CN101295731A - Semiconductor device - Google Patents
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- CN101295731A CN101295731A CNA2007100402527A CN200710040252A CN101295731A CN 101295731 A CN101295731 A CN 101295731A CN A2007100402527 A CNA2007100402527 A CN A2007100402527A CN 200710040252 A CN200710040252 A CN 200710040252A CN 101295731 A CN101295731 A CN 101295731A
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Abstract
The invention relates to a semiconductor device which comprises a semiconductor substrate, a gate dielectric layer positioned on the semiconductor substrate, a gate positioned on the gate dielectric layer and sources and drains positioned on both sides of gate channel layer in the semiconductor substrate. The semiconductor device of the invention is characterized in that main charged ions of gate channel layer on the substrate and of the sources and drains on both sides are the same morphology without converting to inversion ions to form the conductive layer. By using the difference between ion concentration doped on the gate channel layer semiconductor substrate and ion concentration doped on the source and the drain, with the effect of applied lateral voltage at the source/drain, electron or hole of the gate channel is restrained to non-conducting state while under free motion state with influence of longitudinal applied electric field. The electronic mobility accelerates rapidly along with transverse electric field in order to control the conductivity between the source and the drain. The semiconductor device of the invention can provide a semiconductor device with more rapid speed, lower supply voltage and higher density.
Description
Technical field
The present invention relates to technical field of semiconductors, the foundation structure of particularly a kind of metal-oxide semiconductor (MOS) (MOS) device and running principle.
Background technology
Traditional MOS semiconductor device structure, the alloy of the alloy of gate channel layer and the source electrode of both sides and drain electrode is veriform charged ion kenel, can be with reference to Handbook ofSemiconductor Manufacturing Technology, Edited by Yoshio Nishi andRobert Doering, publisher Marcel Dekker, Inc.in 2000.Chapter 5, by RobertB.Simonton, Walter Class, Yuri Erokhin, Michael Mack, and LeonardRubin.Fig. 1 is the structural representation of prior art semiconductor device.Semiconductor device 100 as shown in Figure 1 is formed with successively on the Semiconductor substrate 101 and isolates shallow trench 102, P trap 103 and N trap 104.In P trap 103, form the NMOS element successively; Described NMOS element comprises gate channel layer 105, dielectric layer 106 and grid 107, the light doping section 108 of source electrode and drain electrode, the bag doped region 109 of source electrode and drain electrode, and the clearance wall 110 of grid 107 both sides, with the heavily doped region 111 of source electrode and drain electrode, and the linkage interface layer 112 of source electrode, drain electrode and grid.In N trap 104, form the PMOS element successively; Described PMOS element comprises gate channel layer 105 ', dielectric layer 106 ' and grid 107 ', the light doping section 108 ' of source electrode and drain electrode, the bag doped region 109 ' of source electrode and drain electrode, and the clearance wall 110 ' of grid 107 ' both sides, with the heavily doped region 111 ' of source electrode and drain electrode, and the linkage interface layer 112 ' of source electrode, drain electrode and grid.
In the application and manufacturing process of reality, because the consideration of grid and source/drain electrode engineering design, gate channel layer 105 and 105 ' formation can use repeatedly ion to inject to form anti-trap dopant ion CONCENTRATION DISTRIBUTION, with control threshold voltage and subthreshold value (Subthreshold) leakage current.Can be with reference to research paper (the Dimitri A.Antoniadis and James E.Chung of Massachusetts Institute Technology, 1991 IEEE IEDM Technical Digest, or the breadboard research paper (T.Skotnicki﹠amp of Grenoble, France communication the 21-24 page or leaf); P.Bouillon, 1996 IEEE Symposium onVLSI Technology Technical Digest, the 152-153 page or leaf) with (Tomasz Skotnicki, Gerard Merckel, and Thierry Pedron, March 1988, IEEE Electron DeviceLetters, Vol.9, No.2,109-112 page or leaf).Lightly-doped source/drain electrode 108 and 108 ' can be avoided hot carrier's effect, and the bag doped region 109 and 109 ' of source/drain electrode can reduce the break-through leakage current, and heavy-doped source/drain electrode 111 and 111 ' provides and the extraneous low resistance ohmic contact interface 112 and 112 ' that is connected.Than gate channel layer is dark P trap 103 and the effect of N trap 104, can reduce substrate leakage current on the one hand, on the other hand NMOS and PMOS are isolated, to avoid between NMOS and PMOS, forming breech lock (latch-up) effect, use repeatedly ion to inject P trap 103 and 104 layers of N traps, can reach dual and better effect.Some application more forms dark P trap and dark N trap (not shown in figure 1) in the depths 104 layers of P trap 103 and N traps; Its purposes comprises the holder mess code of avoiding cosmic ray to cause, can be with reference to the research special edition (IBM Journal of Research andDevelopment, Vol.40, No.1, January 1996, the 3-129 pages or leaves) of U.S. IBM.Comprise at the same time on the wafer of simulation and digital signal, can reduce the interference between digital signal and the analog signal, can be with reference to research paper (David K.Su, Marc J.Loinaz, the Shoichi Masui at Standford integration system center, Bruce A.Wooley, IEEE Journal of Solid-State Circuits, Vol.28, No.4, April 1993, the 420-430 pages or leaves).
