205 B CN101373205 B CN 101373205B CN 2007100450893 A CN2007100450893 A CN 2007100450893A CN 200710045089 A CN200710045089 A CN 200710045089A CN 101373205 B CN101373205 B CN 101373205B
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- 238000012360 testing method Methods 0.000 title claims abstract description 67
- 230000005540 biological transmission Effects 0.000 claims description 31
- 238000000034 method Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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CN2007100450893A CN101373205B (zh) | 2007-08-21 | 2007-08-21 | 集成电路芯片接口模块的回环测试结构 |
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CN2007100450893A CN101373205B (zh) | 2007-08-21 | 2007-08-21 | 集成电路芯片接口模块的回环测试结构 |
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CN101373205A CN101373205A (zh) | 2009-02-25 |
CN101373205B true CN101373205B (zh) | 2011-03-16 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101907682B (zh) * | 2009-06-02 | 2012-08-29 | 上海摩波彼克半导体有限公司 | 数字基带芯片Gptimer模块自动测试电路结构、测试平台及方法 |
CN103106172B (zh) * | 2013-02-26 | 2015-08-12 | 龙迅半导体科技(合肥)有限公司 | 一种芯片及测试该芯片的方法 |
US20160065334A1 (en) * | 2014-08-29 | 2016-03-03 | R&D Circuits, Inc | Structure and Implementation Method for implementing an embedded serial data test loopback, residing directly under the device within a printed circuit board |
KR102477268B1 (ko) * | 2018-01-26 | 2022-12-13 | 삼성전자주식회사 | 메모리 모듈의 정보를 실시간으로 모니터링하는 방법 및 시스템 |
CN111669255B (zh) * | 2020-07-09 | 2023-05-12 | 深圳市信锐网科技术有限公司 | 通信设备网口的环回测试方法、装置、电路、设备及介质 |
CN114070765B (zh) * | 2021-11-02 | 2023-05-23 | 广东利扬芯片测试股份有限公司 | 通信接口测试电路及方法 |
CN113986600B (zh) * | 2021-11-04 | 2023-02-03 | 北京智芯微电子科技有限公司 | 一种用于芯片串行接口的测试方法、装置和芯片 |
CN117544544A (zh) * | 2023-12-13 | 2024-02-09 | 广州思林杰科技股份有限公司 | 一种多端口poe测试设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2396577Y (zh) * | 1999-11-01 | 2000-09-13 | 陈杰 | 通信通道四线环回测试装置 |
CN1500246A (zh) * | 2000-12-29 | 2004-05-26 | ̩ | 串行器件的改进型环回检测 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2396577Y (zh) * | 1999-11-01 | 2000-09-13 | 陈杰 | 通信通道四线环回测试装置 |
CN1500246A (zh) * | 2000-12-29 | 2004-05-26 | ̩ | 串行器件的改进型环回检测 |
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Application publication date: 20090225 Assignee: SPREADTRUM COMMUNICATIONS (SHANGHAI) Co.,Ltd. Assignor: Xinji Lease (Tianjin) Co.,Ltd. Contract record no.: 2018990000196 Denomination of invention: Returning ring test structure of IC chip interface module Granted publication date: 20110316 License type: Exclusive License Record date: 20180801 |
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