CN101226949A - Image sensing apparatus and encapsulation method thereof - Google Patents
Image sensing apparatus and encapsulation method thereof Download PDFInfo
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- CN101226949A CN101226949A CNA2007100023925A CN200710002392A CN101226949A CN 101226949 A CN101226949 A CN 101226949A CN A2007100023925 A CNA2007100023925 A CN A2007100023925A CN 200710002392 A CN200710002392 A CN 200710002392A CN 101226949 A CN101226949 A CN 101226949A
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Abstract
The invention relates to an encapsulated module of am image sensing device, the encapsulated module comprises a base plate, a first micro-optics element array, a cover plate and a bay level, wherein the base plate is equipped with a photoelectric transition element array, the first micro-optics element array is formed on the photoelectric transition element array, a second micro-optics array which is oppositely arranged with the first micro-optics element array is arranged on the cover plate, and the bay level is arranged on a joint of the cover plate and the base plate to control the distance between the base plate and the cover plate and maintains the distance in the rang of focal depth of an optical imaging system. The invention effectively solves optical interference problems which exist between sensing element pixels of the image sensing device and the miniaturization problems of the image sensing device.
Description
Technical field
The present invention relates to a kind of image sensering device, relate in particular to a kind of encapsulating structure and manufacture method thereof of image sensering device.
Background technology
Along with making rapid progress of photovoltaic, the demand of imageing sensor is constantly increased.And common imageing sensor can be divided into CCD (Charge Coupled Device, CCD) and CMOS (Complementary Metal-Oxide Semiconductor, complementary matal-oxide semiconductor) two big classes at present.Yet, no matter be CCD or cmos image sensor, all are a kind of semiconductor sensing elements, after converting electric energy in order to the light that will be sensed, again by analog/digital converter (ADC, Analog to Digital Converter) electronic signal is converted to digital signal, transfers to process chip again and carry out signal processing, form digital picture output at last.And structurally maximum different of ccd image sensor and cmos image sensor are position that ADC is provided with quantitative different.
On the other hand.In practical application, no matter be CCD or cmos image sensor, all be by a plurality of CCD or cmos image sensing element and form an image sensing array, wherein, each imageing sensor is referred to as pixel or pixel usually.For an imageing sensor, pixel how much be one of main reason that influences this imageing sensor image quality.In general, the pixel that imageing sensor comprised is many more, and the picture quality that is presented is just clear more.Therefore, along with developing rapidly of semiconductor process techniques, producing the image sensing element that comprises more pixels in same sensing region, has been a manufacturing technology that can reach easily in this area.
Yet the image sensering device of high pixel is quite ripe on manufacturing technology; Yet the increasing sensing element that holds in same sensing region but begins to derive another problem.See also Fig. 1, it is the schematic diagram of known sensing element array.As shown in FIG., this image sensing element array 10 comprises first lenticule (micro lens) 11a, the second lenticule 11b, the 3rd lenticule 11c, the first colored filter 12a, the second colored filter 12b, the 3rd colored filter 12c, light shield layer 13, IC stack layer 14, and the first light sensitive diode 15a, the second light sensitive diode 15b, the 3rd light sensitive diode 15c.Under normal situation, the first incident light 17a should directly put on this second light sensitive diode 15b through after this second lenticule 11b; Yet, when the angle of incident ray becomes big, the second incident light 17b than wide-angle just may be through after this second lenticule 11b, incide another light sensitive diode 15a adjacent with this second light sensitive diode 15b, therefore begin to produce imaging and disturb, this is optics optical crosstalk (optical crosstalk) effect.And along with the increase of pixel on the light sensing apparatus, this optics optical crosstalk effect will become more apparent.