Ion implantation technology is to form P type trap or N type trap in Semiconductor substrate, and the light doping section of the gate channel layer of formation NMOS element and source/drain electrode and the bag doped region of source/drain electrode and the heavily doped region of source/drain electrode, the most popular method of the bag doped region of the gate channel layer of formation PMOS element and the light doping section of source/drain electrode and source/drain electrode and the heavily doped region of source/drain electrode.The degree of depth that the decision ion injects and the parameter of CONCENTRATION DISTRIBUTION are the acceleration energy of ion, the unit are density of ion, ion implantation angle, employed temperature and time during high annealing.The effect of high annealing can be repaired the defective that causes because of the high energy ion collision, adjusts the distribution of ion concentration, simultaneously with the ion excitation that injects.Can be with reference to the research paper at Standford electronics center, James F.Gibbons IEEE Proceedings, Vol.56, No.3, March 1968, the 295-319 page or leaf, with James F.Gibbons IEEE Proceedings, Vol.60, No.9, September 1972, the 1062-2006 pages or leaves.Because the requirement of MOS device in the process of dwindling, ion implantation technique has extended to lower and higher energy, higher unit are density.Simultaneously, the employed temperature of high annealing also progressively reduces, and the time also shortens.Can be with reference to Source Drain and Wells by HiroshiIwai (Tokyo Institute of Technology), 1999 IEDM Short Course onSub-100nm CMOS, Organizer:Mark Bohr, Washington, D.C., USA.
Traditional MOS semiconductor device structure, NMOS places in the P trap basically, and PMOS places in the N trap, and source/drain electrode is then used the different shaped conductive ion with gate channel layer.Add in nothing under the state of longitudinal voliage, source/drain electrode is under the effect that adds lateral voltage, since the reverse PN joint between the passage, the non-conducting electric current.Utilize gate channel layer under the influence of vertical extra electric field, convert the characteristic of transoid conductive ion to, form current channel.Because the characteristic of PN joint is at the boundary layer formation ion depletion region of transoid conductive ion.This ion depletion region can have influence on and add the transoid conductive ion quantity that longitudinal voliage produces, and the empty consumption of a part of applied voltage is forming the ion depletion region.
Above-mentioned MOS semiconductor device structure becomes the motive force of semiconductor technology evolves.Semiconductor fabrication develops towards the direction that the grid groove size is done littler and littler and applied voltage is more and more low.Traditional MOS structure adopts more and more thin dielectric substance layer, adding the effect of highfield, and improves the dopant ion concentration of gate channel layer, with control saturation current and leakage current.Along with the shortening of device channel length, the doped source of requirement/drain electrode degree of depth is also more and more shallow, and the space that can be used to control reverse PN joint ion depletion region is also less and less.Have traditional MOS semiconductor device of three ion depletion regions, available space descends fast, and in the situation that applied voltage reduces, saturation current can't reach the numerical value of expection.
