CN101306518A - Polishing pad, use thereof and method for making the same - Google Patents
Polishing pad, use thereof and method for making the same Download PDFInfo
- Publication number
- CN101306518A CN101306518A CNA2007101637197A CN200710163719A CN101306518A CN 101306518 A CN101306518 A CN 101306518A CN A2007101637197 A CNA2007101637197 A CN A2007101637197A CN 200710163719 A CN200710163719 A CN 200710163719A CN 101306518 A CN101306518 A CN 101306518A
- Authority
- CN
- China
- Prior art keywords
- grinding pad
- pad according
- elastomer
- abrasive sheet
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Abstract
The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
Description
Technical field
The present invention relates to a kind of grinding pad that is used for cmp.
Background technology
Cmp (CMP) is for using the program of a grinding pad with the planarization substrate surface.CMP generally is applied to grind oxide layer and/or the metal level on substrate, silicon and the silicon of lens, mirror, LCD.
With silicon as an example, the at first ingot of monocrystalline silicon section.Usually the described chip of polishing flattens for carrying out chemical etching subsequently it.After etching process, need one to grind processing procedure.During grinding processing procedure, grinding pad carries out chemical reaction together with slurries and silicon atom on the chip surface, so that through the reacted surface ratio silicon softness that underlies.In addition, continue to erase, can make fresh silicon be exposed to slurries and grinding pad through reacted surface.
The 6th, 358, No. 130 United States Patent (USP) discloses a kind of conventional grinding pad that uses with lapping liquid.Described conventional grinding pad has grinding layer and passes window in the opening of described grinding layer.The lower surface of described grinding layer and window is covered by the liquid impermeable barrier that underlies.Described conventional grinding pad further comprises the adhesive that is on the described liquid impermeable barrier, and described adhesive forms the sealing that engages separately between grinding layer and window and underlayer.In described conventional grinding pad, adhesive and liquid impermeable barrier can prevent that the interface between each becomes wet in adhesive and grinding layer, window and the liquid impermeable barrier.Its advantage is, continual liquid impermeable barrier is avoided because following former thereby produce the trend of leakage paths: because crooked during daily processing; Owing to during using described grinding pad, apply grinding pressure; Or because fine pore or the gap in the adhesive.Another advantage is to engage sealing and can reduces and make the change that is caused by lapping liquid in the interface between each in adhesive and grinding layer, window and the liquid impermeable barrier wet.
Because the underlayer of conventional grinding pad comprises fiber usually, so the inclusion of underlayer does not evenly distribute.And,, can observe the varied in thickness of underlayer and grinding pad easily so the inclusion of grinding layer does not also evenly distribute because the grinding layer of conventional grinding pad comprises elastomer usually.In addition, the surface of underlayer and grinding pad is uneven, and coarse usually and fluctuating.This category feature makes underlayer or grinding pad be difficult to be attached to closely and fully described liquid impermeable barrier.Observe bubble and white space (as shown in Figure 1) in the interface between underlayer and grinding layer and liquid impermeable barrier easily.Thereby slurries are easily via described bubble and white space and be penetrated in the interface between underlayer and grinding layer and the liquid impermeable barrier, thereby have shortened the service life of conventional grinding pad, and have reduced the effect and the efficient of cmp simultaneously.
Summary of the invention
A purpose of the present invention is to provide a kind of grinding pad, and described grinding pad comprises a buffer substrate tablet, an abrasive sheet and is used for described buffer substrate tablet is adhered to the adhesive of described abrasive sheet.Described buffer substrate tablet comprises fiber.Described abrasive sheet comprises first elastomer.Described adhesive comprises second elastomer.
Another object of the present invention is to provide a kind of method of grinding substrate, described method comprises uses above-mentioned grinding pad to grind a substrate surface.
Another purpose of the present invention is to provide a kind of method that is used to make above-mentioned grinding pad, and described method comprises following steps:
(a) provide buffer substrate tablet and abrasive sheet;
(b) on the surface of buffer substrate tablet or abrasive sheet, apply second elastomer; And
(c) buffer substrate tablet is adhered to abrasive sheet.
Description of drawings
Fig. 1 illustrates the view of conventional grinding pad under transmission electron microscope.
The view of Fig. 2 explanation grinding pad according to the present invention under transmission electron microscope.