In order to solve the problem that aforesaid optics optical crosstalk effect is derived effectively, in technique known, as United States Patent (USP) notification number US 6,803, in 250, it is to reach the effect that improves light incident efficient by the mode of setting up a complementary set of lenses in the light sensing zone.See also Fig. 2, it is the structural representation with image sensing element of complementary set of lenses.As shown in FIG., this image sensing element 20 comprises substrate 21, has light sensing zone 22 on it, first dielectric substance layer 23, comprise the first conductor layer 24a, 24b on it, second dielectric substance layer 25 comprises the second conductor layer 26a, 26b and first gap 27 on it, chromatic filter layer 28 and lenticule 29 are arranged at the top.This lenticule 29 is convex lens, in order to improve the light harvesting effect of incident beam, first gap, the 27 formed concave structures of these lenticule 29 collocation belows then can further form complementary double micro lens group, the incident light boundling that has wide-angle is low-angle effect, yet the effect of this light boundling also can't reach the effect of the key light incidence angle (CRA, chief ray angle) of adjusting incident beam.Therefore, such structural design is limited for the effect of improving optics optical crosstalk effect.Moreover the concave structure of foregoing double micro lens group is formed on second dielectric layer 25, and this causes extra manufacturing cost burden to needing the extra one concave structure manufacturing technology that increase in the manufacturing technology of the sensing element of standard.And in order effectively to overcome above-mentioned optics optical crosstalk effect, this case applicant has proposed the TaiWan, China patent application (No. 094133609 application case) of " image sensing apparatus and its manufacture method " on September 27th, 2006, it is the setting by microprism, reach the purpose at the key light angle (CRA) of revising incident ray, to reduce the optical interference (optical crosstalk effect) between the pixel.This case utilizes the setting of microprism to reach the technology contents that reduces optical interference between the pixel, also classifies the main reference document of this case simultaneously as.
On the other hand, in known technology, the encapsulating structure of common image sensering device also may have the effect of the collection efficiency that improves incident beam through specific design.See also among Fig. 3, it represents a kind of encapsulating structure of known sensing apparatus.As shown in FIG., the encapsulating structure 30 of this image sensering device comprises substrate 31, this substrate has image sensing element array 32, and also comprises microlens array 33 on this image sensing element array 32, in order to the collection efficiency of the light that improves this image sensing element 30 of incident.33 of this image sensing element array 32 and microlens arrays thereof are to be packaged between glass cover-plate 34 and this substrate 31; and this substrate 31 and this glass cover-plate 34 are kept distance between this substrate 31 and this glass cover-plate 34 by the height of wall (spacerlayer) 35; yet the height of this wall in the product can maintain between 30 to 50 microns usually at present; and should be highly much larger than this sensing element array 32 and this microlens array 33 pairing Pixel Dimensions and optical system depth of focus, therefore such package module design does not also meet the compact design requirement of optical element trend.
The applicant is in view of in the known technology, the problem that usually has optical interference between the sensing element pixel of image sensering device, and the package module of this image sensering device also faces the shortcoming that is difficult for microminiaturization, through test and research in detail, and by means of the spirit of working with perseverance, invent out the present invention, to overcome the above-mentioned shortcoming of image sensering device.
Summary of the invention
The present invention proposes a kind of package module of image sensering device, this package module comprises substrate, the first micro optical element array, cover plate and wall, wherein, has photoelectric conversion element array on this substrate, and this first micro optical element matrix-like is formed on this photoelectric conversion element array, have second micro optical array and relative arrangement of this first micro optical array element on this cover plate, this wall then is the joint that is arranged at this cover plate and this substrate.
According to above-mentioned conception, wherein this first micro optical element array is a microprism array.
According to above-mentioned conception, wherein this first micro optical element array is a microlens array.
According to above-mentioned conception, wherein this second micro optical element array is a microlens array.
According to above-mentioned conception, wherein this second micro optical element array is a microprism array.
According to above-mentioned conception, wherein this cover plate is made of light transmissive material.
According to above-mentioned conception, this wall height Pixel Dimensions that is this optical conversion component array wherein.
According to above-mentioned conception, wherein also comprise at least one set of lenses (lens set) on this cover plate, to constitute the optical imaging system of this image sensering device.
According to above-mentioned conception, wherein this optical imaging system also has a depth of focus (depth of focus) scope, and this spacing is controlled within the focal depth range of this optical imaging system.
Another conception of the present invention is to propose a kind of image sensing optical system, this image sensing optical system comprises the package module and the set of lenses of image sensering device, and wherein the package module of this image sensering device further comprises substrate, the first micro optical element array, cover plate and wall.
