US20010009187A1 - Heat sink and fan arrangment - Google Patents

Heat sink and fan arrangment Download PDF

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Publication number
US20010009187A1
US20010009187A1 US09/754,305 US75430501A US2001009187A1 US 20010009187 A1 US20010009187 A1 US 20010009187A1 US 75430501 A US75430501 A US 75430501A US 2001009187 A1 US2001009187 A1 US 2001009187A1
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United States
Prior art keywords
heat sink
fan
hooked
binding wires
coupling grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/754,305
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US6308773B2 (en
Inventor
Shih-jen Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global Win Technology Co Ltd
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Individual
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Filing date
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Assigned to GLOBAL WIN TECHNOLOGY CO., LTD. reassignment GLOBAL WIN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, SHIH-JEN
Publication of US20010009187A1 publication Critical patent/US20010009187A1/en
Application granted granted Critical
Publication of US6308773B2 publication Critical patent/US6308773B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink and fan arrangement and, more particularly, to such a heat sink and fan arrangement, which uses two U-shaped, hook-tip binding wires to secure the fan to the heat sink.
  • FIG. 6 shows a heat sink and fan arrangement for use to dissipate heat from a CPU.
  • This arrangement comprises a heat sink adapted for attaching to the top sidewall of the CPU, a fan adapted for mounting on the heat sink at the topside, and a fan case adapted for fastening to the CPU to secure the fan, the heat sink and the CPU together.
  • the fan case has bottom hooks adapted for hooking on the bottom sidewall of the CPU. This arrangement is functional, however the manufacturing cost of the fan case is high. Further, the fan case fits only a particular model of CPU.
  • the present invention has been accomplished to provide a heat sink and fan arrangement, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide a heat sink and fan arrangement, which is inexpensive to manufacture. It is another object of the present invention to provide a heat sink and fan arrangement, which fits any of a variety of electronic devices. According to the present invention, two resilient binding wires are used and hooked in four through holes in four corners of the fan to secure the fan to the heat sink.
  • FIG. 1 is an exploded view of a heat sink and fan arrangement according to the present invention.
  • FIG. 2 is an elevational assembly view of the heat sink and fan arrangement of the present invention.
  • FIG. 3 is a sectional view of the heat sink and fan arrangement showing the fastening of the binding wires according to the present invention.
  • FIG. 4 is a sectional view of the heat sink and fan arrangement showing the binding wires well fastened according to the present invention.
  • FIG. 5 is an elevational assembly view of an alternate form of the heat sink and fan arrangement according to the present invention.
  • FIG. 6 is an exploded view of the prior art design.
  • a heat sink and fan arrangement in accordance with the present invention is generally comprised of a fan 1 , a heat sink 2 , and two resilient binding wires 3 .
  • the fan 1 has four through holes 11 in four corners of the bottom sidewall thereof.
  • the heat sink 2 comprises a flat bottom contact wall 21 adapted for attaching to, for example, a CPU (central processing unit), and rows of upright radiating fins 22 raised from the top of the flat bottom contact wall 21 .
  • the two opposite lateral side rows of upright radiating fins 22 define a respective bottom coupling grooves 221 .
  • the resilient binding wires 3 each comprise a horizontal base portion 31 , two hooked tips 321 , and two vertical suspension arm portions 32 respectively connected between two distal ends of the horizontal base portion 31 and the hooked tips 321 .
  • the horizontal base portion 31 has a middle part 311 curved upwards.
  • the fan 1 is attached to the radiating fins 22 of the heat sink 2 at the top side, and then the horizontal base portions 31 of the binding wires 3 are respectively attached to the coupling grooves 221 of the heat sink 2 for enabling the hooked tips 321 of the binding wires 3 to be respectively hooked in the through holes 11 of the fan 1 from the top side.
  • FIG. 5 shows an alternate form of the present invention.
  • the heat sink 2 comprises two extension walls 222 vertically disposed at two opposite lateral sides and respectively stopped at two sides of the fan 1 .
  • the side extension walls 222 each have a bottom coupling groove 2221 adapted to receive the horizontal base portions 31 of the binding wires 3 .

