CN101296557A - Flexible printing circuit board - Google Patents
Flexible printing circuit board Download PDFInfo
- Publication number
- CN101296557A CN101296557A CNA2007101044717A CN200710104471A CN101296557A CN 101296557 A CN101296557 A CN 101296557A CN A2007101044717 A CNA2007101044717 A CN A2007101044717A CN 200710104471 A CN200710104471 A CN 200710104471A CN 101296557 A CN101296557 A CN 101296557A
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- flexible printed
- printed wiring
- wiring board
- matrix
- metal layer
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Abstract
The invention relates to a flexible printed circuit board which comprises a substrate, a patterned metal layer formed on the surface of the substrate, and a covering layer fixed on the patterned metal layer by an adhesive layer, wherein, the thickness of the patterned metal layer ranges from 1 to 8 micrometers and the thickness of the covering layer ranges from 3 to 10 micrometers, and the total thickness of the patterned metal layer, the adhesive layer and the covering layer does not exceed 16 micrometers. The flexible printed circuit board uses the ultrathin covering layer of poly-(p-phenylene terephthalamide) (PPTA) with the thickness ranging from 3 to 10 micrometers, thus leading the total thickness of the patterned metal layer, the adhesive layer and the covering layer to be reduced to below 16 micrometers, and having better pliability and flexibility and being especially suitable for thin electronic products.
Description
Technical field
The present invention relates to a kind of flexible printed wiring board, particularly, the present invention relates to a kind of tectal flexible printed wiring board that has.
Background technology
Flexible printed wiring board (Flexible Printed Circuit, FPC) be to be that basic material combines by having flexual insulating body and Copper Foil, in order to carry various actives and passive device, after assembling, can be applicable to IT periphery, information, consumption electronic products etc., especially in the related application of mobile phone and LCD, quite high growth is arranged.Because a large amount of flexible printed wiring boards that use in the new-type electronic products such as mobile phone, display, mobile phone has become one of considerable downstream application product of flexible printed wiring board.
For mobile phone, the demand of characteristic such as (for example folding, rotation, slip lid etc.), volume be little, in light weight because colored, distinctive appearance its employed circuit board is not only significantly increased in quantity, and the functional requirement of each circuit board is also inequality.With regard to the configuration design demand of mobile phone, be gradually varied to clamshell phone, cover-slide-type handset or rotary mobile phone by in the past stand hand-set, its common point is to increase the anti-flexible printed wiring board of destroying or force to yield and can transmit a large amount of signals in the turning point.
Generally speaking, flexible printed wiring board can be divided into the double-decker that three ply board that glue system is arranged and no glue are according to its architectural difference.Usually, double-deck flexible printed wiring board can be applicable to high-density line and performance requirement high product.Moreover, owing to advantages such as the thickness of double-deck flexible printed wiring board are less relatively, and it is little to have bounce, and pliability is good, become another major product of flexible printed wiring board gradually.
Flexible printed wiring board mainly is that flexible copper foil substrate (FCCL) forms in conjunction with cover layer (Coverlay), and its copper clad laminate then comprises Copper Foil metal level and insulating body two parts.The Copper Foil that is used as metal level can be divided into rolled copper foil (Rolled Annealed Copper, RA) or electrolytic copper foil (Electrodeposited, ED) two kinds, lower but the lattice variations of the manufacturing cost of electrolytic copper foil has different othernesses with property very, is easy to generate shortcoming cracked or fracture behind the circuit etching.On the other hand, rolled copper foil flexible preferable is suitable for flexible printed wiring board, and manufacturing cost is higher, but flexible preferable, is more suitable for flexible printed wiring board.Yet the thickness of rolled copper foil also has its restriction, is unfavorable for reducing the integrated circuit plate thickness.On the other hand, reduce the Copper Foil metal layer thickness, also may cause the difficulty of circuit design and processing except increasing cost.
Therefore, still need a kind ofly can reduce integrated circuit plate thickness, promote the soft board pliability, satisfy the demand of circuit spacing miniaturization, have the flexible printed wiring board of good intensity, electrical characteristic and dimensional stability.
Summary of the invention
The flexible printed wiring board that provides a kind of flexibility high is provided main purpose of the present invention.
The flexible printed wiring board that provides a kind of pliability good is provided.
A further object of the present invention is to provide a kind of flexible printed wiring board that can reduce integral thickness.
For realizing above-mentioned and other purpose, flexible printed wiring board of the present invention comprises matrix, be formed at the patterned metal layer of this matrix surface and be fixed in cover layer on this patterned metal layer by an adhesive layer; Wherein, the thickness of this patterned metal layer is between 1 to 8 micron, and this tectal thickness is between 3 to 10 microns, and this metal level, adhesive layer, and tectal gross thickness be no more than 16 microns.This flexible printed wiring board is a used thickness between 3 to 10 microns ultra-thin cover layer, make metal level, adhesive layer, and tectal gross thickness be reduced to below 16 microns, thereby have preferable flexibility and pliability, be particularly suitable for the slimming electronic product.
