CN101309574B - Combination of cooling device - Google Patents
Combination of cooling device Download PDFInfo
- Publication number
- CN101309574B CN101309574B CN 200710074371 CN200710074371A CN101309574B CN 101309574 B CN101309574 B CN 101309574B CN 200710074371 CN200710074371 CN 200710074371 CN 200710074371 A CN200710074371 A CN 200710074371A CN 101309574 B CN101309574 B CN 101309574B
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- CN
- China
- Prior art keywords
- radiator
- pressure section
- elasticity pressure
- fastener
- buckling parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a heat radiating device assembly used for radiating the electronic device installed on a circuit board. The heat radiating device assembly comprises a heat radiator and a buckle used for fixing the heat radiator on the electronic device, a holding part is arranged on the heat radiator, the buckle comprises an elastic abutting part spanned inside the holding part of the heat radiator and held against the heat radiator and bi-linear buckling parts respectively pivoted at both ends of the elastic abutting part and is clipped and buckled with the circuit board. Compared with the prior art, the buckle provided by the heat radiating device assembly can eliminate the effect of the uneven stress of the heat radiator resulted from the difference of the buckle, so that the inclination of the heat radiator is not easy to occur.
Description
Technical field
The present invention relates to a kind of heat abstractor combination, be meant a kind of heat abstractor combination especially cooling electronic component.
Background technology
When moving, can produce a large amount of heats such as computer cpu, north bridge chips, the contour electronic components of high power of video card, if these heats can not be left effectively, to directly cause temperature sharply to rise, and badly influence the normal operation of electronic devices and components.For this reason, need heat abstractor to come these electronic devices and components are dispelled the heat, traditional heat abstractor generally includes radiator and radiator is fixed to fastener on the electronic devices and components.
Above-mentioned heat abstractor in use, after earlier being attached to radiator on the electronic devices and components end face, utilize the hook between fastener and associated component or structure (for example hole on the circuit board) again and be tight against radiator, and radiator is closely adhered on the electronic devices and components.Chinese patent has disclosed a kind of heat abstractor combination for No. 200320117746.8, it comprises a radiator and two fasteners, this radiator has the communicate groove of radiator both sides and a protruding thorn that forms in opposite directions from the groove both sides, two fasteners are one-body molded by metal wire rod, be arranged in the accommodation space both sides that protruding thorn and groove form respectively, so that radiator is fixed in circuit board.Because two fasteners are separately set in the radiator both sides respectively, when two fasteners bear external force or other reasons and difference occurs, its fastening power that puts on the radiator both sides respectively will change, make radiator both sides unbalance stress, and cause the radiator run-off the straight, cause radiator and electronic devices and components loose contact, and then influence its radiating efficiency.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor combination that is difficult for run-off the straight.
A kind of heat abstractor combination, be used for being installed on the cooling electronic component on the circuit board, it comprises that a radiator and is fixed in fastener on the electronic devices and components with radiator, this radiator offers a holding part, this fastener comprise stride be located in the radiator holding part and compress the elasticity pressure section of radiator and be articulated in elasticity pressure section two ends respectively and with two linear buckling partss of circuit board buckle.
Compared with prior art, the fastener of heat abstractor combination of the present invention has an elasticity pressure section and is articulated in the two linear buckling partss at elasticity pressure section two ends, this elasticity pressure section presses on the radiator by two linear buckling parts elasticity, thereby forms an application of force zone in the radiator holding part.The fastening power that linear buckling parts produced that is positioned at these elasticity pressure section two ends is by the above-mentioned application of force zone that acts on holding part of concentrating, even difference appears in two linear buckling partss, because the elastic force of elasticity pressure section, its active force that puts on radiator will be maintained at original direction and remain on original position, and do not cause the radiator run-off the straight, thereby guarantee that radiator contacts with the stable of electronic devices and components.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor combination of the present invention.
Fig. 2 is the constitutional diagram of Fig. 1.
Fig. 3 is the front view of Fig. 2.
