CN101237746A - 带有加热电阻器的电子板 - Google Patents
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Abstract
本发明涉及一种电子板(1),其包括形成BGA型电子元件衬板(10)的区域(20),以及与所述区域呈直角的电加热电阻器(25A),所述电阻器能够提供一定量的热量以将元件焊接到板上,其特征在于所述电子板包括多个导电层(21,23,25……),它们与电绝缘层(22,24,26……)交替,所述电阻器(25A)形成这些导电层中紧接在表面层(21)之下的一层导电层。如果需要的话,电子板包括散热器。本发明也涉及一种用于实施方法的工具。它也允许通过更换故障部件来对电子板进行修理,而没有拆焊或损坏邻近部件的风险。
Description
技术领域
本发明涉及电子板领域,特别地,涉及用于装配和拆开通过焊接其上的组件的装置。
背景技术
电子板一般包括平面衬板(planar backing),也就是印刷电路,该印刷电路由堆叠的导体,即所谓的“层”组成,这些层之间由电绝缘体彼此分隔开。电子元件安装在该衬板上,藉由焊接在印刷电路上标绘焊接区的金属接头来提供电子连接。通常该衬板在该领域指首字母缩写词PCB(印刷电路板)。
具有外围输出类型,即,具有设置在外壳周边的连接接头的常规元件能够很容易地被焊接在基底上,所述外壳内置有电子芯片。可以将热源移近外围接头,而又不会有由于过热而损坏元件的任何风险,从而实现焊料熔化以及进行焊接操作所需的热量。
现在技术的发展使得人们可以使用体积更小的带有称为表面输出的元件。图1所示的图表示本领域称为BGA(球栅阵列,ball grid array)类型的元件10。该元件包括嵌入在封装材料12中,并且位于下部基底13上的电子芯片11。标绘焊球15在另一侧与基底形成一体,并且被设置为栅格。一部分标绘焊球15A通过适当的电连接装置16A与芯片11形成电连接,一些标绘焊球15B位于基底的中央部分,它们通过连接装置16B与芯片形成电连接和热连接,以便将芯片的卡路里从外壳中排出至PCB板。
然而,与带有外围输出的元件相比,使用表面输出元件也有不便之处,它们需要被加热后才能进行焊接,因为不加热的话标绘焊球就不可用。因此,为了焊接或拆焊这些元件,需要在焊接合金的熔点加热外壳,例如对于铅基合金来说,熔点是195℃。同时也需要保证温度保持低于芯片的保温温度250℃。
此外,在一些航空应用中,电子板封装在没有冷却空气循环的外壳中。接着,人们就在衬板,即PCB中插入一个或多个金属箔,即所谓的散热器(通常由铜制成),以便于通过加热的电子元件和带有电子板的金属外壳外部之间的传导来进行散热。
此外,特别对于航空应用来说,要使用不受天气影响的漆涂覆整个电子板,以保护其抵御潮湿。
由于在一些应用中,电子板的造价很高,例如在航空应用中,所以能够通过更换故障元件进行修复就显得十分重要。更换故障元件必须不会影响到邻近的元件。较困难的一步是在局部提供足够的热量,从而只将待更换元件的焊接熔化。
在这种设置中,当要更换一个BGA类型的元件,例如将其从衬板上拆焊和重焊时,散热器和不受天气影响的漆的存在就会产生不便之处。
现有技术中常用的解决方法并不适用于在具有散热器的衬板上焊接新元件或拆焊已有元件。在这种情况下,需要提供更多的热量,因为要考虑到从散热器散走的热量。这些过多的热量会损坏邻近的元件。此外,不受天气影响的漆会在加热温度下融化,它很可能会移向邻近的焊料并且损坏电连接。
本申请人在法国专利申请FR2,864,419中提出了一种解决方案。这种通过掺有在第一温度下活化的清除助熔剂(stripper flux)的焊膏,以及在高于第一温度的第二温度下焊接合金熔化的手段,将修理的电子元件焊接在包含用于所述元件的至少一个散热器的衬板上的方法包括下列步骤:
通过散热器将衬板预加热至所述第一温度,
用焊膏将元件在衬板上定位,以及
使用足够高温的热气加热元件,以活化助熔剂并使焊接合金达到第二温度。
在这种类型方法中使用的焊膏一般包括:通常呈球形的焊接合金,很少量的用于处理表面的活化助熔剂,以及稀释剂或溶剂。在预加热操作中,通过加热衬板的散热器,热量供应只提供给需要活化助熔剂的那一个元件,衬板和邻近元件的温度保持在低于邻近元件的焊接合金再熔化的温度。此外,通过元件上方的热气喷嘴局部地提供使焊接合金达到熔点所需的热量。通过与加热板之间的对流来对电子板进行预加热,该加热板设置在电子板下方与所述元件相对的一侧上。
使用热气加热元件包括在中间温度下的预加热步骤,该中间温度低于第二温度。至少在预加热步骤期间,电子板放置在外壳中,以使电子板上的温度均匀。通过与电子板平面垂直设置的喷嘴装置释放出热气,该喷嘴在元件被扫完后与回气烟囱形成装置相连。
在上述专利申请中,也公开了一种用于电子板的组装和维修工具,该工具允许实施前述方法,该工具包括用于固定所述电子板的装置,用于通过热导在电子板一侧加热的装置,以及由加热板组成的装置,该加热板用于用热气对所述电子板的另一侧加热。这个工具不仅能实现上述焊接方法,也能实现将需要更换的元件拆焊下来,而同时不会损坏邻近的元件。
