CN101224498A - Method for preparing wolfram and copper material contactor adopting W-CuO powder - Google Patents
Method for preparing wolfram and copper material contactor adopting W-CuO powder Download PDFInfo
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- CN101224498A CN101224498A CNA2008100174417A CN200810017441A CN101224498A CN 101224498 A CN101224498 A CN 101224498A CN A2008100174417 A CNA2008100174417 A CN A2008100174417A CN 200810017441 A CN200810017441 A CN 200810017441A CN 101224498 A CN101224498 A CN 101224498A
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Abstract
The invention discloses a method used for preparing a copper tungsten contact head material with a W-CuO powder. After ball milling, the CuO powder is mixed with a nano-W powder on a high-energy ball mill; after that, the mixed powder is reduced by a hydrogen gas so as to gain a Cu-W composite powder which is finally pressed into shapes, sintered and melted to gain the copper tungsten contact head material. The preparation method of the invention refines the porosity of a W frame and keeps a certain strength; furthermore, the process is simple and the cost is low; the arc through resistance performance of the prepared copper tungsten contact head material is improved.
Description
Technical field
The invention belongs to technical field of metal material preparation, be specifically related to the method that a kind of W-CuO of employing powder prepares the copper tungsten contact material.
Background technology
In the CuW alloy, high-melting-point W forms the skeleton of infusibility, make material have arc resistant, the wear-resisting resistance and high temperature resistance property that undermines, and low-melting Cu has good conduction, thermal conductivity and good plasticity.Therefore the CuW alloy is used as the contact material of high pressure and super-pressure electrical equipment switch widely.
The existing preparation that is used as the CuW alloy of contact material is to adopt Cu powder and W powder to make raw material.According to scaling loss mechanism, the porosity that oozes copper in the W skeleton is more little, and capillarity is big more, and copper is not easy splash more and goes out under the arcing, thereby plays good evaporative heat loss effect, reduces the ablation of W skeleton.So refinement is good more more should to make the hole of W skeleton as the CuW alloy of contact material, but also should keep certain intensity, and the arc ablation resistance performance of contact material is improved.
Summary of the invention
The object of the present invention is to provide a kind of method of the W-CuO of employing powder preparation copper tungsten contact material, the material that this method makes makes the hole of W skeleton obtain refinement, but also has kept certain intensity, thereby has improved the arc ablation resistance performance of contact material.
The technical solution adopted in the present invention is, adopts the method for W-CuO powder preparation copper tungsten contact material, carries out according to the following steps:
A. ball milling
The CuO powder is put into ball mill carry out ball milling, make its particle mean size reach 10～30nm;
B. batch mixing
Being averaged granularity is the W powder of 80～100nm, the CuO powder that the step ball milling is crossed in the adding, and the addition of CuO is 9%～15% of a W grain weight amount, this mixed-powder is put into high energy ball mill carry out batch mixing;
C. reduction
Mixed-powder after the processing of last step is reduced with hydrogen, and hydrogen flowing quantity 0.08l/min, heating rate are 15 ℃/min, the mixed-powder of CuO and W are reduced into the mixed-powder of Cu and W;
D. sintering and infiltration
The last step was obtained 800 ℃～1000 ℃ following sintering of mixed-powder pressed compact, temperature 1 hour of Cu and W, and 1200 ℃～1400 ℃ following infiltration copper of temperature 1～4 hour promptly make the copper tungsten contact material.
Method of the present invention adopts ultra-fine W powder to carry out sintering, refinement the hole of W skeleton, substitute with the CuO powder and to induce the Cu powder, not only solved the difficulty of ultra-fine Cu powder preparation, also played the effect that the W particle is grown up that hinders.The granularity of employing CuO is far smaller than the granularity of W, do not influence the intensity of W skeleton, a spot of like this CuO fills in the hole on every side of W particle as bead, and the CuO powder that adds is effectively cut apart the W particle, avoided the appearance of closed pore, thereby the anti-electrical arc erosion of the copper tungsten contact material that obtains is significantly improved.
Description of drawings
Fig. 1 is a preparation method's of the present invention process chart.
