CN101310172A - Solder material inspecting device - Google Patents

Solder material inspecting device Download PDF

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Publication number
CN101310172A
CN101310172A CNA2006800426474A CN200680042647A CN101310172A CN 101310172 A CN101310172 A CN 101310172A CN A2006800426474 A CNA2006800426474 A CN A2006800426474A CN 200680042647 A CN200680042647 A CN 200680042647A CN 101310172 A CN101310172 A CN 101310172A
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intensity
mentioned
scolder
wave number
inspection object
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Chinese (zh)
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大桥胜己
堀野昌伸
大西康裕
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Omron Corp
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Omron Corp
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Abstract

Printing position information including CAD data is acquired by printing position acquiring means before electronic parts are mounted on a board (2). A light beam is applied only to a cream solder (3) printed on the board (2) while scanning the board (2) with the light beam. The inspection object intensity of the infrared radiation of a specific wave number reflected from the cream solder (3) by the application of the light beam is measured. The cream solder (3) printed on the board (2) is treated as an inspection object, and a light beam is applied to a cream solder (3) used as a comparison object with respect to the inspection object. The comparison object intensity of the infrared radiation of the specific wave number detected as a reflected light when the light beam is applied to the comparison object cream solder is measured. According to the comparison object intensity and the inspection object intensity, a deterioration parameter indicating the degree of relative deterioration of the cream solder (3) of the inspection object relative to the comparison object cream solder (3) is computed.

Description

Solder material inspecting device
Technical field
The present invention relates to check the device of scolder impairment grade.
Background technology
On the production line of printed base plate (hereinafter to be referred as " substrate "), by carrying out following operation, promptly on the printing process of printing solder on the substrate, scolder, carry the installation procedure of electronic unit in this printing, on substrate the reflow soldering operation of welding electronic unit, thereby electronic unit is installed on substrate.
This printing process is for example as described below.At first, disposing metal mask on substrate, is that welding paste supplies to the metal mask surface with scolder.Then, make scraper plate (ス キ one ジ) be connected on the metal mask surface and slip.Like this, welding paste is pushed by scraper plate on the metal mask surface and is rotated mobile.Owing to be formed with the hole corresponding with the Wiring pattern of substrate on metal mask, so utilize the pressing force of this scraper plate, welding paste is pressed out from the hole and is printed on (with reference to the paragraph [0011] of patent documentation 2) on the substrate.
Usually, this metal mask is used continuously with respect to mass substrate under the state of the identical scolder of mounting, so scolder rotates repeatedly and moves by scraper plate when carrying out printing operation repeatedly.Consequently, scolder is deterioration slowly, and the scolder of this deterioration becomes to substrate and brings dysgenic main cause.
Therefore, in order to seek to prevent to produce in the substrate bad or to keep press quality in the printing process, following operation is very important, promptly analyzes the impairment grade of the scolder on the metal mask, changes the scolder on the metal mask when the scolder impairment grade uprises.
Known this scolder is along with deterioration, and its viscosity uprises and carries out oxidation and the reducing power reduction.For example, known if solder printing that viscosity is high is to substrate, it is bad then to be easy to generate " breach (カ ケ) ", " scratch (カ ス レ) " etc. on the substrate behind the printing process, in addition, if will carry out the solder printing of oxidation to substrate, it is bad then to be easy to generate " soldered ball ", " scolding tin is not molten " etc. on the substrate after the reflow soldering operation, and, if the solder printing that reducing power is reduced to substrate, then is easy to generate " wetting state deterioration " etc. on the substrate after the reflow soldering operation bad.
Like this, because viscosity, oxidizability and the reducing power of scolder are relevant with the bad incidence of substrate, so this viscosity, oxidizability and reducing power become the important indicator of the impairment grade of estimating scolder.
Method as the impairment grade of analyzing scolders such as this welding paste, for example, as record ground in the patent documentation 1, the scolder of use sampling carries out the method for the acid number of titration and instrumentation scolder (solder flux), promptly carries out the analytical approach of the so-called off-line instrumentation of this instrumentation outside the manufacturing line of substrate.But, in the method, need carry out the adjustment of reagent etc., produce in order to carry out instrumentation and need spend unnecessary time or the problem of time.
On the other hand, in order to cut down unnecessary time or the time that is used for this instrumentation, the method that also has the impairment grade of the analysis scolder of record in the patent documentation 2,3 for example, that is, the instrumentation of making the impairment grade that is used to check this scolder on the line, can online instrumentation method.
In patent documentation 2, disclose following method, that is,,, by from the laser sensor irradiating laser and measure the flowing velocity of scolder, thereby measure the method for viscosity of this scolder relatively at the scolder of scraper plate surface flow in the printing process of substrate.But, in the method for these patent documentation 2 records, produce following problem, promptly because difference, the instrumentation deviation of the driving condition of scraper plate are bigger.
On the other hand, in patent documentation 3, disclose following method, promptly, with the approaching environment of actual production operation in, use ultraviolet photoelectricity optical spectroscopy to come the method for the surface oxidation rate of instrumentation scolder, as above-mentioned patent documentation 2 records, drive irrelevant with scraper plate and can carry out on-line evaluation, but then, because this method is used harmful ultraviolet ray, so unsatisfactory aspect job safety.
Patent documentation 1: the special fair 08-20434 communique of Japanese patent gazette (open day: on March 04th, 1996)
Patent documentation 2: Japanese patent gazette spy opened flat 05-99831 communique (open day: on April 23rd, 1993)
Patent documentation 3: Japanese patent gazette spy opened flat 10-82737 communique (open day: on March 31st, 1998)
Summary of the invention
The present invention puts in view of the above problems and makes, and its purpose is to improve a kind of solder material inspecting device, can suppress to check time or time in the required operation, can be satisfactory aspect job safety and the instrumentation precision is higher.
To achieve these goals, solder material inspecting device of the present invention is characterised in that to have: the printing position obtains mechanism, and it obtains the printing position information of the scolder that prints on substrate; Light source, it obtains the above-mentioned printing position information that mechanism obtains based on above-mentioned printing position, at enterprising line scanning of aforesaid substrate and the scolder irradiates light to printing on aforesaid substrate only; Intensity detection portion, it detects the ultrared inspection object intensity by the specific wave number of coming from above-mentioned light source irradiation light and from above-mentioned scolder reflection, will try to achieve based on above-mentioned inspection object intensity, the infrared absorbance and the above-mentioned inspection object intensity of the above-mentioned specific wave number in the above-mentioned inspection object scolder exports as the instrumentation value.
In addition, solder material inspecting device of the present invention is characterised in that to have: the printing position obtains mechanism, and it obtains the printing position information of the scolder that prints on substrate; Light source, it obtains the above-mentioned printing position information that mechanism obtains based on above-mentioned printing position, at enterprising line scanning of aforesaid substrate and the scolder irradiates light to printing on aforesaid substrate only; Intensity detection portion, it detects by reflect the ultrared inspection object intensity of the specific wave number of coming from above-mentioned scolder from above-mentioned light source irradiation light; Scolding tin deterioration calculating part, with the scolder that prints on aforesaid substrate serves as to check object, ultrared above-mentioned comparison other intensity and above-mentioned inspection object intensity based on the specific wave number that is detected as reflected light, calculate the deterioration parameter of the above-mentioned inspection object scolder of expression with respect to the relative impairment grade of above-mentioned comparison other scolder, above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object.
The viscosity that scolder causes because of the chemical reaction in printing or when keeping repeatedly deterioration that rises, bring dysgenic main cause because the scolder of this deterioration becomes to substrate, prevent that for seeking it is very important producing press quality bad or that keep in the printing process in the substrate so check the impairment grade of scolder accurately.
Therefore, the present inventor considers as the moment of the impairment grade of checking this scolder, preferably as far as possible near the moment of reflow soldering, in addition, preferably uses the actual scolder that prints as the inspection object on substrate.At this, in order to check the impairment grade of the scolder of actual print on substrate, consider to use by so-called contactless instrumentation method that the scolder irradiates light is checked to well, but then, as described in above-mentioned patent documentation 3, in using ultraviolet method, unsatisfactory aspect job safety.Therefore, the present inventor is conceived to if use the infrared spectrophotometry rule can analyze viscosity, oxidizability, the reducing power of scolder, thereby carries out the impairment grade analysis of scolder.
But because the surface of the parts of substrate or lift-launch is made of resin or resist etc., so to the substrate that is printed with scolder only in the process of irradiates light, these infrared spectrums are as interference and accumulative total, its result produces the problem of instrumentation precision reduction.
Therefore, the present invention who is being used for addressing this problem, obtain by setting and to obtain mechanism in the printing position of the printing position of the scolder that prints on substrate information and based on obtaining above-mentioned printing position information that mechanism obtains by above-mentioned printing position only to the light source of the scolder irradiates light that on aforesaid substrate, prints, only constitute structure to the scolder irradiates light that on substrate, prints, this interference need not be won, the raising of instrumentation precision can be sought.
At this, employed metal mask or employed diagram data, cad data etc. done when making substrate when the printing position obtains mechanism and refers to printing solder.For example, when using the cad data of metal mask obtaining mechanism as the printing position, owing to the configuration in the hole (peristome) of metal mask or size of peristome etc. are transfused to as data, so, then can specify the printing position of the scolder on the substrate if utilize the cad data of this metal mask.In addition, owing on substrate and metal mask, be typically provided with the positioning mark that is used for contraposition, be the coordinate of initial point and the size of peristome etc. for well so printing position information is made as with this positioning mark.
In addition, light source is the bulb of irradiates light, for example uses ceramic light source, and in the present invention, this light source constitutes scanning and irradiates light on substrate.At this, scanning refers to light source, and irradiates light is mobile on substrate on one side on one side, in the present invention, constitutes light source only to moving at the scolder irradiates light that prints on the substrate and on substrate.As only to the structure of this scolder irradiates light, for example can constitute control light source and luminous off and in advance, or it is luminous continuously to constitute light source itself in advance, if the chopping mechanism that the blocks light break that will send from this light source is set, its result, only scolder irradiates light on substrate, printing.In addition,, constitute by opening and closing baffle plate as this chopping mechanism, applicable under open mode irradiates light, descend the structure of shading light in off position.
In addition, in the present invention, also can be provided with in the scolder that can specify in the substrate printing, be the input part of instrumentation subject area based on the sweep limit of light source.This instrumentation subject area can be set arbitrarily by the examiner.
In addition, in the present invention, analyze viscosity, oxidizability, the reducing power of scolder by using the infrared spectrophotometry method, thereby carry out the impairment grade analysis of scolder.The viscosity of the second best in quality scolder is low, oxidizability is low, reducing power is high, if the scolder deterioration, then viscosity, oxidizability uprise and the reducing power reduction, analyze at least one project wherein so the present inventor expects, then can judge the impairment grade of scolder.
Why utilize this infrared spectrophotometry method can analyze viscosity, oxidizability, the reducing power of scolder, it the reasons are as follows described.
Continue to use scolder or scolder is continued to be exposed in the atmosphere, the then burning that is contained, the acid that contains (for example carboxylic acid) changes salt into.That is, in scolder, the metal oxide that contains increases, and the amount of acid reduces, and the amount of salt increases.Metal oxide is also referred to as the oxidized metal in addition.
Scolder causes oxidizability to uprise because of the increase of this metal oxide, because of the increase of salt causes viscosity to uprise, because of the minimizing of sour amount causes reducing power to reduce.
Therefore, in checking the object scolder,, then can check viscosity, oxidizability, the reducing power of this scolder,, then can check the impairment grade of scolder as if being index with them if can analyze the amount of amount, acid and the salt of metal oxide.That is, the amount of the metal oxide in the scolder, the amount of acid, the amount of salt are represented the impairment grade of scolder (viscosity, oxidizability, reducing power).
Therefore, if the present inventor is conceived to according to the infrared spectrophotometry method, then can analyze at least one project in the amount of metal oxide, acid, salt, thereby realize the present invention.
The ultrared uptake of the specific wave number in the scolder changes corresponding to the amount of the metal oxide in the scolder, acid, salt, its result, the Strength Changes of the ultrared specific wave number that is reflected by this scolder.This is because metal oxide, acid, salt that scolder contained have the ultrared character that can be absorbed in the specific separately ripple frequency band.
Therefore, for example, if will with different scolder (for example new scolder of state (impairment grade) of checking the object scolder, use scolder of 100 times etc.) object as a comparison, based on the infra-red intensity (checking object intensity, comparison other intensity) of the specific wave number of detected, reflection respectively, then with respect to the comparison other scolder, the amount of the metal oxide in the analytical review object scolder, acid, salt relatively, and can relatively check viscosity, oxidizability, the reducing power of object scolder.And, can be with respect to the comparison other scolder and relatively check the impairment grade (viscosity, oxidizability, reducing power) of object scolder.This amount is represented the impairment grade (viscosity, oxidizability, reducing power) of scolder.In addition, above-mentioned comparison other intensity for example can be used and the identical method inspection of above-mentioned inspection object intensity, and this comparison other intensity both can similarly be checked when checking above-mentioned inspection object intensity, and in addition, also can check in advance and store in the storing mechanism.
This relative amount is exported with respect to the deterioration parameter of the relative impairment grade of above-mentioned comparison other scolder as the above-mentioned inspection object scolder of expression.Thus, the user of this device can come the above-mentioned relative amount of analytical review object scolder with respect to the comparison other scolder according to the deterioration parameter of output, and can check the relative impairment grade of object scolder with respect to the comparison other scolder.
In addition, both can be the infrared ray of above-mentioned specific wave number, also can be the ultrared light that comprises above-mentioned specific wave number to the light of scolder irradiation.
According to the present invention shown in above, owing to do not need disclosed titration operation in the patent documentation 1, can suppress time required in the operation so compare the method for patent documentation 1, the method of patent documentation 2 can be carried out high-precision instrumentation relatively, in addition, owing to do not use ultraviolet ray, so the method for relative patent documentation 3 is satisfactory aspect job safety.
In addition, in the present invention, because at least one project that only needs to analyze in the amount of a metal oxide, acid, salt gets final product, so above-mentioned specific wave number also can be the wave number that comprises in the ultrared ripple frequency band that at least one absorbed in metal oxide that scolder contained, salt, the acid.
For example, as this metal oxide, can exemplify tin oxide, massicot etc.In addition, can exemplify carboxylic acid, pretend and be above-mentioned sour optimization acid as acid in the acid that scolder contained, that amount is many.And the salt many as the amount in the salt that scolder contained of deterioration can exemplify carboxylate, pretend to be above-mentioned salt optimization acid salt.
In addition, above-mentioned specific wave number can be for being included in the wave number at least one scope in 520cm-1～700cm-1,1270cm-1～1430cm-1,1500cm-1～1650cm-1, the 1665cm-1～1730cm-1 scope.
This be because, above-mentioned tin oxide, massicot have the ultrared character in absorption 520cm-1～700cm-1 scope, carboxylic acid has the ultrared character in absorption 1665cm-1～1730cm-1 scope.In addition, because carboxylate has the ultrared character in absorption 1270cm-1～1430cm-1,1500cm-1～1650cm-1 scope.
The deterioration parameter can be exported according to the step of finding the solution the difference of checking object intensity and comparison other intensity or the step of finding the solution both ratio.
Above-mentioned difference or ratio are the parameters that the difference degree of infrared ray absorbing amount between object scolder and the comparison other scolder, above-mentioned specific wave number is checked in expression.Promptly, this is because according to this difference or ratio, can analyze the comparison other scolder and check the difference of the amount of metal oxide between the object scolder, carboxylic acid, carboxylate, and can relatively check viscosity, oxidizability, the reducing power of object scolder with respect to the comparison other scolder, can relatively check the impairment grade (viscosity, oxidizability, reducing power) of object scolder.
In addition, at the infra-red intensity that light contained that shines comparison other with shine between the infra-red intensity that light contained of checking object and produce some differences sometimes, at this moment, this difference is included in the difference between checked inspection object intensity and the comparison other intensity.