Summary of the invention
The problem that the present invention solves provides a kind of semiconductor device, particularly a kind of foundation structure of semiconductor device and operation principles.Because among the structure of semiconductor device of the present invention, the isolation between the source electrode of gate channel layer and both sides and the drain electrode need not to rely on the PN joint, can more effectively utilize the field effect that adds running voltage.When reducing voltage, can reach required saturation current.Be applicable to the littler and higher semiconductor element of density of making.
One aspect of the present invention provides a kind of semiconductor device, comprise Semiconductor substrate, be positioned at gate dielectric on the Semiconductor substrate, be positioned at the grid on the gate dielectric, source electrode and drain electrode with being positioned at gate channel layer and dielectric layer both sides in the Semiconductor substrate is characterized in that: the main charged ion in the gate channel layer on the described substrate and the source electrode of both sides and the drain electrode is identical kenel.
Described Semiconductor substrate is the mixture of silicon or quadrivalent element material or trivalent and pentad.Include the trivalent ion alloy in the described gate channel layer, described alloy be among boron, boron fluoride, gallium, indium, thallium or the aluminium any one or multiple.The concentration of described gate channel layer intermediate ion alloy is 1E14 to 2E16/cm3 or 1E15 to 2E17/cm
3Described source electrode and the drain electrode in include the trivalent ion alloy, described alloy be among boron, boron fluoride, gallium, indium, thallium or the aluminium any one or multiple.The concentration of described source electrode and drain electrode intermediate ion alloy is 2E18 to 2E21/cm3 or 1E19 to 4E21/cm3.
A kind of semiconductor device is provided on the other hand, comprise Semiconductor substrate, be positioned at a N type trap and the 2nd N type trap on the Semiconductor substrate, a described N type trap and the 2nd N type trap have gate channel layer respectively, gate dielectric, be positioned at grid and the clearance wall that is positioned at the grid both sides on the gate dielectric on the gate dielectric, and the source electrode and the drain electrode that are positioned at gate channel layer and dielectric layer both sides in the Semiconductor substrate, along source electrode, the linkage interface layer that extend on drain and gate surface is characterized in that: the gate channel layer on the described substrate with the source electrode of both sides and the main charged ion in draining be identical kenel.
Described Semiconductor substrate is the mixture of silicon or quadrivalent element material or trivalent and pentad.
Include pentavalent ion doping thing in the described N type trap, described alloy is any one among phosphorus, arsenic, antimony, bismuth or the nitrogen, and is perhaps multiple.
Include the trivalent ion alloy in the described gate channel layer, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.
Include the trivalent ion alloy in described source electrode and the drain electrode, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.
The concentration of described N type trap intermediate ion alloy is that 1E16 is to 4E19/cm3.
The concentration of the gate channel layer intermediate ion alloy of a described N type trap is that 1E14 is to 2E16/cm3.The concentration of the source electrode of a described N type trap and drain electrode intermediate ion alloy is that 2E18 is to 2E21/cm3.
The concentration of the gate channel layer intermediate ion alloy of described the 2nd N type trap is that 1E15 is to 2E17/cm3.The concentration of the source electrode of described the 2nd N type trap and drain electrode intermediate ion alloy is that 1E19 is to 4E21/cm3.
Described linkage interface layer includes metal silicide.The metal ingredient of described metal silicide contains cobalt, nickel, molybdenum, titanium, tungsten, copper or niobium.
The thickness of described gate dielectric is 10 to 100 dusts.
The clearance wall of described grid both sides is a single or multiple lift silicide dielectric medium.
Described semiconductor device also comprises the N+ bag doped region that is positioned at the gate channel layer both sides.The concentration of the N+ bag doped region ion doping thing of described gate channel layer both sides is that 2E17 is to 4E19/cm3.