The specific embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
With reference to Fig. 1, copper tungsten contact material preparation method of the present invention, carry out according to the following steps:
A. ball milling
The CuO powder is put on the ball mill of 120r/min and carried out ball milling, ratio of grinding media to material is 60: 1, and the ball milling time is 60～90 hours, makes the particle mean size of CuO powder reach 10～30nm;
B. batch mixing
Being averaged granularity is the W powder of 80～100nm, the CuO powder that the step ball milling is crossed in the adding, the addition of CuO is 9%～15% of a W grain weight amount, the high energy ball mill of this mixed-powder being put into 120r/min carries out batch mixing, ratio of grinding media to material is 20: 1, and mixing time is 2～6 hours;
C. reduction
Mixed-powder after the processing of last step is reduced with hydrogen, and hydrogen flowing quantity 0.08l/min, heating rate are 15 ℃/min, the mixed-powder of CuO and W are reduced into the mixed-powder of Cu and W;
D. sintering and infiltration
The last step was obtained 800 ℃～1000 ℃ following sintering of mixed-powder pressed compact, temperature 1 hour of Cu and W, and control hydrogen flowing quantity 0.08l/min 1200 ℃～1400 ℃ following infiltration copper of temperature 1～4 hour, promptly makes the copper tungsten contact material.
Embodiment 1
Taking by weighing particle mean size is the W powder 50g of 80～100nm, particle mean size is the CuO powder 4.5g of 10～30nm, in ratio of grinding media to material on the ball mill of 120r/min is to carry out ball milling under 60: 1 the condition 60 hours, is to carry out batch mixing under 20: 1 the condition 2 hours with CuO powder behind the ball milling and nanometer W powder in ratio of grinding media to material on the ball mill of 120r/min, then mixed-powder is reduced with hydrogen at 800 ℃, adopt the mixed-powder moulding after conventional powder metallurgy process will reduce, 800 ℃ of sintering 1 hour, 1200 ℃ of infiltration copper 4 hours, promptly make the copper tungsten contact material then.
Embodiment 2
Taking by weighing particle mean size is the W powder 50g of 80～100nm, particle mean size is the CuO powder 6g of 10～30nm, in ratio of grinding media to material on the ball mill of 120r/min is to carry out ball milling under 60: 1 the condition 70 hours, is to carry out batch mixing under 20: 1 the condition 4 hours with CuO powder behind the ball milling and nanometer W powder in ratio of grinding media to material on the ball mill of 120r/min, then mixed-powder is reduced with hydrogen at 700 ℃, adopt the mixed-powder moulding after conventional powder metallurgy process will reduce, 900 ℃ of sintering 1 hour, 1300 ℃ of infiltration copper 3 hours, promptly make the copper tungsten contact material then.
Embodiment 3
Taking by weighing particle mean size is the W powder 50g of 80～100nm, particle mean size is the CuO powder 7.5g of 10～30nm, in ratio of grinding media to material on the ball mill of 120r/min is to carry out ball milling under 60: 1 the condition 90 hours, is to carry out batch mixing under 20: 1 the condition 6 hours with CuO powder behind the ball milling and nanometer W powder in ratio of grinding media to material on the ball mill of 120r/min, then mixed-powder is reduced with hydrogen at 800 ℃, adopt the mixed-powder moulding after conventional powder metallurgy process will reduce, 1000 ℃ of sintering 1 hour, 1400 ℃ of infiltration copper 1 hour, promptly make the copper tungsten contact material then.
The performance comparison of the Cu-W pseudo-alloy of the inventive method preparation and traditional Cu-W pseudo-alloy is shown in Table 1.
The performance comparison of table 1 Cu-W pseudo-alloy
| Title material | Hardness, HB | Electrical conductivity, %IACS | Density g/cm 3 | Proof voltage breakdown strength (30 mean value), V/m |
| The prepared Cu-W of traditional C u-W the present invention | 197 235 | 44 46 | 14.0940 14.6121 | 9.53×10 7 1.05×10 8 |
As can be seen from the above table, the material that the inventive method obtains, its hardness, electrical conductivity, density and proof voltage breakdown strength value all are improved, and have excellent comprehensive performances.
Claims (5)
1. method that adopts W-CuO powder preparation copper tungsten contact material is characterized in that this method is carried out according to the following steps:
A. ball milling
The CuO powder is put into ball mill carry out ball milling, make its particle mean size reach 10～30nm;
B. batch mixing
Being averaged granularity is the W powder of 80～100nm, the CuO powder that the step ball milling is crossed in the adding, and the addition of CuO is 9%～15% of a W grain weight amount, this mixed-powder is put into high energy ball mill carry out batch mixing;
C. reduction
Mixed-powder after the processing of last step is reduced with hydrogen, and hydrogen flowing quantity 0.08l/min, heating rate are 15 ℃/min, the mixed-powder of CuO and W are reduced into the mixed-powder of Cu and W;
D. sintering and infiltration
The last step was obtained 800 ℃～1000 ℃ following sintering of mixed-powder pressed compact, temperature 1 hour of Cu and W, and 1200 ℃～1400 ℃ following infiltration copper of temperature 1～4 hour promptly make the copper tungsten contact material.