Therefore, above-mentioned solder material inspecting device is preferably, set the wave number different promptly with reference to wave number with above-mentioned specific wave number, in above-mentioned intensity detection portion, further detect by above-mentioned ultrared the 3rd intensity of checking the reflection of object scolder with reference to wave number, above-mentioned scolding tin deterioration calculating part so proofread and correct corresponding to the difference degree of top four's degree and above-mentioned the 3rd intensity in above-mentioned inspection object intensity or the above-mentioned comparison other intensity at least any, this top four's degree is as the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder and the above-mentioned ultrared top four degree with reference to wave number that is detected.
In addition, above-mentioned deterioration parameter also can be obtained according to the difference between second infrared absorbance of first infrared absorbance of the above-mentioned specific wave number in the inspection object scolder that try to achieve based on above-mentioned inspection object intensity, above-mentioned and above-mentioned specific wave number that try to achieve based on above-mentioned comparison other intensity, in the above-mentioned comparison other scolder or any in the ratio.
Difference between above-mentioned first infrared absorbance and above-mentioned second infrared absorbance or ratio are the parameters of the difference degree of the expression infrared ray absorbing amount of checking the above-mentioned specific wave number between object scolder and the comparison other scolder.Therefore, according to this difference or ratio, can analyze the comparison other scolder and check the difference of the amount of metal oxide between the object scolder, carboxylic acid, carboxylate, and can relatively check viscosity, oxidizability, the reducing power of object scolder with respect to the comparison other scolder, can relatively check the impairment grade (viscosity, oxidizability, reducing power) of object scolder.
In addition, at the infra-red intensity that light contained that shines comparison other with shine between the infra-red intensity that light contained of checking object and produce some differences sometimes, at this moment, this difference is included in the inspection object intensity and the difference between the comparison other intensity that is detected, and is included in the difference of first infrared absorbance and second infrared absorbance.
Therefore, be preferably, set the wave number different promptly with reference to wave number with above-mentioned specific wave number, in above-mentioned intensity detection portion, further detect by above-mentioned ultrared the 3rd intensity of checking the reflection of object scolder with reference to wave number, above-mentioned scolding tin deterioration calculating part and then obtain above-mentioned the 3rd infrared absorbance in the above-mentioned inspection object scolder with reference to wave number based on above-mentioned the 3rd intensity, based on as the reflected light when the scolder irradiates light of the comparison other for above-mentioned inspection object scolder and detected above-mentioned ultrared top four degree with reference to wave number, obtain the above-mentioned quatre outside line absorbance in the above-mentioned inspection object scolder with reference to wave number, and proofread and correct corresponding to the difference degree between above-mentioned the 3rd infrared absorbance and the above-mentioned quatre outside line absorbance in above-mentioned first infrared absorbance or second infrared absorbance at least any.
In addition, solder material inspecting device of the present invention is characterised in that to have: light source, before reflow soldering, scan and irradiates light the substrate that is printed with scolder at least; Intensity detection portion, its infra-red intensity that detects the specific wave number of coming by the substrate reflection that is printed with above-mentioned scolder from above-mentioned light source irradiation light certainly is an instrumentation intensity; The intensity extraction mechanism, it is from the detected above-mentioned instrumentation intensity of above-mentioned intensity detection portion, extract only from the detected ultrared inspection object intensity of above-mentioned scolder, will try to achieve based on above-mentioned inspection object intensity, the infrared absorbance and the above-mentioned inspection object intensity of the above-mentioned specific wave number in the above-mentioned inspection object scolder exports as the instrumentation value as catoptrical above-mentioned specific wave number.
In addition, solder material inspecting device of the present invention is characterised in that to have: light source, before reflow soldering, scan and irradiates light the substrate that is printed with scolder at least; Intensity detection portion, its infra-red intensity that detects by the specific wave number of coming from above-mentioned light source irradiation light and from the substrate reflection that is printed with above-mentioned scolder is an instrumentation intensity; The intensity extraction mechanism, it is from the detected above-mentioned instrumentation intensity of above-mentioned intensity detection portion, extract only detected from above-mentioned scolder, as the ultrared inspection object intensity of catoptrical above-mentioned specific wave number; Scolding tin deterioration calculating part, with the scolder that prints on aforesaid substrate serves as to check object, ultrared comparison other intensity and above-mentioned inspection object intensity based on the above-mentioned specific wave number that is detected as reflected light, calculate the deterioration parameter of the above-mentioned inspection object scolder of expression with respect to the relative impairment grade of above-mentioned comparison other scolder, above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for checking object.
The present invention with by only to above-mentioned scolder irradiates light check scolder impairment grade solder material inspecting device similarly, serve as to check object with the scolder that on substrate, prints, use the infrared spectrophotometry method to check the impairment grade of scolder.But, constitute and be not only scolder irradiates light on substrate, printing, but at least the substrate that is printed with scolder is scanned and irradiates light continuously, and be the ultrared inspection object intensity that instrumentation intensity is only extracted the catoptrical specific wave number of conduct that is detected from scolder from infra-red intensity as its catoptrical specific wave number.
For example, imagine following situation, that is, a certain scope on the substrate is scanned and irradiates light, check infra-red intensity as its catoptrical specific wave number.If electronic unit carries on substrate via scolder in this scope, scan and irradiates light, then not only comprise reflected light from scolder, and comprise reflected light from electronic unit, from the reflected light of substrate, intensity detection portion detects and comprises above-mentioned all infra-red intensities of catoptrical specific wave numbers.Directly use this intensity that is detected to check that the impairment grade of scolder is quite difficult, but owing to only in the intensity that this is detected, include, so if can extract this inspection object intensity then can easily carry out the impairment grade inspection of scolder from the detected ultrared inspection object intensity of scolder as catoptrical specific wave number.Therefore, in the present invention, be provided with the intensity extraction mechanism, this intensity extraction mechanism is only extracted the ultrared inspection object intensity of the catoptrical specific wave number of conduct that is detected from scolder from the instrumentation intensity that is detected.In addition, by this intensity extraction mechanism is set, also can will be equipped with the scolder that prints on the substrate of electronic unit as checking object, so before being about to carry out reflow soldering, can check that also its result can further improve the instrumentation precision.
As extracting the method that this checks object intensity, for example, to the substrate irradiates light, check in advance from the infra-red intensity of the next specific wave number of this substrate reflection, have the storage part that this intensity is stored in advance as substrate intensity, the intensity extraction mechanism is as long as extract above-mentioned inspection object intensity by the difference of obtaining and be stored in the aforesaid substrate intensity of above-mentioned storage part from above-mentioned instrumentation intensity.This substrate both can be and had been printed with the substrate of checking the object scolder, also can be other substrate, got final product if only can detect the infra-red intensity of the specific wave number of coming from the substrate reflection.
In addition, to the scolder irradiates light, check in advance from the infra-red intensity of the next above-mentioned specific wave number of this scolder reflection, have the storage part that this intensity is stored in advance as scolding tin intensity, the increase and decrease pattern of the above-mentioned scolding tin intensity that the intensity extraction mechanism can be by relatively being stored in above-mentioned storage part and the signal of above-mentioned instrumentation intensity extracts above-mentioned inspection object intensity.What kind of increase and decrease pattern the signal that this scolder is used for to the scolder irradiates light time observing the infra-red intensity of the specific wave number that reflection comes become, though also can be new scolder, if but be above-mentioned comparison other scolder, owing to can utilize above-mentioned comparison other intensity so be preferred.According to this method, even if on substrate, there is electronic unit etc., also can extract above-mentioned inspection object intensity, and can carry out checking before the reflow soldering being about to, so can further improve the instrumentation precision.In addition, be not subjected to the influence that brings because of the deterioration of substrate itself yet, can extract above-mentioned inspection object intensity.
In addition, as extracting the method for checking object intensity, also can check that by reflecting the infra-red intensity that comes from light source irradiation light from the substrate that is printed with scolder be total instrumentation intensity by intensity detection portion, relatively by the wave number outside the specific wave number in the detected above-mentioned total instrumentation intensity of this intensity detection portion promptly with reference to the infra-red intensity and the defined threshold of wave number, if this threshold value is with the next scolding tin intensity that is made as, and extract the ultrared inspection object intensity of specific wave number from this scolding tin intensity by the intensity extraction mechanism.Because to compare the scolder reflecting brightness extremely low with the substrate reflecting brightness, so also can extract above-mentioned inspection object intensity according to this method.The following setting of this threshold value gets final product, the instrumentation scolder for example with reference to the intensity of reflected light of wave number and the intensity of reflected light with reference to wave number of substrate, obtain in advance as the value of the intensity of reflected light of the intensity of reflected light that can distinguish this scolder and this substrate, and it is pre-set in storing mechanism etc.
In addition, as extracting the method for checking object intensity, also can replace above-mentioned with reference to wave number intensity of reflected light and be made as the summation of the intensity of reflected light of specific wave number, similarly wait by experiment and obtain threshold value, similarly extract the intensity of reflected light of scolder according to this threshold value.In addition, also can replace above-mentioned with reference to wave number intensity of reflected light and utilize the mean value of above-mentioned total instrumentation intensity, obtain threshold value with above-mentioned similarly the grade by experiment, similarly extract the intensity of reflected light of scolder according to this threshold value.
In addition, also can have input part, the sweep limit based on above-mentioned light source that this input part can specify in the scolder of aforesaid substrate printing is the instrumentation subject area.
Above-mentioned scolding tin deterioration calculating part also can realize by computing machine, at this moment, the control program by this scolding tin deterioration calculating part of computer realization and store this control program embodied on computer readable storage medium within the scope of the present invention.
In addition, solder inspection method of the present invention is characterised in that, obtain the printing position information of the scolder that on substrate, prints, based on the above-mentioned above-mentioned printing position information of obtaining at enterprising line scanning of aforesaid substrate and scolder irradiates light only on aforesaid substrate, printing, the ultrared inspection object intensity of the specific wave number that detection comes from the reflection of above-mentioned scolder by shining above-mentioned light will be tried to achieve based on above-mentioned inspection object intensity, the infrared absorbance and the above-mentioned inspection object intensity of the above-mentioned specific wave number in the above-mentioned inspection object scolder exports as the instrumentation value.
In addition, solder inspection method of the present invention is characterised in that, obtain the printing position information of the scolder that on substrate, prints, based on the above-mentioned above-mentioned printing position information of obtaining at enterprising line scanning of aforesaid substrate and scolder irradiates light only on aforesaid substrate, printing, the ultrared inspection object intensity of the specific wave number that detection comes from above-mentioned scolder reflection by shining above-mentioned light, with the scolder that prints on aforesaid substrate serves as to check object, ultrared comparison other intensity and above-mentioned inspection object intensity based on the above-mentioned specific wave number that is detected as reflected light, calculate the deterioration parameter of the above-mentioned inspection object scolder of expression with respect to the relative impairment grade of above-mentioned comparison other scolder, above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for this inspection object.
Solder inspection method utilization of the present invention is by only checking that to above-mentioned scolder irradiates light the solder material inspecting device of the impairment grade of scolder can realize that details is same as described above.
In addition, solder inspection method of the present invention is characterised in that, before reflow soldering, at least the substrate that is printed with scolder is scanned and irradiates light, the infra-red intensity of the specific wave number that detection comes from the substrate reflection that is printed with above-mentioned scolder by shining above-mentioned light is an instrumentation intensity, only extract the ultrared inspection object intensity of the catoptrical above-mentioned specific wave number of conduct that is detected from above-mentioned scolder from above-mentioned detected above-mentioned instrumentation intensity, will try to achieve based on above-mentioned inspection object intensity, the infrared absorbance of the above-mentioned specific wave number in the above-mentioned inspection object scolder and above-mentioned inspection object intensity are exported as the instrumentation value.
In addition, solder inspection method of the present invention is characterised in that, before reflow soldering, at least the substrate that is printed with scolder is scanned and irradiates light, the infra-red intensity of the specific wave number that detection comes from the substrate reflection that is printed with above-mentioned scolder by shining above-mentioned light is an instrumentation intensity, only extract the ultrared inspection object intensity of the catoptrical above-mentioned specific wave number of conduct that is detected from above-mentioned scolder from above-mentioned detected above-mentioned instrumentation intensity, with the scolder that prints on aforesaid substrate serves as to check object, ultrared comparison other intensity and above-mentioned inspection object intensity based on the above-mentioned specific wave number that is detected as reflected light, calculate the deterioration parameter of the above-mentioned inspection object scolder of expression with respect to the relative impairment grade of above-mentioned comparison other scolder, above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for this inspection object.
Solder inspection method of the present invention can be realized by the solder material inspecting device of following formation, this solder material inspecting device scans aforesaid substrate and irradiates light continuously, extract only from the detected ultrared inspection object intensity as catoptrical specific wave number of scolder, details is same as described above.
As mentioned above, in the present invention, at enterprising line scanning of substrate and scolder irradiates light only, detect the ultrared inspection object intensity of the specific wave number of its reflection on substrate, printing based on printing position information.Thus, because can online instrumentation, thus can suppress to check time or time in the required operation, and can make the instrumentation moment further near the reflow soldering operation, also can seek to improve the instrumentation precision.In addition, owing to will be that object intensity be tried to achieve based on checking, check that the infrared absorbance and the above-mentioned inspection object intensity of the specific wave number in the object scolder exports as the instrumentation value, that is, use the infrared spectrophotometry method rather than use ultraviolet ray when instrumentation, it is satisfactory to pretend the industry secure context.
In addition, in the present invention, at least the substrate that is printed with scolder is scanned and irradiates light, the infra-red intensity of the specific wave number that detection comes from the substrate reflection that is printed with above-mentioned scolder by shining this light is an instrumentation intensity, only extracts the ultrared inspection object intensity of the catoptrical above-mentioned specific wave number of conduct that is detected from above-mentioned scolder from the above-mentioned above-mentioned instrumentation intensity that is detected.Thus, owing to also can will be equipped with the scolder that prints on the substrate of electronic unit as checking object, so also can be about to carry out checking before the reflow soldering that its result can further improve the instrumentation precision.
To achieve these goals, solder material inspecting device inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing that has more than one pattern hole at least on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that, have: test section, it detects above-mentioned scraper plate and whether finishes above-mentioned printing; Light-projecting portion is after above-mentioned test section receives the signal that above-mentioned printing finishes, to being filled in the inspection object scolder irradiates light of the inspection hole in the above-mentioned pattern hole; Intensity detection portion, it detects by the above-mentioned light of irradiation the ultrared inspection object intensity from the specific wave number of above-mentioned inspection object scolder reflection, will try to achieve based on above-mentioned inspection object intensity, the infrared absorbance and the above-mentioned inspection object intensity of the above-mentioned specific wave number in the above-mentioned inspection object scolder exports as the instrumentation value.
In addition, above-mentioned solder material inspecting device also can be set the wave number different with above-mentioned specific wave number promptly with reference to wave number, in above-mentioned intensity detection portion, detect and check what the object scolder reflected, above-mentioned ultrared inspection object with reference to wave number is with reference to intensity, and, above-mentioned solder material inspecting device corresponding to as reflected light and detected above-mentioned ultrared comparison other with reference to wave number with reference to intensity and above-mentioned inspection object difference degree with reference to intensity, proofread and correct in above-mentioned inspection object intensity or the above-mentioned comparison other intensity at least any, above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder.
Solder material inspecting device inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing that has more than one pattern hole at least on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, this solder material inspecting device is characterised in that, have: test section, it detects above-mentioned scraper plate and whether finishes above-mentioned printing; Light-projecting portion is after above-mentioned test section receives the signal that above-mentioned printing finishes, to being filled in the inspection object scolder irradiates light of the inspection hole in the above-mentioned pattern hole; Intensity detection portion, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection; Handling part, its output deterioration parameter, this deterioration parameter is based on as reflected light and the ultrared comparison other intensity and the above-mentioned inspection object intensity of detected specific wave number, expression is stated and is checked the relative impairment grade of object scolder with respect to above-mentioned comparison other scolder, and above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder.
