CN101316499B - Cooling substrates and cooling material - Google Patents
Cooling substrates and cooling material Download PDFInfo
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- CN101316499B CN101316499B CN 200710110710 CN200710110710A CN101316499B CN 101316499 B CN101316499 B CN 101316499B CN 200710110710 CN200710110710 CN 200710110710 CN 200710110710 A CN200710110710 A CN 200710110710A CN 101316499 B CN101316499 B CN 101316499B
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- tetrafluoroethylene
- heat
- polymkeric substance
- containing polymers
- conductive filler
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Abstract
The invention relates to a heat-dissipation material which comprises: (1) fluorine-containing high molecular polymer with a melting point higher than 150 DEG C and a weight percentage between 15 percent and 40 percent; (2) heat-conducting filling that is distributed in the fluorine-containing high molecular polymer and has a weight percentage between 60 percent and 85 percent; and (3) an coupling agent, the proportion is weight percentage between 0.5 percent and 3 percent of the heat-conducting filling. The formula of the coupling agent is showed in the figure, wherein, R1, R2 and R3 are alkyl CaH2a+1 and a is more than or equal to 1; X and Y are chosen from: hydrogen (H), fluorine (F) or chlorine (Cl) and CbH2b+1 and b is more than or equal to 1; and n is a positive integer.
Description
Technical field
The present invention relates to a kind of heat-radiating substrate and its heat sink material, especially for substrate and its material of electronic element radiating.
Background technology
The electric energy that electronic component consumes during operation, except real work, major part changes into dissipation of heat.The heat that electronic component produces rises rapidly internal temperature, if untimely with dissipation of heat, element can continue to heat up even overheating failure, and the reliability of electronic component will descend.
Surface adhering technical (SMT) makes electronic component increase in the packing density of printed circuit board (PCB) (PCB), and the efficiently radiates heat area reduces, and element heats up will seriously affect reliability.Especially at present be expected most and be subjected to the high heat problem of the white light emitting diode (LED) that the whole world attractes attention most, with so that the excess Temperature of LED element and affect its luminous intensity and work-ing life.Therefore, heat dissipation design seems very important.
No matter be display backlight source or general illumination, normally a plurality of LED elements are assembled on the circuit substrate.Circuit substrate also provides the function of heat radiation except playing the part of the role of carrying led module.
The heat extraction coefficient that routine utilizes glass fibre FR4 surface that the pcb board of Copper Foil is set is about 0.3W/m-K, has been not enough to deal with radiating requirements.In addition, utilize FR4 to be the heat-radiating substrate of base material, its flexibility is not good, is unsuitable for the application of folded product yet.
Summary of the invention
Main purpose of the present invention provides a kind of heat-radiating substrate, it has excellent heat dissipation characteristics, and have high voltage withstanding dielectric insulation characteristic and deflection physical construction characteristic concurrently, and the cooling application as carrying electronic component (for example LED high-power components) of pcb board for example is provided.
The present invention discloses a kind of heat-radiating substrate and its heat sink material.Described heat-radiating substrate comprises the first tinsel, the second tinsel and the radiative material bed of material.Described heat sink material is stacked to be placed between described the first tinsel and described the second tinsel and forms physical contact.The thermal conductivity of the described radiative material bed of material is greater than 1.0W/m-K, and thickness is less than 0.5mm, and heat sink material wherein comprises: (1) fluoro containing polymers polymkeric substance, and its fusing point is higher than 150 ℃, and weight percent is between 15-40%; (2) heat conductive filler, it intersperses among in the described fluoro containing polymers polymkeric substance, and weight percent is between 60-85%; (3) coupling agent, its ratio are the 0.5-3% weight percent of heat conductive filler.The chemical formula of described coupling agent is
Wherein, R1, R2 and R3 are alkyl (alkyl group) C
aH
2a+1, a＞=1;
X and Y are selected from: hydrogen (H), fluorine (F), chlorine (Cl), C
bH
2b+1, b＞=1; And
N is positive integer.
