CN101345237B - Embedded tenon type packaging structure and manufacturing method thereof - Google Patents
Embedded tenon type packaging structure and manufacturing method thereof Download PDFInfo
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- CN101345237B CN101345237B CN 200810128655 CN200810128655A CN101345237B CN 101345237 B CN101345237 B CN 101345237B CN 200810128655 CN200810128655 CN 200810128655 CN 200810128655 A CN200810128655 A CN 200810128655A CN 101345237 B CN101345237 B CN 101345237B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention provides an embedded tenon-typed encapsulating structure, comprising a bearing device and a chip; the bearing device is provided with an upper surface and a lower surface which face to each other; the upper surface is provided with at least one bulge or a convex tenon; the lower surface is provided with a concave trough or a concave tenon; the shape, size and position of the concave tenon are corresponding to that of the convex tenon; therefore, two bearing devices can be piled and jointed together by the tenon connection of the upper surface and the lower surface. At least one external surface of the bulge is provided with a conductive material; at least one internal side surface of the concave trough is correspondingly provided with an conductive material; when the bulge and the concave trough are connected with each other by the tenon, the electric connection is formed between the electric conductive materials; the bearing device is internally embedded with at least one chip that is provided with a functional surface and a back surface which are electrically connected with the upper surface and the lower surface of the bearing device respectively.
Description
[technical field]
The invention relates to a kind of loose tongue formula encapsulating structure and manufacture method thereof, and particularly relevant for utilizing the built-in type Chip Packaging to realize the loose tongue formula encapsulating structure and the manufacture method thereof of the accurate contraposition of stacking-type encapsulation.
[background technology]
Fast development along with electronic product, integrated circuit (IC) has become indispensable product of information age, for example: (Personal Digital Assistant PDA) with digital camera etc., does not have the trace of invisible integrated circuit for notebook computer, mobile phone, personal digital assistant.With regard to the chip packing-body in the electronic product, in order to satisfy the multi-functional demand with the high-speed high frequency computing of electronic product, must increase the quantity of active element, but must meet designing requirements such as external form is compact, size microminiaturization simultaneously again.
Therefore, for satisfying the demand of in the middle of limited encapsulating structure space, holding the huge electronic component of number, there is the packaged type of many integrated circuits can supply to utilize at present, for instance, the flip-over type encapsulation (Flip Chip) that chip is faced down and combine with substrate by Solder Bumps, quad flat package (Quad FlatPackage, QFP), be to support encapsulating structure by conductive metal frames, by the two sides or the pin on four limits is connected with circuit board, sphere grid array (Ball grid array, BGA) be to be connected with circuit board by the tin ball, or the built-in type Chip Packaging (Chip in Polymer, CIP).The built-in type Chip Packaging is utilized ultra-thin chip buried-in increasing in the layer structure at plated circuit, main earlier chip being loaded on the substrate, utilize dielectric material to form dielectric layer afterwards again and chip is imbedded in wherein, utilize electroless mode that plain conductor is produced on the dielectric material again, for electrically connecting chip and substrate.Yet the problem that the built-in type chip package process is produced is, its yield depends on the uniformity of its dielectric layer, because dielectric layer is to be shaped in the mode that rotation applies, behind exposure imaging, can produce microcellular structure, therefore the uniformity of this dielectric layer just is difficult to control in manufacture process, has further influenced the yield of built-in type Chip Packaging.On the other hand, existing stacking-type encapsulation is to utilize adhesive agent to stick together fixing a plurality of built-in type chips, and utilizes the configuration of various different modes to form the stacking-type encapsulation.But through after the thermal cycle repeatedly, adhesive agent may produce the phenomenon of delamination in the course of processing, or when carrying out storehouse technology, the accuracy of the contraposition between these substrates can produce flaw, causes encapsulating the reduction of yield.Therefore, the present invention will propose a kind of semiconductor chip package and method of novelty, to solve the above problems.
