CN100499976C - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
CN100499976C
CN100499976C CN 200610033269 CN200610033269A CN100499976C CN 100499976 C CN100499976 C CN 100499976C CN 200610033269 CN200610033269 CN 200610033269 CN 200610033269 A CN200610033269 A CN 200610033269A CN 100499976 C CN100499976 C CN 100499976C
Authority
CN
China
Prior art keywords
circuit board
radiator
heat abstractor
linking arm
fastener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200610033269
Other languages
Chinese (zh)
Other versions
CN101005750A (en
Inventor
赖振田
周志勇
丁巧利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CN 200610033269 priority Critical patent/CN100499976C/en
Publication of CN101005750A publication Critical patent/CN101005750A/en
Application granted granted Critical
Publication of CN100499976C publication Critical patent/CN100499976C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The cooling device comprises a heat-sink and a clip. The clip comprises a pressing part and a pair of clasp parts extending out from both ends of the pressing part; each clasp part comprises a bending part and a connection arm; the bending part is set around the heat-sink, and a hook is extended from the end of the connection arm; the connection arm passes through the heat-sink and a corresponding side edge of circuit board, and the hook clasps the side surface of the circuit board.

Description

Heat abstractor
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor in order to the heat-generating electronic elements on the circuit board is dispelled the heat.
[background technology]
Along with computer industry constantly develops, electronic component (as central processing unit) running frequency and speed constantly promote, and caloric value is increasing, if untimely eliminating, accumulation of heat causes that temperature raises, and influences the normal operation of heat-generating electronic elements.
The lifting of computing power make memory bar, show that wafer capacity increases day by day on the mode integrated circuit boards such as sound card, volume is more and more littler, operating rate is piece more and more, the heat that produces in this process constantly increases, how fast the wafer heat on these additional card effectively to be distributed fast, also become the problem that present dealer need solve.
Usually industry is installed auxiliary its heat radiation of radiator on electronic component, contacts close and firm for making radiator with heater element, needs to realize that by a fastener radiator is connected with the firm of this heater element.
Yet because element gathers on the integrated circuit board, the space is little and adjacent integrated circuit board spacing is narrow, and the radiator inconvenience directly is installed thereon, very easily is adjacent integrated circuit board generation interference, operation inconvenience because of radiator is installed on an integrated circuit board.In addition, the fastener that cooperates with socket on the existing CPU of being used for of screw is difficult to use because of can not find the corresponding matching structure on integrated circuit board traditionally.
[summary of the invention]
In view of this, be necessary to provide a kind of easy accessibility, fasten firm heat abstractor.
The heat abstractor of the embodiment of the invention is in order to dispel the heat to the heat-generating electronic elements on the circuit board, this heat abstractor comprises a radiator and a fastener, this fastener comprises and is used to compress a pressure section of this radiator and oppositely bends extended a pair of buckling parts by these pressure section two ends, each buckling parts comprises kink that is extended by the bending of pressure section one end and a linking arm that is extended by the kink end, this kink winding is in the radiator periphery, a grab is extended in the terminal bending of linking arm, this linking arm is through radiator and circuit board relative side and grab hook circuit board one side surface, offer a L shaped aperture of passing for fastener one linking arm on the described circuit board, this aperture comprises that one first orifice part reaches and perpendicular one second orifice part that is communicated with of this first orifice part, and the grab of above-mentioned linking arm passes this first orifice part and slips into second orifice part.
This execution mode compared with prior art, fastener cooperates with circuit board radiator is pressed on the circuit board among the present invention, easy accessibility fastens firm.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the three-dimensional combination figure of Fig. 1.
Fig. 3 is the inversion figure of Fig. 2.
Fig. 4 is the end view of Fig. 2.
[embodiment]
See also Fig. 1 to Fig. 2, heat abstractor of the present invention comprises a circuit board 10, a radiator 20 and radiator 20 is fixed on the fastener 30 of circuit board 10 1 sides.
These circuit board 10 upper surfaces are provided with a heat-generating electronic elements 40, and the lower surface of above-mentioned radiator 20 directly is sticked on this heat-generating electronic elements 40.This circuit board 10 is rectangular, comprises a pair of long limit and pair of short edges, and this edge, circuit board 10 1 long limit is provided with a notch 12, and this notch 12 extends perpendicular to circuit board 10 long side directions; Be provided with an aperture 14 near another place, long limit, this aperture 14 is roughly L-shaped, comprises first orifice part 140 and second orifice part 142 that is communicated with first orifice part.This first, second orifice part 140,142 bearing of trends are parallel respectively, perpendicular to the long limit of circuit board 10.
This radiator 20 comprises that a base plate 22 that directly contacts with heat-generating electronic elements 40 reaches by the vertically extending some radiating fins 24 of these base plate 22 upper surfaces.Notch 12, aperture 14 on these base plate 22 1 opposite side corresponding circuits plates 10 are provided with a pair of breach 26.
Fastener 30 is that elastic metallic wire rod bending forms, and it comprises the pressure section 32 that a level extends, by the reverse a pair of buckling parts 33 that extends of pressure section 32 two ends bending.Each buckling parts 33 comprises by the extended kink 330 of pressure section 32 1 ends, extends a grab 334 by kink 330 terminal extended linking arms 332 and by linking arm 332 terminal bendings.These kink 330 bendings are the L shape and favour radiator, and linking arm 332 is respectively perpendicular to this pressure section 32.
See also Fig. 2 and Fig. 3, the pressure section 32 of this fastener 30 is pressed on base plate 22 upper surfaces of radiator 20, kink 330 be set around radiating fin 24 peripheral and with pressure section 32 antarafacials.Linking arm 332 is fastened in base plate 22 and circuit board 10 both sides, and grab 334 reverse hooks are at circuit board 10 lower surfaces.Above-mentioned pressure section 32 presses in base plate 22 upper surfaces because of being subjected to elastic force, and kink 330 relative circuit board 10 reverse perks and pressure section 32 tilt.
See also Fig. 1 to Fig. 4, during assembling, radiator 20 is placed on the circuit board 10, fastener 30 a wherein linking arm 332 breach 26, the notch 12 on the circuit board 10 that pass base plate 22 1 sides in turn is resisted against circuit board 10 lower surfaces with the grab on it 334, mobile fastener 30 passes through the breach 26 of base plate 22 another sides, first orifice part 140 on the circuit board 10 in turn with another linking arm 332, mobile again fastener 30 finally slips in second orifice part 142 another linking arm 332, and with grab on it 334 and last grab 334 reverse hooks at circuit board 10 lower surfaces.Pressure section 32 is pressed on base plate 22 upper surfaces, thereby fastener 30 is pressed on circuit board 10 1 sides with radiator 20 and closely contacts with heat-generating electronic elements 40.