Preferably, described fluoro containing polymers polymkeric substance can be selected from Ethylene/tetrafluoroethylene (polyethylenetetrafluoroethylene; PETFE) or poly(vinylidene fluoride) (Poly Vinylidene Fluoride; PVDF), wherein the fusing point of PETFE is greater than 220 ℃, and the fusing point of PVDF is greater than 150 ℃.Because both all have higher melt and tool flame-retarding characteristic, can be high temperature resistant, and be difficult for catching fire, and have more the using value on the safety.Described heat conductive filler then can be selected such as ceramic materials such as nitride and oxide compounds.
Except having good heat conduction and insulation effect, if the thickness of described the first tinsel and the second tinsel is made respectively less than 0.1mm and 0.2mm, and the thickness of the described radiative material bed of material is less than 0.5mm (0.3mm is better), it can become by the test substrate flexing that 1cm is wide the deflection test of 10mm diameter circular, the situation that its surface does not have fracture or slight crack occurs, and is able to use for folded product.
Description of drawings
Fig. 1 illustrates the heat-radiating substrate of one embodiment of the invention.
Embodiment
Heat sink material of the present invention mainly comprises: fluoro containing polymers polymkeric substance, heat conductive filler and coupling agent, details are as follows for its composition, ratio and production method.
The surface of heat sink material of the present invention can be enclosed tinsel and be made heat-radiating substrate, and its production method is described as follows: (1) is poured 24 parts of fluoro containing polymers polymkeric substance and 76 parts of heat conductive fillers and coupling agent in the ball grinder into, and mixes 12 hours with 100rpm.That is, the part by weight of fluoro containing polymers polymkeric substance and heat conductive filler is 24:76.(2) raw material of above-mentioned premix is poured among the mixing roll Kneader (oil temperature is set 240 ℃) mixing with 45rpm, until raw materials melt evenly after approximately 270 ℃ finish mixing.(3) fused raw material of mixing roll Kneader being finished is poured in the dicing machine, and is for subsequent use with 300 ℃ of sons that cut into dices.(4) the above-mentioned particle of finishing is poured into twin-screw extruder and squeezed out thin slice through the rolling press tinsel (for example Copper Foil) of fitting with 280 ℃, namely finish heat-radiating substrate 10 (thickness containing metal paper tinsel is about 0.27mm) as shown in Figure 1.
Particularly, described heat-radiating substrate 10 comprise the first tinsel 11, the second tinsel 12 and be stacked and placed on described the first tinsel 11 and described the second tinsel 12 between the radiative material bed of material 13, the described radiative material bed of material 13 is made by above-mentioned thermally conductive material.Described the first and second tinsels 11 and 12 and the described radiative material bed of material 13 between interface form physical contact, and the inner layer sheet mask of tinsel 11 and 12 has the outstanding and described radiative material bed of material 13 of warty to fit to produce clinging powers.
Above-mentioned fluoro containing polymers polymkeric substance can be ethylene-tetrafluoroethylene copolymer (PETEF) or poly(vinylidene fluoride) (PVDF).The present embodiment uses PETFE, for example Q3-9030 of Dow Chemical company or Tefzel
TMHeat conductive filler can be oxide compound or nitride.Coupling agent is the 0.5-3% weight percent of heat conductive filler, and its chemical formula is:
Wherein, R1, R2 and R3 are alkyl (alkyl group) C
aH
2a+1, a＞=1;
X and Y are selected from: hydrogen (H), fluorine (F), chlorine (Cl), C
bH
2b+1, b＞=1; And
N is positive integer.
Be the characteristic after the clear the present invention of understanding adds coupling agent, do not add coupling agent and wherein the mixing time in ball grinder change in 20 minutes the situation comparison group in kind, and comparing with the experimental group that adds the different ratios coupling agent into.Its proof voltage and flexibility test result are as shown in Table 1.