[summary of the invention]
The object of the present invention is to provide a kind of loose tongue formula encapsulating structure, it can utilize groove and the corresponding protrusion that is arranged on the carrier apparent surface, both mutual clampings, and contraposition exactly when guaranteeing the storehouse processing procedure avoids producing the contraposition flaw.
Another object of the present invention is to provide a kind of loose tongue formula encapsulating structure, it can be connected together two or more carriers by the joggle mode and form a kind of storehouse packaging body, and electrical connection device need not be set in addition, thereby the required space of reduction circuit significantly.
For reaching aforementioned purpose of the present invention, the present invention proposes a kind of loose tongue formula encapsulating structure, comprise a carrier and in be embedded at least one chip of this carrier inside, wherein this carrier has a upper surface and a lower surface, this chip has a function face and a back side, the upper surface of this carrier is provided with at least one protrusion, this at least one protrusion is provided with first electric conducting material, be formed with a groove on the lower surface of carrier, the shape of groove and this protrusion complementation, thereby can plant clamping mutually, be provided with second electric conducting material in this groove, in the time of can be in the protrusion of accepting another carrier be planted it, be in contact with one another with first electric conducting material of this protrusion and form electric connection, the function face of chip and the protrusion of this carrier setting are electric connection, and the set groove of the back side of chip and this carrier is electric connection.
The present invention also provides a kind of manufacture method of loose tongue formula encapsulating structure, its step comprises: a carrier is provided, this carrier is inserted and put to cooperate with one second loading plate by one first loading plate and forms, and the upper surface of this first loading plate is provided with at least one protrusion, and the lower surface of second loading plate of its relative position is provided with at least one groove, and the groove of these carrier lower surfaces is corresponding to this protrusion of another carrier; At least one chip is provided, and those chip buried-ins are in this carrier, and its chip has a function face, and with the relative back side of this function face; Electrically connect this function face and this protrusion; And electrically connect this back side and this groove.
Compared to prior art, the present invention not only can utilize the groove and the protrusion that are arranged on the substrate (carrier) to form contraposition stacking-type encapsulation accurately, also can eliminate between substrate the flaw of issuable contraposition accuracy, while and the electric connection space that can significantly shorten this stacking-type packaging body, strengthen electrical property efficiency, reduced the volume of packaging body.Because do not need to use dielectric layer, therefore encapsulate the puzzlement that to exempt the dielectric layer crawling fully simultaneously by the formed stacking-type of loose tongue formula encapsulating structure of the present invention.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
[description of drawings]
Fig. 1 is the schematic diagram of loose tongue formula encapsulating structure of the present invention.
Fig. 2 is the schematic diagram of the manufacture method of loose tongue formula encapsulating structure of the present invention.
Fig. 3 is the stack package structure schematic diagram that is formed according to loose tongue formula encapsulating structure of the present invention institute storehouse by a plurality of.
Fig. 4 is the schematic diagram after loose tongue formula encapsulating structure is constituted according to the present invention storehouse seals film.
[embodiment]
Below will cooperate the graphic loose tongue formula encapsulating structure of the present invention that illustrates, wherein Fig. 1 schematically demonstrates a kind of loose tongue formula encapsulating structure according to a preferred embodiment of the present invention, as shown in Figure 1, this loose tongue formula encapsulating structure includes a carrier 20, and it is to illustrate as example with a substrate in the present embodiment.But this carrier 20 also can be any suitable works or parts, and enforcement of the present invention also is not limited to substrate.
According to a viewpoint of the present invention, be provided with a protrusion 23 at this upper surface 211, on lower surface 221, be formed with a groove 24.This protrusion 23 and groove 24 in the position and in shape in correspondence with each other so the protrusion 23 on the carrier 20 can insert and be fastened on the groove 24 on another carrier, make two carriers 20 can storehouse and be fixed together, and form a packaged type storehouse body.This will further be illustrated hereinafter.
