CN101238575A - Heat radiator and its making method - Google Patents
Heat radiator and its making method Download PDFInfo
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- CN101238575A CN101238575A CN200580051290.1A CN200580051290A CN101238575A CN 101238575 A CN101238575 A CN 101238575A CN 200580051290 A CN200580051290 A CN 200580051290A CN 101238575 A CN101238575 A CN 101238575A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
A heat sink (2) has a base (4) having a first surface (4a) thermally connected to a heat producing body and also has fins (6a-6d) each having through-holes (8), the fins being supported by a second surface (4b) of the base (4) and arranged in a predetermined direction. The base (4) and the fins (6a-6d) are integrally formed of a porous material (lotus-type porous material). The heat sink (2) is placed in a duct (80). It is preferable that the width (W) of the heat sink (2) is substantially equal to or less than 10 mm.
Description
Technical field
The present invention relates to Radiator and its preparation method, particularly adopt the Radiator and its preparation method of porous material.
Background technology
In semi-conductor electricity source component semiconductor equipment such, that caloric value is big when moving, the heat leakage for the such heater of IBGT is produced will adopt radiator.Usually, radiator is made of the tabular substrate of mounting heater and a plurality of fins that are installed on the substrate.Fin is configured in the refrigerant flow path, and like this, by substrate and fin, the heat that heater is produced passes to cold-producing medium.
As an example of this radiator, patent documentation 1 discloses as lower device, that is, adopt porous material as fin material, makes cold-producing medium flow through a plurality of holes that connect fin.
Patent documentation 1: TOHKEMY 2001-358270 communique
Summary of the invention
But radiator before is after porous material is processed, being made into fin, a plurality of fins is bonded on the substrate make again, so the manufacturing time of radiator, manufacturing cost rise, causes productivity ratio to reduce.
For this reason, the purpose of this invention is to provide the high radiator of productivity ratio.
Radiator of the present invention has substrate and a plurality of fin, and aforesaid substrate has with heater hot linked the 1st.Above-mentioned a plurality of fin be supported on substrate with the 2nd of the 1st opposition side on, arrange along predetermined direction, and have a plurality of through holes respectively.Aforesaid substrate and a plurality of fin form with porous material.
According to the present invention, because substrate and a plurality of fin form with porous material, so, will not join to singly on the substrate by fin, can reduce manufacturing time, the manufacturing cost of radiator, boost productivity.
Description of drawings
Fig. 1 represents the radiator of embodiment of the present invention 1.
Fig. 2 represents the casting device of porous matter metal (lotus root shape porous member).
Fig. 3 represents the manufacturing process of porous matter metal (lotus root shape porous member).
Fig. 4 represents another radiator of embodiment of the present invention 1.
Fig. 5 represents the radiator of embodiment of the present invention 2.
Fig. 6 represents the radiator of embodiment of the present invention 3.
Fig. 7 represents the radiator of embodiment of the present invention 4.
Fig. 8 represents another radiator of embodiment of the present invention 4.
Fig. 9 represents the another radiator of embodiment of the present invention 4.
Figure 10 represents the radiator of embodiment of the present invention 5.
Figure 11 represents another radiator of embodiment of the present invention 5.
Figure 12 represents the radiator of embodiment of the present invention 6.
Figure 13 represents the radiator of embodiment of the present invention 7.
Figure 14 represents the radiator of embodiment of the present invention 8.
Figure 15 represents the radiator of embodiment of the present invention 9.
Figure 16 represents the radiator of embodiment of the present invention 10.
Figure 17 represents the radiator of embodiment of the present invention 11.
Figure 18 represents another radiator of embodiment of the present invention 11.
Figure 19 represents the radiator of embodiment of the present invention 12.
Figure 20 represents the radiator of embodiment of the present invention 13.
Figure 21 represents the pipeline and the radiator of embodiment of the present invention 14.
Figure 22 represents the pipeline and the radiator of embodiment of the present invention 15.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.In the following description, to identical or similar constitutive requirements, in a plurality of accompanying drawings, annotate and add suitable suffix with same tag or on same tag and represent.
Execution mode 1
Fig. 1 (a)～(c) is the radiator of present embodiment 1, represents its integral body with 2.This radiator 2 has the plate-shaped fins 6 (6a, 6b, 6c, 6d) that tabular substrate 4 and a plurality of (being 4 in the illustrated example) are approximately perpendicular to substrate 4.Substrate 4 has tabular surface (the 1st face) 4a that mounting the heater (with the heater hot link) that do not show of figure.Plate-shaped fins 6 (6a, 6b, 6c, 6d) in parallel to each other devices spaced apart, be supported on the substrate 4 by tabular surface (the 2nd face) 4b with tabular surface 4a opposition side.In the following description, substrate 4 is positioned at the position parallel with the XY face, and as the Y direction, each fin 6 is positioned at the position parallel with the XZ face the orientation of fin 6a～6d.