Compared with prior art, the present invention has the following advantages:
The gate channel layer of semiconductor device of the present invention on substrate is identical kenel with the source electrode of both sides and the main charged ion of drain electrode.Utilize extra electric field to change the conductivity that to bring charge carrier in the control channel layer of charge carrier, and need not utilize the gate channel layer between source/drain electrode to form the conductivity that the transoid conductive layer is controlled charge carrier.Analyze from structure, semiconductor device provided by the invention is equivalent to the null situation of gate channel layer length of traditional semiconductor device.Semiconductor device structure provided by the invention only has a PN joint longitudinally between raceway groove and bottom N trap, can utilize the concentration of the N+ bag doped region ion doping thing of the PN joint of vertical direction and gate channel layer both sides to downgrade the leakage current of gate channel layer.Correspondingly, transverse electric field effect and vertical electric field effect are separated, reach size of dwindling element and the effect that improves element, add the grid groove and the source/drain electrode that utilize the homotype charged ion, greatly reduce in the space of ion depletion region, in the situation that applied voltage reduces, also can reach the saturation current numerical value of expection.Because the isolation between the source electrode of gate channel layer and both sides and the drain electrode need not the PN joint, directly utilizes the homotype ion to isolate in the potential difference that different concentration of dopant produced, and can reduce external working voltage.Semiconductor device of the present invention has following advantage:
1, semiconductor device provided by the invention is 0.4 to 0.6 volt at applied voltage and can operates, and does not need can finish electric transmission through forming the transoid conductive ion under lower electric field action;
2, semiconductor device provided by the invention does not need through forming the transoid conductive ion, and speed can be faster;
3, under the alive outside influence of semiconductor device provided by the invention, the hot end of source/drain, owing to there is not an ion depletion region, electric field is more uniform to be distributed in whole raceway groove, and hot carrier's effect is reduced greatly;
4, semiconductor device provided by the invention can reduce running voltage, is applicable to that manufacturing is littler, the higher and more reliable semiconductor element of density;
5, semiconductor device provided by the invention can use in a big way source/drain and the dopant ion concentration of gate channel layer and gate dielectric layer thickness in a big way;
6, semiconductor device provided by the invention can be simplified the semiconductor device processing procedure.
Description of drawings
By the more specifically explanation of the preferred embodiments of the present invention shown in the accompanying drawing, above-mentioned and other purpose, feature and advantage of the present invention will be more clear.Reference numeral identical in whole accompanying drawings is indicated identical part.Painstakingly do not draw accompanying drawing in proportion, focus on illustrating purport of the present invention.In the accompanying drawings, for cheer and bright, amplified the thickness in layer and zone.
Fig. 1 is the structural representation of prior art semiconductor device;
Fig. 2 is a semiconductor device foundation structure schematic diagram of the present invention;
Fig. 2 A is a semiconductor device operation principle schematic diagram of the present invention;
Fig. 3 is the structural representation of semiconductor device first embodiment of the present invention;
Fig. 4 is the structural representation of semiconductor device second embodiment of the present invention.
Described schematic diagram is an example, and it should not limit the scope of protection of the invention at this.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention.Therefore the present invention is not subjected to the restriction of following public concrete enforcement.
Essence of the present invention is the change of the basic principle of semiconductor device structure, it is characterized in that the gate channel layer on the substrate is identical kenel with the source electrode of both sides and the charged ion of drain electrode.The potential barrier of utilizing the difference of ion implantation doping ion concentration to cause form source electrode through grid to the isolation between the drain electrode.Owing to there is not the PN joint in the structure, potential barrier is lower than 0.7 volt that contains the PN joint usually, and corresponding running zone potential change is lower than half of semi-conductive band gap; The semiconductor that with silicon is substrate is an example, is about 0.55 volt.Described semiconductor device add running voltage, can be reduced to 0.4 to 0.6 volt.
Fig. 2 is a semiconductor device foundation structure schematic diagram of the present invention.Semiconductor device of the present invention referring to structure shown in Figure 2 200, is formed with gate channel layer 205 on the Semiconductor substrate 201, dielectric layer 206 and grid 207, the doped region 208 of source electrode and drain electrode and 208 ' and the linkage interface layer 212 of source electrode, drain electrode and grid.Wherein, the source electrode of gate channel layer 205 and both sides is identical kenel with charged ion in the doped region of drain electrode 208 and 208 ', wherein include the trivalent ion alloy in the gate channel layer 205, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, perhaps multiple, the concentration of ion doping thing is that 1E14 is to 2E16/cm3.Also include the trivalent ion alloy in the doped region 208 and 208 ' of described source electrode and drain electrode, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple, and the concentration of ion doping thing is that 2E18 is to 2E21/cm3.In another embodiment of above-mentioned foundation structure, the concentration of the ion doping thing in the gate channel layer 205 be 1E15 to 2E17/cm3, the concentration of the ion doping thing in the doped region 208 and 208 ' of source electrode and drain electrode is that 1E19 is to 4E21/cm3.
