CN101296597B - Heat radiating device - Google Patents

Heat radiating device Download PDF

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Publication number
CN101296597B
CN101296597B CN 200710074206 CN200710074206A CN101296597B CN 101296597 B CN101296597 B CN 101296597B CN 200710074206 CN200710074206 CN 200710074206 CN 200710074206 A CN200710074206 A CN 200710074206A CN 101296597 B CN101296597 B CN 101296597B
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CN
China
Prior art keywords
pedestal
heat abstractor
resiliency supported
upper plate
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200710074206
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Chinese (zh)
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CN101296597A (en
Inventor
李伟
吴宜强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN 200710074206 priority Critical patent/CN101296597B/en
Publication of CN101296597A publication Critical patent/CN101296597A/en
Application granted granted Critical
Publication of CN101296597B publication Critical patent/CN101296597B/en
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a heat dissipation device used for dissipating the heat of an electronic component. The device comprises a base body, a fin assembly formed by a plurality of heat dissipation fins and arranged above the base body at intervals and a bracket installed between the base body and the fin assembly; the bracket comprises a bearing face for supporting the heat dissipation fins and an elastic support sheet matched with the base body and arranged in a way of extending downwards from the bearing face. Compared with the prior art, the bracket of the invention is provided with the bearing face and the elastic support sheet; the heat dissipation fins arranged on the bearing face are elastically combined with the base body by the elastic support sheet; the elastic support sheet bends after being exposed by external force, thus playing the role of buffering to the force exerted on the heat dissipation fins and preventing the deformation of the dissipation fins.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor especially cooling electronic component.
Background technology
Electronic devices and components such as central processing unit all will produce a large amount of heat in normal running, as if the heat of untimely its generation of discharge, will influence the operation stability of electronic devices and components.Therefore, for guaranteeing the normal operation of electronic devices and components, industry is installed a heat abstractor usually and is carried out auxiliary heat dissipation on electronic devices and components.
Traditional tower heat abstractor is that radiating fin stacked in parallel that some intervals are provided with is on base, because undermost radiating fin directly or by the hard heat-conducting plate contacts with base, if radiating fin quantity is too much, perhaps the weight of radiating fin is bigger, will make the radiating fin near base bear bigger pressure; And, when heat abstractor is subjected to an external influence power, will mutual extrusion or stretching between radiating fin.Above-mentioned active force all causes radiating fin generation deformation easily, and then influences radiating efficiency.Especially when heat abstractor is in packing and the transportation, violent motion will cause its probability that deformation takes place bigger.
Summary of the invention
In view of this, be necessary the heat abstractor that a kind of difficult generation deformation is provided and has non-deformability.
A kind of heat abstractor, be used for cooling electronic component, it comprises a pedestal, the fins group that one is separated by is arranged at the pedestal top and is formed by some radiating fins, one support is installed between described pedestal and fins group, and this support comprises the continuing surface that supports radiating fin and extends setting and resiliency supported sheet that cooperate with pedestal from accepting to face down.
Compared with prior art, support of the present invention has continuing surface and reaches from the extended resiliency supported sheet of continuing surface, the radiating fin that is arranged on the continuing surface is incorporated into pedestal by resiliency supported sheet elasticity, this resiliency supported sheet is subjected to bending after the external force, can play a cushioning effect to the active force that radiating fin bears, avoid it that deformation takes place.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional combination figure of first embodiment of the invention heat abstractor.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is the stereo amplification figure of part pedestal among Fig. 2.
Fig. 4 is the inversion figure of Fig. 3.
Fig. 5 is a second embodiment of the invention heat abstractor three-dimensional combination figure.
Fig. 6 is the three-dimensional exploded view of Fig. 5.
Embodiment
The heat abstractor of first embodiment of the invention is to be used for being installed on the central processing unit heating electronic component such as (figure do not show) so that it is dispelled the heat.
See also Fig. 1 to Fig. 2, show the heat abstractor of first embodiment of the invention, this heat abstractor comprises fins group 30, that a pedestal 10, is made up of some radiating fins 32 that are set in parallel in pedestal 10 tops and is positioned at the support 20 that pedestal 10 and 30 of fins group are used to support fins group 30, and two pass support 20 and connect fins group 30 in the heat pipe 40 of pedestal 10.
