JP2007139451A - Inspection device of solder material, inspection method of solder material, control program of inspection device of solder material and recording medium having control program recorded thereon of inspection device of solder material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device of a solder material which suppresses the labor or time of work required for inspecting the deterioration degree of the solder material, is preferable from an aspect of working sanitation and has higher measuring precision, and an inspection method of the solder material. <P>SOLUTION: Only the cream solder 3 printed on a substrate 2 is irradiated with light while scanning the surface of the substrate 2 on the basis of the printing position data acquired by a printing position acquiring means of CAD data or the like before an electronic component is mounted on the substrate 2 and the inspection target intensity of infrared rays with a specific wave number reflected from the cream solder 3 by irradiation with light is detected. The cream solder 3 printed on the substrate 2 is set as an inspection target, and the deterioration parameter showing the relative deterioration degree of the cream solder 3 being an inspection target with respect to the cream solder 3 of a comparative target is calculated on the basis of the relative target intensity of infrared rays with a specific wave number detected as reflected light when the cream solder 3 of the comparative target with respect to the inspection target is irradiated with light and the intensity of the inspection target. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a device for inspecting the degree of deterioration of a solder material and a method for inspecting the degree of deterioration of a solder material.

  In a printed circuit board (hereinafter simply referred to as “substrate”) production line, a printing process for printing a solder material on the board, a mounting process for mounting an electronic component on the printed solder material, and soldering the electronic component to the board An electronic component is mounted on the substrate by performing a reflow process.

  This printing process is as follows, for example. First, a metal mask is arranged on the substrate, and cream solder as a solder material is supplied to the surface of the metal mask. Next, a squeegee is brought into contact with the surface of the metal mask and slid. Then, the cream solder is pressed and rotated by the squeegee on the surface of the metal mask. Since a hole corresponding to the wiring pattern of the substrate is formed in the metal mask, the cream solder is pushed out of the hole by the pressing force of the squeegee, and the cream solder is printed on the substrate (paragraph [Patent Document 2] 0011]).

  Since this metal mask is generally used continuously on a large number of substrates with the same solder material placed thereon, the solder material is repeatedly rotated by a squeegee every time printing is repeated. . As a result, the solder material gradually deteriorates, but this deteriorated solder material becomes a factor causing defects in the substrate.

  Therefore, in order to prevent the occurrence of defects on the substrate and maintain the print quality in the printing process, the deterioration degree of the solder material on the metal mask is analyzed, and when the deterioration degree of the solder material becomes high, The work of replacing the solder material is very important.

  It is known that the solder material such as the solder material has a high viscosity as it deteriorates, and the oxidation proceeds and the reducing power decreases. For example, if a solder material with a high viscosity is printed on the substrate, defects such as “debris” and “scratch” are likely to occur on the substrate after the printing process, and if the solder material that has undergone oxidation is printed on the substrate, the reflow process Defects such as “solder balls” and “solder insoluble” are likely to occur on the substrate afterwards, and if solder material with reduced reducing power is printed on the substrate, defects such as “wetability degradation” on the substrate after the reflow process It is known that this is likely to occur.

  As described above, since the viscosity, oxidation degree, and reducing power of the solder material are correlated with the degree of occurrence of defects in the substrate, the viscosity, oxidation degree, and reducing power are important indicators for evaluating the degree of deterioration of the solder material. .

  As a method of analyzing the degree of deterioration of the solder material, for example, as described in Patent Document 1, titration is performed using a sampled solder material, and the acid value of the solder material (flux) is measured, that is, a substrate There is an analysis method based on so-called off-line measurement in which the measurement is performed outside the production line. However, this method requires adjustment of reagents and the like, and there is a problem that extra time and effort are required for measurement.

  On the other hand, in order to reduce unnecessary labor and time for this measurement, measurement for the inspection of the deterioration degree of the solder material is performed on the production line, that is, in-line measurement is enabled. There is also a method of analyzing the degree of deterioration of the solder material as described in 3.

  In this patent document 2, the viscosity of the solder material is measured by irradiating a laser from a laser sensor to measure the flow rate of the solder material in the printing process on the substrate. A method is disclosed. However, the method described in Patent Document 2 has a problem that measurement variation due to the drive state of the squeegee is large.

  On the other hand, Patent Document 3 discloses a technique for measuring the surface oxidation rate of a solder material using ultraviolet photoelectron spectroscopy in an environment close to an actual production process. As described in Patent Document 2, squeegee driving is disclosed. However, this method is not preferable in terms of work hygiene because it uses ultraviolet rays that are harmful to the human body.

Japanese Patent Publication No. 08-20434 (Publication date: March 04, 1996) JP 05-99831 A (publication date: April 23, 1993) Japanese Patent Laid-Open No. 10-82737 (Publication date: March 31, 1998)

  The present invention has been made to solve the above-mentioned problems, and the object thereof is to suppress labor and time for the work required for the inspection, which is preferable in terms of work hygiene, and has a higher measurement accuracy. An object is to provide an apparatus and a solder material inspection method.

  In order to achieve the above object, the solder material inspection apparatus of the present invention includes a print position acquisition unit that acquires print position information of a solder material printed on a substrate, and the print position information acquired by the print position acquisition unit. A light source that emits light only to the solder material printed on the substrate while scanning on the substrate, and an infrared ray of a specific wave number that is reflected from the solder material by irradiation of light from the light source An intensity detector that detects the intensity of the inspection object, and outputs the infrared absorbance of the specific wave number of the solder material to be inspected based on the intensity of the inspection object and the intensity of the inspection object as measurement values. It is characterized by doing.

  Further, the solder material inspection apparatus according to the present invention includes a print position acquisition unit that acquires print position information of a solder material printed on the substrate, and the substrate based on the print position information acquired by the print position acquisition unit. A light source that irradiates light only to the solder material printed on the substrate while scanning above, and an inspection target intensity of infrared of a specific wave number that is reflected from the solder material by irradiation of light from the light source. Comparison between the detected intensity detector and the infrared light of the specific wave number detected as reflected light when the solder material printed on the substrate is an inspection object and the solder material to be compared with the inspection object is irradiated with light A solder deterioration calculation unit that calculates a deterioration parameter indicating a relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared based on the target strength and the inspection target strength. And features.

  Solder material deteriorates due to increased viscosity due to repeated printing and chemical reactions during storage, and this deteriorated solder material causes defects in the board. Therefore, it is possible to accurately inspect the degree of deterioration of the solder material. This is important for preventing the occurrence of defects in the substrate and maintaining the printing quality in the printing process.

  Therefore, the inventor of the present application preferably uses the solder material actually printed on the board as the inspection target as the time when the solder material deterioration degree is inspected as close to reflow as possible. I thought it was suitable. Here, in order to inspect the deterioration degree of the solder material actually printed on the board, it was considered preferable to use a so-called non-contact measurement method in which the solder material is inspected by irradiating light. On the other hand, the method using ultraviolet rays as in Patent Document 3 is not preferable in terms of work hygiene. Accordingly, the inventor of the present application pays attention to the fact that the infrared spectroscopy can be used to analyze the viscosity, oxidation degree, and reducing power of the solder material and decide to analyze the deterioration degree of the solder material. .

  However, since the surface of the board and mounted components is made of resin, resist, etc., simply irradiating light onto the board on which the solder material is printed, these infrared spectra are integrated as noise, and as a result This causes a problem that the measurement accuracy is lowered.

  Therefore, in order to solve the problem, in the present invention, based on the print position acquisition unit that acquires the print position information of the solder material printed on the substrate, and the print position information acquired by the print position acquisition unit, A light source that emits light only to the solder material printed on the substrate, and configured to irradiate light only to the solder material printed on the substrate, so that the noise is not picked up and measured. It was decided to improve accuracy.

  Here, the printing position acquisition means is drawing data used at the time of manufacturing a metal mask or a substrate used at the time of printing a solder material, such as CAD data. For example, when the CAD data of the metal mask is used as the printing position acquisition means, the arrangement of the metal mask holes (openings), the dimensions of the openings, and the like are input as data. If the data is used, the printing position of the solder material on the substrate can be specified. Further, since the positioning mark for normal alignment is provided on the substrate and the metal mask, the printing position information is preferably the coordinates with the positioning mark as the origin, the dimension of the opening, and the like.

  The light source is a lamp that emits light. For example, a ceramic light source is used. In the present invention, the light source is configured to emit light while scanning on the substrate. Here, scanning means that the light source moves on the substrate while irradiating light. In the present invention, the light source irradiates only the solder material printed on the substrate while irradiating light on the substrate. Configured to move. As a configuration for irradiating light only to the solder material, for example, the light source is controlled to emit light intermittently, or the light source itself is configured to emit light continuously. If a light blocking means for intermittently blocking the light emitted from the light source is provided, as a result, only the solder material printed on the board can be irradiated with light. In addition, the light shielding means may be configured by an open / close shutter, in which light is irradiated in the open state and light is shielded in the closed state.

  Moreover, in this invention, you may make it have an input part which can designate the measurement object area which is the range of the scanning by a light source among the solder materials printed on the board | substrate. This measurement target area is configured to be arbitrarily settable by the person to be inspected.

  In the present invention, the degradation degree of the solder material is analyzed by analyzing the viscosity, oxidation degree, and reducing power of the solder material using infrared spectroscopy. A good solder material has low viscosity, low oxidation degree, and high reducing power. However, when the solder material deteriorates, the viscosity and oxidation degree become high and the reducing power becomes low. Therefore, analyze at least one of these items. This is because the inventors of the present application have considered that the degree of deterioration of the solder material can be determined.

  The reason why the viscosity, oxidation degree, and reducing power of the solder material can be analyzed by this infrared spectroscopy is as follows.

  When the solder material is continuously used and exposed to the outside air, the contained metal is oxidized and the contained acid (for example, carboxylic acid) is converted into a salt. That is, in the solder material, the contained metal oxide increases, the acid content decreases, and the salt content increases. Note that the metal oxide is also called a metal oxide.

  The solder material has a higher degree of oxidation due to the increase in the metal oxide, a higher viscosity due to an increase in the salt, and a reduction power due to a decrease in the acid content.