In the present embodiment, this protrusion 23 is arranged to have top surface and a plurality of side outer wall surface, these surfaces with respect to this protrusion 23, groove 24 also has corresponding bottom side surface and side inner wall surface, when the protrusion 23 of a carrier 20 is inserted in the groove 24 of another carrier 20, the top surface of this protrusion 23 is engageable to the bottom side surface of this groove 24, and the outer wall surface of this protrusion 23 is engaged in the inner wall surface of this groove 24.
According to another viewpoint of the present invention, have at least one to be provided with the first electric conducting material (not shown) in the top surface of this protrusion 23 and the outer wall surface, metal material preferably, for example alloy or other material of gold, silver, copper or its etc. with appropriateness.This first electric conducting material can be arranged on the top surface or outer wall surface of this protrusion 23 by any suitable mode, for example electroplates or other technology well known in the art.In addition, on the bottom side surface of this groove 24 and inner wall surface also with respect to lip-deep first electric conducting material of this protrusion 23 and be provided with the second electric conducting material (not shown), second electric conducting material in this groove 24 is arranged to corresponding to first electric conducting material on this protrusion 23, therefore when the protrusion 23 of a carrier 20 is inserted in the groove 24 of another carrier 20, first electric conducting material on this protrusion 23 can contact with second electric conducting material in this groove 24, electrically connects thereby form betwixt.
As first electric conducting material on the protrusion 23, second electric conducting material in the groove 24 can be any suitable electric conducting material, in preferred embodiment of the present invention, this electric conducting material is metal material preferably, for example alloy or other material of gold, silver, copper or its etc. with suitable conductivity, and this second electric conducting material can be arranged on the bottom side surface or inner wall surface of this groove 24 by any suitable mode, for example electroplates or other technology well known in the art.In addition, whether in the present invention, it is identical not limit first and second electric conducting material, but is based on the convenience of manufacturing, and first and second electric conducting material is preferable with identical material.
Loose tongue formula encapsulating structure of the present invention also includes a chip 10 that is embedded in this carrier 20, and this chip 10 has a function face 101, and a back side 102 relative with this function face 101.This chip 10 is arranged in this carrier 20 and 23 of the protrusions of its function face 101 and this carrier 20 is formed electrically connect, and the back side 102 of this chip 10 and the groove 24 of this carrier 20 also form electric connection.The electric connection that this function face 101 and protrusion are 23, and the electric connection of 24 of the back side 102 and grooves can see through any suitable mode and realize.In preferred embodiment of the present invention, electric connection between these members is to see through the lead (not shown) that is embedded in this carrier 20 to realize, just the function face 101 of this chip 10 (or back side 102) is to be connected the electric connection that forms therebetween by the lead that is embedded in the carrier 20 with the protrusion 23 (or groove 24) of carrier 20.In a preferred embodiment of the present invention, these leads are to be made of metal, for example the alloy of gold, silver, copper or its etc.
In illustrated embodiment, the upper surface 211 of carrier 20 of the present invention and lower surface 221 relatively and be parallel to each other, chip 10 is embedded in this carrier 20 and makes its function face 101 relative with upper surface 211, the back side 102 is relative with lower surface 221.In a preferred embodiment, the function face 101 of this chip 10 is parallel to each other with the back side 102, and parallel to each other with the upper surface and the lower surface 211,221 of carrier 20.That is to say that this chip 10 is arranged to form the relation that is arranged in parallel with carrier 20 haply.But this only is a kind of aspect on the invention process, and the present invention is not limited to this aspect, also can be applied to the arrangement situation of other kinds.