Described Semiconductor substrate 201 is the mixture of silicon or quadrivalent element material or trivalent and pentad.Described linkage interface layer 212 includes metal silicide, and the metal ingredient of described metal silicide contains cobalt, nickel, molybdenum, titanium, tungsten, copper or niobium.
The operation principle of semiconductor device of the present invention is referring to the energy band diagram shown in Fig. 2 A.Fig. 2 A be depicted as source electrode 208 among Fig. 2, gate channel layer 205, and drain electrode 208 ' between valency electricity district energy band diagram, this figure corresponding to the dopant ion concentration of gate channel layer among Fig. 2 205 far below the situation of source electrode 208 with drain electrode 208 '.Under the thermal equilibrium state of no applied voltage, each interval fermi level of semiconductor device structure is identical, forms potential difference between the source electrode of gate channel layer and both sides and the drain electrode less than 0.55 volt potential barrier 230.With this understanding, solid line 208,205,208 ' represents that each interval valency electricity district can be with.Source electrode is when adding positive voltage 231, and the valency of source electrode electricity district can be with 208 to move to 233, and the valency electricity district of gate channel layer can be with 208 ' no change with the electric district of the valency of drain electrode with 205, and semiconductor device is in non-conductive state.When grid had an applied voltage 232, if the positive voltage that adds as, be ostracised away from channel layer in the hole, can be with 205 to strengthen gate channel layer and drain electrode valency electricity along 234 directions and distinguish and can be with poorly corresponding to gate channel layer valency electricity district, and semiconductor device is in non-conductive state.If the negative voltage that adds as, the hole is attracted to channel layer, can be with 205 to change along 232 directions corresponding to gate channel layer valency electricity district, and potential barrier reduces, and when voltage reaches threshold voltage, shown in 235 dotted lines among the figure, semiconductor device is in conduction state.The hole flows to drain electrode from source electrode, and sense of current also is to flow to drain electrode from source electrode.
Fig. 3 is the structural representation of semiconductor device first embodiment of the present invention.With reference to the structure 300 of semiconductor device of the present invention first embodiment shown in Figure 3, be formed with successively on the Semiconductor substrate 301 and isolate shallow trench 302, N type trap 303 and 304.In N type trap 303, be formed with the PMOS element; Described PMOS element comprises gate channel layer 305, dielectric layer 306 and grid 307, the clearance wall 310 of grid both sides, the doped region 308 and 308 of source electrode and drain electrode ", and the linkage interface layer 312 of source electrode, drain electrode and grid.The PMOS element that forms in N type trap 304 comprises gate channel layer 305 ', dielectric layer 306 ' and grid 307 ', the clearance wall 310 ' of grid both sides, the doped region 308 ' of source electrode and drain electrode " with 308 ', and the linkage interface layer 312 ' of source electrode, drain electrode and grid.
Above-mentioned Semiconductor substrate 301 is the mixture of silicon or quadrivalent element material or trivalent and pentad.Include pentavalent ion doping thing in described N type trap 303 and 304, described alloy is any one among phosphorus, arsenic, antimony, bismuth or the nitrogen, and is perhaps multiple, and the concentration of ion doping thing is that 1E16 is to 4E19/cm3.
Include the trivalent ion alloy in the described gate channel layer 305, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.The doped region 308 and 308 of described source electrode and drain electrode " in also include the trivalent ion alloy, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.The concentration of described gate channel layer 305 intermediate ion alloys is that 1E14 is to 2E16/cm3.The doped region 308 and 308 of described source electrode and drain electrode " concentration of intermediate ion alloy is that 2E18 is to 2E21/cm3.
Include the trivalent ion alloy in the described gate channel layer 305 ', described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.The doped region 308 ' and 308 ' of described source electrode and drain electrode " in also include the trivalent ion alloy, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.Wherein, the concentration of described gate channel layer 305 ' intermediate ion alloy be 1E15 to 2E17/cm3, the doped region 308 ' and 308 ' of described source electrode and drain electrode " concentration of intermediate ion alloy is that 1E19 is to 4E21/cm3.