Each fin 6 is lotus root (lotus rhizome) shape parts, has the roughly [8 of Y direction extension of a plurality of edges.When the action of radiator 2, cold-producing medium is flowed by hole 8 court+Y directions according to the order of fin 6a, 6b, 6c, 6d.Cold-producing medium for example can adopt the gas in the liquid of cooling water, anti-icing fluid (ethylene glycol) etc. or cold wind, fluorine Lyons etc.In order to prevent freezing medium leakage, usually, along the flow of refrigerant direction, be provided with pipe arrangement, and be provided with the top of fin 6 and the plate of side seal, so that cold-producing medium flows through in the upstream and the downstream of radiator 2.But, under the situation of air-cooled type, also can cold wind be flow through in the pipe arrangement, and fin 6 is exposed in the atmosphere.
The substrate 4 of radiator 2 and fin 6, for example be that the rectangular-shaped porous part (lotus root shape porous member) 10 (Fig. 1 (d)) that is made of metals such as copper, magnesium, aluminium, silicon is carried out cut, the groove 11 (11a, 11b, 11c) that processes with XZ parallel plane more than 1 or 1 (in the example of Fig. 1 (d) 3) forms.In addition, as previously mentioned, the tabular surface 4b of substrate 4, its part forms the bottom surface (outward appearance of radiator 2) of groove 11, and a part forms the imaginary boundary of fin 6.
In addition, radiator 2 for example is used for cooling off CPU, the MPU (following execution mode too) of computer, mainframe computer.
Below, the formation method of radiator 2 is described with reference to Fig. 2, Fig. 3.
First with following known method (among the application, be called the metal freezing method, particular content is for example disclosing in the Japanese kokai publication hei 10-88254 communique), form the metal that has a plurality of tubulose through holes.Fig. 2 forms the casting device that this porous matter metal is used.This casting device 12 has the crucible 14 of accommodating metal derby.Twining the coil 16 of heating crucible 14 usefulness at the peripheral part of crucible 14.Coil 16 is applied high-frequency current, with the metal derby fusion in the crucible 14.At the downside of crucible 14, setting the mould 20 that the base has cooling end 18, by being installed in the open and close valve 22 of crucible 14 lower ends, the metal of molten condition is injected in the mould 20.
Crucible 14 and mould 20 are configured in the closed container (figure does not show), and the gas that remains predetermined pressure in filling in container.This gas and metal, under isobaric gaseous environment, metal-gas is that state diagram has eutectic point.For example, if metal is copper, aluminium, then gas is selected hydrogen, nitrogen etc.In the metal freezing method, utilize following phenomenon, that is, if temperature than the temperature height of eutectic point, then gas atom dissolves in the metal of liquid condition; If temperature is lower than the temperature of eutectic point, then gas atom does not dissolve in the metal of solid state, exist as gas,
In this casting device 12, at first closed container is placed in the isobaric gaseous environment, and the packaged of metal 24 gone in the crucible 14 (Fig. 3 (a)).In open and close valve 22 closing state, coil 16 is applied high-frequency current, make the piece fusion of the metal 24 in the crucible 14.As a result, be melted the metal absorption of state with the gas of its concentration and the corresponding amount of pressure.Then, open open and close valve 22, make motlten metal 26 flow into mould 20 (Fig. 3 (b)).Owing to be provided with cooling end 18 in the bottom of mould 20, so, temperature gradient become from mould 20 bottom-up square.As a result, metal solidifies towards the top from the bottom of mould 20.In the process of setting of motlten metal, produced eutectic reaction, promptly from the motlten metal that is dissolving gas atom, isolate the metal of solid state and the gas of gaseous state.Because the path of gas is the hole, form towards the top from the bottom of mould 20, so, can obtain the porous matter metal (porous material) 30 (Fig. 3 (c)) that inside has formed [28.In addition, except metal, also can use semiconductor is silicon, obtains porous material with above-mentioned metal freezing method.In this case, following operation is applicable to the porous material that constitutes with silicon.