Fig. 4 is the stereo amplification figure of elasticity pressure section among Fig. 1.
Fig. 5 is the front view of Fig. 4.
Embodiment
Heat abstractor of the present invention combination is to be used for being installed on the heating electronic component 44 such as central processing unit so that it is dispelled the heat.
See also Fig. 1 and Fig. 2, show heat abstractor combination of the present invention.The combination of this heat abstractor comprises that a radiator 20 and is used for radiator 20 is fixed in fastener 30 on the electronic devices and components 44 of circuit board 40.
This radiator 20 is made by thermal conductance metal materials such as copper, aluminium, and it comprises a pedestal 21 and from the pedestal 21 one-body molded some radiating fins 23 that squeeze out, these radiating fins 23 are parallel to each other and are spaced.Each radiating fin 23 centre offers a rectangular recess 230, and some rectangular recess 230 are formed a holding part 25, are used to place fastener 30.Two radiating fins 23 that are positioned at radiator 20 central authorities protrude out two protuberances 232 in opposite directions in the position near pedestal 21, and the spacing of this two protuberance 232 is less than the spacing of radiating fin 23.
Described fastener 30 comprises an elasticity pressure section 31 and is articulated in the two linear buckling partss 33 at these elasticity pressure section 31 two ends respectively.As shown in Figure 4 and Figure 5, this elasticity pressure section 31 is striden and is located in radiator 20 holding parts 25, the connecting portion 312 that it comprises two arms 310 that connect and is formed at two arms, 310 free terminals respectively.Each arm 310 comprises a strip body that tilts and a flat segments that is extended outward by body tip, this flat segments bottom offers one first groove 3100, be used for card and establish linear buckling parts 33, two arms 310 are interconnected to one " V " shape structure, these two arms, 310 junctions form a baseplane 3102, contact with holding part 25, form an application of force zone in holding part 25 bottom surfaces, and pressure is put on radiator 20 with radiator 20.And, arm 310 2 relative lateral surfaces near its junction respectively level protrude out two projections 3104, its 232 of two protuberances that are located in radiator 20 rotate in holding part 25 with restriction elasticity pressure section 310.Each connecting portion 312 has half cylindrical body, and along the arm 310 length directions two square protuberances that extend internally out, each square protuberance upper surface offers one second groove 3120 respectively in these cylindrical body both sides, strides for linear buckling parts 33 and establishes.
Again as shown in Figure 1, described two linear buckling partss 33 by pliable and tough and resilient material (such as, steel wire, alloy etc.) one-body molded, it is arranged at radiator 20 both sides respectively.This linearity buckling parts 33 comprises the bend 330 of one " U " shape, and its first groove 3100 that presses on elasticity pressure section 31 is interior to fix this linearity buckling parts 33 in elasticity pressure section 31.The adjutage 332 that 330 liang of free ends of this bend vertically extend outward two " L " shape respectively, the interior angle that its plane of living in and bend 330 planes of living in form is an acute angle.Each adjutage 332 free terminal extends to form a crotch 334 downwards, and this crotch 334 fastens to produce a fastening power with the buckle structure 42 that electronic devices and components 44 location about at circuit board 40 are provided with.Above-mentioned bend 330 and adjutage 332 be flexible respectively to be arranged in first groove 3100 and second groove 3120 of elasticity pressure section 31, make this elasticity pressure section 31 generations one and the corresponding downforce of above-mentioned fastening power, this pressure acts on the application of force zone of above-mentioned radiator 20 holding parts 25, and radiator 20 is fitted in electronic devices and components 44 surfaces closely.