  Therefore, in the solder material to be inspected, if the content of metal oxide, the content of acid and salt can be analyzed, the viscosity, oxidation degree, and reducing power of the solder material can be inspected. The degree of deterioration of the solder material can be inspected. That is, the content of metal oxide, the content of acid, and the content of salt in the solder material indicate the degree of deterioration (viscosity, oxidation degree, reducing power) of the solder material.

  Therefore, the inventors of the present application pay attention to the fact that it is possible to analyze at least one item of the content of metal oxides, acids, and salts according to infrared spectroscopy, leading to the realization of the present invention. It was.

  The amount of infrared rays absorbed at a specific wave number in the solder material changes according to the content of metal oxide, acid, and salt in the solder material, and as a result, the intensity of the specific wave number of infrared rays reflected from the solder material changes. This is because the metal oxide, acid, and salt contained in the solder material have the property of absorbing infrared rays in the wave number band specified in each.

  Therefore, for example, a solder material (for example, a new solder material, a solder material used 100 times, etc.) different from the state (degradation level) of the solder material to be inspected is compared, and the specific wave number reflected from each detected. Based on the intensity of the infrared rays (inspection strength, comparison strength), the relative content of metal oxides, acids, and salts in the solder material to be tested can be analyzed relative to the solder material to be compared. It is possible to relatively inspect the viscosity, oxidation degree, and reducing power of the solder material to be inspected. Therefore, the degree of deterioration (viscosity, degree of oxidation, reducing power) of the solder material to be inspected can be relatively inspected with respect to the solder material to be compared. This content indicates the degree of deterioration (viscosity, oxidation degree, reducing power) of the solder material. The comparison target intensity can be detected by, for example, the same method as the inspection target intensity, and this comparison target intensity may be detected in the same manner when detecting the inspection target intensity. It is also possible to detect it in advance and store it in the storage means.

  The relative content is output as a deterioration parameter indicating the relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared. Accordingly, the user of this apparatus can analyze the relative content of the solder material to be inspected with respect to the solder material to be compared based on the output deterioration parameter, and the solder material to be inspected with respect to the solder material to be compared can be analyzed. The relative deterioration degree can be inspected.

  The light applied to the solder material may be infrared light having the specific wave number or light including infrared light having the specific wave number.

  According to the present invention described above, since the titration work as disclosed in Patent Document 1 is unnecessary, it is possible to suppress the labor of the work compared to the method of Patent Document 1, and higher than the method of Patent Document 2. Since accurate measurement is possible and ultraviolet rays are not used, it is more preferable in terms of work hygiene than the method of Patent Document 3.

  Further, in the present invention, it is only necessary to analyze at least one item of the content of metal oxide, acid, and salt, and therefore the specific wave number is absorbed by at least one of metal oxide, salt, and acid contained in the solder material. The wave number included in the infrared wave number band may be used.

  For example, examples of the metal oxide include tin oxide and lead oxide. Moreover, since the carboxylic acid is mentioned as an acid with much content among the acids contained in a solder material, it is preferable that it is a carboxylic acid as said acid. Further, among the salts contained in the deteriorated solder material, a carboxylate is exemplified as a salt having a high content, and therefore, the salt is preferably a carboxylate.

Also, the wave number the particular wave number ^{is, 520cm -1 ~700cm -1, 1270cm -1} ~1430cm -1, 1500cm -1 ~1650cm -1, is included in at least one range of the range of 1665cm ^-1 ~1730cm -1 It may be.

Additional tin oxide, lead oxide ^is because has a property to absorb an infrared ray at 520cm ^-1 ~700cm -1, carboxylic ^acid, a property to absorb an infrared ray at 1665cm ^-1 ~1730cm -1 It is because it has. Further, ^carboxylate, because has a property to absorb 1270cm ^-1 ~1430cm ^-1, the infrared 1500 cm -1 1650 cm ^-1.

  The deterioration parameter may be output by a procedure for obtaining a difference between the inspection object strength and the comparison object strength or a procedure for obtaining a ratio.

  The difference or ratio is a parameter indicating the difference in infrared absorption at the specific wave number between the solder material to be inspected and the solder material to be compared. That is, according to this difference or ratio, it is possible to analyze the difference in the content of metal oxide, carboxylic acid, and carboxylate between the solder material to be compared and the solder material to be inspected. This is because it is possible to relatively inspect the viscosity, oxidation degree, and reducing power of the solder material to be inspected, and to relatively inspect the deterioration degree (viscosity, oxidation degree, reducing power) of the solder material to be inspected.

  There may be a slight difference between the intensity of the infrared rays contained in the light irradiated to the comparison target and the intensity of the infrared rays contained in the light irradiated to the inspection target. In this case, this difference is detected. It is included in the difference between the inspection target strength and the comparison target strength.

  Therefore, the solder material inspection device sets a reference wave number that is a wave number different from the specific wave number, and the intensity detection unit further determines the third intensity of the infrared light of the reference wave number that reflects the solder material to be inspected. And the solder deterioration calculating unit further detects the fourth intensity of the infrared wave having the reference wave number detected as reflected light when the solder material to be compared with the solder material to be inspected is irradiated with light. It is preferable to correct at least one of the inspection object strength and the comparison object strength according to the degree of difference from the three strengths.

  In addition, the deterioration parameter is the first infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the strength to be inspected, and the solder material in the comparative object obtained based on the strength to be compared. You may make it obtain | require by any one of the difference or ratio with the 2nd infrared rays absorbance of a specific wave number.

  The difference or ratio between the first infrared absorbance and the second infrared absorbance is a parameter indicating the difference in the infrared absorbance at the specific wave number between the solder material to be inspected and the solder material to be compared. Therefore, according to this difference or ratio, the difference in the content of metal oxide, carboxylic acid, and carboxylate between the solder material to be compared and the solder material to be inspected can be analyzed, and This is because it is possible to relatively inspect the viscosity, oxidation degree, and reducing power of the solder material to be inspected, and to relatively inspect the deterioration degree (viscosity, oxidation degree, reducing power) of the solder material to be inspected.

  There may be a slight difference between the intensity of the infrared rays contained in the light irradiated on the comparison target and the intensity of the infrared rays contained in the light irradiated on the inspection target. In this case, this difference is detected. It is included in the difference between the inspection object intensity and the comparison object intensity, and is included in the difference between the first infrared absorbance and the second infrared absorbance.

  Therefore, a reference wave number that is a wave number different from the specific wave number is set, and the intensity detection unit further detects the third intensity of infrared light of the reference wave number that reflects the solder material to be inspected, and calculates the solder deterioration. The unit further obtains a third infrared absorbance of the reference wave number in the solder material to be inspected based on the third intensity, and irradiates light to the solder material to be compared with the solder material to be inspected. Based on the fourth intensity of the infrared of the reference wave number detected as reflected light, the fourth infrared absorbance of the reference wave number in the solder material to be inspected is obtained, and the third infrared absorbance and the fourth infrared absorbance are calculated. It is preferable to correct at least one of the first infrared absorbance and the second infrared absorbance according to the degree of difference.

  Further, in the solder material inspection apparatus of the present invention, before reflow, at least the substrate on which the solder material is printed is irradiated with light, and the solder material is printed by irradiating light from the light source. An intensity detector that detects the intensity of infrared rays of a specific wave number reflected from the substrate, and the specific as reflected light that is detected only from the solder material from the measured intensity detected by the intensity detector An intensity extracting means for extracting the intensity of the infrared inspection object of the wave number, and measuring the infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the intensity of the inspection object and the intensity of the inspection object It is output as a value.

  Further, in the solder material inspection apparatus of the present invention, before reflow, at least the substrate on which the solder material is printed is irradiated with light, and the solder material is printed by irradiating light from the light source. An intensity detector that detects the intensity of infrared rays of a specific wave number reflected from the substrate, and the specific as reflected light that is detected only from the solder material from the measured intensity detected by the intensity detector Intensity extraction means for extracting the intensity of the infrared wave inspection object and the solder material printed on the substrate as the inspection object, and detected as reflected light when light is irradiated to the solder material to be compared with the inspection object A degradation parameter indicating a relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared based on the intensity to be compared with infrared light having the specific wave number and the strength to be inspected. Characterized in that it comprises a solder deterioration calculation unit for calculating a motor, a.

  In the present invention, similarly to the solder material inspection apparatus that inspects the deterioration degree of the solder material by irradiating light only to the above-described solder material, the solder material printed on the substrate is an inspection object, and infrared spectroscopy is performed. Is used to inspect the degree of deterioration of the solder material. However, light is not irradiated only to the solder material printed on the substrate, but light is continuously irradiated while scanning at least the substrate on which the solder material is printed, and the specific wave number as the reflected light is From the measured intensity, which is the intensity of infrared rays, the inspection object intensity of infrared rays having a specific wave number as reflected light detected only from the solder material is extracted.

  For example, a case is assumed where light is irradiated while scanning a certain range on the substrate, and the intensity of infrared light having a specific wave number as the reflected light is detected. In this range, if the electronic component is mounted on the substrate via the solder material, when light is irradiated while scanning, not only the reflected light from the solder material but also the reflected light from the electronic component is emitted from the substrate. Reflected light is also included, and the intensity detection unit detects the intensity of infrared light having a specific wave number including all of the reflected light. It is extremely difficult to inspect the degree of deterioration of the solder material by using the detected intensity as it is, but in this detected intensity, infrared of a specific wave number as reflected light detected only from the solder material is included. Therefore, if the inspection object strength can be extracted, the deterioration degree of the solder material can be easily inspected. Therefore, in the present invention, there is provided intensity extracting means for extracting the inspection target intensity of the infrared of a specific wave number as reflected light detected only from the solder material from the detected measurement intensity. In addition, by providing this strength extraction means, it is possible to inspect the solder material printed on the board on which the electronic component is mounted, so that it can be inspected immediately before reflow, resulting in measurement accuracy. Will be improved.