The proof voltage test is to carry out pressure cooking test (Pressure Cook Test; PCT), being the test piece of will make depresses test after 24 hours through the saturated vapo(u)r of 2 normal atmosphere (atm) and 121 ℃.If made test piece is closely knit not, the water vapour of intrusion will undermine its voltage-resistent characteristic.Flexibility test then is the 1cm wide plate material paillon foil of formed material being removed described the second tinsel, namely is equivalent to the monolateral Copper Foil of only fitting, the circular and minimum diameter that do not rupture of flexing.
Table one
As shown in Table 1, the control group that does not add coupling agent significantly reduces than the initial stage (without the pressure boiling) through the voltage-resistent characteristic of pressure cooking test, and the experimental group 1-5 of adding coupling agent is behind the pressure cooking test, still can bear suitable the voltage (〉 2KV of tool), and the weight percent take coupling agent as heat conductive filler is better between 0.75～1.5%, and has good voltage-resistent characteristic.In addition, the diameter that the test piece of the flexing of all experimental group 1-5 test is broken is all less than 10mm, and along with the ratio of coupling agent increases and significantly improves, person's (〉 10mm that obviously is better than not adding the coupling agent).In other words, more coupling agents will have so that composition material is softer better flexural property.
The weight percent of described fluoro containing polymers polymkeric substance and heat conductive filler can be done the adjustment of certain degree and still keep same characteristic.Preferably, the weight percent of described fluoro containing polymers polymkeric substance is between 15-40%; And the weight percent of heat conductive filler is between 60-85%.Described coupling agent is the 0.5-3% weight percent of described heat conductive filler.
Except above-mentioned material selection, the heat-conducting polymer polymkeric substance also can be selected tetrafluoroethylene (poly (tetrafluoroethylene); PTFE), tetrafluoraoethylene-hexafluoropropylene copolymer (tetrafluoroethylene-hexafluoro-propylene copolymer; FEP), ethylene-tetrafluoroethylene copolymer (ethylene-tetrafluoroethylene copolymer; ETFE), perfluoro alkoxy upgrading tetrafluoroethylene (perfluoroalkoxy modified tetrafluoroethylenes; PFA), poly-(chlorine three-fluorine tetrafluoroethylene) (poly (chlorotri-fluorotetrafluoroethylene); PCTFE), vinylidene fluoride-TFE copolymer (vinylidene fluoride-tetrafluoroethylene copolymer); VF-2-TFE), poly(vinylidene fluoride) (poly (vinylidene fluoride)), tetrafluoroethylene-perfluor dioxole multipolymer (tetrafluoroethylene-perfluorodioxole copolymers), vinylidene difluoride-hexafluoropropylene copolymer (vinylidene fluoride-hexafluoropropylene copolymer), vinylidene fluoride-R 1216-tetrafluoroethylene trimer (vinylidene fluoride-hexafluoropropylene-tetrafluoroethylene terpolymer) and tetrafluoroethylene-perfluoro methyl vinyl ether (tetrafluoroethylene-perfluoromethylvinylether) add and solidify territory monomer trimer (cure site monomer terpolymer) etc.
The nitride that heat conductive filler is selected comprises zirconium nitride (zirconium nitride; ZrN), boron nitride (Boron nitride; BN), aluminium nitride (Aluminum nitride; AlN), silicon nitride (Silicon nitride; SiN).Oxide compound comprises aluminum oxide (Aluminum oxide; Al
2O
3), magnesium oxide (Magnesium oxide; MgO), silicon oxide (Silicon oxide; SiO
2), zinc oxide (Zinc oxide; ZnO), titanium dioxide (Titaninum dioxide; TiO
2) etc.
The thermal conductivity of heat sink material of the present invention is greater than 1.0W/m-K, and is general even greater than 1.5W/m-K, and can significantly promote its radiating efficiency than traditional FR4 glass fibre.