Pattern hole is the hole that is formed at mask used for printing printing stencils such as () metal masks, under the state that mask used for printing and substrate is overlapping, forms corresponding to the position of the printing solder on the substrate, and this pattern hole forms a plurality of usually on mask used for printing.If scraper plate slides on the mask used for printing surface, then scolder is filled down this pattern hole successively from the pattern hole of the mobile starting position of close scraper plate.
In the present invention also can be by light-projecting portion to being filled in the scolder irradiates light of the state in this pattern hole (inspection hole), by the ultrared inspection object intensity of the specific wave number of intensity detection portion detection of reflected, thereby check the impairment grade of scolder.Like this, the scolder that why will be filled in the state in the pattern hole is as checking object, and it the reasons are as follows described.
To checking the object irradiates light,, check that object forms smooth state as far as possible so that its not diffuse reflection, thereby can obtain high-precision check result at the light that receives its reflection and when checking.
Therefore, in the present invention similarly the solder surface by the light-projecting portion irradiates light preferably form smooth state as far as possible to improve the instrumentation precision.
At this, on the production line of substrate, check object be solder surface be the most smooth state when being positioned at printing and finishing to soon from substrate take off before the mask used for printing during.That is, during this period in, scolder is the state that is filled in the pattern hole, utilizes the scraper plate flat surface, and, be limited from the outside by pattern hole, so roughly smooth state can be kept in its surface.
In addition, as the moment of the impairment grade of instrumentation scolder, though preferably the closer to the reflow soldering operation, the instrumentation precision is high more, but for the instrumentation precision is further optimized, preferably after taking off mask used for printing from substrate, from installation procedure to be about to carry out before the reflow soldering operation during in carry out instrumentation.But, on the other hand, if printing finishes and mask used for printing is taken off from substrate, the scolder that then is filled in this pattern hole is released from the restriction of this pattern hole, because this scolder is a paste, so cause hanging down according to its deadweight, its result is that solder surface also might out-of-flatness.
Therefore, in order to check that the object solder surface is kept under the roughly smooth state and can to carry out instrumentation making, in the present invention, be made as and check that the object scolder is filled into the state in the pattern hole, thereby make the instrumentation precision improve (following this measuring method is called " contactless instrumentation method ").
For this reason, in the present invention, be provided with and detect the test section whether printing finishes.For example can use photoelectric sensor, ultrasonic sensor, infrared ray sensor etc. as this test section.By scraper plate is slided on mask used for printing, printing solder on substrate, but if in the position that the slip of this scraper plate stops test section being set, the slip that then can detect scraper plate stops promptly to print end.
In addition, inspection hole is to be filled with the hole that the examiner can set arbitrarily in advance in the pattern hole of checking the object scolder, to the inspection hole of this setting, can check that by the light-projecting portion irradiates light and by intensity detection portion this inspection hole is provided with as mentioned above and gets final product as catoptrical ultrared intensity.Inspection hole also can be set a plurality of.At this moment, both light-projecting portion and intensity detection portion can be set respectively, a light-projecting portion and intensity detection portion are moved each inspection hole.Set a plurality of inspection holes if so, then can corresponding to the scolder on the substrate respectively print the impairment grade that scolder is analyzed at the position, also can obtain respectively to check the distribution of the impairment grade of position.
Like this,, then can check the impairment grade of the scolder of actual print, but also can use following structure that promptly form recess in the scope that scraper plate slides in addition, instrumentation is filled in the scolder of this recess if from pattern hole, set inspection hole.
In the present invention, analyze viscosity, oxidizability, the reducing power of scolder by using the infrared spectrophotometry method, thereby carry out the impairment grade analysis of scolder.
In the present invention, to checking object scolder irradiates light, and check the ultrared inspection object intensity of checking the specific wave number of object scolder reflection from this by light-projecting portion by intensity detection portion.
At this, light-projecting portion is the bulb of irradiates light, for example can use ceramic light source etc.In addition, this light-projecting portion both can constitute signal that direct reception finishes from the printing of test section or receive this signal indirectly via control device etc., received this signal then to the inspection hole irradiates light in case also can constitute.If irradiates light when receiving this signal only, and the situation of inspection hole irradiates light is compared always, can seek to cut down power consumption or suppress heating.
In addition, intensity detection portion for example is made of the infrared ray sensor based on thermal effect formula element such as thermoelectric element or thermoelectric pile or MCT quantum type elements such as (light conductiving element, HgCdTe), detects the infra-red intensity (checking object intensity) from the specific wave number of checking the reflection of object scolder.
The deterioration parameter also can be exported by the step of obtaining the difference of checking object intensity and comparison other intensity or the step of obtaining both ratios.
Above-mentioned difference or ratio are the parameters that the difference degree of infrared ray absorbing amount between object scolder and the comparison other scolder, above-mentioned specific wave number is checked in expression.Promptly, this is because can analyze the difference of the amount of metal oxide between comparison other scolder and the inspection object scolder, carboxylic acid, carboxylate according to this difference or ratio, viscosity, oxidizability, the reducing power of object scolder can be relatively checked, and the impairment grade (viscosity, oxidizability, reducing power) of object scolder can be relatively checked with respect to the comparison other scolder.
In addition, at the infra-red intensity that light contained that shines comparison other with shine between the infra-red intensity that light contained of checking object and produce some differences sometimes, at this moment, this difference is included in the difference of the inspection object intensity that is detected and comparison other intensity.
Therefore, above-mentioned solder material inspecting device is preferably, set the wave number different promptly with reference to wave number with above-mentioned specific wave number, further detect by the above-mentioned ultrared inspection object with reference to wave number of checking the reflection of object scolder with reference to intensity in above-mentioned intensity detection portion, above-mentioned handling part so corresponding to the above-mentioned ultrared comparison other with reference to wave number that is detected as reflected light with reference to intensity and above-mentioned inspection object with reference to the difference degree of intensity and proofread and correct in above-mentioned inspection object intensity or the above-mentioned comparison other intensity at least any, above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder.
In addition, the difference between second infrared absorbance of first infrared absorbance that above-mentioned deterioration parameter also can be by the above-mentioned specific wave number in the inspection object scolder that try to achieve based on above-mentioned inspection object intensity, above-mentioned and above-mentioned specific wave number that try to achieve based on above-mentioned comparison other intensity, in the above-mentioned comparison other scolder or any in the ratio are obtained.
The difference of above-mentioned first infrared absorbance and above-mentioned second infrared absorbance or ratio are the parameters that the difference degree of infrared ray absorbing amount between object scolder and the comparison other scolder, above-mentioned specific wave number is checked in expression.Therefore, according to this difference or ratio, can analyze the comparison other scolder and check the difference of the amount of metal oxide between the object scolder, carboxylic acid, carboxylate, and can relatively check viscosity, oxidizability, the reducing power of object scolder with respect to the comparison other scolder, can relatively check the impairment grade (viscosity, oxidizability, reducing power) of object scolder.
In addition, at the infra-red intensity that light contained that shines comparison other with shine between the infra-red intensity that light contained of checking object and produce some differences sometimes, at this moment, this difference is included in the inspection object intensity that is detected and the difference between the comparison other intensity and is included in the difference of first infrared absorbance and second infrared absorbance.
Therefore, be preferably, set the wave number different promptly with reference to wave number with above-mentioned specific wave number, in above-mentioned intensity detection portion and then detect by the above-mentioned ultrared inspection object with reference to wave number of checking the reflection of object scolder with reference to intensity, above-mentioned handling part and then obtain above-mentioned the 3rd infrared absorbance in the above-mentioned inspection object scolder with reference to intensity with reference to wave number based on above-mentioned inspection object, based on as the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder and the above-mentioned ultrared comparison other with reference to wave number that is detected with reference to intensity, obtain the above-mentioned quatre outside line absorbance in the above-mentioned inspection object scolder with reference to wave number, and corresponding to the difference degree between above-mentioned the 3rd infrared absorbance and the above-mentioned quatre outside line absorbance proofread and correct in above-mentioned first infrared absorbance or second infrared absorbance at least any.
Above-mentioned handling part also can realize by computing machine, and at this moment, control program by this handling part of computer realization and the computer read/write memory medium of storing this control program are within the scope of the present invention.
In addition, solder material inspecting device inspection of the present invention is by overlapping on the substrate and have the mask used for printing of pattern hole and the scraper plate that slides is filled in the above-mentioned pattern hole and is printed on the impairment grade of the scolder on the substrate on this mask used for printing surface, it is characterized in that, above-mentioned mask used for printing is on aforesaid substrate when overlapping, compare aforesaid substrate, print direction with respect to above-mentioned scraper plate forms more longways, and be not provided with the portion that sees through that makes light transmission with the overlapping part of aforesaid substrate, in the moment that above-mentioned printing finishes, by above-mentioned scraper plate mounting the object of inspection scolder is arranged in the above-mentioned portion that sees through, above-mentioned solder material inspecting device has: test section, and it detects above-mentioned scraper plate and whether finishes above-mentioned printing; Light-projecting portion, after above-mentioned test section receives the signal that above-mentioned printing finishes, to mounting in the above-mentioned rear side irradiates light that sees through the above-mentioned inspection object scolder of portion from above-mentioned mask used for printing; Intensity detection portion, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection, will try to achieve based on above-mentioned inspection object intensity, in the infrared absorbance of the above-mentioned specific wave number in the above-mentioned inspection object scolder or the above-mentioned inspection object intensity any is exported as the instrumentation value at least.
In addition, solder material inspecting device inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing with pattern hole on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that, above-mentioned mask used for printing is on aforesaid substrate when overlapping, compare aforesaid substrate, print direction with respect to above-mentioned scraper plate forms more longways, and be not provided with the portion that sees through that makes light transmission with the overlapping part of aforesaid substrate, in the moment that above-mentioned printing finishes, by above-mentioned scraper plate mounting the object of inspection scolder is arranged in the above-mentioned portion that sees through, above-mentioned solder material inspecting device has: test section, and it detects above-mentioned scraper plate and whether finishes above-mentioned printing; Light-projecting portion, after above-mentioned test section receives the signal that above-mentioned printing finishes, to mounting in the above-mentioned rear side irradiates light that sees through the above-mentioned inspection object scolder of portion from above-mentioned mask used for printing; Intensity detection portion, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection; Handling part, its output deterioration parameter, this deterioration parameter object intensity is based on the comparison represented the relative impairment grade of above-mentioned inspection object scolder with respect to above-mentioned comparison other scolder with above-mentioned inspection object intensity, and above-mentioned comparison other intensity is as the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder and the ultrared comparison other intensity of the specific wave number that is detected.
Solder material inspecting device inspection of the present invention is filled in the above-mentioned pattern hole by first scraper plate that overlaps the mask used for printing with pattern hole on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that, above-mentioned mask used for printing is on aforesaid substrate when overlapping, compare aforesaid substrate, print direction with respect to above-mentioned first scraper plate forms more longways, and be not provided with the portion that sees through that makes light transmission with the overlapping part of aforesaid substrate, in the moment that above-mentioned printing finishes, by the above-mentioned first scraper plate mounting object of inspection scolder is arranged in the above-mentioned portion that sees through, above-mentioned solder material inspecting device has: test section, and it detects above-mentioned first scraper plate and whether finishes above-mentioned printing; Light-projecting portion, after above-mentioned test section receives the signal that above-mentioned printing finishes, to mounting in the above-mentioned rear side irradiates light that sees through the above-mentioned inspection object scolder of portion from above-mentioned mask used for printing; Intensity detection portion, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection; Second scraper plate, after detecting above-mentioned inspection object intensity by above-mentioned intensity detection portion, it is by moving to the opposite direction of the moving direction of above-mentioned first scraper plate, mounting is scraped off in the above-mentioned inspection object scolder that sees through portion, will try to achieve based on above-mentioned inspection object intensity, in the infrared absorbance of the above-mentioned specific wave number in the above-mentioned inspection object scolder or the above-mentioned inspection object intensity any is exported as the instrumentation value at least.
In addition, solder material inspecting device inspection of the present invention is filled in the above-mentioned pattern hole by first scraper plate that overlaps the mask used for printing with pattern hole on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that, above-mentioned mask used for printing is on aforesaid substrate when overlapping, compare aforesaid substrate, print direction with respect to above-mentioned first scraper plate forms more longways, and be not provided with the portion that sees through that makes light transmission with the overlapping part of aforesaid substrate, in the moment that above-mentioned printing finishes, by the above-mentioned first scraper plate mounting object of inspection scolder is arranged in the above-mentioned portion that sees through, above-mentioned solder material inspecting device has: test section, and it detects above-mentioned first scraper plate and whether finishes above-mentioned printing; Light-projecting portion, after above-mentioned test section receives the signal that above-mentioned printing finishes, to mounting in the above-mentioned rear side irradiates light that sees through the above-mentioned inspection object scolder of portion from above-mentioned mask used for printing; Intensity detection portion, it detects the ultrared inspection object intensity of the specific wave number that reflects from above-mentioned inspection object scolder by the above-mentioned light of irradiation; Handling part, its output deterioration parameter, this deterioration parameter is represented relative impairment grade with respect to inspection object scolder above-mentioned comparison other scolder, above-mentioned based on the ultrared comparison other intensity of the specific wave number that is detected as reflected light with above-mentioned inspection object intensity, above-mentioned reflected light is the reflected light when the scolder irradiates light of the comparison other for above-mentioned inspection object scolder; Second scraper plate after detecting above-mentioned inspection object intensity by above-mentioned intensity detection portion, by moving to the direction opposite with the moving direction of above-mentioned first scraper plate, scrapes off mounting in the above-mentioned inspection object scolder that sees through portion.
Not to adopt above-mentioned contactless instrumentation method in the present invention, but adopt so-called contact instrumentation method.
That is, constitute, the portion of seeing through is set on mask used for printing and sees through portion's mounting scolder at this, mounting is seen through the rear side irradiates light of the scolder of portion from mask used for printing in this, detect as catoptrical ultrared inspection object intensity by scraper plate.
The mask used for printing that uses in this contact instrumentation method when overlapping, is compared substrate on substrate, form with respect to the print direction of scraper plate more rectangularly, and the printing end position side in mask used for printing forms not overlapping with substrate part.Be not formed with through portion with the overlapping part of this substrate, finishing and slide when stopping in the printing based on scraper plate, seeing through portion's mounting at this has and is moved the scolder of coming by scraper plate.Should see through portion and constitute, and constitute between the rear side of mask used for printing and face side and can see through light by the material of light-permeable.Thus, if from the rear side of mask used for printing this is seen through portion's irradiates light by light-projecting portion, then this light detects by the ultrared inspection object intensity of checking the specific wave number that the object scolder reflects by intensity detection portion by shining in scolder that this sees through portion to mounting through the inside of portion and from dorsal part.
Like this, in the present invention, constitute under the portion of seeing through and scolder state of contact and check.Therefore, for example if mounting has the face (hereinafter referred to as " mounting surface ") of scolder to form with the plane in the portion of seeing through, then checking in the object scolder is become formation state by its deadweight along mounting surface by light-struck (hereinafter referred to as " shadow surface ").
Therefore, in the present invention, need not the operation of smooth especially shadow surface, can seek the further raising of instrumentation precision.
In addition, in the present invention, preferably constitute with print and see through relatively portion's mounting check object be the scraper plate of scolder as first scraper plate, also have second scraper plate that the scolder that see through portion of mounting after checking scraped off in addition.Though the scolder after can will checking by first scraper plate scrapes off, but if this second scraper plate is set, then second scraper plate scrape off during, first scraper plate can turn back to the printing starting position for next time printing, its result can seek printing process, check the raising of the operating efficiency of operation.This second scraper plate constitutes, for example be disposed at relative with first scraper plate to the position, by it is slided to the direction opposite with the glide direction of first scraper plate, thereby scrape off the scolder of mounting, constitute to the direction opposite to tilt to get final product with above-mentioned glide direction in the portion of seeing through.
Also can adopt following structure, that is, the scolder after second scraper plate will be checked scrapes off, and it is slided to the direction opposite with the print direction of above-mentioned first scraper plate on the mask used for printing surface, also can carry out the printing of scolder to substrate.Like this, can further seek the raising of the operating efficiency of printing process, inspection operation.
