CN101251245A - Surface type led lamp with high heat radiation - Google Patents
Surface type led lamp with high heat radiation Download PDFInfo
- Publication number
- CN101251245A CN101251245A CNA2007100098669A CN200710009866A CN101251245A CN 101251245 A CN101251245 A CN 101251245A CN A2007100098669 A CNA2007100098669 A CN A2007100098669A CN 200710009866 A CN200710009866 A CN 200710009866A CN 101251245 A CN101251245 A CN 101251245A
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- smd
- led
- circuit board
- printed circuit
- pcb
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- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention discloses a surface-type light emitting diode lamp with high heat removal performance, comprising a substrate for arranging an SMD-LED, and characterized in that the substrate comprises a substrate body made from highly thermal conductive metallic material. At least one side of a mounting surface of the substrate body is adhered with a printed circuit board which is arranged along the arranging direction of the SMD-LED. The SMD-LED is adhered on the middle part of the mounting surface of the substrate body, and the heating end of the SMD-LED is directly and fixedly connected with the substrate body; the P pin and N pin of the SMD-LED are conductively and respectively connected with the printed circuit board to form a loop. The heating end of the SMD-LED is directly and fixedly connected with the substrate. The heat energy generated by the light emitting diode can be diffused via the highly thermal conductive substrate body. The heat energy generated by the lamp can be quickly led and removed in time via the substrate, so that the temperature of the light emitting diode knot raises slower, the light emitting performance of the SMD-LED is perfectly ensured, the service life of the SMD-LED is prolonged, and the energy consumption is largely reduced. Furthermore, the structure and design are rational, and the manufacture is simple.
Description
Technical field
The present invention relates to led lamp, specifically is a kind of surface type (SMD) led lamp of high-cooling property.
Background technology
With reference to Fig. 1, Fig. 2.Common led lamp is that surface type light emitting diode (hereinafter to be referred as SMD-LED) 2 is fixedly mounted on the circuit board (PCB or aluminium wiring board) 3 of light fixture, again circuit board 3 is utilized insulating cement to be fixed on the base body 1 of high-cooling property, the P of SMD-LED 2, N wiring pin 22,23 electrically connect with circuit board 3 respectively, external circuit imposes direct current by P, the N level of 3 couples of SMD-LED 2 of circuit board, impels SMD-LED 2 to produce brightness.The heat that SMD-LED 2 produces is got rid of by base body 1 after circuit board 3 transmits by heating end 21.But, because printed circuit board (PCB) 3 is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, particularly a large amount of heat energy of the light fixture generation of most SMD-LED concentrating type encapsulation compositions can't in time be dredged and be got rid of, directly cause SMD-LED 2 junction temperatures to raise, light fixture hot polymerization effect and thermal resistance are excessive, cause short and light decay phenomenon in 2 service lifes of SMD-LED easily, and therefore improve energy consumption.
Summary of the invention
The objective of the invention is to overcome existing surface type (SMD) led lamp because of dispel the heat bad cause shorten service life, light decay and the high deficiency of power consumption, a kind of surface type (SMD) led lamp of high-cooling property is provided.
Purpose of the present invention is achieved through the following technical solutions:
The surface type LED lamp of high-cooling property, comprise the pedestal that is used for device SMD-LED, it is characterized in that: described pedestal comprises the base body that a high-thermal conductive metal material is made, at least one side printed circuit board (PCB) that has been sticked on the installed surface of this base body, printed circuit board (PCB) is arranged along the SMD-LED orientation; SMD-LED is attached at base body installed surface middle part, and its heating end is directly fixedlyed connected with base body, and P, N wiring pin connect with printed circuit board (PCB) respectively and form the loop.
The P of described SMD-LED, N wiring pin are divided into the both sides of SMD-LED, and the installed surface dual-side correspondence of the base body printed circuit board (PCB) that has been sticked has spacing between the printed circuit board (PCB) of both sides; The heating end of SMD-LED is fixedlyed connected with the base body installed surface central part between the printed circuit board (PCB) of both sides.