The specific embodiment
The invention provides a kind of grinding pad, the adhesive that it comprises a buffer substrate tablet, an abrasive sheet and is used for described buffer substrate tablet is adhered to described abrasive sheet.Described buffer substrate tablet comprises fiber.Described abrasive sheet comprises first elastomer.Described adhesive comprises second elastomer.
According to the present invention, any buffer substrate tablet that comprises fiber all can be applicable among the present invention.Buffer substrate tablet preferably comprises adhesive-bonded fabric, and more preferably, buffer substrate tablet comprises the adhesive-bonded fabric of rolling, its continuously the volume mode use described rolling adhesive-bonded fabric, compare with the conventional method of the single grinding pad of production that comprises molded or casting, described rolling mode has been improved a batch uniformity.
Use it " adhesive-bonded fabric " second speech to refer to manufacturing sheet, net or the felt of tool directionality or randomly oriented fiber herein, it is engaged by frictional force and/or cohesive force and/or bonding force, do not comprise paper and incorporate into have binder yarn or silk through braiding, knitting, cluster, loop bonding or by the wet type product of (no matter whether through extra pin seam) of boning of milling.Described fiber can be natural or artificial.It can be fixed length or but continuous silk or original position forms.Depend on shape method into the net, adhesive-bonded fabric comprises synthetic adhesive-bonded fabric, acupuncture adhesive-bonded fabric usually, melts and sprays adhesive-bonded fabric, spunbond adhesive-bonded fabric, dry type become net adhesive-bonded fabric, wet type to become net adhesive-bonded fabric, loop bonding adhesive-bonded fabric or water thorn adhesive-bonded fabric.Compare with weaving cotton cloth, adhesive-bonded fabric has material behavior preferably.
Use it " fiber " second speech to refer to ultimate fibre or composite fibre herein, preferably refer to composite fibre.Can select described fiber according to substrate to be ground, preferably, described fiber is made by at least a material that is selected from the group that is made up of following each thing: polyamide, p-phenylenediamine (PPD), polyester, polymethyl methacrylate, PET, polyacrylonitrile and its mixture.
Use it " first elastomer " second speech (being also referred to as " first elastomeric polymer ") to refer to a type of polymer that represents the rubber like quality herein.When grinding, described first elastomer can serve as good buffer to avoid scratch substrate surface to be ground.In a preferred embodiment of the invention, first elastomer comprises Foamex.Use it " Foamex " to refer to the material that contains thermoplastic resin and thermal decomposition of blowing agent herein.Described first elastomer preferably comprises at least one that is selected from the group that is made up of following each thing: polyurethane, polyolefin, Merlon, polyvinyl alcohol, nylon, elastic caoutchouc, polystyrene, the polyaromatic molecule, fluoropolymer, polyimides, cross-linked polyurethane, cross-linked polyolefin, polyethers, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethylene (PTFE), poly-(ethylene terephthalate), the polyaromatic acid amides, polyaromatic, polymethyl methacrylate, its copolymer, its block copolymer, its mixture and its admixture; More preferably, first elastomer comprises polyurethane.
In a preferred embodiment of the invention, abrasive sheet further comprises fiber, and more preferably, described fiber comprises adhesive-bonded fabric (as mentioned above).The projection that the fiber abrasive sheet is provided for grinding also can be used as support, and described support allows the elastomer of abrasive sheet to be deposited in the space of being defined by described support.The those skilled in the art can select to be fit to the fiber of kind and to coordinate first elastomer and described fiber according to the disclosure of this specification.Described fiber is preferably made by at least a material that is selected from the group that is made up of following each thing: polyamide, p-phenylenediamine (PPD), polyester, polymethyl methacrylate, PET, polyacrylonitrile and its mixture.
In a more preferred embodiment of the present invention, abrasive sheet comprises a plurality of continuous holes that are embedded in the fiber and first elastomer.The continuous hole of grinding pad has uniform-dimension, and this helps the distribution of the flowing of lapping liquid, abrasive grains and grinds removing of residue.In a preferred embodiment of the invention, continuous hole has the hole dimension from 0.1 μ m to 500 μ m.