Then, for example, the porous matter metal 30 that obtains with the metal freezing method is formed cuboid, finished porous part 10 (Fig. 1 (d)) with slotting cutter etc.Use for example discharge lines processing method again, on this porous part 10, form groove.Specifically, shown in Fig. 1 (d), to porous part 10, in the imaginary area 32a corresponding (being roughly with the bearing of trend in hole 8 that 90 degree intersect) top, the discharge lines that configuration is extended along directions X (scheming not show) with the groove 11a that will form.Then, this discharge lines court-Z direction is moved, arrive apart from the distance of following (4a is corresponding with tabular surface) is the upper side position of substrate 4 thickness of radiator 2 usefulness always.Then, the pull-up of court+Z direction like this, has formed groove 11a.The thickness of groove 11a (Y direction length) is the line footpath of line at least.Remaining 2 imaginary area 32b, 32c are carried out above-mentioned action repeatedly, formed groove 11b, 11c.Like this, obtained having the radiator 2 (from the character of metal freezing method, not only can form the hole 8 of perforation on fin 6, also can form the hole (seeing Fig. 1 (c)) that does not connect, it is circular that the section shape of through hole does not limit yet) of lotus root shape fin 6a～6d.
Usually, the value of long-pending Sp * hp of the contact area of hole and cold-producing medium (heat transfer area) Sp and the convective heat transfer rate hp from the hole inner face to cold-producing medium is big more, and the cooling capacity of porous part is high more.For the fin 6 that adopts in the present embodiment, in order to improve its cooling capacity, the method for taking is, the number in hole 8 increased and Sp is increased, and in addition, thereby reduces the diameter in hole 8 and flow velocity by the cold-producing medium in the hole increased hp is increased.
In addition, according to Japanese kokai publication hei 10-88254 communique disclosed method, can make the aperture is the scope of tens of μ m～number μ m, the lotus root shape porous metals that voidage is set arbitrarily.According to this manufacture method, can be easily and lotus root shape porous metals are provided at low cost.
In addition, as porous part, adopting through hole is not the structure of the foaming material (foaming metals such as aluminium for example foam) of tubulose, is also contained in the scope of the invention.But, the porous part 10 of lotus root shape, promptly adopt the parts of lotus root shape fin 6, the cold-producing medium of adjacent holes does not collaborate or the cold-producing medium that flows through certain hole is not shunted owing to flow through, so, not because of the pressure loss of collaborating, shunting produces, the low radiator of the pressure loss generally can be provided, and is more satisfactory from this point.
Especially, in the porous part 10 of lotus root shape, the length in Y direction hole is about 10mm among Fig. 1 (c), and the thickness of Y direction fin 6 is below the 10mm, and like this, the number in the hole 8 of perforation fin 7 is many, improves the cooling capacity of fin 6.
As mentioned above, in the present embodiment, on porous part 10, cut out groove 11, formed substrate 4 and fin 6, so, different with above-mentioned structure before, do not need operation that substrate and a plurality of fins are engaged one by one, the result can boost productivity.
In addition, when bonding to fin on the substrate with bonding agent like that before, the heat conduction rate variance of connecting portion is not easy to improve heat dissipation characteristics.And in the radiator 2 of present embodiment, because fin 6 and substrate 4 are integrally formed, so can improve heat dissipation characteristics.
In addition, the radiator of 2 fins is arranged, be also contained in the scope of the present invention for a groove.In addition, the method for the shape of each fin, the shape of substrate (shape that comprises the 1st and the 2nd 4a, 4b), cut groove does not limit the present invention.
Fig. 4 (a) and (b) are with the porous part cutting, obtain the other method of present embodiment radiator.In this method, be ready to the above-mentioned rectangular-shaped porous part 10 that similarly forms '.Then, make discharge lines along porous part 10 ' imaginary plane 34, with respect to porous part 10 ' move, thereby make roughly the same radiator 2 ', 2 ".The line footpath of employed line is different with above-mentioned cutting process, and is more much smaller than the width (Y direction length) of the groove that will form.Specifically,, discharge lines is placed on the lower position that is equivalent to the substrate 4 ' thickness of radiator 2 ' usefulness apart from the top, 1 from a side of Y direction) make line court+Y direction move preset distance (for example more than the 1mm, preferably about 10mm).Then, 2) discharge lines court-Z direction is moved, arrive apart from following distance is the upper side position of radiator 2 " substrate 4 of usefulness " thickness always.Make discharge lines court+Y direction move the distance that is equivalent to groove width again.Then, 3) discharge lines court+Z direction is moved, arrive apart from top distance is the lower position of the substrate 4 ' thickness of radiator 2 ' usefulness always.Repeatedly 2 times 1 again)～3) action after, discharge lines court+Y direction is moved, like this, from porous part 10 ' obtained radiator 2 ', 2 ".
According to this cutting method, can form 2 radiators simultaneously, therefore, compare with the method for above-mentioned cutting slot, boost productivity more.
Fig. 5 is the radiator of present embodiment 2, represents its integral body with 2A.In the radiator 2A of present embodiment, on the 1st 4a of the opposition side of support fin 6 sides of substrate 4, also engaged the good plate (the 2nd substrate) 40 of heat conductivity.Heater is positioned on the substrate 40 (the 1st 4a of substrate 4 and heater hot link).