  As a method for extracting the inspection object intensity, for example, the substrate is irradiated with light, the intensity of infrared of a specific wave number reflected from the substrate is detected, and the intensity is stored in advance as the substrate intensity. The intensity extracting means may extract the inspection object intensity by taking a difference between the measured intensity and the substrate intensity stored in the storage unit. This substrate may be a substrate on which a solder material to be inspected is printed, or may be another substrate, as long as it can detect the intensity of infrared rays having a specific wave number reflected only from the substrate.

  Furthermore, it has a storage unit that irradiates light to the solder material, detects the intensity of the infrared of the specific wave number reflected from the solder material, and stores the intensity in advance as the solder strength. The extraction means may extract the inspection object intensity by comparing the increase / decrease pattern of the solder intensity and the measurement intensity signal stored in the storage unit. This soldering material is used to see what pattern the intensity signal of the infrared wave reflected at the specific wave number reflected when the soldering material is irradiated with light. A material may be used, but a solder material for comparison is preferable because the strength for comparison can be used. According to this method, the strength of the inspection object can be extracted even if an electronic component or the like is present on the substrate, and the inspection can be performed immediately before reflow, so that the measurement accuracy can be further improved. Further, the inspection object strength can be extracted without being affected by the deterioration of the substrate itself.

  As another method for extracting the intensity of the inspection object, the intensity detector detects the total measured intensity, which is the intensity of infrared rays reflected from the printed circuit board by the irradiation of light from the light source, and extracts the intensity. By means, the intensity of the reference wave number, which is a wave number other than the specific wave number, is compared with a predetermined threshold value out of all the measured intensity values detected by the intensity detection unit. At the same time, the inspection target intensity of infrared rays having a specific wave number may be extracted from the solder intensity. Since the solder material reflection luminance is extremely lower than the substrate reflection luminance, the inspection object intensity can be extracted also by this method. For example, the threshold value is obtained by measuring the intensity of the reflected light of the reference wave number of the solder material and the intensity of the reflected light of the reference wave number of the board, and distinguishing the intensity of the reflected light of the solder material and the intensity of the reflected light of the board. What is necessary is just to obtain | require beforehand as a possible value and to set to a memory | storage means etc. previously.

  In addition, as another method of extracting the inspection object intensity, instead of using the reflected light intensity of the reference wave number, the total of the reflected light intensity of the specific wave number is used, and the threshold value is similarly obtained by experiments and the like. Similarly, the intensity of the reflected light of the solder material may be extracted. In addition, using the average value of all the measured intensities instead of the intensity of the reflected light of the reference wave number, the threshold value is obtained by experiment or the like in the same manner, and the reflected light intensity of the solder material is similarly extracted from the threshold value. May be.

  Moreover, you may make it have an input part which can designate the measurement object area which is the range of the scanning by the said light source among the solder materials printed on the said board | substrate.

  The solder deterioration calculation unit may be realized by a computer. In this case, a control program for realizing the solder deterioration calculation unit by a computer, and a computer-readable recording medium storing the control program Falls within the scope of the present invention.

  The solder material inspection method of the present invention acquires print position information of a solder material to be printed on a substrate, and prints on the substrate while scanning the substrate based on the acquired print position information. The inspection object obtained by irradiating light only to the solder material, detecting the intensity of the infrared inspection object reflected at the specific wave number reflected from the solder material by the light irradiation, and obtaining the inspection object intensity The infrared absorbance of the specific wave number in the solder material and the intensity of the inspection object are output as measured values.

Further, the solder material inspection method of the present invention acquires the printing position information of the solder material printed on the substrate,
Based on the acquired print position information, the light is irradiated only to the solder material printed on the substrate while scanning on the substrate, and the light reflected from the solder material by the light irradiation is specified. The specific wave number detected as the reflected light when detecting the intensity of the infrared wave inspection object, the solder material printed on the substrate as the inspection object, and irradiating the comparison target solder material with light. A deterioration parameter indicating a relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared is calculated based on the comparison target strength of the infrared rays and the inspection target strength.

  The solder material inspection method of the present invention can be realized by a solder material inspection apparatus that inspects the degree of deterioration of the solder material by irradiating light only to the above-described solder material, and the details are the same as described above. is there.

  In addition, the solder material inspection method of the present invention irradiates light while scanning at least a substrate on which a solder material is printed before reflowing, and the light is reflected from the substrate on which the solder material is printed. Detecting the measurement intensity which is the intensity of the infrared of the specific wave number, and extracting the intensity of the inspection object of the infrared of the specific wave number as the reflected light detected only from the solder material from the detected measurement intensity, The infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the target strength and the strength to be inspected are output as measured values.

  In addition, the solder material inspection method of the present invention irradiates light while scanning at least a substrate on which a solder material is printed before reflowing, and the light is reflected from the substrate on which the solder material is printed. A measurement intensity which is an intensity of an infrared ray having a specific wave number is detected, and an inspection target intensity of the infrared ray having the specific wave number as reflected light detected only from the solder material is extracted from the detected measurement intensity, and the substrate The solder material printed on the test object is a test object, and the comparison target intensity of the infrared of the specific wave number detected as reflected light when the target solder material for the test object is irradiated with light, and the test target intensity Based on the above, a deterioration parameter indicating a relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared is calculated.

  The solder material inspection method of the present invention is configured to continuously irradiate light while scanning the above-described substrate, and extract an inspection target intensity of infrared having a specific wave number as reflected light detected only from the solder material. This can be realized by the solder material inspection apparatus, and the details thereof are the same as described above.

  As described above, in the present invention, based on the printing position information, light is irradiated only to the solder material printed on the substrate while scanning on the substrate, and the infrared wave to be inspected with a specific wave number reflected therefrom. The intensity was detected. Thereby, since in-line measurement is possible, it is possible to reduce the labor and time required for the inspection, and it is possible to bring the measurement time closer to the reflow process, thereby improving the measurement accuracy. Furthermore, the infrared absorbance at a specific wave number in the solder material to be inspected obtained based on the strength to be inspected and the intensity to be inspected are output as measured values, that is, using infrared spectroscopy and measuring ultraviolet rays. Is not used, which is preferable in terms of work hygiene.

  Further, in the present invention, at least the board on which the solder material is printed is irradiated with light while scanning, and the intensity of the infrared ray having a specific wave number reflected from the board on which the solder material is printed by this light irradiation. A certain measurement intensity is detected, and the inspection target intensity of the infrared of the specific wave number as the reflected light detected only from the solder material is extracted from the detected measurement intensity. As a result, the solder material printed on the board on which the electronic component is mounted can also be inspected, so that the inspection can be performed immediately before the reflow, and as a result, the measurement accuracy is further improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, cream solder is used as the solder material, but the present invention is not limited to this.

[Example 1]
In the solder material inspection apparatus of the present embodiment, the printing of cream solder on the substrate using the metal mask is completed, and the electronic mask is mounted on the substrate after the metal mask is removed from the substrate. On the other hand, light is intermittently irradiated to inspect the deterioration degree of the solder material. Hereinafter, a detailed description will be given with reference to FIGS.

  FIG. 1 is a schematic configuration diagram for explaining the configuration of a solder material inspection apparatus according to the present invention, FIG. 2 is a block diagram thereof, and FIG. 3 is a conceptual diagram showing a light emission pattern of a light source.

  The solder material inspection apparatus 1 of the present invention includes a moving unit 10, an infrared spectroscopic measurement unit 20, a storage unit 30, an input unit 40, a control unit 50, a solder deterioration calculation unit 60, and an output unit 70.

  The moving unit 10 includes an X stage 11 and a Y stage 12. The X stage 11 is configured to be able to advance and retreat in the X-axis direction in the figure, and the substrate 2 on which the cream solder 3 is printed is positioned and placed with reference to the positioning marker origin (0, 0). The Y stage 12 is disposed above the X stage 11 and is provided in a state where the following infrared spectroscopic measurement unit 20 is suspended. The infrared spectroscopic measurement unit 20 extends in the Y-axis direction in the figure. It is configured to be able to advance and retreat.

  The infrared spectroscopic measurement unit 20 includes a light source 21 and an intensity detection unit 22. The light source 21 is a lamp that irradiates the cream solder 3 printed on the substrate 2 with light, and for example, a ceramic light source is used. In the present embodiment, the light emitted from the light source 21 is configured to be applied only to the cream solder 3 printed on the substrate 2 and is controlled by the control unit 50 by a method as will be described later. It is designed to be irradiated intermittently. Another method is also conceivable as a method of irradiating only the cream solder 3 with the light source 21. For example, the light source 21 continuously irradiates light, and is provided with light shielding means such as an opening / closing shutter (not shown) that can shield the light from the light source 21, and the opening / closing of the opening / closing shutter is controlled by the control unit 50. If the light is irradiated and the light is blocked when closed, as a result, only the cream solder 3 is irradiated with light.

  The light emission pattern of the light source 21 will be described with reference to FIG. 3. FIG. 3A is an enlarged view of the measurement target area A part of FIG. 1, and FIG. It is the conceptual diagram which showed the -OFF state. As shown to Fig.3 (a), the light source 21 is scanned with respect to the measurement object area A from the cream solder 3-1 to the cream solder 3-7 in order. Then, when the light source 21 is positioned on the cream solder 3-1, the light source 21 is in the state L1 (ON state) as shown in (b), and the cream solder 3 is irradiated with light. On the other hand, when the light source 21 is located between the cream solder 3-1 and the cream solder 3-2, the light source 21 is in the state L2 state (OFF state) as shown in FIG. The cream solder 3 is not irradiated. Note that the light irradiation by the light source 21 is preferably performed before the electronic component or the like is mounted on the substrate 2.

  On the other hand, the intensity detection unit 22 is an infrared sensor, detects the intensity of incident infrared rays, generates an analog signal (light reception signal) indicating the intensity of the detected infrared rays, and transmits the analog signal to the storage unit 30. It is configured as follows. Examples of the intensity detection unit 22 include an infrared sensor using a thermal element such as a pyroelectric element or a thermopile or a quantum element such as MCT (photoconductive element, HgCdTe).