Pedestal 10 comprises a upper plate 12, a lower plate 11, one first connector 13 and one second connector 14, wherein these first and second connectors, 13,14 common folders are established a temperature sensor 60 on upper plate 12, and this temperature sensor 60 is used to measure one and is installed on the heat abstractor one crosswind fan rotating speed of (figure does not show).This lower plate 11 roughly is square, and its lower surface is used for contacting with electronic devices and components, and upper surface 114 parallel two symmetrical strip first grooves 110 that are provided with are used to embed heat pipe 40.Between this 2 first groove 110 and convex respectively three fins 112 that stretch out of 2 first grooves 100 and 114 junctions of lower plate 11 upper surfaces.
Please consult Fig. 3 and Fig. 4 simultaneously, this upper plate 12 is arranged at lower plate 11 tops, and it is roughly rectangle.These upper plate 12 lower surfaces extend four projections 120 respectively downward vertically near four jiaos of places, and these projection 120 inside are communicating structure, are used to install screw rod spare 50, this upper plate 12 is fixed in circuit board (figure does not show).Upper plate 12 centre have first breach 121 of a rectangle, and these first breach, 121 both sides are outwards expanded along the minor face of upper plate 12 respectively in the part near upper plate 12 lower surfaces, form two first steps that cave in 1210, cooperate for first connector 13.2 second breach 122,126 are opened in first breach, 121 left and right sides respectively, each second breach 122,126 comprises that a rectangular indentation reaches from rectangular indentation one jiao of half circumferential notch that extends outward along upper plate 12 long limits away from first breach 121, two semicircle breach are centrosymmetric about first breach 121, and described second breach 122,126 is used to wear heat pipe 40.122,126 junctions of 2 second breach of first breach 121 and its both sides that distribute form first crossbeam 123 and second crossbeam 124 respectively, first crossbeam 123 is provided with one " V " shape the 3rd breach 1230 at upper plate 12 upper surface places, pass for the lead of temperature sensor 60; Described first crossbeam 123 and second crossbeam 124 stage portion 1232,1242 that traps out that concaves respectively at the lower surface place of upper plate 12, to cooperate and cross spacing lower plate 11 with the respective ribs 112 of lower plate 11, each stage portion 1232,1242 is provided with disymmetrical second groove 1231,1241 with ccontaining heat pipe 40.Vertically protrude from the lower surface of upper plate 12 at the center that four positive stop strips 125 are surrounded on first breach 121 uniformly, and described positive stop strip 125 is parallel to the minor face of upper plate 12 and is distributed in 2 second breach, 122,126 both sides, is placed in wherein lower plate 11 with longitudinal spacing.
As shown in Figure 3, first connector 13 comprises a rectangular body, its lower surface offers disymmetrical the 3rd groove 130 along short side direction, and these the 3rd grooves 130 are combined into the semi-cylindrical shaped passage that is used for heat pipe 40 embeddings with second groove 1231,1241 of upper plate 12; First connector, 13 upper face center places offer the 3rd breach 1230 that one " V " shape the 4th breach, 131, the four breach 131 are connected in upper plate 12 along short side direction, with ccontaining temperature sensor 60; First connector, 13 upper surface both sides are respectively to lower recess, form two second steps 132 of symmetry, to cooperate with two first steps 1210 of upper plate 12 respectively, and first connector 13 is attached in first breach 121 of upper plate 12, these first connector, 13 tops will protrude from upper plate 12 upper surfaces, cooperate to form the space of ccontaining temperature sensor 60 with second connector 14.
As shown in Figure 4, second connector 14 is arranged on the upper plate 12, it comprises a rectangular body, one surface of this body maximum, one first rectangular channel 140 that traps out that concaves, make second connector 14 form the sidewall 143 of four thickness equalizations around first rectangular channel 140, these sidewalls 143 form the lower surface 141 that cooperates with upper plate 12, and wherein a sidewall 143 is offering one second rectangular channel 142 near these lower surface 141 places, supply the lead of temperature sensor 60 to stretch out.This second connector 14 is arranged at first breach, 121 tops of upper plate 12, its lower surface 141 connects with the upper surface of upper plate 12, and first connector 13 that partly convexedly stretches in upper plate 12 upper surfaces is contained in first rectangular channel 140 of this second connector 14, the two formed space is used for ccontaining temperature sensor 60.
Again as shown in Figure 2, fins group 30 is parallel to upper plate 12 by the radiating fin 31 of some spaces and piles up and form, these radiating fin 31 relative both sides are respectively equipped with disymmetrical manhole 310, the upwards vertical bending of the inner edge of each through hole 310 is extended one first annular in conjunction with limit 311, and some these first annulars can be interconnected to form the cylindrical channel that heating tube 40 wears in conjunction with limit 311.Two opposite side of radiating fin 31 other both sides are bending downward vertically respectively, extend two flangings 312, flanging 312 is provided with buckle structure (figure does not show), some radiating fins 31 are buckled into above-mentioned fins group 30 mutually by buckle structure, this fins group 30 is arranged on the support 20, is distributed to surrounding space with the heat that heat abstractor is absorbed.