When the base material of making radiator 2A was porous part, hole 8 was not a tubulose sometimes, but the 1st 4a of the path of cold-producing medium and substrate 4 is communicated with by hole 8.At this moment, go up, make the radiator action as if the 1st 4a that heater is positioned in substrate 4, then cold-producing medium leaks from the 1st 4a.For this reason, in the present embodiment,, can guarantee the sealing of radiator 2A by substrate 40 is set.As a result, can improve the rate of finished products of porous part.
Execution mode 3
Fig. 6 represents the execution mode 3 of radiator of the present invention.In the radiator 2B of present embodiment, the through hole 8B of fin 6B is not parallel to Y direction (orientation of fin 6B), but extends obliquely.Therefore, fin 6B compares with the fin 6 of the execution mode 1 with same thickness, and heat transfer area S increases, and the result can improve the cooling capacity of radiator 2B.
The fin 6B of radiator 2B, be on porous part, along obtaining with the non-orthogonal in fact imaginary area of the bearing of trend of [(the parallel plane imaginary area of XZ of the angle (acute angle) following) formation groove with become about 90 degree with respect to this bearing of trend.
In addition, among Fig. 6, be that the situation that bearing of trend to [has departed from the Y direction is described, still, as the Y direction, the situation of the formation deviation in driction XZ face of groove is also contained in the present embodiment.
Fig. 7 (a) and (b) are radiators of present embodiment 4, represent its integral body with 2C.In the above-described embodiment, be on porous part, the grooving of retention substrate thickness landform, therefore, each fin is to interconnect by substrate.And in the radiator 2C of present embodiment, be above the Z direction of porous part 10 to following formation through slot 41, a plurality of fin 6C are being supported by the sidewall 42 that is formed on a side at directions X.That is, fin 6C and sidewall 42 are integrally formed with porous material.Below the Z of fin 6C direction, engaging the good plate of heat conductivity (substrate) 40.Heater is positioned on the substrate 40.During radiator 2C action, under the situation about being communicated with below by hole 8 of refrigerant passage and fin 6C, substrate 40 also has the sealing function that prevents freezing medium leakage.In addition, sidewall 42 also has the function of the wall that constitutes refrigerant flow path, so, when manufacturing has the cooling device of radiator 2C, have the advantage that can dispense the work of making pipe arrangement.
The manufacture method of radiator 2C is identical with the manufacture method of the radiator 2 of Fig. 1.That is, on rectangular-shaped porous part 10, in the directions X left side of the imaginary area 32C corresponding, the discharge lines that configuration is extended along the Z direction with the groove that will form.This discharge lines court+directions X is moved, and arrive apart from the distance on the directions X right side is the leftward position of sidewall 42 thickness of radiator 2C always.Then, court-directions X moves, and forms a through slot 41.After having formed a plurality of through slots, this porous part 10 is joined on the substrate 40.
The orientation of fin 6C, can with execution mode 1 similarly, be parallel to the bearing of trend of tubulose through hole 8 in fact, also can with execution mode 3 similarly, acutangulate with above-mentioned bearing of trend.Under latter instance, the heat transfer area S of through hole and cold-producing medium increases, and can improve the cooling capacity of radiator 2C.
In the present embodiment, a plurality of fin 6C are connecting by sidewall 42 that (in other words, a plurality of fin 6C are by the side adjacent with the composition surface of substrate 40, supporting by sidewall 42), therefore, can once a plurality of fin 6C be bonded on the substrate 40, can boost productivity.
Fin 6C and sidewall 42 are being installed in the pipe arrangement that constitutes cooling flowing path, when the wall of pipe arrangement constitutes substrate 40 (heater is positioned on the pipe arrangement wall), are being also contained in the scope of the present invention.This structure also has the above-mentioned effect of present embodiment.
Sidewall (directions X) needn't only be located at a side, and sidewall 42R, 42L also can be as the radiator 2D of Fig. 8 be set in both sides.Through slot 41D with adjacent fins 6D separates forms with for example slotting cutter.In addition, in order to obtain the above-mentioned effect of present embodiment, as long as sidewall is connected to the adjacent fin of looking younger, sidewall also not necessarily will be formed on the whole side (side's side of directions X).For example, also can as the radiator 2E of Fig. 9 (a), sidewall 42a, 42b, 42c (at this moment, the through slot 41E that adjacent fins 6E is separated forms staggered) alternately be set in the right side and the left side of directions X.
As Fig. 7, shown in Figure 8, when being provided with the sidewall that supports whole fins, the heater on being positioned in substrate 40, all right other heater of mounting on sidewall can provide the radiator that can corresponding come from the heat of side.In order to ensure the sealing of radiator, the substrate of also can on sidewall, rejoining.