See also Fig. 1 to Fig. 3, when assembling this heat abstractor combination, at first the bend 330 with each linear buckling parts 33 presses in first groove 3100 of elasticity pressure section 31, make linear buckling parts 33 go for a stroll pars convoluta 330 rotation then and adjutage 332 striden be located in second groove 3120, realize the pivot joint of linear buckling parts 33 and elasticity pressure section 31.Afterwards, radiator 20 is positioned on electronic devices and components 44 surfaces, then elasticity pressure section 31 is striden the holding part 25 of being located at radiator 20, wherein, the projection 3104 of this elasticity pressure section 31 is arranged in the interval of radiator 20 2 protuberances 232, and the bottom surface elasticity butt of its baseplane 3102 and holding part 25, thereby make two linear buckling partss 33 be distributed in radiator 20 both sides respectively.At last, the crotch 334 of linear buckling parts 33 is fastened with the buckle structure 42 that electronic devices and components 44 location about at circuit board 40 are provided with respectively, make 30 pairs of radiators of fastener 20 produce downward pressure and radiator 20 is close to electronic devices and components 44.Thus, assembling process has been finished in this heat abstractor combination.
Be appreciated that ground, above-mentioned elasticity pressure section and linear buckling parts can be one-body molded, saving its buckle structure, thus the difficulty when reducing assembling and the cost of less heat abstractor combination.
It is also understood that ground, above-mentioned radiator can have a plurality of holding parts, to stride the elasticity pressure section of respective numbers located therein respectively, each linear buckling parts also has the bend of respective numbers, it articulates with a plurality of elasticity pressure sections respectively, and the contact-making surface of a plurality of elasticity pressure sections and holding part all is positioned on the same straight line that is parallel to linear buckling parts adjutage.Wherein, because a plurality of elasticity pressure sections can produce bigger pressure, radiator can fit in the electronic devices and components surface more closely.
In sum, because the two linear buckling partss that fastener of the present invention has an elasticity pressure section and is articulated in elasticity pressure section two ends, this elasticity pressure section presses on radiator by linear buckling parts elasticity, thereby in the radiator holding part, form an application of force zone, the fastening power that linear buckling parts produced that is positioned at these elasticity pressure section two ends is by on the above-mentioned application of force zone that acts on holding part of concentrating, even difference appears in two linear buckling partss, because the elastic force of elasticity pressure section, its active force that puts on radiator will kept original direction and remain on original application of force zone, and do not cause the radiator run-off the straight, thereby guarantee that radiator contacts with the stable of electronic devices and components.
Claims (13)
1. heat abstractor combination, be used for being installed on the cooling electronic component on the circuit board, it comprises that a radiator and is fixed in fastener on the electronic devices and components with radiator, this radiator offers a holding part, described radiator comprises a pedestal and the radiating fin of being arranged by some spaces that base extension goes out, described radiating fin middle part is provided with a breach, some these breach are formed above-mentioned holding part, it is characterized in that: this fastener comprise stride be located in the radiator holding part and compress the elasticity pressure section of radiator and be articulated in elasticity pressure section two ends respectively and with two linear buckling partss of circuit board buckle, described elasticity pressure section comprises two arms, this two arm connects into one " V " shape structure, the outside level of this two arms junction protrudes out a projection, two radiating fins that are positioned at radiator central authorities protrude out two protuberances in opposite directions in the position near pedestal, and above-mentioned projection is arranged between this two protuberance.
2. heat abstractor combination as claimed in claim 1, it is characterized in that: described elasticity pressure section also comprises two connecting portions that are connected to two arm free terminals, above-mentioned linear buckling parts is articulated on the connecting portion.
3. heat abstractor combination as claimed in claim 2, it is characterized in that: described arm end face is provided with first groove of establishing for linear buckling parts card, and described connecting portion end face offers second groove of establishing for linear buckling parts card.
4. heat abstractor combination as claimed in claim 3, it is characterized in that: described linear buckling parts comprises one " U " shape bend, and from extended two adjutages of this bend bilateral symmetry, this bend presses in first groove of elasticity pressure section arm, and this adjutage is striden in second groove of being located at described connecting portion.
5. heat abstractor as claimed in claim 4 combination is characterized in that: described adjutage end is formed with and is used for and the circuit board crotch of buckle mutually.