当使用的合金是基于铅的合金时,例如锡铅合金,其熔点可被调节至195℃时,这种方法尤为适用。但它不适用于与不含铅的,符合环保法规的,自身熔点高于或充分接近于元件所能经受的极限温度的合金进行焊接。因此,诸如由锡,铜以及银构成的合金,它们符合环保法规的要求,它们的熔点是230℃,比上面提到的195℃高出35℃,但是基本上接近元件的极限温度250℃。
发明内容
因此,本发明的目的是允许使用具有高于某一温度的熔点的焊料,现有技术中,在该温度下,BGA型元件已经可被焊接在印刷电路上。
本发明的另一目的是改进上述专利申请中的现有方法。而该技术进一步提供了修理电子板,以及移除元件,而不会在电子板上产生任何能损坏电子板部件的热应力。更特别地,用于熔化待移除元件的焊接合金的必需热量供应可以被定位,从而避免损坏邻近元件的连接关系或设置在衬板下方的元件。
根据本发明,使用电子板达到这些目的,本发明的电子板包括:形成BGA型元件区域的衬板;以及与所述区域呈直角的电加热电阻器,所述电阻器能够提供将元件焊接到电子板上所需的一定热量,其特征在于:所述电子板进一步包括:多个与电绝缘层交替的导电层,所述电阻器形成这些导电层中紧接在表面层之下的一层导电层。
在外壳是带有散热器的电子板情况下,带有加热电阻器可以提供所需的补充热量,以便于与熔点高于铅合金熔点的材料焊接起来。通过在一侧用热气加热,在另一侧由加热板加热来进行焊接。附加的电阻器能够将热量供应限制于焊接处,而不会影响到电子元件。尽管本解决方案的益处首先是为了带有散热器的电子板,但是增加加热电阻器也适用于不带任何散热器的电子板的外壳。
同样需要注意的是,这里附加的电阻器不应错认为是加热电阻器,加热电阻器很可能包括航空中使用的电子板,并且具有为整个电子板提供充足热量的功能,以便于能够在很低的温度下进行令人满意的操作。
根据另一个特征,所述电子元件衬板形成区域包括多个晶片,元件就焊接在晶片上,形成加热区域的加热电阻器设置在所述晶片的下面,最好是直接设置在晶片下面。
本发明的电子板在BGA型电子元件或任何类型元件的焊接/拆焊方法领域中具有特别的好处,其中这些元件的连接焊料是难以接触到的,本方法包括从相对于元件的电子板的相对面进行焊接的第一次加热,所述加热电阻器提供补充的热量供应,以便增加焊接温度,例如可达到熔点。
更特别地,通过加热板的传导获得从相对侧的所述焊料加热。
根据另一个特征,本方法包括通过施加到元件上的热气实现第二次加热。
下面参考附图,将对本发明进行详细描述。
附图说明
图1是表面输出元件的截面图。
图2是沿图3中2-2线的截面图,电子板部件设有焊接连接的元件以及衬板中有散热器。
图3是沿图2中3-3方向的截面图。
图4是沿图2中4-4方向的截面图。
图5是沿图2中5-5方向的截面图。
图6是本发明中用于将BGA型电子元件焊接到印刷电路板上的工具。
具体实施方式
在图2中,部分揭示了,在BGA电子元件安装领域中,带有本发明所述装置的电子板。电子板20包括多个导电层21,23,25……,介于电绝缘层22,24,26……之间。这里只显示了它们中的头三个,但是电子板通常包括有很多个层。第一层21,在图3中也有揭示,它包括晶片21A,该晶片21A通过焊球15与元件之间构成电连接。晶片21A与下面的电子层23的接点23A之间有电连接,电子层23在图4中也有揭示。第一层也包括晶片21B和层23,接点23B。这些晶片通过金属化穿孔互相连接,以实现所有元件间的电路互连,这些元件在电子板的外表面上以电线相连,从而实现电子板的电功能性。
根据本发明,下面的层25包括加热电阻器25A。在图5中详细揭示了这种电阻器的几何形状,其呈栅格形状,并带有加热面25A1,加热面25A1由导线束25A2相连,线25A2又与两侧的导线束25A3相连。两侧的导线束25A3分别与垂直电子板平面穿过电子板的金属化穿孔27和27’电连接。金属化穿孔27和27’能够使电阻器与外部电源相连接。
可以看出加热面与晶片21A之间呈直角,以在第一层21上构成连接。
现在请参考图6,揭示了电子板的组装和修理工具100,其能焊接或拆焊BGA型的电子元件,其中设置了电子板1,该电子板带有其上设置有元件10的衬板区域20。参看图2,其揭示了构成层28和底盘29的散热器。电子板进一步包括图中未示出的连续的层25,其包括加热电阻器和形成层28的金属散热器。
该工具包括加热板40,其上定位有电子板。插头27f和27f’安装在金属化穿孔27和27’中。插头与电源相连。
加热板40的加热装置在图中没有显示,举个例子,其可以是电加热装置。在电子板的顶上,设置有与衬板平面垂直的喷嘴110。喷嘴110的宽度足够覆盖元件10。在图中,有两个墙壁部件121,它们在喷嘴壁外部和与其轴平行,并提供了通路。它们形成了回气烟囱。箭头指示了由喷嘴壁导引的入射气体的方向,以及同一气体在与元件碰撞后的行进方向。
有利地,将电子板和加热板组件封装在热防护外壳(此处未示)中,以便使其包括的不同组件的温度均一。有利地,喷嘴包括两个孔122,使其设置在要焊接或拆焊的元件所在的位置,这取决于是要组装电子板还是要通过更换元件而对其进行修理。例如,在不需要处理的位置,这些孔被阻塞。举个例子,墙壁121的部件位于沿着孔122的边缘,从而当加热喷嘴被定位穿过孔时,可以对气体形成屏障。墙壁与位于孔内的喷嘴壁共同构成一个烟囱。