Shown in Fig. 9 (a), in the time of on a part that sidewall is located at each side, shown in Fig. 9 (b), if other substrate 46R, 46L are bonded on each sidewall, just can be positioned in heater on these substrates 46R, the 46L, therefore, can provide the radiator of energy correspondence from the heat of side.
Execution mode 5
Figure 10 is the radiator of present embodiment 5, represents its integral body with 2F.
In execution mode 1～3, adjacent fin links to each other by substrate, and in the execution mode 4, adjacent fin links to each other by sidewall.But adjacent fins is linked to each other with the sidewall both sides by substrate.For example, also can be as the radiator 2F of Figure 10, the groove 41F that only open to the outside towards a direction (that is, the border of each groove 41F by sidewall 42R, 42L, adjacent fins 6F, reach substrate 4F and form) is set.Also can as the radiator 2G of Figure 11, be provided with only at the adjacent both direction groove 41G (that is, the border of each groove 41G is formed by sidewall 42, adjacent fins 6G and substrate 4G) open towards the outside.
Figure 12 is the radiator of present embodiment 6, represents its integral body with 2H.(a) being stereogram, (b) is the profile of seeing from directions X, (c) is the profile of seeing from the Z direction.
Radiator 2H is formed by the lotus root shape porous member (porous part) of bulk, and this porous member has a plurality of [es 8 circular section, that extend along the Y direction.Radiator 2H includes a plurality of grooves 41 that are approximately perpendicular to the Y direction.The width of groove 41 (width of Y direction) is about 0.5mm, compares with the radiator 2 of execution mode 1, and is much narrow.
In present embodiment 6, the making of groove 41 (groove cutting processing) is by for example utilizing the discharge lines processing method of discharge lines to carry out.Discharge lines moves along the XZ plane, forms grooving on porous member.Because the direction along the XY plane moves unlike execution mode 1, so, do not cut a part (the imaginary area 32a～32c) of porous member.The width of groove 41 is equivalent to the thickness of discharge lines, for example is about 0.5mm as mentioned above.The manufacture method of this groove 41, in the following embodiments too.
With execution mode 1 similarly, by making this groove 41, increased the ratio of through hole 8.As a result, the number in the hole 8 that cold-producing medium passes through also increases, and can improve radiating effect.As mentioned above, be 10mm when following in the width W that is clipped in the fin 6 between groove 41 and the groove 41 (length of Y direction), through hole is many in particular, can increase substantially radiating effect (cooling effectiveness).
In addition, the processing method of groove 41 also can not adopt the discharge lines processing of line cutting, and adopt the machining of having utilized slotting cutter.
In addition, in radiator 2H, owing to do not cut (the imaginary area 32a～32c) of portion on the porous member, so, in the radiator 2 of execution mode 1,, cold-producing medium is flow through by in the contained hole 8 of the part that cut, owing to increased the surface area that contacts with cold-producing medium, improve cooling effectiveness.
In addition, the processing of present embodiment 6, for example, if make the line that extends along directions X only towards the Z direction move or make the slotting cutter that is arranged on the Z direction along X-direction move etc., make cut off with instrument (ZX plane) in the face that is not parallel to the direction of principal axis of [(Y direction) mobile.In other words, with the parallel direction of direction of principal axis (Y) of [, do not have the sectility face, so, compare handling ease with execution mode 1.
In addition, fin 6 and substrate (brace table) the 4th, the structure of one, so, can save with solder brazing or solder the operation that fin 6 engages with substrate 4, can reduce cost, boost productivity.In addition, in this structure, unlike constructing (day flat 2001-358270 communique of the disclosure) before, the fin that forms from porous member is bonded on the other substrate, so, manufacturing cost and manufacturing time can be reduced.
Execution mode 7
Figure 13 is the radiator of present embodiment 7, represents its integral body with 2I.
The lotus root shape porous member that radiator 2I uses, the section shape that not only includes perpendicular to direction of principal axis (Y direction) is circular hole 8, also include non-circular hole 8 '.
In radiator 2I since be not limited to hole 8,8 ' section shape, so the section shape that yet can use the hole is not circular lotus root shape porous member.
In the following embodiments, the section shape in the hole of lotus root shape porous member also is not limited to circle, non-circular.
Figure 14 is the radiator of present embodiment 8, represents its integral body with 2J.(a) being stereogram, (b) is the profile of seeing from the Z direction.
In the radiator 2J of present embodiment 8, shown in (b), the direction of principal axis of [8 is Y directions, but groove 41 ' with respect to XZ plane inclination predetermined angular.
