CN101336062B - Combination of cooling device - Google Patents

Combination of cooling device Download PDF

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Publication number
CN101336062B
CN101336062B CN 200710076269 CN200710076269A CN101336062B CN 101336062 B CN101336062 B CN 101336062B CN 200710076269 CN200710076269 CN 200710076269 CN 200710076269 A CN200710076269 A CN 200710076269A CN 101336062 B CN101336062 B CN 101336062B
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CN
China
Prior art keywords
pressure section
radiator
fastener
connecting portion
protuberance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200710076269
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Chinese (zh)
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CN101336062A (en
Inventor
余建平
李东云
吴伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN 200710076269 priority Critical patent/CN101336062B/en
Publication of CN101336062A publication Critical patent/CN101336062A/en
Application granted granted Critical
Publication of CN101336062B publication Critical patent/CN101336062B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipating device combination for dissipating heat of an electronic component arranged on a circuit board, comprises: a heat dissipator having a plurality of heat dissipating fins and a buckle tool fixing the heat dissipator on the circuit board. The buckle tool includes a pressing part and two elastic arms respectively arranged on opposite two sides of the pressing part, and the pressing part comprises two slices which are symmetically arranged and have top ends connected to each other, one opening is arranged between the two slices, convex points are projected on inner side top ends mutually oriented of each slice, wherein the heat dissipating fins at the center of the heat dissipator pass through the opening of the pressing part and abut against the convex points, a projected convex part is arranged at the lower end of each slice of the pressing part and pressed at the middle of the heat dissipator. Compared with the prior art, the buckle tool in the heat dissipating device of the invention generates a downward pressing force through the action of the elastic arms, and the pressing force is centralized on the middle part of the heat dissipator so that the heat dissipator is not inclined, and the heat dissipator and the electronic component are fixedly contacted.

