CN101370959A - Sputtering method and sputtering system - Google Patents
Sputtering method and sputtering system Download PDFInfo
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- CN101370959A CN101370959A CNA2007800022189A CN200780002218A CN101370959A CN 101370959 A CN101370959 A CN 101370959A CN A2007800022189 A CNA2007800022189 A CN A2007800022189A CN 200780002218 A CN200780002218 A CN 200780002218A CN 101370959 A CN101370959 A CN 101370959A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
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Abstract
When a film is deposited by sputtering employing an AC power supply, output from the AC power supply is interrupted by detecting occurrence of arc discharge quickly and generation of particles or splash can be prevented effectively by reducing energy when arc discharge is generated. A pair of targets (41a, 41b) provided in a vacuum chamber (11) are applied with a voltage at a predetermined frequency through the AC power supply (E) while changing the polarity alternately, each target is switched alternately to an anode electrode and a cathode electrode, and plasma atmosphere is formed by generating glow discharge between the anode electrode and the cathode electrode in order to sputter each target. In this regard, output voltage waveform to the pair of targets is detected and output from the AC power supply is interrupted when the voltage drop time of the output voltage waveform is judged shorter than the normal glow discharge time.
Description
Technical field
The invention provides a kind of can be on the treatment substrate surface film forming sputtering method and sputter equipment.
Background technology
Sputtering method is the target of the specified shape made at the thin film composition of treatment substrate surface filming as required, makes the ion in the plasma atmosphere quicken bombardment to target, the atom of target is splashed, and then form film on the treatment substrate surface.Under the above-mentioned situation, on the target that is cathode electrode, apply voltage, between cathode electrode and anode electrode or ground-electrode, produce glow discharge, form plasma atmosphere by direct supply or AC power.
As everyone knows, in above-mentioned glow discharge, because of arc-over can take place certain reason, above-mentioned arc-over can bring out problems such as particulate and splash as being created in the part of cathode electrode, can not form high-quality film.
Therefore, in the sputtering method of known use direct supply, for example can detect the voltage between cathode electrode and the ground-electrode, this volts lost becomes when surpassing prescribed value greatly, detect arc-over, the electric power of the specified time internal cutting off direct supply after arc-over produces is supplied with (patent documentation 1).
Patent documentation 1: the spy opens flat 11-200036 communique (for example, with reference to claim 1).
But, utilize the sputter of AC power, promptly in vacuum chamber, apply voltage with the frequency of stipulating on the free mutually a pair of target that is provided with by AC power with alternately changing polarity, each target alternately is switching in the sputter of anode electrode, cathode electrode, the polarity of the voltage that applies on each target changes at any time, and volts lost often takes place, therefore, be difficult to use the arc-detection method that detects the volts lost between above-mentioned cathode electrode, anode electrode that relies on.
In the prior art, have by obtaining by AC power to the virtual value of the output voltage of target or mean value this output voltage direct currentization, and be according to the method that detects electric arc with this volts DS, but owing to added the time that voltage of alternating current is converted into volts DS, the detection with arc-over produces the problem that postpones, can not effectively prevent particulate and splash etc.
Summary of the invention
At the problems referred to above, the object of the present invention is to provide a kind of sputtering method and sputter equipment, in using the film forming sputter of AC power, can detect the generation of arc-over rapidly and cut off its output to target, energy when making arc-over diminishes, and then effectively prevents the generation of particulate and splash etc.
At the problems referred to above; claim 1 provides a kind of sputtering method that each target is carried out sputter; frequency with regulation on a pair of target that is provided with in vacuum chamber by AC power applies voltage with alternately changing polarity; each target alternately is switching to anode electrode; cathode electrode; between anode electrode and cathode electrode, produce glow discharge and form plasma atmosphere; thereby each target is carried out sputter; it is characterized by: detect the voltage waveform of in described a pair of target, exporting; when time of the volts lost time ratio normal glow discharge of judging this output voltage waveforms more in short-term, cut off the output of described AC power.
According to the present invention, by on a pair of target, applying voltage by AC power, each target alternately is switching to anode electrode, cathode electrode, between anode electrode and cathode electrode, produce glow discharge and form plasma atmosphere, ion in the plasma atmosphere quickens bombardment to the target that becomes cathode electrode, the atom of target is splashed, and then on the treatment substrate surface, form film.
In sputter as produce arc-over, the impedance of plasma body will diminish rapidly, voltage decreases between target at first, and produce powerful electric current.Under the above-mentioned situation, can directly detect the generation of arc-over by length to volts lost time of the output voltage waveforms of target, compare to the virtual value of the output voltage of target or the method for average detection arc-over with variation and calculating, can detect arc-over and cut-out output rapidly to target by current value between target.Thus, the energy in the time of can reducing arc-over also effectively prevents the generation of particulate and splash.
Under the above-mentioned situation, detect the output current wave between the described a pair of target, absolute value as this output voltage waveforms surpasses prescribed value, then be considered as producing described glow discharge, when making the grid current signal by the absolute value of this output current wave, absolute value by described output voltage waveforms is made voltage pulse signal, when this grid current signal is in that voltage pulse signal is off-state under the on-state, shorter in the time of can judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms.In view of the above, because detect the generation of volts lost when electric current flows between target, for example can reduce the flase drop of arc-over and survey.
For accurately detecting the generation of arc-over, in described sputter, will be roughly the same preferably to the output current wave of described target, the phase control of output voltage waveforms.
Under the above-mentioned situation, described prescribed value is changed according to the input electric power of AC power to a pair of target.