According to above-mentioned conception, wherein also has photoelectric conversion element array on this substrate, this first micro optical element matrix-like is formed on this photoelectric conversion element array, then have second micro optical array and relative arrangement of this first micro optical array element on this cover plate, and this wall then is the joint that is arranged at this cover plate and this substrate, in order to control the spacing between this first micro optical array and this second micro optical array, in addition, this set of lenses then is to be arranged on this cover plate, with so that the image formation by rays of this image sensing optical system of incident in this image sensering device module.
According to above-mentioned conception, wherein this first micro optical element array is a microprism array.
According to above-mentioned conception, wherein this first micro optical element array is a microlens array.
According to above-mentioned conception, wherein this second micro optical element array is a microlens array.
According to above-mentioned conception, wherein this second micro optical element array is a microprism array.
According to above-mentioned conception, wherein this cover plate is made of light transmissive material.
According to above-mentioned conception, wherein this image sensing optical system has a focal depth range, and this spacing is controlled in this depth of focus (depth of focus) scope.
According to above-mentioned conception, wherein this spacing is the Pixel Dimensions of this optical conversion component array.
Another conception of the present invention is the method that proposes a kind of package image sensing apparatus, and this method comprises the following step at least: (1) provides substrate and cover plate; (2) on this substrate, form photoelectric conversion element array; (3) on this photoelectric conversion element array, form the first micro optical element array; (4) on this cover plate, form the second micro optical element array; And (5) engage this substrate and this loam cake, so that this micro optical element array and relative arrangement of this second micro optical element array.
According to above-mentioned conception, wherein this second micro optical element array is formed on this cover plate to be similar to semiconductor technology.
According to above-mentioned conception, wherein when engaging the step of this substrate and this loam cake, also comprise the formation wall, to control the spacing between this substrate and this cover plate.
According to above-mentioned conception, wherein this spacing is the unit picture element size of this photoelectric conversion element array.
According to above-mentioned conception, wherein also be included in the step that forms at least one set of lenses (lens set) on this cover plate, to constitute the optical imaging system of this image sensering device.
According to above-mentioned conception, wherein this optical imaging system has a depth of focus (depth of focus) scope, and this spacing is controlled within this focal depth range.
According to the present invention, can solve the optical interference problem that exists between the sensing element pixel of image sensering device effectively, and the image sensering device miniaturization issues.
By the following drawings explanation and embodiment the present invention is elaborated, be convenient to more in depth understand the present invention.
[brief description of drawingsfig]
Fig. 1 represents the schematic diagram according to a kind of sensing element array in the known technology.
Fig. 2 represents according to a kind of structural representation with image sensing element of complementary set of lenses in the known technology.
Fig. 3 represents the encapsulating structure schematic diagram according to a kind of sensing apparatus in the known technology.
Fig. 4 A and Fig. 4 B represent to utilize the schematic diagram of setting up a little water chestnut mirror and reaching the angle of incidence of light of finishing wide-angle.
Fig. 5 A and Fig. 5 B represent to utilize the schematic diagram of setting up a lenticule and reaching the angle of incidence of light of finishing wide-angle.
Fig. 6 A and Fig. 6 B represent the image sensering device encapsulation modular structure schematic diagram according to first specific embodiment of the present invention.
Fig. 7 A and Fig. 7 B represent the image sensering device encapsulation modular structure schematic diagram according to second specific embodiment of the present invention.
Fig. 8 A and Fig. 8 B represent the image sensering device encapsulation modular structure schematic diagram according to the 3rd specific embodiment of the present invention.
Fig. 9 represents a kind of image sensing optical system according to the 4th specific embodiment of the present invention.