Pedestal central part between described two printed circuit board (PCB)s is provided with the projection of arranging along its length; SMD-LED heating end is fixing with the projection welding.
The P of described SMD-LED, N wiring pin are located at the same side of SMD-LED, are provided with step with the corresponding printed circuit board (PCB) that has been sticked of corresponding base body installed surface one side of wiring pin, opposite side; Its heating end of SMD-LED is direct and the welding of pedestal step is fixing.
Described pedestal integral body is strip, discoid or square frame shape.
The present invention has the following advantages:
The directly fixing welding of the base body that the heating end of SMD-LED and high-thermal conductive metal material are made, the heat energy that SMD-LED is produced is directly dispersed by the base body of high heat conduction, particularly a large amount of heat energy of the light fixture generation of most SMD-LED concentrating type assembling formations are in time dredged by base body rapidly and are got rid of, the heat susceptor conductive performance is good, heat dissipation channel is unimpeded, thermal resistance is little, the light-emitting diodes duct ligation heats up just slow, ensure the luminescent properties of SMD-LED well, prolong the service life of SMD-LED, cut down the consumption of energy greatly.The two wiring pin of SMD-LED electrically connect with the printed circuit board (PCB) that is installed on the base body installed surface respectively, and reasonable in design is made simply, has very good practical value, improves the competitiveness of product in market greatly.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described in further detail.
Fig. 1 is the structure cutaway view of existing surface type (SMD) led lamp.
Fig. 2 is the structural representation of first embodiment of the invention.
Fig. 3 is along the cutaway view Amplified image of A-A direction among the figure.
Fig. 4 is the structural representation of second embodiment of the invention.
Fig. 5 is along the cutaway view Amplified image of B-B direction among the figure.
The specific embodiment
Embodiment 1: with reference to Fig. 2, Fig. 3.The surface type of high-cooling property (SMD) led lamp comprises the pedestal that is used for a plurality of SMD-LED 2 of device, and pedestal comprises the base body 1 that adopts high-thermal conductive metal material such as aluminium, alloy etc. to make; On the installed surface of the base body 1 that a plurality of SMD-LED 2 are installed in order along base body 1.
The end face middle part of base body 1 is provided with groove 11, and groove 11 runs through the length direction of base body 1, and the bottom surface of groove 11 is for installing the installed surface of SMD-LED 2.The central part of installed surface is provided with along its length the projection 12 of arranging, the correspondence printed circuit board (PCB) 31,32 that has been sticked on the installed surface of protruding 12 both sides.The directly fixing welding of the heating end 21 of each SMD-LED 2 and projection 12 end faces between the printed circuit board (PCB) of both sides, and SMD-LED 2 is fixed on the base body 1.The both sides of SMD-LED 2 have P, N wiring pin 22,23, and P, N wiring pin 22,23 are electrically conducted with corresponding printed circuit board (PCB) 31,32 respectively and form the loop.
With reference to Fig. 2, Fig. 3.Two printed circuit board (PCB)s 31,32 can adopt the staggered layout at interval of multisection type or other circuit forms to arrange, make both sides printed circuit board (PCB) 31,32 form P electrode district, the N electrode district that is cross-linked SMD-LED 2 respectively, to realize a plurality of SMD-LED concentrating type series, parallel loop.
As Fig. 2, shown in Figure 3, pedestal integral body is strip.But the shape of pedestal is not limited to shown in the figure, can be designed to discoid or other moulding such as square frame shape according to concrete needs.