Adhesive according to the present invention is formed between buffer substrate tablet and the abrasive sheet, and preferably is to be embedded in the fiber of buffer substrate tablet.Because according to adhesive of the present invention is preferably to be embedded in the fiber of buffer substrate tablet, can serve as the intermediate between buffer substrate tablet and the abrasive sheet.Adhesive according to the present invention is through the surface of design with modification buffer substrate tablet and abrasive sheet, and the point (as shown in Figure 2) that can fill the coarse of buffer substrate tablet and abrasive sheet and rise and fall.Thereby this two sheet material is can be bonded to each other good, and has strengthened the bonding strength of buffer substrate tablet and abrasive sheet significantly.In addition, can work according to grinding pad of the present invention and can be by slurry infiltration, service life of grinding pad thereby prolonged, and improved the effect and the efficient of cmp thus.
Use it " second elastomer " second speech (being also referred to as " second elastomeric polymer ") to refer to a type of polymer that represents the rubber like quality herein.Described second elastomer can serve as the adhesive that is used for buffer substrate tablet is adhered to abrasive sheet.In a preferred embodiment of the invention, this second elastomer is a paste.This paste is preferably-liquid type paste, two-liquid type paste or the wet paste that solidifies.In a more preferred embodiment of the present invention, this second elastomer comprises at least one that is selected from the group that is made up of following each thing: polyurethane, polyvinyl chloride, polystyrene, polyethylene, polyamide, polyethers, polypropylene, ethylene acetate/vinylacetate, its copolymer, its block copolymer, its mixture and its admixture.
In a most preferred embodiment of the present invention, second elastomer comprises polyurethane.
In a preferred embodiment of the invention, paste is the two-liquid type paste.Described two-liquid type paste refers to and comprises interact with each other or crosslinked paste with two kinds of compositions realizing adhesive effect.Described two-liquid type paste preferably comprises second elastomer and PIC.
The present invention also provides a kind of method of grinding substrate, and described method comprises uses grinding pad mentioned above to grind substrate surface.
The present invention also provides a kind of method that is used to make above-mentioned grinding pad, and described method comprises following steps:
(a) provide buffer substrate tablet and abrasive sheet;
(b) on the surface of buffer substrate tablet or abrasive sheet, apply second elastomer; And
(c) buffer substrate tablet is adhered to abrasive sheet.
The mode that buffer substrate tablet is adhered to abrasive sheet changes according to the form of adhesive.Being used for the adhesive that buffer substrate tablet is adhered to abrasive sheet preferably is by at least one surface that applies, sprays, printing or scraping are applied to buffer substrate tablet and abrasive sheet.
After applying adhesive, buffer substrate tablet and abrasive sheet are bonded together.Buffer substrate tablet and abrasive sheet are preferably bonded to each other under 75 ℃ to 80 ℃ temperature.
If necessary, in process in accordance with the present invention (c) afterwards, described method further comprises a curing schedule.In some cases, adhesive needs described curing schedule to solidify and forms joint.The condition of described curing schedule and mode change according to employed adhesive.
Now described in detail the present invention with following example, only it does not mean that the present invention only is confined to these examples and holds within disclosing.
Conventional grinding pad: underlayer and grinding layer are adhered to the liquid impermeable barrier by adhesive.
According to grinding pad of the present invention: buffer substrate tablet and abrasive sheet are bonded together by the adhesive that comprises polyurethane.
Show conventional grinding pad (pad 1) in the table 1 and according to the characteristic of grinding pad of the present invention (pad 2).
Table 1
| Bonding strength | Do (kg/cm) | Wet (kg/cm) |
| Pad 1 | 0.42 | 0.35 |
| Pad 2 | 1.1 | 0.9 |
(R.R) average: 6277
NU％：5.6％
Equipment: IPEC776
The foregoing description only is explanation the present invention's principle and effect thereof, and unrestricted the present invention.Practise the modification of the foregoing description being made in the personage of this technology and change still spirit without prejudice to the present invention.The present invention's interest field should be as described later claim listed.
Claims (20)
1. grinding pad, it comprises:
Buffer substrate tablet comprises fiber;
Abrasive sheet comprises first elastomer, and described abrasive sheet comprises lapped face, and described lapped face is used to grind substrate; And
Adhesive is used for described buffer substrate tablet is adhered to described abrasive sheet, and described adhesive comprises second elastomer.
2. grinding pad according to claim 1, wherein said buffer substrate tablet comprises adhesive-bonded fabric.
