CN101296607A - Circuit board bearing device and circuit board fixing method - Google Patents

Circuit board bearing device and circuit board fixing method Download PDF

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Publication number
CN101296607A
CN101296607A CNA2007100742336A CN200710074233A CN101296607A CN 101296607 A CN101296607 A CN 101296607A CN A2007100742336 A CNA2007100742336 A CN A2007100742336A CN 200710074233 A CN200710074233 A CN 200710074233A CN 101296607 A CN101296607 A CN 101296607A
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CN
China
Prior art keywords
circuit board
groove
electronic devices
components
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007100742336A
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Chinese (zh)
Inventor
郝建一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honsentech Co Ltd
Avary Holding Shenzhen Co Ltd
Original Assignee
Honsentech Co Ltd
Fukui Precision Component Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honsentech Co Ltd, Fukui Precision Component Shenzhen Co Ltd filed Critical Honsentech Co Ltd
Priority to CNA2007100742336A priority Critical patent/CN101296607A/en
Publication of CN101296607A publication Critical patent/CN101296607A/en
Pending legal-status Critical Current

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Abstract

The invention provides a circuit board bearing device which is provided with a bearing surface used for bearing the circuit board. The bearing surface is provided with at least one groove which is provided with a groove bottom surface opposite to the bearing surface; the groove bottom surface is provided with a bonding layer. The technical proposal also provides a method for fixing the circuit board. In the technical proposal, the circuit board can be stably fixed on the circuit board bearing device, and the situation of stress concentration can not occur on electronic components adhered on the surface of the circuit board.