In addition, the above-mentioned quality award from the ministry that sees through is set in printing end position near above-mentioned scraper plate or above-mentioned first scraper plate earlier.This be for make scolder by deadweight the portion of being through push.
The face (mounting surface) of the above-mentioned inspection object of the mounting scolder of the portion of seeing through can form with above-mentioned mask used for printing surface co-planar ground.Constitute if form like this, then when utilizing second scraper plate that the scolder of mounting after seeing through the inspection of portion scraped off, can easily carry out.
In addition, the portion of seeing through also can form by the prism that is made of ZnSe, Ge etc., at this moment, if configuration light-projecting portion and intensity detection portion is so that light repeatedly reflection and to above-mentioned mounting surface irradiates light repeatedly in prism, can detect as catoptrical ultrared inspection object intensity, then can seek the further raising of instrumentation precision, so this is desirable.
Therefore also use the infrared spectrophotometry method in the present invention, can think that situation about putting down in writing in the explanation with above-mentioned contactless instrumentation method is identical.
In addition, solder inspection method inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing that has more than one pattern hole at least on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, above-mentioned solder inspection method is characterised in that to have following operation: detect operation, it detects the above-mentioned printing that whether is through with of above-mentioned scraper plate; The light projector operation is after above-mentioned test section receives the signal that above-mentioned printing finishes, to being filled in the inspection object scolder irradiates light of the inspection hole in the above-mentioned pattern hole; The intensity detection operation, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection, will try to achieve based on above-mentioned inspection object intensity, in the infrared absorbance of the above-mentioned specific wave number in the above-mentioned inspection object scolder or the above-mentioned inspection object intensity any is exported as the instrumentation value at least.
Solder inspection method inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing that has more than one pattern hole at least on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, above-mentioned solder inspection method is characterised in that to have following operation: detect operation, it detects the above-mentioned printing that whether is through with of above-mentioned scraper plate; The light projector operation is after above-mentioned test section receives the signal that above-mentioned printing finishes, to being filled in the inspection object scolder irradiates light of the inspection hole in the above-mentioned pattern hole; The intensity detection operation, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection; Treatment process, its output deterioration parameter, this deterioration parameter is represented the relative impairment grade of above-mentioned inspection object scolder with respect to above-mentioned comparison other scolder based on the ultrared comparison other intensity of the specific wave number that is detected as reflected light with above-mentioned inspection object intensity, and above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder.
The present invention is the scolder measuring method that adopts above-mentioned contactless instrumentation method, for example can realize by the scolder measuring device of the present invention that uses above-mentioned contactless instrumentation method.
Solder inspection method inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing with pattern hole on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that, above-mentioned mask used for printing is on aforesaid substrate when overlapping, compare aforesaid substrate, print direction with respect to above-mentioned scraper plate forms more rectangularly, and be not provided with the portion that sees through that makes light transmission with the overlapping part of aforesaid substrate, in the moment that above-mentioned printing finishes, by above-mentioned scraper plate mounting the object of inspection scolder is arranged in the above-mentioned portion that sees through, above-mentioned solder inspection method has following operation: detect operation, it detects the above-mentioned printing that whether is through with of above-mentioned scraper plate; The light projector operation, state detect operation and detect above-mentioned printing and finish after, to mounting in the above-mentioned rear side irradiates light that sees through the above-mentioned inspection object scolder of portion from above-mentioned mask used for printing; The intensity detection operation, it detects by the above-mentioned light of irradiation from the ultrared inspection object intensity of the specific wave number of above-mentioned inspection object scolder reflection, will try to achieve based on above-mentioned inspection object intensity, in the infrared absorbance of the above-mentioned specific wave number in the above-mentioned inspection object scolder or the above-mentioned inspection object intensity any is exported as the instrumentation value at least.
Solder inspection method inspection of the present invention is filled in the above-mentioned pattern hole by the scraper plate that overlaps the mask used for printing with pattern hole on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that, above-mentioned mask used for printing is on aforesaid substrate when overlapping, compare aforesaid substrate, print direction with respect to above-mentioned scraper plate forms more rectangularly, and be not provided with the portion that sees through that makes light transmission with the overlapping part of aforesaid substrate, in the moment that above-mentioned printing finishes, by above-mentioned scraper plate mounting the object of inspection scolder is arranged in the above-mentioned portion that sees through, above-mentioned solder inspection method has following operation: detect operation, it detects the above-mentioned printing that whether is through with of above-mentioned scraper plate; The light projector operation, after above-mentioned test section receives the signal that above-mentioned printing finishes, to mounting in the above-mentioned rear side irradiates light that sees through the above-mentioned inspection object scolder of portion from above-mentioned mask used for printing; The intensity detection operation, it checks by the irradiation of above-mentioned light the ultrared inspection object intensity of the specific wave number that reflects from above-mentioned inspection object scolder; Treatment process, its output deterioration parameter, this deterioration parameter is represented the relative impairment grade of above-mentioned inspection object scolder with respect to above-mentioned comparison other scolder based on the ultrared comparison other intensity of the specific wave number that is detected as reflected light with above-mentioned inspection object intensity, and above-mentioned reflected light is the reflected light when the comparison other scolder irradiates light for above-mentioned inspection object scolder.
The present invention is the scolder measuring method that adopts above-mentioned contact instrumentation method, for example can realize by the scolder measuring device of the present invention that uses above-mentioned contact instrumentation method.
As mentioned above, in the present invention, be checked through scraper plate and finish printing, keep making the overlapping state of mask used for printing and substrate top, to the scolder that is filled in inspection hole or mounting in the scolder irradiates light of the portion of seeing through, and the ultrared inspection object intensity of the specific wave number of detection of reflected.Thus, owing to can carry out online instrumentation, thus can suppress to check time or time in the required operation, and,, also can seek the raising of instrumentation precision so can prevent diffuse reflection because the face of irradiates light is entirely formed.And, owing to will be that object intensity be tried to achieve based on checking, in the infrared absorbance of above-mentioned specific wave number in the above-mentioned inspection object scolder or the above-mentioned inspection object intensity any is exported as the instrumentation value at least, promptly do not use ultraviolet ray when using the infrared spectrophotometry method to carry out instrumentation, it is satisfactory to pretend the industry secure context.
Description of drawings
Fig. 1 is the summary construction diagram that is used to illustrate the structure of solder material inspecting device of the present invention;
Fig. 2 is the functional block diagram of first embodiment of expression solder material inspecting device of the present invention;
Fig. 3 (a), Fig. 3 (b) are the synoptic diagram of first embodiment of expression solder material inspecting device of the present invention;
Precedence diagram when Fig. 4 is the setting of first embodiment of expression solder material inspecting device of the present invention;
Precedence diagram when Fig. 5 is the action of first embodiment of expression solder material inspecting device of the present invention;
Fig. 6 is the spectrogram that the infrared absorbance of the infrared absorbance of object welding paste and comparison other welding paste is checked in expression;
Fig. 7 is that containing composition and containing the chart of proportional (weight %) of object welding paste checked in expression;
To be expression deduct the infrared absorbance of comparison other welding paste and the chart of the absorbance difference that obtains from the infrared absorbance of inspection object welding paste shown in Figure 6 to Fig. 8;
Fig. 9 (a) is to a plurality of inspection objects, to check that the infrared absorbance of object welding paste deducts the infrared absorbance of comparison other welding paste and the absorbance difference that obtains is checked object corresponding to each and the chart represented from each, Fig. 9 (b) is to a plurality of inspection objects, the table of the ultrared absorbance of expression P.e.c., viscosity, stipulated number;
Figure 10 is to a plurality of inspection objects, to check that the infrared absorbance of object welding paste deducts the infrared absorbance of comparison other welding paste and the absorbance difference that obtains is checked object corresponding to each and the chart represented is the chart about the wave number frequency band of 520cm-1～700cm-1 from each;
Figure 11 is to a plurality of inspection objects, to check that the infrared absorbance of object welding paste deducts the infrared absorbance of comparison other welding paste and the absorbance difference that obtains is checked object corresponding to each and the chart represented is the chart about the wave number frequency band of 1270cm-1～1420cm-1 from each;
Figure 12 is to a plurality of inspection objects, to check that the infrared absorbance of object welding paste deducts the infrared absorbance of comparison other welding paste and the absorbance difference that obtains is checked object corresponding to each and the chart represented is the chart about the wave number frequency band of 1500cm-1～1650cm-1 from each;
Figure 13 is to a plurality of inspection objects, to check that the infrared absorbance of object welding paste deducts the infrared absorbance of comparison other welding paste and the absorbance difference that obtains is checked object corresponding to each and the chart represented is the chart about the wave number frequency band of 1665cm-1～1725cm-1 from each;
Figure 14 is the functional block diagram of second embodiment of expression solder material inspecting device of the present invention;
Precedence diagram when Figure 15 is the action of second embodiment of expression solder material inspecting device of the present invention;
Figure 16 is the synoptic diagram that signal extraction is handled;
Figure 17 is the synoptic diagram of scolding tin deterioration computing;
Figure 18 is the sectional view of the printing process of explanation welding paste;
Figure 19 is a sectional view of schematically representing the 3rd embodiment of solder material inspecting device of the present invention;
Figure 20 is the functional block diagram of the 3rd embodiment of expression solder material inspecting device of the present invention;
Figure 21 is the precedence diagram of the 3rd embodiment of expression solder material inspecting device of the present invention;
Figure 22 is the processing flow chart of the 3rd embodiment of expression solder material inspecting device of the present invention;
Figure 23 is a sectional view of schematically representing the 4th embodiment of solder material inspecting device of the present invention;
Figure 24 is the processing flow chart of the 4th embodiment of expression solder material inspecting device of the present invention;
Figure 25 is a sectional view of schematically representing the 5th embodiment of solder material inspecting device of the present invention;
Figure 26 is a sectional view of schematically representing the 6th embodiment of solder material inspecting device of the present invention;
Figure 27 is a sectional view of schematically representing the 7th embodiment of solder material inspecting device of the present invention;
Figure 28 is a sectional view of schematically representing the 8th embodiment of solder material inspecting device of the present invention.
Description of reference numerals
1: solder material inspecting device; 2: substrate; 3: welding paste; 10: moving part; The 11:X flat board; The 12:Y flat board; 20: infrared spectroscopy instrumentation portion; 21: light source; 22: intensity detection portion; 30: storage part; 40: input part; 50: control part; 60: scolding tin deterioration calculating part; 70: efferent; 80: signal extraction portion; 100: solder material inspecting device; 110: substrate; 111,111A, 111B: mask used for printing; 111a: pattern hole; 1111a: inspection hole; 111b, 111c: see through portion; 111d: strip parts; 1111b, 1112c: mounting surface; 112: welding paste; 113: scraper plate; 113A: first scraper plate; 113B: second scraper plate; 114: test section; 115: light-projecting portion; 116: intensity detection portion; 117: handling part; 118: efferent
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.In addition, below use welding paste, but be not limited thereto as scolder.
(first embodiment)
In the solder material inspecting device of present embodiment, finish to use metal mask with the printing of welding paste to substrate, this metal mask is being taken off the back from substrate during carry electronic unit, to this substrate irradiates light off and on, thereby carry out the impairment grade inspection of scolder.Below, be elaborated with reference to Fig. 1～Fig. 3.
Fig. 1 is the summary construction diagram that is used to illustrate the structure of solder material inspecting device of the present invention, and Fig. 2 is its block diagram, and Fig. 3 is the synoptic diagram of the luminous pattern of expression light source.
Solder material inspecting device 1 of the present invention has: moving part 10, infrared spectroscopy instrumentation portion 20, storage part 30, input part 40, control part 50, scolding tin deterioration calculating part 60, efferent 70.
Moving part 10 is made of X dull and stereotyped 11 and Y flat board 12.X flat board 11 is advanced and retreat on the X-direction in the drawings, and the substrate 2 that is printed with welding paste 3 is the benchmark mounting that is positioned with positioning mark initial point (0,0).Y flat board 12 is equipped on the top of this X flat board 11, and, being made as the state of the following infrared spectroscopy instrumentation of suspention portion 20, this infrared spectroscopy instrumentation portion 20 constitutes in the drawings and advances and retreat on the Y direction.
Infrared spectroscopy instrumentation portion 20 is made of light source 21 and intensity detection portion 22.Light source 21 is to the bulb of welding paste 3 irradiates lights of printing on substrate 2, for example uses ceramic light source.In the present embodiment, constitute the light that sends from this light source 21 and only be radiated at the welding paste 3 that substrate 2 prints, by method described later, 50 controls of Be Controlled portion and irradiation off and on.In addition, as the method that makes light source 21 only shine above-mentioned welding paste 3, also can consider other method.For example, make light source 21 irradiates light continuously, setting is by the chopping mechanism of the formations such as not shown switching baffle plate (シ ャ Star one) of the light that can cover this light source 21, this opens and closes the switching of baffle plate by control part 50 controls, irradiates light when opening, shading when closing is consequently only to welding paste 3 irradiates lights.
Illustrating that with reference to Fig. 3 the luminous pattern of this light source 21, Fig. 3 (a) are the enlarged drawings of the instrumentation subject area A part of Fig. 1, (b) is the synoptic diagram of connection-cut-off state of the luminous pattern of expression light source 21.Shown in Fig. 3 (a), instrumentation subject area A scans on the welding paste 3-7 light source 21 successively from welding paste 3-1 relatively.Like this, when light source 21 was positioned on the welding paste 3-1, light source 21 became state L1 (on-state) shown in figure (b), become the state to welding paste 3 irradiates lights.On the other hand, light source 21 is on welding paste 3-1 and during the position between on the welding paste 3-2, and light source 21 becomes state L2 (cut-off state) shown in figure (b), and light does not shine welding paste 3.In addition, preferably before carrying electronic unit etc. on the substrate 2, carry out based on the irradiation of the light of this light source 21.
On the other hand, intensity detection portion 22 is infrared ray sensors, constitutes ultrared intensity that detects incident and the simulating signal (being subjected to light signal) that generates the detected infra-red intensity of expression, and this simulating signal is sent to storage part 30.As the example of this intensity detection portion 22, for example exemplify infrared ray sensor based on thermal effect formula elements such as thermoelectric element or thermoelectric pile or MCT quantum type elements such as (light conductiving element, HgCdTe).
Storage part 30 by ROM (Read Only Memory: ROM (read-only memory)), RAM (Read AccessMemory: random access memory) formation such as, but constitute cad data, illumination light-emitting pattern, instrumentation subject area A of memory substrate 2 or metal mask etc.This cad data is used for determining the appointment of instrumentation subject area A and the luminous moment of light source 21.For example, in this cad data, position coordinates that employed positioning mark P0 is peristome reference point, metal mask when importing with substrate 2 and metal mask contraposition and size etc.Also can store by line, point coordinate and their sizes and the rich data (Gerber date) of shape lattice that constitute, that in CAD system, use etc.
Input part 40 is made of keyboard, mouse or touch panel etc.Be not whole welding pastes 3 of checking printing on substrate 2, but the examiner who constitutes the impairment grade of checking welding paste 3 can import instrumentation subject area A when selecting instrumentation subject area A arbitrarily and carrying out instrumentation.
Method as this input, can consider method as described below, promptly, constitute for example printing position of the welding paste in the display base plate 23 on display device such as display, if the drag operation scope from this position by mouse is selected instrumentation object position, then specify as instrumentation subject area A at this instrumentation position.In addition, can consider also that as the system of selection of instrumentation subject area A the input of carrying out coordinate by keyboard etc. selects to wait the whole bag of tricks.
Control part 50 constitute whole control in the lump the moving of moving part 10, from the signal of storage part 30 read, the light emitting control of light source 21 etc., for example, constitute by software configurations such as hardware configuration such as Programmable Logic Controller or control programs.
Scolding tin deterioration calculating part 60 constitutes the simulating signal that processing is sent here from the intensity detection portion 22 of infrared spectroscopy instrumentation portion 20, the impairment grade of calculating inspection object welding paste, and its result of calculation is transported to storage part 30.For example, by with this analog signal conversion being A/D (analog to digital) converter of digital signal and the computing machine formation of carrying out data processing based on this digital signal.