  The storage unit 30 includes a ROM (Read Only Memory), a RAM (Read Access Memory), and the like, and is configured to be able to store the CAD data of the substrate 2 or the metal mask, the illumination light emission pattern, the measurement target area A, and the like. This CAD data is used to specify the measurement target area A and specify the light emission timing of the light source 21. For example, in this CAD data, the position coordinates and dimensions of the opening portion of the metal mask are input with the positioning mark P0 used when aligning the substrate 2 and the metal mask as a reference point. Gerber data used in a CAD system configured with the coordinates of lines and points, their dimensions, and their shapes may be stored.

The input unit 40 includes a keyboard, a mouse, a touch panel, or the like. Rather than inspecting all of the cream solder 3 printed on the substrate 2, the person who inspects the degree of deterioration of the cream solder 3 inputs the measurement target area A when the measurement target area A is arbitrarily selected and measured. It is configured to be possible.
As an input method, for example, when a printing part of the cream solder 3 on the substrate 2 is displayed on a display means such as a display and a range of the measurement target part is selected by dragging the mouse from the part, the part is the measurement target. A method of configuring the area A to be designated is conceivable. In addition, as a method of selecting the measurement target area A, various methods are conceivable, for example, by inputting coordinates using a keyboard or the like.

  The control unit 50 is configured to perform overall control, such as control of movement of the moving unit 10, reading of information from the storage unit 30, and light emission control of the light source 21, such as a hardware configuration such as a programmable controller, It may be configured by any software configuration such as a control program.

  The solder deterioration calculation unit 60 processes the analog signal sent from the intensity detection unit 22 of the infrared spectroscopic measurement unit 20, calculates the deterioration degree of the cream solder to be inspected, and transmits the calculation result to the storage unit 30. Is configured to do. For example, an analog / digital (A / D) converter that converts the analog signal into a digital signal and a computer that performs data processing based on the digital signal are included.

  The output unit 70 is a display panel that displays an image based on image data sent from the control unit 50 or a communication device that outputs measurement results to the outside.

  Next, the operation of the solder material inspection apparatus of this embodiment will be described with reference to FIGS. FIG. 4 is a sequence diagram when the light emission pattern of the light source and the measurement target area A are set in the solder material inspection apparatus of the present invention, and FIG. 5 is a sequence diagram when the solder material inspection apparatus of the present invention is in operation.

  First, the operation at the time of setting the illumination light emission pattern of the light source and the measurement target area will be described with reference to FIG.

  First, when the person to be inspected inputs the measurement target area A by the input unit 10 (S400), information related to the input measurement target area A (hereinafter referred to as “area information”) is transmitted to the control unit 50 ( The control unit 50 reads the metal mask CAD data stored in the storage unit 30 (S401). Next, the control unit 50 calculates an illumination light emission pattern from the read CAD data and the input area information (S402), and writes the illumination light emission pattern and area information calculated by this calculation in the storage unit 30 ( S403), the setting of the illumination light emission pattern and the measurement target area A is completed. For example, this light emission pattern can be calculated as follows. If the moving speed of the X stage 11 and Y stage 12 of the moving unit 10 is kept constant, the position and dimensions of the cream solder 3 in the measurement target area A are stored in advance in the area information. The moving distance of the unit 10 can be recognized. Therefore, the time required for the moving unit 10 to move on each cream solder 3-1, 3-2,... In FIG. 3 can be easily calculated from the moving speed and the moving distance. What is necessary is just to let the time required for 1 time of the irradiation of the light source 21 irradiated intermittently.

  Next, the operation at the time of operation of the solder material inspection apparatus of the present invention after the above setting will be described with reference to FIG.

  First, the control unit 50 reads the illumination light emission pattern and the area information written in the storage unit 30 by the setting operation (S500). For example, a configuration in which an inspection start button (not shown) is provided and the person who performs the inspection starts the reading process by operating the inspection start button can be considered. In addition, when the process at the time of setting is started, the process at the time of operation can be performed continuously with this process.

  Next, the control unit 50 issues a movement instruction signal to the measurement start position P1 (X0, Y0) to the movement unit 10 (S501), and the movement unit 10 that has received the movement instruction signal receives the infrared spectroscopy measurement unit 20. The X stage 11 and the Y stage 12 are moved so as to be positioned on the measurement start position P1 (X0, Y0) (S502). As the moving process of the moving unit 10, for example, the infrared spectroscopic measuring unit 20 places the moving origin of the X stage 11 and the moving stage of the Y stage 12 on the positioning marker P 0 (0, 0). The position is set in advance, and the X stage 11 and the Y stage 12 are moved so that the infrared spectroscopic measurement unit 20 is positioned on the positioning marker P0 (0, 0), thereby positioning the moving origin. Since the area information includes the position, size, shape and the like with the positioning marker P0 (0, 0) as the origin, the moving unit 10 moves based on this area information. When positioning the moving origin, if a camera (not shown) or the like is provided on the Y stage 12 so that the positioning marker P0 on the substrate 2 can be recognized by the camera, the substrate 2 on the X stage 11 is displaced. It is recommended to correct this.

  Next, the control unit 50 issues a light emission instruction to the light source 21 based on the illumination light emission pattern read from the storage unit 30 to the light source 21, and the infrared spectroscopic measurement unit 20 causes the measurement unit area A to be moved to the moving unit 10. A movement instruction is issued to scan the top (S503). Then, upon receiving the movement instruction, the moving unit 10 starts moving on the measurement target area A (S504), and the light source 21 emits light intermittently during the scanning based on the illumination light emission pattern. As a result, only the cream solder 3 printed on the substrate 2 is irradiated with light (S505). On the other hand, when the cream solder 3 is irradiated with light from the light source 21, infrared light is emitted as reflected light from the cream solder 3, and the intensity (inspection target intensity) of the infrared light is detected by the intensity detector 22. At the same time (S505), the detected data is transmitted to the storage unit 30 and continuously written into the storage unit 30 as measurement data (S506).

  When the scanning by the infrared spectroscopic measurement unit 20 is completed (S507), the control unit 50 reads the measurement data (inspection target intensity) written in the storage unit 30 and the comparison target intensity stored in advance and the comparison target intensity. Is read from the storage unit 30, and the read data is transmitted to the solder deterioration calculating unit 60 (S508, S509).

  Based on these data, the solder deterioration calculating unit 60 calculates the deterioration degree of the cream solder 3 in the measurement target area A by a method described later (S510), and the calculated deterioration degree of the cream solder 3 is calculated. The degradation degree data shown is transmitted to the storage unit 30. The transmitted deterioration degree data is written in the storage unit 30 (S511), read by the control unit 50, and the read deterioration degree data is processed and output by the output unit 70 (S512).

  In the present invention, the degradation degree of cream solder is analyzed by the following method using infrared spectroscopy. Hereinafter, various examples will be described.

  When the cream solder is continuously used and the cream solder is continuously exposed to the outside air, the contained metal is oxidized in the cream solder, and the contained carboxylic acid is converted into a carboxylate. That is, when cream solder is used or kept exposed to the outside air, the content of the metal oxide increases, the content of carboxylic acid decreases, and the content of carboxylate increases in the cream solder.

  The increase in the metal oxide increases the degree of oxidation of the cream solder, the increase in the carboxylate increases the viscosity of the cream solder, and the reduction of the carboxylic acid content decreases the reducing power of the cream solder. Occurs. This phenomenon is called cream solder deterioration.

  Therefore, if at least one of the content of the metal oxide, the content of the carboxylic acid, and the content of the carboxylate can be analyzed in the cream solder to be inspected, at least one of the viscosity, the degree of oxidation, and the reducing power of the cream solder. Can be inspected, and thus the degree of deterioration of the cream solder can be inspected.

  On the other hand, each of the metal oxide, carboxylic acid, and carboxylate is known to absorb infrared rays of a specific wave number band specified in each.

  Therefore, the analysis of the degree of deterioration of the cream solder is realized by combining the following steps. First, by irradiating light to the cream solder to be inspected, the intensity of the infrared inspection object having a specific wave number reflected from the cream solder to be inspected is detected. Next, the comparison target intensity of the infrared of the specific wave number that reflects the comparison target cream solder is detected by irradiating the comparison target cream solder with the light. And based on each detected intensity | strength, the deterioration degree of the cream solder of the said test object with respect to the said comparison object is test | inspected relatively. Note that the detection order strength detection and the comparison target strength detection may be performed in reverse order or simultaneously. Also, the comparison target intensity can be detected in advance and stored in a storage means (not shown).

  If it carries out as mentioned above, the test object intensity | strength of the specific wave number of the infrared rays reflected from the cream solder of a test object and the comparison object intensity | strength of the specific wave number of the infrared rays reflected from the cream solder of a comparison object can be detected.

  Here, as described above, each of the metal oxide, the carboxylic acid, and the carboxylate salt absorbs infrared rays in a specific wave number band specified in each. Therefore, depending on the content of the metal oxide, carboxylic acid, and carboxylate in the cream solder, the amount of infrared absorption at a specific wave number in the cream solder changes, and the intensity of the specific wave number infrared that reflects the cream solder changes. .

  Therefore, based on the strength of the test object and the strength of the comparison object detected by the above method, the content of the metal oxide, the content of carboxylic acid, At least one of the contents can be relatively analyzed. Therefore, the degradation degree of the cream solder to be inspected can be relatively inspected with respect to the cream solder to be compared.

  In addition, as a method of this inspection, (a) a procedure for obtaining a difference between the inspection object intensity and the comparison object intensity, (b) a procedure for obtaining a ratio between the inspection object intensity and the comparison object intensity, (c) the above The first infrared absorbance of the specific wave number in the cream solder to be inspected is obtained from the strength of the test object, the second infrared absorbance of the specific wave number in the cream solder of the comparison object is obtained from the intensity of the comparative object, and the first infrared ray is obtained. A procedure for obtaining a difference between the absorbance and the second infrared absorbance, and (d) a procedure for obtaining a ratio between the first infrared absorbance and the second infrared absorbance.

