CN101312616A - Circuit board etching method - Google Patents
Circuit board etching method Download PDFInfo
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- CN101312616A CN101312616A CNA2007101076239A CN200710107623A CN101312616A CN 101312616 A CN101312616 A CN 101312616A CN A2007101076239 A CNA2007101076239 A CN A2007101076239A CN 200710107623 A CN200710107623 A CN 200710107623A CN 101312616 A CN101312616 A CN 101312616A
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- etching method
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- board etching
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Abstract
The invention relates to a graving method of circuit boards, comprising steps of: first, providing a circuit board, wherein one surface of the circuit board is at least provided with a nonconductive area, and then graving at least one label on the nonconductive area of the circuit board. When processes screen printing, the invention can flatly attach a steel plate on a circuit board without protruded labels, to attach the solder paste of the screen printing on the connecting nodes correctly and keep a certain solder paste deposition amount, thereby improving the combination force between the connecting nodes and the active/inactive elements in the following surface stick technique and preventing short circuit.
Description
Technical field
The present invention relates to a kind of circuit board etching method, particularly relate to a kind of method that forms mark in the engraving mode at circuit board.
Background technology
Along with the development of electronics technology, circuit board has become significant components indispensable in the various electronic products.
See also Fig. 1 and Fig. 2, the manufacture method of known circuit board comprises the following step: at first, one substrate 1 with metal level is provided, then, see through known deposition, exposure, development, etching supervisor with the metal level of substrate 1 form patterning wiring 21 and a plurality of binding with contact (pad) 22 to form a circuit board 2.Wherein, the patterning of circuit board 2 wiring 21 and the position that links with the appearance of assemblies such as contact 22 may be defined as a conduction region R21, and the other parts of circuit board 2 may be defined as a non-conductive district R22.
Then, see also Fig. 3 and shown in Figure 4 again, see through printing process forms a plurality of projectioies on the non-conductive district R22 of circuit board 2 mark (mark) 23, use to indicate and locate with mark or pin position markers or the like.
At last, see also the screen painting processing procedure that carries out shown in Figure 5, one steel plate 3 with patterning mesh 31 is set on circuit board 2, on steel plate 3, push away brush one tin cream 4 then, the mesh 31 of tin cream 4 by steel plate 3 is deposited on is preset as to link, so that the follow-up surface mount technology (SMT) that sees through coheres with active element (not shown) with on the position 22 of contact.
Yet, because the variation of the screen painting processing procedure of preparation mark is too big, cause the mark 23 of projection highly inconsistent, and then make steel plate 3 can't entirely be close on the circuit board 2, link with (for example: offset that the tin cream amount is too much or very few, tin cream is put or the like problem), and then feasible binding produces problem of short-circuit with the good or not adjacent binding of the adhesion between contact 22 and the active element with contact 22 on the contact 22 and cause tin cream 4 correctly to be deposited on.
This shows that above-mentioned existing circuit board etching method obviously still has inconvenience and defective, and demands urgently further being improved in the use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel circuit board etching method, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing circuit board etching method exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel circuit board etching method, can improve general existing screen painting processing procedure, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcomes the defective that existing circuit board etching method exists, and a kind of novel circuit board etching method is provided, and technical problem to be solved is to make its improved efficiency that can make follow-up screen painting, is very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of circuit board etching method according to the present invention proposes is characterized in that comprising the following step: a circuit board is provided, wherein has a non-conductive district at least on the surface of foregoing circuit plate; And form at least one mark in this non-conductive district of foregoing circuit plate in the engraving mode.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid circuit board etching method, wherein said engraving mode are the optics engraving.
Aforesaid circuit board etching method, wherein said mark is recess.
Aforesaid circuit board etching method, wherein said literal or the pattern of being labeled as.
Aforesaid circuit board etching method wherein saidly is labeled as that a label, a model, one indicate, a location is with mark or pin position markers.
Aforesaid circuit board etching method, wherein said circuit board are a printed circuit board (PCB).
