CN101315175A - High power semiconductor lighting lamp - Google Patents
High power semiconductor lighting lamp Download PDFInfo
- Publication number
- CN101315175A CN101315175A CNA200710041405XA CN200710041405A CN101315175A CN 101315175 A CN101315175 A CN 101315175A CN A200710041405X A CNA200710041405X A CN A200710041405XA CN 200710041405 A CN200710041405 A CN 200710041405A CN 101315175 A CN101315175 A CN 101315175A
- Authority
- CN
- China
- Prior art keywords
- fin
- led
- heat
- power led
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 12
- 238000005266 casting Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000005034 decoration Methods 0.000 abstract 1
- 238000004512 die casting Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004134 energy conservation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses a high-power semiconductor illuminating lamp which comprises a lamp holder, an LED driver, an insulating shell, a radiator with crossed radiating fins and a high-power LED. A ring-shaped groove is formed on the bottom surface of the radiator with crossed radiating fins. The high-power LED is fixed on the central plane of the ring-shaped groove. Reflecting mirrors are arranged at the periphery of the high-power LED. A lamp shade is hermetically connected with the ring-shaped groove. The radiator consists of a concave heat conducting body, ribs, heat-transfer sheets, fins and radiating fins. The ribs are arranged perpendicularly inside the concave heat conducting body. The heat-transfer sheets are arranged circularly on the outer wall of the concave heat conducting body. Fins are arranged on two sides of the initial end and at the tail end of the heat-transfer sheets. The width of the fin is reduced from bottom to top. The width of the radiating fin is reduced from top to bottom. The radiating fins are distributed among the heat-transfer sheets, arranged crosswise relative to the fins and connected with the outer wall of the concave heat conducting body. The radiator with crossed radiating fins is made from die-casting aluminum materials with good thermal conductivity, has high heat dissipating capability toward the surrounding space and minimizes the light attenuation of the high-power LED. Therefore, the illuminating lamp is applicable to the light fittings used for indoor and outdoor illumination and decoration with compact structure.
Description
Technical field
The present invention relates to a kind of semi-conductor lighting lamp, particularly a kind of single great power LED is fixed on the high power semiconductor lighting lamp on the fin chiasma type radiator.
Background technology
The semi-conductor electricity light source is a kind of electric light source that does not have filament, is a kind of luminescent device that directly electric energy is converted into luminous energy, is called light emitting diode, is also referred to as semiconductor lamp, the English LED that is called for short.Semiconductor lighting is considered to the new energy-conserving light source of illumination of 21 century.LED is not only energy-conservation, also have the life-span long, volume is little, safety, environmental protection, characteristics such as non-maintaining, easy to control.LED can replace conventional light source to use in a lot of places, and the speed of LED replacement traditional lighting light source has been quickened in the particularly appearance of great power LED, also makes LED become real in the large-area applications of indoor and outdoor lighting.
Great power LED is a direction of LED industry future development, but great power LED is had relatively high expectations to heat dissipation technology, the power of LED is big more, the heat flow density of its chip is just high more, environment temperature reaches certain limit will very fast generation light decay, directly cause the decline in LED life-span, the temperature of led chip sharply rises and damages led chip when the effect of radiator is bad, has only the heat dissipation technology that solves great power LED, delay the light decay of LED to greatest extent, the application of the large-area popularization great power LED of ability.
Semi-conductor lighting lamp of the prior art, structure as shown in Figure 1, one group of great power LED 12 is fixed on the funnel type radiator 17, and be electrically connected with lamp holder 1 and led driver 2, funnel type radiator 17 is fixed on the radiator stand 16, and by insulation crust 3 and lampshade 10 great power LED 12 is surrounded.The semi-conductor combined lamp of this structure, luminous intensity is unbalanced, and because of funnel type radiator 17 is surrounded by lampshade 10 large tracts of land, can not carry out sufficient heat exchange with air, and heat dispersion is relatively poor, and comparatively fast produces light decay, directly causes the decline in LED life-span.
Summary of the invention
Unbalanced and the relatively poor decline that causes the LED life-span of great power LED cooling effect for the luminous intensity that solves semi-conductor combined lamp, the invention provides and a kind of funnel type radiator 17 and radiator stand 16 are fused, and be improved to fin chiasma type radiator, and adopt the high power semiconductor lighting lamp of single great power LED.