In addition, when making voltage pulse signal by the absolute value of described output voltage waveforms, detect the pulse width of this voltage pulse signal,, shorter when then judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms as this pulse width less than prescribed value.As mentioned above, only can detect the generation of arc-over,, also can detect arc-over when the phase place of output voltage waveforms and output current wave is inconsistent when starting etc. so needn't consider the phase differential between output voltage waveforms and output current wave with voltage between target.
Under the above-mentioned situation, described prescribed value can directly be determined by the absolute value of output voltage waveforms, or come to determine indirectly by the pulse width of measuring in advance when arc-over not taking place.
In addition, can detect and the proportional differentiated waveform of the volts lost of described output voltage waveforms, when surpassing prescribed value and become big, shorter when then judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms as this differentiated waveform.In view of the above, available simple circuit configuration realizes the arc-over testing circuit, and, only can detect the generation of arc-over with voltage between target, so needn't consider phase differential between output voltage waveforms and output current wave, also can detect arc-over when the phase place of output voltage waveforms and output current wave is inconsistent when starting etc.
Under the above-mentioned situation,, preferably before detecting described differentiated waveform, remove the interference of output voltage waveforms by filtering circuit for more accurately detecting the generation of arc-over.
In addition, preferred described output voltage waveforms is sinusoidal wave approximately.
And, detect the output current wave between described a pair of target, the phase place of described output voltage waveforms and output current wave and amplitude are adjusted to the difference waveform that detects its waveform after roughly consistent, when this difference waveform surpasses prescribed value and becomes big, shorter when then judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms.As mentioned above, the waveform that uses when synthesizing as arc-detection by the difference of current waveform after will suitably regulating and voltage waveform, the output of its difference waveform becomes bigger output waveform when making arc-over, so be not subject to the interferential influence, its result can reduce the generation of flase drop.
Under the above-mentioned situation,, preferably before detecting described difference waveform, remove the interference of output voltage waveforms and output current wave by filtering circuit in order more accurately to detect the generation of arc-over.
In addition, preferred described output voltage waveforms and output current wave are sinusoidal wave approximately.
At the problems referred to above, claim 13 provides a kind of sputter equipment, it is characterized by: have a pair of target that in vacuum chamber, is provided with, and the AC power that between described a pair of target, applies voltage with the frequency of regulation with alternately changing polarity; Be provided with electric arc detecting device, it detects the shorter volts lost of time to the volts lost time ratio normal glow discharge of the output voltage waveforms of described target; Shut-off device, the output from AC power is cut off in its output with arc detection circuitry.
Under the above-mentioned situation, also can on described AC power, phase adjusting device be set, make to the output voltage waveforms of a pair of target and the phase place basically identical of output current wave.
Described electric arc detecting device has: the first absolute value testing circuit and the second absolute value testing circuit, and it detects the output current wave between described a pair of target and the absolute value of output voltage waveforms; Grid current signal generating circuit and voltage pulse signal generation circuit, it is provided with comparer, imports absolute value and detection level from the first absolute value testing circuit and the second absolute value testing circuit respectively; The volts lost testing circuit, it imports grid current signal and voltage pulse signal from grid current signal generating circuit and voltage pulse signal generation circuit respectively; When this grid current signal is in that voltage pulse signal is off-state under the on-state, can detect the fall time of shorter volts lost during than normal glow discharge.
In addition, the electric arc detecting device of another kind of embodiment has: the absolute value testing circuit, and it detects the absolute value of the output voltage waveforms between described a pair of target; Voltage pulse generation circuit, it is provided with comparer, and input is from the voltage waveform and the detection level of described absolute value testing circuit; The volts lost testing circuit, its input is from the voltage pulse signal of voltage pulse generation circuit; Detect the pulse width of the voltage pulse signal of importing in the volts lost testing circuit,, can detect the fall time of shorter volts lost during than normal glow discharge when this pulse width during less than prescribed value.
In addition, the electric arc detecting device of another kind of embodiment has: differentiating circuit, the proportional differentiated waveform of volts lost of the output voltage waveforms between its detection and described a pair of target; The absolute value testing circuit, it detects the absolute value of the voltage waveform of described differentiating circuit; The voltage derivative waveform circuit, it is provided with comparer, and input is from the voltage waveform and the detection level of absolute value testing circuit; When the absolute value of this differentiated waveform surpasses prescribed value and becomes big, can detect the fall time of shorter volts lost during than normal glow discharge.
In addition, the electric arc detecting device of another kind of embodiment has: first and second each gain adjustment circuit, its amplitude with output voltage waveforms between described a pair of target and output current wave are adjusted into roughly consistent; Differentiating amplifier, it detects from the output voltage waveforms of each gain adjustment circuit and the difference waveform of output current wave; The absolute value testing circuit, it detects the absolute value from the wave of described differentiating amplifier; The difference waveform testing circuit, it has comparer, and input is from the wave and the detection level of absolute value testing circuit; When the absolute value of this wave surpasses prescribed value and becomes big, can detect the fall time of shorter volts lost during than normal glow discharge.
As mentioned above, sputtering method of the present invention and sputter equipment when utilizing the AC power spatter film forming, can detect the generation of arc-over rapidly and cut off output to target, play the energy when reducing arc-over and effectively prevent the effect of particulate and splash.