  The difference or the ratio is a parameter indicating the difference in the infrared absorption amount of the specific wave number between the cream solder to be compared and the cream solder to be inspected. Therefore, by determining these parameters, it is possible to analyze the difference in the content of metal oxide, carboxylic acid, and carboxylate between the cream solder to be compared and the cream solder to be inspected. On the other hand, the viscosity, oxidation degree, and reducing power of the cream solder to be inspected can be relatively inspected, and the deterioration degree (viscosity, oxidation degree, reducing power) of the inspected cream solder can be relatively inspected. is there.

  Note that, in the inspection process, instead of obtaining such differences and ratios, the practitioner of the present invention according to the present embodiment simply compares the detected intensities and absorbances with respect to the comparison target. It is possible to relatively determine the degree of deterioration of the cream solder to be inspected.

  Further, different cream solders may be used as the inspection object and the comparison object, or the same cream solder may be used.

  Note that “use the same cream solder each” means, for example, a cream solder a in a new state as a comparison target, and the cream solder a in a state after use (after use in a substrate printing process) as an inspection target. This is the case. Further, the cream solder b having a printing count of 100 in the substrate printing process may be set as a comparison target, and the cream solder b having the printing count of 200 may be set as an inspection target.

  Next, an embodiment of a method for analyzing the degree of deterioration of the cream solder described above will be described.

  First, cream solder to be inspected in the present embodiment will be described. In this example, cream solder containing each substance shown in FIG. 7 as a component was used for the inspection. As shown in the figure, the cream solder of this example has 80 to 90% tin, 1 to 3% silver, less than 1% copper, 2 to 4% diethylene glycol monohexyl ether, 1 % 2-ethylene-1,3-hexanediol and 4-6% rosin.

The main component of the cream solder is a metal such as tin (Sn) or lead (Pb), but in the cream solder of this embodiment, tin is used as the metal as shown in FIG. In addition, as shown in FIG. 7, rosin (C ₁₉ H ₂₉ COOH) is used in the cream solder of this example as the carboxylic acid that is the main component that provides the reducing power in the cream solder.

  In this example, the cream solder shown in FIG. 7 was used as a comparison target, and the cream solder after being used in the substrate printing process was used as an inspection target. Hereinafter, the cream solder to be compared may be simply referred to as “comparison object”, and the cream solder to be inspected may be simply referred to as “inspection object”.

Here, with respect to the comparative and test object, respectively irradiated with infrared same intensity, it detects the intensity of the band of the ^{500cm -1 ~3000cm} -1 in infrared ray reflected the comparative (comparative strength) test was detected band intensity of ^{500cm -1 ~3000cm} -1 in the infrared ray reflected the target (inspection object intensity).

Furthermore, in this example, for each wave number, the infrared absorbance of the comparison target (second infrared absorbance) and the infrared absorbance of the test subject (first infrared absorbance) were calculated. In addition, as for the said light absorbency, the blank value (intensity in wave number h of irradiated infrared rays) corresponding to wave number h is set to BL, the intensity in wave number h of infrared rays reflected from a comparison object is set to A, and the wave number of infrared rays reflected from a test object The intensity at h is B,
Absorbance of infrared rays to be compared (absorbance corresponding to wave number h) A ′ = − log (A / BL) (1)
Absorbance of infrared ray to be inspected (absorbance corresponding to wave number h) B ′ = − log (B / BL) (2)
Can be calculated for each wave number.

  FIG. 6 is a spectrum chart showing the calculated absorbance. In the figure, the horizontal axis indicates the wave number of infrared rays (Wave Number), and the vertical axis indicates the absorbance of infrared rays.

  As shown in the figure, it is observed that there is a difference between the absorbance of the infrared ray to be compared and the absorbance of the infrared ray to be inspected.

Next, this difference was examined. Specifically, the difference was calculated for A ′ and B ′ corresponding to each wave number obtained in the above (1) and (2) as shown in equation (11). This difference is hereinafter referred to as “absorbance difference”.
Absorbance difference = B′−A ′ (11)
In other words, the absorbance difference here is obtained by subtracting the infrared absorbance of the comparison object from the infrared absorbance of the examination object, and indicates the difference between the infrared absorbance of the examination object and the comparison object. .

  FIG. 8 is a chart showing the relationship between the wave number of infrared rays and the absorbance difference corresponding to the wave number. That is, the chart of FIG. 8 shows an absorbance difference obtained by subtracting the absorbance of the comparison object from the absorbance of the examination object shown in the chart of FIG.

8, in the test object and the comparison object, 600 cm around ^-1, 1300 cm around ^-1, 1600 cm around ^-1, the absorbance around 1700 cm ^-1, it can be seen that a large difference is.

Specifically, 600 cm around ^-1, 1300 cm around ^-1, at 1600 cm ^-1, infrared absorbance of the test object is found to be higher than the infrared absorbance of the comparison object. It can also be seen that the infrared absorbance of the test object is lower than that of the comparison object in the vicinity of 1700 cm ⁻¹ .

Here, in the infrared spectrum chart, it is known that the absorption observed near 600 cm ⁻¹ is due to the vibration of the oxygen-metal bond in the metal oxide. Furthermore, the absorption observed at around 1300 cm ^-1 is due to the symmetric stretching vibration of carboxylic acid salt, the absorption observed at around 1600 cm ^-1 is to be due to the antisymmetric stretching vibration of carboxylate Are known. Furthermore, it is known that the absorption observed in the vicinity of 1700 cm ⁻¹ indicates absorption due to stretching vibration of a double bond in carboxylic acid.

Therefore, in the vicinity of 600 cm ⁻¹ , the infrared light absorbance of the inspection object is higher than that of the comparison object. Therefore, the inspection object contains a larger amount of metal oxide than the comparison object. It can be seen that the degree of oxidation is higher than the target.

Further, in the vicinity of 1300 cm ^-1 and near 1600 cm ^-1, who inspected, than compared, since the infrared-ray absorbance is high, in the test object, contains a large amount carboxylates than comparison It can be seen that the viscosity is higher than the comparison target.

Further, in the vicinity of 1700 cm ⁻¹ , since the infrared light absorbance of the inspection object is lower than that of the comparison object, the inspection object has less carboxylic acid than the comparison object, and the reducing power is lower than that of the comparison object. It turns out that it is low.

  Thus, in this embodiment, for each wave number of the infrared spectrum, the intensity of infrared rays that reflect the cream solder to be inspected (inspection intensity) and the intensity of infrared rays that reflect the cream solder to be compared (intensity to be compared) Thus, the infrared absorbance (first infrared absorbance) of the cream solder to be inspected and the infrared absorbance (second infrared absorbance) of the cream solder to be compared are obtained.

For each wave number of the infrared spectrum, an absorbance difference is obtained by subtracting the absorbance of the cream solder to be compared from the absorbance of the cream solder to be examined. Here, 600 cm around ^-1, 1300 cm ^-1, 1600 cm -1, referring to the absorbance difference at around 1700 cm ^-1, for comparison, containing of the metal oxide contained in the cream solder of the inspection object, carboxylic acid Content and carboxylate content can be relatively grasped.

  And, from the content of this metal oxide, it is possible to relatively grasp the degree of oxidation of the cream solder to be inspected, and from the content of carboxylic acid, it is possible to relatively grasp the reducing power of the cream solder to be inspected. From the salt content, the viscosity of the cream solder to be inspected can be relatively grasped.

  Next, a new solder cream solder is used as a comparison target, and each solder paste with 200, 400, 600, 800, 1000, and 1200 printings in the substrate printing process is used as an inspection target. The result analyzed by the method shown in the example is shown in FIG.

  FIG. 9A shows the relationship between the wave number of infrared rays and the difference in absorbance obtained by subtracting the absorbance of the cream solder to be compared from the absorbance of the cream solder to be tested corresponding to each wave number for each test object. It is a chart. The horizontal axis indicates the wave number of infrared rays, and the vertical axis indicates the difference in absorbance, which is the difference between the absorbance of the cream solder to be compared and the absorbance of the cream solder to be inspected.

From FIG. 9 (a), the higher the number of times of printing of the cream solder increases, 1300 cm ^-1 and around 1600 cm ^-1 absorbance around is high, absorbance around 1700 cm ^-1 is seen to be decreased. Thus, it can be seen that as the number of times of printing increases, the carboxylic acid in the cream solder decreases and the carboxylate salt increases. And it can be analyzed from the result of this increase in carboxylate that the viscosity of cream solder increases as the number of times of printing increases.

Actually, when the viscosity was measured for each inspection object, as shown in FIG. 9B, it was confirmed that the number of times the cream solder was printed and the viscosity of the cream solder had a positive correlation. Further, the infrared absorbance of cream solder near 1600 cm ⁻¹ and the viscosity of cream solder have a positive correlation, and the infrared absorbance of cream solder near 1700 cm ⁻¹ and the viscosity of cream solder have a negative correlation. It was also confirmed. This relationship is established because the carboxylic acid contained in the cream solder decreases as the number of times the cream solder is printed, and the absorption of infrared rays in the vicinity of 1700 cm ⁻¹ is reduced. This is because the amount of carboxylate increases and the absorption of infrared rays in the vicinity of 1600 cm ⁻¹ increases, and the viscosity increases as the carboxylate increases.

In addition, according to the embodiment shown above, the infrared absorbance of the cream solder to be inspected and the infrared absorbance of the cream solder to be compared are calculated, but the cream solder to be inspected can be calculated without calculating the absorbance. The content of the metal oxide, the content of the carboxylic acid, and the content of the carboxylate can be relatively grasped. Specifically, for each wave number of 500 cm to 3000 cm ⁻¹ , the intensity of infrared light that reflects the cream solder to be inspected and the intensity of infrared light that reflects the cream solder to be compared are detected. Then, at each wave number, the calculation of equation (21) is performed for each detected intensity.
Intensity difference = B−A (21)
A: Infrared intensity reflected from the comparison object B: Infrared intensity reflected from the inspection object Here, “intensity difference” refers to the intensity of the infrared light detected in the comparison object from the intensity of the infrared light detected in the inspection object. This is a difference between the intensity of the infrared ray detected in the inspection object and the intensity of the infrared ray detected in the comparison object.

