CN101347876A - Water-soluble scaling powder for lead-free solder of tin silver zinc series - Google Patents
Water-soluble scaling powder for lead-free solder of tin silver zinc series Download PDFInfo
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- CN101347876A CN101347876A CNA2008101512533A CN200810151253A CN101347876A CN 101347876 A CN101347876 A CN 101347876A CN A2008101512533 A CNA2008101512533 A CN A2008101512533A CN 200810151253 A CN200810151253 A CN 200810151253A CN 101347876 A CN101347876 A CN 101347876A
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Abstract
The invention relates to a water-soluble soldering flux which is suitable for tin, silver and zinc series lead-free solder. The weight percentage of all the components is as follows: 0.1-22 % of activating agent, 0.1-25 % of wetting agent, 0.1-5% of thixotropic agent, 0.1-2 % of corrosion inhibitor, 0.1-5 % of oxidation inhibitor and solvent for the rest. The invention aims at the problem that the existing soldering flux of leaded solder is not suitable for lead-free solder and provides the water-soluble soldering flux which can be effectively matched with lead-free solder, especially applicable to tin, silver and zinc series lead-free solder; the water-soluble soldering flux can improve wettability, antioxidant ability and solderability of lead-free solder, can meet the requirements of welding temperature of lead-free solder, and causes little corrosion to lead-free solder alloy; postwelding residue is little and can be washed away by water; welding spots have good quality, smooth surfaces and strong stability; a dried circuit board has high insulation resistance value.
Description
Technical field
The present invention relates to a kind of scaling powder, be particularly useful for the water-soluble flux of lead-free solder of tin silver zinc series.
Background technology
Work closely-related various electronic product when promoting the well-being of mankind with the human lives, also because of the use of solder containing pb in the electronic product healthy and ecological environment of harm humans day by day.The discarded tissue of electronic electric equipment under the leader of European Union (WEEE) requirement stopped in the electronic assemblies industry in 2006 uses lead-containing materials.American National electronics manufacturing association (NEMI) specially for carrying out one " the unleaded plan of the welding of NEMI " by name for this reason comes the unleaded use problem that is assemblied in the electronics industry of system research; The main consumer electronics manufacturing enterprise of Japan also promises to undertake round Realization leadless electronic assembling as early as possible one after another, and everything makes the research of lead-free solder extremely urgent.For meeting the unleaded tide of global synchronization welding, the lead-free solder patent barrier of avoiding having developed is in the world formulated the task of top priority that the lead-free solder development strategy that is fit to China's actual conditions has become China Electronics's assembly industry.And requirement must have the corresponding scaling powder can supporting with it use in the research and development process of lead-free solder.
Studying more and preliminary business-like lead-free solder at present in the world is Sn-Ag and Sn-Ag-Cu eutectic alloy.But in research and use, find that compare with traditional Sn-Pb scolder, the lead-free solder wetability is poor, easily oxidation, and fusing point height.Therefore be adapted to the scaling powder of solder containing pb, lead-free solder is not suitable for, the one, this class scaling powder helps the wetting ability of lead-free solder not enough; The 2nd, be not suitable for the high welding temperature of lead-free solder; the rising of fusing point means that welding temperature must improve; just easy more oxidation of the high more solder joint of temperature on the one hand; will inevitably increase the volatilization of activating agent in the scaling powder on the other hand; and do not have good activation and protective effect, thereby make the easier oxidation of solder joint.
Summary of the invention
The object of the invention mainly is at the inadaptability of existing solder containing pb scaling powder to lead-free solder, and a kind of water-soluble flux that can effectively cooperate lead-free solder to use is provided, and technical scheme of the present invention is as follows:
Lead-free solder of tin silver zinc series of the present invention with each component of water-soluble flux and middle weight percentage is: activating agent 0.1-22wt%, and wetting agent 0.1-25wt%, thixotropic agent 0.1-5wt%, corrosion inhibiter 0.1-2wt%, antioxidant 0.1-5wt%, all the other are solvent.
Described activating agent is one or more a mixture of methylamine, dimethylamine, trimethylamine, ethamine, isopropylamine, butylamine, dibutyl amine and dimethylamine hydrochloride or diethylamine hydrochloride.