Embodiment
Fig. 1 is magnetic controlled tube sputtering apparatus of the present invention (to call " sputter equipment " in the following text).Sputter equipment 1 has the vacuum chamber 11 that is kept the specified vacuum degree by rotary pump, turbomolecular pump equal vacuum gas barrier (not shown) for string row formula.The top of vacuum chamber 11 is provided with substrate transfer apparatus.This substrate transfer apparatus has the structure that adopts prior art, for example, possesses the carriage 2 that treatment substrate S is installed, driver intermittently, with substrate S conveyance successively to the position relative with target described later.
Be provided with gas gatherer 3 in the vacuum chamber 11.Gas gatherer 3 is connected on the source of the gas 33 by the tracheae 32 that is provided with mass flow controller 31, the O that can use when vacuum chamber 11 imports the sputter gas such as Ar of certain flow or reactive sputtering
2, H
2O, H
2, N
2Deng reactant gases.At the downside of vacuum chamber 11, dispose cathode electrode C.
Cathode electrode C is included in a pair of target 41a, the 41b that treatment substrate S opposite is provided with.Each target 41a, 41b according to Al, Ti, Mo or ITO etc. on treatment substrate S during film forming the composition of film make by known method, slightly be rectangular parallelepiped (being seen as rectangle from above).Each target 41a, 41b engage with the liner plate 42 that plays cooled target 41a, 41b effect with matrix materials such as indium or tin in sputter, are installed in by not shown insulating element on the framework of cathode electrode C, dispose with unbound state in vacuum chamber 11.
Under the above-mentioned situation, the sputter face 411 during not the using of target 41a, 41b with same plane that treatment substrate S parallels on be set up in parallel, between the relative side 412 of each target 41a, 41b, members such as any plate or shielding are not set.The physical dimension of each target 41a, 41b is set at greater than with each target 41a, the physical dimension of treatment substrate S when 41b is set up in parallel.
In addition, among the cathode electrode C, be equipped with magnet set piece installing 5 at the rear of each target 41a, 41b.Magnet set piece installing 5 has the back up pad 51 that parallels with each target 41a, 41b.This back up pad 51 is narrower than the width of each target 41a, 41b, by constituting along the OBL flat board that extends out to its both sides on the length direction of each target 41a, 41b, for the magneticsubstance that can strengthen magnetic pull is made.Back up pad 51 is provided with the peripheral magnet 53 that is provided with along the bar-shaped central magnet 52 on the length direction of each target 41a, 41b, along the periphery of back up pad 51.Volume sum when the same magnetization that the volume when at this moment, the same magnetization of central magnet 52 converts is designed to for example to equal peripheral magnet 52 converts (peripheral magnet: centring magnet: peripheral magnet=1:2:1).
As mentioned above, the place ahead at each target 41a, 41b, form corresponding closed circuit tubulose flux respectively,, can improve the density that strengthens plasma body in the electron density in the place ahead of target 41a, 41b by catching at ionized electronics in the place ahead of target 41a, 41b and secondary electron that sputter produced.On a pair of target 41a, 41b, connect output cable K respectively from AC power E, can be on a pair of target 41a, 41b (1～400KHz) alternately changes polarity applies voltage with the frequency of regulation.
As shown in Figure 2, AC power E alternately changes polarity and constitutes to the oscillating portion 7 of each target 41a, 41b output voltage by the power feeding section 6 that electric power can be provided and with the frequency of regulation.The waveform of above-mentioned output voltage is a sine wave roughly, but does not limit waveform for this reason, for example also can be rectangular wave roughly.
In addition, have in the power feeding section 6: be arranged on the switching transistor 65 between direct current transmission line 64a, 64b, but be connected with first cpu circuit, 61 free communication ground and the first driving circuit 66a that trip switch transistor 65 is connected, disconnected, an and PMW pilot circuit 66b.Under the above-mentioned situation, have current detection sensor and voltage detecting transformer, be provided with the electric current that detects between direct current transmission line 64a, 64b, the testing circuit 67a and the A/D convertor circuit 67b of voltage, by testing circuit 67a and A/D convertor circuit 67b input cpu circuit 61.
The other side, oscillating portion 7 is provided with: but second cpu circuit 71 that is connected with first cpu circuit, 61 free communication ground, be arranged on formation vibration 4 first to fourth switching transistor 72a, 72b, 72c, the 72d of switch circuit 72 between direct current transmission line 64a, 64b, but be connected and control the second driving circuit 73a and the 2nd PMW pilot circuit 73b of each switching transistor 72a, 72b, 72c, 72d connection, disconnection with second cpu circuit, 71 free communication ground.
Then, by the second driving circuit 73a and the 2nd PMW pilot circuit 73b, for example control the action of each switching transistor 72a, 72b, 72c, 72d, make the first and the 4th switching transistor 72a, 72d, regularly reverse with connection, the disconnection of second and third switching transistor 72b, 72c, can be by the alternating current transmission line 74a, the 74b sine wave output alternating-current that come self-oscillation with switch circuit 72.Under the above-mentioned situation, be provided with the testing circuit 75a and the A/D convertor circuit 75b that detect oscillating voltage, oscillating current, import second cpu circuit 71 by testing circuit 75a and A/D convertor circuit 75b.
Alternating current transmission line 74a, 74b are connected with lc circuit on the output transformer 76 with known construction via the resonance of serial or parallel connection and series-parallel connection combination, are connected on a pair of target 41a, the 41b from the output cable K of output transformer 76.Under the above-mentioned situation, have current detection sensor and voltage detecting transformer, be provided with detection to the output voltage of a pair of target 41a, 41b, the testing circuit 77a and the A/D convertor circuit 77b of outward current, import second cpu circuit 71 by testing circuit 77a and A/D convertor circuit 77b.Thus, can be in sputter by AC power E with certain frequency and alternately change polarity and apply voltage to a pair of target 41a, 41b.
