CN101310876B - Dust removal method of sensitization device - Google Patents
Dust removal method of sensitization device Download PDFInfo
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- CN101310876B CN101310876B CN2007100743837A CN200710074383A CN101310876B CN 101310876 B CN101310876 B CN 101310876B CN 2007100743837 A CN2007100743837 A CN 2007100743837A CN 200710074383 A CN200710074383 A CN 200710074383A CN 101310876 B CN101310876 B CN 101310876B
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Abstract
The invention discloses a dust removing method of a photoreception device, which includes the following processing procedures: A. a dust testing device is used for testing the photoreception device so as to determine the location of dust; B. a dust removing device is used for removing the dust for the photoreception device under the monitoring of the dust testing device until the monitoring result is normal. The dust removing method of the invention can immediately acquire the dust removing effect so as to avoid the defect of secondary dust removing after the dust removing result is found ineffective.
Description
Technical field
The present invention relates to a kind of dust removal method of sensor devices.
Background technology
In electric field, dust usually causes bad influence to electronic and electrical equipment.For example at camera COB (Chip on Board, chip on board) in the potting process, because environment and artificial factor, fall to having on the sensor devices (as CCD, CMOS etc.) of packaged camera inside small dust granules cause the bad generation of stain arranged on the image of taking pictures.When reprocessing this badness, usual way is after camera lens is screwed off from base, go dust granules is sticking with the air gun purge or with the glue rod at microscopically, and then the test of taking pictures after camera lens screwed on.Because these two kinds of methods all are the tests again of cleaning earlier, small dust granules is not cleaned out if this causes the sensor devices surface, must need to reprocess for the second time.The operator watches at microscopically for a long time simultaneously, and labour intensity is big, damages eyes easily.In addition, because camera has been packaged, easily the sensor devices surface dust is blown to outside the sensor devices scope with the air gun purge, test does not at that time have stain, but dust drops on the sensor devices once more in subsequent operation, and reliability is bad.If with the sticking sensor devices surface dust of glue rod, operating force is difficult to control, easily produces vestige on the sensor devices surface, causes other bad phenomenon to produce.
Summary of the invention
The present invention is exactly in order to overcome above deficiency, to have proposed a kind of dust removal method of sensor devices, and this method can be carried out dust and removed in test, avoid reprocessing for the second time.
Technical problem of the present invention is solved by following technical scheme:
A kind of dust removal method of sensor devices comprises following processing procedure:
A, utilize the dust testing arrangement to detect sensor devices, determine the dust present position;
B, utilization remove the dust device and go the dust operation normal until monitoring result to sensor devices under described dust testing arrangement monitoring, wherein said dust testing arrangement comprises computer, the test board that testing software is housed, described test board links to each other with computer, and described sensor devices is electrically connected with test board when test; Described sensor devices will over against the signal of telecommunication that produces of pure white test pattern be transferred to computer by test board, analysis and calculating by testing software demonstrate the image that described sensor devices is tested in real time on the display of computer, the stain that shows in the test pattern partly is exactly corresponding dust position, sensor devices surface; The described dust device that removes is removed the dust granules of correspondence position on the described sensor devices according to the position at stain place in the described test pattern, till not having stain on the described test pattern.
The described dust device that removes is for spraying the air gun of clean gas.
Described sensor devices is the sensor devices of camera.
Also comprise the steps: before the described steps A base of camera is split with the pcb board that is loaded with sensor devices.
The present invention with respect to the beneficial effect of prior art is:
Because of the present invention to go dust operation be what to carry out under the monitoring of dust testing arrangement, like this, with respect to testing dust removing effects after the dedusting in the prior art again,, the present invention avoids finding that dust removing effects needs the defective of repair for 2nd time after not good again thereby can immediately understanding dust removing effects.
Further, testing arrangement of the present invention comprises computer and the test board that testing software is housed, thereby has avoided the operator to watch at microscopically for a long time, and labour intensity is big, damages eyes easily.
The base of camera and the pcb board that is loaded with sensor devices are split, prevent from just dust to be blown to outside the sensor devices, do not have stain during test, but dust drops on problem on the sensor devices once more in subsequent operation, has improved the reliability of dedusting.
Description of drawings
Fig. 1 is the structural representation of testing arrangement of the present invention.
The specific embodiment
Embodiment one: at the mobile phone cam sensor devices, the processing procedure of dust removal method of the present invention is as follows:
1, the base of defective products camera and the pcb board that is loaded with sensor devices are split.
2, utilize the dust testing arrangement that the sensor devices of the camera that split base is tested, determine the dust position.
As shown in Figure 1, the dust testing arrangement comprises computer and the test board that testing software is housed, and described test board is provided with data buffer memory and sending module, switch module, data processing module, power transfer module, USB interface.During work, sensor devices to be tested and computer that testing software is housed are electrically connected with test board, the working power of test board can external 5V power supply, also can be provided by USB interface by computer.Power transfer module is changed the 5V power supply, produces the required operating voltage of each module to give each module for power supply.Data buffer memory and sending module receive the test data of sensor devices and are buffered in wherein, open switch module then, data buffer memory and sending module send to data processing module with test data, data processing module is handled test data, convert thereof into the data of usb protocol and send to USB interface, USB interface is delivered to computer with data and by computer data is handled.