Description of drawings
Fig. 1 illustrates flexible circuit board structure of the present invention; And
Fig. 2 a to Fig. 2 c is that the no glue of explanation formation is the step of double-deck copper clad laminate;
Fig. 3 is that expression the present invention is in order to carry out the device of flexibility test; And
Fig. 4 is that expression the present invention is in order to carry out the device of flexibility test.
The component symbol explanation
100 flexible printed wiring boards
120 insulating bodies
140 patterned metal layers
150 adhesive layers
160 cover layers
200 metal level raw materials
210 carriers
220 peel plies
230 Copper Foil metals
240 polyimide films
250 no glue are double-deck copper clad laminate
Embodiment
Below will further specify the present invention, scope perhaps in it should not be construed as limiting the invention in any form by specific embodiment.
Fig. 1 is the instantiation of expression flexible printed circuit board structure of the present invention.This flexible printed wiring board 100 comprises insulating body 120, and these insulating body 120 surfaces are formed with patterned metal layer 140, and 160 of cover layers fixedly are covered in this pattern metal laminar surface by patterned metal layer surface glue adhesion coating 150.The example of this insulating body comprises, but non-polyester matrix, polyethylene terephthalate matrix, polyimide matrix or liquid crystal polymer (LCP) matrix, polyethylene cycloalkanes (PEN) matrix, epoxy resin/glass fabric (FR4) matrix or its mixture of being limited to is preferably polyimide matrix.
With regard to no glue is double-deck copper clad laminate structure, can utilize the squash type rubbing method polyimides predecessor polyamic acid or polyimides coating to be coated the extra thin copper foil metal surface of metal level raw material earlier, 50 to 350 ℃ closed nitrogen oven bakings 15 to 240 minutes, dehydrate with cyclisation or directly carry out drying, form thickness between 5 to 30 microns, be preferably between 6 to 10 microns polyimide film as insulating body.
Flexible printed wiring board of the present invention, it uses the copper metal as metal level, and the example comprises, but non-cathode copper, calendering copper or sputter/plating (the Sputtering and Plating) copper of being limited to.The thickness of this copper metal layer is preferably between 1 to 5 micron between 1 to 8 micron, is more preferred between 1 to 3 micron, for example the extra thin copper foil of 1,2,3,5,8 microns of used thicknesses.Shown in Fig. 2 a to Fig. 2 c, in this instantiation, use the metal level raw material 200 that comprises carrier 210, peel ply 220, reaches extra thin copper foil metal 230.After these extra thin copper foil metal 230 surfaces form polyimide film 240, carrier 210 and peel ply 220 are peeled off, shown in Fig. 2 b, promptly forming the no glue shown in Fig. 2 c is double-deck copper clad laminate 250.
Shown in Figure 1, in the flexible printed circuit board structure of the present invention, 160 of cover layers are fixedly to be covered in this pattern metal laminar surface by patterned metal layer surface glue adhesion coating 150.This tectal thickness is preferably between 4 to 6.5 microns between 3 to 10 microns, is more preferred between 4 to 4.5 microns.In this instantiation, use the aromatic polyamide film as ultra-thin cover layer, for example use the PPTA film as the coverlay in the flexible printed circuit board structure of the present invention, or use other to have height and peel off characteristics such as transition temperature and low-expansion coefficient, electric insulating quality is good, and thickness is no more than 10 microns, preferablely is no more than 6.5 microns, the better ultra-thin cover layer that is no more than 4.5 microns.
Flexible printed wiring board of the present invention is a used thickness between 3 to 10 microns ultra-thin cover layer, the collocation extra thin copper foil is as metal level, can make this flexible printed wiring board metal level, adhesive layer, and the cover layer gross thickness be no more than 16 microns, thereby have preferable flexibility and pliability, be particularly suitable for the slimming electronic product.
Embodiment
The flexibility test
Use device shown in Figure 3 to carry out
Test condition
Voltage: AC220V
Measuring range: 410 grams
Readable: 0.001 gram
Test R angle: 2.35mm
Testing procedure
1, adjusts two feets of tester, make air level be positioned at the leveling instrument center;
2, connect instrument power source, with the instrument zero clearing;
3, open glass door, (size 10mm * 30mm) end is fixed on the holder of pallet top, and the other end is stuck on the deck at pallet center, makes test piece become one " U " font, shuts glass door after finishing with test piece;
4, rotary apparatus right-hand member knob slowly counterclockwise slowly descends deck, contacts with following square washer until it, and the R of test piece at this moment angle is 2.35mm;
5, treat that indicator light is bright after, both can read contravariant power reading;
6, after test finishes, the knob dextrorotation to original position, is opened glass door, take off test piece;
7, repeat steps 3-6 suddenly, test other test pieces.