下面将介绍某一具体元件的焊接过程的一个范例。
由加热板40对板进行预加热;由板产生的热量被向上传递至形成电子板散热器的金属部件。温度持续增加直到电子板达到一预定温度。
然后,将元件定位在插入焊膏的衬板上。温度足够活化焊膏中含有的清除助熔剂(stripper flux)。
热气通过喷嘴喷在元件上,温度范围从250℃到300℃。热气扫过元件的上表面,绕过喷嘴的自由边,被烟囱的墙壁导引,与原方向反转180°返回。在元件的焊球水平的温度逐渐达到165℃到170℃。
然后热气的温度增加至400℃-490℃。
通过在一预定时间段内提供加热电阻器25A来得到大量的补充热量,该时间段足够短以便使临近的元件和要焊接的元件能避免受损。在这个时间范围内,由于加热面与要焊接的晶片呈直角,可以进一步减小损坏其它元件的风险;焊球上的温度逐渐增加至230℃,芯片的温度增加至230℃-240℃。达到组成焊接的合金的熔点,热气流也就此停止。
在修理电子板时,步骤与上述过程类似,或者更佳的是,为了简化操作模式的目的,使用与已经介绍过的焊接元件的过程相同的步骤。更特别地,电子板被预加热至第一温度以便使电子板中产生的应变达到平衡。
在第二种情况下,可以毫无困难地使预加热温度达到助熔剂的活化温度。然而,当电子板被封装在热防护外壳中时,可以大大地减少电子板上不同点处的温度散失。
Claims (8)
1.一种电子板(1),其包括形成BGA型电子元件衬板(10)的区域(20),以及与所述区域呈直角的电加热电阻器(25A),所述电阻器能够提供一定的热量以将元件焊接到板上,其特征在于所述电子板包括多个导电层(21,23,25……),它们与电绝缘层(22,24,26……)交替,所述电阻器(25A)形成这些导电层中紧接在表面层(21)之下的一层导电层。
2.如权利要求1所述的电子板,其中形成电子元件衬板(10)的所述区域(20)包括多个晶片(21A),元件焊接在这些晶片上,加热电阻器包括设置在所述晶片下面的加热面(25A1)。
3.如权利要求1所述的电子板,其中所述加热电阻器包括形成接点以连接外部电源的装置(27,27’)。
4.如权利要求1所述的电子板,其包括散热器(28)。
5.一种在如权利要求1所述的印刷电路电子板上焊接/拆焊BGA型电子元件的方法,包括从相对于元件的电子板相对面进行焊接的第一次加热,所述加热电阻器提供补充热量以使焊接温度增至熔点。
6.如权利要求5所述的方法,其中通过加热板的传导来实现所述的从相对面的焊接加热。
7.如权利要求6所述方法,其包括由施加到元件上的热气进行的第二次加热。
8.如权利要求7所述方法,其中所述热气由钟形物导引,该钟形物包括在热气扫过所述元件后的气体排放装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR07/00684 | 2007-01-31 | ||
FR0700684A FR2912029B1 (fr) | 2007-01-31 | 2007-01-31 | Carte electronique incorporant une resistance chauffante. |
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CN101237746A true CN101237746A (zh) | 2008-08-06 |
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CN200810007106.9A Pending CN101237746A (zh) | 2007-01-31 | 2008-01-31 | 带有加热电阻器的电子板 |
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US (1) | US8059424B2 (zh) |
EP (1) | EP1954108A1 (zh) |
JP (1) | JP2008193083A (zh) |
CN (1) | CN101237746A (zh) |
BR (1) | BRPI0800072A (zh) |
CA (1) | CA2619144A1 (zh) |
FR (1) | FR2912029B1 (zh) |
IL (1) | IL189121A0 (zh) |
MA (1) | MA29829B1 (zh) |
MX (1) | MX2008001438A (zh) |
RU (1) | RU2484607C2 (zh) |
SG (1) | SG144889A1 (zh) |
ZA (1) | ZA200800996B (zh) |
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CN103889079A (zh) * | 2012-12-20 | 2014-06-25 | 李水波 | 加热板 |