In order to make a large amount of cooling fluids flow through the hole 8 of the fin 6 of lotus root shape porous member, increase heet transfer rate, shown in above-mentioned execution mode, be preferably in and form groove 41 on the face vertical with the direction of principal axis (Y direction) of [8.But the formation direction of groove 41 is not necessarily strictly vertical with the direction of principal axis in hole 8.
Shown in present embodiment 8, allow groove 41 ' form the manufacturing procedure of radiator 2J is simplified with respect to XZ plane inclination ground, shorten manufacturing time.
In addition, in order to increase the ratio in the hole 8 that connects fin, the length W of the fin 6 of Y direction is set at below the 10mm.
In addition, shown in (c), the lotus root shape porous member that also can use the direction of principal axis in hole 8 to tilt with respect to the Y direction.In (c), groove 41 ' be formed on the XZ plane.This structure also can make the manufacturing process of radiator 2J simplify, and shortens manufacturing time.
Execution mode 9
Figure 15 is the radiator of present embodiment 9, represents its integral body with 2K.
In the radiator 2K shown in (a), keep sidewall 42L, 42R and substrate 4 landform grooving 41.Groove 41 is roughly parallel to the XZ plane, alternately cuts from the both sides of lotus root shape porous member to form.That is,, be provided with staggered groove 41 with respect to the Z direction.
On the other hand, in the radiator 2K ' shown in (b), kept sidewall 42L, 42R, but having cut substrate 4 ground has formed groove 41.
In this radiator 2K, 2K ', the ratio of through hole 8 increases, and has improved cooling effectiveness.In addition, cold-producing medium can be shaped integratedly by fin 6 and the substrate 4 in the hole 8, has saved operation and cost that fin 6 is engaged with substrate 4, boosts productivity.
In addition,, then a plurality of fins 6 once can be bonded on the substrate,, reduce manufacturing cost so manufacturing process simplifies if radiator 2K, 2K ' are bonded on the good substrate of heat conductivity.
In addition, the formation of groove 41 can be adopted based on the discharge lines of line cutting and process or adopt the machining of having utilized slotting cutter.
Figure 16 is the radiator of present embodiment 10, represents its integral body with 2L.(a) be stereogram, (b) (c) is the profile of seeing from directions X.
In radiator 2L, keep sidewall 42L, formed groove 41 42R.In the structure of (b), groove 41 penetrates into the bottom surface along the Z direction from above.In the structure of (c), formed groove 41 on bottom surface retention substrate 4 ground.
The machining of having utilized slotting cutter is adopted in the formation of this groove 41.That is, the slotting cutter that is configured in the Z direction is moved along directions X, form groove 41.
Usually, radiator is installed in the pipeline that cold-producing medium flows through, but the one-piece type radiator 2L of the sidewall shown in the present embodiment 10, its sidewall 42L, 42R also double as are duct wall, so, can save and make required cost and the operation of duct wall.
In addition,, then a plurality of fins 6 once can be bonded on the substrate,, reduce manufacturing cost so manufacturing process simplifies if this radiator 2L is bonded on the good substrate of heat conductivity.
Especially in the radiator 2L shown in (c), except sidewall 42L, 42R, substrate 4 also is an one, not only sidewall 42L, 42R, and substrate 4 also constitutes duct wall, so, can further omit and make required cost and the operation of duct wall.
Execution mode 11
Figure 17 is the radiator of present embodiment 11, represents its integral body with 2M.(a) being stereogram, (b) is the profile of seeing from directions X.
In present embodiment 11, because radiator 2K ' is bonded on the brace table 71, so, can once a plurality of fins 6 be bonded on the brace table 71, manufacturing process simplifies, and can reduce manufacturing cost.
On the other hand, Figure 18 is another radiator of present embodiment 11, represents its integral body with 2M '.(a) being stereogram, (b) is the profile of seeing from directions X.
This structure can once be bonded on a plurality of fins 6 on the brace table 71 similarly, so manufacturing process simplifies, can reduce manufacturing cost.
Figure 19 is the radiator of present embodiment 12, represents its integral body with 2N.(a) being stereogram, (b) is the profile of seeing from the Z direction.
In radiator 2N, also configurable on sidewall paneling 72L, 72R because bottom surface and two sides are smooth so heater is not only configurable on the bottom surface, cool off.
In present embodiment 12, because radiator 2K is bonded on sidewall paneling 72L, the 72R, so, can once a plurality of fins 6 be bonded on sidewall paneling 72L, the 72R, manufacturing process simplifies, and can reduce manufacturing cost.
Execution mode 13
Figure 20 is the radiator of present embodiment 13, represents its integral body with 2O, 2O '.(a) be stereogram, (b) (c) is the profile of seeing from directions X.