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, circuit board etching method of the present invention has following advantage and beneficial effect at least: from the above, circuit board etching method of the present invention is to form mark in the engraving mode in the non-conductive district of circuit board, so that mark can be positioned at the non-conductive district of circuit board and can not protrude in the surface (as being recess) of circuit board, when after carry out screen painting, steel plate entirely is close on the circuit board that does not have raised marking, and then make that tin cream on the wire mark can be correct be formed at binding with on the contact, and can keep certain tin cream deposition, and in follow-up surface mount technology, promote the adhesion that links with between contact and the active element, and more can avoid situation of short circuit.
In sum, the invention relates to a kind of circuit board etching method, comprise the following step: at first, provide a circuit board, wherein, have a non-conductive district on the surface of circuit board at least; Then, form at least one mark in the engraving mode in the non-conductive district of circuit board.The present invention has above-mentioned plurality of advantages and practical value, obvious improvement is arranged technically, and produced handy and practical effect, and more existing circuit board etching method has the outstanding effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 and Fig. 2 are the wiring processing procedure schematic perspective view of known circuit board.
Fig. 3 is the schematic perspective view of raised marking on the known circuit board.
Fig. 4 is the cross-sectional schematic of raised marking on the known circuit board.
Fig. 5 is for carrying out the cross-sectional schematic of screen painting on the known circuit board.
Fig. 6 is the flow chart according to the circuit board etching method of preferred embodiment of the present invention.
Fig. 7 and Fig. 8 are the schematic perspective view of preferred embodiment circuit board etching method of the present invention.
The diagrammatic cross-sectional side elevation of A-A ' hatching on the circuit board in Fig. 9 displayed map 8.
Figure 10 and Figure 11 show the diagrammatic cross-sectional side elevation of the circuit board etching method different shape of preferred embodiment of the present invention.
Figure 12 is presented at the circuit board after preferred embodiment of the present invention is scribed, and carries out the diagrammatic cross-sectional side elevation of screen painting processing procedure.
Figure 13 shows the schematic perspective view according to the circuit board etching method of preferred embodiment of the present invention.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of circuit board etching method, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Below will consult relevant drawings, the circuit board etching method according to preferred embodiment of the present invention will be described.
See also shown in Figure 6ly, comprise step 1 (S01) and step 2 (S02) according to the circuit board etching method of preferred embodiment of the present invention.
Then, see also shown in Figure 7 again, step 1 (S01) provides a circuit board 5, wherein, circuit board 5 can be drawn by existing technology, for instance, a substrate that will have a metal level sees through deposition, exposure, development and etching supervisor to form patterning wiring 51 and a plurality of binding usefulness contact 52 on a surface 50 of circuit board 5.
Wherein, patterning wiring 51 and binding are defined as a conduction region R51 with contact 52, and the other parts of circuit board 5 are defined as a non-conductive district R52.In the present embodiment, circuit board 5 can be a printed circuit board (PCB).In addition, quantity and the position of the non-conductive district R52 of circuit board 5 also can be designed according to actual demand.
Then, please consult Fig. 8 and shown in Figure 9 simultaneously, step 2 (S02) forms at least one mark (mark) 53 in the engraving mode at the non-conductive district R52 of circuit board 5, and the surface that it is positioned at non-conductive district R52 and can not protrudes in circuit board for example presents recess (as shown in Figure 9).
In the present embodiment, the engraving mode can be optics engraving (for example being laser engraving) mode, and certainly, any other engraving mode also belongs to category of the present invention.
Wherein, mark 53 can literal or pattern represent that for instance, mark 53 can numeral, character, character string various textual representation such as (as shown in Figure 8), can also circle, pattern such as ellipse, triangle, rectangle, polygon, cross represents.In addition, mark 53 can be according to actual needs a label, a model, one indicate (logo, as shown in Figure 8), a location is with mark or pin position markers etc.
In addition, the cup depth of mark 53 and concave shape also can design according to actual demand, and for instance, the cup depth H1 of each mark 53 is all identical (as shown in Figure 9), certainly, the depression height H 2 of each mark 53, H3 also can differences (as shown in figure 10).