^{Here, 600cm -1, 1300cm -1, 1600cm} -1, referring to the intensity difference of about 1700 cm ^-1, metal oxides inspected for comparison, carboxylic acid, infrared absorption differences carboxylate Can be grasped. Therefore, it is possible to relatively grasp the content of the metal oxide, the content of the carboxylic acid, and the content of the carboxylate contained in the cream solder to be inspected with respect to the comparison target.

  In addition, the difference in infrared absorbance between the comparison object and the inspection object can be grasped not by the above-described absorbance difference or intensity difference but also by the ratio of each absorbance or each intensity, and the metal oxide contained in the cream solder to be inspected Content, carboxylic acid content, and relative carboxylate content.

For example, for each wave number, an intensity ratio that is a ratio between the intensity of the infrared ray detected in the inspection object and the intensity of the infrared ray detected in the comparison object may be obtained by the following calculation.
Intensity ratio = B / A (31)
In addition, for example, for each wave number, an absorbance ratio that is a ratio of the absorbance of infrared rays in the inspection object to the absorbance of infrared rays in the comparison object may be obtained by the following calculation. In addition, about the calculation method of a light absorbency, it is the same as that of (1), (2) Formula.
Absorbance ratio = B ′ / A (41)
A ′: Absorbance of infrared rays to be compared B ′: Absorbance of infrared rays to be inspected In addition, according to the embodiment described above, each wave number of cream solders to be compared and inspected over 500 to 3000 cm ^−1. Each time, the intensity of infrared rays is detected, and the absorbance of the infrared rays and the absorbance difference, the absorbance ratio, the intensity difference, or the intensity ratio are calculated, but the intensity is detected only for infrared rays of a specific wave number, A procedure for calculating the absorbance, absorbance difference, and intensity ratio of the specific wave number or the intensity difference and intensity ratio may be used. Here, the particular wave number, metal oxide, carboxylic acid, at least one wave number infrared absorption is observed among the carboxylate, in the present ^{embodiment, 600cm -1, 1300cm -1, 1600cm} -1, 1700cm ^At least one of ^-1 .

  Further, the intensity of the light emitted from the light projecting unit 15 is uneven, and even if the comparison target and the inspection target are each irradiated with infrared rays using the same light projecting unit 15, the infrared rays are irradiated at different timings. In this case, there is a slight difference between the intensity of infrared light irradiated on the comparison target and the intensity of infrared light irradiated on the inspection target. This difference may adversely affect the intensity of the detected infrared light reflected from the cream solder.

  Therefore, it is preferable to perform correction when obtaining the above intensity difference, intensity ratio, absorbance difference, and absorbance ratio at a specific wave number. The procedure for obtaining the corrected intensity difference obtained by correcting the intensity difference, the corrected intensity ratio obtained by correcting the intensity ratio, the corrected absorbance difference obtained by correcting the absorbance difference, and the corrected absorbance ratio obtained by correcting the absorbance ratio will be described below.

First, a wave number other than the wave number band in which infrared absorption of a metal oxide, carboxylic acid, or carboxylate salt is observed and the intensity of reflected infrared light is different between a comparison object and an inspection object is set as a reference wave number (for example, 2929 cm ^{− 1} ) It is set in the cream solder inspection apparatus 1.

  And the intensity | strength of the said reference wave number in the infrared rays which reflected the comparison object and the intensity | strength of the said reference wave number in the infrared rays which reflected the test object are detected. Furthermore, the intensity | strength of the said specific wave number in the infrared rays which reflected the comparison object and the intensity | strength of the said specific wave number in the infrared rays which reflected the test object are detected.

Here, the intensity of the reference wave number (fourth intensity) in the infrared ray reflected from the comparison object is A _ref , the intensity of the reference wave number (third intensity) in the infrared ray reflected from the inspection object is reflected from B _ref , and the reflection object is reflected from the comparison object. The intensity of the specific wave number in infrared (comparative intensity) is A _tar , and the intensity of the specific wave in infrared reflected from the inspection object (inspection intensity) is B _tar .

In addition, the infrared absorbance (fourth infrared absorbance) of the reference wave number in the comparison target is A ′ _ref , the infrared absorbance of the reference wave number (third infrared absorbance) in the test subject is B ′ _ref , and the infrared of the specific wave number in the comparison subject. The absorbance (second infrared absorbance) is A ′ _tar , and the infrared absorbance (first infrared absorbance) of the specific wave number in the test object is B ′ _tar .

Each absorbance is calculated by the same method as in equations (1) and (2). That is, the intensity corresponding to the reference wave number corresponding to the reference wave number in the infrared ray irradiated to the comparison target is BL _ref , the intensity corresponding to the specific wave number in the infrared ray irradiated to the inspection object is BL _tar ,
A ′ _ref = −log (A _ref / BL _ref ) (61)
B ′ _ref = −log (B _ref / BL _ref ) (62)
A ′ _tar = −log (A _tar / BL _tar ) (63)
B ′ _tar = −log (B _tar / BL _tar ) (64)
Can be obtained.

Hereinafter, the corrected intensity difference, the corrected intensity ratio, the corrected absorbance difference, and the corrected absorbance ratio are
Correction intensity difference = (B _tar −B _ref ) − (A _tar −A _ref ) (71)
Correction intensity ratio = (B _tar −B _ref ) / (A _tar −A _ref ) (72)
Corrected absorbance difference = (B ′ _tar −B ′ _ref ) − (A ′ _tar −A ′ _ref ) (73)
Corrected absorbance ratio = (B ′ _tar −B ′ _ref ) / (A ′ _tar −A ′ _ref ) (74)
Can be obtained.

  As a result, even if there is a slight difference between the intensity of the infrared rays irradiated to the comparison object and the intensity of the infrared rays irradiated to the inspection object, the reference wave number corresponding to the above difference is obtained for each intensity and each absorbance. Since the intensity is subtracted, a corrected intensity difference, a corrected intensity ratio, a corrected absorbance difference, and a corrected absorbance ratio that almost eliminate this difference can be obtained.

Moreover, the corrected intensity difference, corrected intensity ratio, corrected absorbance difference, corrected absorbance ratio are
Correction intensity difference = (B _tar × A _ref / B _ref ) −A _tar (75)
Correction intensity ratio = (B _tar × A _ref / B _ref ) / A _tar (76)
Corrected absorbance difference = (B ′ _tar × A ′ _ref / B ′ _ref ) −A ′ _tar (77)
Corrected absorbance ratio = (B ′ _tar × A ′ _ref / B ′ _ref ) / A ′ _tar (78)
Can be obtained. In this method, A _ref / B _ref or A ′ _ref / B ′ _ref is used as a correction coefficient corresponding to the difference.

Furthermore, the particular wave number of each the above ^{(600cm -1, 1300cm -1, 1600cm} -1, 1700cm -1) is capable of numerical changes. That is, a particular wave ^{number, 600cm -1, 1300cm -1, 1600cm} -1, is not limited to 1700 cm ^-1, it is possible to set the scope of the particular wave number. This point will be specifically described.

First, as in the analysis in FIG. 9, cream solder in a new state is used as a comparison target, and each solder paste having a printing frequency of 200, 400, 600, 800, 1000, and 1200 in the substrate printing process is compared. As the test object, the absorbance difference was determined for each test object by the method shown in this example. The results are shown in FIGS. In FIG ^10, illustrates the absorbance differences at a wave number band of 520cm ^-1 ~700cm -1, ^11, shows the absorbance differences at a wave number band of 1270cm ^-1 ~1430cm -1, 12, shows the absorbance differences at a wave number band of 1500 cm ^-1 1650 cm ^-1, FIG. 13 ^shows the absorbance differences at a wave number band of 1665cm ^-1 ~1730cm -1.

Metal oxide contained in the solder paste While the absorption peak of the (tin dioxide) can be detected at around 600 cm ^-1, as shown in FIG. ^10, when focusing on 520cm ^-1 ~700cm -1, the absorbance of each inspection object The difference in difference can be distinguished, and if attention is paid to 557 cm ^{−1 to} 613 cm ⁻¹ , the difference in absorbance difference for each inspection object can be observed more remarkably. ^Therefore, if the specific wave number at least one of wave numbers between 520cm ^-1 ~700cm -1, it is possible to analyze the content of the metal oxide of each inspection object.

Moreover, although the absorption peak of the symmetrical stretching vibration of carboxylate is detected in the vicinity of 1300 cm ⁻¹ (strictly, 1323 cm ⁻¹ ), as shown in FIG. 11, if attention is paid to 1270 cm ^{−1 to} 1430 cm ^−1. , it can be distinguished difference in absorbance difference for each inspection ^object, if attention to 1282cm ^-1 ~1382cm -1, can be observed more conspicuously in difference in absorbance difference for each inspection object. ^Therefore, if at least one of wave numbers between 1270cm ^-1 ~1430cm -1 and the noticed wave number, it is possible to analyze the content of the carboxylate of each inspection object.

Further, the absorption peak of the antisymmetric stretching vibration of the carboxylate (strictly, 1590 cm ^-1) 1600 cm near ^-1 are detected, as shown in FIG. ^12, by focusing on the 1500 cm -1 1650 cm ^-1 For example, the difference in absorbance difference for each inspection object can be distinguished. If attention is paid to 1562 cm ^{−1 to} 1624 cm ⁻¹ , the difference in absorbance difference for each inspection object can be observed more remarkably. ^Therefore, if at least one of wave numbers between 1500 cm -1 1650 cm ^-1 and the noticed wave number, it is possible to analyze the content of the carboxylate of each inspection object.

Furthermore, although the absorption peak of the carbon-oxygen double bond of carboxylic acid is detected in the vicinity of 1700 cm ⁻¹ , as shown in FIG. 13, if attention is paid to 1665 cm ^{−1 to} 1730 cm ⁻¹ , the absorbance for each test object is detected. If the difference in the difference can be distinguished and attention is paid to 1683 cm ^{−1 to} 1710 cm ⁻¹ , the difference in absorbance difference for each inspection object can be observed more remarkably. ^Therefore, if the noticed wave number at least one of wave numbers between 1665cm ^-1 ~1730cm -1, it is possible to analyze the content of the carboxylic acid of each inspection target.