Description

The fixing means of circuit board bearing device and circuit board
Technical field
The present invention relates to the circuit board mounting technology, relate in particular to the fixing means of a kind of circuit board bearing device and circuit board.
Background technology
Along with the development of electronic product toward volume miniaturization, functional diversities, circuit precise treatment direction, (Surface Mounted Technology SMT) also mounts from single face and develops into two-sided mounting, to realize electronic product assembling requirement surface mounting technology.
The single face attachment process of circuit board be with circuit board one side fixed placement in bearing tray, to prevent that circuit board is shifted in the surface mount process, carry out steps such as paste solder printing, device storing, reflow soldering then at the circuit board another side.Wherein, paste solder printing is meant tin cream is passed through the mould printing of predetermined pattern to the weld pad of circuit board surface, device is put and to be meant that the pin with electronic devices and components is positioned on the circuit board welding pad of tin cream out of the press, and reflow soldering is meant to be sent circuit board into reflow ovens refuse tin cream and make and realize machinery and the process that is electrically connected between electronic devices and components pin and the circuit board welding pad.
The two-sided attachment process of circuit board is generally earlier carries out single face with circuit board and mounts, after single face mounts the circuit board turn-over is carried out the flow process that mounts that this circuit board does not mount face again, promptly, the one side that circuit board has been mounted electronic devices and components is fixed in bearing tray, carries out flow processs such as paste solder printing, device storing, reflow soldering then at the circuit board face of not mounting.
Because it is different to have mounted various electronic devices and components shapes, the size of face, and bearing tray is a tabular, therefore this has carried out being easy to generate displacement when circuit board that single face mounts is positioned over bearing tray, rocking, thereby paste solder printing figure, device are put the error of position when causing surface mount, and then cause the bad connection between electronic devices and components and the circuit board.In addition, this has carried out circuit board that single face mounts and only contact with bearing tray and fix according to being mounted on its surperficial electronic devices and components, thus electronic devices and components to be easy to stress concentrated and damage, come off.
Therefore, be necessary to provide a kind of and stablize, the method and the circuit board bearing device of fixing circuit board fully.
Summary of the invention
A kind of circuit board bearing device, it has a load-bearing surface, and described load-bearing surface is used for the bearer circuit plate, it is characterized in that, described load-bearing surface is provided with at least one groove, described groove have one with load-bearing surface groove opposite bottom surface, described groove floor is provided with adhesive layer.
A kind of circuit board bearing device, it has a load-bearing surface, described load-bearing surface is used for the bearer circuit plate, described circuit board has a first surface that matches with load-bearing surface, described first surface is pasted with at least one electronic devices and components, it is characterized in that, described load-bearing surface is provided with at least one groove, the shape of this groove matches with the shape of electronic devices and components, this groove is used to accommodate described electronic devices and components, described groove floor is provided with adhesive layer, and this adhesive layer is used for electronic devices and components are fixed on groove.
A kind of fixing means of circuit board comprises step:
A kind of circuit board bearing device is provided, and it has a load-bearing surface that is used for the bearer circuit plate, and described load-bearing surface is provided with at least one groove, described groove have one with load-bearing surface groove opposite bottom surface, described groove floor is provided with adhesive layer;
A kind of circuit board is provided, and described circuit board has opposite first and second surface, and described first surface is pasted with at least one electronic devices and components, and described second surface is face to be mounted;
Described circuit board is positioned over described circuit board bearing device, the first surface of circuit board is contacted with described load-bearing surface, and make described electronic devices and components be contained in described groove, described electronic devices and components are fixed in groove floor by adhesive layer.
The circuit board bearing device in the technical program and the fixing means of circuit board have following advantage: at first, the groove of circuit board bearing device is corresponding with the electronic devices and components of circuit board first surface, make described electronic devices and components can be placed in described groove just, thereby circuit board can be stablized and is positioned over described circuit board bearing device.Secondly, the contact-making surface between circuit board and the circuit board bearing device is big, and first surface can fully contact with load-bearing surface, the generation of having avoided electronic devices and components stress to concentrate situation.Once more, groove floor is provided with adhesive layer, can be further fixedly electronic devices and components and circuit board, the circuit board zone that prevents to be provided with electronic devices and components produces song and sticks up.In addition, described adhesive layer has certain elasticity, can further alleviate the force-bearing situation of electronic devices and components, obtains the better effect that mounts.
Description of drawings
Fig. 1 is the schematic diagram of the circuit board bearing device that provides of the technical program execution mode first embodiment.
Fig. 2 is the generalized section of the circuit board bearing device that provides of the technical program execution mode first embodiment along the II-II direction of Fig. 1.
Fig. 3 is the schematic diagram of the circuit board that provides of the technical program execution mode first embodiment.
Fig. 4 is the generalized section that circuit board that the technical program execution mode first embodiment provides is fixed in circuit board bearing device.
Fig. 5 is the schematic diagram of the circuit board bearing device that provides of the technical program execution mode second embodiment.
Fig. 6 is the generalized section of the circuit board bearing device that provides of the technical program execution mode second embodiment along the VI-VI direction of Fig. 5.