The explanation of main element reference numeral:
10 image sensing element arrays
11a-11c lenticule 13 light shield layers
12a-12c colored filter 14 IC stack layers
15a-15c light sensitive diode 17a, 17b incident light image component
20 image sensing elements
21 substrates, 22 light sensing zones
23 first dielectric substance layer 24a, 24b first conductor layer
25 second dielectric substance layer 26a, 26b second conductor layer
27 gaps, 28 chromatic filter layers
29 lenticules
The encapsulating structure of 30 image sensering devices
31 substrates, 32 image sensing element arrays
33 microlens arrays, 33 34 glass cover-plates
35 walls
The single dot structure of 40 image sensering devices
41 lenticules, 42 IC stack layers
43 photosensitive layers, 45 microprisms
46 lenticules
100,110,120,130,140,150 image sensering device package modules
101 substrates, 102 cover plates
103 walls, 104 photoelectricity sensed layer
105 first micro optical element arrays, 106 second micro optical element arrays
200 image sensing optical systems
201 set of lenses images, 202 light screening materials
203 isolated electromagnetic shielding materials
Embodiment
Embodiment 1
See also 4A and Fig. 4 B, it represents a kind of conception of the present invention, and its utilization is set up a little water chestnut mirror (micro prism) and reached the schematic diagram of angle of incidence of light of finishing wide-angle.As shown in Fig. 4 A, the dot structure that the single dot structure 40 of known image sensering device designs the sensing element array 10 among Fig. 1 as described above is the same, has lenticule (micro lens) 41, IC stack layer 42 and photosensitive layer 43; And as shown in Fig. 4 A, though the design of this lenticule 41 can have light harvesting effect to a certain degree, yet when the angle of incident ray becomes big (when just key light incidence angle (CRA) increases), the position of ray cast on this photosensitive layer 43 can past more photosensitive layer outside skew, and after the angle at key light angle is bigger than a certain particular value, the light of incident will be displaced to this pixel 43 layers of sensitization the outside and project on its adjacent pixels, thereby produce so-called optical optical crosstalk (optical crosstalk) effect.And by the design of the dot structure shown in Fig. 4 B, above this dot structure 40, set up a microprism 45 structures, the key light incidence angle (CRA) that makes wide-angle is trimmed to less incidence angle earlier through this microprism 45 time, can effectively avoid the disturbed condition between the neighbor.Therefore, this pair of micro-optic mirror group is designed to one of main conception of the present invention.
In addition, Fig. 5 A and Fig. 5 B illustrate another kind of conception of the present invention, and the schematic diagram of a lenticule with the angle of incidence of light of finishing wide-angle set up in its utilization.At Fig. 5 A, the dot structure 40 of image sensering device is similar to the design as the dot structure 40 of the image sensering device among Fig. 4 A, has lenticule 41, IC stack layer 42 and photosensitive layer 43; And the key light incidence angle of its incident ray is when becoming big, the outside skew that the position of ray cast on this photosensitive layer 43 equally can past more photosensitive layer.And in Fig. 5 B, the single dot structure 40 of this sensing apparatus is similar to the dot structure design among Fig. 4 B, and only the design of this microprism 45 is replaced by another lenticule 46 structures.And the light incident path figure from Fig. 4 B as can be known, the key light incidence angle (CRA) that these lenticule 46 structures have the wide-angle of making equally is trimmed to the function of less incidence angle earlier through this lenticule 46 time, so can effectively avoid the disturbed condition between the neighbor.Therefore, in purpose of the present invention, be to reach the angle of finishing key light incidence angle and incident beam is produced the purpose of boundling effect, effectively to avoid the generation of optics optical crosstalk effect by designed two micro-optic mirror groups (it can be the combination in any of microprism, dimpling lens or nick lens).
Because the present invention is structured on the basis that the two micro-optic mirror groups of image sensering device design, the inventor of this case further proposes this pair micro-optic mirror group is designed respectively on the encapsulation cover plate and its silicon wafer substrate of image sensering device, further to reach the purpose with the effective microminiaturization of image sensering device package module again.To further describe at the design of the package module of aforementioned conception of the present invention below.