Efferent 70 is based on the view data sent here from control part 50 and the display panel of display image or the instrumentation result outputed to outside communicator.
The action of the solder material inspecting device of present embodiment then, is described with reference to Fig. 4 and Fig. 5.Precedence diagram when the precedence diagram when Fig. 4 is the setting of the luminous pattern of the light source of expression in the solder material inspecting device of the present invention and instrumentation subject area A, Fig. 5 are the actions of solder material inspecting device of the present invention.
Action when earlier the setting of the illumination light-emitting pattern of light source and instrumentation subject area being described with reference to Fig. 4.
At first, after the examiner imports instrumentation subject area A (S400) by input part 10, the information (hereinafter referred to as " area information ") relevant with the instrumentation subject area A of this input is sent to control part 50 (S401), and control part 50 reads in the cad data (S401) that is stored in the metal mask in the storage part 30.Then, control part 50 is by the area information compute illumination luminous pattern (S402) of this cad data that reads in and input, and illumination light-emitting pattern and the area information that will be calculated by this calculating write storage part 30 (S403), finish the setting of illumination light-emitting pattern and instrumentation subject area A.For example, this luminous pattern can calculate as follows.If make the translational speed of X flat board 11, Y flat board 12 of moving part 10 certain, because the position and the size of the welding paste 3 in the instrumentation subject area A are stored as area information in advance, so can be from the displacement of this area information identification moving part 10.Therefore, according to above-mentioned translational speed and this displacement, can easily calculate on moving part 10 each welding paste 3-1 in Fig. 3, on the 3-2 ... move the required time, so, as long as be set at the once irradiating time of radiation source 21 off and on as long as will move the required time.
Action when then solder material inspecting device work of the present invention after the above-mentioned setting being described with reference to Fig. 5.
At first, control part 50 is read illumination light-emitting pattern and the area information (S500) that writes storage part 30 by above-mentioned setting action.This reads processing can consider following carrying out, and not shown inspection start button for example is set, and the examiner begins to read processing by operating this inspection start button.In addition, also can as described belowly carry out the processing when even beginning to set, the processing when then carrying out this work continuously with this processing.
Next, 50 pairs of moving parts 10 of control part send the mobile mobile indicator signal (S501) to instrumentation starting position P1 (X0, Y0), receive this moving part that moves indicator signal 10 and X flat board 11, Y flat board 12 are moved so that infrared spectroscopy instrumentation portion 20 is positioned at instrumentation starting position P1 (X0, Y0) upward (S502).Mobile processing as this moving part 10, for example in advance the mobile initial point of the X flat board 11 of moving part 10 and the mobile initial point of Y flat board 12 are set at following position, promptly, infrared spectroscopy instrumentation portion 20 is configured in the position on the positioning mark P0 (0,0), X flat board 11, Y flat board 12 are moved and carry out mobile initial point the location so that infrared spectroscopy instrumentation portion 20 be positioned on the positioning mark P0 (0,0).Because depositing in this positioning mark P0 (0,0) in area information is the position of initial point and size, shape etc., so moving part 10 moves based on this area information.In addition, when carrying out this location of moving initial point, if in advance will not shown camera etc. be arranged on the Y flat board 12 and can utilize this camera to discern positioning mark P0 on substrate 2, thereby the skew of the substrate 2 on the corrected X flat board 11 gets final product.
Next, control part 50 sends luminous indication based on the illumination light-emitting pattern of reading from storage part 30 to light source 21, and, moving part 10 is sent the mobile indication (S503) that infrared spectroscopy instrumentation portion 20 is scanned on instrumentation subject area A.Like this, moving part 10 receives this and moves indication and begin to move (S504) on instrumentation subject area A, and light source 21 is luminous off and in above-mentioned scan period based on above-mentioned illumination light-emitting pattern, its result, only welding paste 3 irradiates lights (S505) on substrate 2, printing.On the other hand, if utilize 21 pairs of welding paste 3 irradiates lights of light source, then produce as catoptrical infrared ray from this welding paste 3, utilize intensity detection portion 22 to detect this ultrared intensity (checking object intensity) (S505), and these detected data are sent to storage part 30, write storage part 30 (S506) continuously as the instrumentation data.
After above-mentioned scanning (S507) end based on infrared spectroscopy instrumentation portion 20, control part 50 is read the above-mentioned instrumentation data that are written to storage part 30 (checking object intensity) and the comparison other intensity of the comparison other stored in advance from storage part 30, and the data that this is read are delivered to scolding tin deterioration calculating part 60 (S508, S509).
At scolding tin deterioration calculating part 60, based on these data and use method described later to calculate the impairment grade (S510) of the welding paste 3 in the instrumentation subject area A, the impairment grade data of the impairment grade of this welding paste that calculates 3 of expression are delivered to storage part 30.The impairment grade data of this conveying are written to storage part 30 (S511), and read by control part 50, and processed the opening of these impairment grade data of reading utilized efferent 70 outputs (S512).
In the present invention, use infrared spectrophotometry method and utilize following method to carry out the impairment grade analysis of welding paste.Following various embodiment alternately are described.
If continue to use welding paste or welding paste continued to be exposed in the atmosphere, then in welding paste, the burning that is contained, the carboxylic acid that contains changes carboxylate into.That is, use welding paste or it is continued to be exposed in the atmosphere, then in this welding paste, the metal oxide that contains increases, and the carboxylic acid that contains reduces, and the carboxylate that contains increases.
So, produce following phenomenon, promptly, the increase of this metal oxide increases, because the increase of this carboxylate increases the viscosity of welding paste, because the minimizing of the amount of carboxylic acid makes the reducing power reduction of welding paste owing to making the oxidizability of welding paste.Such phenomenon is called the deterioration of welding paste.
Therefore, in checking the object welding paste, if can analyze at least one in the amount of the amount of amount, carboxylic acid of metal oxide or carboxylate, then can check at least one in the viscosity, oxidizability, reducing power of this welding paste, and then can check the impairment grade of welding paste.
On the other hand, known metal oxides, carboxylic acid, carboxylate all can absorb the infrared ray of specific separately specific wave number frequency band.
Therefore, by implementing the combination of following operation, can realize the analysis of welding paste impairment grade.At first, detect by check the ultrared inspection object intensity of the specific wave number of object welding paste reflection from this to checking object welding paste irradiates light.Then, detect the ultrared comparison other intensity of the above-mentioned specific wave number that reflects by this comparison other welding paste by comparison object welding paste is shone above-mentioned light.Based on above-mentioned detected each intensity, relatively check the impairment grade of above-mentioned inspection object welding paste with respect to above-mentioned comparison other.In addition, the enforcement order of the detection of inspection object intensity and the detection of comparison other intensity both can be opposite, also can carry out simultaneously.In addition, also can detect comparison other intensity in advance, and it is stored in the not shown storing mechanism in advance.
Like this, can detect from the inspection object intensity of the ultrared specific wave number of checking the reflection of object welding paste with from the comparison other intensity of the ultrared specific wave number of comparison other welding paste reflection.
At this, as mentioned above, metal oxide, carboxylic acid, carboxylate all can absorb the infrared ray of specific separately specific wave number frequency band.Therefore, the amount of the metal oxide in the corresponding welding paste, carboxylic acid, carboxylate, the ultrared uptake of the specific wave number in the welding paste changes, by the ultrared Strength Changes of the specific wave number of welding paste reflection.
Therefore, based on by said method detected inspection object intensity and comparison other intensity, relatively analytical review object welding paste is with respect in the amount of the amount of the amount of the metal oxide of comparison other welding paste, carboxylic acid, carboxylate at least one.Thereby, can relatively check the impairment grade of object welding paste with respect to the comparison other welding paste.
In addition, as the method for this inspection, exemplify step as described below: the step of (a) obtaining the difference of above-mentioned inspection object intensity and above-mentioned comparison other intensity; (b) obtain the step of the ratio of above-mentioned inspection object intensity and above-mentioned comparison other intensity; (c) obtain first infrared absorbance of checking the above-mentioned specific wave number the object welding paste from above-mentioned inspection object intensity, and obtain second infrared absorbance of the above-mentioned specific wave number the comparison other welding paste, thereby obtain the step of the difference of above-mentioned first infrared absorbance and above-mentioned second infrared absorbance from above-mentioned comparison other intensity; (d) obtain the step of the ratio of above-mentioned first infrared absorbance and above-mentioned second infrared absorbance.
Above-mentioned difference or ratio are the parameters of the difference degree of expression comparison other welding paste and the infrared ray absorbing amount of checking the above-mentioned specific wave number between the object welding paste.Thereby, by obtaining these parameters, can analyze the comparison other welding paste and check the difference of the amount of metal oxide between the object welding paste, carboxylic acid, carboxylate, with respect to the comparison other welding paste, viscosity, oxidizability, the reducing power of detected object welding paste can be relatively checked, and the impairment grade (viscosity, oxidizability, reducing power) of object welding paste can be relatively checked.
In addition, in above-mentioned inspection operation, situation as described below also is possible, promptly, do not obtain such difference or ratio, even if the invention process person relevant with present embodiment only contrasts above-mentioned detected each intensity or absorbance, can relatively judge the impairment grade of above-mentioned inspection object welding paste with respect to above-mentioned comparison other.
In addition,, both different separately welding pastes can be used, also identical separately welding paste can be used as above-mentioned inspection object and above-mentioned comparison other.
Above-mentioned " using identical separately welding paste " for example is meant the object as a comparison with the welding paste a of new state, with this welding paste a of using back (after the use in the substrate printing process) state as the situation of checking object.In addition, also can be 100 times welding paste b object as a comparison with the print pass in the printing process of substrate, this welding paste b that with above-mentioned print pass is 200 times is as checking object.
One embodiment of the analytic approach of the impairment grade of the welding paste shown in next more than the explanation.
At first, illustrate in the present embodiment to checking the object welding paste.In the present embodiment, when checking, use with each material shown in Figure 7 as the welding paste that contains composition.As shown in the drawing, the welding paste of present embodiment contains the rosin of 80～90% tin, 1～3% silver, the copper less than 1%, 2～4% diethylene glycol monohexyl ether, the 2-ethylidene-1 less than 1%, 3-hexanediol and 4～6%.
In addition, the major component of welding paste is tin (Sn) or plumbous metals such as (Pb), in the welding paste of present embodiment, as shown in Figure 7, uses tin as this metal.In welding paste,, in the welding paste of present embodiment, as shown in Figure 7, use rosin (C19H29COOH) as the carboxylic acid of the major component of bringing reducing power.
In the present embodiment, with welding paste shown in Figure 7 and be this welding paste object as a comparison of new state, serve as to check object with this welding paste after in the printing process of substrate, using.In addition, below abbreviate the comparison other welding paste as " comparison other " sometimes, will check that the object welding paste abbreviates " inspection object " as.
At this, relative this comparison other and inspection object, shine the infrared ray of same intensity respectively, detection is by the intensity (comparison other intensity) in 500cm-1～3000cm-1 frequency band in the infrared ray of comparison other reflection, and detection is by the intensity in 500cm-1～3000cm-1 frequency band in the infrared ray of checking the object reflection (checking object intensity).
And, in this embodiment,, calculate the infrared absorbance (second infrared absorbance) of comparison other and the infrared absorbance (first infrared absorbance) of inspection object about each wave number.In addition, above-mentioned absorbance can be obtained by following calculating, promptly, to be made as BL with wave number h corresponding intervals (Block ラ Application Network) value (intensity of the ultrared wave number h of irradiation), to be made as A from the intensity of the ultrared wave number h of comparison other reflection, to be made as B from the intensity of checking the ultrared wave number h that object reflects, corresponding each wave number is calculated:
The infrared absorbance of comparison other (absorbance corresponding) A ' with wave number h=-log (A/BL) ... (1)
Infrared absorbance (absorbance corresponding) B ' of inspection object with wave number h=-log (B/BL) ... (2).
Fig. 6 is the spectrogram of the absorbance that calculates of expression.In addition, the transverse axis among this figure represents that (Wave Number: wave number), the longitudinal axis is represented ultrared absorbance to ultrared wave number.
As shown in the drawing, can observe at the infrared absorbance of comparison other and check on the infrared absorbance of object and there are differences.
Next, this difference is discussed.Specifically, shown in (11) formula, calculate the difference with B ' by above-mentioned (1), (2) formula A ' that obtain, corresponding with each wave number.Below with this difference as " absorbance is poor ".
Absorbance is poor=B '-A ' ... (11)
That is, refer to from the infrared absorbance of checking object in this absorbance difference and to deduct the infrared absorbance of comparison other and the value that obtains, the difference of the infrared absorbance of the infrared absorbance of object and comparison other is checked in expression.
Fig. 8 is the chart of the relation of expression infrared ray wave number and the absorbance difference corresponding with this wave number.That is, the absorbance that deducts from the inspection object absorbance shown in the chart of Fig. 6 after the absorbance of comparison other of the graphical presentation of Fig. 8 is poor.
As shown in Figure 8, in checking object and comparison other, it is bigger poor to exist near near near near the absorbance the 600cm-1, the 1300cm-1, the 1600cm-1, the 1700cm-1.
Specifically, as can be known near the 600cm-1, near the 1300cm-1, near the 1600cm-1, the infrared absorbance of inspection object compares the infrared absorbance height than object.In addition, near 1700cm-1, check that the infrared absorbance of object is low than the infrared absorbance of object frequently as can be known.
At this, known in infrared spectrogram, near the absorption of observing 600cm-1 produces because of the vibration of the oxygen-metallic bond in the metal oxide.In addition, near the known absorption of observing 1300cm-1 produces because of the symmetrical stretching vibration of carboxylate, and near the absorption of observing 1600cm-1 produces because of the contrary symmetrical stretching vibration in the carboxylate.And near the known absorption of observing 1700cm-1 produces because of the stretching vibration of the two keys in the carboxylic acid.
Therefore, near 600cm-1, frequently than the infrared absorbance height of object,, compare comparison other, the oxidizability height as can be known so in checking object, contain many than object metal oxides frequently owing to check object.
In addition, as can be known near the 1300cm-1 and near the 1600cm-1, frequently than the infrared absorbance height of object,, compare comparison other, the viscosity height so in checking object, contain many than object carboxylates frequently owing to check object.
And, near 1700cm-1,,, compare comparison other as can be known so in checking object, contain few than object carboxylic acid frequently owing to check that object is low than the infrared absorbance of object frequently, reducing power is low.
Like this, in the present embodiment, each wave number about infrared spectrum, from by the infra-red intensity of checking the reflection of object welding paste (checking object intensity) with by the infra-red intensity (comparison other intensity) of comparison other welding paste, obtain the infrared absorbance (first infrared absorbance) checked in the object welding paste and the infrared absorbance (second infrared absorbance) in the comparison other welding paste.
In addition, about each wave number of infrared spectrum, it is poor to obtain the absorbance that deducts after the absorbance of comparison other welding paste from the absorbance of checking the object welding paste.At this, if poor with reference near near near near the above-mentioned absorbance the 600cm-1, the 1300cm-1, the 1600cm-1, the 1700cm-1, then can grasp relatively with respect to comparison other, check the amount of the metal oxide that contains in the object welding paste, the amount of carboxylic acid, the amount of carboxylate.
Can relatively grasp the oxidizability of checking the object welding paste by the amount of this metal oxide, can relatively grasp the reducing power of checking the object welding paste, can relatively grasp the viscosity of checking the object welding paste by the amount of carboxylate by the amount of carboxylic acid.
Next, with the welding paste of new state object as a comparison, each welding paste that with print pass in the printing process of substrate is 200 times, 400 times, 600 times, 800 times, 1000 times, 1200 times is as checking object, and the result by the methods analyst shown in the present embodiment is shown in Fig. 9 (a).
Fig. 9 (a) is that corresponding each checked the ultrared wave number of object representation and deducted the absorbance of comparison other welding paste and the chart of the relation of the absorbance difference that obtains from the absorbance of the inspection object welding paste corresponding with each wave number.In addition, transverse axis is represented ultrared wave number, and the longitudinal axis is represented the absorbance of comparison other welding paste and checked that the difference of the absorbance of object welding paste is that absorbance is poor.