CN112349659A (zh) * | 2019-08-07 | 2021-02-09 | 台湾爱司帝科技股份有限公司 | 薄膜结构、芯片承载组件及芯片承载设备 |
CN112992812A (zh) * | 2019-12-17 | 2021-06-18 | 台湾爱司帝科技股份有限公司 | 微加热器芯片、晶圆级电子芯片组件及芯片组件堆叠系统 |
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WO2020196746A1 (ja) * | 2019-03-26 | 2020-10-01 | 三菱マテリアル株式会社 | 絶縁回路基板 |
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- 2008-01-29 MA MA30611A patent/MA29829B1/fr unknown
- 2008-01-30 SG SG200800842-7A patent/SG144889A1/en unknown
- 2008-01-30 IL IL189121A patent/IL189121A0/en unknown
- 2008-01-30 MX MX2008001438A patent/MX2008001438A/es not_active Application Discontinuation
- 2008-01-30 ZA ZA200800996A patent/ZA200800996B/en unknown
- 2008-01-30 RU RU2008103648/07A patent/RU2484607C2/ru not_active IP Right Cessation
- 2008-01-30 JP JP2008018629A patent/JP2008193083A/ja not_active Withdrawn
- 2008-01-30 US US12/022,505 patent/US8059424B2/en not_active Expired - Fee Related
- 2008-01-31 BR BRPI0800072-7A patent/BRPI0800072A/pt not_active IP Right Cessation
- 2008-01-31 EP EP08101161A patent/EP1954108A1/fr not_active Withdrawn
- 2008-01-31 CN CN200810007106.9A patent/CN101237746A/zh active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103889079A (zh) * | 2012-12-20 | 2014-06-25 | 李水波 | 加热板 |
CN103889079B (zh) * | 2012-12-20 | 2016-03-09 | 李水波 | 加热板 |
CN112349659A (zh) * | 2019-08-07 | 2021-02-09 | 台湾爱司帝科技股份有限公司 | 薄膜结构、芯片承载组件及芯片承载设备 |
CN112992812A (zh) * | 2019-12-17 | 2021-06-18 | 台湾爱司帝科技股份有限公司 | 微加热器芯片、晶圆级电子芯片组件及芯片组件堆叠系统 |
Also Published As
Publication number | Publication date |
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US8059424B2 (en) | 2011-11-15 |
EP1954108A1 (fr) | 2008-08-06 |
ZA200800996B (en) | 2008-11-26 |
CA2619144A1 (fr) | 2008-07-31 |
SG144889A1 (en) | 2008-08-28 |
IL189121A0 (en) | 2008-11-03 |
MX2008001438A (es) | 2009-02-24 |
JP2008193083A (ja) | 2008-08-21 |
FR2912029A1 (fr) | 2008-08-01 |
FR2912029B1 (fr) | 2010-10-22 |
BRPI0800072A (pt) | 2008-09-16 |
RU2484607C2 (ru) | 2013-06-10 |
RU2008103648A (ru) | 2009-08-10 |
MA29829B1 (fr) | 2008-10-03 |
US20080187772A1 (en) | 2008-08-07 |
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