See Fig. 6 A, it represents first specific embodiment of a kind of image sensering device package module of the present invention.As shown in FIG., this image sensering device package module 100 mainly comprises substrate 101 and cover plate 102, then is to control distance between this substrate 101 and this cover plate 102 by wall (spacer) 103 at the joint of this substrate 101 and this cover plate 102.In addition, on this substrate 101, also has photoelectricity sensed layer 104, it is the opto-electronic conversion array of being made up of a plurality of photo-electric conversion elements (being generally CMOS sensing element or CCD sensing element), and also be formed with the first micro optical element array 105 on this photoelectricity sensed layer 104, wherein this first micro optical array also comprises a plurality of nick lens, and make each nick lens corresponding one or several photo-electric conversion elements, project the boundling effect of the light of each photo-electric conversion element with lifting.On the other hand, this cover plate 102 is made of light transmissive material usually, be formed with the second micro optical element array 106 on it, with these first micro optical element array, 105 relative arrangements, wherein this second micro optical element array 106 also comprises a plurality of nick lens (concave lens), and each nick lens is to each nick lens that should the first micro optical element array 105, so that the light beam of each nick lens of this first micro optical element array 105 of incident can be adjusted its key light incidence angle (CRA) through the nick lens of this second micro optical element array 106 earlier, to reach the effect of improving optics optical crosstalk effect.
In another alternate embodiment of the image sensering device package module 100 of the embodiment of the invention 1, as shown in Fig. 6 B, this image sensering device package module 110 and image sensering device package module 100 in the previous embodiment 1 comprise cover plate 102, wall 103, photoelectricity sensed layer 104 and the first micro optical element array 105 formed thereon and the second micro optical element array 106 of relative arrangement with this first micro optical element array equally.And the difference of this image sensering device package module 110 and image sensering device package module 100 is that this photoelectricity sensed layer 104 in this image sensering device package module 110 is present on the substrate 101 of a wafer-level (wafer level), therefore this image sensering device package module 110 can utilize the chip encapsulation technology (Wafer Level CSP) of wafer scale to carry out, further effectively to reduce the encapsulation volume of this image sensering device package module.
Embodiment 2
See Fig. 7 A, it represents the embodiment 2 of a kind of image sensering device package module of the present invention.Compare with the image sensering device package module 100 in the previous embodiment 1, have much at one member and configuration mode equally according to the image sensering device package module 120 in the embodiments of the invention 2, only wherein be formed in the second micro optical element array 106 of the first micro optical element array 105 on the photoelectricity sensed layer 104 and relative arrangement and adopt a plurality of dimpling lens (convex lens) to form its micro optical array with this first micro optical element array.In addition, shown in Fig. 7 B, it represents another alternate embodiment of this image sensering device package module 120.Identical with aforementioned alternate embodiment according to Fig. 6 B, at the image sensering device package module 130 shown in Fig. 7 B this photoelectricity sensed layer 104 is formed on the substrate 101 of a wafer-level (wafer level), therefore this image sensering device package module 130 can utilize the chip encapsulation technology (Wafer Level CSP) of wafer scale to carry out, further effectively to reduce the encapsulation volume of this image sensering device package module.
Embodiment 3
Shown in Fig. 8 A and B, it represents the embodiment 3 and the corresponding alternate embodiment thereof of a kind of image sensering device package module of the present invention.Compare with the image sensering device package module 100 and 120 among the embodiment 2 with previous embodiment 1, image sensering device package module 140 shown in Fig. 8 A has and previous embodiment member and configuration mode much at one equally, the first micro optical element array 105 that only wherein is formed on the photoelectricity sensed layer 104 adopts a plurality of dimpling lens to form its micro optical array, is formed on this cover plate 102 and in the second micro optical element array 106 of relative arrangement with this first micro optical element array and then adopts a plurality of microprisms (micro prism) to form its micro optical array.Image sensering device package module 150 then is the image sensing package module 140 among the corresponding diagram 8A and is similar to aforementioned according to the image sensering device package module 110 and 130 among Fig. 6 B and Fig. 7 B shown in Fig. 8 B, this photoelectricity sensed layer 104 is formed on the substrate 101 of a wafer-level (wafer level), therefore this image sensering device package module 150 can utilize the chip encapsulation technology (WaferLevel CSP) of wafer scale to carry out, further effectively to reduce the encapsulation volume of this image sensering device package module.
In previous embodiment 1～3 and alternate embodiment thereof, lenticule on this first micro optical element array 105 and this second micro optical element array 106 or little water chestnut mirror can be looked technology or applicable cases and combination in any in addition, should not be limited to the execution mode of aforementioned cited specific embodiment.In addition, wall 103 among this image sensing package module 100-150 highly can be controlled at the Pixel Dimensions size that the spacing that makes this first micro optical element array 105 and this second micro optical element array 106 maintains each pixel that is equivalent to this photoelectric conversion element array 104, further effectively to reduce the encapsulation volume of this image sensing package module 100-150.