Fig. 7 is the schematic diagram of the circuit board that provides of the technical program execution mode second embodiment.
Fig. 8 is the generalized section that circuit board that the technical program execution mode second embodiment provides is fixed in circuit board bearing device.
Embodiment
Below in conjunction with accompanying drawing, the execution mode of the technical program is described in further detail.
See also Fig. 1 and Fig. 2, the circuit board bearing device 100 that the technical program first embodiment provides has a load-bearing surface 101 that is used for the bearer circuit plate.Described load-bearing surface 101 is provided with at least one groove 110, and described groove 110 is used for the electronic devices and components that ccontaining circuit board first surface is provided with.Therefore, the structure of described groove 110 matches with the structure of electronic devices and components, and what is called matches and is meant that electronic devices and components can be placed in the described groove 110 just.Groove 110 is surrounded with bottom surface 112 by a plurality of sides 111 and forms.Described groove 110 bottom surfaces 112 are provided with adhesive layer 150, to bond, fixedly to be placed in the electronic devices and components in the groove 110.
Described circuit board bearing device 100 can resistant to elevated temperatures base plate for copper coin, aluminium sheet, iron plate, alloy sheets, organic composite plate or other.In the present embodiment, described circuit board bearing device 100 is the aluminium sheet of surfacing.
The quantity of described groove 110, offer position, shape and size and all match with the electronic devices and components of circuit board surface.In the present embodiment, the quantity of described groove 110 is one, and it is arranged at the central part of load-bearing surface 101.Described groove 110 is the cuboid caulking groove, and the length of remembering described groove 110 is L 1, width is B 1, the degree of depth is H 1
Described groove 110 can form by casting, also can by mill, processing technologys such as line cutting, laser cutting form, also can be by other precise machining process formation.
Described adhesive layer 150 also can be arranged at described groove 110 sides 111, with the electronic devices and components of further bonding circuit board surface except that being arranged at described groove 110 bottom surfaces 112.In the present embodiment, described adhesive layer 150 only is arranged at groove 110 bottom surfaces 112.The glue-line of this adhesive layer 150 for having certain viscosity, it can be layer of silica gel, also can be other glue-line.The height of remembering described adhesive layer 150 is A 0
Adhesive layer 150 can be arranged at groove 110 bottom surfaces 112 by coating apparatus such as point gum machine, glue spreaders.As a rule, adhesive layer 150 need carry out the precuring processing after being arranged at groove 110 bottom surfaces 112.Precuring is handled on the one hand and is made that adhesive layer 150 surface viscosities are moderate, both can adhere to the electronic devices and components of circuit board surface, is easy to take off circuit board that is adhered to and the damage that can not cause electronic devices and components again; Make adhesive layer 150 tight bond in groove 110 bottom surfaces 112 on the other hand, when when circuit board is taken off in groove 110 bottom surfaces 112, adhesive layer 150 can be along with circuit board breaks away from groove 110 bottom surfaces 112 together.Thereby adhesive layer 150 is repeatedly reusable, has reduced the cost that circuit board surface mounts.The precuring treatment process should be selected according to the character of adhesive layer 150.As a rule, the precuring treatment process of layer of silica gel is hot curing, is specially under the 600-700 degree centigrade of ambient cure 2-10 minute.
See also Fig. 3, the circuit board 200 that the technical program first embodiment provides has opposite first 201 and second surface 202.Described first surface 201 is the face that cooperates with the load-bearing surface 101 of circuit board bearing device 100, and these first surface 201 central parts are provided with electronic devices and components 210.Described second surface 202 is face to be mounted, treat circuit board 200 cooperate be fixed in circuit board bearing device 100 after, will carry out follow-up surface mount flow process in second surface 102, as paste solder printing, device storing, reflow soldering etc.
Described electronic devices and components 210 are cuboid, and it has a plurality of sides 211 and an end face 212.The length of remembering described electronic devices and components 210 is l 1, width is b 1, highly be h 1
Because described groove 110 is corresponding with described electronic devices and components 210, therefore, the length L of described groove 110 1Length l with electronic devices and components 210 1Equate the width B of groove 110 1Width b with electronic devices and components 210 1Equate the depth H of groove 110 1Equal the height h of electronic devices and components 210 1Height A with adhesive layer 150 0Add and.
Certainly, can have certain offset between the size of the size of described groove 110 and electronic devices and components 210 and adhesive layer 150.As a rule, bigger 0～0.1 millimeter of length, the width of the length of described groove 110, the comparable electronic devices and components 210 of width, the adding of the height of the comparable electronic devices and components 210 of the degree of depth of described groove 110 and adhesive layer 150 height with big 0～0.1 millimeter.
So, when described circuit board 200 was fixedly set in circuit board bearing device 100, described electronic devices and components 210 can be placed in described groove 110 just, as shown in Figure 4.
Concrete, during fixing described circuit board 200, the first surface 201 of circuit board 200 is contacted with described load-bearing surface 101, the side 211 of described electronic devices and components 210 contacts with 111 cooperations of the side of described groove 110, the end face 212 of described electronic devices and components 210 contacts with adhesive layer 150, that is, described electronic devices and components 210 are bonded in groove 110 bottom surfaces 112 by adhesive layer 150.
Thereby, but described circuit board 200 held stationary can not produce the displacement of circuit board 200 in described circuit board bearing device 100, can not make on the electronic devices and components 210 to produce stress and concentrate yet.
See also Fig. 5 and Fig. 6, the load-bearing surface 301 of the circuit board bearing device 300 that the technical program second embodiment provides is provided with first groove 310, second groove 320, the 3rd groove 330 that is arranged in order.