(b) the radiator 2O shown in is that the radiator 2K ' of Figure 15 (b) illustrated embodiment 9 is bonded on the good brace table of heat conductivity 71, reaches the structure on sidewall paneling 72L, the 72R.
In addition, (c) the radiator 2O ' shown in is that the radiator 2K of Figure 15 (a) illustrated embodiment 9 is bonded on the good brace table of heat conductivity 71, reaches the structure on sidewall paneling 72L, the 72R.
In radiator 2O, 2O ', also configurable on sidewall paneling 72L, 72R because bottom surface and two sides are smooth so heater is not only configurable on the bottom surface, cool off.
In addition, in present embodiment 13, because radiator 2K, 2K ' are bonded on brace table 71, reach on sidewall paneling 72L, the 72R, so, can once a plurality of fins 6 be bonded on brace table 71 and sidewall paneling 72L, the 72R, manufacturing process simplifies, and can reduce manufacturing cost.
Figure 21 represents that radiator 2 is assembled in the state in the pipeline 80.Pipeline 80 is made of base plate 81, side plate 82,83,84,85, upper plate 86.Be provided with pipe arrangement 87,88 on side plate 82,83, cold-producing medium flows towards the direction of the direction of arrow 21.
In addition, radiator 2, also available solder etc. is bonded on the bottom surface 81 of pipeline 80.
In addition, being accommodated in the radiator in the pipeline 80, can not be the radiator 2 of execution mode 1 also, but the radiator 2A in other execution mode etc.
Execution mode 5
Figure 22 represents that radiator 2 is assembled in another state in the pipeline 80.Pipeline 80 is made of base plate 81, side plate 82,83,84,85, upper plate 86.Side plate 84,85 and upper plate 86 are to engage in advance.Other structure is identical with above-mentioned execution mode 15.
Like this, owing in advance side plate 84,85 and upper plate 86 are engaged, so the assembling procedure of pipeline 80 can simplify.
Claims (15)
1. a radiator has substrate and a plurality of fin; Aforesaid substrate has with heater hot linked the 1st; Above-mentioned a plurality of fin be supported on substrate with the 2nd of above-mentioned the 1st opposition side on, arranging along predetermined direction, and having a plurality of through holes respectively; Substrate and a plurality of fin form with porous material.
2. radiator as claimed in claim 1 is characterized in that, also has the 1st the 2nd substrate that is engaging with substrate.
3. a radiator is characterized in that, has substrate, a plurality of fin and sidewall; Aforesaid substrate has with heater hot linked the 1st; Above-mentioned a plurality of fin be supported on substrate with the 2nd of above-mentioned the 1st opposition side on, arranging along predetermined direction, and having a plurality of through holes respectively; Above-mentioned sidewall is by a plurality of fins of lateral support of each fin adjacent with the composition surface of substrate; Sidewall and a plurality of fin form with porous material.
4. a radiator is characterized in that, has a plurality of fins and sidewall; Above-mentioned a plurality of fin is bonded on the external substrate of with the heater hot link, is arranging along predetermined direction, and is having a plurality of through holes respectively; Above-mentioned sidewall is by a plurality of fins of lateral support of each fin adjacent with the composition surface of external substrate; Sidewall and a plurality of fin form with porous material.
5. as each described radiator in the claim 1 to 4, it is characterized in that, be ready to have the porous part of reservation shape, on this porous part, cut out one or more groove, thereby be processed to form substrate or sidewall and a plurality of fin.
6. radiator as claimed in claim 5 is characterized in that, above-mentioned porous part has a plurality of [es that extend along predetermined direction; Above-mentioned one or more groove and [cut across form.
7. radiator as claimed in claim 6 is characterized in that, above-mentioned one or more groove forms with the bearing of trend of [and the orientation of fin with acutangulating.
8. as claim 6 or 7 described radiators, it is characterized in that, above-mentioned porous part is to prepare like this: metal-gas of preparing under isobaric gaseous environment is metal and the gas that state diagram has eutectic point, under the isobaric gaseous environment with metal melting after, this motlten metal is solidified in the mould that has temperature gradient along predetermined direction, then cakey metal is processed into predetermined shape.
9. radiator as claimed in claim 1 is characterized in that, is located at being spaced apart more than the 1mm of groove between adjacent fins.
10. radiator as claimed in claim 1 is characterized in that, is located at being spaced apart below the 0.5mm of groove between adjacent fins.
11., it is characterized in that the width of above-mentioned radiator (W) is about below the 10mm as each described radiator in the claim 1 to 10.
12. as claim 3 or 4 described radiators, it is characterized in that, also have the sidewall paneling that is bonded on the above-mentioned sidewall.