The thickness of described support 20 is greater than the thickness of radiating fin 32, and it comprises one and is used to contact the continuing surface 21 of fins group 30 and some from continuing surface 21 extended resiliency supported sheets 22.These continuing surface 21 structures are identical with radiating fin 32, its relative both sides offer two manholes 210 accordingly, the upwards vertical bending of the inner edge of each through hole 210 is extended second annular in conjunction with limit 212, further to be connected in conjunction with limit 311, together form the cylindrical channel that heating tube 40 wears with fins group 30 corresponding first annulars.Two opposite side of continuing surface 21 other both sides are bending downward vertically respectively, extend two sidewalls 221, these two sidewalls, 221 free terminals inwardly extend in opposite directions, formation is roughly parallel to two braces 222 of continuing surface 21, each brace 222 continues to extend downward vertically two pressure-bearing plates 220 in its both sides, the bonding pad 223 that each pressure-bearing plate 220 bends inwards out and is roughly parallel to continuing surface 21 away from an end of continuing surface 21, this bonding pad 223 are by welding or gummed and thermal conductance is incorporated into upper plate 12 upper surfaces.Described sidewall 221, brace 222, pressure-bearing plate 220, bonding pad 223 are together formed above-mentioned resiliency supported sheet 22, this resiliency supported sheet 22 with fins group 30 flexible fastenings in pedestal 10, because the elastic construction that this resiliency supported sheet 22 has one " ㄈ " shape and is connected in " L " shape under it, it is subjected to bending after the external force effect, can produce the double buffering effect to the active force that fins group 30 is born, avoid radiating fin 31 that deformation takes place, and because support 20 thickness greater than radiating fin 31 thickness, can increase the bulk strength of heat abstractor.
Described heat pipe 40 is roughly L-shaped, it has short evaporation section 42, one an arc adiabatic section 43 than long condensation segment 41 and connection evaporation section 42 and condensation segment 41, the evaporation section 42 of described two heat pipes 40 is parallel to each other to interlock and is placed in the pedestal 10, and adiabatic section 43 is passed second breach 12 of pedestal 10 respectively and condensation segment 41 is arranged in the fins group 30.
When assembling this heat abstractor, at first first connector 13 is arranged in first breach 121 of upper plate 12, the second step 132 of this first connector 13 is attached at the first step 1210 in upper plate 12 first breach 121, and makes the top of first connector 13 protrude from upper plate 12 upper surfaces; Respectively the condensation segment 41 of two heat pipes 40 is passed 2 second breach 122,126 of upper plate 12 afterwards perpendicular to upper plate 12, make in the semi-cylindrical shaped space that second groove 1231,1241 of the 3rd groove 130 and upper plate 12 2 first, second crossbeams 123,124 of evaporation section 42 parallel staggered embedding first connectors 13 of two heat pipes 40 connects to form; Again with the stage portion 1232,1242 that is connected to upper plate 12 2 first, second crossbeams 123,124 of fin 112 correspondences of lower plate 11, in the cylindrical space that second groove 1231,1241 that makes the evaporation section 42 of two heat pipes 40 be contained in the 3rd groove 130 of first groove 110 of lower plate 11 and first connector 13 and upper plate 12 first, second crossbeams 123,124 is fully formed, and the sidewall of lower plate 11 respectively with four positive stop strip 125 holdings mutually of upper plate 12, and lower plate 11 is fixed in upper plate 12 belows; One temperature sensor 60 is positioned in the 4th breach 131 of first connector 13, and its lead passes the 3rd breach 1230 of upper plate 12 first crossbeams 123 and derives; Subsequently, second connector 14 is positioned over upper plate 12 first breach 121 tops, its lower surface 141 contacts with upper plate 12 upper surfaces, first connector, 14 tops that convexedly stretch in upper plate 12 is contained in first rectangular channel 140 of second connector 13, and temperature sensor 60 is arranged in wherein; At last, support 20 and fins group 30 are positioned on the upper plate 12 successively, condensation segment 41 correspondences of two heat pipes 40 are arranged in the cylindrical channel that support 20 annulars are formed in conjunction with limit 311 in conjunction with the annular of limit 212 and radiating fin 31.Thus, this heat abstractor has been finished assembling process.