The technical solution adopted for the present invention to solve the technical problems is: comprise lamp holder, led driver, insulation crust, fin chiasma type radiator and great power LED, wherein lamp holder, led driver and great power LED are electrically connected, fin chiasma type radiator bottom surface is provided with ring groove, fixing great power LED on its ring groove central plane, and with reflective mirror encirclement great power LED, lampshade and ring groove are tightly connected; Insulation crust is provided with light sensor.
Described fin chiasma type radiator is made of matrix heat carrier, fin, heat transfer sheet, fin and fin; On matrix heat carrier inwall and bottom surface around and vertical row show fin; On matrix heat carrier outer wall around and the arranged vertical heat transfer sheet, the both sides, top and the end of heat transfer sheet are provided with fin, the width of its fin is to narrow down from top to bottom; The width of fin is to narrow down from top to bottom, and is distributed between the heat transfer sheet, with the fin cross arrangement, and with matrix heat carrier outer wall on be connected.
In the led driver structure, light-operated PCB is fixed on the side of LED power supply PCB, and is electrically connected with light sensor; Be fixed with the isolating transformer of high frequency at the opposite side of LED power supply PCB.
The invention has the beneficial effects as follows, this direction arranged vertical fin that makes progress along thermal current, and with the structure of fin cross arrangement, compare with funnel type radiator of the prior art, its remarkable advantage is, heat in the great power LED passes to heat transfer sheet and fin by the matrix heat carrier, carries out heat exchange with air, and the heat of fin and fin is taken away.Air is taken away heat, and what are relevant with the surface area size of fin and fin.The surface area of fin is big more, and the heat of transmission is many more, and radiating effect is just high more.But limit by space and cost, the volume of radiator just is difficult to continue to increase.Therefore in order to continue to promote the radiating effect of radiator, have in the moulding of fin and quantitatively work hard.Fin or fin pitch are too small in actual applications, and it is full to be easy to be become silted up by laying dust, and are difficult for fully carrying out heat exchange with air at the heat of spacing, so fin asks and ask greatly more, but do not ask close.
In fin chiasma type heat spreader structures, the width up and down of fin and fin does not wait, and interleaved mode is arranged, a side narrower at width leaves enough spaces, even the spacing of fin is closeer, heat and surrounding air can be carried out sufficient heat exchange, and reduce temperature difference between radiator and the surrounding air, with the temperature that reduces to greatest extent in the great power LED, reduce the light decay of great power LED, indoor and outdoor general lighting and decorative lamp that can the implementation structure compactness.
Description of drawings
Fig. 1 is the structural representation of a kind of semi-conductor combined lamp of the prior art.
Fig. 2 is the structural representation of one embodiment of the invention.
Fig. 3 is the vertical view of the fin chiasma type radiator in embodiment illustrated in fig. 2.
Fig. 4 is the A-A half sectional view of Fig. 3.
Fig. 5 is the upward view of Fig. 3.
Fig. 6 is the structural representation of led driver.
1. lamp holders among the figure, 2.LED driver, 201. isolating transformers, 202.LED power supply PCB, 203. light-operated PCB, 3. insulation crust, 4. fin, 5. matrix heat carrier, 6. fin, 7. fin, 8. heat transfer sheet, 9. annular groove, 10. lampshade, 11. reflective mirrors, 12. great power LED, 13. fins, 14. light sensors, 15. fin chiasma type radiator, 16. radiator stands, 17. funnel type radiators.
The specific embodiment
By Fig. 2～shown in Figure 6, the present invention includes lamp holder 1, led driver 2, insulation crust 3, fin chiasma type radiator 15 and great power LED 12, wherein lamp holder 1 and led driver 2 are electrically connected with light sensor 14 and great power LED 12 respectively.Insulation crust 3 is provided with light sensor 14.Led driver 2 is surrounded by lamp holder 1, insulation crust 3, fin chiasma type radiator 15.According to the lamp installation instructions for use, also can be without lamp holder 1, power supply directly through insulation shell 3, is connected with led driver 2.