Described first groove 310 is the cuboid caulking groove, and it is surrounded by four rectangles, first side 311 and rectangle first bottom surface 312 and forms.The length of remembering described first groove 310 is L 2, width is B 2, the degree of depth is H 2
Described second groove 320 also is the cuboid caulking groove, and it is surrounded by four rectangles, second side 321 and rectangle second bottom surface 322 and forms.The length of remembering described second groove 320 is L 3, width is B 3, the degree of depth is H 3And, L 3Less than L 2, B 3Less than B 2, H 3Less than H 2
Described the 3rd groove 330 is a cylinder bodily form caulking groove, has a cylindrical shape the 3rd side 331 and circle the 3rd bottom surface 332.The diameter of remembering described the 3rd groove 330 is D 1, the degree of depth is H 4
In the present embodiment, it is A that described first bottom surface 312, second bottom surface 322, the 3rd bottom surface 332 are provided with thickness 1Adhesive layer 350.Certainly, the thickness of the adhesive layer 350 that described first bottom surface 312, second bottom surface 322, the 3rd bottom surface 332 are set also can be different, only needs adhesive layer 350 to have predetermined adhesive force and gets final product to be adhered fixed electronic devices and components.
Described circuit board bearing device 300 is used for carrying circuit board 400 corresponding with it, sees also Fig. 7, and circuit board 400 has opposite first 401 and second surface 402.Described first surface 401 is disposed with first electronic devices and components 410, second electronic devices and components 420 and the 3rd electronic devices and components 430.Described second surface 402 is pending surface-pasted.
Described first electronic devices and components 410 are cuboid, have four rectangles the 4th side 411 and rectangle first end face 412.The length of remembering these first electronic devices and components 410 is l 2, width is b 2, highly be h 2
Described second electronic devices and components 420 are cuboid also, have four rectangles the 5th side 421 and rectangle second end face 422.The length of remembering these second electronic devices and components 420 is l 3, width is b 3, highly be h 3, and l 3Less than l 2, b 3Less than b 2, h 3Less than h 2
Described the 3rd electronic devices and components 430 are cylinder, have a cylindrical shape the 6th side 431 and circle the 3rd end face 432.The diameter of remembering described the 3rd electronic devices and components 430 is d 1, the degree of depth is h 4
Because described first groove 310, second groove 320, the 3rd groove 330 are corresponding with first electronic devices and components 410, second electronic devices and components 420, the 3rd electronic devices and components 430 successively, that is to say, the size of described first groove 310 is corresponding with the size of first electronic devices and components 410 and tack coat 350, that is L, 2Equal l 2, B 2Equal b 2, H 2Equal h 2With A 1Add and; The size of described second groove 320 is corresponding with the size of second electronic devices and components 420 and tack coat 350, that is, and and L 3Equal l 3, B 3Equal b 3, H 3Equal h 3With A 1Add and; The size of described the 3rd groove 330 is corresponding with the size of the 3rd electronic devices and components 430 and tack coat 350, that is, and and D 4Equal d 4, H 4Equal h 4With A 1Add and.
Therefore, when described circuit board 400 is fixedly set in circuit board bearing device 300, described first electronic devices and components 410, second electronic devices and components 420, the 3rd electronic devices and components 430 can be placed in described first groove 310, second groove 320, the 3rd groove 330 just successively, as shown in Figure 8.
Concrete, during fixing described circuit board 400, the first surface 401 of circuit board 400 is contacted with described load-bearing surface 301, the 4th side 411 of described first electronic devices and components 410 contacts with first side, 311 cooperations of described first groove 310, first end face 412 of described first electronic devices and components 410 contacts with adhesive layer 350, that is, described first electronic devices and components 410 are bonded in first groove, 310 bottom surfaces 312 by adhesive layer 350; The 5th side 421 of described second electronic devices and components 420 contacts with second side, 321 cooperations of described second groove 320, second end face 422 of described second electronic devices and components 420 contacts with adhesive layer 350, and described second electronic devices and components 420 are bonded in second groove, 320 bottom surfaces 322 by adhesive layer 350; The 6th side 431 of described the 3rd electronic devices and components 430 contacts with the 3rd side 311 cooperations of described the 3rd groove 330, the 3rd end face 432 of described the 3rd electronic devices and components 430 contacts with adhesive layer 350, and described the 3rd electronic devices and components 430 are bonded in the 3rd groove 330 bottom surfaces 332 by adhesive layer 350.Thereby, but described circuit board 400 held stationary are in described circuit board bearing device 300.
Because the contact-making surface between circuit board bearing device 300 and the circuit board 400 is big, so the stress that is subjected to during surface mount is uniformly distributed in circuit board 400 everywhere, avoided the generation of the concentrated situation of electronic devices and components upper stress.In addition, the circuit board zone that is pasted with electronic devices and components is easy to produce song and sticks up, in the technical program, groove floor be provided with adhesive layer 350 with adhere to, fixedly electronic devices and components and this regional circuit board, therefore, circuit board 300 can steadily be fixed in described circuit board bearing device 300.
The circuit board bearing device in the technical program and the fixing means of circuit board have following advantage: at first, the groove of circuit board bearing device is corresponding with the electronic devices and components of circuit board first surface, make described electronic devices and components can be placed in described groove just, thereby circuit board can be stablized and is positioned over described circuit board bearing device.Secondly, the contact-making surface between circuit board and the circuit board bearing device is big, and first surface and fully contacting of load-bearing surface have been avoided the generation of the concentrated situation of electronic devices and components stress.Once more, groove floor is provided with adhesive layer, can be further fixedly electronic devices and components and circuit board, the circuit board zone that prevents to be provided with electronic devices and components produces song and sticks up.In addition, described adhesive layer has certain elasticity, can further alleviate the force-bearing situation of electronic devices and components, obtains the better effect that mounts.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.