3. grinding pad according to claim 1, wherein said fiber is selected from the group that is made up of ultimate fibre and composite fibre.
4. grinding pad according to claim 1, wherein said fiber is made by at least a material that is selected from the group that is made up of following each thing: polyamide, p-phenylenediamine (PPD), polyester, polymethyl methacrylate, PET, polyacrylonitrile and its mixture.
5. grinding pad according to claim 1, wherein said first elastomer comprises Foamex.
6. grinding pad according to claim 1, wherein said first elastomer comprise at least one that is selected from the group that is made up of following each thing: polyurethane, polyolefin, Merlon, polyvinyl alcohol, nylon, elastic caoutchouc, polystyrene, the polyaromatic molecule, fluoropolymer, polyimides, cross-linked polyurethane, cross-linked polyolefin, polyethers, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethylene (PTFE), poly-(ethylene terephthalate), the polyaromatic acid amides, polyaromatic, polymethyl methacrylate, its copolymer, its block copolymer, its mixture and its admixture.
7. grinding pad according to claim 6, wherein said first elastomer comprises polyurethane.
8. grinding pad according to claim 1, wherein said abrasive sheet comprises fiber.
9. grinding pad according to claim 8, the described fiber in the wherein said abrasive sheet comprises adhesive-bonded fabric.
10. grinding pad according to claim 8, the described fiber in the wherein said abrasive sheet is selected from the group that is made up of ultimate fibre and composite fibre.
11. grinding pad according to claim 8, described fiber in the wherein said abrasive sheet is made by at least a material that is selected from the group that is made up of following each thing: polyamide, p-phenylenediamine (PPD), polyester, polymethyl methacrylate, PET and polyacrylonitrile and its mixture.
12. grinding pad according to claim 8, wherein said abrasive sheet comprise a plurality of continuous holes that are embedded in described fiber and described first elastomer.
13. grinding pad according to claim 1, wherein said second elastomer comprise at least one that is selected from the group that is made up of following each thing: polyurethane, polyvinyl chloride, polystyrene, polyethylene, polyamide, polyethers, polypropylene, ethylene acetate/vinylacetate, its copolymer, its block copolymer, its mixture and its admixture.
14. grinding pad according to claim 12, wherein said second elastomer comprises polyurethane.
15. grinding pad according to claim 1, wherein said adhesive are selected from the group that is made up of following each thing: a liquid type paste, two-liquid type paste and the wet paste that solidifies.
16. grinding pad according to claim 15, wherein said two-liquid type paste comprises described second elastomer and PIC.
17. a method of grinding substrate, it comprises the surface of using grinding pad according to claim 1 to grind described substrate.
18. a method that is used to make grinding pad according to claim 1, it comprises following steps:
(a) provide buffer substrate tablet and abrasive sheet;
(b) on the surface of described buffer substrate tablet or described abrasive sheet, apply described second elastomer; And
(c) described buffer substrate tablet is adhered to described abrasive sheet.
19. method according to claim 18, wherein step (b) comprises described second elastomer coated, injection, printing or scraping on the surface of described buffer substrate tablet or described abrasive sheet.