Described wetting agent is glycerine and other polyalcohol or ether, and wetting agent can reduce the scaling powder surface tension, promotes the wetting of itself and metal surface, strengthens welding effect; Glycerine and other polyalcohol or ether can be used as cosolvent raising activating agent again simultaneously, and the dissolubility of thixotropic agent corrosion inhibiter and antioxidant makes it not produce depositional phenomenon.
Described thixotropic agent is a rilanit special, and it mainly acts on is to give soldering paste certain thixotropic property, and promptly soldering paste viscosity under stress diminishes, so that the soldering paste printing.Finish printing, at the state of not stressing, its viscosity increases, and to keep intrinsic shape, prevents that soldering paste from subsiding.
Described corrosion inhibiter is benzimidazole or toluene and imidazoles, plays antopxidation, reduces the corrosivity of scaling powder to printed board.
Described antioxidant is a phenols, modified cellulose, and phenolic resins, acetal or polyethers, purpose is to prevent the scolder oxidation, because zinc is oxidized easily in the lead-free solder of tin silver zinc series.
Described remaining solvent is a deionized water.
The present invention is directed to the inadaptability of existing solder containing pb scaling powder to lead-free solder, a kind of water-soluble flux that can effectively cooperate lead-free solder to use is provided, be particularly useful for lead-free solder of tin silver zinc series, improve its wetability and oxidation resistance, can strengthen the solderability of lead-free solder, and the welding temperature requirement of energy adapted to leadless scolder, little to the leadless welding alloy corrosiveness, the postwelding residue is few, and can wash by water totally, quality of welding spot is good, any surface finish, stability is strong, and dried circuit board has higher insulating resistance value.
Description of drawings
Fig. 1: with the solder joint after traditional scaling powder welding;
Fig. 2: with the solder joint after the scaling powder welding of the present invention.
The specific embodiment
What each component was given all is weight percentage.
Example 1
Diethylamine hydrochloride 22
Glycerine (glycerine) 20
Carbitol 5
Rilanit special 1
Benzimidazole 0.1
Phenolic resins 0.5
Deionized water 51.4
Example 2
Dimethylamine hydrochloride 15
Glycerine (glycerine) 5
Diethylene glycol butyl ether 7
Rilanit special 2.5
Benzimidazole 0.9
Modified cellulose (methylcellulose) 0.1
Deionized water 69.5
Welding back effect as shown in Figure 2.
It is identical adopting ethyl cellulose or CMC to replace the methylcellulose effect in the above-mentioned example.
Example 3
Dimethylamine 0.1
Glycerine (glycerine) 15
Hexylene glycol 8
Rilanit special 0.1
Toluene and imidazoles 2
Dimethoxym ethane 2.3
Deionized water 72.5
Example 4
Trimethylamine 3
Butylamine 3
Glycerine (glycerine) 0.1
Rilanit special 5
Toluene and imidazoles 1.4
Bisphenol-A 5
Deionized water 82.5.
The effect of the scaling powder that adopts present embodiment 2 and traditional scaling powder is as shown in Figure 1, 2: Fig. 1, Fig. 2 are respectively welding solder joint photo afterwards, all are 5 millimeters Cu substrates of Sn-3.7Ag-3Zn scolder and diameter, earlier scaling powder is applied to the Cu substrate surface by the industrial production flow process, again solder fusing is welded.As seen from Figure 1, scolder substantially can not drawout on the Cu plate, and traditional scaling powder does not have wetting action.In addition, the solder joint jaundice illustrates that oxidation has taken place scolder, and traditional scaling powder does not play anti-oxidation purpose.By shown in Figure 2, scolder is sprawled on the Cu plate substantially fully, and the solder joint light, so the scaling powder of present patent application not only has good wetting effect to lead-free solder of tin silver zinc series, and can also prevent that lead-free solder of tin silver zinc series is oxidized.
The present invention is not limited to the technology described in the example; its description is illustrative; and it is nonrestrictive; authority of the present invention is limited by claim; based on present technique field personnel according to the present invention can change, technology related to the present invention that method such as reorganization obtains, all in protection scope of the present invention.
