CN1398696A - Lead-free solder - Google Patents
Lead-free solder Download PDFInfo
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- CN1398696A CN1398696A CN02129643.XA CN02129643A CN1398696A CN 1398696 A CN1398696 A CN 1398696A CN 02129643 A CN02129643 A CN 02129643A CN 1398696 A CN1398696 A CN 1398696A
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Abstract
A lead-free hard solder material is a kind of lead-free alloy. The hard solder includes Sn 94.7-98 wt%, Cu 0.5-1.5 wt%, Ag 1-3.5 wt%, Pb 0.01-0.2 wt% and La or Ce 0.001-0.1 wt%. It has the performance superior to the available ternary lead-free Sn-Cu-Ag alloy. It can be used in connection of electronic elements and devices, and in other industries.
Description
Technical field: the present invention relates to a kind of alloy, particularly a kind of unleaded brazing alloy.
Background technology: lead is nondegradable toxic metals element, is again the metal of industrial a large amount of uses at present.Along with the pay attention to day by day of countries in the world to environmental protection, the plumbous application of numerous and confused legislation restriction.The research and development of no lead solders (being lead-free brazing) and application more and more come into one's own, up to the present, the lead-free brazing of researching and developing out both at home and abroad has the hundreds of kind, comprising the tin-silver-copper alloy, though near tin-lead alloy, but still there are many deficiencies in tin-silver-copper ternary lead-free alloy on many performances.At first, stannum-silver-copper three-part alloy is relatively poor at spreading property, the gap filling performance of metal surfaces such as copper, angle of wetting θ is bigger, fusing point is higher, and (as the Sn40Pb60 alloy melting point is 183 ℃, and the tin-silver-copper alloy melting point is 220 ℃), therefore, the application of not only above-mentioned tin-silver-copper lead-free alloy has been subjected to considerable restraint, and demand of practical production also urgently looks forward to developing early the lead-free brazing that can really satisfy production requirement.
Summary of the invention: the object of the present invention is to provide a kind of brazing property that makes to be significantly improved, combination property reaches the lead-free brazing of traditional Sn40Pb60 solder containing lead alloy property level, its objective is such realization: lead-free brazing comprises tin, silver, copper, at tin, silver, the lead and the optional lanthanum that add trace in the copper, a kind of in the cerium, by mass, tin accounts for 94.7～98%, silver accounts for 1～3.5%, copper accounts for 0.5～1.5%, lead accounts for 0.01～0.2%, lanthanum or cerium account for 0.001～0.1%, perhaps at tin, silver, the lead and the lanthanum that add trace in the copper, cerium, by mass, tin accounts for 94.7～98%, silver accounts for 1～3.5%, and copper accounts for 0.5～1.5%, and lead accounts for 0.01～0.2%, lanthanum accounts for 0.001～0.1%, and cerium accounts for 0.001～0.1%.The invention has the advantages that: pure tin can be wetting well on the surface of copper, but spreading property is not good, hinders flowing of tin; Adding does not produce the also difficult lead that dissolves each other of compound with copper, has diluted tin, has weakened the generation of compound, thereby spreading property is improved greatly.This invention is exactly in the tin-silver-copper alloy, treats as a kind of useful alloying element plumbous, promptly has a mind to add a spot of lead in unleaded fully alloy, to improve the spreading property of kamash alloy.And a spot of lead (0.01～0.02%) had both met the limited field of states such as the U.S., European Union and Japan to lead, satisfied " unleaded " on the technical meaning, and promptly Qian content is not more than 0.2%, has significantly improved the spreading property of tin-silver-copper alloy again; The adding of trace lanthanum and/or cerium has reduced brazing filler metal alloy on the one hand at the angle of wetting θ on copper surface (having improved wettability), and the mechanical property of brazing filler metal alloy is increased.And the relevant data of measuring according to the regulation of GB/T11363-1989 standards such as " solder spreadability and clearance fillability test methods ", the spreading property of neoteric Xi-Yin-lead-copper-lanthanum (cerium) brazing filler metal alloy, angle of wetting and mechanical property all near in addition surpassed traditional tin-lead alloy.This alloy has good spreading property, wettability and mechanical property on the copper surface.