See also Fig. 2, demonstrate the schematic diagram that is similar to Fig. 1, in order to the manufacture method of explanation according to the loose tongue formula encapsulation of the embodiment of the invention.As shown in Figure 2, this carrier 20 is made of first loading plate 21 and second loading plate 22, and the two inserts and puts cooperation mutually and forms carrier 20 by sticking together.This first loading plate 21 and second loading plate 22 all have opposed inside and outer surface, and be arranged to make the inner surface of the two to fit together first loading plate 21 and second loading plate 22, and this chip 10 is folded in therebetween, thereby this chip 10 can be embedded in fully by in first and second loading plate 21,22 carriers that constituted 20.The outer surface of first and second loading plate 21,22 constitutes the upper surface 211 and the lower surface 221 of this carrier 20 respectively.In illustrated embodiment, the outer surface of this first loading plate 21 constitutes the upper surface 211 of carrier 20, and the outer surface of this second loading plate 22 constitutes the lower surface 221 of this carrier 20.But in enforcement of the present invention, be not limited to this arrangement, the arrangement that also can adopt other to be fit to.This first loading plate 21 and second loading plate 22 can see through any suitable mode and combine.
See also Fig. 3, wherein demonstrate the stack type encapsulation structure that together constitutes according to the loose tongue formula encapsulating structure storehouse of the embodiment of the invention by a plurality of.Wherein illustrated as the front, each carrier 20 all has upper surface 211 and reaches and these upper surface 211 opposing lower surface 221, and this upper surface 211 is provided with at least one protrusion 23, and lower surface 221 is provided with at least one groove 24 that corresponds respectively to this at least one protrusion 23.Therefore when two adjacent carriers 20 respectively with the relative mode storehouse of upper surface and lower surface together the time, wherein the protrusion 23 on the upper surface 211 of a carrier 20 can be inserted in the groove 24 on the lower surface 221 of another carrier 20, and clamping is the stacking-type encapsulation mutually.The groove 24 that utilizes two carriers 20 and 23 of protrusions cooperate and clamping can provide this two carrier 20 contraposition modes more accurately, and then improve the yield of this packaging body.But for those skilled in the art in this area, the setting of these protrusion 23 grooves 24 can be adopted any suitable configuration, for example set protrusion 23 and the groove 24 of the upper surface of a carrier 20 and lower surface might not have identical quantity and the position is set, also not necessarily to have complementary or identical shape, but protrusion 23 and 24 of the grooves that connects of planting mutually on the upper and lower surface of adjacent carrier 20 must have corresponding shape, position and quantity, is beneficial to the joint of the two.But with regard to making convenience, should be advisable with the protrusion 23 and the groove 24 of equal number, position and shape.
In addition, the top surface of each protrusion 23 and side outer wall surface are provided with first electric conducting material, and the bottom side surface of each groove 24 and side inner wall surface are provided with second electric conducting material.These first and second electric conducting materials see through that protrusion 23 is inserted in the groove 24 and when being joined together at adjacent two carriers 20, can be in contact with one another and form electric connection.Two adjacent carriers 20 can electrically connect as required and mutually up and down by this way, exempt the demand that electric connection or apparatus parts are set in addition, therefore can simplify overall structure, and reduce the required space of this stacking-type packaging body, strengthen whole electrically effect.
First and second set electric conducting material can only be arranged on the specific relative position on protrusion 23 and the groove 24 on protrusion 23 and the groove 24, also can be covered on the institute surface of this protrusion 23 and groove 24 comprehensively, perhaps all be covered with electric conducting material on one of them all surfaces of protrusion 23 and groove 24, another only is provided with electric conducting material on privileged site.These change the variation that all belongs on the invention process, can further change according to the demand of particular implementation aspect and make up, but its main points are and can form certain and firm electric connection at protrusion 23 that plugs and 24 of grooves.
As previously mentioned, in each carrier 20, be provided with at least one chip 10, and this chip 10 all is embedded in this carrier 20 inside fully.The function face 101 of each chip 10 and the back side 102 all are to see through suitable electric installation, as are embedded in the lead (not shown) in the carrier, and with these carrier 20 upper and lower surfaces 211,221 on set protrusion 23 form with groove 24 and electrically connect.Therefore when a plurality of carrier 20 storehouses form stacking-type encapsulation together, chips 10 in each carrier 20 can see through the electric connection of the groove 24 of 20 of adjacent carriers and protrusion 23 and form the electric connection of 10 of chips, so significantly shorten the electric connection space of this stacking-type packaging body, strengthen whole electrical property efficiency.