The flexibility test
Use device shown in Figure 4 to carry out
Test condition
Working voltage: AC220V
Test R angle: 1.0mm
Testing procedure
1, adjusts two feets of tester, test piece is fixed on the tester table;
2, connect instrument power source, with the instrument zero clearing;
Set: test condition:
Spacing H:2.0mm, place, R angle: 1.0mm
Frequency: 30 times/minute
Shift motion: 32mm
3, treat that indicator light is bright after, can write down the experimental test data;
4, after test finishes, the knob dextrorotation to original position, is taken off test piece;
5, repeat above-mentioned steps, test other test pieces.
Embodiment 1
The PPTA film (poly-paraphenyleneterephthalic amide film) that uses 4.2 microns is as cover layer, utilize the epoxy resin sticker that this PPTA thin-film covering layer is pasted the layer on surface of metal of the double-deck copper clad laminate of forming to sputter Copper Foil and polyimide insulative layer, form structure shown in Figure 1.Be cut into the flexible printed wiring board specimen 1 of 10mm * 30mm, carry out the test of flexibility and flexibility, repeat three times, calculating mean value, and in flexibility test back calculating resistance varying-ratio, test result is embedded in table 1.
Embodiment 2-5
Repeat embodiment 1, according to the thickness of listed adjustment thin-film covering layer of table 1 and copper metal layer.Be cut into the flexible printed wiring board specimen of 10mm * 30mm, carry out the test of flexibility and flexibility, repeat three times, calculating mean value, and in flexibility test back calculating resistance varying-ratio, test result is embedded in table 1.
Comparative example 1-3
Repeat embodiment 1, listed according to table 1, replace 4.2 microns PPTA film as cover layer with the polyimide film of 12 microns of thickness, utilize the epoxy resin sticker that this thin-film covering layer is pasted the layer on surface of metal of the double-deck copper clad laminate of forming to sputter Copper Foil and polyimide insulative layer, form structure shown in Figure 1.Be cut into the flexible printed wiring board comparative sample 1 of 10mm * 30mm, carry out the test of flexibility and flexibility, repeat three times, calculating mean value, and in flexibility test back calculating resistance varying-ratio, test result is embedded in table 1.
Table 1
| Specimen 1 | Specimen 2 | Specimen 3 | Specimen 4 | Specimen 5 | Comparative sample 1 | Comparative sample 2 | Comparative sample 3 | |
| A. overburden cover (micron) | 4.2 | 6.2 | 9 | 4.2 | 4.2 | 12.5 | 12.5 | 12.5 |
| B. adhesive layer thickness (micron) | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| C. metal layer thickness (micron) | 1 | 1 | 1 | 3 | 5 | 1 | 3 | 5 |
| A+b+c gross thickness (micron) | 10.2 | 12.2 | 15 | 12.2 | 14.2 | 18.5 | 20.5 | 22.5 |
| Thickness of insulating layer (micron) | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Flexibility (gf) | 3 | 5 | 8 | 5 | 10 | 12 | 12 | 13 |
| Flexibility (ten thousand times) | 50 | 50 | 50 | 40 | 40 | 30 | 30 | 25 |
Show that according to table 1 result flexible printed wiring board of the present invention has preferable flexibility and flexibility, after the specimen test piece was carried out 400,000 times or simulated the flexibility test of slide phone slip up to 500,000 times, its circuit still can keep normal electrical property efficiency.
Above-mentioned specification and embodiment only are illustrative principle of the present invention and effect thereof, but not are used to limit the present invention.
Claims (15)
1. a flexible printed wiring board is characterized in that, comprising:
Matrix;
Patterned metal layer, it is formed at this matrix surface; And
Cover layer, it is fixed on this patterned metal layer by an adhesive layer; Wherein, the thickness of this patterned metal layer is between 1 to 8 micron, and this tectal thickness is between 3 to 10 microns, and this metal level, adhesive layer, and tectal gross thickness be no more than 16 microns.
2. flexible printed wiring board according to claim 1 is characterized in that, this metal layer thickness is between 1 to 5 micron.
3. flexible printed wiring board according to claim 2 is characterized in that, this metal layer thickness is between 1 to 3 micron.
4. flexible printed wiring board according to claim 1 is characterized in that, this tectal thickness is between 4 to 6.5 microns.
5. flexible printed wiring board according to claim 4 is characterized in that, this tectal thickness is between 4 to 4.5 microns.
6. flexible printed wiring board according to claim 1, it is characterized in that this matrix is selected from polyester matrix, polyethylene terephthalate matrix, polyimide matrix or liquid crystal polymer matrix, polyethylene cycloalkanes matrix, cohort that epoxy resin/glass fabric matrix or its mixture are constituted.