Insulation crust 3 and 15 salable connections of fin chiasma type radiator, can be on around the insulation crust 3 when not needing to seal fluting or open sky so that the heats in the matrix heat carrier 5 distribute, further reduce the temperature of great power LED 12.When the temperature of great power LED 12 surpassed limiting temperature, the brightness that the thermal management of led driver 2 is in time controlled great power LED 12 was turned down or is extinguished.For energy-conservation, the use light fixture in indivedual occasions can be provided with light sensor 14, in control daybreak and dark period to the power of light and extinguish.
Fin chiasma type radiator 15 bottom surfaces are provided with ring groove 9, fixing great power LED 12 on the central plane of its ring groove 9, and surround great power LEDs 12 with reflective mirror 11, lampshade 10 is tightly connected with ring groove 9.This lampshade 10 is semi-circular, also can adopt plate or other shapes, as long as have the light transmittance height, and anti-dazzle, eye-protecting function gets final product.
Fin chiasma type radiator 15 is to be made of matrix heat carrier 5, fin 6, heat transfer sheet 8, fin 7, fin 13 and fin 4, and is integral with the aluminum high-pressure casting of heat conduction and perfect heat-dissipating.In matrix heat carrier 5, be provided with fin 6, and and the bottom surface of matrix heat carrier 5 and inwall on around the mode arranged vertical; On matrix heat carrier 5 outer walls, arrange heat transfer sheet 8 and fin 7 around distribution and vertical direction, heat transfer sheet 8 is to begin down to broaden gradually at the top of matrix heat carrier 5 outer walls or middle part, its width one fin 13 that regularly extends, fin 7 is to begin down to broaden gradually from the top, and begins to be connected to the end with the both sides, top of heat transfer sheet 8; The width of fin 4 is to narrow down from top to bottom, and is distributed between the heat transfer sheet 8, with fin 7 cross arrangements, and with matrix heat carrier 5 outer walls on be connected.
The size or its fixed form different of the power output of great power LED 12 and heat-radiating substrate (fin that LED carries or bolt), the number of the diameter of matrix heat carrier 5 and bottom shape and fin 6, heat transfer sheet 8 and fin 4 is then slightly different with size.
In the structure of led driver 2, light-operated PCB203 is fixed on the side of LED power supply PCB202, and is electrically connected with light sensor 14; Be fixed with the isolating transformer 201 of high frequency at the opposite side of LED power supply PCB202.
Claims (4)
1. a high power semiconductor lighting lamp comprises lamp holder, led driver, insulation crust, fin chiasma type radiator and great power LED, and wherein lamp holder, led driver and great power LED are electrically connected, and it is characterized in that:
Fin chiasma type radiator bottom surface is provided with ring groove, fixing great power LED on its ring groove central plane, and surround great power LED with reflective mirror, lampshade and ring groove are tightly connected; Insulation crust is provided with light sensor.
2. high power semiconductor lighting lamp according to claim 1 is characterized in that:
Described fin chiasma type radiator is made of matrix heat carrier, fin, heat transfer sheet, fin and fin; On matrix heat carrier inwall and bottom surface around and vertical row show fin; On matrix heat carrier outer wall around and the arranged vertical heat transfer sheet, the both sides, top and the end of heat transfer sheet are provided with fin, the width of its fin is to narrow down from top to bottom; The width of fin is to narrow down from top to bottom, and is distributed between the heat transfer sheet, with the fin cross arrangement, and with matrix heat carrier outer wall on be connected.
3. high power semiconductor lighting lamp according to claim 1 is characterized in that:
In the led driver structure, light-operated PCB is fixed on the side of LED power supply PCB, and is electrically connected with light sensor; Be fixed with the isolating transformer of high frequency at the opposite side of LED power supply PCB.