In addition, be connected by the output of testing circuit 77a on the testing circuit 78a of the output phase that is used for detecting output voltage and outward current and frequency, but by free communication be connected output phase frequency control circuit 78b on this testing circuit 78a, the phase place and the frequency of output voltage and outward current is input in second cpu circuit 71.In view of the above, according to each switching transistor 72a, 72b, the connection of 72c, 72d, the disconnection of using switch circuit 72 from the control signal of second cpu circuit 71 by second driving circuit 73a control vibration, the output voltage and the phase place of outward current can be controlled to be mutually roughly consistently, output phase frequency control circuit 78b, second cpu circuit 71 and the second driving circuit 73a constitute phase adjusting device.
Then, with the position that treatment substrate S is transported to a pair of target 41a, 41b opposite, import the sputter gas of stipulating by substrate transfer apparatus by the gas gatherer.Apply voltage of alternating current by AC power E on a pair of target 41a, 41b, each target 41a, 41b alternately are switching to anode electrode, cathode electrode, produce glow discharge and form plasma atmosphere between anode electrode and cathode electrode.In view of the above, the ion in the plasma atmosphere quickens bombardment to the target 41a, the 41b that become cathode electrode, the atom of target is splashed, and then form film on treatment substrate S surface.
At this moment, in magnet set piece installing 5, be provided with the drive units such as motor that do not show on the figure, utilize this drive unit, make target 41a, 41b parallel and constant speed ground to-and-fro movement between two positions on the along continuous straight runs, make on target 41a, 41b whole and all can obtain impartial erosion areas.
But, in above-mentioned glow discharge, can produce arc-over because of certain reason as everyone knows, as on a pair of target 41a, 41b, producing this kind arc-over locally, will bring out problems such as particulate and splash, for forming the second best in quality film, need detect arc-over rapidly, and cut off output immediately from AC power E.
In the present embodiment, on oscillating portion 7, be provided with electric arc detecting device 8, be used for detecting the time volts lost more in short-term of the volts lost time ratio normal glow discharge of the voltage waveform of exporting to a pair of target 41a, 41b.Then, when electric arc detecting device 8 detects arc-over, but volts lost electric arc output signal is output to second cpu circuit 71 that free communication ground connects, but according to second cpu circuit 71 with from the control signal of first cpu circuit 71 of free communication, by the action of the first driving circuit 66a trip switch transistor 65, and cut off output immediately to a pair of target 41a, 41b.
At this moment, according to control signal from second cpu circuit 71, by the second driving circuit 73a, control vibration each switching transistor 72a, 72b of switch circuit 72, the action of 72c, 72d, make that for example the current potential between alternating current transmission line 74a, the 74b is identical, and can cut off output immediately to a pair of target 41a, 41b.
To shown in Fig. 3 (e), electric arc detecting device 8 has as Fig. 3 (a): current sense amplifier 81 and voltage transformation amplifier 82, and its output voltage, outward current to testing circuit 77a output carries out amplification; The first absolute value testing circuit 83a and the second absolute value testing circuit 83b, it detects through current sense amplifier 81 and the output current wave of voltage transformation amplifier 82 amplification and the absolute value of output voltage waveforms.In addition, electric arc detecting device 8 has: grid current generation circuit 84a and voltage pulse generation circuit 84b, it has the absolute value of input from first and second absolute value testing circuit 83a, 83b respectively, and predefined grid current detects the comparer 841 of level and voltage pulse detection level; Volts lost testing circuit 85, it imports grid current signal and voltage pulse signal from grid current generation circuit 84a and voltage pulse generation circuit 84b respectively.Predefined grid current detects level and voltage pulse detects level (prescribed value), also can change to the output of a pair of target 41a, 41b according to for example power feeding section 6, can carry out more high-precision arc-detection.
Below, the arc-over detection by arc detection circuitry 8 is described.At first, the control signal trip switch transistor 65 from first cpu circuit 61 with power feeding section 6 provides direct current by direct current transmission line 64a, 64b to oscillating portion 7.Then, use the action of controlling first to fourth switching transistor 72a, 72b, 72c, 72d from the control signal of second cpu circuit 71, apply voltage of alternating current to a pair of target 41a, 41b.At this moment, input reset signal reset (with reference to Fig. 3 (c)) in the down detection circuit 85 under electric current.
Secondly, will be through the absolute value of testing circuit 77a from the current waveform of the first absolute value testing circuit 83a, detect the comparer 841 that level is imported grid current generation circuit 84a with grid current, when described absolute value surpasses grid current detection level, then be considered as glow discharge takes place down detection circuit 85 input regular discharge signals (with reference to Fig. 3 (c)) under electric current in vacuum chamber 11.Preferably, the phase place of output voltage waveforms and output current wave about consistent after, input regular discharge signal.
Then, will be from each absolute value of first and second absolute value testing circuit 83a, 83b, detect level with grid current detection level and predefined voltage pulse and import each comparer 841, thus in will grid current signal and voltage pulse signal input voltage down detection circuit 85, with high-speed clock signal input voltage down detection circuit 85 and begin the detection (with reference to Fig. 3 (c)) of arc-over from grid current generation circuit 84a and voltage pulse generation circuit 84b.