Understandable, the resiliency supported sheet of above-mentioned heat abstractor support can also be " L " shape, but same resiliency supported fins group is on pedestal.
To shown in Figure 6, be the heat abstractor of second embodiment of the invention as Fig. 5.This heat abstractor comprises a pedestal 10a, and is arranged at fins group 30a, on the pedestal 10a and is fixed in pedestal 10a top with the support 20a that supports fins group 30a and pass support 20a and connect fins group 30a in the heat pipe 40a of pedestal 10a.
This pedestal comprises a lower plate 11a and a guard member 12a; this lower plate 11a comprises a square body; the parallel respectively four buckle ear 110a that extend outward of the midpoint on these square body four limits; each buckle ear 110a comprises a bumping square and reaches from bumping square away from extended half round bump in one side of square body; and each buckle ear 110a offer one with the manhole 1101a of the concyclic heart of semicircle projection; wear for screw rod spare 50a, and this lower plate 11a is fixed in circuit board (figure does not show).This lower plate 11a upper face center place is provided with one and is parallel to the square body strip first groove 111a on one side, and the degree of depth of this first groove 111a is reduced gradually by middle mind-set both sides, to embed heat pipe 40a.Again; this lower plate 11a upper surface rectangular recess 112a who is used for ccontaining guard member 12a that traps out that concaves; this rectangular recess 112a is divided into symmetrical two parts by the above-mentioned first groove 11a, and its degree of depth is less than the degree of depth of the first groove 111a in this rectangular recess 112a zone.Be arranged with two screws that are distributed in the first groove 111a both sides (indicating) in this rectangular recess 112a, wear for screw 60a, with fixing guard member 12a in lower plate 11a.
This guard member 12a comprises a rectangular body, and its lower surface centre is offered second a groove 120a along this rectangular body short side direction, is used for ccontaining heat pipe 40a; Its upper surface is provided with two symmetrical manhole 121a, to wear screw 60a.
Described fins group 30a is arranged by some radiating fin 31a spaces that are parallel to lower plate 11a and forms, this radiating fin 31a is roughly rectangular, offer disymmetrical manhole 310a respectively near its two relative minor face places, the upwards vertical bending of each through hole 310a inner edge is extended an annular in conjunction with limit 311a.The bending downward vertically respectively of the two relative minor faces of this radiating fin 31a, extend two flanging 312a, each flanging 312a all has buckle structure (figure does not show), some radiating fin 31a are buckled into fins group 30a mutually by buckle structure, simultaneously, the annular of each radiating fin 31a interconnects in conjunction with limit 312a, forms a cylindrical channel that connects, and 40a wears with heating tube.
Described support 20a thickness is greater than radiating fin 31a thickness, and it comprises continuing surface 21a and reaches from the extended resiliency supported sheet of continuing surface 21a 22a.This continuing surface 21a is parallel to lower plate 11a, its two opposite side is bending downward vertically respectively, extend two flanging 210a, fasten and fins group 30a is fixed in support 20a with corresponding flanging 312a with radiating fin 31a, near offering disymmetrical manhole 211a in two above-mentioned opposite side positions, each through hole 211a inner edge upwards vertically bends out an annular in conjunction with limit 212a, further to be connected in conjunction with limit 310a with the respective annular of radiating fin 31a, forms the cylindrical channel that heating tube 40a wears.The stator 220a and one that the impact extrusion downwards of this continuing surface 21a middle part goes out two " U " shape connects two stator 220a and is lower than the brace 221a of continuing surface 21a, each stator 220a all offers " U " shape groove 2201a that is parallel to continuing surface 21a, 40a wears with heating tube, the thermo-contact by welding or gummed of the bottom 2201a of these stators 220a and lower plate 11a upper surface, this continuing surface 21a both sides not impact extrusion part contact with fins group 30a and are fixed.The above-mentioned resiliency supported sheet 22a of the common composition of this two stators 220a and a connecting piece 221a, and with fins group 30a flexible fastening in pedestal 10a, because continuing surface 21a height is greater than brace 221a height, this support 20a has two inverted "L" shaped elastic constructions and supports fins group 30a both sides, it is subjected to bending after the external force effect, the active force that can bear fins group 30a produces a cushioning effect preferably, avoid radiating fin 31a that deformation takes place, and because support 20a thickness greater than radiating fin 31a thickness, can increase the bulk strength of heat abstractor.