The specific embodiment one: the present invention can be used for the connection of the Related product of the soldering of electronic devices and components (printed circuit board (PCB), leads of electronic component etc.) or other industry and uses.Present embodiment comprises tin, silver, copper, adds a kind of in the plumbous and optional lanthanum, cerium of trace in tin, silver, copper, by mass, tin accounts for 94.7～98%, silver accounts for 1～3.5%, and copper accounts for 0.5～1.5%, and lead accounts for 0.01～0.2%, lanthanum or cerium account for 0.001～0.1%, wherein tin accounts for 96.28%, and silver accounts for 2.8%, and copper accounts for 0.72%, lead accounts for 0.18%, and lanthanum or cerium account for 0.02%.
The specific embodiment two: what present embodiment and the specific embodiment one were different is, tin accounts for 96.58%, and silver accounts for 2.6%, and copper accounts for 0.6%, and lead accounts for 0.20%, and lanthanum or cerium account for 0.02%.
The specific embodiment three: what present embodiment and the specific embodiment one, two were different is, tin accounts for 95.72%, and silver accounts for 3.3%, and copper accounts for 0.8%, and lead accounts for 0.15%, and lanthanum or cerium account for 0.03%.
The specific embodiment four: what present embodiment and the specific embodiment one, two, three were different is, adds the lead of trace and lanthanum, cerium in tin, silver, copper, by mass, tin accounts for 94.7～98%, and silver accounts for 1～3.5%, and copper accounts for 0.5～1.5%, lead accounts for 0.01～0.2%, and lanthanum accounts for 0.001～0.1%, and cerium accounts for 0.001～0.1%, wherein tin accounts for 96.26%, silver accounts for 2.8%, and copper accounts for 0.72%, and lead accounts for 0.18%, lanthanum accounts for 0.02%, and cerium accounts for 0.02%.
The specific embodiment five: what present embodiment and the specific embodiment one, two, three, four were different is, tin accounts for 96.58%, and silver accounts for 2.6%, and copper accounts for 0.6%, and lead accounts for 0.20%, and lanthanum accounts for 0.01%, and cerium accounts for 0.01%.
The specific embodiment six: what present embodiment and the specific embodiment one, two, three, four, five were different is, tin accounts for 95.72%, and silver accounts for 3.3%, and copper accounts for 0.8%, and lead accounts for 0.15%, and lanthanum accounts for 0.01%, and cerium accounts for 0.02%.
Claims (8)
1, a kind of lead-free brazing, it comprises tin, silver, copper, it is characterized in that in tin, silver, copper adding a kind of in the plumbous and optional lanthanum, cerium of trace, by mass, tin accounts for 94.7～98%, and silver accounts for 1～3.5%, and copper accounts for 0.5～1.5%, lead accounts for 0.01～0.2%, and lanthanum or cerium account for 0.001～0.1%.
2, lead-free brazing according to claim 1 is characterized in that tin accounts for 96.28%, and silver accounts for 2.8%, and copper accounts for 0.72%, and lead accounts for 0.18%, and lanthanum or cerium account for 0.02%.
3, lead-free brazing according to claim 1 is characterized in that tin accounts for 96.58%, and silver accounts for 2.6%, and copper accounts for 0.6%, and lead accounts for 0.20%, and lanthanum or cerium account for 0.02%.
4, lead-free brazing according to claim 1 is characterized in that tin accounts for 95.72%, and silver accounts for 3.3%, and copper accounts for 0.8%, and lead accounts for 0.15%, and lanthanum or cerium account for 0.03%.
5, a kind of lead-free brazing, it comprises tin, silver, copper, it is characterized in that in tin, silver, copper, adding micro-lead and lanthanum, cerium, by mass, tin accounts for 94.7～98%, and silver accounts for 1～3.5%, copper accounts for 0.5～1.5%, lead accounts for 0.01～0.2%, and lanthanum accounts for 0.001～0.1%, and cerium accounts for 0.001～0.1%.