In addition, as shown in Figure 3, storehouse carrier 20 together might not have identical size and shape, as long as protrusion 23 and groove 24 on its upper and lower surface are corresponding and can engage one another on shape, quantity and position.
Further consult Fig. 4, demonstrate the schematic diagram after storehouse body among Fig. 3 carries out the colloid encapsulation.As shown in Figure 4, can further utilize resin or other suitable material to carry out packaging operation on the storehouse body that a plurality of carriers 20 are constituted.That is to say, on the upper surface 211 of the carrier 20 of these storehouse body the superiors, can be provided with a sealing 25, thereby the periphery that this sealing 25 may extend into this storehouse body covers these carriers 20.Among the embodiment shown in the figure, be somebody's turn to do in the storehouse body that forms by 20 storehouses of a plurality of carriers, its undermost carrier 20 has the surface area greater than other carrier 20, can be when extending downwards around this storehouse body for this sealing 25, bank up thereon and the carrier 20 that the top is all is sealed in this sealing 25 inside.
In addition, if needed, can on the lower surface 221 of the carrier 20 of this storehouse packaging body bottom, a plurality of tin balls 26 be set for electrically connecting with other external device (ED).The setting of these tin balls 26 can be matched with the groove 24 on this lower surface 221, or is arranged on the appropriate location on the lower surface 221 in addition, sees through suitable electric installation or element again and is connected on the chip 10 in this bottom carrier 20.The setting of tin ball 26 is technology well known in the art, no longer adds to give unnecessary details at this.
In sum, loose tongue formula encapsulating structure provided by the present invention has not only avoided existing built-in type chip when the coating rotation of carrying out dielectric layer, the puzzlement that causes this packaging body yield to reduce because of the uniformity is not good, simultaneously also engage formation storehouse body with other carriers with protrusion by being arranged on groove on the carrier upper and lower surface, and on the surface of protrusion and the surface of groove all plating electric conducting material is arranged, can realize the electric connection of whole stacking-type packaging body, strengthen whole electrical property efficiency.
Claims (16)
1. a loose tongue formula encapsulating structure includes: a carrier and in be embedded at least one chip of described carrier inside, wherein said carrier has a upper surface and a lower surface, described chip has a function face and a back side, it is characterized in that: the upper surface of described carrier is provided with at least one protrusion, described at least one protrusion is provided with first electric conducting material, be formed with a groove on the lower surface of carrier, the shape of groove and described protrusion complementation, thereby can plant clamping mutually, be provided with second electric conducting material in the described groove, in the time of can be in the protrusion of accepting another carrier be planted it, be in contact with one another with first electric conducting material of described protrusion and form electric connection, the function face of chip and the protrusion of described carrier setting are electric connection, and the set groove of the back side of chip and described carrier is electric connection.
2. loose tongue formula encapsulating structure as claimed in claim 1 is characterized in that: described carrier and described chip are in a parallel set.
3. loose tongue formula encapsulating structure as claimed in claim 1 is characterized in that: the described first conduction material and second electric conducting material include metal material, and described metal material is selected from the group that includes gold, silver, copper and alloy thereof.
4. loose tongue formula encapsulating structure as claimed in claim 1, it is characterized in that: the function face of described chip and the back side utilize lead to be electrically connected on the protrusion and groove of described carrier respectively, thereby make the protrusion of described chip and carrier and groove form electric connection.
5. loose tongue formula encapsulating structure as claimed in claim 1, it is characterized in that: the upper surface of described carrier is provided with a sealing, and in order to cover described carrier, the lower surface of described carrier is provided with several tin balls.