The thickness of described gate dielectric 306 is 10 to 100 dusts.Described linkage interface layer 312 includes metal silicide.The metal ingredient of described metal silicide contains cobalt, nickel, molybdenum, titanium, tungsten, copper or niobium.The clearance wall 310 of described grid both sides is a single or multiple lift silicide dielectric medium.
The thickness of described gate dielectric 306 ' is 10 to 100 dusts.Described linkage interface layer 312 ' includes metal silicide.The metal ingredient of described metal silicide contains cobalt, nickel, molybdenum, titanium, tungsten, copper or niobium.The clearance wall 310 ' of described grid both sides is a single or multiple lift silicide dielectric medium.
Fig. 4 is the structural representation of semiconductor device second embodiment of the present invention.With reference to semiconductor device structure of the present invention 400 shown in Figure 4, be formed with successively on the Semiconductor substrate 401 and isolate shallow trench 402, N type trap 403 and 404.In N type trap 403, be formed with the PMOS element; Described PMOS element comprises gate channel layer 405, dielectric layer 406 and grid 407, the clearance wall 410 of grid both sides, the doped region 408 and 408 of source electrode and drain electrode "; and the bag doped region 409 and 409 of source electrode and drain electrode " and the linkage interface layer 412 of source electrode, drain electrode and grid.The PMOS element that forms in N type trap 404 comprises gate channel layer 405 ', dielectric layer 406 ' and grid 407 ', the clearance wall 410 ' of grid both sides, the doped region 408 ' and 408 ' of source electrode and drain electrode "; and the bag doped region 409 ' of source electrode and drain electrode " with 409 ' and the linkage interface layer 412 ' of source electrode, drain electrode and grid.Semiconductor device structure 400 in the present embodiment only is to have increased bag doped region 409 and 409 with the difference of aforesaid semiconductor device architecture 300 " and bag doped region 409 ' and 409 ' ".Above-mentioned bag doped region can further reduce the leakage current between the source electrode and drain electrode in the substrate.In N type trap 403 and 404, the bag doped region 409,409 ", 409 ' and 409 ' " the dopant ion type be N
+Type.Include pentavalent ion doping thing in the N+ bag doped region ion, described alloy is any one among phosphorus, arsenic, antimony, bismuth or the nitrogen, and is perhaps multiple.The concentration of alloy is that 2E17 is to 4E19/cm3.
In sum, semiconductor device of the present invention and preparation method thereof provides a kind of operation principles, and the gate channel layer in the structure of semiconductor device is identical kenel with the source electrode of both sides and the charged ion of drain electrode.The structure of semiconductor device of the present invention belongs to the basic principle and the application of semiconductor element, may extend into various designs thus and is not connected with circuit with the variation of application and exemplifies one by one.Comprise logic element, magazine member, driver element, recipient element, controller component, microprocessing systems element, with system element etc., all at the protection range of semiconductor device of the present invention.
Though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention.Any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize the method and the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, all still belongs in the scope of technical solution of the present invention protection any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (24)
1, a kind of semiconductor device, comprise Semiconductor substrate, be positioned at gate dielectric on the Semiconductor substrate, be positioned at the grid on the gate dielectric, source electrode and drain electrode with being positioned at gate channel layer and dielectric layer both sides in the Semiconductor substrate is characterized in that: the main charged ion in the gate channel layer on the described substrate and the source electrode of both sides and the drain electrode is identical kenel.
2, semiconductor device according to claim 1 is characterized in that: described Semiconductor substrate is the mixture of silicon or quadrivalent element material or trivalent and pentad.
3, semiconductor device according to claim 1 is characterized in that: include the trivalent ion alloy in the described gate channel layer, described alloy be among boron, boron fluoride, gallium, indium, thallium or the aluminium any one or multiple.
4, semiconductor device according to claim 3 is characterized in that: the concentration of described gate channel layer intermediate ion alloy is that 1E14 is to 2E16/cm3.