20. method according to claim 18, it further comprises curing schedule afterwards in step (c).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/750,352 | 2007-05-18 | ||
| US11/750,352 US20080287047A1 (en) | 2007-05-18 | 2007-05-18 | Polishing pad, use thereof and method for making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101306518A true CN101306518A (en) | 2008-11-19 |
Family
ID=40027984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101637197A Pending CN101306518A (en) | 2007-05-18 | 2007-10-11 | Polishing pad, use thereof and method for making the same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20080287047A1 (en) |
| CN (1) | CN101306518A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102275143A (en) * | 2010-06-08 | 2011-12-14 | 三芳化学工业股份有限公司 | Polishing pad and manufacturing method thereof |
| CN103068525A (en) * | 2010-07-28 | 2013-04-24 | 3M创新有限公司 | Hybrid abrasive hand pad and method of abrading a surface |
| US8491359B2 (en) | 2009-08-24 | 2013-07-23 | Bestac Advanced Material Co., Ltd. | Polishing pad, use thereof and method for making the same |
| CN104625945A (en) * | 2013-11-07 | 2015-05-20 | 三芳化学工业股份有限公司 | Polishing pad and manufacturing method thereof |
| CN104684686A (en) * | 2012-08-02 | 2015-06-03 | 3M创新有限公司 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
| CN102029571B (en) * | 2009-09-24 | 2015-07-29 | 贝达先进材料股份有限公司 | Grinding pad and its application and its manufacture method |
| CN105437056A (en) * | 2014-09-19 | 2016-03-30 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
| US9669518B2 (en) | 2013-10-03 | 2017-06-06 | San Fang Chemical Industry Co., Ltd. | Polishing pad and method for making the same |
| CN107073688A (en) * | 2014-10-28 | 2017-08-18 | 阪东化学株式会社 | Grind material and grind the manufacture method of material |
| CN108274387A (en) * | 2017-01-06 | 2018-07-13 | 三芳化学工业股份有限公司 | Polishing pad and polishing apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8765259B2 (en) * | 2007-02-15 | 2014-07-01 | San Fang Chemical Industry Co., Ltd. | Carrier film for mounting polishing workpiece and method for making the same |
| TWI538777B (en) * | 2012-06-29 | 2016-06-21 | 三島光產股份有限公司 | Method of manufacturing polishing pad mold, polishing pad mold manufactured by the method, and polishing pad manufactured by the mold |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5938504A (en) * | 1993-11-16 | 1999-08-17 | Applied Materials, Inc. | Substrate polishing apparatus |
| JP2003510826A (en) * | 1999-09-29 | 2003-03-18 | ロデール ホールディングス インコーポレイテッド | Polishing pad |
| US6533645B2 (en) * | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
| US6807006B2 (en) * | 2000-12-22 | 2004-10-19 | Hiroshi Kawahara | Method of manufacturing polarized spectacle lens |
| WO2003082524A1 (en) * | 2002-03-25 | 2003-10-09 | Thomas West, Inc | Smooth pads for cmp and polishing substrates |
| DE10393018T5 (en) * | 2002-08-08 | 2005-08-25 | Dai Nippon Printing Co., Ltd. | Sheet for electromagnetic shielding |
| EP1590127A1 (en) * | 2003-01-10 | 2005-11-02 | 3M Innovative Properties Company | Pad constructions for chemical mechanical planarization applications |
| US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
-
2007
- 2007-05-18 US US11/750,352 patent/US20080287047A1/en not_active Abandoned
- 2007-10-11 CN CNA2007101637197A patent/CN101306518A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8491359B2 (en) | 2009-08-24 | 2013-07-23 | Bestac Advanced Material Co., Ltd. | Polishing pad, use thereof and method for making the same |
| CN102029571B (en) * | 2009-09-24 | 2015-07-29 | 贝达先进材料股份有限公司 | Grinding pad and its application and its manufacture method |
| CN102275143A (en) * | 2010-06-08 | 2011-12-14 | 三芳化学工业股份有限公司 | Polishing pad and manufacturing method thereof |
| CN103068525A (en) * | 2010-07-28 | 2013-04-24 | 3M创新有限公司 | Hybrid abrasive hand pad and method of abrading a surface |
| CN104684686A (en) * | 2012-08-02 | 2015-06-03 | 3M创新有限公司 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
| US9669518B2 (en) | 2013-10-03 | 2017-06-06 | San Fang Chemical Industry Co., Ltd. | Polishing pad and method for making the same |
| CN104625945A (en) * | 2013-11-07 | 2015-05-20 | 三芳化学工业股份有限公司 | Polishing pad and manufacturing method thereof |
| CN104625945B (en) * | 2013-11-07 | 2017-03-01 | 三芳化学工业股份有限公司 | Polishing pad and its manufacture method |
| CN105437056A (en) * | 2014-09-19 | 2016-03-30 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
| CN105437056B (en) * | 2014-09-19 | 2018-08-28 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
| CN107073688A (en) * | 2014-10-28 | 2017-08-18 | 阪东化学株式会社 | Grind material and grind the manufacture method of material |
| CN108274387A (en) * | 2017-01-06 | 2018-07-13 | 三芳化学工业股份有限公司 | Polishing pad and polishing apparatus |
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| Publication number | Publication date |
|---|---|
| US20080287047A1 (en) | 2008-11-20 |
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Open date: 20081119 |