Claims (10)

1. circuit board bearing device, it has a load-bearing surface, and described load-bearing surface is used for the bearer circuit plate, it is characterized in that, described load-bearing surface is provided with at least one groove, described groove have one with load-bearing surface groove opposite bottom surface, described groove floor is provided with adhesive layer.
2. circuit board bearing device as claimed in claim 1 is characterized in that, described groove also has the groove side that joins with load-bearing surface, and described groove side is provided with adhesive layer.
3. circuit board bearing device as claimed in claim 1 is characterized in that, described circuit board bearing device is to be selected from a kind of in copper coin, aluminium sheet, iron plate, alloy sheets or the organic composite bearing plate.
4. circuit board bearing device as claimed in claim 1 is characterized in that described adhesive layer comprises silica gel.
5. circuit board bearing device as claimed in claim 1 is characterized in that, described adhesive layer is handled through precuring, makes it have predetermined viscosity.
6. circuit board bearing device, it has a load-bearing surface, described load-bearing surface is used for the bearer circuit plate, described circuit board has a first surface that matches with load-bearing surface, described first surface is pasted with at least one electronic devices and components, it is characterized in that, described load-bearing surface is provided with at least one groove, the shape of this groove matches with the shape of electronic devices and components, this groove is used to accommodate described electronic devices and components, described groove floor is provided with adhesive layer, and this adhesive layer is used for electronic devices and components are fixed on groove.
7. circuit board bearing device as claimed in claim 6 is characterized in that the size of described groove is corresponding with the size of described electronic devices and components.
8. circuit board bearing device as claimed in claim 7 is characterized in that, the adding with big 0～0.1 millimeter of the depth ratio electronic devices and components height of described groove and bondline thickness.
9. the fixing means of a circuit board comprises step:
A kind of circuit board bearing device is provided, and it has a load-bearing surface that is used for the bearer circuit plate, and described load-bearing surface is provided with at least one groove, described groove have one with load-bearing surface groove opposite bottom surface, described groove floor is provided with adhesive layer;
A kind of circuit board is provided, and described circuit board has opposite first and second surface, and described first surface is pasted with at least one electronic devices and components, and described second surface is face to be mounted;
Described circuit board is positioned over described circuit board bearing device, the first surface of circuit board is contacted with described load-bearing surface, and make described electronic devices and components be contained in described groove, described electronic devices and components are fixed in groove floor by adhesive layer.
10. the fixing means of circuit board as claimed in claim 9, it is characterized in that, described groove also has the groove side that joins with load-bearing surface, described electronic devices and components have device side and device end face, when described electronic devices and components are contained in described groove, the groove side contacts with device side, and the adhesive layer of groove floor contacts with the device end face.
CNA2007100742336A 2007-04-27 2007-04-27 Circuit board bearing device and circuit board fixing method Pending CN101296607A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2007100742336A CN101296607A (en) 2007-04-27 2007-04-27 Circuit board bearing device and circuit board fixing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007100742336A CN101296607A (en) 2007-04-27 2007-04-27 Circuit board bearing device and circuit board fixing method

Publications (1)

Publication Number Publication Date
CN101296607A true CN101296607A (en) 2008-10-29

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ID=40066503

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100742336A Pending CN101296607A (en) 2007-04-27 2007-04-27 Circuit board bearing device and circuit board fixing method

Country Status (1)

Country Link
CN (1) CN101296607A (en)

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Open date: 20081029