Embodiment 2: with reference to Fig. 4, Fig. 5.Present embodiment with implement 1 and different be:
The P of SMD-LED 2, N wiring pin 31,32 are located at the same side of SMD-LED, are provided with step 13 be sticked printed circuit board (PCB) 33, opposite side of base body 1 installed surface one side of wiring pin 22,23 corresponding sides.Printed circuit 33 plates are fixedly mounted on SMD- LED wiring pin 22,23 corresponding installed surface one sides, and the printed circuit board (PCB) 33 after the installation and the end face of step 13 are positioned on the same horizontal plane, so that fixing SMD-LED 2.The 21 step 13 end faces welding direct and base body 1 of SMD-LED 2 heating ends are fixing, and SMD-LED 2 are fixed on the installed surface of base body 1.All the other structures are identical with embodiment 1, do not repeat them here.
The above, only for preferred embodiment of the present invention, so can not limit scope of the invention process with this, i.e. the equivalence of doing according to the present patent application claim and description changes and modification, all should still belong in the scope that patent of the present invention contains.
Claims (5)
1, the surface type LED lamp of high-cooling property, comprise the pedestal that is used for device SMD-LED, it is characterized in that: described pedestal comprises the base body that a high-thermal conductive metal material is made, at least one side printed circuit board (PCB) that has been sticked on the installed surface of this base body, printed circuit board (PCB) is arranged along the SMD-LED orientation; SMD-LED is attached at base body installed surface middle part, and its heating end is directly fixedlyed connected with base body, and P, N wiring pin connect with printed circuit board (PCB) respectively and form the loop.
2, surface type according to claim 1 (SMD) led lamp, it is characterized in that: the P of described SMD-LED, N wiring pin are divided into the both sides of SMD-LED, the installed surface dual-side correspondence of the base body printed circuit board (PCB) that has been sticked has spacing between the printed circuit board (PCB) of both sides; The heating end of SMD-LED is fixedlyed connected with the base body installed surface central part between the printed circuit board (PCB) of both sides.
3, surface type according to claim 2 (SMD) led lamp is characterized in that: the pedestal central part between described two printed circuit board (PCB)s is provided with the projection of arranging along its length; SMD-LED heating end is fixing with the projection welding.
4, surface type according to claim 1 (SMD) led lamp, it is characterized in that: the P of described SMD-LED, N wiring pin are located at the same side of SMD-LED, are provided with step with the corresponding printed circuit board (PCB) that has been sticked of corresponding base body installed surface one side of wiring pin, opposite side; Its heating end of SMD-LED is direct and the welding of pedestal step is fixing.
5, surface type according to claim 1 (SMD) led lamp is characterized in that: described pedestal integral body is strip, discoid or square frame shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100098669A CN100567809C (en) | 2007-11-19 | 2007-11-19 | The surface type of high-cooling property (SMD) led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100098669A CN100567809C (en) | 2007-11-19 | 2007-11-19 | The surface type of high-cooling property (SMD) led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101251245A true CN101251245A (en) | 2008-08-27 |
| CN100567809C CN100567809C (en) | 2009-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100098669A Expired - Fee Related CN100567809C (en) | 2007-11-19 | 2007-11-19 | The surface type of high-cooling property (SMD) led lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100567809C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371123A (en) * | 2015-12-01 | 2016-03-02 | 袁志贤 | Large-power LED (light-emitting diode) module |
-
2007
- 2007-11-19 CN CNB2007100098669A patent/CN100567809C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371123A (en) * | 2015-12-01 | 2016-03-02 | 袁志贤 | Large-power LED (light-emitting diode) module |
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| Publication number | Publication date |
|---|---|
| CN100567809C (en) | 2009-12-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| CP02 | Change in the address of a patent holder |
Address after: 362000 Fujian Taiwanese investment zone of Quanzhou Dongyuan kilometer east-west trunk road (from the intersection of apricot show about 800 meters) Patentee after: Concord Opto Electric Tech (Quanzhou) Co., Ltd. Address before: 362000 Fujian Quanzhou economic and Technological Development Zone hi tech enterprise incubator base No. 1 building Patentee before: Concord Opto Electric Tech (Quanzhou) Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20201119 |