7. flexible printed wiring board according to claim 1 is characterized in that, this matrix is a polyimide matrix.
8. flexible printed wiring board according to claim 1 is characterized in that, this metal level is a copper metal layer.
9. flexible printed wiring board according to claim 8 is characterized in that, this copper metal layer is the sputter copper metal layer.
10. flexible printed wiring board according to claim 1 is characterized in that, this cover layer is the PPTA film.
11. a coverlay that is used for flexible printed wiring board is characterized in that, the adhesive layer that comprises thin layer and be formed at this thin layer surface, and the thickness of this thin layer is between 3 to 10 microns.
12. coverlay according to claim 11 is characterized in that, this thin layer is the PPTA film.
13. a flexible copper foil substrate that is used for flexible printed wiring board is characterized in that, the metal level that comprises matrix and be formed at this matrix surface, and this metal layer thickness is between 1 to 8 micron.
14. flexible copper foil substrate according to claim 13 is characterized in that, this metal level is a copper metal layer.
15. flexible copper foil substrate according to claim 14 is characterized in that, this copper metal layer is the sputter copper metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710104471 CN101296557B (en) | 2007-04-23 | 2007-04-23 | Flexible printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710104471 CN101296557B (en) | 2007-04-23 | 2007-04-23 | Flexible printing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101296557A true CN101296557A (en) | 2008-10-29 |
| CN101296557B CN101296557B (en) | 2011-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710104471 Active CN101296557B (en) | 2007-04-23 | 2007-04-23 | Flexible printing circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN101296557B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102791079A (en) * | 2012-08-13 | 2012-11-21 | 广东生益科技股份有限公司 | Manufacturing method of flexible circuit board and flexible circuit board manufactured by using manufacturing method |
| CN102791086A (en) * | 2012-08-13 | 2012-11-21 | 广东生益科技股份有限公司 | Manufacturing method of rigid-flexible combined circuit board |
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103802390A (en) * | 2012-11-08 | 2014-05-21 | 三星电机株式会社 | Copper-clad laminate, method for manufacturing the same, and printed circuit board including the same |
| TWI633820B (en) * | 2016-10-31 | 2018-08-21 | HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | Hollowed printed circuit board and method for manufacturing same |
| CN113789053A (en) * | 2021-09-13 | 2021-12-14 | 宁夏清研高分子新材料有限公司 | High-heat-resistance TLCP material and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6596391B2 (en) * | 1997-05-14 | 2003-07-22 | Honeywell International Inc. | Very ultra thin conductor layers for printed wiring boards |
| AU6207100A (en) * | 1999-07-09 | 2001-01-30 | Shipley Company, L.L.C. | Method of forming a thin metal layer on an insulating substrate |
| CN1781348A (en) * | 2003-12-05 | 2006-05-31 | 三井金属矿业株式会社 | Printed wiring board, its manufacturing method, and circuit device |
-
2007
- 2007-04-23 CN CN 200710104471 patent/CN101296557B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103547132B (en) * | 2012-07-17 | 2017-03-22 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN102791079A (en) * | 2012-08-13 | 2012-11-21 | 广东生益科技股份有限公司 | Manufacturing method of flexible circuit board and flexible circuit board manufactured by using manufacturing method |
| CN102791086A (en) * | 2012-08-13 | 2012-11-21 | 广东生益科技股份有限公司 | Manufacturing method of rigid-flexible combined circuit board |
| CN102791079B (en) * | 2012-08-13 | 2015-06-17 | 广东生益科技股份有限公司 | Manufacturing method of flexible circuit board and flexible circuit board manufactured by using manufacturing method |
| CN103802390A (en) * | 2012-11-08 | 2014-05-21 | 三星电机株式会社 | Copper-clad laminate, method for manufacturing the same, and printed circuit board including the same |
| TWI633820B (en) * | 2016-10-31 | 2018-08-21 | HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | Hollowed printed circuit board and method for manufacturing same |
| CN113789053A (en) * | 2021-09-13 | 2021-12-14 | 宁夏清研高分子新材料有限公司 | High-heat-resistance TLCP material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101296557B (en) | 2011-07-06 |
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Owner name: KUNSHAN YASHEN ELECTRON MATERIAL SCIENCE CO., LTD. Free format text: FORMER OWNER: ASIA ELECTRIC WORKS CO., LTD. Effective date: 20090814 |
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Effective date of registration: 20090814 Address after: 169, Huangpu Road, Kunshan Economic Development Zone, Jiangsu, China: 215300 Applicant after: Asia Electronic Materials Co., Ltd. Address before: Hsinchu County, Taiwan, China Applicant before: Asia Electronic Material Co., Ltd. |
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