Heat sink material of the present invention, not only have high-heat conductive efficency, high voltage withstanding, and the heat-radiating substrate of its making has more standby good flexibility, and be applied to present PCB, dispel the heat for illuminating led module, even can be used for the application of the collapsible heat radiations such as notebook, mobile phone.
Technology contents of the present invention and technical characterstic disclose as above, yet the those skilled in the art still may be based on teaching of the present invention and disclosure and done all replacement and corrections that does not break away from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to those disclosed embodiments, and should comprise various do not break away from replacement of the present invention and corrections, and is contained by appended claims.
Claims (13)
1. heat sink material, its thermal conductivity is characterized in that comprising greater than 1.0W/m-K:
Fluoro containing polymers polymkeric substance, its fusing point are higher than 150 ℃;
Heat conductive filler, it intersperses among in the described fluoro containing polymers polymkeric substance; And
Coupling agent, its chemical formula is
Wherein, R1, R2 and R3 are alkyl C
aH
2a+1, a 〉=1;
X and Y are selected from: H, F, Cl, C
bH
2b+1, b 〉=1;
N is positive integer,
Wherein, the weight percent of described heat conductive filler is between 60-85%, and the weight percent of described fluoro containing polymers polymkeric substance is between 15-40%, and described coupling agent is the 0.5-3% weight percent of heat conductive filler.
2. heat sink material according to claim 1 is characterized in that described fluoro containing polymers polymkeric substance is selected from ethylene-tetrafluoroethylene copolymer or poly(vinylidene fluoride).
3. heat sink material according to claim 1 is characterized in that described fluoro containing polymers polymkeric substance is selected from tetrafluoroethylene, tetrafluoraoethylene-hexafluoropropylene copolymer, ethylene-tetrafluoroethylene copolymer, perfluoro alkoxy upgrading tetrafluoroethylene, poly-(chlorine three-fluorine tetrafluoroethylene), vinylidene fluoride-TFE copolymer, poly(vinylidene fluoride), tetrafluoroethylene-perfluor dioxole multipolymer, vinylidene difluoride-hexafluoropropylene copolymer, vinylidene fluoride-R 1216-tetrafluoroethylene trimer and tetrafluoroethylene-perfluoro methyl vinyl ether add and solidify territory monomer trimer.
4. heat sink material according to claim 1 is characterized in that described coupling agent is 0.75～1.5% weight percent of described heat conductive filler.
5. heat sink material according to claim 1 is characterized in that described heat conductive filler is selected from nitride or oxide compound.
6. heat sink material according to claim 5 is characterized in that described oxide compound is selected from aluminum oxide, magnesium oxide, silicon oxide, zinc oxide, titanium dioxide.
7. heat sink material according to claim 5 is characterized in that described nitride is selected from zirconium nitride, boron nitride, aluminium nitride, silicon nitride.
8. heat-radiating substrate is characterized in that comprising:
The first tinsel;
The second tinsel; And
The radiative material bed of material, it is stacked and placed between described the first tinsel and described the second tinsel and forms physical contact, and the thermal conductivity of the described radiative material bed of material is greater than 1W/m-K, and thickness is less than 0.5mm, and comprises:
(1) fluoro containing polymers polymkeric substance, its fusing point are higher than 150 ℃; With
(2) heat conductive filler, it intersperses among in the described fluoro containing polymers polymkeric substance; And
(3) coupling agent, its chemical formula is
Wherein, R1, R2 and R3 are alkyl C
aH
2a+1, a 〉=1;
X and Y are selected from: H, F, Cl, C
bH
2b+1, b 〉=1;
N is positive integer,
The weight percent of wherein said heat conductive filler is between 60-85%, the weight percent of described fluoro containing polymers polymkeric substance is between 15-40%, described coupling agent is the 0.5-3% weight percent of heat conductive filler, wherein after adopting the wide heat-radiating substrate of 1cm and removing described the second tinsel, surface non-cracking or slight crack produced when flexing became the cylinder of 10mm diameter, and the thickness of wherein said the first tinsel is less than or equal to 0.2mm.