Abstract

A heat sink and fan arrangement includes a heat sink having two bottom coupling grooves disposed at two opposite lateral sides, a fan supported on the heat sink, the fan having four through holes in four corners of a bottom wall thereof, and two resilient binding wires fastened to the heat sink and the fan to secure the heat sink and the fan together, the binding wires each having a horizontal base portion respectively coupled to the bottom coupling grooves of the heat sink, two hooked tips respectively hooked in the through holes of the fan, and two vertical suspension arms connected between two distal ends of the horizontal base portion and the hooked tips.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a heat sink and fan arrangement and, more particularly, to such a heat sink and fan arrangement, which uses two U-shaped, hook-tip binding wires to secure the fan to the heat sink. [0001]
  • Various heat sinks have been disclosed for use with a fan to dissipate heat from an electronic device, for example, a CPU (central processing unit). FIG. 6 shows a heat sink and fan arrangement for use to dissipate heat from a CPU. This arrangement comprises a heat sink adapted for attaching to the top sidewall of the CPU, a fan adapted for mounting on the heat sink at the topside, and a fan case adapted for fastening to the CPU to secure the fan, the heat sink and the CPU together. The fan case has bottom hooks adapted for hooking on the bottom sidewall of the CPU. This arrangement is functional, however the manufacturing cost of the fan case is high. Further, the fan case fits only a particular model of CPU. [0002]
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished to provide a heat sink and fan arrangement, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide a heat sink and fan arrangement, which is inexpensive to manufacture. It is another object of the present invention to provide a heat sink and fan arrangement, which fits any of a variety of electronic devices. According to the present invention, two resilient binding wires are used and hooked in four through holes in four corners of the fan to secure the fan to the heat sink. [0003]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat sink and fan arrangement according to the present invention. [0004]
  • FIG. 2 is an elevational assembly view of the heat sink and fan arrangement of the present invention. [0005]
  • FIG. 3 is a sectional view of the heat sink and fan arrangement showing the fastening of the binding wires according to the present invention. [0006]
  • FIG. 4 is a sectional view of the heat sink and fan arrangement showing the binding wires well fastened according to the present invention. [0007]
  • FIG. 5 is an elevational assembly view of an alternate form of the heat sink and fan arrangement according to the present invention. [0008]
  • FIG. 6 is an exploded view of the prior art design. [0009]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 1 and 2, a heat sink and fan arrangement in accordance with the present invention is generally comprised of a [0010] fan 1, a heat sink 2, and two resilient binding wires 3.
  • The [0011] fan 1 has four through holes 11 in four corners of the bottom sidewall thereof. The heat sink 2 comprises a flat bottom contact wall 21 adapted for attaching to, for example, a CPU (central processing unit), and rows of upright radiating fins 22 raised from the top of the flat bottom contact wall 21. The two opposite lateral side rows of upright radiating fins 22 define a respective bottom coupling grooves 221. The resilient binding wires 3 each comprise a horizontal base portion 31, two hooked tips 321, and two vertical suspension arm portions 32 respectively connected between two distal ends of the horizontal base portion 31 and the hooked tips 321. The horizontal base portion 31 has a middle part 311 curved upwards.
  • Referring to FIGS. 3 and 4 and FIG. 2 again, the [0012] fan 1 is attached to the radiating fins 22 of the heat sink 2 at the top side, and then the horizontal base portions 31 of the binding wires 3 are respectively attached to the coupling grooves 221 of the heat sink 2 for enabling the hooked tips 321 of the binding wires 3 to be respectively hooked in the through holes 11 of the fan 1 from the top side.
  • Referring to FIGS. from [0013] 2 through 4 again, when attaching the horizontal base portions 311 of the binding wires 3 to the coupling grooves 221 of the heat sink 2, the upwardly curved middle part 311 of each binding wire 3 is deformed to lift the suspension arms 32 over the elevation of the through holes 11 of the fan 1, so that when the upward pulling force is released from the binding wires 3, the binding wires 3 immediately return to their former shape, thereby causing the hooked tips 321 of the binding wires 3 to be respectively hooked in the through holes 11 of the fan 1 to secure the fan 1 and the heat sink 2 firmly together.
  • FIG. 5 shows an alternate form of the present invention. According to this alternate form, the [0014] heat sink 2 comprises two extension walls 222 vertically disposed at two opposite lateral sides and respectively stopped at two sides of the fan 1. The side extension walls 222 each have a bottom coupling groove 2221 adapted to receive the horizontal base portions 31 of the binding wires 3.
  • It is to be understood that the drawings are designed for purposes of illustration only, and are not intended for use as a definition of the limits and scope of the invention disclosed. [0015]