[Example 2]
Also in the solder material inspection apparatus in Example 2, after the printing is completed and the metal mask is removed and before reflowing, the degree of deterioration of the cream solder is inspected, and the infrared spectroscopy is used. The same as in the first embodiment. However, in summary, the second embodiment does not irradiate light only on the cream solder printed on the substrate as in the first embodiment, but is mounted on the substrate or the cream solder depending on the case. It is configured to detect the intensity of infrared rays as reflected light by irradiating the electronic component with light, and extract only the cream solder (inspection intensity) from the intensity. Therefore, it is different from the first embodiment. Hereinafter, only portions different from the first embodiment will be described in detail, and description of similar portions will be omitted.

  First, the configuration of the solder material inspection apparatus of this embodiment will be described with reference to FIGS. FIG. 14 is a functional block diagram showing a second embodiment of the solder material inspection apparatus of the present invention.

  The schematic configuration of the solder material inspection apparatus 1 according to the present embodiment is as shown in FIG. 1 as in the first embodiment. However, as shown in FIG. 14, the solder material inspection apparatus 1 further includes a signal extraction unit 80 as strength extraction means. This is different from the first embodiment.

  The signal extraction unit 80 continuously irradiates light while scanning the substrate 2 on which the cream solder 3 is printed, and from the measured intensity which is the intensity of infrared of a specific wave number as the reflected light, only from the cream solder 3. It is configured to extract the intensity of an inspection object of infrared light having a specific wave number as reflected light to be detected. For example, an arithmetic unit such as a CPU executes a program stored in a storage unit such as a ROM or RAM, and controls an input unit such as a keyboard, an output unit such as a display, or a communication unit such as an interface circuit. Can be realized. Specific extraction processing will be described later.

  Next, the operation during operation of the solder material inspection apparatus of this embodiment will be described with reference to FIG. FIG. 15 is a sequence diagram during the operation.

  First, when the person to be inspected inputs the measurement target area A by the input unit 40, the point that the area information is written in the storage unit 30 is the same as in the first embodiment. Next, the control unit 50 reads the area information from the storage unit 30, transmits a movement instruction signal to the movement unit 10, and the movement unit 10 that has received the movement instruction signal moves the X stage 11 and the Y stage 12, The infrared spectroscopic measurement unit 20 is moved to the measurement start position P1 (X0, Y0) (S600 to S603). For these operations, the same method as in the first embodiment can be applied.

  Next, the control unit 50 issues a light emission instruction to the light source 21, and also issues a movement instruction to the moving unit 10 so that the infrared spectroscopic measurement unit 20 scans the measurement target area A (S603). Then, the infrared spectroscopic measurement unit 20 scans the measurement target area A while continuously emitting light (S604). On the other hand, when the light source 21 emits light to the measurement target area A, the intensity of the infrared rays as the reflected light is detected by the intensity detection unit 22 (S605), and the detected data is stored in the storage unit 30. And is continuously written in the storage unit 30 as measurement data (S606), and when the scanning in the measurement target area A is completed, the moving unit 10 ends the movement (S607). In this embodiment, unlike the first embodiment, the light source 21 emits light continuously, and light is applied not only to the cream solder 3 in the measurement target area A but also to the substrate 2. It will be. Note that, depending on the signal extraction process described later, even if an electronic component is mounted in the measurement target area A, only the intensity (inspection target intensity) of infrared light having a specific wave number as reflected light from the cream solder 3 is extracted. It is possible.

  Next, the control unit 50 functions as intensity detection means for extracting the inspection object intensity and starts signal extraction processing. The signal extraction processing includes the following.

[First embodiment of signal extraction processing]
The substrate is irradiated with light, the intensity of infrared light having a specific wave number reflected from the substrate is detected, and the intensity is stored in advance in the storage unit 30 as the substrate intensity. This is to obtain reference data indicating what pattern the intensity of the reflected infrared light having a specific wave number becomes when the substrate is irradiated with light. And the said test object intensity | strength is extracted by taking the difference with the said board | substrate intensity | strength memorize | stored in the memory | storage part 30 from the said measurement intensity | strength.

[Second Embodiment of Signal Extraction Processing]
The cream solder is irradiated with light, the intensity of infrared light having a specific wave number reflected from the cream solder is detected, and the intensity is stored in advance in the storage unit 30 as the solder strength. This is because, when the cream solder is irradiated with light, the reference data indicating the pattern of the intensity of the reflected infrared light having a specific wave number is obtained. And the said test object intensity | strength is extracted by comparing the increase / decrease pattern of the said solder intensity | strength memorize | stored in the memory | storage part 30, and the said measurement intensity | strength signal. FIG. 16 conceptually shows this extraction method. D1 indicates the solder strength as the reference data, D2 is a portion corresponding to cream solder in the measured strength, and D3 is a portion corresponding to the substrate or component in the measured strength. One element of the bar graph is a value normalized by the light intensity of the specific wave number or the light intensity of the reference wave number. Here, the light intensity at a particular wave ^{number, 1665cm -1 ~1730cm -1 (a1)} , 1500cm -1 ~1650cm -1 (a2), 1270cm -1 ~1430cm -1 (a3), 520cm -1 ~700cm -1 ( the a4), divided by the light intensity of the reference wave number ^{1100cm -1 ~1200cm} -1 (b) are normalized, with a value of from the left in the drawing a1 / b, a2 / b, a3 / b, a4 / b is there. As indicated by D1 in the figure, in the reference solder data, the signal increase / decrease pattern is changed by-++, and D2 in the measurement data is also changed by the signal increase / decrease pattern-++. Therefore, D2 is recognized as a signal indicating the solder strength. The cream solder for obtaining the reference data may be a new cream solder. However, if the cream solder is used for comparison, the strength of the comparison target can be used. According to this method, even if an electronic component or the like is present on the substrate 2, the inspection object strength can be extracted and the inspection can be performed immediately before the reflow, so that the measurement accuracy can be further improved. Further, the inspection object strength can be extracted without being affected by the deterioration of the substrate itself.

[Third embodiment of signal extraction processing]
First, the intensity detection unit 22 detects the total measurement intensity, which is the intensity of infrared rays reflected from the substrate 2 on which the cream solder 3 is printed by irradiation of light from the light source 21. The total measured intensity includes not only the cream solder 3 but also the substrate 2. Next, the signal extraction unit 80 compares the infrared intensity of the reference wave number, which is a wave number other than the specific wave number, among the total measured intensities detected by the intensity detection unit 22 with a predetermined threshold value, and is equal to or less than the threshold value. If so, the solder strength is determined, and the infrared inspection target strength of a specific wave number is extracted from the solder strength. Since the solder material reflection luminance is extremely lower than the substrate reflection luminance, the inspection object intensity can be extracted also by this method. For example, the threshold value is obtained by measuring the intensity of the reflected light of the reference wave number of the cream solder and the intensity of the reflected light of the reference wave number of the substrate, and distinguishing the intensity of the reflected light of the cream solder and the intensity of the reflected light of the substrate. What is necessary is just to obtain | require beforehand as a possible value and to set to the memory | storage part 30 beforehand.

  In addition, as another method of extracting the inspection object intensity, instead of using the reflected light intensity of the reference wave number, the total of the reflected light intensity of the specific wave number is used, and the threshold value is similarly obtained by experiments and the like. Similarly, the intensity of the reflected light of the cream solder may be extracted. In addition, using the average value of all the measured intensities instead of the intensity of the reflected light of the reference wave number, the threshold value is obtained by an experiment or the like in the same manner, and the reflected light intensity of the cream solder is similarly extracted from the threshold value. May be.

  When the signal extraction process ends, the extracted extracted data (inspection intensity) is transmitted to the storage unit 30, and the storage unit 30 writes the extracted data (S611). The subsequent processing (S612 to S616) is the same as the processing of S508 to S512 shown in FIG.

  Note that the solder deterioration calculation process may be performed as shown in FIG. FIG. 17 is a conceptual diagram when the solder deterioration degree is obtained from the difference (D31) between the inspection target strength (D11) of the comparison target cream solder and the comparison target strength (D2) of the inspection target cream solder. The difference D31 is obtained from D11-D2, and the obtained difference D3 is shown as the sum of absolute values of the signal differences. Each bar graph element has a value normalized as described above. Thus, if it shows as an absolute value sum total, the grade of the deterioration degree of cream solder can be understood at a glance.

The schematic block diagram for demonstrating the structure of the solder material test | inspection apparatus of this invention. The functional block diagram which shows 1st Example of the solder material test | inspection apparatus of this invention. The conceptual diagram which shows 1st Example of the solder material test | inspection apparatus of this invention. The sequence diagram at the time of the setting which shows 1st Example of the solder material test | inspection apparatus of this invention. The sequence diagram at the time of the operation | movement which shows 1st Example of the solder material test | inspection apparatus of this invention. The spectrum chart which shows the infrared light absorbency of the cream solder of a test object, and the infrared light absorbency of the cream solder of a comparison object. The table | surface which shows the content component and content rate (weight%) of the cream solder to be examined. The chart which shows the light absorbency difference obtained by subtracting the infrared light absorbency of the cream solder of a comparison object from the infrared light absorbency of the cream solder of a test object shown in FIG. For a plurality of inspection objects, (a) is a chart showing the difference in absorbance obtained for each inspection object by subtracting the infrared absorbance of the cream solder for comparison from the infrared absorbance of the cream solder for each inspection object, (b) Table showing the number of times of printing, viscosity, and infrared absorbance of a predetermined number of times. The plurality of inspection object, a chart showing the absorbance difference obtained by subtracting the infrared absorbance of the cream solder to be compared from the cream solder of the infrared absorbance of each test object for each inspection target, 520cm ^-1 ~700cm ^-1 Chart for wave number band of. The plurality of inspection object, a chart showing the absorbance difference obtained by subtracting the infrared absorbance of the cream solder to be compared from the cream solder of the infrared absorbance of each test object for each inspection target, 1270cm ^-1 ~1420cm ^-1 Chart for wave number band of. The plurality of inspection object, a chart showing the absorbance difference obtained by subtracting the infrared absorbance of the cream solder to be compared from the cream solder of the infrared absorbance of each test object for each inspection target, 1500 cm ^-1 1650 cm ^-1 Chart for wave number band of. The plurality of inspection object, a chart showing the absorbance difference obtained by subtracting the infrared absorbance of the cream solder to be compared from the cream solder of the infrared absorbance of each test object for each inspection target, 1665cm ^-1 ~1725cm ^-1 Chart for wave number band of. The functional block diagram which shows 2nd Example of the solder material test | inspection apparatus of this invention. The sequence diagram at the time of the operation | movement which shows 2nd Example of the solder material test | inspection apparatus of this invention. The conceptual diagram of a signal extraction process. The conceptual diagram of a solder deterioration calculation process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder material inspection apparatus 2 Board | substrate 3 Cream solder 10 Moving part 11 X stage 12 Y stage 20 Infrared spectroscopy measurement part 21 Light source 22 Intensity detection part 30 Storage part 40 Input part 50 Control part 60 Solder deterioration calculation part 70 Output part 80 Signal Extraction unit