Claims (8)

1. heat abstractor, in order to the heat-generating electronic elements on the circuit board is dispelled the heat, this heat abstractor comprises a radiator and a fastener, it is characterized in that: this fastener comprises and is used to compress a pressure section of this radiator and oppositely bends extended a pair of buckling parts by these pressure section two ends, each buckling parts comprises kink that is extended by the bending of pressure section one end and a linking arm that is extended by the kink end, this kink winding is in the radiator periphery, a grab is extended in the terminal bending of linking arm, this linking arm is through radiator and circuit board relative side and grab hook circuit board one side surface, offer a L shaped aperture of passing for fastener one linking arm on the described circuit board, this aperture comprises that one first orifice part reaches and perpendicular one second orifice part that is communicated with of this first orifice part, and the grab of above-mentioned linking arm passes this first orifice part and slips into second orifice part.
2. heat abstractor as claimed in claim 1 is characterized in that: described fastener is formed by the metal wire rod bending.
3. heat abstractor as claimed in claim 1 is characterized in that: offer the notch that another linking arm for fastener passes on described circuit board another side relative with the aperture.
4. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned first orifice part and the second orifice part length bearing of trend be parallel respectively, perpendicular to this circuit board one side.
5. heat abstractor as claimed in claim 1 is characterized in that: described two grab free end bearing of trends are opposite.
6. heat abstractor as claimed in claim 5 is characterized in that: edge, limit, described radiator two opposite sides forms a breach that passes for the linking arm of fastener respectively.
7. heat abstractor as claimed in claim 6 is characterized in that: described radiator comprises a base plate and by the extended some radiating fins of base plate, above-mentioned breach is formed at edge, limit, base plate two opposite sides.
8. heat abstractor as claimed in claim 7 is characterized in that: described kink winding is peripheral and favour the base plate of radiator at radiating fin.
CN 200610033269 2006-01-18 2006-01-18 Heat sink Expired - Fee Related CN100499976C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200610033269 CN100499976C (en) 2006-01-18 2006-01-18 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200610033269 CN100499976C (en) 2006-01-18 2006-01-18 Heat sink

Publications (2)

Publication Number Publication Date
CN101005750A CN101005750A (en) 2007-07-25
CN100499976C true CN100499976C (en) 2009-06-10

Family

ID=38704534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200610033269 Expired - Fee Related CN100499976C (en) 2006-01-18 2006-01-18 Heat sink

Country Status (1)

Country Link
CN (1) CN100499976C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102802378A (en) * 2011-05-27 2012-11-28 鸿富锦精密工业(深圳)有限公司 Radiating device and electronic device using radiating device
DE102011107316A1 (en) * 2011-07-06 2013-06-06 Abb Ag Arrangement for cooling assemblies of an automation or control system
CN103296863B (en) * 2012-02-24 2017-03-01 台达电子企业管理(上海)有限公司 Power supply change-over device
FI20125982A (en) * 2012-09-24 2014-03-25 Tellabs Oy Circuit board system comprising a spring-mounted element

Also Published As

Publication number Publication date
CN101005750A (en) 2007-07-25

Similar Documents

Publication Publication Date Title
CN100482060C (en) Heat radiator
US8050038B2 (en) Heat dissipation device
CN109588006B (en) Heat dissipation device of expansion card and expansion card assembly with heat dissipation function
US20090109613A1 (en) Memory module heat sink
US7736153B2 (en) Electrical connector assembly having improved clip mechanism
US20090154105A1 (en) Heat dissipation device and a method for manufacturing the same
CN100456460C (en) Fastener of radiator
CN100499976C (en) Heat sink
US20070165380A1 (en) Memory module assembly including a clip for mounting a heat sink thereon
US20080128110A1 (en) Heat sink assembly having a fan mounting device
US20090229790A1 (en) Radiating fin assembly for thermal module
CN101309574B (en) Combination of cooling device
US20090201646A1 (en) Retaining device
CN101662916A (en) Heat dissipation device
US20090229789A1 (en) Radiating fin assembly for thermal module
US6678160B1 (en) Heat sink assembly including clip
CN100518470C (en) Heat radiator
CN100518473C (en) Heat radiator
CN1936771B (en) Radiator fixing device
CN103025119A (en) Heat dissipation device
CN101056524B (en) Heat radiator
CN101415311B (en) Radiating device
TWI336232B (en) Heat dissipation device
CN101394727B (en) Heat Radiation device
JP2015065314A (en) Electronic apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090610

Termination date: 20120118