When producing arc-over between a pair of target 41a, the 41b, at first, fall to the output voltage of a pair of target 41a, 41b, then, outward current increases rapidly.At this moment, the grid current signal is kept original " 1 " (on-state), has only voltage pulse signal to become " 0 " (off-state) (with reference to Fig. 3 (b)).Promptly in detecting arc-over, judge at volts lost testing circuit 85 whether the grid current signal is " 0 ", and when the grid current signal was " 0 ", the grid current signal was in off-state.Then, when the grid current signal is " 1 ", enter voltage pulse decline waiting status, at this moment, judge whether voltage pulse signal is " 1 ", then be judged as normal glow discharge for " 1 " as voltage pulse signal.Subsequently, when the grid current signal became " 0 ", voltage pulse signal became " 0 ", and the grid current signal recovers off-state.
Conversely, be the voltage pulse decline waiting status of " 1 " at the grid current signal, volts lost when becoming " 0 ", voltage pulse signal takes place, judges to have produced arc-over (with reference to Fig. 3 (d)).At this moment, can detect, therefore can detect the generation (with reference to Fig. 3 (e)) of arc-over rapidly owing to 1 pulse of high-speed clock signal or the volts lost of 2 pulse delays.
When detecting arc-over by electric arc detecting device 8, second cpu circuit 71 that outputs to arc-over, control signal with for example second cpu circuit 71 is passed through the second driving circuit 73a, the control vibration is cut off the output to a pair of target 41a, 41b with each switching transistor 72a, 72b of switch circuit 72, the action of 72c, 72d.
In view of the above, can directly detect the generation of arc-over by length to volts lost time of the output voltage waveforms of a pair of target 41a, 41b, with variation by current value between target 41a, 41b and calculate to the virtual value of the output voltage of target 41a, 41b and compare, can detect arc-over rapidly and cut off the output of AC power E with the method for average detection arc-over.Thus, the energy in the time of can reducing arc-over also effectively prevents the generation of particulate and splash etc., and, can when flowing, outward current detect the generation of volts lost, and for example can reduce the flase drop of arc-over and survey.
With reference to Fig. 4 (a) to Fig. 4 (e), 80 electric arc detecting devices that relate to for another embodiment.This electric arc detecting device 80 is the proofing unit that only detects arc-over from output voltage, has: voltage transformation amplifier 810, and it carries out amplification to the output voltage that comes self-detection circuit 77a; Absolute value testing circuit 820, it detects the absolute value through the output voltage waveforms of voltage transformation amplifier 810 amplification.In addition, electric arc detecting device 80 has: voltage pulse generation circuit 830, and it has the absolute value of importing respectively from absolute value testing circuit 820, with the comparer 830a of voltage pulse detection level; Input detects gating producer 841 from the volts lost testing circuit 840 and the pulse width of the voltage pulse signal of voltage pulse generation circuit 830.
Below the arc-over of explanation arc detection circuitry 80 detects.At first, make AC power E action apply voltage of alternating current equally with above-mentioned to a pair of target 41a, 41b.At this moment, to volts lost testing circuit 840 input reset signals reset (with reference to Fig. 4 (c)).
Then, will be from the absolute value of absolute value testing circuit 820, detect level input comparator 830a with predefined voltage pulse, when will outputing to volts lost testing circuit 840, with regular discharge signal and high-speed clock signal input voltage down detection circuit 840 and begin the detection (with reference to Fig. 4 (c)) of arc-over from the voltage pulse signal of voltage pulse generation circuit 830.Then; by the voltage pulse signal that inputs to volts lost testing circuit 840; make the gate voltage signal that has pulse width under the normal glow discharge state in the pulse width gating producer 841; gate voltage signal is kept original " 1 " (on-state); when having only voltage pulse signal to become " 0 " (off-state), detect arc-over (with reference to Fig. 4 (b)) by the decline of output voltage.
Promptly in detecting arc-over, by volts lost testing circuit 840, when gate voltage signal was " 0 ", gate voltage signal was in off-state.Then, when gate voltage signal is " 1 ", enter voltage pulse signal decline waiting status, at this moment, judge whether voltage pulse signal is " 1 ", for " 1 " then is judged as normal glow discharge takes place in this state as voltage pulse signal.Subsequently, when gate voltage signal became " 0 ", voltage pulse signal also became " 0 ", and gate voltage signal is recovered off-state.
Conversely, in voltage pulse signal decline waiting status, volts lost taking place when voltage pulse signal becomes " 0 ", then judges to have produced arc-over (with reference to Fig. 4 (d)).At this moment, can detect, therefore can detect the generation (with reference to Fig. 4 (e)) of arc-over rapidly because of 1 pulse of high-speed clock signal or the volts lost of 2 pulse delays.
In view of the above, only just can detect the generation of arc-over, needn't consider phase place poor of voltage and electric current, also can detect arc-over when the phase place of voltage and electric current is inconsistent when startup etc. by the voltage between a pair of target 41a, the 41b.
In addition, directly make gate voltage signal by absolute value in the foregoing description, but be not limited thereto, for example also can relatively change the size of the voltage amplitude of detection.Under the above-mentioned situation, detect the magnitude of voltage of no arc-over state earlier with additive method, decision relatively is the voltage amplitude of no arc-over later on, and the voltage amplitude when serving as basis detection arc-over with described voltage amplitude descends.