Claims (7)
1. be used for the water-soluble flux of lead-free solder of tin silver zinc series, it is characterized in that: component and weight percentage are as follows:
Activating agent 0.1-22wt%,
Wetting agent 0.1-25wt%,
Thixotropic agent 0.1-15wt%,
Corrosion inhibiter 0.1-2wt%,
Antioxidant 0.1-5wt%,
All the other are solvent.
2. water-soluble flux as claimed in claim 1 is characterized in that described activating agent is one or more a mixture of methylamine, dimethylamine, trimethylamine, ethamine, isopropylamine, butylamine, dibutyl amine and dimethylamine hydrochloride or diethylamine hydrochloride.
3. water-soluble flux as claimed in claim 1 is characterized in that described wetting agent and cosolvent are glycerine and other polyalcohol or ether, and wetting agent can reduce the scaling powder surface tension, promotes the wetting of itself and metal surface, strengthens welding effect; Cosolvent improves activating agent, and the dissolubility of thixotropic agent corrosion inhibiter and antioxidant makes it not produce depositional phenomenon.
4. water-soluble flux as claimed in claim 1 is characterized in that described thixotropic agent is a rilanit special.
5. water-soluble flux as claimed in claim 1 is characterized in that described corrosion inhibiter is benzimidazole or toluene and imidazoles.
6. water-soluble flux as claimed in claim 1 is characterized in that described antioxidant is a phenols, modified cellulose, phenolic resins, acetal or polyethers.
7. water-soluble flux as claimed in claim 1 is characterized in that described remaining solvent is a deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101512533A CN101347876A (en) | 2008-09-05 | 2008-09-05 | Water-soluble scaling powder for lead-free solder of tin silver zinc series |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101512533A CN101347876A (en) | 2008-09-05 | 2008-09-05 | Water-soluble scaling powder for lead-free solder of tin silver zinc series |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101347876A true CN101347876A (en) | 2009-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101512533A Pending CN101347876A (en) | 2008-09-05 | 2008-09-05 | Water-soluble scaling powder for lead-free solder of tin silver zinc series |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059478A (en) * | 2010-11-25 | 2011-05-18 | 湖南嘉业达电子有限公司 | Lead-free water-soluble environmental-friendly soldering flux for piezoelectric ceramics and preparation method thereof |
| CN102126094A (en) * | 2011-01-15 | 2011-07-20 | 广州市铠特电子材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN103648231A (en) * | 2013-11-18 | 2014-03-19 | 无锡俊达测试技术服务有限公司 | Pcb |
| CN110303272A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Brass base, Ni-based needle tubing halogen-free environmental solder(ing) paste and preparation method thereof |
| CN112589318A (en) * | 2020-11-12 | 2021-04-02 | 深圳市晨日科技股份有限公司 | Water-soluble lead-free soldering paste, water-washing solder paste and preparation method thereof |
| CN114633046A (en) * | 2022-03-14 | 2022-06-17 | 深圳市同方电子新材料有限公司 | High-stability environment-friendly soldering paste and preparation method thereof |
-
2008
- 2008-09-05 CN CNA2008101512533A patent/CN101347876A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059478A (en) * | 2010-11-25 | 2011-05-18 | 湖南嘉业达电子有限公司 | Lead-free water-soluble environmental-friendly soldering flux for piezoelectric ceramics and preparation method thereof |
| CN102126094A (en) * | 2011-01-15 | 2011-07-20 | 广州市铠特电子材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN103648231A (en) * | 2013-11-18 | 2014-03-19 | 无锡俊达测试技术服务有限公司 | Pcb |
| CN110303272A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Brass base, Ni-based needle tubing halogen-free environmental solder(ing) paste and preparation method thereof |
| CN112589318A (en) * | 2020-11-12 | 2021-04-02 | 深圳市晨日科技股份有限公司 | Water-soluble lead-free soldering paste, water-washing solder paste and preparation method thereof |
| CN114633046A (en) * | 2022-03-14 | 2022-06-17 | 深圳市同方电子新材料有限公司 | High-stability environment-friendly soldering paste and preparation method thereof |
| CN114633046B (en) * | 2022-03-14 | 2024-04-16 | 深圳市同方电子新材料有限公司 | High-stability environment-friendly soldering paste and preparation method thereof |
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Open date: 20090121 |