9. heat-radiating substrate according to claim 8 is characterized in that described fluoro containing polymers polymkeric substance is selected from ethylene-tetrafluoroethylene copolymer or poly(vinylidene fluoride).
10. heat-radiating substrate according to claim 8 is characterized in that described fluoro containing polymers polymkeric substance is selected from tetrafluoroethylene, tetrafluoraoethylene-hexafluoropropylene copolymer, ethylene-tetrafluoroethylene copolymer, perfluoro alkoxy upgrading tetrafluoroethylene, poly-(chlorine three-fluorine tetrafluoroethylene), vinylidene fluoride-TFE copolymer, poly(vinylidene fluoride), tetrafluoroethylene-perfluor dioxole multipolymer, vinylidene difluoride-hexafluoropropylene copolymer, vinylidene fluoride-R 1216-tetrafluoroethylene trimer and tetrafluoroethylene-perfluoro methyl vinyl ether add and solidify territory monomer trimer.
11. heat-radiating substrate according to claim 8 is characterized in that described heat conductive filler is selected from: aluminum oxide, magnesium oxide, zinc oxide, silicon oxide, titanium dioxide, zirconium nitride, boron nitride, aluminium nitride and silicon nitride.
12. heat-radiating substrate according to claim 8 is characterized in that placing 2 normal atmosphere, the boiling of 121 ℃ of saturated steam pressure after 24 hours, every 2mm can bear the above voltage of 2KV.
13. heat-radiating substrate according to claim 8 is characterized in that described the first and second tinsels are Copper Foils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710110710 CN101316499B (en) | 2007-06-01 | 2007-06-01 | Cooling substrates and cooling material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710110710 CN101316499B (en) | 2007-06-01 | 2007-06-01 | Cooling substrates and cooling material |
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| Publication Number | Publication Date |
|---|---|
| CN101316499A CN101316499A (en) | 2008-12-03 |
| CN101316499B true CN101316499B (en) | 2013-02-27 |
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ID=40107289
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710110710 Expired - Fee Related CN101316499B (en) | 2007-06-01 | 2007-06-01 | Cooling substrates and cooling material |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102943969A (en) * | 2012-11-21 | 2013-02-27 | 深圳华瀚新能源材料有限公司 | Light-emitting diode (LED) lamp using heat conduction high-polymer material for heat dissipation |
| TWI561623B (en) * | 2015-09-07 | 2016-12-11 | Polytronics Technology Corp | Thermal interface material |
| JP6493616B1 (en) * | 2017-11-02 | 2019-04-03 | ダイキン工業株式会社 | Fluorine-containing elastomer composition and sheet for heat dissipation material |
| TWI686309B (en) * | 2019-01-09 | 2020-03-01 | 可成科技股份有限公司 | Heat-dissipating structure and manufacturing method thereof |
| CN110776706A (en) * | 2019-10-29 | 2020-02-11 | 追信数字科技有限公司 | Method for manufacturing CPU heat dissipation material by heat absorption, heat transfer and radiation combined mechanism |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100722A (en) * | 1988-11-25 | 1992-03-31 | Nichias Corporation | Glass fiber-reinforced resin composite materials |
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2007
- 2007-06-01 CN CN 200710110710 patent/CN101316499B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100722A (en) * | 1988-11-25 | 1992-03-31 | Nichias Corporation | Glass fiber-reinforced resin composite materials |
Non-Patent Citations (1)
| Title |
|---|
| hu futian et.al..manufacturing and characteristics of copper clad laminates based on glass cloth and polytertrafluoroethylene.《Polymers and polymer composites》.2006,第14卷(第1期),81-85. * |
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Effective date of registration: 20140618 Address after: 215316 Jiangsu province Hanpu Kunshan Development Zone, hi tech Industrial Park Road (No. 998) Patentee after: Kunshan Juda Electronic Co., Ltd. Address before: Hsinchu City, Taiwan, China Patentee before: Juding Science and Technology Co., Ltd. |
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