6. heat abstractor combination as claimed in claim 4, it is characterized in that: described adjutage is L-shaped, and the interior angle that its plane of living in and described bend plane of living in forms is an acute angle.
7. heat abstractor combination as claimed in claim 1, it is characterized in that: described elasticity pressure section and linear buckling parts are formed in one.
8. fastener, be used for radiator is fixed to a circuit board, be provided with some buckle structures around this circuit board, it is characterized in that: this fastener comprises two linear buckling partss that compress the elasticity pressure section of radiator and be articulated in elasticity pressure section two ends respectively and fasten with the circuit-board card buckle structure, described elasticity pressure section comprises two arms, this two arm connects into one " V " shape structure, and the outside level of this two arms junction protrudes out a projection, and this projection is arranged on the radiator.
9. fastener as claimed in claim 8 is characterized in that: described elasticity pressure section also comprises two connecting portions that are connected to two arm free terminals, and above-mentioned linear buckling parts is articulated on the connecting portion.
10. fastener as claimed in claim 9 is characterized in that: described arm end face is provided with first groove of establishing for linear buckling parts card, and described connecting portion end face offers second groove of establishing for linear buckling parts card.
11. fastener as claimed in claim 10, it is characterized in that: described linear buckling parts comprises one " U " shape bend, and from extended two adjutages of this bend bilateral symmetry, this bend presses in first groove of elasticity pressure section arm, and this adjutage is striden in second groove of being located at described connecting portion.
12. fastener as claimed in claim 11 is characterized in that: described adjutage end is formed with and is used for and the circuit board crotch of buckle mutually.
13. fastener as claimed in claim 11 is characterized in that: described adjutage is L-shaped, and the interior angle that its plane of living in and described bend plane of living in forms is an acute angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710074371 CN101309574B (en) | 2007-05-18 | 2007-05-18 | Combination of cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710074371 CN101309574B (en) | 2007-05-18 | 2007-05-18 | Combination of cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101309574A CN101309574A (en) | 2008-11-19 |
| CN101309574B true CN101309574B (en) | 2011-08-31 |
Family
ID=40125729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710074371 Expired - Fee Related CN101309574B (en) | 2007-05-18 | 2007-05-18 | Combination of cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101309574B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101776941B (en) * | 2009-01-08 | 2013-03-13 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN102468252B (en) * | 2010-11-03 | 2013-09-04 | 超众科技股份有限公司 | Thin buckle for radiator |
| CN102956581A (en) * | 2011-08-31 | 2013-03-06 | 鸿富锦精密工业（深圳）有限公司 | Buckle and electronic device using same |
| CN102678812B (en) * | 2012-05-07 | 2015-03-04 | 加弘科技咨询(上海)有限公司 | Anti-vibration fixing structure and anti-vibration fan |
| CN102724849A (en) * | 2012-06-01 | 2012-10-10 | 加弘科技咨询(上海)有限公司 | Heat-radiating system, heat-radiating device and heat-radiating fin base thereof |
| TWI694760B (en) * | 2017-01-25 | 2020-05-21 | 雙鴻科技股份有限公司 | Securing device and electronic device having the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2507137Y (en) * | 2001-08-06 | 2002-08-21 | 惠翔企业有限公司 | Fastener snap for heat sink component |
| CN1946273A (en) * | 2005-10-07 | 2007-04-11 | 富准精密工业(深圳)有限公司 | Heat radiator lock and heat radiator combination using said lock |
-
2007
- 2007-05-18 CN CN 200710074371 patent/CN101309574B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2507137Y (en) * | 2001-08-06 | 2002-08-21 | 惠翔企业有限公司 | Fastener snap for heat sink component |
| CN1946273A (en) * | 2005-10-07 | 2007-04-11 | 富准精密工业(深圳)有限公司 | Heat radiator lock and heat radiator combination using said lock |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101309574A (en) | 2008-11-19 |
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| C06 | Publication | ||
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Granted publication date: 20110831 Termination date: 20140518 |