By Fig. 9 (a) as can be known, along with the increase of welding paste print pass, reach near the absorbance of 1600cm-1 near the 1300cm-1 and increase, near the absorbance the 1700cm-1 reduces.Hence one can see that, and along with the increase of print pass, carboxylic acid reduces and the carboxylate increase in welding paste.In addition, the result from this carboxylate increases can analyze and draw the increase of print pass thereupon, and the viscosity of welding paste rises.
In fact, each is checked that the viscometric result of object shown in Fig. 9 (b), can confirm that the print pass of welding paste and the viscosity of welding paste are positive correlation.In addition, also can confirm welding paste near 1600cm-1 infrared absorbance and the viscosity of welding paste be positive correlation, welding paste near 1700cm-1 infrared absorbance and the viscosity of welding paste be negative correlativing relation.Such relation why set up be because, increase along with the print pass of welding paste, carboxylic acid that welding paste contained reduces and near 1700cm-1 ultrared absorption tails off, carboxylate that welding paste contained increases and near 1600cm-1 ultrared absorption increases, and the increase of corresponding carboxylate, viscosity increased.
In addition, according to the embodiment shown in above, calculate the infrared absorbance of inspection object welding paste and the infrared absorbance of comparison other welding paste, even if but do not calculate absorbance, also can relatively grasp the amount of the metal oxide of checking that the object welding paste is contained, the amount of carboxylic acid, the amount of carboxylate.Specifically, about each wave number of 500cm～3000cm-1, detect infra-red intensity by the infra-red intensity of checking the reflection of object welding paste and the reflection of comparison other welding paste.In addition, in each wave number, detected relatively each intensity is carried out the computing of (21) formula.
Intensity difference=B-A ... (21)
A: from the ultrared intensity of comparison other reflection
B: from checking the ultrared intensity of object reflection
At this, " intensity difference " refers to from detected infra-red intensity during checking object and deducts detected infra-red intensity in comparison other and the value that obtains, is the difference of detected infra-red intensity and detected infra-red intensity in comparison other in checking object.
At this,, then can grasp the difference of the infrared ray absorbing amount of the metal oxide of checking object, carboxylic acid, carboxylate with respect to comparison other if with reference to the above-mentioned intensity difference of 600cm-1,1300cm-1,1600cm-1,1700cm-1.Therefore, with respect to comparison other, can relatively grasp the amount of the metal oxide of checking that the object welding paste is contained, the amount of carboxylic acid, the amount of carboxylate.
In addition, also can be not according to above-mentioned absorbance difference or intensity difference, and according to the ratio of each absorbance or the ratio of each intensity, grasp the difference of the infrared absorbance in comparison other and the inspection object, and can grasp the amount of the metal oxide of checking that the object welding paste is contained, the amount of carboxylic acid, the relative amount of carboxylate.
For example, also can corresponding each wave number and obtain by following computing that detected infra-red intensity is a strength ratio with the ratio of detected infra-red intensity in comparison other in checking object.
Strength ratio=B/A ... (31)
The ratio of in addition, for example also can corresponding each wave number and obtaining the infrared absorbance in the infrared absorbance checked in the object and the comparison other by following computing is the absorbance ratio.About the computing method of absorbance, identical with (1), (2) formula.
Absorbance ratio=B '/A ... (41)
A ': the infrared absorbance of comparison other
B ': the infrared absorbance of checking object
In addition, according to the embodiment shown in above, welding paste about comparison other and inspection object, in the scope of 500～3000cm-1, corresponding each wave number and detect ultrared intensity, and calculate infrared absorbance and poor, the above-mentioned absorbance of above-mentioned absorbance than, above-mentioned intensity difference or above-mentioned strength ratio, but also can be order as described below, promptly only to the above-mentioned intensity of the infrared detection of specific wave number, absorbance, the absorbance of calculating this specific wave number is poor, strength ratio or above-mentioned intensity difference, strength ratio.At this, at least a infrared ray absorbing that specific wave number refers in metal oxide, carboxylic acid, the carboxylate can received wave number, in the present embodiment, and at least a among 600cm-1,1300cm-1,1600cm-1, the 1700cm-1.
In addition, light intensity inequality from light-projecting portion 15 irradiations, to comparing object and checking object, even if use same light-projecting portion 15 irradiation infrared rays respectively, if respectively at different moment irradiation infrared rays, the ultrared intensity that then shines comparison other produces some differences with the ultrared intensity that shines the inspection object.This difference is brought harmful effect to the ultrared intensity by the welding paste reflection that is detected sometimes.
Therefore, preferably poor, the absorbance of above-mentioned intensity difference, strength ratio, the absorbance in finding the solution specific wavelength was proofreaied and correct than the time.Below, illustrate find the solution the correction intensity of proofreading and correct above-mentioned intensity difference poor, proofread and correct the order that the correction intensity of above-mentioned strength ratio is poorer than, the correction absorbance of proofreading and correct above-mentioned absorbance difference, proofread and correct the correction absorbance ratio of above-mentioned absorbance ratio.
At first, outside the wave number frequency band of the observation infrared ray absorbing of metal oxide, carboxylic acid, carboxylate, with by comparison other with check that the different wave number of the intensity of reflected infrared of object reflection as reference wave number (for example 2929cm-1), preestablishes in welding paste testing fixture 1.
Then, detect above-mentioned by in the infrared ray of comparison other reflection with reference to the intensity of wave number with by the above-mentioned intensity in the infrared ray of checking the object reflection with reference to wave number.And then, detect by the intensity of the above-mentioned specific wave number in the infrared ray of comparison other reflection with by the intensity of checking the above-mentioned specific wave number in the infrared ray that object reflects.
At this, to be made as Aref from the above-mentioned intensity (top four's degree, comparison other are with reference to intensity) the infrared ray of comparison other reflection with reference to wave number, to be made as Bref from the above-mentioned intensity the infrared ray of checking the object reflection (the 3rd intensity, inspection object are with reference to intensity) with reference to wave number, to be made as Atar from the intensity (comparison other intensity) of the above-mentioned specific wave number the infrared ray of comparison other reflection, will be made as Btar from the intensity (checking object intensity) of the above-mentioned specific wave number the infrared ray of checking the object reflection.
In addition, above-mentioned infrared absorbance with reference to wave number in the comparison other (quatre outside line absorbance) is made as A ' ref, to check that the above-mentioned infrared absorbance with reference to wave number (the 3rd infrared absorbance) in the object is made as B ' ref, the infrared absorbance (second infrared absorbance) of the above-mentioned specific wave number in the comparison other is made as A ' tar, the infrared absorbance (first infrared absorbance) of checking the above-mentioned specific wave number in the object is made as B ' tar.
By calculating each absorbance with (1), method that (2) formula is identical.That is, will with the infrared ray that shines comparison other in be made as BLref with reference to the corresponding intensity of wave number, with shine the infrared ray of checking object in the corresponding intensity of specific wave number be made as BLtar, can obtain each absorbance by following formula (61)～(64).
A′ref＝-log(Aref/BLref)...(61)
B′ref＝-log(Bref/BLref)...(62)
A′tar＝-log(Atar/BLtar)...(63)
B′tar＝-log(Btar/BLtar)...(64)
Below, can obtain that correction intensity is poor by following formula (71)～(74), correction intensity than, proofread and correct absorbance poor, proofread and correct the absorbance ratio.
Correction intensity is poor=(Btar-Bref)-(Atar-Aref) ... and (71)
The correction intensity ratio=(Btar-Bref)/(Atar-Aref) ... (72)
Proofread and correct absorbance poor=(B ' tar-B ' ref)-(A ' tar-A ' ref) ... (73)
Correction absorbance ratio=(B ' tar-B ' ref)/(A ' tar-A ' ref) ... (74)
Thus, even if to the ultrared intensity of relatively object irradiation with to producing some differences between the ultrared intensity of checking the object irradiation, about each intensity, each absorbance, owing to deduct the intensity with reference to wave number corresponding with above-mentioned difference, the correction intensity of roughly eliminating this difference is poor, correction intensity compares, the correction absorbance is poor, proofread and correct the absorbance ratio so can obtain.
In addition, correction intensity is poor, correction intensity compares, the correction absorbance is poor, proofread and correct the absorbance ratio can obtain by following formula (75)～(78).This method is with Aref/Bref or the A ' ref/B ' ref correction coefficient as above-mentioned difference.
Correction intensity is poor=(Btar * Aref/Bref)-Atar ... (75)
The correction intensity ratio=(Btar * Aref/Bref)/Atar ... (76)
Proofread and correct absorbance poor=(B ' tar * A ' ref/B ' ref)-A ' tar ... (77)
Proofread and correct absorbance than=(B ' tar * A ' ref/B ' ref)/A ' tar ... (78)
In addition, above-mentioned each specific wave number (600cm-1,1300cm-1,1600cm-1,1700cm-1) can be carried out the numerical value change.That is, specific wave number is not limited to 600cm-1,1300cm-1,1600cm-1,1700cm-1, can set the effective range as specific wave number.Specify this point.
At first, with analysis among Fig. 9 similarly, with the welding paste of new state object as a comparison, each welding paste that with print pass in the printing process of substrate is 200 times, 400 times, 600 times, 800 times, 1000 times, 1200 times is as checking object, by the method shown in the present embodiment, it is poor that each is checked that object is obtained above-mentioned absorbance.Its result such as Fig. 5～shown in Figure 8.In addition, Figure 10 represents that the above-mentioned absorbance in 520cm-1～700cm-1 wave number frequency band is poor, Figure 11 represents that the above-mentioned absorbance in 1270cm-1～1430cm-1 wave number frequency band is poor, Figure 12 represents that the above-mentioned absorbance in 1500cm-1～1650cm-1 wave number frequency band is poor, and Figure 13 represents that the above-mentioned absorbance in 1665cm-1～1730cm-1 wave number frequency band is poor.
The absorption peak of the metal oxide that welding paste contained (tin ash) is detected near 600cm-1, as shown in figure 10, if pay close attention to 520cm-1～700cm-1, then can distinguish the difference of the absorbance difference of respectively checking object, if pay close attention to 557cm-1～613cm-1, then can observe the difference of the absorbance difference of respectively checking object more significantly.Therefore, if the arbitrary at least wave number between 520cm-1～700cm-1 is made as above-mentioned specific wave number, then can analyze the amount of the metal oxide of respectively checking object.
In addition, the absorption peak of the symmetrical stretching vibration of carboxylate (is 1323cm-1 more accurately) and is detected near 1300cm-1, as shown in figure 11, if pay close attention to 1270cm-1～1430cm-1, then can distinguish the difference of the absorbance difference of respectively checking object, if pay close attention to 1282cm-1～1382cm-1, then can observe the difference of the absorbance difference of respectively checking object more significantly.Therefore, if the arbitrary at least wave number between 1270cm-1～1430cm-1 is made as above-mentioned concern wave number, then can analyze the amount of the carboxylate of respectively checking object.
The absorption peak of the contrary symmetrical stretching vibration of carboxylate (is 1590cm-1 more accurately) and is detected near 1600cm-1, as shown in figure 12, if pay close attention to 1500cm-1～1650cm-1, then can distinguish the difference of the absorbance difference of respectively checking object, if pay close attention to 1562cm-1～1624cm-1, then can observe the difference of the absorbance difference of respectively checking object more significantly.Therefore, if the arbitrary at least wave number between 1500cm-1～1650cm-1 is made as above-mentioned concern wave number, then can analyze the amount of the carboxylate of respectively checking object.
And, the absorption peak of the two keys of the carbon-oxygen of carboxylic acid is detected near 1700cm-1, as shown in figure 13, if pay close attention to 1665cm-1～1730cm-1, then can distinguish the difference of the absorbance difference of respectively checking object, if pay close attention to 1683cm-1～1710cm-1, then can observe the difference of the absorbance difference of respectively checking object more significantly.Therefore, if the arbitrary at least wave number between 1665cm-1～1730cm-1 is made as above-mentioned concern wave number, then can analyze the amount of the carboxylic acid of respectively checking object.
(second embodiment)
In the solder material inspecting device of second embodiment, similarly finish printing and metal mask taken off the back before the reflow soldering during in carry out aspect the impairment grade inspection of welding paste with to use infrared spectrophotometry method aspect identical with above-mentioned first embodiment.But, this second embodiment is summarized, it is not welding paste irradiates light only as above-mentioned first embodiment on substrate, printing, but constitute to substrate or to welding paste, according to circumstances or to being equipped on the electronic unit irradiates light of substrate, and detect as its catoptrical infra-red intensity, from this intensity, only extract the intensity (checking object intensity) of welding paste, above-mentioned aspect is different with first embodiment.Below, only describe the part different in detail, the explanation of omitting same section with first embodiment.
The structure of the solder material inspecting device of present embodiment at first, is described with reference to Fig. 1, Figure 14.Figure 14 is the functional block diagram of second embodiment of expression solder material inspecting device of the present invention.
The schematic configuration of the solder material inspecting device 1 of present embodiment and above-mentioned first embodiment are same, as shown in Figure 1, but as shown in figure 14, also have as different with above-mentioned first embodiment aspect the signal extraction portion 80 of intensity extraction mechanism.
Signal extraction portion 80 constitutes, to the substrate 2 scan edge limits that are printed with welding paste 3 irradiates light continuously, from the infra-red intensity as its catoptrical specific wave number is instrumentation intensity, extracts as only from the ultrared inspection object intensity of welding paste 3 detected catoptrical specific wave numbers.For example, arithmetical organs such as CPU are carried out the program be stored in the storing mechanisms such as ROM or RAM, realize by communication agencies such as output mechanism such as input mechanisms such as supervisory keyboard, display or interface circuits.Handle as described later about concrete extraction.
Action when next, illustrating that with reference to Figure 15 the solder material inspecting device of present embodiment is worked.Precedence diagram when Figure 15 is this work.
At first, the examiner by input part 40 input instrumentation subject area A, then area information is written into storage part 30 this is identical with above-mentioned first embodiment on the one hand.Then, control part 50 is read area information from storage part 30, and to the mobile indicator signal of moving part 10 conveyings, receive this moving part that moves indicator signal 10 X flat board 11, Y flat board 12 are moved, and make infrared spectroscopy instrumentation portion 20 move to instrumentation starting position P1 (X0, Y0) (S600～S603).The identical method of these applicable and above-mentioned first embodiment of action.
Next, 50 pairs of light sources 21 of control part send luminous indication, and moving part 10 is sent mobile indication so that (S603) scanned in infrared spectroscopy instrumentation portion 20 on instrumentation subject area A.Like this, infrared spectroscopy instrumentation portion 20 limits are luminous continuously, scan edge instrumentation subject area A (S604).On the other hand, if utilize 21 pairs of instrumentation subject area of light source A irradiates light, then detect as its catoptrical infra-red intensity (S605) by intensity detection portion 22, these detected data are sent to storage part 30 and write storage part 30 (S606) continuously as the instrumentation data, if finish the scanning in the instrumentation subject area A, then moving part 10 finishes to move (S607).In addition, different with above-mentioned first embodiment in the present embodiment, light source 21 is luminous continuously, not only to welding paste 3 irradiates lights in the instrumentation subject area A, and to substrate 2 also irradiates light.In addition, handle,, also can only extract infra-red intensity (checking object intensity) as the catoptrical specific wave number that reflects from welding paste 3 even if in this instrumentation subject area A, be equipped with electronic unit by signal extraction described later.
Next, control part 50 works as the intensity detection mechanism that extracts above-mentioned inspection object intensity, begins to carry out signal extraction and handles, and handles as this signal extraction, has following situation.
(first embodiment that signal extraction is handled)
To the substrate irradiates light, detect from the infra-red intensity of the specific wave number of this substrate reflection, store this intensity into storage part 30 as substrate intensity in advance.Purpose is to obtain to the substrate irradiates light time, represents that the infra-red intensity of the specific wave number that its reflection comes becomes the reference data of which kind of pattern.In addition, by obtaining and the difference that is stored in the aforesaid substrate intensity of storage part 30, extract above-mentioned inspection object intensity from above-mentioned instrumentation intensity.