With reference to Fig. 5 (a) and Fig. 5 (b), 9 electric arc detecting devices that relate to for another embodiment.This electric arc detecting device 9 also is the proofing unit that is only detected arc-over by output voltage, has the voltage transformation amplifier 91 that the output voltage that comes self-detection circuit 77a is carried out amplification, with can remove the known interference filter 92 of output voltage interferential, and differentiating circuit 93.The output of this differentiating circuit 93 is imported in the absolute value testing circuit 94, is provided with voltage pulse generation circuit 95, and it is provided with the comparer 95a that imports this absolute value and voltage derivative wave test level respectively.
Secondly, the arc-over that arc detection circuitry 9 is described detects.At first, make AC power E action apply voltage of alternating current equally with above-mentioned to a pair of target 41a, 41b.Then will be through the absolute value and the predefined voltage derivative wave test level input comparator 95a from absolute value testing circuit 94 of differentiating circuit 93.At this moment, when absolute value is lower than voltage derivative wave test level, be judged as normal glow discharge.Otherwise, when absolute value exceeds voltage derivative wave test level, then be judged as arc-over (with reference to Fig. 5 (b)) taken place.
In view of the above, arc-over testing circuit 9 can be realized with simple circuit, and, only just can detect the generation of arc-over by the voltage between a pair of target 41a, the 41b, phase place poor of voltage and electric current needn't be considered, also arc-over can be detected when the phase place of voltage and electric current is inconsistent when starting etc.
With reference to Fig. 6 (a) and Fig. 6 (b), 90 electric arc detecting devices that relate to for another embodiment.This electric arc detecting device 90 is the proofing units that only detected arc-over by the difference waveform of output voltage waveforms and output current wave, has: current sense amplifier 910 and voltage transformation amplifier 920 that the output voltage that comes self-detection circuit 77a and outward current are carried out amplification; With can remove the known interference filter 930a of output voltage waveforms and output current wave interferential, 930b; And will be adjusted into first and second each gain adjustment circuit 941a, 940b unanimous on the whole through the output voltage waveforms of interference filter 930a, 930b and the amplitude of output current wave.
And electric arc detecting device 90 is imported output voltage waveforms and the output current wave through first and second each gain adjustment circuit 941a, 940b respectively, and have: the difference of corresponding above-mentioned waveform is carried out the differential differentiating amplifier with known configurations 950; Detection is from the absolute value testing circuit 960 of the absolute value of the difference waveform of differentiating amplifier 950; Be provided with the difference waveform testing circuit 970 of the comparer 970a that imports this absolute value and difference waveform detection level respectively.
Secondly, the arc-over that arc detection circuitry 90 is described detects.At first, make AC power E action apply voltage of alternating current equally with above-mentioned to a pair of target 41a, 41b.Using then from the control signal of second cpu circuit 71 by each switching transistor 72a, 72b, the connection of 72c, 72d, the disconnection of second driving circuit 73a control vibration with switch circuit 72, is unanimous on the whole with the phase control of output voltage and outward current.
Then, according to the output voltage and the outward current that detect by testing circuit 77a, adjust signal by second cpu circuit 71 to first and second each gain adjustment circuit 940a, 940b difference received current gain adjust signal and voltage gain, by first and second each gain adjustment circuit 940a, 940b with the amplitude of output voltage waveforms, output current wave be adjusted into unanimous on the whole after, output voltage waveforms, output current wave input differentiating amplifier 950.
Then, will be from the absolute value through the difference waveform of absolute value testing circuit 960 of differential amplifier 950, and predefined difference waveform detects level input comparator 970a.At this moment, detect level less than difference waveform, then be judged as normal glow discharge takes place as the absolute value of difference waveform.Otherwise, when absolute value surpasses difference waveform detection level, be judged as arc-over (with reference to Fig. 6 (b)) taken place.
In view of the above, by the waveform that will when the difference of the current waveform of suitable adjusting and voltage waveform is synthesized as arc-detection, use, its difference waveform output becomes bigger output waveform (with reference to Fig. 6 (b)) when arc-over takes place, therefore be not subject to the interferential influence, the result can reduce the generation of flase drop.In addition, the a pair of target 41a that the foregoing description just disposes in vacuum chamber 11, the situation of 41b are illustrated, but be not limited thereto structure, also can and establish the individual target of plural number (more than 3), and to AC power that alternately applies voltage of alternating current of 2 target configurations, above-mentioned formation also is fit to arc method for measuring of the present invention at least.
Description of drawings
Fig. 1 is the synoptic diagram of sputter equipment of the present invention.
Fig. 2 is the AC power synoptic diagram.
Fig. 3 (a) is the synoptic diagram of electric arc detecting device.Signal by current waveform, voltage waveform when (b) taking place for arc-over changes synoptic diagram.(c) be to import synoptic diagram to the signal of volts lost testing circuit.(d) detect synoptic diagram for arc-over.(e) be (b) show arc-over the time signal enlarged diagram that changes.
Fig. 4 (a) is the electric arc detecting device synoptic diagram of another embodiment.The signal of voltage waveform changes synoptic diagram when (b) taking place for arc-over.(c) be to import synoptic diagram to the signal of volts lost testing circuit.(d) detect synoptic diagram for arc-over.(e) be (b) show arc-over the time signal enlarged diagram that changes.
Fig. 5 (a) is the electric arc detecting device synoptic diagram of another embodiment.The variation synoptic diagram of voltage waveform when (b) taking place for arc-over.
Fig. 6 (a) is the electric arc detecting device synoptic diagram of another embodiment.The variation synoptic diagram of difference waveform when (b) taking place for arc-over.