Claims (21)

Print position acquisition means for acquiring print position information of the solder material printed on the substrate;
Based on the print position information acquired by the print position acquisition means, a light source that emits light only to the solder material printed on the substrate while scanning on the substrate;
An intensity detector that detects the intensity of an inspection target of infrared rays of a specific wave number reflected from the solder material by irradiation of light from the light source;
A solder material inspection apparatus that outputs the infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the strength to be inspected and the strength to be inspected as measured values. Print position acquisition means for acquiring print position information of the solder material printed on the substrate;
Based on the print position information acquired by the print position acquisition means, a light source that emits light only to the solder material printed on the substrate while scanning on the substrate;
An intensity detector that detects the intensity of an inspection object of infrared of a specific wave number reflected from the solder material by irradiation of light from the light source;
The solder material printed on the substrate is an inspection object, and the comparison target intensity of the infrared of the specific wave number detected as reflected light when the solder material to be compared with the inspection object is irradiated with light, and the inspection object A solder deterioration calculation unit that calculates a deterioration parameter indicating the relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared based on the strength;
A solder material inspection apparatus comprising: The solder material inspection apparatus according to claim 1, wherein the light source emits light intermittently. The solder material inspection apparatus according to claim 1, further comprising a light shielding unit that intermittently shields light emitted from the light source. Before reflow, a light source that emits light while scanning at least a substrate printed with a solder material;
An intensity detector that detects a measurement intensity that is the intensity of infrared of a specific wave number reflected from the substrate on which the solder material is printed by irradiation of light from the light source;
Intensity extracting means for extracting the intensity of the inspection object of the specific wave number as reflected light detected only from the solder material from the measured intensity detected by the intensity detector;
A solder material inspection apparatus that outputs the infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the strength to be inspected and the strength to be inspected as measured values. Before reflow, a light source that emits light while scanning at least a substrate printed with a solder material;
An intensity detector that detects a measurement intensity that is the intensity of infrared of a specific wave number reflected from the substrate on which the solder material is printed by irradiation of light from the light source;
Intensity extracting means for extracting the intensity of the inspection object of the infrared of the specific wave number as reflected light detected only from the solder material from the measured intensity detected by the intensity detector;
The solder material printed on the substrate is an inspection object, and the comparison target intensity of the infrared of the specific wave number detected as reflected light when the solder material to be compared with the inspection object is irradiated with light, and the inspection object A solder deterioration calculation unit that calculates a deterioration parameter indicating the relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared based on the strength;
A solder material inspection apparatus comprising: Irradiating the substrate with light, detecting the intensity of the infrared of the specific wave number reflected from the substrate, and having a storage unit for storing the intensity in advance as the substrate intensity;
The intensity extraction means is
7. The solder material inspection apparatus according to claim 5, wherein the inspection object strength is extracted by taking a difference between the measured strength and the substrate strength stored in the storage unit. 8. . Irradiating the solder material with light, detecting the intensity of the infrared of the specific wave number reflected from the solder material, and having a storage unit for storing the intensity in advance as the solder strength;
The intensity extraction means is
7. The solder according to claim 5, wherein the inspection object strength is extracted by comparing the solder strength stored in the storage unit with the increase / decrease pattern of the signal of the measured strength. Material inspection equipment. Before reflow, a light source that emits light while scanning at least a substrate printed with a solder material;
An intensity detector that detects the total measured intensity, which is the intensity of infrared rays reflected from the substrate on which the solder material is printed by irradiation of light from the light source;
Of all the measured intensities detected by the intensity detector, the infrared intensity of a reference wave number that is a wave number other than a specific wave number is compared with a predetermined threshold value. An intensity extracting means for extracting the intensity of the infrared inspection object of a specific wave number from the solder intensity,
A solder material inspection apparatus that outputs the infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the strength to be inspected and the strength to be inspected as measured values. Before reflow, a light source that emits light while scanning at least a substrate printed with a solder material;
An intensity detector that detects the total measured intensity, which is the intensity of infrared rays reflected from the substrate on which the solder material is printed by irradiation of light from the light source;
Of all the measured intensities detected by the intensity detector, the infrared intensity of a reference wave number that is a wave number other than a specific wave number is compared with a predetermined threshold value. Intensity extraction means for extracting the intensity of the infrared inspection object of a specific wave number from the solder intensity,
The solder material printed on the substrate is an inspection object, and the comparison target intensity of the infrared of the specific wave number detected as reflected light when the solder material to be compared with the inspection object is irradiated with light, and the inspection object A solder deterioration calculation unit that calculates a deterioration parameter indicating the relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared based on the strength;
A solder material inspection apparatus comprising: 11. The solder material inspection according to claim 1, further comprising: an input unit capable of designating a measurement target area that is a range of scanning by the light source among the solder materials printed on the substrate. apparatus.   The solder material inspection apparatus according to claim 2, wherein the deterioration parameter is obtained by a difference or a ratio between the inspection target strength and the comparison target strength. The deterioration parameter is
The first infrared absorbance of the specific wave number in the solder material to be inspected obtained based on the strength of the inspection object, and the second infrared absorbance of the specific wave number in the solder material to be compared obtained in accordance with the intensity of the comparative object. The solder material inspection device according to claim 2, wherein the solder material inspection device is obtained from any one of a difference or a ratio of The solder material inspection device
Set a reference wave number that is different from the specific wave number,
In the intensity detector,
Further, the third intensity of the infrared of the reference wave number that reflects the solder material to be inspected is detected,
The solder deterioration calculation unit
Furthermore, according to the degree of difference between the fourth intensity of the infrared of the reference wave number detected as reflected light when the solder material to be compared with the solder material to be inspected is irradiated with light, and the third intensity, The solder material inspection apparatus according to claim 12, wherein at least one of the inspection object strength and the comparison object strength is corrected. The solder material inspection device
Set a reference wave number that is different from the specific wave number,
In the intensity detector,
Further, the third intensity of the infrared of the reference wave number that reflects the solder material to be inspected is detected,
The solder deterioration calculation unit
Further, based on the third intensity, the third infrared absorbance of the reference wave number in the solder material to be inspected is obtained, and as reflected light when light is applied to the solder material to be compared with the solder material to be inspected Based on the detected fourth infrared intensity of the reference wave number, the fourth infrared absorbance of the reference wave number in the solder material to be inspected is obtained, and the difference between the third infrared absorbance and the fourth infrared absorbance is obtained. The solder material inspection apparatus according to claim 13, wherein at least one of the first infrared absorbance and the second infrared absorbance is corrected accordingly. Get the print position information of the solder material printed on the board,
Based on the acquired printing position information, irradiate only the solder material printed on the substrate while scanning the substrate,
Detecting the intensity of an inspection object of infrared of a specific wave number reflected from the solder material by the light irradiation,
A solder material inspection method comprising: outputting the infrared absorbance of the specific wave number of the solder material to be inspected obtained based on the inspection object strength and the inspection object strength as measurement values. Get the print position information of the solder material printed on the board,
Based on the acquired printing position information, irradiate only the solder material printed on the substrate while scanning the substrate,
Detecting the intensity of an inspection object of infrared of a specific wave number reflected from the solder material by the light irradiation,
The solder material printed on the substrate is an inspection object, and the comparison target intensity of the infrared of the specific wave number detected as reflected light when the solder material to be compared with the inspection object is irradiated with light, and the inspection object A solder material inspection method, wherein a deterioration parameter indicating a relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared is calculated based on strength. Before reflow, irradiate light while scanning at least the board on which the solder material is printed,
Detecting the measurement intensity, which is the intensity of infrared of a specific wave number reflected from the substrate on which the solder material is printed by the light irradiation,
Extracting the inspected intensity of the infrared of the specific wave number as reflected light detected only from the solder material from the measured intensity detected,
A solder material inspection method comprising: outputting the infrared absorbance of the specific wave number of the solder material to be inspected obtained based on the inspection object strength and the inspection object strength as measurement values. Before reflow, irradiate light while scanning at least the board on which the solder material is printed,
Detecting the measurement intensity, which is the intensity of infrared of a specific wave number reflected from the substrate on which the solder material is printed by the light irradiation,
Extracting the inspected intensity of the infrared of the specific wave number as reflected light detected only from the solder material from the measured intensity detected,
The solder material printed on the substrate is an inspection object, and the comparison target intensity of the infrared of the specific wave number detected as reflected light when the solder material to be compared with the inspection object is irradiated with light, and the inspection object A solder material inspection method, wherein a deterioration parameter indicating a relative deterioration degree of the solder material to be inspected with respect to the solder material to be compared is calculated based on strength.   A control program for a solder material inspection apparatus, wherein the function of the processing unit according to any one of claims 2, 6, and 10 is realized by a computer.   A computer-readable recording medium storing the control program according to claim 20.

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