6. a loose tongue formula encapsulating structure includes: several carriers and several chip, wherein said carrier all has a upper surface and a lower surface, described chip is embedded in each carrier inside respectively, each chip all has a function face and a back side, it is characterized in that: the upper surface of carrier is provided with at least one protrusion, its lower surface is provided with at least one groove, the shape of groove and described protrusion complementation, when repeatedly putting together at two carriers, mutually plant clamping and another carrier fix and accurate contraposition, thereby form the storehouse body of described carrier, protrusion is provided with first electric conducting material, be provided with second electric conducting material in the groove, can be when described protrusion be inserted in the groove, contact with each other with described first electric conducting material and form electric connection, and the protrusion of the relative carrier of function face of each chip is electric connection, and the groove of the relative carrier in the back side of described chip is electric connection.
7. loose tongue formula encapsulating structure as claimed in claim 6 is characterized in that: each carrier all is set in parallel with its interior chip.
8. loose tongue formula encapsulating structure as claimed in claim 6 is characterized in that: first electric conducting material and second electric conducting material include metal material, and described metal material is selected from the group that includes gold, silver, copper and alloy thereof.
9. loose tongue formula encapsulating structure as claimed in claim 6 is characterized in that: described groove and protrusion, close-fitting clamping and formation electrically connect mutually, electrically connect so that form between the carrier in the described storehouse body.
10. loose tongue formula encapsulating structure as claimed in claim 6, it is characterized in that: the function face of described chip utilizes lead to be electrically connected to the protrusion of its relevant carrier, the back side of described chip utilizes lead to be electrically connected to the groove of its relevant carrier, and makes the protrusion of described chip and described carrier and groove form electric connection.
11. loose tongue formula encapsulating structure as claimed in claim 6, it is characterized in that: the storehouse packaging body has the superiors' carrier, also be provided with a sealing on its upper surface, in order to covering described carrier, and the lower surface of the orlop carrier of described storehouse body is provided with several tin balls.
12. the manufacture method of a loose tongue formula encapsulating structure is characterized in that: its step comprises:
One carrier is provided, described carrier is inserted and put to cooperate with one second loading plate by one first loading plate and forms, and the upper surface of described first loading plate is provided with at least one protrusion, and the lower surface of second loading plate of its relative position is provided with at least one groove, and the groove of described carrier lower surface is corresponding to the described protrusion of another carrier;
At least one chip is provided, and described chip buried-in is in described carrier, and described chip has a function face, and with the relative back side of described function face;
Electrically connect described function face and described protrusion; And
Electrically connect the described back side and described groove.
13. the manufacture method of loose tongue formula encapsulating structure as claimed in claim 12 is characterized in that: described first loading plate is to insert and put to cooperate with pressurization or close-fitting mode to coat described chip fully with second loading plate.
14. the manufacture method of loose tongue formula encapsulating structure as claimed in claim 12 is characterized in that: be provided with some leads between described chip and the described carrier, be electrically connected to described carrier for described chip.
15. the manufacture method of loose tongue formula encapsulating structure as claimed in claim 12 is characterized in that: the outer wall plating of the surface of described protrusion and side has conductive metallic material, and the surface of described groove and the inwall of side are coated with conductive metallic material.
16. the manufacture method of loose tongue formula encapsulating structure as claimed in claim 12, it is characterized in that: be provided with a sealing on the upper surface of described carrier in addition, and cover described carrier, after sealing, plant the step of tin ball, promptly on the lower surface of described carrier, form several tin balls.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200810128655 CN101345237B (en) | 2008-06-16 | 2008-06-16 | Embedded tenon type packaging structure and manufacturing method thereof |
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| CN 200810128655 CN101345237B (en) | 2008-06-16 | 2008-06-16 | Embedded tenon type packaging structure and manufacturing method thereof |
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| CN101345237A CN101345237A (en) | 2009-01-14 |
| CN101345237B true CN101345237B (en) | 2010-06-02 |
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| CN105280574B (en) * | 2014-07-16 | 2018-12-04 | 日月光半导体制造股份有限公司 | Component-embedded encapsulating structure and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038881A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038881A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate |
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| JP特开平7-294352A 1995.11.10 |
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