Nomenclature:
1 sputter equipment
41a, 41b target
6 power feeding section
7 oscillating portions
8 electric arc detecting devices
The E AC power
The K feed cable
Claims (18)
1. sputtering method that each target is carried out sputter; frequency with regulation on a pair of target that is provided with in vacuum chamber by AC power applies voltage with alternately changing polarity; each target alternately is switching to anode electrode, cathode electrode; between anode electrode and cathode electrode, produce glow discharge and form plasma atmosphere; thereby each target is carried out sputter; it is characterized by: detect the voltage waveform of in described a pair of target, exporting; when time of the volts lost time ratio normal glow discharge of judging this output voltage waveforms more in short-term, cut off the output of described AC power.
2. according to the sputtering method of claim 1 record, it is characterized by: detect the output current wave between the described a pair of target, absolute value as this output voltage waveforms surpasses prescribed value, then be considered as producing described glow discharge, when making the grid current signal by the absolute value of this output current wave, absolute value by described output voltage waveforms is made voltage pulse signal, when this grid current signal was in that voltage pulse signal is off-state under the on-state, the fall time that can judge described output voltage waveforms was shorter during than normal glow discharge.
3. according to the sputtering method of claim 1 or 2 records, it is characterized by: in described sputter, will be unanimous on the whole to the output current wave of described target, the phase control of output voltage waveforms.
4. want the sputtering method of 2 or 3 records according to right, it is characterized by: the variation to the input electric power of described a pair of target changes according to AC power to make described prescribed value.
5. according to the sputtering method of claim 1 record, it is characterized by: when making voltage pulse signal by the absolute value of described output voltage waveforms, detect the pulse width of this voltage pulse signal,, shorter when then judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms as this pulse width less than prescribed value.
6. according to the sputtering method of claim 5 record, it is characterized by: described prescribed value can directly be determined by the absolute value of output voltage waveforms, or come to determine indirectly by the pulse width of measuring in advance when arc-over not taking place.
7. according to the sputtering method of claim 1 record, it is characterized by: detect and the proportional differentiated waveform of the volts lost of described output voltage waveforms, when surpassing prescribed value and become big, shorter when then judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms as this differentiated waveform.
8. according to the sputtering method of claim 7 record, it is characterized by: before detecting described differentiated waveform, remove the interference of output voltage waveforms by filtering circuit.
9. according to the sputtering method of claim 7 or 8 records, it is characterized by: described output voltage waveforms is sine wave roughly.
10. according to the sputtering method of claim 1 record, it is characterized by: detect the output current wave between described a pair of target, the phase place of described output voltage waveforms and output current wave and amplitude are adjusted to the difference waveform that detects its waveform after roughly consistent, when this difference waveform surpasses prescribed value and becomes big, shorter when then judging the normal glow discharge of the volts lost time ratio of described output voltage waveforms.
11. the sputtering method according to claim 10 record is characterized by: before detecting described difference waveform, remove the interference of output voltage waveforms and output current wave by filtering circuit.
12. according to the sputtering method of claim 10 or 11 records, it is characterized by: described output voltage waveforms and output current wave are sine wave roughly.
13. sputter equipment, it is characterized by: have a pair of target that in vacuum chamber, is provided with, and the AC power that between described a pair of target, applies voltage with the frequency of regulation with alternately changing polarity, be provided with electric arc detecting device, it detects the shorter volts lost of time to the volts lost time ratio normal glow discharge of the output voltage waveforms of described target; Shut-off device, the output from AC power is cut off in its output with arc detection circuitry.
14. the sputter equipment according to claim 13 record is characterized by: on described AC power phase adjusting device is set, makes to the output voltage waveforms of a pair of target and the phase place basically identical of output current wave.
15. sputter equipment according to claim 13 or 14 records, it is characterized by: described electric arc detecting device has: the first absolute value testing circuit and the second absolute value testing circuit, and it detects the output current wave between described a pair of target and the absolute value of output voltage waveforms; Grid current signal generating circuit and voltage pulse signal generation circuit, it is provided with comparer, imports absolute value and detection level from the first absolute value testing circuit and the second absolute value testing circuit respectively; The volts lost testing circuit, it imports grid current signal and voltage pulse signal from grid current signal generating circuit and voltage pulse signal generation circuit respectively; When this grid current signal is in that voltage pulse signal is off-state under the on-state, can detect the fall time of shorter volts lost during than normal glow discharge.
16. according to the sputter equipment of claim 13 or 14 records, it is characterized by: described electric arc detecting device has: the absolute value testing circuit, it detects the absolute value of the output voltage waveforms between described a pair of target; Voltage pulse generation circuit, it is provided with comparer, and input is from the absolute value and the detection level of described absolute value testing circuit; The volts lost testing circuit, its input is from the voltage pulse signal of voltage pulse generation circuit; Detect the pulse width of the voltage pulse signal of importing in the volts lost testing circuit,, can detect the fall time of shorter volts lost during than normal glow discharge when this pulse width during less than prescribed value.
17. according to the sputter equipment of claim 13 or 14 records, it is characterized by: described electric arc detecting device has: differentiating circuit, the proportional differentiated waveform of volts lost of the output voltage waveforms between its detection and described a pair of target; The absolute value testing circuit, it detects the absolute value of the output voltage waveforms of described differentiating circuit; The voltage derivative waveform circuit, it is provided with comparer, and input is from the absolute value and the detection level of absolute value testing circuit; When the absolute value of this differentiated waveform surpasses prescribed value and becomes big, can detect the fall time of shorter volts lost during than normal glow discharge.