Description

The heat abstractor combination
Technical field
The present invention relates to the combination of a kind of heat abstractor, particularly simple in structure, in conjunction with firm heat abstractor combination.
Background technology
When moving, can produce a large amount of heats such as computer cpu, north bridge chips, the contour electronic components of high power of video card, if these heats can not be left effectively, to directly cause temperature sharply to rise, and badly influence the normal operation of electronic devices and components.For this reason, need heat abstractor to come these electronic devices and components are dispelled the heat, traditional heat abstractor generally includes radiator and radiator is fixed to
Fastener on the sub-components and parts.
Above-mentioned heat abstractor in use, earlier radiator is attached on the electronic devices and components end face, utilize the hook between fastener and associated component or structure (for example hole on the circuit board) to make fastener be tight against radiator again, and radiator is closely adhered on the electronic devices and components.Chinese patent has disclosed a kind of similar heat abstractor No. 200320117746.8, it comprises a radiator and two fasteners, this radiator has the communicate groove of radiator both sides and a protruding thorn that forms in opposite directions from the groove both sides, two fasteners are one-body molded by metal wire rod, be arranged in the accommodation space both sides that protruding thorn and groove form respectively, so that radiator is fixed in circuit board.Because two fasteners are separately set in the radiator both sides respectively, when two fasteners bear external force or other reasons and difference occurs, its fastening power that puts on the radiator both sides respectively will change, make radiator both sides unbalance stress, and cause the radiator run-off the straight, cause radiator and electronic devices and components loose contact, and then influence its radiating efficiency.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor simple in structure, that be difficult for run-off the straight to make up in fact.
A kind of heat abstractor combination, be used for being installed on the cooling electronic component on the circuit board, comprise that one has the radiator of some radiating fins and radiator is fixed in a fastener on the circuit board, this fastener comprises a pressure section and lays respectively at two elastic arms of the relative both sides of pressure section, this pressure section comprises and being symmetrical arranged and two lamellar bodies that top end links to each other, one opening is arranged between this two lamellar body, each lamellar body mutually towards inner top side all convex with salient point, wherein the radiator radiating fin that is in centre pass this pressure section opening and with pressure section two lamellar bodies on salient point against, each lamellar body lower end of this pressure section comprises a protuberance that is convexly equipped with, and this protuberance that is convexly equipped with is pressed on the radiator middle part.
Compared with prior art, fastener in the heat abstractor of the present invention combination, the action by elastic arm makes fastener produce a downward pressure, and this pressure is concentrated the middle part that acts on radiator, and do not make the radiator run-off the straight, radiator is firmly contacted with electronic component.
With reference to the accompanying drawings, the invention will be further described in conjunction with concrete execution mode.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor combination of the present invention.
Fig. 2 is the cutaway view of the fastener of heat abstractor combination among Fig. 1.
Fig. 3 is the three-dimensional combination figure of Fig. 1, and wherein fastener is in not buckling state.
Fig. 4 is the three-dimensional combination figure of Fig. 1, and wherein fastener is in buckling state.
Fig. 5 is the cutaway view of Fig. 4.
Embodiment
See also Fig. 1, heat abstractor combination of the present invention comprises a fastener 10 and a radiator 30, and this fastener 10 can be fixed in radiator 30 on the circuit board 50.This circuit board 50 is provided with heat-generating electronic elements 60, and electronic component 60 around be provided with four trips 52.This fastener 10 cooperates with trip 52 on the circuit board 50, radiator 30 firmly can be fitted in electronic component 60 surfaces of circuit board 50.
This radiator 30 comprise one with electronic component 60 substrate contacted 32 and some radiating fins that are arranged in parallel 34 of extending vertically upward along these pedestal 32 end faces, every adjacent two 34 of row's radiating fins form a groove 36.Wherein, the both sides that are in the radiating fin 34 of centre convex with a stage portion 38, this stage portion 38 upwards protrudes out formation from adjacent radiating fin 34 bottoms, radiating fin 34 both sides of centre, this stage portion 38 is provided with at interval with the radiating fin 34 of centre, and the spacing between the more adjacent radiating fin 34 of spacing of the radiating fin 34 of itself and centre is little.
Please further consult Fig. 2, this fastener 10 comprise one can be sheathed on the radiating fin 34 of centre pressure section 12 and from pressure section 12 two ends symmetries, two elastic arms 14 that laterally extend.
This pressure section 12 comprises symmetrically arranged two parallel lamellar bodies, and this two parallel lamellar body top end links to each other.One opening 121 is arranged between two lamellar bodies.This opening 121 is used for wearing for the radiating fin 34 that is in centre, two lamellar bodies of pressure section 12 is laid respectively in the groove 36 of centre radiating fin 34 both sides, and lean with stage portion 38.Each lamellar body comprises the protuberance 125 that a top 122 and one protrudes out towards circuit board 50, and this protuberance 125 is positioned at the central position of the below on top 122, the protuberance 125 of each lamellar body is used for leaning with the pedestal 32 of radiator 30.Wherein the top 122 of a lamellar body inwardly convexes with a pair of salient point 1223 at interval, and the middle inside on another lamellar body top 122 inwardly convexes with a salient point 1226.After fastener 10 was installed in radiator 30, these three salient points 1223,1226 were pressed on the both sides of the radiating fin 34 of centre the other way around, made radiator 30 more firm with combining of fastener 10.The protuberance 125 of each lamellar body is provided with a baseplane 1252, be provided with in the middle part of this baseplane 1,252 one with the pedestal 32 contacted protruding 1254 of radiator 30.
Two extensions 145 that this each elastic arm 14 comprises an inverted U-shaped connecting portion 141, laterally extended by these connecting portion 141 bilateral symmetry and by the downward extended buckling parts 147 of the free terminal of extension 145.Two connecting portions 141 of this two elastic arm 14 are positioned at the top end that pressure section 12 2 opposite sides are used to connect pressure section 12 2 lamellar bodies, and the inside symmetry in the middle part of each connecting portion 141 convexes with a pair of salient point 1412.When the buckling parts 147 of elastic arm 14 is in not buckling state, two extensions, 145 coplanes of each elastic arm 14.This each buckling parts 147 is a button hook.
Please further consult Fig. 3 to Fig. 5, when assembling this heat abstractor combination, the radiating fin 34 that is positioned at radiator 30 centre passes the opening of fastener 10 pressure sections 12, two lamellar bodies of pressure section 12 are laid respectively in the groove 36 of radiating fin 34 adjacent both sides of centre, and two elastic arms 14 of fastener 10 lay respectively at two outsides relatively of radiator 30.The extension 145 of pushing elastic arm 14 both sides gently downwards makes fastener 10 that strain take place, thereby make the lamellar body move toward one another of pressure section 12 both sides, make two lateral pieces of the protuberance 125 of pressure section 12 be resisted against a side of the stage portion 38 of radiator 30, in the groove 36 of radiator 30, rock to prevent fastener 10.Simultaneously, three salient points 1223,1226 of 122 both sides, pressure section 12 tops are pressed on the both sides of the radiating fin 34 of centre, make fastener 10 and radiator 30 more firm combining.On the baseplane 1252 of the protuberance 125 of pressure section 12 a pair of protruding 1254 is pressed on fastener 10 and pedestal 32 contacted for point, avoided the unbalance stress that causes because of contact-making surface is concavo-convex in the face contact, two salient points 1412 of elastic arm 14 each connecting portion 141 mutually against.Further push extension 145 downwards, buckling parts 147 hooks that make its two ends are on the trip 52 of circuit board 50, this moment, 145 of two extensions of each elastic arm 14 formed an obtuse angle, make fastener 10 produce downward pressure, being arranged on a pair of protruding 1254 of pressure section 12 protuberances 125 belows is pressed on the radiator 30, thereby radiator 30 is sticked closely on electronic component 60, has finished the assembling of heat abstractor thus.
Same, two extensions, 145 two ends of applying light elastic arm 14 skid off the buckling parts 147 at its two ends from the trip 52 of circuit board 50, fastener 10 can be removed from radiator 30.