2. in accordance with the method for claim 1, it is characterized in that among the described step a, the rotating speed of ball mill is 120r/min, ratio of grinding media to material is 60: 1, and the ball milling time is 60～90 hours.
3. in accordance with the method for claim 1, it is characterized in that among the described step b, the rotating speed of high energy ball mill is 120r/min, ratio of grinding media to material is 20: 1, and mixing time is 2～6 hours.
4. in accordance with the method for claim 1, it is characterized in that among the described step c, the control hydrogen flowing quantity is 0.08l/min, heating rate is 15 ℃/min.
5. in accordance with the method for claim 1, it is characterized in that in the described steps d, the control hydrogen flowing quantity is 0.08l/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100174417A CN100528422C (en) | 2008-01-30 | 2008-01-30 | Method for preparing wolfram and copper material contactor adopting W-CuO powder |
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| CNB2008100174417A CN100528422C (en) | 2008-01-30 | 2008-01-30 | Method for preparing wolfram and copper material contactor adopting W-CuO powder |
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| CN101224498A true CN101224498A (en) | 2008-07-23 |
| CN100528422C CN100528422C (en) | 2009-08-19 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102828059A (en) * | 2012-09-27 | 2012-12-19 | 北京科技大学 | Preparation method of contact alloy for nano particle filled tungsten skeleton special structure |
| CN105463241A (en) * | 2015-12-29 | 2016-04-06 | 桂林电器科学研究院有限公司 | Processing method of copper and chromium electric contact material |
| CN105463240A (en) * | 2015-12-29 | 2016-04-06 | 桂林电器科学研究院有限公司 | Preparation method of copper-chromium electrical contact material |
| CN107739862A (en) * | 2017-10-24 | 2018-02-27 | 宝鸡市铭坤有色金属有限公司 | A kind of preparation method of tungsten-copper alloy material |
| CN109837442A (en) * | 2019-03-28 | 2019-06-04 | 北京工业大学 | The preparation method of the nanocrystalline tungsten copper based composites of metal element Ti/Cr and the original position hard phase WC codope |
| WO2020064295A1 (en) * | 2018-09-26 | 2020-04-02 | Siemens Aktiengesellschaft | Powder mixture for producing an electrical contact material, method for producing the electrical contact material using the powder mixture, electrical contact material and use of the electrical contact material |
| CN111411280A (en) * | 2020-03-03 | 2020-07-14 | 福达合金材料股份有限公司 | Copper tungsten carbide diamond composite electrical contact material and preparation method thereof |
| CN111863488A (en) * | 2020-07-13 | 2020-10-30 | 安徽恒均粉末冶金科技股份有限公司 | Method for preparing electric appliance switch contact by powder metallurgy copper-tungsten alloy |
-
2008
- 2008-01-30 CN CNB2008100174417A patent/CN100528422C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102828059A (en) * | 2012-09-27 | 2012-12-19 | 北京科技大学 | Preparation method of contact alloy for nano particle filled tungsten skeleton special structure |
| CN105463241A (en) * | 2015-12-29 | 2016-04-06 | 桂林电器科学研究院有限公司 | Processing method of copper and chromium electric contact material |
| CN105463240A (en) * | 2015-12-29 | 2016-04-06 | 桂林电器科学研究院有限公司 | Preparation method of copper-chromium electrical contact material |
| CN107739862A (en) * | 2017-10-24 | 2018-02-27 | 宝鸡市铭坤有色金属有限公司 | A kind of preparation method of tungsten-copper alloy material |
| WO2020064295A1 (en) * | 2018-09-26 | 2020-04-02 | Siemens Aktiengesellschaft | Powder mixture for producing an electrical contact material, method for producing the electrical contact material using the powder mixture, electrical contact material and use of the electrical contact material |
| CN109837442A (en) * | 2019-03-28 | 2019-06-04 | 北京工业大学 | The preparation method of the nanocrystalline tungsten copper based composites of metal element Ti/Cr and the original position hard phase WC codope |
| CN111411280A (en) * | 2020-03-03 | 2020-07-14 | 福达合金材料股份有限公司 | Copper tungsten carbide diamond composite electrical contact material and preparation method thereof |
| CN111863488A (en) * | 2020-07-13 | 2020-10-30 | 安徽恒均粉末冶金科技股份有限公司 | Method for preparing electric appliance switch contact by powder metallurgy copper-tungsten alloy |
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|---|---|
| CN100528422C (en) | 2009-08-19 |
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