Sensor devices is over against test pattern, and test pattern adopts a pure white picture.Sensor devices produces the corresponding signal of telecommunication according to test pattern, is transferred to computer by test board.Computer demonstrates the image that sensor devices is tested in real time by the analysis and the calculating of testing software on the display of computer, because test pattern is pure white picture, so the stain in the test pattern partly is exactly corresponding dust position, sensor devices surface.Testing software on the computer is transplanted and next image processing software in the former camera, also can write separately at test process.
3, use the dust granules of correspondence position on the air gun purge sensor devices according to the position at stain place in the test pattern on the computer, till not having stain on the test pattern.
Utilize the dust on the air gun purge sensor devices correspondence position, obviously also can use glue rod or other to remove the dust device and carry out dust removal operation, in whole dust removal process, the test pattern that always shows sensor devices on the display of computer in real time, the operator can understand dust removing effects immediately by the situation that test pattern shows and constantly adjust operation do not have stain on test pattern, illustrates that at this moment dedusting finishes.Air gun of the present invention also comprises filter, is used for the gas of sending into air gun is filtered, and the gas that makes air gun blow out is clean gas, avoids in the purge process sensor devices being brought secondary pollution.
4, the former base viscose glue water cover that removes is toasted after on the clean pcb board that is loaded with sensor devices of purge.
After the dedusting, again the base that splits is installed on the pcb board, mobile phone cam is operate as normal again.
Method of the present invention is owing to be the position of determining small dust granules on the sensor devices according to test pattern, and determining to drop on small dust granules on the sensor devices according to test pattern has or not and is cleaned out, in scale removal process, just can test the effect that obtains clearing up like this, thereby avoid carrying out repair for 2nd time; The operator does not need to watch for a long time microscope simultaneously, has alleviated operator's operation intensity greatly, effectively raises camera stain bad yield of reprocessing and reliability of products.
Obviously, the invention is not restricted to use on the sensor devices of mobile phone cam, can be suitable for equally for the sensor devices of other picture pick-up devices; Or even the electronic and electrical equipment of wider usability optical device, as long as utilize testing arrangement to monitor the dust removal operation of sensor devices in real time, all should be considered as belonging to protection scope of the present invention.
Claims (4)
1. the dust removal method of a sensor devices is characterized in that: comprise following processing procedure:
A, utilize the dust testing arrangement to detect sensor devices, determine the dust present position;
B, utilization remove the dust device and go the dust operation normal until monitoring result to sensor devices under described dust testing arrangement monitoring, wherein
Described dust testing arrangement comprises computer, the test board that testing software is housed, and described test board links to each other with computer, and described sensor devices is electrically connected with test board when test;
Described sensor devices will over against the signal of telecommunication that produces of pure white test pattern be transferred to computer by test board, analysis and calculating by testing software demonstrate the image that described sensor devices is tested in real time on the display of computer, the stain that shows in the described test pattern partly is exactly corresponding dust position, sensor devices surface;
The described dust device that removes is removed the dust granules of correspondence position on the described sensor devices according to the position at stain place in the described test pattern, till not having stain on the described test pattern.
2. the dust removal method of sensor devices according to claim 1 is characterized in that:
The described dust device that removes is for spraying the air gun of clean gas.
3. the dust removal method of sensor devices according to claim 1 and 2 is characterized in that:
Described sensor devices is the sensor devices of camera.
4. the dust removal method of sensor devices according to claim 3 is characterized in that:
Also comprise the steps: before the described steps A base of camera is split with the pcb board that is loaded with sensor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100743837A CN101310876B (en) | 2007-05-21 | 2007-05-21 | Dust removal method of sensitization device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100743837A CN101310876B (en) | 2007-05-21 | 2007-05-21 | Dust removal method of sensitization device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101310876A CN101310876A (en) | 2008-11-26 |
| CN101310876B true CN101310876B (en) | 2011-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100743837A Active CN101310876B (en) | 2007-05-21 | 2007-05-21 | Dust removal method of sensitization device |
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| CN (1) | CN101310876B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103128828A (en) * | 2011-12-03 | 2013-06-05 | 苏州豪特景精密机械有限公司 | Floor production device |
| CN103962347B (en) * | 2013-01-24 | 2016-05-11 | 北京京东方光电科技有限公司 | A kind of cleaning systems and method |
| TWI503183B (en) * | 2013-09-16 | 2015-10-11 | All Ring Tech Co Ltd | Cleaning equipment and cleaning methods |
| CN105021374A (en) * | 2014-04-25 | 2015-11-04 | 三星高新电机（天津）有限公司 | Measurement device and measurement method for foreign matters on surface of assembly product |
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2007
- 2007-05-21 CN CN2007100743837A patent/CN101310876B/en active Active
Non-Patent Citations (2)
| Title |
|---|
| JP特开2001-15471A 2001.01.19 |
| JP特开2003-42934A 2003.02.13 |
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| CN101310876A (en) | 2008-11-26 |
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Effective date of registration: 20191230 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
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