Claims (10)

1. heat abstractor combination, be used for being installed on the cooling electronic component on the circuit board, comprise that one has the radiator of some radiating fins and radiator is fixed in a fastener on the circuit board, this fastener comprises a pressure section and lays respectively at two elastic arms of the relative both sides of pressure section, it is characterized in that: this pressure section comprises and being symmetrical arranged and two lamellar bodies that top end links to each other, one opening is arranged between this two lamellar body, each lamellar body mutually towards inner top side all convex with salient point, a radiating fin that is in centre on the radiator pass this pressure section opening and with pressure section two lamellar bodies on salient point against, each lamellar body lower end of this pressure section has a protuberance that is convexly equipped with towards circuit board, and this protuberance compresses the radiator middle part downwards.
2. heat abstractor as claimed in claim 1 combination, it is characterized in that: each protuberance is provided with a baseplane, and be provided with at the middle part of each baseplane one with radiator against projection.
3. heat abstractor combination as claimed in claim 1, it is characterized in that: be in the bottom position of the radiating fin both sides of centre on the radiator, upwards protruded out a stage portion respectively, the protuberance of pressure section is resisted against this stage portion respectively.
4. heat abstractor combination as claimed in claim 1, it is characterized in that: each elastic arm comprises an inverted U-shaped connecting portion, by extended two extensions in these connecting portion both sides and by the downward extended buckling parts of the free terminal of extension, this connecting portion is in a side of pressure section, and two lamellar bodies of connection pressure section.
5. heat abstractor as claimed in claim 4 combination, it is characterized in that: the middle inside of each connecting portion is provided with a pair of salient point, after this fastener is fixed on the circuit board, this two salient point mutually against.
6. heat abstractor as claimed in claim 5 combination is characterized in that: when fastener was in not buckling state, two extension coplanes of each elastic arm when fastener is in buckling state, formed an obtuse angle between two extensions of each elastic arm.
7. fastener, be used for radiator is fixed in the electronic component of circuit board, comprise a pressure section and be positioned at two elastic arms of the relative both sides of pressure section, it is characterized in that: this pressure section comprises two lamellar bodies that are parallel to each other and top end connects, one opening is arranged between two lamellar bodies, each lamellar body mutually towards inner top side all convex with salient point, be used for against radiator, the lower end of each lamellar body comprises a protuberance that protrudes out, and this protuberance that protrudes out is used to be resisted against radiator.
8. fastener as claimed in claim 7 is characterized in that: this protuberance that protrudes out has a baseplane, and is formed with a projection on this baseplane.
9. fastener as claimed in claim 7, it is characterized in that: each elastic arm comprises an inverted U-shaped connecting portion, by extended two extensions in these connecting portion both sides and by the downward extended buckling parts of the free terminal of extension, this connecting portion is in a side of pressure section, and two lamellar bodies of connection pressure section.
10. fastener as claimed in claim 9 is characterized in that: the middle inside of this each connecting portion of elastic arm is provided with a pair of salient point.
CN 200710076269 2007-06-29 2007-06-29 Combination of cooling device Expired - Fee Related CN101336062B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200710076269 CN101336062B (en) 2007-06-29 2007-06-29 Combination of cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200710076269 CN101336062B (en) 2007-06-29 2007-06-29 Combination of cooling device

Publications (2)

Publication Number Publication Date
CN101336062A CN101336062A (en) 2008-12-31
CN101336062B true CN101336062B (en) 2011-05-11

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102056456A (en) * 2009-10-30 2011-05-11 富准精密工业(深圳)有限公司 Heat dissipating device
CN103116389A (en) * 2011-11-16 2013-05-22 鸿富锦精密工业(深圳)有限公司 Radiator combination
CN202841813U (en) * 2012-09-20 2013-03-27 中兴通讯股份有限公司 Radiator fixing device
CN104780737A (en) * 2014-01-15 2015-07-15 鸿富锦精密工业(深圳)有限公司 Radiator fixing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2374979Y (en) * 1999-04-02 2000-04-19 富准精密工业(深圳)有限公司 Chip radiator
CN2507137Y (en) * 2001-08-06 2002-08-21 惠翔企业有限公司 Fastener snap for heat sink component
CN2538120Y (en) * 2002-02-07 2003-02-26 曜越科技股份有限公司 Pivot heat radaition member lock
CN2914602Y (en) * 2006-06-08 2007-06-20 环达电脑(上海)有限公司 Fixing structure of heat dissipation module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2374979Y (en) * 1999-04-02 2000-04-19 富准精密工业(深圳)有限公司 Chip radiator
CN2507137Y (en) * 2001-08-06 2002-08-21 惠翔企业有限公司 Fastener snap for heat sink component
CN2538120Y (en) * 2002-02-07 2003-02-26 曜越科技股份有限公司 Pivot heat radaition member lock
CN2914602Y (en) * 2006-06-08 2007-06-20 环达电脑(上海)有限公司 Fixing structure of heat dissipation module

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Granted publication date: 20110511

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