(second embodiment that signal extraction is handled)
To the welding paste irradiates light, detect from the infra-red intensity of the specific wave number of this welding paste reflection, store this intensity into storage part 30 as scolding tin intensity in advance.Purpose is to obtain to represent that its infra-red intensity that reflects the specific wave number of coming becomes the reference data of which kind of pattern to the welding paste irradiates light time.In addition, at the increase and decrease pattern of the signal of the above-mentioned scolding tin intensity of storage part 30 storages and above-mentioned instrumentation intensity, extract above-mentioned inspection object intensity by relatively.Figure 16 schematically represents this extraction method.D1 represents to become the scolding tin intensity of this reference data, and D2 is a part suitable with welding paste in the above-mentioned instrumentation intensity, D3 be in the above-mentioned instrumentation intensity with substrate or the suitable part of parts.1 key element of this column diagram is to utilize the light intensity or the above-mentioned standardized value of light intensity with reference to wave number of above-mentioned specific wave number.At this, with light intensity 1665cm-1～1730cm-1 (a1), 1500cm-1～1650cm-1 (a2), 1270cm-1～1430cm-1 (a3), 520cm-1～700cm-1 (a4) standardization divided by the light intensity 1100cm-1～1200cm-1 (b) of reference wave number of specific wave number, the left side begins to be respectively the value of a1/b, a2/b, a3/b, a4/b from figure.In the drawings in the benchmark scolding tin data shown in the D1, the increase and decrease pattern of signal is with the mode displacement of "+-", and the signal increase and decrease pattern among the D2 in the instrumentation data is also with the mode displacement of "+-".Therefore, D2 is identified as the signal of expression scolding tin intensity.In addition, the welding paste that is used to obtain reference data can be new welding paste, if be above-mentioned comparison other welding paste, owing to can utilize above-mentioned comparison other intensity, so be suitable.According to this method, even if on substrate 2, have electronic unit etc., also can extract above-mentioned inspection object intensity, before being about to carry out reflow soldering, can check, so can further improve the instrumentation precision.In addition, also can not be subjected to the influence that brings because of the deterioration of substrate itself, can extract above-mentioned inspection object intensity.
(the 3rd embodiment that signal extraction is handled)
At first, utilize intensity detection portion 22, detecting by irradiation is total instrumentation intensity from the light of light source 21 and from the infra-red intensity of substrate 2 reflections that are printed with welding paste 3.Not only comprise intensity in this total instrumentation intensity, also comprise intensity from substrate 2 from welding paste 3.Next, utilize signal extraction portion 80 relatively by the wave number outside the specific wave number in these intensity detection portion 22 detected above-mentioned total instrumentation intensity promptly with reference to the infra-red intensity and the defined threshold of wave number, if be this threshold value with next with it as scolding tin intensity, and extract the infrared inspection object intensity of specific wave number from this scolding tin intensity.Compare with the substrate reflecting brightness, the scolder reflecting brightness is extremely low, so also can extract above-mentioned inspection object intensity by this method.The following setting of this threshold value gets final product, the instrumentation welding paste for example with reference to the intensity of reflected light of wave number and the intensity of reflected light with reference to wave number of substrate, obtain in advance as the value of the intensity of reflected light of the intensity of reflected light that can distinguish this welding paste and this substrate, and it is pre-set in storage part 30.
In addition, as extracting the method for checking object intensity, also can replace above-mentioned with reference to wave number intensity of reflected light and be made as the summation of the intensity of reflected light of specific wave number, similarly wait by experiment and obtain threshold value, similarly extract the intensity of reflected light of welding paste according to this threshold value.In addition, also can replace above-mentioned with reference to wave number intensity of reflected light and utilize the mean value of above-mentioned total instrumentation intensity, obtain threshold value with above-mentioned similarly the grade by experiment, similarly extract the intensity of reflected light of welding paste according to this threshold value.
Handle if finish above-mentioned signal extraction, then the extraction data of this extraction (checking object intensity) are transported to storage part 30, and storage part 30 writes this extraction data (S611).After this (S612～S616) is identical with the processing of S508～S512 shown in Figure 5 in processing.
In addition, when carrying out the computing of scolding tin deterioration, also can carry out as shown in figure 17.Figure 17 is from the above-mentioned inspection object intensity (D11) of comparison other welding paste and the synoptic diagram when checking that difference (D31) between the above-mentioned comparison other intensity (D2) of object welding paste is obtained the scolding tin impairment grade, obtain difference D31 from D11-D2, this difference D31 that obtains is represented as the absolute value summation of each signal difference.In addition, the key element of each column diagram becomes as mentioned above by standardized value.Like this, if represent as the absolute value summation, then the degree of the impairment grade of welding paste comes into plain view.
(the 3rd embodiment)
In the solder material inspecting device of the 3rd embodiment, finish to use mask behind substrate printing welding paste, mask is being installed under the state of substrate, to this substrate irradiates light, carry out the impairment grade inspection of scolder.The structure of solder material inspecting device of the present invention is described with reference to Figure 18, Figure 19.This solder material inspecting device not only comprises the inspection body of checking the welding paste impairment grade, and can constitute in the lump with the printing mechanism of printing welding paste, is not limited to the structure of this embodiment.
Earlier printing mechanism is described with reference to Figure 18.Figure 18 is the sectional view of explanation printing process, expression printing initial state.
At first, on the substrate 110 that is formed with not shown Wiring pattern overlay configuration be formed with pattern hole 111a, 111a ... mask used for printing 111.At this moment, the position of the printing welding paste 112 on Wiring pattern, configuration pattern hole 111a, 111a ....
Under this state, supply with welding paste 112 to mask used for printing 111 lip-deep printing starting position P1 sides, make the leading section 113a of scraper plate 113 and the surperficial butt of mask used for printing 111, and make it slide into printing end position P2 from printing starting position P1.The leading section 113a of this scraper plate 113 is made of materials such as rubber, resin, metals, and the print direction X in figure tilts and slides.
Utilize the slip of this scraper plate 113, welding paste 112 rotates on mask used for printing 111 and moves, begin to fill successively from the pattern hole 111a of printing starting position P1 side, via this pattern hole 111a, 111a ..., welding paste 112 is printed on the substrate 110.
When this prints, utilize scraper plate 113 will be filled into pattern hole 111a, 111a ... the surfacing of the welding paste 112 of ...
In the present embodiment, utilize this printing mechanism make welding paste 112 be filled into pattern hole 111a, 111a ..., from this pattern hole 111a, 111a ... middle selection pattern hole 111a is arbitrarily set as inspection hole 1111a, surface irradiation light by to this welding paste 112 carries out the analysis of impairment grade.
Next, the structure of inspection body of the solder material inspecting device of present embodiment is described with reference to Figure 19, Figure 20.In addition, also will be called contactless measuring method below based on the inspection method of the inspection body of present embodiment.
Figure 19 is a sectional view of schematically representing the solder material inspecting device of present embodiment, particularly schematically represents the sectional view of the inspection body of analysis welding paste impairment grade.Figure 20 is its functional block diagram.
Solder material inspecting device 100 constitute have test section 114, light-projecting portion 115, intensity detection portion 116, handling part 117, can utilize efferent 118 outgoing inspection results.
Test section 114 for example is made of photoelectric sensor, ultrasonic sensor, infrared ray sensor etc., is used to check whether the printing based on scraper plate 113 finishes, and is disposed at the printing end position P2 of scraper plate 113.Test section 114 constitutes by moving of scraper plate 113 and blocks the light that self sends, and finishes thereby detect printing, and will represent that the printing detection of end signal that printing finishes sends to handling part 117.
Light-projecting portion 115 is to the bulb of the inspection hole 1111a irradiates light among the pattern hole 111a, for example, uses ceramic light source.This light-projecting portion 115 constitutes if send the luminous command signal of luminous instruction by handling part 117 to inspection hole 1111a, and is then luminous to inspection hole 1111a.Like this, because light-projecting portion 115 constitutes and receives luminous command signal and luminous,, can seek the amount of saving energy or suppress to generate heat so compare with always luminous structure.
Intensity detection portion 116 is infrared ray sensors, and it constitutes the simulating signal (being subjected to light signal) that detects the infra-red intensity of injecting and generate the infra-red intensity of expression detection, and this simulating signal is sent to handling part 117.As the example of this intensity detection portion 116, for example can exemplify infrared ray sensor based on thermal effect formula elements such as thermoelectric element or thermoelectric pile or MCT quantum type elements such as (light conductiving element, HgCdTe).In addition, intensity detection portion 117 is arranged to be positioned at as from the catoptrical ultrared optical axis of welding paste 112 or the focal position of condenser.
In the present embodiment, between intensity detection portion 116 and mask used for printing 111, be provided with bandpass filter 120.This bandpass filter 120 is the optical filters that are disposed on the optical axis of intensity detection portion 116, and the infrared ray of specific wave number is seen through.In addition, this specific wave number is that at least a infrared ray absorbing in metal oxide, carboxylic acid, the carboxylate can received wave number.
Handling part 117 constitutes the simulating signal that processing is sent here from intensity detection portion 116, and this instrumentation result is sent to efferent 118.For example, by A/D (the Analog to Digital: analog to digital) converter and constitute that with this analog signal conversion is digital signal based on the computing machine that this digital signal is carried out data processing.
In addition, ROM (read-only memory)) or the program in the storing mechanism such as RAM arithmetical organ such as CPU is carried out and is stored in ROM (Read OnlyMemory:, realize by communication agencies such as output mechanism such as input mechanisms such as supervisory keyboard, display or interface circuits in this handling part 117.Therefore, the computing machine with these mechanisms can be realized the various functions and the various processing of handling part 117 only by reading the storage medium of storing said procedure and carrying out this program.In addition, by said procedure being stored in the movable storage medium, can be implemented in above-mentioned various functions and various processing on any computing machine.
As this storage medium, both can be and be used for the such program medium of not shown storer, for example ROM handled by microcomputer, also can be in addition as external memory and be provided with not shown program reading device, by inserting the program medium that storage medium can read therein.
In addition, no matter be which kind of situation, preferably constitute the addressable and execution program stored of microprocessor.And read routine downloads to the program storage area of microcomputer with the program of reading, and this program is stored in the body apparatus in advance.
In addition, as the said procedure medium, be to constitute the storage medium that can separate with body, for example be following storage medium, band such as tape or magnetic tape cassette class, the dish class of CDs such as disk such as floppy disk or hard disk or CD/MO/MD/DVD, card such as IC-card (containing storage card) class, or contain based on mask rom, EPROM (Erasable Programmable Read Only Memory: EPROM (Erasable Programmable Read Only Memory)), EEPROM (Electrically Erasable Programmable Read OnlyMemory: electricallyerasable ROM (EEROM)), the semiconductor memory of flash rom etc., storage medium of mounting program etc. regularly.
In addition, if can connect the system architecture of the communication network that contains the Internet, be preferably with from the mode of the downloaded program storage medium of mounting program fluidly.
And as mentioned above from the downloaded program time, the program of preferred this download usefulness is stored in advance in the body apparatus or from other storage medium and installs.
Efferent 118 is based on the instrumentation result who sends here from handling part 117 and shows instrumentation result's display panel or with the communicator of instrumentation result to outside output.
Next the action of solder material inspecting device is described with reference to Figure 21, Figure 22.Figure 21 is a precedence diagram, and Figure 22 is a processing flow chart.
Be positioned at printing end position P2 if scraper plate 113 slides into, then scraper plate 113 covers the infrared ray that test section 114 sends.Like this, test section 114 detects printing and finishes (S100), and will print the detection of end signal and send to handling part (S101).In a single day handling part 117 receives this printing detection of end signal, then light-projecting portion 115 is sent luminous command signal (S102).Like this, 115 pairs of light-projecting portions that receive this luminous command signal are filled in welding paste 112 irradiates lights (S103) among the inspection hole 1111a.Welding paste 112 by light-projecting portion 115 irradiates lights after, received (S104) via bandpass filter 120 by intensity detection portion 116 as catoptrical infrared ray, intensity detection portion 116 is subjected to light signal to send to handling part 117 (S105) this.Handling part 117 receives this and is subjected to light signal, receives this handling part that is subjected to light signal 117 and is subjected to light signal computing mode change degree (S106) by this, and handling part 117 sends to efferent 118 with the state variation degree that this calculates.Like this, efferent 118 receives this state variation degree and exports measurement result (S108).
This state variation degree refers to checks the impairment grade of object welding paste with respect to the comparison other welding paste, and in the present invention, handling part 117 uses the infrared spectrophotometry method to carry out the impairment grade analysis of welding paste.Because this infrared spectrophotometry method is identical with first embodiment, its explanation of Therefore, omited.
(the 4th embodiment)
Because in the solder material inspecting device of the 4th embodiment, similarly detect the impairment grade that printing finishes and use infrared spectrophotometry method inspection welding paste, this is identical with above-mentioned the 3rd embodiment, so in following only explanation and the different part of above-mentioned the 3rd embodiment, omit the explanation to same structure, action.
The solder material inspecting device of the 4th embodiment is described with reference to Figure 23, Figure 24.Figure 23 is a sectional view of schematically representing the solder material inspecting device of the 4th embodiment, and Figure 24 is its processing flow chart.
In the solder material inspecting device 100 of the 4th embodiment, similarly at first utilize method shown in Figure 180 on substrate 110, to print welding paste 112.
Summarize in the solder material inspecting device 100 of the 4th embodiment difference with above-mentioned the 3rd embodiment, it constitutes checks that object welding paste 112 is not filled among the inspection hole 1111a, and mounting is in seeing through the 111b of portion, mounting is seen through the rear side irradiates light of the welding paste 112 of the 111b of portion from mask used for printing 111A in this, thereby check the impairment grade of welding paste 112.Below describe in detail.
Mask used for printing 111A with the overlapping state of substrate 110 under, above-mentioned printing end position side forms (part of the following mask used for printing 111A that will be in Figure 23 will form from substrate 110 is called " strip parts 111d " rectangularly) from substrate 110 rectangularly.111d forms porose 1112a in this strip parts.The tabular that the bottom side of this hole 1112a is fixed in mask used for printing 111A rear side sees through the 111b of portion and stops up, and should see through the 111b of portion and become the bottom of hole 1112a (following this bottom is called " mounting surface 1111b ").
The mask used for printing 111A of said structure as mentioned above with the overlapping state of substrate 110 under, print by scraper plate 113 is slided on mask used for printing 111A surface, after this printing finished, at printing end position P2, this scraper plate 113 was mentioned upward.Near under this scraper plate that is raised 113, be formed with the above-mentioned 111b of portion of seeing through.Therefore, if finish, then seeing through mounting welding paste 112 on the 111b of portion based on the printing of scraper plate 113.
In addition, see through the 111b of portion and constitute the light that makes from light-projecting portion 115 irradiations by mounting surface 1111b total reflection, for example, the prism that is made of ZnSe, Ge etc. forms.
Light-projecting portion 115 is disposed at the rear side of mask used for printing 111A, to seeing through the 111b of portion from the rear side irradiates light.Therefore, constitute mounting in the inspection object welding paste 112 that sees through the 111b of portion from backside illuminated light.
Intensity detection portion 116 similarly is disposed at the rear side of mask used for printing 111A, and can detect as the catoptrical ultrared inspection object intensity from checking that object welding paste 112 reflects.
In addition, also can detect many irradiates lights of above-mentioned mounting surface 1111b repeatedly to reflect if see through the 111b of portion configuration light-projecting portion 115 and intensity detection portion 116, then can seek the further raising of instrumentation precision in inside as catoptrical ultrared inspection object intensity.
Other structure is identical with situation about illustrating in above-mentioned contactless instrumentation method, and is also identical with Figure 21, situation shown in Figure 22 to the action that shows the instrumentation result from checking that printing finishes the back in addition, the Therefore, omited explanation.
As mentioned above, in the present embodiment since from the back side to the inspection object welding paste irradiates light of mounting in the mounting surface that sees through portion, and detect as its catoptrical ultrared inspection object intensity, so do not need the operation of the shadow surface of smooth welding paste especially, can seek further to improve the instrumentation precision.