Claims (3)

What the invention claimed is:
1. A heat sink and fan arrangement comprising a heat sink, a fan attached to a top side of said heat sink, and two resilient binding wires fastened to said heat sink and said fan to secure said heat sink and said fan together, wherein said fan comprises four through holes in four corners of a bottom wall thereof; said heat sink comprises two bottom coupling grooves disposed at two opposite lateral sides; said resilient binding wires each comprise a horizontal base portion respectively coupled to the bottom coupling grooves of said heat sink, two hooked tips respectively hooked in the through holes of said fan, and two vertical suspension arms connected between two distal ends of said horizontal base portion and said hooked tips.
2. The heat sink and fan arrangement of
claim 1
, wherein said heat sink comprises two extension walls vertically disposed at two opposite lateral sides, and said bottom coupling grooves are respectively formed on said extension walls at a bottom side.
3. The heat sink and fan arrangement of
claim 2
, wherein said extension walls of said heat sink are respectively stopped at two opposite lateral sides of said fan.
US09/754,305 2000-01-25 2001-01-05 Heat sink and fan arrangement Expired - Fee Related US6308773B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW089201265 2000-01-25
TW089201265U TW458384U (en) 2000-01-25 2000-01-25 Fixing device of heat sink

Publications (2)

Publication Number Publication Date
US20010009187A1 true US20010009187A1 (en) 2001-07-26
US6308773B2 US6308773B2 (en) 2001-10-30

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US09/754,305 Expired - Fee Related US6308773B2 (en) 2000-01-25 2001-01-05 Heat sink and fan arrangement

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US (1) US6308773B2 (en)
TW (1) TW458384U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179285A1 (en) * 2001-05-30 2002-12-05 Sas Adrian Pieter Folded-fin heat sink assembly and method of manufacturing same
US20050092463A1 (en) * 2003-10-29 2005-05-05 Edward Lopatinsky Multi-heatsink integrated cooler
US20050183843A1 (en) * 2004-02-13 2005-08-25 Fujikura Ltd. Heat sink
US20090123362A1 (en) * 2005-07-16 2009-05-14 Norbert Roesch Process for producing nanocrystalline alpha-AI2O3
US20100236764A1 (en) * 2009-03-19 2010-09-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100258282A1 (en) * 2009-04-10 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fan holders

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW509348U (en) * 2001-06-18 2002-11-01 Global Win Technology Co Ltd Heat dissipation apparatus
TW584275U (en) * 2003-06-25 2004-04-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
US7639497B2 (en) * 2007-12-10 2009-12-29 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device having a fan mounted thereon
CN101772293B (en) * 2009-01-07 2013-06-05 富准精密工业(深圳)有限公司 Radiating device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US5678627A (en) * 1996-01-03 1997-10-21 Lee; Richard CPU heat sink mounting structure

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179285A1 (en) * 2001-05-30 2002-12-05 Sas Adrian Pieter Folded-fin heat sink assembly and method of manufacturing same
US6854181B2 (en) 2001-05-30 2005-02-15 Tyco Electronics Canada Ltd. Folded-fin heat sink assembly and method of manufacturing same
US20050092463A1 (en) * 2003-10-29 2005-05-05 Edward Lopatinsky Multi-heatsink integrated cooler
US6981542B2 (en) * 2003-10-29 2006-01-03 Rotys Inc. Multi-heatsink integrated cooler
US20050183843A1 (en) * 2004-02-13 2005-08-25 Fujikura Ltd. Heat sink
US20090123362A1 (en) * 2005-07-16 2009-05-14 Norbert Roesch Process for producing nanocrystalline alpha-AI2O3
US20100236764A1 (en) * 2009-03-19 2010-09-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100258282A1 (en) * 2009-04-10 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fan holders

Also Published As

Publication number Publication date
TW458384U (en) 2001-10-01
US6308773B2 (en) 2001-10-30

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AS Assignment

Owner name: GLOBAL WIN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, SHIH-JEN;REEL/FRAME:011424/0348

Effective date: 20001130

LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20051030