As Fig. 9, its expression is according to a kind of image sensing optical system of the 4th specific embodiment of the present invention.As shown in Figure 9, this image sensing optical system 200 comprises the package module 110 and the set of lenses 201 of the image sensering device described in the embodiment as described above.As previously mentioned, the package module 110 of this image sensering device is made up of the substrate 101 and the cover plate 102 that are formed on the wafer, wherein, on this substrate 101, have photoelectric conversion element array 104, and on photoelectric conversion element array 104, then be formed with the first micro optical element array 103.On the other hand, then have second micro optical array 106 and these first micro optical array element, 103 relative arrangements on the cover plate 102 of the package module 110 of this image sensering device, joint between this cover plate 102 and this substrate 101 then is formed with wall 103, in order to control the spacing between this first micro optical array 105 and this second micro optical array 106.In addition, this set of lenses 201-203 then is formed on this cover plate 102, with so that the image formation by rays of this image sensing optical system of incident in the package module 110 of this image sensering device.Design by above-mentioned image sensing optical system 200, wall 103 in this image sensing package module 110 highly can be adjusted to make this first micro optical element array 105 with this second for the spacing of array of optical elements 106 maintains within depth of focus (the depth of focus) scope of this set of lenses 201, further effectively to reduce the encapsulation volume of this image sensing package module 110.
In preferable specific embodiment, this image sensing optical system 200 also comprises light screening material 202, be arranged on this set of lenses 201 around, reflex to outside this set of lenses 201 or be subjected to the interference of extraneous light incident with the light of avoiding in this set of lenses 201 transmission, around the package module 110 of this image sensering device, then be provided with isolated electromagnetic shielding (EMI) material 203, to intercept electromagnetic interference.In addition, in other alternate embodiment, first and second micro optical array on the package module 110 of this image sensering device certainly depending on the circumstances or the needs of the situation is replaced by the kenel of dimpling lens or microprism, with the optimum efficiency of the optics optical crosstalk effect that is improved.
Comprehensive the above, the present invention proposes the image sensing optical system that a kind of package module of image sensering device and package module and at least one set of lenses by this image sensering device are constituted.And, the manufacture method of above-mentioned image sensing package module and the image sensing optical system that constituted thereof is compatible with traditional semiconductor technology, integrated optics technology and semiconductor packaging process, so that this photoelectric conversion element array and this first micro optical element array, with and pairing this second array of optical elements can be formed at respectively on this substrate and this cover plate, finish the canned program of this image sense package module or its optical system by engaging (bonding) technology.Yet, mandatory declaration be, the foregoing description is only in order to illustrating better embodiment of the present invention, however scope of the present invention should be not limited to this above-mentioned specific embodiment; The present invention can be conceived arbitrarily by those skilled in the art and forms many modifications, however the scope that does not all break away from claims and defined.
Claims (16)
1. the package module of an image sensering device is characterized in that, comprises:
Substrate has photoelectric conversion element array on it;
The first micro optical element array is formed on this photoelectric conversion element array;
Cover plate has second micro optical array and relative arrangement of this first micro optical array element on it; And
Wall is placed in the joint of this cover plate and this substrate, in order to control the spacing between this substrate and this cover plate.
2. package module as claimed in claim 1 is characterized in that, this first micro optical element array is microprism array or microlens array.
3. package module as claimed in claim 1 is characterized in that, this second micro optical element array is microprism array or microlens array.
4. package module as claimed in claim 1 is characterized in that, this first micro optical element array comprises a plurality of nick lens, and this second micro optical element array comprises a plurality of corresponding with it nick lens.
5. package module as claimed in claim 1 is characterized in that, this first micro optical element array comprises a plurality of dimpling lens, and this second micro optical element array comprises a plurality of corresponding with it dimpling lens.
6. package module as claimed in claim 1 is characterized in that, this first micro optical element array comprises a plurality of dimpling lens, and this second micro optical element array comprises a plurality of corresponding with it microprisms.