5, semiconductor device according to claim 1 is characterized in that: described source electrode and the drain electrode in include the trivalent ion alloy, described alloy be among boron, boron fluoride, gallium, indium, thallium or the aluminium any one or multiple.
6, semiconductor device according to claim 5 is characterized in that: the concentration of described source electrode and drain electrode intermediate ion alloy is that 2E18 is to 2E21/cm3.
7, semiconductor device according to claim 3 is characterized in that: the concentration of described gate channel layer intermediate ion alloy is that 1E15 is to 2E17/cm
3
8, semiconductor device according to claim 5 is characterized in that: the concentration of described source electrode and drain electrode intermediate ion alloy is that 1E19 is to 4E21/cm3.
9, a kind of semiconductor device, comprise Semiconductor substrate, be positioned at a N type trap and the 2nd N type trap on the Semiconductor substrate, a described N type trap and the 2nd N type trap have gate channel layer respectively, gate dielectric, be positioned at grid and the clearance wall that is positioned at the grid both sides on the gate dielectric on the gate dielectric, and the source electrode and the drain electrode that are positioned at gate channel layer and dielectric layer both sides in the Semiconductor substrate, along source electrode, the linkage interface layer that extend on drain and gate surface is characterized in that: the gate channel layer on the described substrate with the source electrode of both sides and the main charged ion in draining be identical kenel.
10, semiconductor device according to claim 9 is characterized in that: described Semiconductor substrate is the mixture of silicon or quadrivalent element material or trivalent and pentad.
11, semiconductor device according to claim 9 is characterized in that: include pentavalent ion doping thing in the described N type trap, described alloy is any one among phosphorus, arsenic, antimony, bismuth or the nitrogen, and is perhaps multiple.
12, semiconductor device according to claim 9 is characterized in that: include the trivalent ion alloy in the described gate channel layer, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.
13, semiconductor device according to claim 9 is characterized in that: include the trivalent ion alloy in described source electrode and the drain electrode, described alloy is any one among boron, boron fluoride, gallium, indium, thallium or the aluminium, and is perhaps multiple.
14, semiconductor device according to claim 11 is characterized in that: the concentration of described N type trap intermediate ion alloy is that 1E16 is to 4E19/cm3.
15, according to claim 9 or 12 described semiconductor device, it is characterized in that: the concentration of the gate channel layer intermediate ion alloy of a described N type trap is that 1E14 is to 2E16/cm3.
16, according to claim 9 or 13 described semiconductor device, it is characterized in that: the concentration of the source electrode of a described N type trap and drain electrode intermediate ion alloy is that 2E18 is to 2E21/cm3.
17, according to claim 9 or 12 described semiconductor device, it is characterized in that: the concentration of the gate channel layer intermediate ion alloy of described the 2nd N type trap is that 1E15 is to 2E17/cm3.
18, according to claim 9 or 13 described semiconductor device, it is characterized in that: the concentration of the source electrode of described the 2nd N type trap and drain electrode intermediate ion alloy is that 1E19 is to 4E21/cm3.
19, semiconductor device according to claim 9 is characterized in that: described linkage interface layer includes metal silicide.
20, semiconductor device according to claim 19 is characterized in that: the metal ingredient of described metal silicide contains cobalt, nickel, molybdenum, titanium, tungsten, copper or niobium.
21, semiconductor device according to claim 9 is characterized in that: the thickness of described gate dielectric is 10 to 100 dusts.
22, semiconductor device according to claim 9 is characterized in that: the clearance wall of described grid both sides is a single or multiple lift silicide dielectric medium.
23, semiconductor device according to claim 9 is characterized in that: described semiconductor device also comprises the N+ bag doped region that is positioned at the gate channel layer both sides.
24, semiconductor device according to claim 23 is characterized in that: the concentration of the N+ bag doped region ion doping thing of described gate channel layer both sides is that 2E17 is to 4E19/cm3.
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| CNA2007100402527A CN101295731A (en) | 2007-04-24 | 2007-04-24 | Semiconductor device |
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| CNA2007100402527A CN101295731A (en) | 2007-04-24 | 2007-04-24 | Semiconductor device |
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| CN101295731A true CN101295731A (en) | 2008-10-29 |
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2007
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