4. high power semiconductor lighting lamp according to claim 1 is characterized in that:
Fin chiasma type radiator forms with heat conduction and the good aluminum high-pressure casting of thermal diffusivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710041405XA CN100552287C (en) | 2007-05-29 | 2007-05-29 | High power semiconductor lighting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710041405XA CN100552287C (en) | 2007-05-29 | 2007-05-29 | High power semiconductor lighting lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101315175A true CN101315175A (en) | 2008-12-03 |
| CN100552287C CN100552287C (en) | 2009-10-21 |
Family
ID=40106272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710041405XA Expired - Fee Related CN100552287C (en) | 2007-05-29 | 2007-05-29 | High power semiconductor lighting lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100552287C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102563575A (en) * | 2010-12-16 | 2012-07-11 | 金松山 | Isolation type heat dissipation device of LED (light-emitting diode) lamp |
| CN103062643A (en) * | 2011-10-21 | 2013-04-24 | 深圳长城开发科技股份有限公司 | Light-emitting diode (LED) bulb |
| CN103090339A (en) * | 2011-10-29 | 2013-05-08 | 金松山 | Cross type radiator for light-emitting diode (LED) lamp |
| CN104180345A (en) * | 2013-05-28 | 2014-12-03 | 深圳市海洋王照明工程有限公司 | Lamp |
| CN104654255A (en) * | 2013-11-22 | 2015-05-27 | 苏州承源光电科技有限公司 | Radiator for LEDs |
| EP2659178A4 (en) * | 2010-12-31 | 2015-07-15 | Ge Lighting Solutions Llc | Led lamp |
| WO2016070368A1 (en) * | 2014-11-06 | 2016-05-12 | 袁志贤 | Novel heat dissipation led lamp |
-
2007
- 2007-05-29 CN CNB200710041405XA patent/CN100552287C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102563575A (en) * | 2010-12-16 | 2012-07-11 | 金松山 | Isolation type heat dissipation device of LED (light-emitting diode) lamp |
| EP2659178A4 (en) * | 2010-12-31 | 2015-07-15 | Ge Lighting Solutions Llc | Led lamp |
| CN103062643A (en) * | 2011-10-21 | 2013-04-24 | 深圳长城开发科技股份有限公司 | Light-emitting diode (LED) bulb |
| CN103062643B (en) * | 2011-10-21 | 2015-11-18 | 深圳长城开发科技股份有限公司 | A kind of LEDbulb lamp |
| CN103090339A (en) * | 2011-10-29 | 2013-05-08 | 金松山 | Cross type radiator for light-emitting diode (LED) lamp |
| CN104180345A (en) * | 2013-05-28 | 2014-12-03 | 深圳市海洋王照明工程有限公司 | Lamp |
| CN104180345B (en) * | 2013-05-28 | 2017-09-22 | 深圳市海洋王照明工程有限公司 | A kind of light fixture |
| CN104654255A (en) * | 2013-11-22 | 2015-05-27 | 苏州承源光电科技有限公司 | Radiator for LEDs |
| WO2016070368A1 (en) * | 2014-11-06 | 2016-05-12 | 袁志贤 | Novel heat dissipation led lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100552287C (en) | 2009-10-21 |
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Address after: Shandong Dongying Economic Development Zone 56 East six road Tektronix Photoelectric Technology Park Patentee after: Jin Songshan Address before: Room 25, No. 390, Lane 402, Royal mountain road, Shanghai, Pudong New Area Patentee before: Jin Songshan |
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Address after: Department of ENT, 146 Development Zone Hospital, the Yellow Sea West Road, Dalian Development Zone, Liaoning Province, China Patentee after: Jin Songshan Address before: Shandong Dongying Economic Development Zone 56 East six road Tektronix Photoelectric Technology Park Patentee before: Jin Songshan |
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Address after: 116100 Liaoning Province, Dalian city Jinzhou district west coast defense Lu Feng Jing building No. 443 room 4-1501 Patentee after: Jin Songshan Address before: 116600 Department of ENT, Development Zone Hospital, 146 West Road, Dalian Development Zone, the Yellow Sea, Liaoning Patentee before: Jin Songshan |
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Owner name: BEIJING HENGRUI TIANQI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: JIN SONGSHAN Effective date: 20120411 |
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Free format text: CORRECT: ADDRESS; FROM: 116100 DALIAN, LIAONING PROVINCE TO: 100070 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20120411 Address after: 100070, No. 2, West eight, Jia Ming Street, North Village, Daxing District, Beijing Patentee after: Beijing hengrui Tian Qi Technology Co., Ltd. Address before: 116100 Liaoning Province, Dalian city Jinzhou district west coast defense Lu Feng Jing building No. 443 room 4-1501 Patentee before: Jin Songshan |
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| DD01 | Delivery of document by public notice | ||
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Addressee: Qi Bingcong Document name: Notification of Termination of Patent Right |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 Termination date: 20130529 |