7. package module as claimed in claim 1 is characterized in that this cover plate is made of light transmissive material.
8. package module as claimed in claim 1 is characterized in that photoelectric conversion element array has a plurality of pixels, and this spacing equates with this Pixel Dimensions.
9. package module as claimed in claim 1 is characterized in that, this substrate is a wafer-level.
10. an image sensing optical system is characterized in that, comprises:
The package module of image sensering device, it comprises:
Substrate has photoelectric conversion element array on it;
The first micro optical element array is formed on this photoelectric conversion element array;
Cover plate has second micro optical array and relative arrangement of this first micro optical array element on it; And
Wall is placed in the joint of this cover plate and this substrate, in order to control the spacing between this first micro optical array and this second micro optical array; And
Set of lenses is arranged on this cover plate, with so that the image formation by rays of this image sensing optical system of incident in the package module of this image sensering device.
11. image sensing optical system as claimed in claim 10 is characterized in that, this first micro optical element array is microprism array or microlens array.
12. image sensing optical system as claimed in claim 10 is characterized in that, this second micro optical element array is microprism array or microlens array.
13. image sensing optical system as claimed in claim 10 is characterized in that,
This cover plate is made of light transmissive material;
This image sensing optical system has a focal depth range, and this spacing is controlled in this focal depth range; And/or
This optical conversion component array comprises a plurality of pixels, and this spacing equates with this Pixel Dimensions.
14. image sensing optical system as claimed in claim 10 is characterized in that, also comprises light screening material, be arranged on this set of lenses around.
15. image sensing optical system as claimed in claim 10 is characterized in that, also comprises isolated electromagnetic shielding, is arranged on around the package module of this image sensering device.
16. the method for a package image sensing apparatus is characterized in that, comprises the following step:
Substrate and cover plate are provided;
On this substrate, form photoelectric conversion element array;
On this photoelectric conversion element array, form the first micro optical element array;
On this cover plate, form the second micro optical element array; And engage this substrate and this loam cake, so that this first micro optical element array and relative arrangement of this second micro optical element array.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007100023925A CN101226949A (en) | 2007-01-15 | 2007-01-15 | Image sensing apparatus and encapsulation method thereof |
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| CNA2007100023925A CN101226949A (en) | 2007-01-15 | 2007-01-15 | Image sensing apparatus and encapsulation method thereof |
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| CN103229084A (en) * | 2010-08-17 | 2013-07-31 | 赫普塔冈微光学有限公司 | Method of manufacturing a plurality of optical devices for cameras |
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| WO2017036381A1 (en) * | 2015-09-02 | 2017-03-09 | 苏州晶方半导体科技股份有限公司 | Package structure and packaging method |
| CN110061017A (en) * | 2014-12-04 | 2019-07-26 | 原相科技股份有限公司 | Optical sensor package and optical sensor assembly |
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| CN102023330A (en) * | 2009-09-15 | 2011-04-20 | 鸿富锦精密工业（深圳）有限公司 | Shading element array, method for manufacturing shading element array and lens module array |
| CN103229084A (en) * | 2010-08-17 | 2013-07-31 | 赫普塔冈微光学有限公司 | Method of manufacturing a plurality of optical devices for cameras |
| CN103229084B (en) * | 2010-08-17 | 2016-11-30 | 新加坡恒立私人有限公司 | The method manufacturing multiple Optical devices for camera |
| CN110061017A (en) * | 2014-12-04 | 2019-07-26 | 原相科技股份有限公司 | Optical sensor package and optical sensor assembly |
| CN110061017B (en) * | 2014-12-04 | 2023-08-22 | 原相科技股份有限公司 | Optical sensor package and optical sensor assembly |
| WO2017036381A1 (en) * | 2015-09-02 | 2017-03-09 | 苏州晶方半导体科技股份有限公司 | Package structure and packaging method |
| WO2021047138A1 (en) * | 2019-09-12 | 2021-03-18 | 神盾股份有限公司 | Optical sensor, optical sensing system, and manufacturing method for optical sensor |
| TWI791938B (en) * | 2019-09-12 | 2023-02-11 | 神盾股份有限公司 | Optical sensor, optical sensing system and manufacturing method of optical sensor |
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