Described heat pipe 40a is " U " shape, have two parallel longer condensation segment 41a and a shorter evaporation section 42a who connects two condensation segment 41a, when assembling this heat abstractor, at first the evaporation section 42a with heat pipe 40a is embedded in the first groove 111a of lower plate 11a, and its two condensation segment 41a is perpendicular to lower plate 11a.Then; by screw 60a guard member 12a is fixed in lower plate 11a; this guard member 12a is arranged at lower plate 11a top; fit and guard member 12a bottom be placed in the rectangular recess 112a in the bottom surface of its lower surface and lower plate rectangular recess 112a, the space that the second groove 120a of this guard member 12a and the first groove 111a of lower plate 11a form is placed in heat pipe 40a evaporation section 42a wherein.At last, support 20a and fins group 30a are stacked gradually on lower plate 11a, in the cylindrical channel that the annular that makes the two evaporation section 41a of heat pipe 40a pass the two groove 2201a of support 20a respectively and be arranged in support 20a and fins group 30a is formed in conjunction with limit 212a, 311a, thereby finish the assembling of this heat abstractor.
In sum, the present invention is provided with the radiating fin of support on continuing surface and is incorporated into pedestal by resiliency supported sheet elasticity, this resiliency supported sheet rubber-like bending structure, it is subjected to bending after the external force, can play a cushioning effect to the active force that radiating fin bears, avoid it that deformation takes place, simultaneously, because backing thickness greater than radiating fin thickness, can increase the bulk strength of heat abstractor.

Claims (10)

1. heat abstractor, be used for cooling electronic component, it comprises a pedestal, the fins group that one is separated by is arranged at the pedestal top and is formed by some radiating fins, it is characterized in that: a support is installed between described pedestal and fins group, and this support comprises the continuing surface that supports radiating fin and extends setting and resiliency supported sheet that cooperate with pedestal from accepting to face down.
2. heat abstractor as claimed in claim 1 is characterized in that: described resiliency supported sheet extends from the side of continuing surface, and described resiliency supported sheet comprises a bonding pad that cooperates with pedestal.
3. heat abstractor as claimed in claim 2 is characterized in that: described resiliency supported sheet is one " L " shape structure.
4. heat abstractor as claimed in claim 2, it is characterized in that: the side of described continuing surface is bent into sidewall towards pedestal, the edge that this sidewall the relies on pedestal brace that extends internally out, this brace free terminal is towards pedestal bending extending pressure-bearing plate, the edge that this pressure-bearing plate relies on pedestal extends internally out and is used for the bonding pad that contacts with pedestal, and this sidewall, brace, pressure-bearing plate and bonding pad are together formed above-mentioned resiliency supported sheet.
5. heat abstractor as claimed in claim 1 is characterized in that: described resiliency supported sheet comprises two with " U " shape stator of pedestal contact and be connected this two stator and be lower than a connecting piece of continuing surface.
6. heat abstractor as claimed in claim 5 is characterized in that: described resiliency supported sheet is stamped to form downwards from the continuing surface middle part.
7. as each described heat abstractor of claim 1 to 6, it is characterized in that: the thickness of described support is greater than the thickness of radiating fin.
8. heat abstractor as claimed in claim 1 is characterized in that: this heat abstractor also comprises at least one heat pipe, and this at least one heat pipe has an evaporation section that is connected with pedestal and passes the condensation segment of described radiating fin.
9. heat abstractor as claimed in claim 1 is characterized in that: this pedestal comprises that also the upper plate and of accepting support cooperates with upper plate and is contacted with the lower plate of electronic devices and components.
10. heat abstractor as claimed in claim 9 is characterized in that: described pedestal also comprises one first connector and one second connector, and the common folder of this first connector and second connector is established a temperature sensor on upper plate.
CN 200710074206 2007-04-25 2007-04-25 Heat radiating device Expired - Fee Related CN101296597B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200710074206 CN101296597B (en) 2007-04-25 2007-04-25 Heat radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200710074206 CN101296597B (en) 2007-04-25 2007-04-25 Heat radiating device

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CN101296597A CN101296597A (en) 2008-10-29
CN101296597B true CN101296597B (en) 2011-07-27

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102378548A (en) * 2010-08-19 2012-03-14 鸿富锦精密工业(深圳)有限公司 Radiating device
CN105514095B (en) * 2015-12-18 2020-05-12 华北电力大学 Crimping type IGBT module with height-variable boss
CN105470291A (en) * 2015-12-18 2016-04-06 国网智能电网研究院 Improved crimping type IGBT device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2826512Y (en) * 2005-10-14 2006-10-11 英业达股份有限公司 Radiator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2826512Y (en) * 2005-10-14 2006-10-11 英业达股份有限公司 Radiator

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