(the 5th embodiment)
The solder material inspecting device of the 5th embodiment is the structure roughly the same with the structure of above-mentioned the 4th embodiment, and difference is: also be provided with second scraper plate that scrapes off the welding paste after the inspection and the structure of the portion of seeing through.Only illustrate and above-mentioned the 4th embodiment difference below with reference to Figure 24 and Figure 25, omit explanation other parts.Figure 24 is the processing flow chart of the 5th embodiment of expression solder material inspecting device of the present invention.Figure 25 is a sectional view of schematically representing the 5th embodiment of solder material inspecting device of the present invention.
In the solder material inspecting device 100 of present embodiment, constitute by the first scraper plate 113A and these two scraper plates of the second scraper plate 113B, undertaken and the identical printing process of situation that in above-mentioned the 3rd embodiment and the 4th embodiment, illustrates by the first scraper plate 113A.
At mask used for printing 111B, similarly form porose 1112b at strip parts 111d with above-mentioned the 4th embodiment.
See through its upper side of the 111c of portion and form and the roughly the same shape of above-mentioned hole 1112b, be formed with flange 1111c in lower side, upper side is fitted among the 1112b of hole, and, utilize flange 1111c to be fixed in the rear side of mask used for printing 111B.Should see through 111c of portion and above-mentioned the 4th embodiment similarly, be formed near under the first scraper plate 113A that printing end position P2 is raised, if finish, then seeing through mounting welding paste 112 on the 111c of portion (following have the face of this welding paste to be called " mounting surface 1112c " mounting) based on the printing of scraper plate 113A.
Because configuration light-projecting portion 115 and intensity detection portion 116 are to see through the mounting surface 1112c irradiates light of the 111c of portion from rear side to this and can detect as catoptrical ultrared inspection object intensity, so can seek further to improve the instrumentation precision, identical about this point with above-mentioned the 4th embodiment.
On the other hand, in the present embodiment, have the second scraper plate 113B, this compares with above-mentioned the 4th embodiment and has structural difference.
This second scraper plate 113B constitutes, and after detecting above-mentioned inspection object intensity, the welding paste 112 after checking is scraped off from mounting surface 1112c, and its material is identical with the above-mentioned first scraper plate 113A.It is relative with the above-mentioned first scraper plate 113A that this second scraper plate 113B is configured to, and tilt to the direction opposite with the first scraper plate 113A (the printing starting position P1 direction side among Figure 25).Like this, if the second scraper plate 113B that the welding paste 112 after checking is scraped off is set, the second scraper plate 113B scrape off welding paste 112 during in, the first scraper plate 113A can turn back to printing starting position P1 for next time printing, its result, the operating efficiency of can seek to improve printing process, checking operation.
In addition, in the solder material inspecting device of present embodiment, owing to constitute after utilizing intensity detection portion 116 to detect inspection object intensity, the second scraper plate 113B scrapes off mounting in the inspection object welding paste 112 that sees through the 111c of portion, so constitute intensity detection portion 116 after detecting inspection object intensity, for example will represent to detect the detection end signal that finishes and send to the second scraper plate 113B via handling part 117.In addition, constitute after the second scraper plate 113B receives this detection end signal, begin the above-mentioned operation that scrapes off.
Also can adopt following structure, the welding paste 112 after promptly the second scraper plate 113B will check scrapes off, and it is slided to the direction opposite with the print direction of the above-mentioned first scraper plate 113A on mask used for printing 111B surface, also can be to substrate 110 printing welding pastes 112.Like this, the operating efficiency of can further seek to improve printing process, checking operation.
In addition, the above-mentioned quality award from the ministry that sees through is set in printing end position P2 near above-mentioned scraper plate or above-mentioned first scraper plate earlier.This is that the portion of being through pushes in order to make welding paste utilization deadweight.
Next the action of the solder material inspecting device of present embodiment is described with reference to Figure 24.
About finish from the printing that detects the first scraper plate 113A by intensity detection portion 116 (S200) back, to by a series of actions of efferent 118 output measurement results (S200～S208), identical with situation about in the 3rd embodiment, illustrating with reference to Figure 22.In the present embodiment, on the basis of this action, what increase by the second scraper plate 113B above-mentionedly scrapes off action.Specifically, this scrapes off following the carrying out of action, promptly handling part 117 by intensity detection portion 116 receive be subjected to light signal after, the 117 couples second scraper plate 113B of this handling part send and are used to instruct it to scrape off the command signal that scrapes off of welding paste behind the instrumentation.Like this, the second scraper plate 113B receives this and scrapes off command signal, and slides to the direction opposite with the print direction of the above-mentioned first scraper plate 113A on mask used for printing 111B surface, scrapes off the welding paste (S209) after the inspection.This scrapes off the later variable design of the suitable moment of action S206 in Figure 24.
As mentioned above, when the second scraper plate 113B also is used for printing process, also form and see through the identical structure of the 111c of portion in the printing starting position of mask used for printing 111B P1 side, corresponding therewith, configurable light-projecting portion 115 and intensity detection portion 116.If constitute like this, then the second scraper plate 113B printing of the printing end position P2 side direction from Figure 25 starting position P1 side on mask used for printing 111B surface is slided, the second scraper plate 113B is behind the welding paste 112 that scrapes off on the mounting surface 1112c, printing end position P2 from Figure 25 successively the welding paste 112 that scrapes off is filled into pattern hole 111a, 111a ... in, on substrate 110 printing welding paste 112.Therefore, owing to print serially, check, printing and inspection all can more effectively be carried out.Such structure is also applicable to the 4th embodiment.
In addition, mounting surface 1112c can form with mask used for printing 111B surface co-planar ground.If constitute like this, then when utilizing the second scraper plate 113B that the welding paste 112 of mounting after the inspection of mounting surface 1112c scraped off, can easily scrape off.
And,, can consider Figure 26, Figure 27, other embodiment shown in Figure 28 as other embodiment of contactless measuring method.
(the 6th embodiment)
As shown in figure 26, intensity detection portion 116 and bandpass filter 120 also can have a plurality of respectively.In this structure, the infrared ray absorbing that for example the specific wave number of bandpass filter 120A is made as metal oxide can received wave number, the infrared ray absorbing that the specific wave number of bandpass filter 120B is made as carboxylic acid can received wave number, but the amount of the metal oxide of analytical review object and can analyze the amount of carboxylic acid then.
(the 7th embodiment)
As shown in figure 27, also can constitute and between light-projecting portion 115 and mask used for printing 111 and on the optical axis of light-projecting portion 115, possess the rotary part 130 that contains a plurality of bandpass filter 120C.......This rotary part 130 only constitutes any bandpass filter 120C is disposed on the optical axis of light-projecting portion 115, and based on the instruction from handling part 117, by rotating the changeable bandpass filter 120C that is configured on the optical axis.
According to this structure,, can detect by welding paste 112 infrared rays reflection, that wave number has nothing in common with each other if the specific wave number of each bandpass filter 120C...... that rotary part 130 contained is had nothing in common with each other.Thus, by checking that once operation gets final product the amount of the metal oxide of analytical review object welding paste 112, the amount of carboxylic acid, the amount of carboxylate.
In addition, in each bandpass filter 120C...... of rotary part 130, also can be included in illustrate among the 3rd embodiment, see through ultrared optical filter with reference to wave number.In intensity detection portion 116, detect above-mentioned intensity (top four's degree) and the above-mentioned intensity (the 3rd intensity) from the infrared ray of checking the object reflection from the infrared ray of comparison other reflection with reference to wave number with reference to wave number.And in handling part 117, if calculate (61)～(64) formula, (71)～(78) formula, then exportable correction intensity is poor, correction intensity than, proofread and correct absorbance poor, proofread and correct the absorbance ratio.
(the 8th embodiment)
In addition, as other embodiment of contact measuring method, can consider other embodiment shown in Figure 28.
In the position configuration relative light-projecting portion 115, rotary part 130, intensity detection portion 116 are arranged, and dispose catoptron 140,145 with another face side among the mask used for printing 111B.Specifically, on the optical axis of light-projecting portion 115, the edge disposes rotary part 130, catoptron 140 successively from the direct of travel of the light of light-projecting portion 115.In addition, catoptron 140 is configured to and will reflects to the direction that sees through the 111c of portion via the light of rotary part 130 from light-projecting portion 115 irradiations.And catoptron 145 is configured to and will reflects from the direction of the light that sees through the 111c of portion to intensity detection portion 116.
According to this structure, the bandpass filter 120C that rotary part 130 is comprised only sees through the infrared ray of the specific wave number from the light that light-projecting portion 115 penetrates, and the infrared ray that sees through is to catoptron 140 guiding.Then, this infrared ray is reflected, and mirror 140 reflects and to the direction guiding that sees through the 111c of portion, arrive welding paste 112 via seeing through the 111c of portion.In addition, arrive the infrared reflection of welding paste 112, and via seeing through the 111c of portion to catoptron 145 guiding.Then, inject by these catoptron 145 reflections and to intensity detection portion 116 to the infrared ray of catoptron 145 guiding.Thus, in intensity detection portion 116, can detect infra-red intensity by welding paste 112 reflections.
The present invention is not limited to the respective embodiments described above, can carry out various changes in the scope of protection of present invention, and disclosed in the above-described embodiment each technological means of appropriate combination and the embodiment that obtains are also contained in the technical scope of the present invention.
The Japanese patent application (special permission 2005-337790) that the Japanese patent application that the application proposed based on November 15th, 2005 (special permission 2005-330281), on November 22nd, 2005 propose is quoted its content at this as reference.

Claims (14)

1. solder material inspecting device is characterized in that having:
The printing position obtains mechanism, and it obtains the printing position information of the scolder that prints on substrate;
Light source, it obtains the described printing position information that mechanism obtains based on described printing position, at enterprising line scanning of described substrate and the scolder irradiates light to printing on described substrate only;
Intensity detection portion, it detects the ultrared inspection object intensity by the specific wave number of coming from described light source irradiation light and from described scolder reflection,
The infrared absorbance and the described inspection object intensity of the described specific wave number in the inspection object scolder that will try to achieve based on described inspection object intensity are exported as the instrumentation value.
2. solder material inspecting device as claimed in claim 1 is characterized in that described light source is luminous off and on.
3. solder material inspecting device as claimed in claim 1 is characterized in that, the chopping mechanism that blocks with having the light break that will send from described light source.
4. solder material inspecting device is characterized in that having:
Light source, before reflow soldering, this light source scans and irradiates light the substrate that is printed with scolder at least;
Intensity detection portion, it detects by the infra-red intensity of the next specific wave number of the substrate reflection that is printed with described scolder from described light source irradiation light certainly, is instrumentation intensity;
The intensity extraction mechanism, its from the detected described instrumentation intensity of described intensity detection portion extract only detected from described scolder, as the ultrared inspection object intensity of catoptrical described specific wave number,
The infrared absorbance and the described inspection object intensity of the described specific wave number in the inspection object scolder that will try to achieve based on described inspection object intensity are exported as the instrumentation value.
5. solder material inspecting device as claimed in claim 4 is characterized in that having storage part, and the substrate irradiates light is also detected in advance from the infra-red intensity of the next described specific wave number of this substrate reflection, and this storage part is stored this intensity in advance as substrate intensity,
Described intensity extraction mechanism is extracted described inspection object intensity by obtaining described instrumentation intensity and difference in the described substrate intensity of described storage portion stores from described instrumentation intensity.
6. solder material inspecting device as claimed in claim 4, it is characterized in that having storage part, the scolder irradiates light is also detected in advance from the ultrared intensity of the next described specific wave number of this scolder reflection, described storage part is stored this intensity in advance as scolding tin intensity
Described intensity extraction mechanism by relatively being stored in described storage part described scolding tin intensity and the increase and decrease pattern of the signal of described instrumentation intensity extract described inspection object intensity.
7. solder material inspecting device as claimed in claim 1 is characterized in that having input part, this input part can specify in the scolder of described substrate printing, be the instrumentation subject area based on the sweep limit of described light source.
8. solder material inspecting device, inspection is filled in the described pattern hole by the scraper plate that overlaps the mask used for printing that has more than one pattern hole at least on the substrate and slide on this mask used for printing surface and is printed on the impairment grade of the scolder on the substrate, it is characterized in that having:
Test section, it detects described scraper plate and whether finishes described printing;
Light-projecting portion, behind the signal that is received described printing end by described test section, described light-projecting portion is to checking object scolder irradiates light;
Intensity detection portion, it detects the ultrared inspection object intensity of the specific wave number that reflects from described inspection object scolder by the described light of irradiation,
In the infrared absorbance of the described specific wave number in the described inspection object scolder that will try to achieve based on described inspection object intensity or the described inspection object intensity any is exported as the instrumentation value at least.
9. solder material inspecting device as claimed in claim 8, it is characterized in that, described solder material inspecting device is set the wave number different with described specific wave number promptly with reference to wave number, detects that the object scolder reflects by checking, described ultrared inspection object with reference to wave number with reference to intensity in described intensity detection portion
Described solder material inspecting device corresponding to as reflected light and detected, described ultrared comparison other with reference to wave number with reference to intensity and described inspection object difference degree with reference to intensity, to in described inspection object intensity or the described comparison other intensity any is proofreaied and correct at least, described reflected light is the reflected light when the comparison other scolder irradiates light for described inspection object scolder.
10. solder material inspecting device as claimed in claim 8 is characterized in that, described inspection object scolder is filled in the inspection hole in the described pattern hole.
11. solder material inspecting device as claimed in claim 8, it is characterized in that, when described mask used for printing overlaps on the described substrate, compare described substrate, print direction with respect to described scraper plate forms more longways, and not being provided with the portion that sees through that makes light transmission with the overlapping part of described substrate, in the moment that described printing finishes, by described scraper plate mounting the object of inspection scolder is arranged in the described portion that sees through
After described test section received the signal of described printing end, the relative mounting of described light-projecting portion was in the described described inspection object scolder that sees through portion, from the rear side irradiates light of described mask used for printing.
12. solder material inspecting device as claimed in claim 11 is characterized in that, the described printing end position that is set in described scraper plate or described first scraper plate through portion.
13. solder material inspecting device as claimed in claim 11 is characterized in that, described face and the described mask used for printing surface co-planar that sees through the described inspection object of the mounting scolder of portion.
14. solder material inspecting device as claimed in claim 11 is characterized in that, the described portion that sees through is formed by prism.
CNA2006800426474A 2005-11-15 2006-11-09 Solder material inspecting device Pending CN101310172A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP330281/2005 2005-11-15
JP2005330281A JP2007139451A (en) 2005-11-15 2005-11-15 Inspection device of solder material, inspection method of solder material, control program of inspection device of solder material and recording medium having control program recorded thereon of inspection device of solder material
JP337790/2005 2005-11-22

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CN103384812A (en) * 2011-02-11 2013-11-06 株式会社Ｄｊｔｅｃｈ Printed solder inspection device
CN112630170A (en) * 2020-12-16 2021-04-09 贵州电网有限责任公司 Iron tower resistant steel welding solder composition detection device that waits
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JP2002350342A (en) * 2001-05-28 2002-12-04 Advantest Corp Method and apparatus for measuring surface state
AU2003261884A1 (en) * 2002-09-03 2004-03-29 Hamamatsu Foundation For Science And Technology Promotion Pattern inspection method and inspection device therefor
JP4549662B2 (en) * 2003-12-04 2010-09-22 パナソニック株式会社 Solder inspection apparatus and solder inspection method

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CN103384812A (en) * 2011-02-11 2013-11-06 株式会社Ｄｊｔｅｃｈ Printed solder inspection device
CN103384812B (en) * 2011-02-11 2017-07-21 名古屋电机工业株式会社 Printing solder check device
CN112630170A (en) * 2020-12-16 2021-04-09 贵州电网有限责任公司 Iron tower resistant steel welding solder composition detection device that waits
CN115156651A (en) * 2022-04-29 2022-10-11 深圳市汇北川电子技术有限公司 Laser welding method for copper bar of electronic device

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