6, lead-free brazing according to claim 5 is characterized in that tin accounts for 96.26%, and silver accounts for 2.8%, and copper accounts for 0.72%, and lead accounts for 0.18%, and lanthanum accounts for 0.02%, and cerium accounts for 0.02%.
7, lead-free brazing according to claim 5 is characterized in that tin accounts for 96.58%, and silver accounts for 2.6%, and copper accounts for 0.6%, and lead accounts for 0.20%, and lanthanum accounts for 0.01%, and cerium accounts for 0.01%.
8, lead-free brazing according to claim 5 is characterized in that tin accounts for 95.72%, and silver accounts for 3.3%, and copper accounts for 0.8%, and lead accounts for 0.15%, and lanthanum accounts for 0.01%, and cerium accounts for 0.02%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02129643.XA CN1234498C (en) | 2002-09-06 | 2002-09-06 | Lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02129643.XA CN1234498C (en) | 2002-09-06 | 2002-09-06 | Lead-free solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1398696A true CN1398696A (en) | 2003-02-26 |
| CN1234498C CN1234498C (en) | 2006-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02129643.XA Expired - Lifetime CN1234498C (en) | 2002-09-06 | 2002-09-06 | Lead-free solder |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301179C (en) * | 2005-05-11 | 2007-02-21 | 郴州金箭焊料有限公司 | Leadless solder |
| CN101261211B (en) * | 2007-12-07 | 2010-06-02 | 戴国水 | Soldering material wetting angle measurement method |
| CN1657225B (en) * | 2004-12-09 | 2011-05-04 | 中国电子科技集团公司第十四研究所 | Ultra particle leadless brazing filler and its manufacturing method |
| US9175368B2 (en) | 2005-12-13 | 2015-11-03 | Indium Corporation | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability |
| US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| CN106001980A (en) * | 2016-06-15 | 2016-10-12 | 中国科学院电工研究所 | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof |
| CN114769935A (en) * | 2022-04-13 | 2022-07-22 | 广州汉源微电子封装材料有限公司 | Lead-free solder and preparation method and application thereof |
-
2002
- 2002-09-06 CN CN02129643.XA patent/CN1234498C/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1657225B (en) * | 2004-12-09 | 2011-05-04 | 中国电子科技集团公司第十四研究所 | Ultra particle leadless brazing filler and its manufacturing method |
| CN1301179C (en) * | 2005-05-11 | 2007-02-21 | 郴州金箭焊料有限公司 | Leadless solder |
| US9175368B2 (en) | 2005-12-13 | 2015-11-03 | Indium Corporation | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability |
| US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| CN101261211B (en) * | 2007-12-07 | 2010-06-02 | 戴国水 | Soldering material wetting angle measurement method |
| CN106001980A (en) * | 2016-06-15 | 2016-10-12 | 中国科学院电工研究所 | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof |
| CN114769935A (en) * | 2022-04-13 | 2022-07-22 | 广州汉源微电子封装材料有限公司 | Lead-free solder and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1234498C (en) | 2006-01-04 |
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Free format text: FORMER OWNER: LIAO GAOBING Owner name: SHENZHEN VITAL NEW MATERIAL COMPANY LIMITED Free format text: FORMER OWNER: XUE SONGBO Effective date: 20100726 |
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Effective date of registration: 20100726 Address after: 518000, Shenzhen, Guangdong province Longgang District Longgang Street fun community, rice Road No. 18 only special industrial park Patentee after: SHENZHEN VITAL NEW MATERIAL COMPANGY Ltd. Address before: 150080, No. 6, building 2, 2 nursery street, No. 105-2, nursery street, Nangang District, Heilongjiang, Harbin Co-patentee before: Liao Gaobing Patentee before: Xue Songbai |
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Granted publication date: 20060104 |