In addition, see also shown in Figure 11ly, the concave shape of each mark 53 also can be different, and mark 531 be that flat depression shape, mark 532 are skew wall recess or the like for wedged bottom recess, mark 533.
Hold, see also shown in Figure 12, because mark 53 is positioned at non-conductive district R52 and can not protrudes in the surface of circuit board 5, so that steel plate 3 can be smooth be close on the circuit board 5, and then make being placed in that tin cream 4 can be correct link with on the contact 52, produce problem of short-circuit and can avoid linking with contact 52 with the good or not adjacent binding of the adhesion between contact 52 and the active element.
In addition, above-mentioned step 2 (S02) forms recess mark 53 (as Fig. 8 and shown in Figure 9) in the engraving mode at the non-conductive district R52 of circuit board 5, forms the unique method of mark but this only is used for for example.
For instance, please consult shown in Figure 13ly simultaneously, step 2 (S02) can also be carved mode and be formed a depressed area 54 to manifest mark 55 at the non-conductive district R52 of circuit board 5, and wherein, depressed area 54 is around mark 55.At this moment, mark 55 still can not protrude in the surface of circuit board 5, so that steel plate 3 can be smooth be close to the wire mark processing procedure that carries out follow-up tin cream on the circuit board 5.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
1, a kind of circuit board etching method is characterized in that comprising the following step:
One circuit board is provided, wherein has a non-conductive district at least on the surface of foregoing circuit plate; And
Form at least one mark in the engraving mode in this non-conductive district of foregoing circuit plate.
2, circuit board etching method according to claim 1 is characterized in that wherein said engraving mode is the optics engraving.
3, circuit board etching method according to claim 1 is characterized in that wherein said mark is recess.
4, circuit board etching method according to claim 1 is characterized in that wherein said literal or the pattern of being labeled as.
5, circuit board etching method according to claim 1 is characterized in that wherein saidly being labeled as that a label, a model, one indicate, a location is with mark or pin position markers.
6, circuit board etching method according to claim 1 is characterized in that wherein said circuit board is a printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101076239A CN101312616A (en) | 2007-05-22 | 2007-05-22 | Circuit board etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101076239A CN101312616A (en) | 2007-05-22 | 2007-05-22 | Circuit board etching method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101312616A true CN101312616A (en) | 2008-11-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101076239A Pending CN101312616A (en) | 2007-05-22 | 2007-05-22 | Circuit board etching method |
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| CN (1) | CN101312616A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387664A (en) * | 2010-09-06 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board printing method |
| CN102740585A (en) * | 2011-04-02 | 2012-10-17 | 华硕科技（苏州）有限公司 | Circuit board and manufacturing method thereof |
| CN104029506A (en) * | 2014-05-20 | 2014-09-10 | 海门市曼博莱电子发展有限公司 | SMT chip-mounting technology |
| CN105873378B (en) * | 2016-06-01 | 2018-12-21 | 全讯射频科技(无锡)有限公司 | The height adjustment device of a plant ball steel mesh |
| CN111356295A (en) * | 2020-02-13 | 2020-06-30 | 广州金升阳科技有限公司 | Solder paste printing device and solder paste printing processing method |
-
2007
- 2007-05-22 CN CNA2007101076239A patent/CN101312616A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387664A (en) * | 2010-09-06 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board printing method |
| CN102387664B (en) * | 2010-09-06 | 2013-10-09 | 富葵精密组件(深圳)有限公司 | Circuit board printing method |
| CN102740585A (en) * | 2011-04-02 | 2012-10-17 | 华硕科技（苏州）有限公司 | Circuit board and manufacturing method thereof |
| CN104029506A (en) * | 2014-05-20 | 2014-09-10 | 海门市曼博莱电子发展有限公司 | SMT chip-mounting technology |
| CN105873378B (en) * | 2016-06-01 | 2018-12-21 | 全讯射频科技(无锡)有限公司 | The height adjustment device of a plant ball steel mesh |
| CN111356295A (en) * | 2020-02-13 | 2020-06-30 | 广州金升阳科技有限公司 | Solder paste printing device and solder paste printing processing method |
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Open date: 20081126 |