CN101269445A - Stannum-copper binary alloy leadless solder paste - Google Patents
Stannum-copper binary alloy leadless solder paste Download PDFInfo
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- CN101269445A CN101269445A CNA2007100345952A CN200710034595A CN101269445A CN 101269445 A CN101269445 A CN 101269445A CN A2007100345952 A CNA2007100345952 A CN A2007100345952A CN 200710034595 A CN200710034595 A CN 200710034595A CN 101269445 A CN101269445 A CN 101269445A
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Abstract
The invention relates to a lead-free soldering paste. Alloy welding powder is made to the soldering paste through mixing bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and tin-copper binary eutectic alloy welding powder which are in the mixture ratio of 20 to 60:80 to 40 and adding scaling powder. The alloy welding powder is made up of the bismuth-tin binary eutectic alloy welding powder Bi48Sn42 which takes the mass percent of 80 to 90 percent, and the tin-copper binary eutectic alloy welding powder takes the mass percent of 10 to 20 percent. The lead-free soldering paste keeps the peak value temperature between 210 to 220 DEG C in reflow soldering process, greatly reducing the peak value temperature and the possibility for damaging a breadboard and an element device.
Description
Technical field
The present invention relates to a kind of leadless soldering tin paste, particularly the leadless soldering tin paste that uses in the electronic product surface mount process.
Background technology
In electronic product surface mount process, at present widely used is the leaded solder(ing) paste that alloyed powder such as tin-lead is made, and lead is environmentally harmful, discontented toe ring guaranteed request, and the most common leadless soldering tin paste adopts tin-silver-copper (SnAgCu) alloy system more at present.Xi-Yin, Xi-Yin-bismuth, tin-copper and tin-copper adds the alloy system that transition metals such as minor amount of nickel, cobalt are formed simultaneously.But all more than 210 ℃, its reflux temperature is higher for the fusing point of these alloys.So high serviceability temperature usually can cause the damage of wiring board and components and parts.And by eutectic welding tin cream that bismuth-Xi binary eutectic alloy Bi48Sn42 welding powder is made, though can avoid the too high and problem that causes of reflux temperature, but because fusing point is on the low side, have only 138 ℃, formed solder joint reduces reliability because of intensity descends in serviceability temperature during near 100 ℃.
Summary of the invention
For overcoming the low melting point of bismuth-eutectic welding tin cream that Xi binary eutectic alloy Bi48Sn42 welding powder is made, formed solder joint is the low shortcoming of reliability in use, and the high temperature solder(ing) paste made of multicomponent alloy welding powders such as tin-silver-copper, Xi-Yin-bismuth, tin-copper easily causes deficiencies such as pcb board and components and parts damage, the present invention to disclose a kind of the welding in the tin cream welding process to use fusing point and traditional leadless soldering tin paste that tin-plumbous system is suitable.
The technical measures that the present invention taked are: in the leadless soldering tin paste, alloy welding powder is that the mass percent that the stannum-copper binary alloy welding powder binary eutectic alloy welding powder Bi48Sn42 between 200-230 ℃ accounts for by bismuth-Xi binary eutectic alloy welding powder Bi48Sn42 and fusing point is 80-90%, and stannum-copper binary alloy welding powder mass percent is 10-20%.The peak temperature of the present invention in solder reflow process remains between 210-220 ℃, reduces peak temperature significantly, reduced the possibility that wiring board and components and parts damage.
The specific embodiment
In the leadless soldering tin paste under the present invention, along with the increase of bismuth-tin eutectic alloy Bi48Sn42 welding powder content, the backflow peak temperature of leadless soldering tin paste can reduce gradually, and the dependability of solder joint also can correspondingly decrease simultaneously.Otherwise along with the content of bismuth-ashbury metal Bi48Sn42 welding powder reduces, the backflow peak temperature of leadless soldering tin paste also can increase gradually, and the dependability of solder joint also can correspondingly increase.In use, according to the designing requirement of product, select bismuth-ashbury metal Bi48Sn42 welding powder and Sn99.3Cu0.7
Embodiment 1: welding powder is by bismuth-Xi binary eutectic alloy Bi48.Sn42 alloy welding powder and stannum-copper binary alloy welding powder in the leadless soldering tin paste, adds scaling powder and makes.The mass percent that bismuth-Xi binary eutectic alloy welding powder accounts for is 81%, and stannum-copper binary alloy welding powder mass percent is 18.8%, and the scaling powder mass percent is 0. 2%.The leadless soldering tin paste backflow peak temperature that obtains is 210 ℃.
Embodiment 2: welding powder is by bismuth-Xi binary eutectic alloy Bi48.Sn42 alloy welding powder and stannum-copper binary alloy welding powder in the leadless soldering tin paste, adds scaling powder and makes.The mass percent that bismuth-Xi binary eutectic alloy welding powder accounts for is 89%, and stannum-copper binary alloy welding powder mass percent is 10.9%, and the scaling powder mass percent is 0.1%.The leadless soldering tin paste backflow peak temperature that obtains is 206 ℃.
Embodiment 3: welding powder is by bismuth-Xi binary eutectic alloy Bi48.Sn42 alloy welding powder and stannum-copper binary alloy welding powder in the leadless soldering tin paste, adds scaling powder and makes.The mass percent that bismuth-Xi binary eutectic alloy welding powder accounts for is 85%, and stannum-copper binary alloy welding powder mass percent is 14.5%, and the scaling powder mass percent is 0.5%.The leadless soldering tin paste backflow peak temperature that obtains is 206 ℃.
Claims (2)
1. stannum-copper binary alloy leadless solder paste, it is characterized in that: in the leadless soldering tin paste, alloy welding powder is by Bi48Sn42 and stannum-copper binary alloy welding powder, add the tin cream that scaling powder is made again, wherein the mass percent that bismuth-Xi binary eutectic alloy welding powder accounts for is 80-90%, stannum-copper binary alloy welding powder mass percent is 9.5-19.5%, and the scaling powder mass percent is 0.1-0.5%.
2. leadless soldering tin paste according to claim 1 is characterized in that: the mass percent that bismuth-Xi binary eutectic alloy welding powder accounts for is 85%, and stannum-copper binary alloy welding powder mass percent is 14.8%, and the scaling powder mass percent is 0.2%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100345952A CN101269445A (en) | 2007-03-21 | 2007-03-21 | Stannum-copper binary alloy leadless solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100345952A CN101269445A (en) | 2007-03-21 | 2007-03-21 | Stannum-copper binary alloy leadless solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101269445A true CN101269445A (en) | 2008-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100345952A Pending CN101269445A (en) | 2007-03-21 | 2007-03-21 | Stannum-copper binary alloy leadless solder paste |
Country Status (1)
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| CN (1) | CN101269445A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785038A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Surface treatment method for protecting superfine raw solder powder, and superfine powder solder paste prepared according to method |
| US11267080B2 (en) * | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
-
2007
- 2007-03-21 CN CNA2007100345952A patent/CN101269445A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785038A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Surface treatment method for protecting superfine raw solder powder, and superfine powder solder paste prepared according to method |
| US11267080B2 (en) * | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| US20220184749A1 (en) * | 2019-05-09 | 2022-06-16 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| US11712762B2 (en) | 2019-05-09 | 2023-08-01 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
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Open date: 20080924 |