13. the manufacture method of a radiator, preparation has the porous part of a plurality of [es of almost parallel extension, cut the part of porous part with the line of roughly straight line ground extension, thereby form the groove that is clipped between fin, wherein, with mobile route on the face of line bearing of trend approximate vertical, line, be roughly コ font.
14. the manufacture method of a radiator, preparation has the porous part of a plurality of [es of almost parallel extension, cut the part of porous part with the line of roughly straight line ground extension, thereby form the groove that is clipped between fin, wherein, with mobile route on the face of line bearing of trend approximate vertical, line, roughly be straight line.
15. the manufacture method of a radiator, preparation have the porous part of a plurality of [es of almost parallel extension, with the part of slotting cutter cutting porous part, thereby form the groove that is clipped between fin, wherein, slotting cutter is moved along roughly certain direction, cut groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200580051290.1A CN101238575B (en) | 2005-08-11 | 2005-08-11 | Heat radiator and its making method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200580051290.1A CN101238575B (en) | 2005-08-11 | 2005-08-11 | Heat radiator and its making method |
| PCT/JP2005/014731 WO2007017945A1 (en) | 2005-08-11 | 2005-08-11 | Heat sink and method of producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101238575A true CN101238575A (en) | 2008-08-06 |
| CN101238575B CN101238575B (en) | 2010-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200580051290.1A Active CN101238575B (en) | 2005-08-11 | 2005-08-11 | Heat radiator and its making method |
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| CN (1) | CN101238575B (en) |
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| CN102130074A (en) * | 2009-12-14 | 2011-07-20 | 三星电机株式会社 | Heat radiating member and circuit board with the same |
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| CN102310320A (en) * | 2010-06-30 | 2012-01-11 | 三菱电机株式会社 | Heat exchanger manufacturing method and manufacturing device |
| CN102934535A (en) * | 2010-06-07 | 2013-02-13 | 三菱电机株式会社 | Heat sink, and method for producing same |
| CN104066526A (en) * | 2011-11-30 | 2014-09-24 | 施耐德电气It公司 | Method of fabricating a heat sink |
| CN104661497A (en) * | 2015-03-04 | 2015-05-27 | 山东超越数控电子有限公司 | Cooling fin provided with through holes |
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| CN2484146Y (en) * | 2001-07-27 | 2002-04-03 | 戴礼冬 | Radiating plate |
| CN100390976C (en) * | 2002-12-31 | 2008-05-28 | 千如电机工业股份有限公司 | Porous structive coramic cooling fin and its making method |
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| CN102130074A (en) * | 2009-12-14 | 2011-07-20 | 三星电机株式会社 | Heat radiating member and circuit board with the same |
| CN102934535B (en) * | 2010-06-07 | 2016-03-30 | 三菱电机株式会社 | Radiator and its preparation method |
| CN102934535A (en) * | 2010-06-07 | 2013-02-13 | 三菱电机株式会社 | Heat sink, and method for producing same |
| CN102310320A (en) * | 2010-06-30 | 2012-01-11 | 三菱电机株式会社 | Heat exchanger manufacturing method and manufacturing device |
| CN102310320B (en) * | 2010-06-30 | 2015-02-11 | 三菱电机株式会社 | Heat exchanger manufacturing method and manufacturing device |
| CN102184902A (en) * | 2011-04-14 | 2011-09-14 | 山东大学 | Porous alloy heat pipe radiator with gradient composite structure |
| US9791219B2 (en) | 2011-11-30 | 2017-10-17 | Schneider Electric It Corporation | Method of fabricating a heat sink |
| CN104066526B (en) * | 2011-11-30 | 2016-03-30 | 施耐德电气It公司 | Manufacture the method for radiator |
| CN104066526A (en) * | 2011-11-30 | 2014-09-24 | 施耐德电气It公司 | Method of fabricating a heat sink |
| CN104661497A (en) * | 2015-03-04 | 2015-05-27 | 山东超越数控电子有限公司 | Cooling fin provided with through holes |
| CN110277737A (en) * | 2019-07-24 | 2019-09-24 | 四川电器集团股份有限公司 | A kind of explosion-proof method of flame-proof switch cabinet and switchgear |
| TWI790835B (en) * | 2021-11-29 | 2023-01-21 | 艾姆勒科技股份有限公司 | Immersion-type heat dissipation structure and method for manufacturing the same |
| CN114850797A (en) * | 2022-05-18 | 2022-08-05 | 浙江华鑫实业有限公司 | Machining method of communication radiator |
| CN114850797B (en) * | 2022-05-18 | 2023-11-03 | 浙江华鑫实业有限公司 | Processing method of radiator for communication |
| US20240142181A1 (en) * | 2022-10-27 | 2024-05-02 | Amulaire Thermal Technology, Inc. | Two-phase immersion-type heat dissipation structure having skived fin with high porosity |
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