18. according to the sputter equipment of claim 13 or 14 records, it is characterized by: described electric arc detecting device has: first and second each gain adjustment circuit, its amplitude with output voltage waveforms between described a pair of target and output current wave are adjusted into roughly consistent; Differentiating amplifier, it detects from the output voltage waveforms of each gain adjustment circuit and the difference waveform of output current wave; The absolute value testing circuit, it detects the absolute value from the wave of described differentiating amplifier; The difference waveform testing circuit, it has comparer, and input is from the wave and the detection level of absolute value testing circuit; When the absolute value of this wave surpasses prescribed value and becomes big, can detect the fall time of shorter volts lost during than normal glow discharge.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2006003444A JP4963023B2 (en) | 2006-01-11 | 2006-01-11 | Sputtering method and sputtering apparatus |
| JP003444/2006 | 2006-01-11 | ||
| PCT/JP2007/050200 WO2007080905A1 (en) | 2006-01-11 | 2007-01-11 | Sputtering method and sputtering system |
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| CN101370959A true CN101370959A (en) | 2009-02-18 |
| CN101370959B CN101370959B (en) | 2011-01-12 |
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| JP (1) | JP4963023B2 (en) |
| KR (1) | KR101028050B1 (en) |
| CN (1) | CN101370959B (en) |
| TW (1) | TWI392755B (en) |
| WO (1) | WO2007080905A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103348038A (en) * | 2011-02-08 | 2013-10-09 | 夏普株式会社 | Magnetron sputtering device, method for controlling magnetron sputtering device, and film forming method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5016819B2 (en) * | 2006-01-11 | 2012-09-05 | 株式会社アルバック | Sputtering method and sputtering apparatus |
| JP5322235B2 (en) * | 2007-08-20 | 2013-10-23 | 株式会社アルバック | Sputtering method |
| JP5429771B2 (en) * | 2008-05-26 | 2014-02-26 | 株式会社アルバック | Sputtering method |
| US9613784B2 (en) | 2008-07-17 | 2017-04-04 | Mks Instruments, Inc. | Sputtering system and method including an arc detection |
| JP5363166B2 (en) * | 2009-03-31 | 2013-12-11 | 株式会社アルバック | Sputtering method |
| DE102010031568B4 (en) | 2010-07-20 | 2014-12-11 | TRUMPF Hüttinger GmbH + Co. KG | Arclöschanordnung and method for erasing arcs |
| DE102013110883B3 (en) * | 2013-10-01 | 2015-01-15 | TRUMPF Hüttinger GmbH + Co. KG | Apparatus and method for monitoring a discharge in a plasma process |
| EP2905801B1 (en) | 2014-02-07 | 2019-05-22 | TRUMPF Huettinger Sp. Z o. o. | Method of monitoring the discharge in a plasma process and monitoring device for monitoring the discharge in a plasma |
| TWI617687B (en) * | 2014-12-04 | 2018-03-11 | 財團法人金屬工業研究發展中心 | Monitoring method and system for a sputter device |
| KR101757818B1 (en) | 2015-10-12 | 2017-07-26 | 세메스 주식회사 | Apparatus for monitoring pulsed radio frequency power, and apparatus for treating substrate comprising the same |
| JP2019189913A (en) * | 2018-04-26 | 2019-10-31 | 京浜ラムテック株式会社 | Sputtering cathode, sputtering cathode assembly and sputtering apparatus |
| US11668309B2 (en) * | 2020-07-31 | 2023-06-06 | Japan Atomic Energy Agency | Vacuum component and evacuation method using the same |
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| DE4441206C2 (en) * | 1994-11-19 | 1996-09-26 | Leybold Ag | Device for the suppression of rollovers in cathode sputtering devices |
| JPH09170079A (en) * | 1995-12-18 | 1997-06-30 | Asahi Glass Co Ltd | Sputtering method and device |
| CN1228810C (en) * | 1997-04-21 | 2005-11-23 | 东京电子亚利桑那公司 | Method and appts. for ionized sputtering of materials |
| JPH11200036A (en) * | 1998-01-16 | 1999-07-27 | Toshiba Corp | Production of thin film and sputtering device therefor |
| JP2001003166A (en) * | 1999-04-23 | 2001-01-09 | Nippon Sheet Glass Co Ltd | Method for coating surface of substrate with coating film and substrate by using the method |
| JP2002012969A (en) * | 2000-07-03 | 2002-01-15 | Sanyo Shinku Kogyo Kk | Method for controlling sputtering apparatus |
| JP4780972B2 (en) * | 2004-03-11 | 2011-09-28 | 株式会社アルバック | Sputtering equipment |
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| CN103348038A (en) * | 2011-02-08 | 2013-10-09 | 夏普株式会社 | Magnetron sputtering device, method for controlling magnetron sputtering device, and film forming method |
| CN103348038B (en) * | 2011-02-08 | 2015-05-20 | 夏普株式会社 | Magnetron sputtering device, method for controlling magnetron sputtering device, and film forming method |
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| TW200732488A (en) | 2007-09-01 |
| CN101370959B (en) | 2011-01-12 |
| JP4963023B2 (en) | 2012-06-27 |
| TWI392755B (en) | 2013-04-11 |
| JP2007186725A (en) | 2007-07-26 |
| WO2007080905A1 (en) | 2007-07-19 |
| KR101028050B1 (en) | 2011-04-08 |
| KR20080078053A (en) | 2008-08-26 |
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